TW201238919A - Scribing wheel and scribing device - Google Patents

Scribing wheel and scribing device Download PDF

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Publication number
TW201238919A
TW201238919A TW100143787A TW100143787A TW201238919A TW 201238919 A TW201238919 A TW 201238919A TW 100143787 A TW100143787 A TW 100143787A TW 100143787 A TW100143787 A TW 100143787A TW 201238919 A TW201238919 A TW 201238919A
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TW
Taiwan
Prior art keywords
scribing
scribing wheel
brittle material
material substrate
diamond
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Application number
TW100143787A
Other languages
Chinese (zh)
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TWI465406B (en
Inventor
Toshio Fukunishi
Tadanobu Nakano
Yasuhiro Sendai
Mitsuru Kitaichi
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Mitsuboshi Diamond Ind Co Ltd
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Publication of TW201238919A publication Critical patent/TW201238919A/en
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Publication of TWI465406B publication Critical patent/TWI465406B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006Cutting members therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/157Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/06Grooving involving removal of material from the surface of the work
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006Cutting members therefor
    • B26D2001/002Materials or surface treatments therefor, e.g. composite materials

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

The present invention provides a scribing wheel capable of forming excellent scribe lines on a brittle material substrate and a scribing device provided with the scribing wheel. A polycrystalline diamond scribing wheel 50 is arranged by a way of using the lower faces of two conical frustums to face each other (wherein, the area of lower face is greater than that of the top face) and has a substantially disc-like shape (abacus bead shape). In addition, the polycrystalline diamond used to form the scribing wheel 50 is formed by using a graphite type carbon substance having fine crystal grain structure or amorphous character as a starting substance to directly convert and sinter under extra-high pressure and temperature. Furthermore, the polycrystalline diamond substantially contains only diamond without intentionally adding other substances therein.

Description

201238919 六、發明說明: 【發明所屬之技術領域】 本發明係有關於一種劃線輪、及具有該劃線輪之劃線裝 置。 【先前技術】 先前,作為用於在脆性材料基板(例如’玻璃基板等)上 形成劃線之工具,已知有燒結鑽石製劃線輪(刀輪)。 [先前技術文獻] [專利文獻] [專利文獻1]曰本專利特開2009-166169號公報 【發明内容】 [發明所欲解決之問題] 於此,燒結鑽石(P〇lycrystal丨ine diam〇nd: PCD)係藉由 於鑽石達到熱力學穩定之超高壓高溫下燒結鑽石粒子、金 屬結合材料、及添加劑之混合物而生成。因此,燒結鑽石 與單結晶鎖石相比,不存在解理之問題,不具有機械特性 之各向異性,且具有優異之韌性。 然而,高溫下之燒結鑽石之機械特性會因包含於晶界中 之金屬結合材料而下降 v 始认 降例如,若為了形成劃線,而使劃 料基板抵接,則會使劃線輪之刀尖j 耐磨性等機购生產生燒結鑽石之晶界結合強度下降, 謂^機械特性下降 因此,本發明之目的在於 上 形成良好之劃線之劃線輪具。於脆性材料基板 及具有該劃線輪之劃線裝置 159525.doc 201238919 [解決問題之技術手段] 為解決上述課題,技術方案1之發明之特徵在於,其係 多晶鑽石製劃線輪’且包括圓盤狀本體部、設置於上述 體部外周之圓環狀之刀、及沿著上述刀之最外周部設置之 刀尖’且上述刀之厚度係自上述本體部之中心朝向上述刀 尖憂卜’上述多晶鑽石係將具有微細之晶粒組織、或非晶 質之石墨型碳物質作為起始物質,於超高壓高溫下直接轉 換燒結成鑽石者,且實質上僅包含鑽石。 又,技術方案2之發明係如技術方案丨之劃線輪,其中上 述刀尖具有沿著上述最外周部設置之複數個突起部。 又,技術方案3之發明之特徵在於包括:劃線單元,其 係藉由使如技術方案^之劃線輪相對脆性材料基板壓接 滾動,而於上述脆性材料基板上形成劃線;及保持單元, 其係-面保持上述脆性材料基板,—面使所保持之上述脆 性材料基板對劃線單元相對移動。 [發明之效果] 根據技術方案1至3記載之發明,構成劃線輪之多晶鑽石 係將具有微細之晶粒組織或非晶質之石墨型碳物質作為起 始物質,於超高Μ溫下直接轉換I结成鑽石者。又,多 晶鑽石實質上僅包含鑽石。 由此,該多晶鑽石製劃線輪不僅可以提高常溫下之硬 度,而且還可以提高高溫下之機械特性。因此,可以實現 劃線輪更進一步之長壽命化。 尤其,根據技術方案2記載之發明,劃線輪係由多晶鑽 159525.doc 201238919 石成形’且常溫下之劃線輪之硬度、及高溫下之劃線輪之 機械特性提昇。因此,即便於刀尖之最外周部上設置有複 數個突起部’亦可抑制各突起部缺損,實現劃線輪更進一 步之長壽命化。 【實施方式】 <1.劃線裝置之構成> 以下’ 一面參照圖式,一面詳細地對本發明實施形態進 行說明。 圖1及圖2係分別表示劃線裝置1之整體構成之一例之前 視圖及側視圖。圖3及圖4係表示劃線輪50附近之構成之一 例之前視圖及仰視圖。圖5係用以說明主銷後傾穩定效應 之仰視圖。 劃線裝置1係如下裝置:於例如玻璃基板或陶瓷基板等 之類的由脆性材料形成之基板(以下,亦簡稱為「脆性材 料基板j )4之表面上劃有劃線(切割紋路:縱向裂紋卜 如圖1及圖2所示,劃線裝置丨係主要包括保持單元ι〇、 劃線單元20、攝像部單元6〇、及控制單元9(^再者,於圖 1及以後之各圖中,為明確該等構件之方向關係、,而視需 要適當地標註有將Z軸方向設為鉛垂方向且將乂丫平面設為 水平面之XYZ正交座標系。 於此,如圖3所示,若利用劃線裝置i於脆性材料基板4 之表面上形成劃線SL,則於脆性材料基板4上,將產生沿 著垂直方向(Z軸方向)延伸之垂直裂紋κ(劃線步驟卜 又,將如下方法稱為「斷裂」,即,藉由對產生有該垂 159525.doc 201238919 直裂紋κ之脆性材料基板4傳遞應力(斷裂步驟),而使垂直 裂紋κ自形成有劃線s L之脆性材料基板4之主面伸展至其 相反側之主面為止,從而將脆性材料基板4切斷。 另-方面’將如下方法稱為「分裂」,即,僅利用劃線 步驟(即’不執行斷裂步驟)’ I垂直裂紋K自脆性材料基 板4之劃線SL之主面伸展至相反側之主面為止,從而切斷 脆性材料基板4。 該等斷裂及分裂係於不產生切届 ^ 个厓玍切屑之方面,優於使用鑽石 切割機(或磨輪)、或者鑽石創y换^ Μ & 4石躓石劃片機之研磨切割之切斷方 法0 又,作為可藉由本實施形態之劃線方法而斷裂或分裂之 脆性材料基板4之材質<列’可列舉玻璃、陶瓷、矽、或藍 寶石等。尤其近年來,作為用於與通信機器相關之高頻模 組之基板,正在自HTCC(High 0201238919 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a scribing wheel and a scribing apparatus having the scribing wheel. [Prior Art] Conventionally, as a tool for forming a scribe line on a brittle material substrate (for example, a 'glass substrate or the like), a scribing wheel (cutter wheel) made of sintered diamond is known. [Prior Art Document] [Patent Document 1] [Patent Document 1] JP-A-2009-166169 (Summary of the Invention) [Problems to be Solved by the Invention] Here, a sintered diamond (P〇lycrystal丨ine diam〇nd) : PCD) is produced by sintering diamond particles, metal bond materials, and additives as a result of the thermodynamically stable ultra high pressure and high temperature of the diamond. Therefore, sintered diamond has no problem of cleavage compared with single crystal lock stone, has no anisotropy of mechanical properties, and has excellent toughness. However, the mechanical properties of the sintered diamond at a high temperature are lowered by the metal bonding material contained in the grain boundary. For example, if the scribing substrate is abutted to form a scribe line, the scribing wheel is The machine tip of the tool tip j wear resistance produces a decrease in the grain boundary bonding strength of the sintered diamond, which means that the mechanical properties are degraded. Therefore, the object of the present invention is to form a well-marked scribing wheel. A brittle material substrate and a scribing device having the scribing wheel 159525.doc 201238919 [Technical means for solving the problem] In order to solve the above problems, the invention of claim 1 is characterized in that it is a polycrystalline diamond scribing wheel a disk-shaped body portion, an annular knife provided on an outer circumference of the body portion, and a blade edge provided along an outermost peripheral portion of the blade, and the thickness of the blade is from a center of the body portion toward the blade edge The above-mentioned polycrystalline diamonds have a fine grain structure or an amorphous graphite-type carbon material as a starting material, and are directly converted into a diamond at an ultrahigh pressure and high temperature, and substantially contain only diamonds. Further, the invention of claim 2 is the scribing wheel according to the invention, wherein the blade tip has a plurality of protrusions provided along the outermost peripheral portion. Further, the invention of claim 3 is characterized in that: a scribing unit is formed by forming a scribing line on the brittle material substrate by crimping the scribing wheel as described in the prior art with respect to the brittle material substrate; and maintaining The unit is configured to hold the brittle material substrate, and the surface of the brittle material substrate is relatively moved to the scribe unit. [Effect of the Invention] According to the inventions of the first to third aspects, the polycrystalline diamond constituting the scribing wheel has a fine grain structure or an amorphous graphite-type carbon material as a starting material, and is super-high temperature. Directly convert I into a diamond. Also, polycrystalline diamonds contain essentially only diamonds. Therefore, the polycrystalline diamond scribing wheel can not only improve the hardness at normal temperature, but also improve the mechanical properties at high temperatures. Therefore, it is possible to further extend the life of the scribing wheel. In particular, according to the invention of claim 2, the scribing wheel is formed by the polycrystalline diamond 159525.doc 201238919 stone forming and the hardness of the scribing wheel at normal temperature and the mechanical characteristics of the scribing wheel at a high temperature are improved. Therefore, even if a plurality of projections ′ are provided on the outermost peripheral portion of the blade edge, the projections can be prevented from being defective, and the scribing wheel can be further extended in life. [Embodiment] <1. Configuration of scribing device> Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 and Fig. 2 are a front view and a side view, respectively, showing an example of the overall configuration of the scribing device 1. 3 and 4 are a front view and a bottom view showing an example of the configuration in the vicinity of the scribing wheel 50. Fig. 5 is a bottom view for explaining the stabilizing effect of the kingpin. The scribing device 1 is a device for scribing a surface of a substrate made of a brittle material (hereinafter, also referred to simply as "brittle material substrate j" 4) such as a glass substrate or a ceramic substrate (cutting line: longitudinal direction) As shown in FIG. 1 and FIG. 2, the scribing device system mainly includes a holding unit ι, a scribing unit 20, an imaging unit 6〇, and a control unit 9 (further, in FIG. 1 and later). In the figure, in order to clarify the directional relationship of the members, an XYZ orthogonal coordinate system in which the Z-axis direction is the vertical direction and the 乂丫 plane is the horizontal plane is appropriately labeled as needed. As shown in the figure, when the scribe line SL is formed on the surface of the brittle material substrate 4 by the scribing device i, a vertical crack κ extending in the vertical direction (Z-axis direction) is generated on the brittle material substrate 4 (the scribing step) Further, the following method is referred to as "fracture", that is, by transmitting a stress (fracture step) to the brittle material substrate 4 having the vertical crack κ of the 159525.doc 201238919, the vertical crack κ is formed with a scribe line. The main surface of the s L brittle material substrate 4 Stretching to the opposite side of the main surface, thereby cutting the brittle material substrate 4. The other aspect 'refers to the following method as "split", that is, using only the scribing step (ie, 'do not perform the breaking step'' The crack K is cut from the main surface of the scribe line SL of the brittle material substrate 4 to the main surface on the opposite side, thereby cutting the brittle material substrate 4. The fracture and splitting are in the aspect of not cutting the swarf of the cliff. It is superior to the use of a diamond cutting machine (or a grinding wheel), or a diamond cutting machine amp & 4 stone slashing machine cutting method 0, as a cutting method by the present embodiment can be broken or The material <column of the split brittle material substrate 4 is glass, ceramic, enamel, or sapphire, etc. In particular, in recent years, as a substrate for a high-frequency module related to a communication device, it is being derived from HTCC (High 0).

Ceramics,高溫共燒陶幻向著相對易於加工之ltcc⑽wCeramics, high temperature co-fired ceramic illusion towards relatively easy processing ltcc(10)w

Temperature C().fired Ceramies,低溫共燒陶幻加速轉 移。因而’本實施形態之劃線方法不斷得到有效使用。 保持單元1G係保持脆性材料基板4,並且使所保持之脆 吐材料基板4對於劃線單元2G進行相對移動。如圖1所示, 保持單元H)係設置於基部10a上,且主要包括載置台n、 滾珠螺桿機構12、及電動機13。 於此,基部1〇a係由例如大致立方體狀之石板形成,且 其上表面(與保持單元1〇對向之面)經平坦加工。藉此,可 降低基部H)a之熱膨脹,從而使由保持單元1〇保持之脆性 I59525.doc 201238919 材料基板4良好地移動。 載置台11係吸附保持所載置之脆性材料基板4。又,載 置台11使所保持之脆性材料基板4沿著箭線AR1方向(X軸 正或負方向:以下’亦簡稱為「進退方向」)進退移動, 並且沿著箭線R1方向旋轉。如圖1及圖2所示,載置台1!係 主要具有吸附部11a、旋轉台lib、及移動台lie。 吸附部11 a係設置於旋轉台11 b之上側。如圖1及圖2所 示’於吸附部11a之上表面可載置脆性材料基板4 ^又,於 吸附部1 la之上表面,柵格狀地配置有複數個吸附槽(省略 圖示)。因此’於載置著有脆性材料基板4之狀態下,藉由 將各吸附槽内之環境氣體進行排氣(抽吸),而將脆性材料 基板4吸附於吸附部11 a。 旋轉台11 b係設置於吸附部11 a之下側,且以與z軸大致 平行之旋轉軸lid為中心,使吸附部Ua旋轉。又,移動台 lie係設置於旋轉台lib之下側,且沿著進退方向,使吸附 部11a及旋轉台lib移動。 因此,由載置台11吸附保持之脆性材料基板4係沿著箭 線AR1方向進退移動,並且以隨著吸附部Ua之進退動作而 移動之旋轉軸lid為中心進行旋轉。 滾珠螺桿機構12係配置於載置台丨丨之下側,且使載置台 11沿著箭線AR1方向進退移動。如圖i及圖2所示,滾珠螺 桿機構12係主要包括進給螺桿丨2a、及螺母丨2b。 進給螺桿12a係沿著載置台u之進退方向延伸之桿體。 於進給螺桿12&之外周面,設置有螺旋狀之槽(省略圖示 159525.doc 201238919 又’進給螺桿12a之一端係由支撐部i4a可旋轉地支撐’且 進給螺桿12a之另一端係由支撐部14b可旋轉地支撐。進 而,進給螺桿12a係與電動機13聯動連結,且若電動機13 進行旋轉’則該進給螺桿12a沿著該電動機13之旋轉方向 進行旋轉。 螺母12b係隨著進給螺桿12a旋轉,藉由未圖示滾珠之滚 動,而沿著箭線AR1方向進退移動。如圖1及圖2所示,螺 母12b係固定於移動台iic之下部。 因此,若將電動機13驅動,將電動機13之旋轉力傳遞至 進給螺桿12a,則螺母12b將沿著箭線AR1方向進退移動。 其結果’固定有螺母12b之載置台11將與螺母12b同樣地沿 著箭線AR1方向進退移動》 一對導軌15、16係約束載置台11於行進方向上之移動。 如圖2所示,一對導軌1 5、16係於基部1 〇 a上,隔開特定距 離固定於箭線AR2方向上。 複數個(本實施形態中為2個)滑動部1 7( 17a ' 17b)係沿著 導軌15於箭線AR1方向上自如滑動。如圖1及圖2所示,各 滑動部17( 17a、1 7b)係於移動台11 c之下部,隔開特定距離 固定於箭線AR1方向上。 複數個(本實施形態中為2個:其中,為了方便圖示,而 僅記載滑動部18a)滑動部18係沿著導軌16於箭線ARl方向 上自如滑動。如圖1及圖2所示’各滑動部丨8係與滑動1 17(17a、17b)同樣地’於移動台He之下部,隔開特定距離 固定於箭線AR1方向上。 159525.doc 201238919 如上所述,若電動機13之旋轉力傳遞至滾珠螺桿12,則 載置台11將沿著一對導軌15、16移動。因此,可確保載置 台11於進退方向上之平移性。 劃線單元20係藉由使多晶鑽石製劃線輪5〇對由保持單元 1 〇保持之脆性材料基板4進行壓接滾動(參照圖3),而於脆 性材料基板4之表面上形成劃線SLe如圖丨及圖2所示,劃 線單元20係主要包括劃線頭部3〇、及驅動部4〇。 劃線頭部30係利用未圖示之升降、加壓機構,自所保持 之劃線輪50對脆性材料基板4之表面傳遞擠壓力(以下,亦 簡稱為「劃線負載」)。如圖3所示,劃線頭部3〇係包含輪 架35。又,輪架35係旋轉自如地保持劃線輪5〇之元件。如 圖3所示,輪架35係主要包含銷36、支撐框體37、及回轉 部38。 肖6係於插入至貝通劃線輪5〇之貫通孔$内之狀態下 固定之桿體。於此,如圖3及圖4所示,貫通孔池係沿著 與X軸大致平行之旋轉軸50b延伸。 如圖3所示,支撐框體37係以覆蓋貫通孔5〇a之兩開口 (兩端)之方式配置之構造物。自貫通孔5〇a之兩端突出之銷 3錄可旋轉地設置於支揮框體37。因此,可使由銷%固定 之劃線輪50相對支撐框體37自如旋轉。 、如圖3所示’回轉部38係設置於支揮框體37之上部,且 、、轴大致平行之旋轉軸38a為中心使支樓框體η進行旋 轉如圖4所不,使自下面觀察之回轉部%之旋轉轴仏之 位置、與脆性材料基板4中之保持單元1()之設置位置他錯 159525.doc 201238919 藉此’如圖5所示,若劃線輪5〇之行進方向自箭線AR3(2 點鍵線)方向變為箭線AR4(實線)方向,則因主銷後傾穩定 效應而使環繞旋轉抽38a之扭矩作用於劃線輪50。因此, 劃線輪50沿著箭線R2方向轉動,劃線輪50之位置由2點鏈 線位置變為實線位置。 如上所述,即便劃線輪50之行進方向發生變化,劃線輪 5〇之姿勢相對行進方向僅偏離角度Θ1,箭線R2方向之扭矩 仍作用於劃線輪50。其結果,劃線輪5〇以劃線輪5〇之姿勢 與劃線輪50之行進方向變為大致平行之方式回轉。 驅動部40係使設置有劃線輪50之劃線頭部30於箭線AR2 方向(Y軸正或負方向:以下,亦簡稱為「往復方向」)上 往復移動。如圖2所示,驅動部4〇係主要包含支柱41、導 軌42、及電動機43。於圖2中,表示使用滾珠螺桿作為驅 動機構之例子,但亦可使用其他機構、例如線性電動機 (線性導軌)等。 複數個(本實施形態中為2個)支柱41(4ia ' 4ib)係自基部Temperature C (). fired Ceramies, low temperature co-firing temperament acceleration transfer. Therefore, the scribing method of the present embodiment is continuously used effectively. The holding unit 1G holds the brittle material substrate 4, and causes the held embedding material substrate 4 to relatively move the scribing unit 2G. As shown in FIG. 1, the holding unit H) is provided on the base 10a, and mainly includes a mounting table n, a ball screw mechanism 12, and an electric motor 13. Here, the base portion 1a is formed of, for example, a substantially cubic stone plate, and the upper surface thereof (the surface facing the holding unit 1A) is flattened. Thereby, the thermal expansion of the base portion H)a can be lowered, so that the brittleness I59525.doc 201238919 held by the holding unit 1〇 is well moved. The mounting table 11 sucks and holds the brittle material substrate 4 placed thereon. Further, the mounting table 11 moves the brittle material substrate 4 held in the direction of the arrow line AR1 (the X-axis positive or negative direction: hereinafter, also referred to as "advancing and retracting direction"), and moves in the direction of the arrow R1. As shown in Fig. 1 and Fig. 2, the mounting table 1 has mainly an adsorption unit 11a, a rotary table lib, and a mobile station lie. The adsorption portion 11a is provided on the upper side of the rotary table 11b. As shown in FIG. 1 and FIG. 2, the brittle material substrate 4 can be placed on the upper surface of the adsorption portion 11a, and a plurality of adsorption grooves (not shown) are arranged in a grid shape on the upper surface of the adsorption portion 1la. . Therefore, the brittle material substrate 4 is adsorbed to the adsorption portion 11a by exhausting (suction) the ambient gas in each adsorption tank while the brittle material substrate 4 is placed. The rotary table 11b is disposed on the lower side of the adsorption portion 11a, and rotates the adsorption portion Ua around the rotation axis lid substantially parallel to the z-axis. Further, the mobile station lie is disposed on the lower side of the rotary table lib, and moves the adsorption portion 11a and the rotary table lib in the advancing and retracting direction. Therefore, the brittle material substrate 4 adsorbed and held by the mounting table 11 moves forward and backward in the direction of the arrow AR1, and rotates around the rotation axis lid that moves in accordance with the advancing and retracting operation of the adsorption portion Ua. The ball screw mechanism 12 is disposed on the lower side of the mounting table, and moves the mounting table 11 forward and backward in the direction of the arrow AR1. As shown in Figs. i and 2, the ball screw mechanism 12 mainly includes a feed screw 丨 2a and a nut 丨 2b. The feed screw 12a is a rod that extends in the advancing and retracting direction of the mounting table u. On the outer peripheral surface of the feed screw 12&, a spiral groove is provided (illustration 159525.doc 201238919 is omitted, and one end of the feed screw 12a is rotatably supported by the support portion i4a' and the other end of the feed screw 12a The support screw 14a is rotatably supported by the support portion 14b. Further, the feed screw 12a is coupled to the motor 13 and the feed screw 12a is rotated in the rotation direction of the motor 13 when the motor 13 rotates. As the feed screw 12a rotates, it moves forward and backward in the direction of the arrow line AR1 by rolling of the ball (not shown). As shown in Fig. 1 and Fig. 2, the nut 12b is fixed to the lower portion of the moving table iic. When the motor 13 is driven and the rotational force of the motor 13 is transmitted to the feed screw 12a, the nut 12b moves forward and backward in the direction of the arrow AR1. As a result, the mounting table 11 to which the nut 12b is fixed will be the same as the nut 12b. Moving forward and backward in the direction of the arrow line AR1" The pair of guide rails 15, 16 restrain the movement of the mounting table 11 in the traveling direction. As shown in Fig. 2, a pair of guide rails 15 and 16 are attached to the base portion 1a, separated by a specific The distance is fixed to the arrow line AR2 In the direction, a plurality of (two in the present embodiment) sliding portions 17 (17a' 17b) are slidable along the guide rail 15 in the direction of the arrow line AR1. As shown in Figs. 1 and 2, each sliding portion 17 is shown. (17a, 17b) is attached to the lower portion of the mobile station 11c, and is fixed in the direction of the arrow line AR1 by a certain distance. A plurality of (two in the present embodiment: wherein, for convenience of illustration, only the sliding portion is described) 18a) The sliding portion 18 is slidable along the guide rail 16 in the direction of the arrow AR1. As shown in Figs. 1 and 2, the respective sliding portions 8 are similar to the sliding 1 17 (17a, 17b) in the moving table He. The lower portion is fixed in the direction of the arrow line AR1 by a certain distance. 159525.doc 201238919 As described above, when the rotational force of the motor 13 is transmitted to the ball screw 12, the stage 11 will move along the pair of guide rails 15, 16. Therefore, the translatability of the mounting table 11 in the advancing and retracting direction can be ensured. The scribing unit 20 presses the brittle material substrate 4 held by the holding unit 1 压 by the polycrystalline diamond scribing wheel 5 (refer to 3), a scribe line SLe is formed on the surface of the brittle material substrate 4 as shown in FIG. The scribing unit 20 mainly includes a scribing head portion 3A and a driving portion 4A. The scribing head portion 30 is a pair of the scribing wheel 50 to the brittle material substrate 4 by a lifting and pressing mechanism (not shown). The surface transmits a pressing force (hereinafter also referred to simply as "streaking load"). As shown in Fig. 3, the scribing head 3 includes a wheel carrier 35. Further, the wheel frame 35 is rotatably held by the scribing wheel. As shown in FIG. 3, the wheel carrier 35 mainly includes a pin 36, a support frame 37, and a turning portion 38. The chord 6 is a rod that is fixed in a state of being inserted into the through hole $5 of the Beton scribing wheel. Here, as shown in Figs. 3 and 4, the through hole pool extends along the rotation shaft 50b substantially parallel to the X-axis. As shown in Fig. 3, the support frame 37 is a structure that is disposed so as to cover the two openings (both ends) of the through hole 5〇a. A pin 3 projecting from both ends of the through hole 5〇a is rotatably provided to the support frame 37. Therefore, the scribing wheel 50 fixed by the pin % can be freely rotated with respect to the support frame 37. As shown in Fig. 3, the 'turning portion 38 is provided on the upper portion of the swing frame 37, and the pivot frame 38a whose axis is substantially parallel is centered to rotate the branch frame η as shown in Fig. 4, from below. The position of the rotating shaft % of the observed turning portion % and the setting position of the holding unit 1 () in the brittle material substrate 4 are wrong. 159525.doc 201238919 By this, as shown in FIG. 5, if the scribing wheel 5 is advanced When the direction is changed from the arrow line AR3 (2-point key line) direction to the arrow line AR4 (solid line) direction, the torque of the circumferential rotation pumping 38a acts on the scribing wheel 50 due to the kingpin backward tilting stabilizing effect. Therefore, the scribing wheel 50 is rotated in the direction of the arrow line R2, and the position of the scribing wheel 50 is changed from the 2-point chain position to the solid line position. As described above, even if the traveling direction of the scribing wheel 50 changes, the posture of the scribing wheel 5 is deviated from the traveling direction by only the angle Θ1, and the torque in the direction of the arrow R2 acts on the scribing wheel 50. As a result, the scribing wheel 5 turns in such a manner that the direction of the scribing wheel 5 is substantially parallel to the traveling direction of the scribing wheel 50. The drive unit 40 reciprocates the scribing head 30 provided with the scribing wheel 50 in the direction of the arrow line AR2 (Y-axis positive or negative direction: hereinafter, also simply referred to as "reciprocating direction"). As shown in Fig. 2, the drive unit 4 mainly includes a support 41, a guide rail 42, and a motor 43. In Fig. 2, an example in which a ball screw is used as a driving mechanism is shown, but other mechanisms such as a linear motor (linear guide) or the like can be used. A plurality of (two in the present embodiment) pillars 41 (4ia ' 4ib) are from the base

特定距離固定於上下方向上。 l〇a沿著上下方向(z軸方向)延伸 。如圖2所示,各導軌42The specific distance is fixed in the up and down direction. L〇a extends in the up and down direction (z-axis direction). As shown in FIG. 2, each guide rail 42

,滾珠螺桿機構) 電動機43係與未圖示之進給機構(例如, 159525.doc 201238919 聯動連結。藉此,若電動機43進行旋轉,則劃線頭部3〇沿 著複數個導軌42於箭線AR2方向上往復移動。 劃線輪50係藉由壓接滾動於脆性材料基板4上,而於脆 性材料基板4上形成劃線SL(參照圖3)。再者,劃線輪5〇之 詳細構成隨後描述。 攝像部單元60係拍攝由保持單元1G保持之脆性材料基板 4。如圖2所示’攝像部單元6()係包含複數個攝像機 65(65a、65b)。 如圖1及圖2所示,複數個(本實施形態中為2個)攝像機 65(65a、65b)係配置於保持單元1〇之上方。各攝像機 65(65a、65b)係拍攝形成於脆性材料基板4上之特徵性部分 (例如,對準標記(省略圖示))之圖像。而且,基於由各攝 像機65(65a、65b)拍攝之圖像,求出脆性材料基板4之位置 及姿勢。 於此’所謂脆性材料基板4之「位置」係指絕對座標系 中之脆性材料基板4上之任意位置。χ,所謂脆性材料基 板4之「姿勢」係指脆性材料基板4之基準線(例如,脆性 材料基板4為方形時’ 4邊中之lif)相對於劃線頭部3〇之往 復方向之傾斜度。 進而’於本實㈣態中’使时形之脆性材料基板4, 且於脆性材料基板4之4個角令之鄰接2個角形成有對準標 記。又’各對準標記由對應之攝像機…、价進行拍攝, 且基於該等拍攝之圖像’求出絕對座標系中之各對準標記 之位置° X ’基於該等對準標記之位置,運算脆性材料基 I59525.doc 201238919 板4之位置及姿勢。 之各元件之動作控制、及 控制單元90係主要包括 控制單元90係實現劃線裝置1 資料運算。如圖1及圖2所示, ROM(Read ㈤y Me则ry,唯讀記憶體)91、RAM(Ran^ Access Memory,隨機存取記憶體)9? ^ 隨、及 CPU(CentralThe ball screw mechanism is connected to a feed mechanism (not shown) (for example, 159525.doc 201238919. Thus, when the motor 43 rotates, the scribing head 3 is along the plurality of guides 42 in the arrow The scribing wheel 50 is reciprocally moved in the direction of the line AR2. The scribing wheel 50 is rolled onto the brittle material substrate 4 by crimping, and a scribe line SL is formed on the brittle material substrate 4 (see Fig. 3). The detailed configuration will be described later. The imaging unit 60 captures the brittle material substrate 4 held by the holding unit 1G. As shown in Fig. 2, the imaging unit 6 () includes a plurality of cameras 65 (65a, 65b). As shown in Fig. 2, a plurality of (two in the present embodiment) cameras 65 (65a, 65b) are disposed above the holding unit 1A. Each of the cameras 65 (65a, 65b) is formed on the brittle material substrate 4. An image of a characteristic portion (for example, an alignment mark (not shown)). Further, based on an image captured by each camera 65 (65a, 65b), the position and posture of the brittle material substrate 4 are obtained. 'The position of the so-called brittle material substrate 4 means the absolute coordinates. Any position on the brittle material substrate 4 in the system. The "posture" of the brittle material substrate 4 means the reference line of the brittle material substrate 4 (for example, the lif in the four sides when the brittle material substrate 4 is square) The inclination of the reciprocating direction of the scribe head 3 。. Further, in the present (fourth) state, the brittle material substrate 4 of the time shape is formed, and the two corners of the four corners of the brittle material substrate 4 are formed adjacent to each other. Alignment marks. Further 'each alignment mark is taken by the corresponding camera, price, and based on the captured images', the position of each alignment mark in the absolute coordinate system is determined. X X 'based on the alignment The position of the mark, the calculation of the brittle material base I59525.doc 201238919 The position and posture of the plate 4. The operation control and control unit 90 of each component mainly includes the control unit 90 to realize the data operation of the scribing device 1. As shown in Fig. 1 and 2, ROM (Read (five) y Me, ry, read-only memory) 91, RAM (Ran ^ Access Memory, random access memory) 9? ^ With, and CPU (Central

Processing Unit,令央處理單元)93。 ROM(Read Only Memory^係所謂之非揮發性記憶部, 且記憶有例如程式91a。再者,作為R〇M9l,亦可使用讀 寫自如之非揮發性記憶體即快閃記憶體。RAM(RandlProcessing Unit, the central processing unit) 93. The ROM (Read Only Memory) is a so-called non-volatile memory unit, and stores, for example, a program 91a. Further, as R〇M9l, a non-volatile memory that is freely readable and writable, that is, a flash memory can be used. Randl

Access Mem〇ry)92係揮發性之記憶部,且記憶有例如 CPU93之運算中使用之資料。 CPU(Central pr0cessing Unit)93 係執行遵循 r〇m9i 之程 式91a之控制(保持單元1〇之進退、旋轉動作、及驅動部4〇 使劃線頭部30進行之往復動作等控制)、以及脆性材料基 板4之位置及姿勢運算等之資料處理。 例如,CPU93係 (1) 運算脆性材料基板4之位置及姿勢,並且 (2) 基於該位置及姿勢之運算結果,使旋轉台ub進行旋 轉動作,且藉由使移動台11 c進退動作而執行脆性材料基 板4對於劃線頭部30之對準處理。 <2.劃線輪之構成> 圖ό及圖7係表示劃線輪5〇之構成之一例之側視圖及前視 圖。於本實施形態中’劃線輪50係由多晶鑽石成形。 如圖3至圖7所示,劃線輪5〇係配置成2個圓錐台之下底 159525.doc •12· 201238919 面(其中,下底面之面積大於上底面)相互對向,且具有大 致圓盤形狀(算盤珠形狀)。如圖6至圖8所示,劃線輪50係 主要包含本體部51、刀52、及刀尖52a。 如圖6及圖7所示,本體部51係呈圓盤狀,且於本體部51 之中心附近設置有沿著旋轉軸50b貫通本體部5 1之貫通孔 5 0a。又,於本體部51之外周,設置有圓環狀之本體部 5卜 如圖6所示,刀52係由以旋轉軸50b為中心之同心圓狀之 内周及外周形成之圓環狀體。如圖7所示,刀52係於前視 圖中呈V字狀。沿著旋轉軸50b之刀52之厚度Tb(參照圖7) 係隨著自旋轉轴50b側朝向刀尖52a而逐漸變小》 刀尖52a係沿著刀52之最外周部(即,刀52中相距旋轉軸 5〇b之距離達到最大,且刀52之厚度Tb成為最小之部分)設 置。如圖6所示,於刀尖52&之各部分,不存在刻意形成之 凹凸,且刀尖52a之各部分與旋轉軸5〇b之距離成為相同。 又,劃線輪50係於抵接有刀尖52&之狀態下,於脆性材 料基板4上進行旋轉,藉此,使與刀尖523之軌跡對應之劃 線SL形成於脆性材料基板4上。 <2 1.劃線輪之尺寸> 於此,劃線輪50之外徑Dm(參照圖7)通常為丨〜⑺…⑷, 較佳為1 5(mm)(更佳為卜”麵))之範圍。於劃線輪之外 徑Dm小於丨mm之情形時,劃線輪5()之操作性及对久性下 降另方面’於劃線輪50之外徑Dm大於5 mm之情形 時,有可能導致劃線時之垂直裂紋u能形成為比脆性材 159525.doc -13- 201238919 料基板4深。 又’劃線輪50之厚度Th(參照圖7)較佳為〇.5〜12(mmK更 佳為0.5〜l.l(mm))之範圍。於劃線輪5〇之厚度Th小於〇5 m m之情形時’有可能導致加工性及操作性下降。另一方 面’於劃線輪50之厚度Th大於12 mm之情形時,用於劃線 輪50之材料及製造之成本變高。 又,刀52之刀尖角Θ2(參照圖7)通常為鈍角,且較佳為 90<e2S160(deg)(更佳為 i〇0g2g140(deg))之範圍。再 者,刀尖角Θ2之具體角度係根據需要切斷之脆性材料基板 4之材質及/或厚度等適當設定。 <2.2.劃線輪中所含之材料> 用於劃線輪50成形之多晶鑽石係將具有微細之晶粒組 織 '或非晶質之石墨型碳物質作為起始物質,於超高壓高 m·下直接轉換燒結成鑽石。又,多晶鑽石實質上僅包含鑽 石’且並未刻意地對多晶鑽石添加其他物質。 作為具有微細晶粒組織之石墨型碳物質,例如可列舉平 均粒徑為0.5〜1(μηι)之鑽石粒子。又,作為具有非晶質之 石墨型奴物質,可列舉非晶形碳(am〇rph〇us Carbon: a. G)、奈米碳管(Carbon Nanotube: CNT)、或富勒稀 C60。 於此,對可用於劃線輪50成形之各種鑽石(例如,單結 晶鑽石、燒結鑽石、及多晶鑽石)進行比較研究。 首先,對多晶鑽石與單結晶鑽石進行比較研究。已知單 結晶鑽石具有解理性及結晶各向異性,且於特定之面方位 上達到最南硬度。 159525.doc •14- 201238919 與此相對,多晶鑽石伽苗 ,、單、〜日日鑽石相比,不存在解理問 題,不具有機械特性之各向異性,且具有優異之勃性。 〇 ’多4石之硬度於室溫下變得與依存於特定面方位之 卓結晶鑽石之最高硬度相 々曰寻因此,各面方位上之多晶鑽 石之硬度變得大致相同, 垃 且與單結晶鑽石之最高硬度相 等。 又’已知單結晶鑽石、w ., 、同,皿下在特有之(111) <110>方向 會引發滑移變形。其結果, 单L日日鑽石具有因加熱導致硬 度下降之問題。Access Mem〇ry) 92 is a volatile memory unit and stores information such as those used in the calculation of CPU 93. The CPU (Central pr0cessing Unit) 93 performs control of the program 91a following the r〇m9i (advance and retreat of the holding unit 1〇, rotation operation, and control of the reciprocating operation of the scribing head unit 30 by the drive unit 4), and brittleness Data processing such as position and posture calculation of the material substrate 4. For example, the CPU 93 is (1) calculating the position and posture of the brittle material substrate 4, and (2) rotating the rotary table ub based on the calculation result of the position and posture, and performing the forward movement of the mobile station 11c. The brittle material substrate 4 is processed for alignment of the scribing heads 30. <2. Configuration of the scribing wheel> Fig. 7 and Fig. 7 are a side view and a front view showing an example of the configuration of the scribing wheel 5〇. In the present embodiment, the scribing wheel 50 is formed of polycrystalline diamond. As shown in FIG. 3 to FIG. 7 , the scribing wheel 5 is configured such that the two truncated cones are 159525.doc •12·201238919 (where the area of the lower bottom surface is larger than the upper bottom surface) and are opposite to each other. Disc shape (abacus bead shape). As shown in Figs. 6 to 8, the scribing wheel 50 mainly includes a main body portion 51, a blade 52, and a blade edge 52a. As shown in Figs. 6 and 7, the main body portion 51 has a disk shape, and a through hole 50a penetrating through the main body portion 51 along the rotating shaft 50b is provided in the vicinity of the center of the main body portion 51. Further, an annular main body portion 5 is provided on the outer circumference of the main body portion 51. As shown in Fig. 6, the knife 52 is an annular body formed by a concentric inner circumference and an outer circumference centering on the rotation shaft 50b. . As shown in Fig. 7, the knife 52 is V-shaped in the front view. The thickness Tb (refer to FIG. 7) of the blade 52 along the rotating shaft 50b gradually becomes smaller as the self-rotating shaft 50b side faces the blade edge 52a. The blade edge 52a is along the outermost peripheral portion of the blade 52 (ie, the blade 52). The distance between the middle and the rotating shaft 5〇b is maximized, and the thickness Tb of the knife 52 is the smallest. As shown in Fig. 6, at each of the blade tips 52 & there are no intentionally formed irregularities, and the distance between the respective portions of the blade edge 52a and the rotating shaft 5〇b is the same. Further, the scribing wheel 50 is rotated on the brittle material substrate 4 while being in contact with the blade edge 52&, and the scribing line SL corresponding to the locus of the blade edge 523 is formed on the brittle material substrate 4. . <2 1. Size of the scribing wheel> Here, the outer diameter Dm (refer to Fig. 7) of the scribing wheel 50 is usually 丨~(7) (4), preferably 15 (mm) (more preferably 卜) The range of the surface). When the outer diameter Dm of the scribing wheel is less than 丨mm, the operability and durability of the scribing wheel 5() is decreased. The outer diameter Dm of the scribing wheel 50 is greater than 5 mm. In the case of the case, it is possible that the vertical crack u at the time of scribing can be formed deeper than the brittle material 159525.doc -13 - 201238919. Further, the thickness Th of the scribing wheel 50 (refer to FIG. 7) is preferably 〇. The range of .5 to 12 (mmK is preferably 0.5 to ll (mm)). When the thickness Th of the scribing wheel 5 is less than 〇5 mm, 'there may be a decrease in workability and workability. On the other hand' When the thickness Th of the scribing wheel 50 is greater than 12 mm, the cost of the material and the manufacturing cost for the scribing wheel 50 becomes high. Further, the blade tip angle Θ2 (refer to FIG. 7) of the blade 52 is usually an obtuse angle, and Preferably, the range of 90<e2S160(deg) (more preferably i〇0g2g140(deg)). Further, the specific angle of the corner angle Θ2 is appropriate according to the material and/or thickness of the brittle material substrate 4 to be cut as needed. Set. <2.2. Material contained in the wheel> The polycrystalline diamond used for the scribing wheel 50 is formed by using a fine grain structure or an amorphous graphite-type carbon material as a starting material, which is directly under ultrahigh pressure and high m· Conversion and sintering into diamonds. In addition, polycrystalline diamonds contain only diamonds in nature and do not intentionally add other substances to the polycrystalline diamonds. As a graphite type carbon material having a fine grain structure, for example, an average particle diameter of 0.5 to 〜 1 (μηι) of diamond particles. Further, as the amorphous graphite-type slave substance, amorphous carbon (am〇rph〇us Carbon: a. G), carbon nanotube (CNT Nanotube: CNT), Or Fuller C60. Here, a comparative study of various diamonds (for example, single crystal diamonds, sintered diamonds, and polycrystalline diamonds) that can be used for the scribing wheel 50 is formed. First, for polycrystalline diamonds and single crystal diamonds. Comparative study. Single crystal diamonds are known to have cleavage and crystal anisotropy, and reach the southernmost hardness in a specific plane orientation. 159525.doc •14- 201238919 In contrast, polycrystalline diamond gamma seedlings, single, ~ Compared to daily diamonds There is no cleavage problem, no anisotropy of mechanical properties, and excellent boring properties. 硬度 'More than 4 stone hardness at room temperature becomes opposite to the highest hardness of crystallized diamonds depending on the specific plane orientation. Therefore, the hardness of the polycrystalline diamonds in each plane orientation is approximately the same, and the highest hardness is equal to that of the single crystal diamond. Also known as single crystal diamonds, w., and, under the dish are unique ( 111) The <110> direction will cause slip deformation. As a result, the single L day diamond has a problem that the hardness is lowered due to heating.

與此相對,多晶艚x + B rn p t 日日界結合強度較高,且具有晶界 龜裂傳播之抑制效果及 m ^ 0 迮變形之抑制效果。因此,多晶 鑽石與皁結晶鑽石相比 於同丨皿下具有優異之硬度特性。 其-人,對多晶鑽石與士 、燒,,°鑽石進行比較檢討。燒結鑽石 诉稭由將鑽石粒子、全 結而夺点。m 屬、,° 5材料、及添加劑之混合物燒 晶錯Λ 鑽石與夕日日鑽石同樣地,相較單結 日日鑽石不存在解理問 且右德 不具有機械特性之各向異性,且 具有優異之韌性。 #'且 然而,燒結鑽石且有闵曰 ^ 八因阳界中所含之結合材料導致高溫 下之機械特性下降之問題。 例如,於燒結鑽石中, 材料之催化作用… 之鑽石粒子係藉由金屬結合 該妹a而开]、、”。即’燒結鑽石係實質上具有藉由 成、·口 口而形成之鑽石 柯田 料。因此,視情UpT 與金屬結合材料之複合材 金屬結合材料之_㈣會因鑽石之結構體之熱膨服率與 ,、,、/脹率之差,而於鑽石之結構體中產生 159525.doc -15· 201238919 微J裂,.·文其、‘果’若燒結鑽石經受熱履歷,則視情況不 同’會導致燒結鑽石之硬度下降。 與此相對,多晶鑽石係不包含燒結助劑及金屬結合材料 之鑽石單相多晶。多晶鑽石具有數十nm之緻密性鑽石粒子 彼此牢固地直接接合之構造。即,多晶鑽石實質上於晶界 上不含有夾雜4勿’從而不具有因夾雜物導致產生微小裂紋 之問題。因此,多晶鑽石與燒結鐵石不同,可減少因熱履 歷導致硬度下降之問題。 如上所述,乡晶鑽石不僅具有單結晶鑽石之優點與燒結 鑽石之優點’ 1具有耐熱性。藉此,由多晶鑽石形成之劃 線輪5〇不僅可提昇常溫下之硬度,而且可提昇高溫下之機 械特性。因此,可實現劃線輪5〇更進一步之長壽命化。 &lt;3.劃線輪之成形方法&gt; 於此,對由多晶鑽石成形劃線輪5〇之方法進行說明。首 先:於本成形方法中’首先自設為較佳厚度 之多晶鑽石中切取達到所需半徑之圓盤^ 其次,以沿著旋轉軸50b之刀52之厚度^自旋轉軸5仙側 朝向刀尖52a逐漸變小之方式,切削圓盤之周緣部。藉 此於圓盤之周緣部形成前視呈v字狀之刀52。 &lt;4.劃線方法&gt; 於此,對利用劃線輪50於脆性材料基板4上形成劃線儿 之方法進行說明。 於本方法中,釗線頭部30之劃線輪50利用未圖示之升 降加壓機構對脆性材料基板4壓接。又,保持單元1〇之 I59525.doc -16- 201238919 電動機13及/或驅動部4〇之電動機43受到驅動,使劃線頭 部30相對於由保持單元1〇保持之脆性材料基板4於水平面 内相對移動。因此,於脆性材料基板4上,利用劃線輪5〇 形成所需之劃線SL,並產生垂直裂紋κ。 於此,劃線負載較佳為5〜5〇(N)(更佳為15〜30(N))之範 圍。又,劃線輪50相對於脆性材料基板4之移動速度(以 下’亦簡稱為「劃線速度」)通常為5〇〜12〇〇(mm/sec)、較 佳為50〜300(mm/sec)之範圍。再者,劃線負載及劃線速度 之具體值係根據脆性材料基板4之材質及/或厚度等而適當 設定。 又,於脆性材料基板4上,相應於劃線頭部3〇之相對移 動而形成如下之劃線SL。 例如’若於使電動機43停止之狀態下驅動電動機丨3,則 使保持單元10於令劃線頭部30停止之狀態下於進退方向 (圖1之箭線AR1方向)上移動。即,劃線頭部3 〇相對於由保 持單元10保持之脆性材料基板4於進退方向上相對移動。 因此,於脆性材料基板4之上表面形成沿著該進退方向之 劃線SL(參照圖3)。 另一方面’若於使電動機13停止之狀態下驅動電動機 43 ’則使劃線頭部30於令保持單元1〇停止之狀態下於往復 方向(圖2之箭線AR2方向)上移動。即,劃線頭部3〇相對於 由保持單元1 〇保持之脆性材料基板4於往復方向上相對移 動。因此’於脆性材料基板4之上表面形成沿著該往復方 向之劃線SL(參照圖3)。 159525.doc •17· 201238919 又’若各電動機13、43之動作狀態自⑴使電動機们停 止且使電動機13驅動之狀態變為(2)使電動機13停止且使電 動機43驅動之狀態,則劃線頭部3〇之移動方向因主銷後傾 穩定效應而自與脆性材料基板4平行之進退方向(第丨水平 方向)變為往復方向(第2水平方向)。即,劃線輪5〇保持與 脆性材料基板4抵接,而使劃線輪5〇之刀尖52&amp;之方向變更 90度。因此,於脆性材料基板4之上表面形成大致l字狀之 劃線SL(參照圖3)。 進而,於電動機13、43同時旋轉之情形時,劃線頭部3〇 之行進方向變為相對於進退方向(箭線AR1方向)及往復方 向(箭線AR2方向)傾斜之狀態。因此,於脆性材料基板4之 上表面,形成相對進退方向及往復方向傾斜之狀態之劃線 SL(參照圖3)。進而,於使電動機13、43之轉數發生變化 之情形時’形成曲線狀之劃線SL(參照圖3)。 於此,於本實施形態中,亦將以形成大致L字狀之劃線 之方式,使脆性材料基板4上產生垂直裂紋κ(參照圖3)之 情況稱為「L字劃線」。 再者,於斷裂之情形時’利用斷裂裝置(省略圖示)對脆 性材料基板4之主面中之形成有劃線SL之主面(以下,亦 簡稱為「形成面」)、及(2)與形成面為相反側之主面傳遞 應力。因此,於劃線步驟中產生於脆性材料基板4上之垂 直裂紋K伸展至與形成面為相反側之面為止,從而將脆性 材料基板4切斷(斷裂步驟)。 又’於分裂之情形時’藉由劃線步驟而形成較深之垂直 159525.doc -18· 201238919 裂紋κ。因此’無需斷裂裝置(省略圖示),而僅藉由劃線 步驟切斷脆性材料基板4。 &lt;5.本實施形態之劃線輪之優點&gt; 如上所述,本實施形態之劃線輪5〇係為多晶鑽石製且 該多晶鑽石係將具有微細之晶粒組織、或非晶質之石墨型 碳物質作為起始物質’於超高壓高溫下直接:換燒結成錯 石。又,多晶鑽石有時包含極其微量之氮等,但實質上僅 包含鑽石,且未刻意地對多晶鑽石添加其他物質。 藉此’由多晶鑽石形成之劃線輪50不僅可提昇常溫下之 硬度,而且可提昇高溫下之機械特性。因此,可實現劃線 輪50更進一步之長壽命化。 &lt; 6.變形例&gt; 以上,對本發明實施形態進行了說明,但本發明並不限 定於上述實施形態,可進行各種變形。 (1)於本實施形態中,以於刀尖5 2 a之各部分上不存在刻 意形成之凹凸之方式進行了說明(參照圖6及圖7),但刀尖 52a之形狀並不限定於此。圖8係圖6之A部分放大圖。如圖 8所示,刀尖52a具有突起部54,並且於刀尖52a上設置有 槽53、及稜線54a。 複數個槽53係設置於刀尖52a上且側視圖中大致呈v字狀 之凹陷,且藉由雷射加工、放電加工、或研磨加工等先前 公知之加工方法而形成。如圖8所示,鄰接之槽5 3係沿著 刀52之外周僅隔開所需間距p而形成。 其中’如上所述,本實施形態之劃線輪50為小徑 159525.doc •19· 201238919On the other hand, the polycrystalline germanium x + B rn p t has a high bonding strength per day, and has the effect of suppressing the crack propagation at the grain boundary and suppressing the deformation of m ^ 0 迮. Therefore, polycrystalline diamonds have superior hardness characteristics compared to soap-crystallized diamonds under the same dish. It is a person who compares the polycrystalline diamonds with the diamonds, burns, and diamonds. Sintered diamonds complain that the straw is made up of diamond particles. m genus, ° 5 material, and mixture of additives, crystallized Λ 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石Excellent toughness. #' And, however, sintered diamonds and 闵曰 ^ eight due to the combination of materials contained in the yang boundary cause the problem of mechanical properties at high temperatures. For example, in sintered diamonds, the catalysis of the material... The diamond particles are bound by the metal to the sister a, ie, the sintered diamond has substantially the diamond formed by the mouth and mouth. Therefore, depending on the composite material of the UpT and the metal bond material, the metal bond material will be in the structure of the diamond due to the difference between the thermal expansion rate of the structure of the diamond and the difference between the expansion ratio and the expansion ratio. Produced 159525.doc -15· 201238919 Micro-J split, .. Wen Qi, 'fruit' if the sintered diamond is subjected to the heat history, depending on the situation 'will lead to a decrease in the hardness of the sintered diamond. In contrast, the polycrystalline diamond does not contain A single-phase polycrystalline diamond with a sintering aid and a metal bonding material. The polycrystalline diamond has a structure in which the dense diamond particles of several tens of nm are firmly bonded to each other. That is, the polycrystalline diamond does not substantially contain inclusions on the grain boundary. 'There is no problem of microcracking due to inclusions. Therefore, unlike polycrystalline diamond, polycrystalline diamond can reduce the problem of hardness reduction due to thermal history. As mentioned above, the crystal diamond not only has a single The advantages of crystal diamonds and the advantages of sintered diamonds '1 have heat resistance. Thereby, the scribing wheel 5 formed of polycrystalline diamond can not only improve the hardness at normal temperature, but also improve the mechanical properties at high temperatures. Further, the scribing wheel 5〇 has a longer life. <3. Method of forming the scribing wheel> Here, a method of forming the scribing wheel 5〇 from the polycrystalline diamond will be described. First, in the present forming method 'Firstly, a disc having a desired radius is cut from a polycrystalline diamond of a preferred thickness. Next, the thickness of the knife 52 along the rotating shaft 50b is gradually reduced from the side of the rotating shaft 5 toward the cutting edge 52a. In this manner, the peripheral portion of the disk is cut, whereby a v-shaped knife 52 is formed in the peripheral portion of the disk. [4. Scribing method] Here, the scribing wheel 50 is used for the brittle material substrate. In the present method, the scribing wheel 50 of the twisting head portion 30 is crimped to the brittle material substrate 4 by a lifting and lowering mechanism (not shown). I59525.doc -16- 201238919 Motor 13 and/or motor 43 of drive unit 4 To drive, the scribing head 30 is relatively moved in the horizontal plane with respect to the brittle material substrate 4 held by the holding unit 1 . Therefore, on the brittle material substrate 4, the required scribing SL is formed by the scribing wheel 5 And generating a vertical crack κ. Here, the scribing load is preferably in the range of 5 to 5 〇 (N) (more preferably 15 to 30 (N)). Further, the scribing wheel 50 is opposed to the brittle material substrate 4 The moving speed (hereinafter also referred to as "scribing speed") is usually in the range of 5 〇 to 12 〇〇 (mm/sec), preferably 50 to 300 (mm/sec). Further, the specific values of the scribing load and the scribing speed are appropriately set depending on the material and/or thickness of the brittle material substrate 4. Further, on the brittle material substrate 4, a scribe line SL as follows is formed corresponding to the relative movement of the scribe head portion 3''. For example, when the motor 丨3 is driven in a state where the motor 43 is stopped, the holding unit 10 is moved in the advancing and retracting direction (the direction of the arrow line AR1 in Fig. 1) while the scribing head portion 30 is stopped. That is, the scribing head portion 3 is relatively moved in the advancing and retracting direction with respect to the brittle material substrate 4 held by the holding unit 10. Therefore, a scribe line SL (see Fig. 3) along the advancing and retracting direction is formed on the upper surface of the brittle material substrate 4. On the other hand, when the motor 43 is driven in a state where the motor 13 is stopped, the scribing head portion 30 is moved in the reciprocating direction (the direction of the arrow line AR2 in Fig. 2) while the holding unit 1 is stopped. Namely, the scribing head portion 3〇 is relatively moved in the reciprocating direction with respect to the brittle material substrate 4 held by the holding unit 1A. Therefore, a scribe line SL (see Fig. 3) along the reciprocating direction is formed on the upper surface of the brittle material substrate 4. 159525.doc •17· 201238919 In addition, if the operation state of each of the motors 13 and 43 is changed from (1) the motor is stopped and the motor 13 is driven to the state (2) the motor 13 is stopped and the motor 43 is driven, The moving direction of the wire head 3 turns into a reciprocating direction (second horizontal direction) from the advancing and retracting direction (the horizontal direction) parallel to the brittle material substrate 4 due to the kingpin backward tilting stabilizing effect. That is, the scribing wheel 5 is held in contact with the brittle material substrate 4, and the direction of the blade edge 52&amp; of the scribing wheel 5 is changed by 90 degrees. Therefore, a substantially l-shaped scribe line SL is formed on the upper surface of the brittle material substrate 4 (see Fig. 3). Further, when the motors 13 and 43 are simultaneously rotated, the traveling direction of the scribing head 3〇 is in a state of being inclined with respect to the advancing and retracting direction (arrow line AR1 direction) and the reciprocating direction (arrow line AR2 direction). Therefore, on the upper surface of the brittle material substrate 4, a scribe line SL (see Fig. 3) in a state of being inclined with respect to the advancing and retracting direction and the reciprocating direction is formed. Further, when the number of revolutions of the motors 13 and 43 is changed, a curved line SL (see Fig. 3) is formed. Here, in the present embodiment, a case where a vertical crack κ (see Fig. 3) is generated on the brittle material substrate 4 by forming a substantially L-shaped scribe line is also referred to as an "L-line". In the case of the fracture, the main surface of the main surface of the brittle material substrate 4 in which the scribe line SL is formed (hereinafter, also simply referred to as "formation surface") and (2) The stress is transmitted to the main surface on the opposite side to the forming surface. Therefore, the vertical crack K generated on the brittle material substrate 4 in the scribing step is extended to the surface opposite to the formation surface, thereby cutting the brittle material substrate 4 (breaking step). In the case of splitting, a deeper vertical is formed by the scribing step. 159525.doc -18· 201238919 Crack κ. Therefore, the brittle material substrate 4 is cut only by the scribing step without a breaking device (not shown). &lt;5. Advantages of the scribing wheel of the present embodiment&gt; As described above, the scribing wheel 5 of the present embodiment is made of polycrystalline diamond and the polycrystalline diamond system will have fine grain structure or The crystalline graphite carbon material is used as the starting material 'directly under ultrahigh pressure and high temperature: it is changed into sintered rock. Further, polycrystalline diamonds sometimes contain extremely small amounts of nitrogen or the like, but contain only diamonds in essence, and do not intentionally add other substances to the polycrystalline diamonds. By this, the scribing wheel 50 formed of polycrystalline diamond can not only improve the hardness at normal temperature, but also improve the mechanical properties at high temperatures. Therefore, the scribing wheel 50 can be further extended in life. &lt; 6. Modified Example&gt; Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made. (1) In the present embodiment, the irregularities formed on the respective portions of the blade edge 5 2 a are not described (see FIGS. 6 and 7 ), but the shape of the blade edge 52 a is not limited to this. Figure 8 is an enlarged view of a portion A of Figure 6. As shown in Fig. 8, the blade edge 52a has a projection portion 54, and a groove 53 and a ridge line 54a are provided on the blade edge 52a. The plurality of grooves 53 are formed on the blade edge 52a and have a substantially V-shaped recess in a side view, and are formed by a conventionally known processing method such as laser processing, electric discharge machining, or polishing. As shown in Fig. 8, the adjacent grooves 53 are formed along the outer circumference of the blade 52 only by the required pitch p. Wherein, as described above, the scribing wheel 50 of the present embodiment has a small diameter 159525.doc •19·201238919

GdOnm)),且於槽53之形成過程中要求加工精度。因 此作為槽53之加工方法,推薦雷射加工,作為使用之雷 射光,可列舉例如YAG(Yttrium Aluminium以咖,㈣石 榴石)高頻雷射、二氧化碳氣體雷射 '綠色雷射、 UV(Ultravi〇let,紫外線)雷射、飛秒雷射。 如圖8所示,複數個突起部54係沿著本體部51之最外周 部设置。更具體而言’各突起部54係設置於沿著刀尖52a 設置之複數個槽53中鄰接之槽53之間。 如上所述,刀尖52a具有複數個突起部54(參照圖8),且 脆性材料基板4之切斷(分裂或斷裂)係藉由各突起部$ 4抵接 (嵌入)於刀尖52a而實現。 又,如上所述,劃線輪50係由多晶鑽石成形。藉此,常 溫下之劃線輪50之硬度、及高溫下之劃線輪5〇之機械特性 提昇。 因此,當劃線輪50之行進方向於劃線輪5〇抵接於作為切 斷對象之脆性材料基板4之狀態下發生變化時,亦可有效 地防止刀尖52a之各突起部54缺損。因此,實現了劃線輪 50更進一步之長壽命化。 再者,於圖8中’為了方便圖示,僅記載有3個槽53、及 4個突起部54。又’形成於刀尖52a上之複數個槽53係以千 分尺級刻意地加工而成。因此,複數個槽53區別於藉由刀 尖52a形成時之研磨加工而必然形成之研磨條紋。 又’形成於刀尖52a上之槽53之深度Dp(換言之,突起部 54之高度:參照圖8)通常為1〜60(μιη),較佳為丨〜2〇() 159525.doc -20- 201238919 (更佳為1〜15(μηι))之範圍。當利用槽53之深度Dp達到i 以上(尤其2 μιη以上)之劃線輪50連續地形成劃線儿之情形 時,可充分確保垂直裂紋Κ達到所需深度以上之劃線弘之 長度(以下,亦簡稱為「有效切削長度」)。另一方面,就 加工性方面而言,將深度Dp設定為6〇 μΓΏ以下。 又,鄰接之槽53之間之間距ρ(參照圖8)通常為1〇〜2〇〇 (μιη),較佳為50〜200(μιη)(更佳為7〇〜17〇(μιΏ))之範圍。當 鄰接之槽53之間之間距Ρ小於1〇 μπΐ2情形時,有時劃線輪 50之刀尖52a之磨損變大,導致耐久性下降。另一方面, 當該間距P大於200 μηΐ2情形時,有時無法於脆性材料基 板4上形成良好之垂直裂紋κ。 又化成於鄰接之槽53之間之稜線54a之長度l(參照圖 8)較佳為25〜75bm)(更佳為25〜75(μιη))之範圍。當該稜線 54a之長度L小於25 μιη之情形時,將無法確保充分之有效 切削長度,從而產生劃線輪5〇之壽命變短之類的問題。 進而,槽53之寬度W相對稜線54a之長度L之比例Ri( = W/L)通常為〇_2〜5.0 ’較佳為〇·5〜5.0(進而,就形成較深之 垂直裂紋而言,較佳為1·〇〜35,另一方面,就斷裂面或分 割面之品質方面而言,較佳為〇)之範圍。於此情形 時’可充分確保有效切削長度。 (2)又’設置於刀尖52a上之複數個槽53之形狀並不限定 於側視圖中大致呈V字狀。圖9至圖u係表示形成於劃線輪 5〇之刀大52a上之槽53之其他例之圖。如圖9所示,槽53亦 可為例如側視圖中呈梯形之凹陷。又,如圖1〇及圖丨丨所 159525.doc •21 · 201238919 不’亦可為側視圖中呈圓弧狀或矩形狀之凹陷β 【圖式簡單說明】 圖1係表示本發明實施形態之劃線裝置之整體構成之 例之前視圖。 圖2係表示本發明實施形態之劃線裝置之整體構成之 例之側視圖。 圖3係表示劃線輪附近之構成之一例之前視圖。 圖4係表示劃線輪附近之構成之一例之仰視圖。 圖5係用以說明主銷後傾穩定效應之仰視圖。 圖6係表示劃線輪之構成之一例之側視圖。 圖7係表示劃線輪之構成之一例之前視圖。 圖8係圖6之Α部分之放大圖。 圖9係表示形成於劃線輪之刀尖上之槽形狀之其他例 圖。 圖1 〇係表示形成於劃線輪之刀尖上之槽形狀之其他例 圖。 圖11係表不形成於劃線輪之刀尖上之槽形狀之其他例 圖。 【主要元件符號說明】 劃線裝置 脆性材料基板 保持單元 基部 載置台 之 之 之 4 10 10a 11 159525.doc •22- 201238919 lla 吸附部 lib 旋轉台 11c 移動台 lid 旋轉軸 12 滾珠螺桿機構 12a 進給螺桿 12b 螺母 13 電動機 14a 、14b 支撐部 15 ' 16 一對導執 17、 17a、17b &gt; 滑動部 18、 18a 20 劃線單元 30 劃線頭部 35 輪架 36 銷 37 支撐框體 38 回轉部 38a 旋轉軸 40 驅動部 41、 41a、41b 支柱 42 導執 43 電動機 50 劃線輪 159525.doc -23- 201238919GdOnm)), and processing accuracy is required during the formation of the groove 53. Therefore, as the processing method of the groove 53, laser processing is recommended, and as the laser light to be used, for example, YAG (Yttrium Aluminium coffee, (iv) garnet) high-frequency laser, carbon dioxide gas laser 'green laser, UV (Ultravi) 〇let, ultraviolet) laser, femtosecond laser. As shown in Fig. 8, a plurality of projections 54 are provided along the outermost periphery of the body portion 51. More specifically, each of the projections 54 is disposed between the adjacent grooves 53 in the plurality of grooves 53 provided along the blade edge 52a. As described above, the blade edge 52a has a plurality of protrusions 54 (refer to FIG. 8), and the cutting (split or break) of the brittle material substrate 4 is abutted (embedded) by the respective protrusions $4 on the blade edge 52a. achieve. Further, as described above, the scribing wheel 50 is formed of polycrystalline diamond. Thereby, the hardness of the scribing wheel 50 at normal temperature and the mechanical characteristics of the scribing wheel 5 at a high temperature are improved. Therefore, when the traveling direction of the scribing wheel 50 changes in a state in which the scribing wheel 5A abuts against the brittle material substrate 4 as the cutting target, the projections 54 of the blade edge 52a can be effectively prevented from being damaged. Therefore, the life of the scribing wheel 50 is further extended. In addition, in FIG. 8, 'for the convenience of illustration, only three grooves 53 and four protrusions 54 are described. Further, a plurality of grooves 53 formed on the blade edge 52a are intentionally processed in a micrometer scale. Therefore, the plurality of grooves 53 are distinguished from the grinding stripes which are inevitably formed by the grinding process when the blade edge 52a is formed. Further, the depth Dp of the groove 53 formed on the blade edge 52a (in other words, the height of the protrusion portion 54: see Fig. 8) is usually 1 to 60 (μιη), preferably 丨~2〇() 159525.doc -20 - 201238919 (more preferably 1 to 15 (μηι)) range. When the scribing wheel 50 having a depth Dp of the groove 53 of i or more (especially 2 μm or more) is continuously formed with a scribe line, it is possible to sufficiently ensure that the vertical crack Κ reaches a desired depth or more (hereinafter, Also referred to as "effective cutting length"). On the other hand, in terms of workability, the depth Dp is set to 6 〇 μΓΏ or less. Further, the distance ρ between the adjacent grooves 53 (see Fig. 8) is usually 1 〇 to 2 〇〇 (μιη), preferably 50 to 200 (μιη) (more preferably 7 〇 to 17 〇 (μιΏ)). The scope. When the distance between the adjacent grooves 53 is less than 1 〇 μπ ΐ 2, the wear of the blade edge 52a of the scribing wheel 50 may become large, resulting in a decrease in durability. On the other hand, when the pitch P is larger than 200 μη ΐ 2, a good vertical crack κ may not be formed on the brittle material substrate 4. Further, the length l (see Fig. 8) of the ridge line 54a formed between the adjacent grooves 53 is preferably in the range of 25 to 75 bm) (more preferably 25 to 75 (μιη)). When the length L of the ridgeline 54a is less than 25 μm, a sufficient effective cutting length cannot be ensured, resulting in a problem that the life of the scribing wheel 5 is shortened. Further, the ratio of the width W of the groove 53 to the length L of the ridgeline 54a Ri (= W/L) is usually 〇_2 to 5.0', preferably 〇5 to 5.0 (further, in terms of forming a deep vertical crack) Preferably, it is 1·〇~35, and on the other hand, in terms of the quality of the fracture surface or the division surface, it is preferably in the range of 〇). In this case, the effective cutting length can be sufficiently ensured. (2) The shape of the plurality of grooves 53 provided on the blade edge 52a is not limited to a substantially V-shape in a side view. Fig. 9 to Fig. 9 are views showing another example of the groove 53 formed in the blade 52a of the scribing wheel 5?. As shown in Fig. 9, the groove 53 may also be, for example, a trapezoidal depression in a side view. Moreover, as shown in Fig. 1 and Fig. 159525.doc • 21 · 201238919, it may not be a concave or concave shape in a side view in an arc shape or a rectangular shape. [Schematic description of the drawings] Fig. 1 shows an embodiment of the present invention. A front view of an example of the overall configuration of the scribing device. Fig. 2 is a side view showing an example of the overall configuration of a scribing apparatus according to an embodiment of the present invention. Fig. 3 is a front view showing an example of the configuration in the vicinity of the scribing wheel. Fig. 4 is a bottom view showing an example of the configuration in the vicinity of the scribing wheel. Fig. 5 is a bottom view for explaining the stabilizing effect of the kingpin. Fig. 6 is a side view showing an example of the configuration of the scribing wheel. Fig. 7 is a front view showing an example of the configuration of the scribing wheel. Figure 8 is an enlarged view of a portion of Figure 6. Fig. 9 is a view showing another example of the shape of the groove formed on the blade edge of the scribing wheel. Fig. 1 is a view showing another example of the shape of a groove formed on the tip of the scribing wheel. Fig. 11 is a view showing another example of the shape of the groove which is not formed on the blade edge of the scribing wheel. [Description of main component symbols] Scribe device brittle material substrate holding unit base mounting table 4 10 10a 11 159525.doc •22- 201238919 lla adsorption unit lib rotating table 11c moving table lid rotating shaft 12 ball screw mechanism 12a feeding Screw 12b nut 13 motor 14a, 14b support portion 15' 16 pair of guides 17, 17a, 17b &gt; sliding portion 18, 18a 20 scribing unit 30 scribing head 35 wheel carrier 36 pin 37 supporting frame 38 turning portion 38a Rotary shaft 40 Drive unit 41, 41a, 41b Pillar 42 Guide 43 Motor 50 Scribe wheel 159525.doc -23- 201238919

50a 50b 50c 51 52 52a 53 54 54a 60 65、 90 91 91a 92 93 AR1 AR4 Dm Dp K 貫通孔 旋轉軸 設置位置 本體部 刀 刀尖 槽 突起部 棱線 攝像部單元 65a、65b 攝像機 控制單元 ROM(Read Only Memory,唯讀 記憶體) 程式 RAM(Random Access Memory 5 隨機存取記憶體) CPU(Central Processing Unit,中 央處理單元) 、AR2、AR3、 箭線 劃線輪之外徑 槽之深度 垂直裂紋 159525.doc -24- 201238919 L 棱線之長度 P 間距 R1、R2 箭線 SL 劃線 Tb 刀之厚度 Th 劃線輪之厚度 W 槽之寬度 159525.doc -25-50a 50b 50c 51 52 52a 53 54 54a 60 65, 90 91 91a 92 93 AR1 AR4 Dm Dp K Through-hole rotation axis setting position Main body knife tip groove projection ridge line imaging unit 65a, 65b Camera control unit ROM (Read Only Memory (read only memory) Program RAM (Random Access Memory 5) CPU (Central Processing Unit), AR2, AR3, arrow line wheel OD groove depth vertical crack 159525 .doc -24- 201238919 L Length of ridge line P Spacing R1, R2 Arrow line SL scribe line Tb Thickness of knife Th Thickness of scribe wheel W Width of groove 159525.doc -25-

Claims (1)

201238919 七、申請專利範圍: 1. 一種劃線輪,其特徵在於:其係多晶鑽石製劃線輪,且 包括: (a)圓盤狀之本體部; ' . (b)设置於上述本體部外周之圓環狀之刀;及 - (c)/0著上述刀之最外周部設置之刀尖; 上述刀之厚度係自上述本體部之中心朝向上述刀尖變 小; 上述夕aa鑽石係將具有微細之晶粒組織、或非晶質之 石墨型碳物質作為起始物質,於超高壓高溫下直接轉換 燒結成鑽石者,且實質上僅包含鑽石。 2. 如請求項1之劃線輪,其中 上述刀尖具有(b - 1 )沿著上述最外周部設置之複數個突 起部。 3. 一種劃線裝置,其特徵在於包括: 劃線單兀’其係藉由使如請求項}或2之劃線輪對脆性 材料基板壓接滚動,而於上述脆性材料基板上形成劃 線;及 . ㈣單元’其係—面㈣上述驗㈣基板,-面使 . 所保持之上述脆性材料基板對劃線單元相對移動。 I59525.doc201238919 VII. Patent application scope: 1. A scribing wheel, characterized in that it is a polycrystalline diamond scribing wheel, and includes: (a) a disk-shaped body portion; '. (b) is disposed on the body a ring-shaped knife on the outer circumference; and - (c) / 0 is provided at the outermost peripheral portion of the knife; the thickness of the knife is smaller from the center of the body portion toward the tip; A graphite material having a fine grain structure or an amorphous graphite material is used as a starting material, and is directly converted into a diamond at an ultrahigh pressure and high temperature, and substantially contains only a diamond. 2. The scribing wheel of claim 1, wherein the cutting edge has (b-1) a plurality of projections disposed along the outermost peripheral portion. 3. A scribing apparatus, comprising: a scribing unit 兀' which forms a stroke on the brittle material substrate by crimping a brittle material substrate by a scribing wheel as claimed in claim 2 or 2 (4) The unit 'the system' - the surface (4) the above test (4) substrate, - surface. The above-mentioned brittle material substrate is relatively moved to the scribe unit. I59525.doc
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