201237440 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種用於電子電路基板門* 的檢查系統及封裝件保持具。 等的連接 【先前技術】 以往’在進行封入半導體積體電路之半導體 液晶面板（panel)等之檢查對象的導通狀熊檢杳封農件或 作特性檢查的檢查系統中，為了謀求檢查對象與查及/或動 用信號之信號處理裝置之間的電性連接，採用二輪出撿查 導電性的接觸探針（contact probe)的探針單I數個收各 unit)。在探針單元中，伴隨著近年來半導體 液晶面板的高度積體化、細微化的進展，藉由將接觸探針 間的間距予以狹小化’對高度積體化、細微化的檢查對象 亦能夠適用的技術正進步中。 然而，在檢查對象的導通狀態檢查及動作特性檢查 中，要求縮短在檢查所需的時間。製造檢查對象的廠商了 為了縮短檢查時間，藉由同時使多數個半導體封裝件與複 數個接觸探針接觸來進行檢查。 〃 以往，同時地進行連接在個片切斷前的封裴件載體 (package carrier)連結體之狀態的複數個基板的檢查所 進行的基板檢查（例如，參照專利文獻丨）。藉由該基板 檢查裝置同時地進行複數個基板的檢查，能夠縮短在二查 所需的時間。此外，在進行基板檢查後，藉由壓機（p r e s f) 裝置使各基板從封裝件載體連結體被分割。 323813201237440 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an inspection system and a package holder for an electronic circuit board door*. [Phase of the prior art] In the conventional inspection system for conducting inspection of a semiconductor liquid crystal panel such as a semiconductor liquid crystal panel, etc., or in the inspection system for characteristic inspection, in order to check the object to be inspected The electrical connection between the signal processing devices that detect and/or use the signals is performed by using a two-round inspection probe of a conductive contact probe to receive a plurality of units. In the probe unit, the height of the semiconductor liquid crystal panel has been increased in recent years, and the pitch of the contact probes has been narrowed. The applicable technology is progressing. However, in the conduction state inspection and the operation characteristic inspection of the inspection object, it is required to shorten the time required for the inspection. Manufacturers who manufacture inspection objects In order to shorten the inspection time, inspection is performed by simultaneously bringing a plurality of semiconductor packages into contact with a plurality of contact probes. In the past, the substrate inspection performed by the inspection of a plurality of substrates in a state in which the package carrier is connected before the sheet cutting is performed (for example, see Patent Document). By performing the inspection of a plurality of substrates simultaneously by the substrate inspection device, the time required for the second inspection can be shortened. Further, after the substrate inspection, each substrate is divided from the package carrier assembly by a press (p r e s f) device. 323813
S 4 201237440 對此，就對於個片切斷之基板進行檢查的方法而言， 在專利文獻2中，揭示了一種構件檢查方法，係對於載置 在托盤（tray)之凹部的各基板，藉由因瞬間移動或振動 所產生的慣性移動、因傾斜所產生的滑動移動而使凹部的 基板移動並進行基板對於凹部之定位後進行基板的檢查。 在專利文獻3中，揭示有一種基板治具（JIG)板，係藉由 被連結的複數個壓接桿分別推壓載置於各開口部之基板的 角部來進行複數個基板的定位。此外，在專利文獻4中， 揭示有一種基板檢查方法，係以對電路基板的網路、配線 樣式（Pattern)附加優先順位來依序進行檢查，俾能縮短 電路基板的檢查時間。 (先前技術文獻） (專利文獻） 專利文獻1:曰本特開平1卜23646號公報。 專利文獻2:日本特開2007-3326號公報。 專利文獻3:日本特開2008-101959號公報。 專利文獻4:日本特開2008-281406號公報。 【發明内容】 (發明所欲解決的課題） 然而，在專利文獻1所示的基板檢查裝置中，可檢查 的基板被限定在利用封裝件載體連結體的基板。因此，進 行被個片切斷之基板（半導體封裝件）的檢查時，必須將 基板一個個依序檢查，或者在托盤的預定位置分別載置基 板，而會有導致在檢查所需的時間增加的問題。 5 323813 201237440 此外，在專利文獻2所示之構件檢查方法及專利文獻 3所示之基板治具板中，雖可進行複數個基板的定位而同 時地進行檢查，但會有使裝置構成變得複雜的問題。在專 利文獻4所示的基板檢查方法中，雖然能夠縮短一個基板 所需的檢查時間，但因一個個進行檢查，故會有導致檢查 費時的問題。 本發明係為有鑑於前述之問題點所開發者，其目的係 為提供一種檢查系統及封裝件保持具，其係以簡易的構 成，能夠縮短對被個片切斷之檢查對象之檢查所需的時間。 (解決課題的手段） 為了解決前述課題並達成目的，本發明的檢查系統係 具備有：托盤，係具有保持做為檢查對象之封裝件的複數 個保持孔；接觸探針，係於進行檢查時與前述封裝件的電 極接觸；探針保持具，係保持前述接觸探針；以及定位手 段，係設置於前述探針保持具，用以在進行前述檢查時進 行前述封裝件相對於前述保持孔的定位。 此外，本發明的檢查系統係在前述的發明中，復具備 有：蓋體，係覆蓋前述托盤的上表面，且具有供前述封裝 件所具有的電極露出於外部的開口部，並能夠與藉由前述 托盤所保持之封裝件的至少一部份抵接。 此外，本發明的檢查系統係在前述的發明中，前述定 位手段係為從前述探針保持具朝與該探針保持具的主面垂 直之方向延伸之前端呈尖細形狀的複數個銷針；前述托盤 係具有可供前述銷針的前端插入的插入孔；前述銷針係在 6 323813In the case of the method of inspecting the substrate cut by the sheet, Patent Document 2 discloses a method of inspecting the member, and borrows from each of the substrates placed on the recess of the tray. The substrate is inspected by the inertial movement due to the instantaneous movement or the vibration, the sliding movement caused by the tilt, the substrate of the concave portion being moved, and the positioning of the substrate with respect to the concave portion. Patent Document 3 discloses a substrate jig (JIG) plate in which a plurality of substrates are positioned by pressing a plurality of crimping bars connected to each other to press a corner portion of a substrate placed in each opening. Further, Patent Document 4 discloses a substrate inspection method for sequentially inspecting a network and a wiring pattern of a circuit board in order to shorten the inspection time of the circuit board. (Prior Art Document) (Patent Document) Patent Document 1: Japanese Patent Publication No. Hei No. 23646. Patent Document 2: Japanese Laid-Open Patent Publication No. 2007-3326. Patent Document 3: Japanese Laid-Open Patent Publication No. 2008-101959. Patent Document 4: Japanese Laid-Open Patent Publication No. 2008-281406. [Problem to be Solved by the Invention] In the substrate inspection apparatus described in Patent Document 1, the substrate that can be inspected is limited to the substrate using the package carrier. Therefore, when inspecting a substrate (semiconductor package) that has been cut by a sheet, it is necessary to inspect the substrates one by one, or to mount the substrates at predetermined positions of the tray, which may cause an increase in time required for inspection. The problem. In the member inspection method shown in Patent Document 2 and the substrate fixture shown in Patent Document 3, the plurality of substrates can be positioned and simultaneously inspected, but the device configuration may be changed. complicated question. In the substrate inspection method shown in Patent Document 4, the inspection time required for one substrate can be shortened, but inspection is performed one by one, which causes a problem that inspection takes time. The present invention has been made in view of the above problems, and an object thereof is to provide an inspection system and a package holder which are capable of shortening the inspection of an inspection object that is cut by a sheet. time. (Means for Solving the Problem) In order to solve the above problems and achieve the object, the inspection system of the present invention includes a tray having a plurality of holding holes for holding a package to be inspected, and a contact probe for performing inspection Contacting the electrode of the package; the probe holder retaining the contact probe; and the positioning means is disposed on the probe holder for performing the foregoing package relative to the holding hole when performing the foregoing inspection Positioning. Further, in the inspection system of the present invention, the cover body is provided with a cover that covers the upper surface of the tray and has an opening for allowing the electrode of the package to be exposed to the outside, and can be borrowed At least a portion of the package held by the tray is abutted. Further, in the inspection system of the present invention, the positioning means is a plurality of pins having a tapered shape extending from a direction in which the probe holder extends in a direction perpendicular to a main surface of the probe holder. The aforementioned tray has an insertion hole into which the front end of the pin can be inserted; the pin is attached to 6 323813
S 201237440 進行前述檢查時 件移動至預定位置。、""封袭件之外緣並使前述封裝 針係能夠朝^明的檢查系統係在前述的發明令 乃朝與对述探針保持 二發明t，前述鎖 此外，本發明的檢杳季统垂直之方向進退。 位手段係為在進行檢查述的發明卜前述定 ::裝件移動至前述保持孔二件的主面，並使 =彈簧係從前述探針保持具=置，彈簧;前 在傾斜方向立起地延伸。 朝向前述預定位置 此外，本發明的封裝件 ^呆持做為檢查對象之封裝件的複H有：托盤’係具 ，係覆蓋前述托盤的上表面，且具^持孔；以及蓋 有的電極露出於外部的開口部，並能夠鱼:迷封裝件所具 保持之封裂件的至少—部份抵接。〜由前述托盤所 (發明的效果） 本發明的檢查系統及封裝件保持具 劝1設有進行檢查對象之封裝件的定 為係在探針單 托盤與探針單元進行抵 、疋位手段，且使 檢查對象之封穿件的三 、a 進行保持於托盤的 農件的電極的接觸2位、：及5觸探針與檢查對象之封 …的接觸’因而達成以簡易的構成，能夠縮短對 不固片切斷之檢查對象之檢查所需的時間。 【實施方式】 以下參照圖式詳細地說明本發明之實施形態。另外， 本發明並非限定於下述實施形態。此外，在以下的說明中 323813 7 201237440 所參照的各圖，僅找夠獲得理解本發明之时 概略地顯示形狀、大小、以及位置 又上 作僅喊在錢所麻之雜、大小、'以及位置=明並 (苐一實施形態） ^ 第1圖係為顯示本第一實施形態的檢查系統之構成的 立體圖4 2 __示本第1施形態的檢查系統 成的分解立體圖。在第i圖、第2圖所示的檢查 係為在進行屬於檢㈣象之半導體封裝件2Q的電氣 檢查時所使用的裝置，且為用以將半導體封裝件2g與朝 導體封裝件20輸出檢查用信號 連接的裝置。 電路基板之間予以電性 檢查系統1係具備有大略圓盤狀之托盤10、大略圓盤 ，蓋體針單元4〇;該托盤 = =形的半料封裝㈣；該蓋體3G係㈣與 = 持之半導體封裝件20的至少一 ： ，係=導體封裝件20與電路基板之間電性連:針早 托盤0 ’係如第3圖所示的立體圖，具有形成在托盤 此Γ在面保持半導體料件2Q的保持孔u。 針二插通=有:供:键 各保持孔11至少形成兩個。插通此插:孔山係對於 成兩個時，係形成在對應於 a對於保持孔U形 續兩邊的位置。另外，托盤1(^之半处導體封裝件20的連 的材料所形成。此外，藉由:用月b夠對應於檢查溫度 才用與半導體封裝件線膨脹係 323813 8 201237440 數相同或近似的材料，則即使檢查對象的半導體封裝件膨 脹時，亦能夠進行正確的定位。 半導體封裝件20係為BGA(球閘陣列封裝，Ball Grid οS 201237440 Moves to the predetermined position when the above check is performed. And "" the outer edge of the encapsulation member and enable the aforementioned encapsulating needle system to be attached to the inspection system of the above-mentioned invention, and to maintain the invention of the probe, the aforementioned lock, in addition, the inspection of the present invention The season is vertical and vertical. The positioning means is the invention described in the above description: the mounting member moves to the main surface of the holding hole, and the spring is held from the probe holder = spring, and the front rises in the oblique direction. Extend the ground. In addition to the predetermined position, the package of the present invention holds the package as the object to be inspected. The tray 'cables cover the upper surface of the tray and have holes; and the covered electrodes The opening portion is exposed to the outside, and is capable of at least partially abutting the sealing member held by the fish. 〜The above-mentioned trays (effects of the invention) The inspection system and the package holder of the present invention are provided with a means for performing inspection, and the means for abutting and locating the probe single tray and the probe unit are In addition, the third and a of the sealing member to be inspected are held in contact with the electrode of the agricultural product of the tray, and the contact between the 5-touch probe and the sealing member of the inspection object is completed, thereby achieving a simple configuration and shortening The time required for the inspection of the inspection object that is not cut off. [Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Further, the present invention is not limited to the following embodiments. In addition, in the following description, each of the drawings referred to by 323813 7 201237440 is only sufficient to obtain the understanding of the present invention, and the shape, the size, and the position are roughly displayed, and the size, the size, and the Position = Ming (Embodiment) ^ Fig. 1 is a perspective view showing the configuration of the inspection system according to the first embodiment. Fig. 4 is an exploded perspective view showing the inspection system of the first embodiment. The inspection shown in FIGS. i and 2 is a device used for performing electrical inspection of the semiconductor package 2Q belonging to the inspection (four) image, and is for outputting the semiconductor package 2g to the conductor package 20. Check the device connected with the signal. The electrical inspection system 1 between the circuit boards is provided with a tray 10 having a substantially disk shape, a substantially circular disk, and a cover needle unit 4; the tray == half-package (4); the cover 3G is (4) = at least one of the semiconductor package 20 is held: the electrical connection between the conductor package 20 and the circuit substrate: the needle early tray 0' is a perspective view as shown in Fig. 3, which is formed on the tray The holding hole u of the semiconductor material 2Q is held. Needle 2 insertion = Yes: Supply: Key Each of the holding holes 11 is formed at least two. Insert this plug: When the two sides of the Kongshan system are formed into two, they are formed at positions corresponding to the two sides of the retaining hole U. In addition, the tray 1 (the half of the conductor package 20 is formed by the material of the connection. Further, by using the month b enough to correspond to the inspection temperature, it is the same as or similar to the semiconductor package linear expansion system 323813 8 201237440 The material can be correctly positioned even when the semiconductor package of the inspection object is inflated. The semiconductor package 20 is a BGA (Ball Gate Array Package, Ball Grid ο
Array)，如第4圖所示的立體圖，作為電極的焊球21係 配設在面20a且形成大略矩形。 蓋體30係形成與托盤10大略等同的外緣形狀來覆蓋 托盤10，如於第5圖所示的立體圖，具有對應保持孔11 所設置之呈圓形的開口部31。開口部31係為稍微小於半 導體封裝件20之對角長度之直徑的圓形。蓋體30固定在 托盤10時，即使托盤10上下反轉時，開口部31亦抵接在 半導體封裝件20的端部，即能夠防止半導體封裝件20從 保持孔11a的脫離。另外，托盤10與蓋體30係藉由螺絲 固定或嵌合等被固定。此外，蓋體30係在面30a側與探針 單元40接觸。 探針單元40係具有導電性之接觸探針50 (以下簡稱 「探針50」）、以及作為保持部之探針保持具41 ;該接觸 探針50係接觸於屬於相異兩個之被接觸體的半導體封裝 件20及電路基板；而該探針保持具41係根據預定樣式收 容並保持複數個探針50。此外，在本第一實施形態中，係 以能夠與4個半導體封裝件同時地接觸的探針單元為例進 行說明。 探針保持具41係將位於第6圖之下面側的第1構件 41a與位於上面側的第2構件41b積層而成者。在第1構 件41a及第2構件41b，分別各形成同數之用以收容複數 9 323813 201237440 個探針5G的第i保持孔42a及第2保持孔伽（保持孔 42)，收容探針5〇的第丨保持孔仏及第2保持孔伽， 係以互相之軸線-致的方式形成。此外，探針保持具Ο 係具有朝與蓋體30相對向側之面4〇a突出而設置且形成 插入於托盤H)的插通孔lla的前端呈尖細形狀之銷針 43。另外，第6圖係顯示使於第1圖、第2⑽示之探針 單元40反轉的立體圖。 另外，在與探針單元40之蓋體3〇接觸侧之面他， 能夠插人於蓋體3G之開之呈圓柱狀的突出 二：而探針50的配置’則以與半導體封裝件 ==方式來配設保持孔42。此外，突出部她係 ，對應開口部31的配置而形成複數個。 保=42係以第i保持孔42a與第2保持孔4 Γ第魏方㈣成_麵_梯孔形狀。亦 即第1保持孔42a係由小直徑部42c、以及大直框 所構成，該小直徑部42c係在探針保持具Ο的上 開I ;而大直徑部復係其直徑大於前述的小直徑部42c。 另方面，第2保持孔42b係由小直徑部42e、以及大直 徑部42f所構成；該小直徑部42e係在探針保持具41的下 端面具有開σ ;而大直徑部42f係其直徑大於前述的小直 控部42e。該等第1保持孔42a及第2保持孔42b的形狀， 係因應收容探針50的構成所決定。藉此，具有因此探針 50從探針保持具41脫落之功能。 於第7圖所示的探針50係採用導電性材料所形成， 323813 10 201237440 具備有第1柱塞（Plunger) 51、第2柱塞52、以及彈簧 構件53;該第1柱塞51係與電路基板側之電極進行接觸； 該第2柱塞52係在進行半導體封裝件20之檢查時與焊球 21進行接觸；而該彈簧構件53係設置在第1柱塞51與第 2柱搴52之間，將兩者的第1柱塞51及第2柱塞52伸縮 自如地進行連結。構成探針50的第1柱塞51與第2柱塞 52以及彈簧構件53係具有同一個軸線。 第1柱塞51係具有前端部51a、凸緣部51b、以及基 端部51c ;該前端部51a係形成與電路基板側之電極進行 接觸的前端呈尖細形狀；該凸緣部51b係具有其直徑相較 於前端部51a的直徑大；而該基端部51c係經由凸緣部51b 朝與前端部51a相反之側延伸，且其直徑相較於凸緣部51b 小，而壓入有彈簧構件5 3的端部。 第2柱塞52係具有前端部52a、凸緣部52b、以及基 端部52c ;該前端部52a係具有形成前端呈尖細形狀的複 數個爪部；該凸緣部52b係其直徑相較於前端部52a的直 徑大；而該基端部52c係與凸緣部52b的前端部52a相對 向而設置，且其直徑相較於凸緣部52b小，而壓入有彈簧 構件53的端部。 彈簧構件53係第1柱塞51側為密捲繞部53a，另一 方面，第2柱塞52側為疏捲繞部53b。密捲繞部53a的端 部係壓入於基端部51c，而抵接於凸緣部51b。另一方面， 疏捲繞部53b的端部係壓入於基端部52c，而抵接於凸緣 部52b。另外，彈簧構件53係朝與半導體封裝件20的連 11 323813 201237440 接方向彈性變形。 在半導體封裝件20的檢查時，藉由來自半導體封裝 件20的接觸射，彈螢構件53係成為沿著長邊方向被壓 縮的狀L w彈簧構件53被壓縮時，密捲繞部⑽則與第 2柱塞52的基端部52d進行接觸。藉此，獲得確實的電氣 導通。 接著針對銷針43的構成及藉由銷針43的半導體封 裝件20之定位，參照第8圖、第9圖進行說明。銷針43 係保持於形成純㈣持具41的第丨鋪孔…、第2保 持孔41d内。銷針43係具有前端部43&、凸緣部咖、以 及凸座部43c;該前端部咖係形成大略柱狀，且前端呈 災細形狀；該凸緣部43b係連結於與前端部咖側相異之 端部^其直徑大於前端部43a的最大直徑；座 43C係連結於與凸緣部43b之前端部他的連 端部側’且直徑小於凸緣部43b。 w日兴< 此外，第1保持孔41q直徑係小 的直徑。在形成有第1保持孔4】Μ 保待孔41d 描妒狀抵接凸绫邱4U益l C '、第2保持孔41d的階 梯綠抵接HM3b，#此防切針 脫離。除此之外，銷針43係對於一 *、 木十保持具41 41d的底面之線圈狀的彈簧構件，被固^在第2保持孔 銷針㈣形成朝插人孔藉此， 立未在鎖針43設置凸座部43=^t進退自如。另外， 第2保持孔剔底面之間配設彈脊構：^ 進行半導體封裝件2G的定位之時，首先，當使探針 323813Array), as shown in the perspective view of Fig. 4, the solder balls 21 as electrodes are disposed on the surface 20a and formed into a substantially rectangular shape. The lid body 30 is formed to have an outer edge shape which is substantially equivalent to the tray 10 to cover the tray 10. As shown in Fig. 5, the lid body 30 has a circular opening portion 31 corresponding to the holding hole 11. The opening portion 31 is a circle which is slightly smaller than the diameter of the diagonal length of the semiconductor package 20. When the lid body 30 is fixed to the tray 10, even when the tray 10 is vertically inverted, the opening portion 31 abuts against the end portion of the semiconductor package 20, that is, the detachment of the semiconductor package 20 from the holding hole 11a can be prevented. Further, the tray 10 and the lid body 30 are fixed by screwing or fitting. Further, the cover 30 is in contact with the probe unit 40 on the side of the face 30a. The probe unit 40 is a conductive contact probe 50 (hereinafter referred to as "probe 50"), and a probe holder 41 as a holding portion; the contact probe 50 is in contact with two different ones. The semiconductor package 20 and the circuit substrate; and the probe holder 41 accommodates and holds a plurality of probes 50 according to a predetermined pattern. Further, in the first embodiment, a probe unit capable of simultaneously contacting four semiconductor packages will be described as an example. The probe holder 41 is formed by laminating a first member 41a located on the lower side of Fig. 6 and a second member 41b located on the upper side. Each of the first member 41a and the second member 41b is formed with the same number of ith holding holes 42a and second holding holes 380 (holding holes 42) for accommodating a plurality of 9 323813 201237440 probes 5G, and the probe 5 is housed. The third aperture of the crucible and the second retention aperture are formed in a mutually axial manner. Further, the probe holder has a pin 43 which is provided to protrude toward the surface 4〇a facing the cover 30 and has a tip end shape which is inserted into the insertion hole 11a of the tray H). In addition, Fig. 6 is a perspective view showing the probe unit 40 shown in Fig. 1 and Fig. 2(10) inverted. Further, on the side in contact with the cover 3 of the probe unit 40, it can be inserted into the cylindrical projection 2 of the cover 3G: and the configuration of the probe 50 is used with the semiconductor package = The retaining hole 42 is provided in the manner of =. Further, the projections are formed in plurality, corresponding to the arrangement of the openings 31. The seal = 42 is formed in the i-th holding hole 42a and the second holding hole 4, and the fourth side (four) is in the shape of a face-to-ladder. That is, the first holding hole 42a is composed of a small diameter portion 42c and a large straight frame which is opened on the probe holder ;; and the large diameter portion is larger than the aforementioned small diameter. Diameter portion 42c. On the other hand, the second holding hole 42b is composed of the small diameter portion 42e and the large diameter portion 42f; the small diameter portion 42e has an opening σ at the lower end surface of the probe holder 41; and the large diameter portion 42f is the diameter thereof. It is larger than the aforementioned small straight control portion 42e. The shape of the first holding hole 42a and the second holding hole 42b is determined by the configuration of the housing probe 50. Thereby, there is a function that the probe 50 is detached from the probe holder 41. The probe 50 shown in FIG. 7 is formed of a conductive material, and 323813 10 201237440 includes a first plunger (Plunger) 51, a second plunger 52, and a spring member 53. The first plunger 51 is provided. The electrode is in contact with the electrode on the circuit board side; the second plunger 52 is in contact with the solder ball 21 when the semiconductor package 20 is inspected; and the spring member 53 is provided on the first plunger 51 and the second column Between the 52, the first plunger 51 and the second plunger 52 of both of them are connected to each other in a stretchable manner. The first plunger 51 constituting the probe 50 has the same axis as the second plunger 52 and the spring member 53. The first plunger 51 has a distal end portion 51a, a flange portion 51b, and a proximal end portion 51c. The distal end portion 51a has a tapered shape formed in contact with an electrode on the circuit board side; the flange portion 51b has a tapered shape The diameter is larger than the diameter of the front end portion 51a; and the base end portion 51c extends toward the side opposite to the front end portion 51a via the flange portion 51b, and has a smaller diameter than the flange portion 51b, and is pressed in The end of the spring member 53. The second plunger 52 has a distal end portion 52a, a flange portion 52b, and a proximal end portion 52c. The distal end portion 52a has a plurality of claw portions having a tapered shape at the distal end thereof; the flange portion 52b has a diameter The front end portion 52a has a large diameter; and the base end portion 52c is provided to face the front end portion 52a of the flange portion 52b, and has a diameter smaller than that of the flange portion 52b, and the end of the spring member 53 is press-fitted. unit. In the spring member 53, the first plunger 51 side is a tightly wound portion 53a, and on the other hand, the second plunger 52 side is a sparsely wound portion 53b. The end portion of the densely wound portion 53a is press-fitted to the proximal end portion 51c to abut against the flange portion 51b. On the other hand, the end portion of the unwinding portion 53b is press-fitted to the base end portion 52c to abut against the flange portion 52b. Further, the spring member 53 is elastically deformed in the direction of connection with the semiconductor package 20 11 323813 201237440. At the time of inspection of the semiconductor package 20, when the projection member 16 is brought into contact with the semiconductor package 20, the flare member 53 is compressed in the longitudinal direction, and the Lw spring member 53 is compressed, and the dense winding portion (10) is used. Contact is made with the proximal end portion 52d of the second plunger 52. Thereby, a reliable electrical conduction is obtained. Next, the configuration of the pin 43 and the positioning of the semiconductor package 20 by the pin 43 will be described with reference to Figs. 8 and 9 . The pin 43 is held in the second ply hole ... and the second holding hole 41d which form the pure (four) holder 41. The pin 43 has a front end portion 43&, a flange portion, and a boss portion 43c; the front end portion is formed in a substantially columnar shape, and the front end has a sinuous shape; the flange portion 43b is coupled to the front end portion The side end portion has a diameter larger than the maximum diameter of the front end portion 43a; the seat 43C is coupled to the end portion side of the front end portion of the flange portion 43b and has a smaller diameter than the flange portion 43b. w Nikko < In addition, the first holding hole 41q has a small diameter. The first holding hole 4 is formed. The protective hole 41d is in contact with the projection 4i, and the second holding hole 41d is abutted against the HM3b, and the anti-cutting needle is disengaged. In addition, the pin 43 is a coil-shaped spring member for the bottom surface of a *, wood ten holder 41 41d, and is fixed to the second holding hole pin (4) to form a insertion hole, thereby not standing The lock pin 43 is provided with a boss portion 43=^t to advance and retreat freely. In addition, the second holding hole is provided with a ridge structure between the bottom surfaces: ^ When positioning the semiconductor package 2G, first, when the probe 323813 is made
S 12 201237440 單元40之面40a侧接近於蓋體3〇時，銷針43沿著托盤 10之插入孔11a的壁面—邊被導引一邊進行插入（參照第 8圖）。此時’銷針43之側面與半導體封裝件2〇的端部 接觸，且對半導體封裝件2〇施加力量。藉由該力 量，使半 導體封裝件20朝與保持孔丨丨之插入孔ila相對向的壁面 側移動。此外’銷針43因為如於第6圖所示，對應於在矩 形的外緣（4邊）中相鄰之2邊所設置的插入孔1 ia而被 設置’因此使半導體封裝件2〇朝保持孔11的4角落 (corner)中之1角落移動。 當蓋體30與探針單元4〇接觸，且半導體封裝件20 碰到了保持孔11之4個壁面中之相鄰兩個壁面時，則半導 體封嚷件20相對於保持孔丨丨的定位結束。同時，探針50 的前端部52a與半導體封裝件2〇的焊球21接觸（參照第 9圖）。此時’第7圖所示的前端部513因為與未圖示的 電路基板連接，故半導體封裝件2〇與電路基板被電性連 接。 根據前述的本第一實施形態，因為在探針單元侧設置 複數個進行半導體封裝件之定位的銷針、以及在保持半導 體封裝件的托盤設置複數個可供銷針插入的插入孔，且使 托盤與探針單元抵接，藉此同時地進行托盤上之複數個半 導體封裝件的定位、以及與半導體封裝件之電極的接觸， 因此以簡易的構成’能夠正確地進行被個片切斷之檢查對 象的檢查，並且能夠縮短對被個片切斷之檢查對象之檢查 所需的時間。 13 323813 201237440 除此之外，因為設置具有能夠與半導體封裝件之一部 份抵接之開口部的蓋體，即使托盤旋轉時亦藉由蓋體來保 持半導體縣件的上面，目而能確保半導體封裝件之搬送 的穩定性。再者，藉由對於收容晶圓（wafer )的匣盒 (cassette)調節托盤的大小，即可應用於晶圓的檢查裝 置。 一 此外，本第一實施形態的構成，因僅在探針單元側設 置定位用之銷針’ ^在托盤侧設置供銷針插人的插入孔即 可’故以簡易的構成來實現正確的檢查及檢查時間的縮 紐，並且對於現行的托盤僅配設插入孔即能夠對應。 此外，銷針43可藉由金屬所形成，亦可藉由樹脂所 形成，亦可對於以金屬所.形成的基材覆蓋樹脂。銷針“ 係為能夠藉由半導―件之材質等所設計。 另外，使用的半導體封裝件係除了前述BGA之外，亦 能夠適用於PGA (腳位陣列，Pin Grid Array)等。 此外，探針亦可為如第丨〇圖所示之彈簧探針 (P0G0-pln)54。第 1〇 圖所示的彈簧探針（p〇G〇_pin)54， 係在兩端具有騎在保持孔之—方端部㈣舰1形狀的 探針保持具41c且可朝一方的長邊方向進退的前端部 54a 54b。刖端部54a、54b係分別與電路基板及半導體封 裝件接觸’藉此使f路基板與半導義裝狀間電性導通。 (第一實施形態） 第11圖係為顯示本第二實施形態的檢查系統之構成 的立體圖。第12圖係為顯示本第二實施形態的檢查系統之 323813 14 201237440 構成的分解立體圖。在第11圖、第12圖所示的檢查系統 2 ’係為在進行屬於檢查對象之半導體封裝件7〇的電氣特 性檢查時所使用的裝置，且為用以將半導體封裝件70與對 半導體封裝件70輸出檢查用信號之電路基板之間予以電 性連接的裝置。 檢查系統2係為具備有托盤6〇、蓋體80、以及探針 單元90 ;該托盤60係形成保持呈大略矩形的半導體封裝 件70的大略圓盤狀；該蓋體8〇係形成能夠與托盤6〇所保 持之半導體封裝件7〇的一部份主面抵接的大略圓盤狀；而 該探針單元90係使半導體封裝件7〇與電路基板之間電性 連接。 托盤60係如第13圖所示的立體圖，具有形成在托盤 60的主面60a且能夠保持半導體封裝件70的保持孔61。 此外，保持孔61係如第14圖所示的剖面圖，具有第1保 持孔61a、以及第2保持孔61b;該第1保持孔61a係具有 保持半導體封裝件7〇之大略矩形的開口；而第2保持孔 61b係與第1保持孔6ia的開口面連通而設置，且具有比 第1保持孔61a大之大略矩形的開口。第丨保持孔61a及 第2保持孔6ib的配設高度，係與後述半導體封裝件7〇 之引線71的突出高度及前端部的高度相對應。 半導體封裝件70係為形成矩形形狀的qFP(四方封 裝，Quad Flat Package)，如第15圖所示的立體圖所示， 屬於電極之引線71係從相對於主面7〇a正交之面突出而配 设。此外，引線71係從相對於主面7〇a正交之面突出，且 323813 15 201237440 以使前端部的高度（延伸高度）成為與半導體封裝件70 之上面同等高度之方式形成彎曲形狀。 蓋體80係形成與托盤60大略等同的外緣形狀來覆蓋 托盤60，如第16圖所示的立體圖，具有與保持孔61相對 應所設置的開口部81。開口部81係具有第1開口部81a、 以及4個第2開口部81b ;該第1開口部81a係形成直徑 小於半導體封裝件70之主面70a的圓形；而該第2開口部 81b係與保持孔61之外緣的形狀相對應所形成。當蓋體80 固定於托盤60時，即使托盤60反轉時，開口部81亦抵接 在半導體封裝件70的端部，即能夠防止半導體封裝件70 從保持孔61的脫離。另外，蓋體80係在面80a側與探針 單元90接觸。此外，托盤60與蓋體80係藉由螺絲固定或 嵌合等被固定。 探針單元90係具有導電性之接觸探針100 (以下簡稱 「探針100」）、以及作為保持部之探針保持具91 ;該接 觸探針100係接觸於屬於相異之兩個被接觸體的半導體封 裝件70及電路基板；而該探針保持具91係根據預定樣式 收容並保持複數個探針100。探針保持具91係如第17圖、 第18圖所示，在面90a上，形成有與各半導體封裝件70 之引線71及蓋體80之第2開口部81b相對應所設置的突 出部90b。在突出部90b之與面90a平行之面，形成有保 持接觸探針100的保持孔92。在面90a中，4個突出部90b 係形成與一個半導體封裝件70相對應的矩形形狀。 探針保持具91係將位於第17圖之下面側的第1構件 16 323813S 12 201237440 When the surface 40a side of the unit 40 is close to the lid body 3, the pin 43 is inserted while being guided along the wall surface of the insertion hole 11a of the tray 10 (refer to Fig. 8). At this time, the side of the pin 43 is in contact with the end of the semiconductor package 2A, and a force is applied to the semiconductor package 2A. By this force, the semiconductor package 20 is moved toward the wall side opposite to the insertion hole ila of the holding hole. Further, the pin pin 43 is provided corresponding to the insertion hole 1 ia provided on the adjacent two sides of the rectangular outer edge (4 sides) as shown in Fig. 6 so that the semiconductor package 2 is turned toward One of the four corners of the holding hole 11 is moved. When the cover 30 is in contact with the probe unit 4, and the semiconductor package 20 hits the adjacent two wall faces of the four walls of the holding hole 11, the positioning of the semiconductor package 20 with respect to the holding hole ends. . At the same time, the front end portion 52a of the probe 50 is in contact with the solder ball 21 of the semiconductor package 2A (refer to Fig. 9). At this time, the front end portion 513 shown in Fig. 7 is connected to a circuit board (not shown), so that the semiconductor package 2 is electrically connected to the circuit board. According to the first embodiment described above, since a plurality of pins for positioning the semiconductor package are provided on the probe unit side, and a plurality of insertion holes for inserting the pins are provided in the tray holding the semiconductor package, and the tray is provided By abutting against the probe unit, the positioning of the plurality of semiconductor packages on the tray and the contact with the electrodes of the semiconductor package are simultaneously performed, so that the inspection can be performed correctly by the simple configuration The inspection of the object and the time required for the inspection of the inspection object cut by the piece can be shortened. 13 323813 201237440 In addition, since a cover having an opening portion that can abut against a part of the semiconductor package is provided, it is ensured that the upper surface of the semiconductor article is held by the cover even when the tray is rotated. The stability of the transfer of the semiconductor package. Further, the wafer inspection device can be applied by adjusting the size of the tray for a cassette containing a wafer. In addition, in the configuration of the first embodiment, since the pin for positioning is provided only on the side of the probe unit, and the insertion hole for inserting the pin is provided on the side of the tray, the correct inspection can be realized with a simple configuration. And the retraction of the inspection time, and it is possible to match only the insertion hole for the current tray. Further, the pin 43 may be formed of a metal, may be formed of a resin, or may be covered with a base material formed of a metal. The pin is designed to be made of a semi-conductive material, etc. Further, the semiconductor package used can be applied to a PGA (Pin Grid Array) or the like in addition to the BGA described above. The probe can also be a spring probe (P0G0-pln) 54 as shown in Fig. 1. The spring probe (p〇G〇_pin) 54 shown in Fig. 1 has a ride at both ends. The front end portion 54a 54b of the probe holder 41c in the shape of the ship 1 is held in the longitudinal direction of the one end of the ship. The end portions 54a and 54b are respectively in contact with the circuit board and the semiconductor package. This is to electrically connect the f-channel substrate to the semiconductor package. (First embodiment) FIG. 11 is a perspective view showing a configuration of an inspection system according to the second embodiment. FIG. 12 is a second display. An exploded perspective view of the configuration of the inspection system of the embodiment 323813 14 201237440. The inspection system 2' shown in Figs. 11 and 12 is used for the inspection of the electrical characteristics of the semiconductor package 7〇 to be inspected. Device, and to use the semiconductor package 70 and the opposite half The conductor package 70 is electrically connected to the circuit board for outputting the inspection signal. The inspection system 2 is provided with a tray 6 〇, a cover 80, and a probe unit 90; the tray 60 is formed to be kept substantially rectangular The semiconductor package 70 has a substantially disk shape; the cover 8 is formed into a substantially disk shape capable of abutting a part of the main surface of the semiconductor package 7A held by the tray 6〇; and the probe unit The 90 series electrically connects the semiconductor package 7A to the circuit board. The tray 60 is a perspective view as shown in Fig. 13, and has a holding hole 61 formed in the main surface 60a of the tray 60 and capable of holding the semiconductor package 70. Further, the holding hole 61 has a first holding hole 61a and a second holding hole 61b as shown in Fig. 14, and the first holding hole 61a has an opening having a substantially rectangular shape for holding the semiconductor package 7? The second holding hole 61b is provided to communicate with the opening surface of the first holding hole 6ia, and has a substantially rectangular opening larger than the first holding hole 61a. The height of the second holding hole 61a and the second holding hole 6ib is disposed. And the semiconductor package 7 described later The protruding height of the lead wire 71 corresponds to the height of the front end portion. The semiconductor package 70 is a qFP (Quad Flat Package) which is formed in a rectangular shape, as shown in the perspective view shown in Fig. 15, which belongs to the lead wire 71 of the electrode. It is disposed so as to protrude from a surface orthogonal to the main surface 7〇a. Further, the lead wire 71 protrudes from a surface orthogonal to the main surface 7〇a, and 323813 15 201237440 such that the height of the front end portion (extension height) The curved shape is formed to be equal to the height of the upper surface of the semiconductor package 70. The lid body 80 is formed to have an outer edge shape substantially equivalent to the tray 60 to cover the tray 60, and a perspective view as shown in Fig. 16 has an opening portion 81 provided corresponding to the holding hole 61. The opening 81 has a first opening 81a and four second openings 81b. The first opening 81a has a circular shape with a diameter smaller than the main surface 70a of the semiconductor package 70. The second opening 81b is formed. It is formed corresponding to the shape of the outer edge of the holding hole 61. When the lid body 80 is fixed to the tray 60, even when the tray 60 is reversed, the opening portion 81 abuts against the end portion of the semiconductor package 70, that is, the detachment of the semiconductor package 70 from the holding hole 61 can be prevented. Further, the lid body 80 is in contact with the probe unit 90 on the side of the surface 80a. Further, the tray 60 and the lid 80 are fixed by screwing or fitting. The probe unit 90 is a conductive contact probe 100 (hereinafter referred to as "probe 100"), and a probe holder 91 as a holding portion; the contact probe 100 is in contact with two different ones that are in contact with each other. The semiconductor package 70 and the circuit substrate; and the probe holder 91 accommodates and holds the plurality of probes 100 according to a predetermined pattern. As shown in FIGS. 17 and 18, the probe holder 91 is formed with a projection provided on the surface 90a corresponding to the lead 71 of each semiconductor package 70 and the second opening 81b of the lid 80. 90b. A holding hole 92 for holding the contact probe 100 is formed on a surface of the protruding portion 90b that is parallel to the surface 90a. In the face 90a, the four projections 90b are formed in a rectangular shape corresponding to one semiconductor package 70. The probe holder 91 is a first member that will be located on the lower side of Fig. 17 323813
S 201237440 ⑽與位於上面側的第2構件91b積屬而成者。在第1構 件91a及第2構件91b’分別各形成相同數量之用以收容 複數個!木針1GG的第1保持孔92a及第2保持孔⑽（保 持孔92)，收谷探針1〇〇的第丨保持孔及第2保持孔 92b:係以互相之軸線一致的方式形成。此外，探針保持具 91係具有板片彈簧93;該板片彈簧93係設置於與蓋體8〇 相對向側的面90a，而作為能夠抵接於半導體封裝件7〇的 主面的定位手段。另外，第17圖係顯示使第11圖、第12 圖所示之探針單元90反轉的立體圖。 另外，在探針單元90之與蓋體8〇接觸侧之面9〇a， 形成有旎夠插入於蓋體80之第2開口部8ib之呈圓柱狀的 突出部90b，且以與一個半導體封裝件7〇之引線71的配 設樣式相同配置之方式來配設保持孔92。此外，突出部9〇b 係在探針單元的面90a，對應第2開口部81b的配置而形 成有複數個。 保持孔92係如第19圖所示之部份剖面圖，以第1保 持孔92a與第2保持孔92b所構成，同時沿著貫通方向形 成直徑相異的階梯孔形狀。亦即，第i保持孔92a係由小 直徑部92c、以及大直徑部92d所構成；該小直徑部92c 係在探針保持具91的上端面具有開口；而大直徑部92d 係其直徑比前述的小直徑部92c大。另一方面，第2保持 孔92b係由小直徑部92e、以及大直徑部92f所構成；該 小直徑部42e係在探針保持具91的下端面具有開口；而大 直徑部92f係其直徑比前述的小直徑部92e大❶該等第1 17 323813 201237440 保持孔92a及第2保持孔92b的形狀，係因應要收容之探 針100的構成所決定。藉此，具有防止探針100從探針保 持具91脫落之功能。 板片彈簣93係藉由螺絲93a固定於面90a，且以從面 90a往傾斜方向立起之方式延伸。此外，板片彈簧93係如 第17圖、第18圖所示，至少對於第2構件91b藉由螺絲 93a固定。板片彈簧93係如第18圖所示，以朝向在形成 突出部90b之外緣（4邊）中任何一角落（頂點）延伸之 方式設置，使半導體封裝件7 0朝向第1保持孔61 a之4 角落中的1角落移動。另外，板片彈簧93亦可以金屬所形 成，亦可以樹脂所形成，亦可以樹脂覆蓋金屬基材的表面。 此外，板片彈簧93其至少與半導體封裝件70接觸之部份， 具有高摩擦力者為佳。 第19圖所示的探針100係採用導電性材料所形成， 具備有第1柱塞101、第2柱塞102、以及彈簧構件103 ; 該第1柱塞101係具有與第7圖所示之第1柱塞51同樣的 構成；該第2柱塞52係在進行半導體積體電路70之檢查 時與引線71接觸；而該彈簧構件103係設置在第1柱塞 101與第2柱塞102之間，且將兩者的第1柱塞101及第2 柱塞102伸縮自如地進行連結。構成探針100的第1柱塞 101及第2柱塞102，以及彈簧構件103係具有同一個軸 線。第1柱塞101係與第7圖所示之前端部51a、凸緣部 51、以及基端部51c同樣，具有前端部101a、凸緣部101b、 以及基端部101c。 18 323813 g 201237440 第2柱塞102係具有前端部i〇2a、凸緣部102b、以 及基端部102c;該前端部1〇2a係形成與引線71接觸之前 端呈尖細形狀；該凸緣部1〇2b係其直徑比前端部52a的直 徑大；而該基端部l〇2c係與凸緣部102b的前端部102a 相對向而設置’且直徑比凸緣部1〇2b小，而壓入有彈簧構 件103的端部。 彈簧構件103係第1柱塞ι〇1側為密捲繞部l〇3a，另 一方面’第2柱塞1〇2側為疏捲繞部1〇3b。密捲繞部103a 的端部係壓入於基端部l〇lc，而抵接於凸緣部1〇lb。另一 方面’疏捲繞部l〇3b的端部係壓入於基端部i〇2c，而抵 接於凸緣部102b。另外’彈簧構件103係朝與半導體封裝 件70的連接方向彈性變形。 在半導體封裴件70的檢查時，藉由來自半導體封裝 件70的接觸荷重，彈簧構件ι〇3係成為沿著長邊方向被壓 縮的狀態。當彈簧構件103被壓縮時，密捲繞部103a則與 第2柱塞1〇2的基端部1〇2d接觸。 接著’針對藉由板片彈簧93的半導體封裝件7〇之定 位’參照第20圖、第21圖進行說明。首先，當使探針單 几90之面90a侧接近於蓋體80時，板片彈簧93會與半導 體封裝件70接觸，而對半導體封裝件70施加力量，藉此 使半導體封裝件70朝板片彈簧93的延伸方向（第20圖之 右方向）移動《此時，板片彈簧93係與半導體封裝件70 的主面70a接觸並使半導體封裝件7〇移動。藉前述之力 量’半導體封裴件70係朝第1保持孔61a與第2保持孔 19 323813 201237440 61b的父界壁面側移動。 當蓋體80與探針單元90接觸，且半導體封裝件70 碰到了保持孔61之4個壁面中之相鄰兩個壁面時，則半導 體封裝件7 0相對於保持孔61的定位即完成。同時地，探 針100的前端部102a與半導體封裝件70的引線71接觸（參 照第21圖）。此時’第19圖所示的前端部101a，因為與 未圖示的電路基板連接，故半導體封裝件70與電路基板被 電性連接。 根據前述的本第二實施形態，即使採用QFP作為半導 體封裝件時，亦與第一實施形態同樣地，在探針單元側複 數設置用來進行半導體封裝件之定位的銷針、以及可供銷 針插入至保持半導體封裝件托盤的複數個插入孔，且使托 盤與探針早元抵接’而同時地進行托盤上之複數個半導體 封裝件的定位、以及與半導體封裝件之電極的接觸，故以 簡易的構成，能夠正確地進行被個片切斷之檢查對象的檢 查，並且能夠縮短對被個片切斷之檢查對象之檢查所需的 時間。 、 另外，即使在本第二實施形態的檢查系統中，亦可採 用前述第一實施形態之檢查系統的銷針來進行定位。木 的銷針較佳為在可抵接於各半導體封裝件7 〇之4角落丨中時 2個以上角落的位置配置銷針，而使半導體封裝件之 剩之角落側移動而進行定位。如在能夠抵接於半導體斤 件70的3角落的位置配置銷針則更為理想。 封裴 此外，藉由調整蓋體80的第2開口部81b及浐針时 323813 名 20 201237440 70 90的突出部90b的配置及高度，亦能適用於QFN (四方 扁平.、.、弓丨卿封裝，Quad Flat Non-leaded Package)或 S〇P (小外形封裂，Small Outline Package)。 此外 雖以對 在前述第一、第二形態中的探針單元早_ 應於4個半導體封料者進行說明，惟若能夠與兩個以上 之半導體封裝件接觸者即可，與托盤對應而能夠同時地接 觸全部的半_崎件者亦可。 (產業上之可利用性） 、如以上所述’本發明之檢查系統及封裝件保持具係為 以簡易的構成’連接被個片切斷之複數個電氣電路基板間 等’於進行電科通之情料為有用者。 【圖式簡單說明】 第1圖係為顯示本發明第-實施形態的檢查系統之構 成的立體圖。 » 2圖係為顯示本發明第一實施形態的檢查系統之構 成的分解立體圖。 第3圖係為顯示於第1圖、第2圖所示之檢查系統之 基本部分之構成的立體圖。 f 4 ®係為_示於第1圖、第2圖所示之檢查系統之 基本部分之構成的立體圖。 第5圖係為顯示於第1圖、第2圖所示之檢查系統之 基本部分之構成的立體圖。 第6圖係為_示於第1圖、第2圖所示之檢查系統之 基本部分之構成的立體圖。 21 323813 201237440 第7圖係為顯示本發明第一實施形態的檢查系統之基 本部分之構成的部份剖面圖。 第8圖係為顯示本發明第一實施形態的檢查系統之基 本部分之構成的剖面圖。 第9.圖係為顯示本發明第一實施形態的檢查系統之基 本部分之構成的剖面圖。 第10圖係為顯示本發明第—實施形態的檢查系統之 基本部分其他構成的部份剖面圖。 第U圖係為顯示本發明第二實施形態的檢查系統之 構成的立體圖。 第12圖係為顯示本發明第二實施形態的檢查系統4 構成的分解立體圖。 站夕圖係為顯示於第11圖、帛12圖所示之檢查月 、、’ 要部分之構成的立體圖。 Z圖係為顯示於第11圖、第12圖所示之檢查; 、 要。卩分之構成的剖面圖。 =5圖係為顯示於第u圖、帛12圖所示之檢查考 、、充之主要部分之構成的立體圖。 統二==於第^圖、第12圖所示之檢查' 丨刀之構成的立體圖。 统之ΪΓα圖係為顯示於第11圖、帛12圖所示之檢查系 、、先之主要料之構朗立體圖。 統之:二圖=7於第U圖、第12圖所示之㈣ [刀之構成的立體圖。 323813S 201237440 (10) is a member of the second member 91b located on the upper side. Each of the first member 91a and the second member 91b' is formed with the same number of first holding holes 92a and second holding holes (10) (holding holes 92) for accommodating a plurality of wood needles 1GG, and the receiving probe 1〇 The second holding hole and the second holding hole 92b of the crucible are formed so as to coincide with each other. Further, the probe holder 91 has a leaf spring 93; the leaf spring 93 is provided on a surface 90a facing the cover 8A, and serves as a positioning capable of abutting against the main surface of the semiconductor package 7A. means. In addition, Fig. 17 is a perspective view showing the reverse of the probe unit 90 shown in Figs. 11 and 12 . Further, on the surface 9〇a of the probe unit 90 on the side in contact with the lid body 8〇, a cylindrical projection portion 90b which is inserted into the second opening portion 8ib of the lid body 80 is formed, and is combined with a semiconductor. The holding holes 92 are disposed in such a manner that the lead wires 71 of the package 7 are arranged in the same manner. Further, the protruding portion 9〇b is attached to the surface 90a of the probe unit, and a plurality of the projections are formed corresponding to the arrangement of the second opening 81b. The holding hole 92 is a partial cross-sectional view as shown in Fig. 19, and is constituted by the first holding hole 92a and the second holding hole 92b, and forms a stepped hole shape having a different diameter along the through direction. That is, the i-th holding hole 92a is constituted by the small diameter portion 92c and the large diameter portion 92d; the small diameter portion 92c has an opening at the upper end surface of the probe holder 91; and the large diameter portion 92d is the diameter ratio thereof. The aforementioned small diameter portion 92c is large. On the other hand, the second holding hole 92b is composed of a small diameter portion 92e and a large diameter portion 92f; the small diameter portion 42e has an opening at the lower end surface of the probe holder 91; and the large diameter portion 92f has a diameter The shape of the holding hole 92a and the second holding hole 92b of the first 17 323813 201237440 is larger than the above-described small diameter portion 92e, and is determined by the configuration of the probe 100 to be accommodated. Thereby, it has a function of preventing the probe 100 from coming off the probe holder 91. The plate magazine 93 is fixed to the surface 90a by a screw 93a, and extends so as to stand up from the surface 90a in an oblique direction. Further, as shown in Figs. 17 and 18, the leaf spring 93 is fixed to at least the second member 91b by a screw 93a. The leaf spring 93 is disposed so as to extend toward any one of the outer edges (four sides) of the protruding portion 90b as shown in FIG. 18, so that the semiconductor package 70 faces the first holding hole 61. A corner of a 4 corner moves. Further, the leaf spring 93 may be formed of a metal or a resin, or may be coated with a resin to cover the surface of the metal substrate. Further, it is preferable that the leaf spring 93 has at least a portion in contact with the semiconductor package 70 and has high friction. The probe 100 shown in Fig. 19 is formed of a conductive material, and includes a first plunger 101, a second plunger 102, and a spring member 103. The first plunger 101 has the same structure as shown in Fig. 7. The first plunger 51 has the same configuration. The second plunger 52 is in contact with the lead 71 when the semiconductor integrated circuit 70 is inspected. The spring member 103 is provided on the first plunger 101 and the second plunger. The first plunger 101 and the second plunger 102 of the two are connected to each other in a telescopic manner. The first plunger 101 and the second plunger 102 constituting the probe 100 and the spring member 103 have the same axis. Similarly to the front end portion 51a, the flange portion 51, and the proximal end portion 51c shown in Fig. 7, the first plunger 101 has a distal end portion 101a, a flange portion 101b, and a proximal end portion 101c. 18 323813 g 201237440 The second plunger 102 has a front end portion i〇2a, a flange portion 102b, and a base end portion 102c; the front end portion 1〇2a is formed in a tapered shape before being in contact with the lead wire 71; the flange The portion 1〇2b has a larger diameter than the front end portion 52a; and the base end portion 〇2c is disposed opposite to the front end portion 102a of the flange portion 102b and has a smaller diameter than the flange portion 1〇2b. The end of the spring member 103 is pressed in. The spring member 103 is a densely wound portion 10a on the side of the first plunger ι 1 and on the other side of the second plunger 1 〇 2 is a sparsely wound portion 1 〇 3b. The end portion of the densely wound portion 103a is press-fitted to the proximal end portion 10c to abut against the flange portion 1b. On the other hand, the end portion of the unwinding portion 10b is press-fitted into the base end portion i2c to abut against the flange portion 102b. Further, the spring member 103 is elastically deformed in the direction of connection with the semiconductor package 70. At the time of inspection of the semiconductor package 70, the spring member 〇3 is compressed in the longitudinal direction by the contact load from the semiconductor package 70. When the spring member 103 is compressed, the densely wound portion 103a comes into contact with the proximal end portion 1〇2d of the second plunger 1〇2. Next, the description will be made with reference to Figs. 20 and 21 for the positioning of the semiconductor package 7A by the leaf spring 93. First, when the side 90a of the probe sheet 90 is brought close to the cover 80, the leaf spring 93 comes into contact with the semiconductor package 70, and a force is applied to the semiconductor package 70, thereby causing the semiconductor package 70 to face the board. The extending direction of the leaf spring 93 (the right direction of FIG. 20) is moved. At this time, the leaf spring 93 is in contact with the main surface 70a of the semiconductor package 70 and the semiconductor package 7 is moved. By the above-described force amount, the semiconductor package 70 is moved toward the parent wall surface side of the first holding hole 61a and the second holding hole 19 323813 201237440 61b. When the cover 80 is in contact with the probe unit 90, and the semiconductor package 70 hits the adjacent two wall faces of the four walls of the holding hole 61, the positioning of the semiconductor package 70 with respect to the holding hole 61 is completed. At the same time, the front end portion 102a of the probe 100 is in contact with the lead 71 of the semiconductor package 70 (refer to Fig. 21). At this time, the front end portion 101a shown in Fig. 19 is connected to a circuit board (not shown), so that the semiconductor package 70 and the circuit board are electrically connected. According to the second embodiment described above, even when the QFP is used as the semiconductor package, as in the first embodiment, the pin for positioning the semiconductor package and the pin for the pin are provided on the probe unit side. Inserting into a plurality of insertion holes for holding the semiconductor package tray, and causing the tray to abut the probe early, while simultaneously positioning the plurality of semiconductor packages on the tray and contacting the electrodes of the semiconductor package, With a simple configuration, it is possible to accurately perform inspection of an inspection object that is cut by a piece, and it is possible to shorten the time required for inspection of an inspection object that is cut by a piece. Further, even in the inspection system of the second embodiment, the pin of the inspection system of the first embodiment described above can be used for positioning. It is preferable that the pin of the wood is disposed so as to be in contact with each other at two or more corners in the corners of the four corners of the respective semiconductor packages 7, and the remaining corner sides of the semiconductor package are moved to be positioned. It is more preferable to arrange the pin at a position where it can abut against the corners of the semiconductor chip 70. In addition, by adjusting the arrangement and height of the second opening 81b of the lid 80 and the projections 90b of the 323813 20 201237440 70 90 when the needle 80 is adjusted, the sealing can also be applied to the QFN (Quad Flat., . Package, Quad Flat Non-leaded Package) or S〇P (Small Outline Package). In addition, although the probe unit in the first and second aspects described above is described as four semiconductor packages, if it is possible to contact two or more semiconductor packages, it corresponds to the tray. It is also possible to be able to contact all of the semi-sakis at the same time. (Industrial Applicability) As described above, the inspection system and the package holder of the present invention are connected to a plurality of electrical circuit boards that are cut by a single piece in a simple configuration. The situation is useful. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the configuration of an inspection system according to a first embodiment of the present invention. Fig. 2 is an exploded perspective view showing the configuration of the inspection system according to the first embodiment of the present invention. Fig. 3 is a perspective view showing the configuration of the essential part of the inspection system shown in Figs. 1 and 2; The f 4 ® is a perspective view showing the configuration of the essential part of the inspection system shown in Figs. 1 and 2 . Fig. 5 is a perspective view showing the configuration of the essential part of the inspection system shown in Figs. 1 and 2; Fig. 6 is a perspective view showing the configuration of the essential part of the inspection system shown in Figs. 1 and 2; 21 323813 201237440 Fig. 7 is a partial cross-sectional view showing the configuration of the essential part of the inspection system according to the first embodiment of the present invention. Fig. 8 is a cross-sectional view showing the configuration of a substantial portion of the inspection system according to the first embodiment of the present invention. Fig. 9 is a cross-sectional view showing the configuration of a basic portion of an inspection system according to the first embodiment of the present invention. Fig. 10 is a partial cross-sectional view showing another configuration of the essential part of the inspection system according to the first embodiment of the present invention. Fig. U is a perspective view showing the configuration of an inspection system according to a second embodiment of the present invention. Fig. 12 is an exploded perspective view showing the configuration of the inspection system 4 according to the second embodiment of the present invention. The station map is a perspective view showing the configuration of the inspection month shown in Fig. 11 and Fig. 12, and the main part. The Z map is shown in the inspection shown in Fig. 11 and Fig. 12; A cross-sectional view of the composition of the points. The Fig. 5 is a perspective view showing the configuration of the main part of the inspection and the charging shown in Fig. 12 and Fig. 12. Tong 2 == in the ^ picture, the 12th picture shows the perspective of the structure of the file. The system of the system is shown in the inspection chart shown in Fig. 11 and Fig. 12, and the schematic view of the main material. Unification: Two figures = 7 in Figure U, Figure 12 (four) [The three-dimensional diagram of the structure of the knife. 323813
S 22 201237440 第19圖係為顯示本發明第二實施形態的檢查系統之 主要部分之構成的部份剖面圖。 第20圖係為顯示本發明第二實施形態的檢查系統之 主要部分之構成的剖面圖。 •第21圖係為顯示本發明第二實施形態的檢查系統之 主要部分之構成的剖面圖。 【主要元件符號說明】 1 ' 2 檢查系統 10、60 托盤 10a、40a、60a、70a 主要 11 ' 61 保持孔 11a 插入孔 11a 插通孔 20、70 半導體封裝件 20a ' 90a 面 21 焊球 30、80 蓋體 31 > 81 開口部 40、90 探針單元 41 ' 91 探針保持具 41a、91a 第1構件 41b 、 91b 第2構件 41c、42a、61a、92a 第1保持孔 41d、42b、61b、92b 第2保持孔 23 . 323813 201237440 42、92 保持孔 42c 、 42e 小直徑部 42d 、 42f 大直徑部 43 銷針 43a、51a、52a、54a、54b、102a 前端部 43b 、 51b 、 52b 、 102b 凸緣部 43c 凸座部 50 、 100 探針 51 - 101 第1柱塞 51c 、 52c 、 102c 基端部 52 、 102 第2柱塞 53 、 103 彈簧構件 53a 、 103a 密捲繞部 53b 、 103b 疏捲繞部 54 彈簧探針 71 引線 81a 第Γ開口部 81b 第2開口部 90b 突出部 93 板片彈簧 24 323813 sS 22 201237440 Figure 19 is a partial cross-sectional view showing the configuration of a main part of an inspection system according to a second embodiment of the present invention. Figure 20 is a cross-sectional view showing the configuration of a main part of an inspection system according to a second embodiment of the present invention. Fig. 21 is a cross-sectional view showing the configuration of a main portion of an inspection system according to a second embodiment of the present invention. [Main component symbol description] 1 ' 2 Inspection system 10, 60 tray 10a, 40a, 60a, 70a Main 11' 61 holding hole 11a insertion hole 11a insertion hole 20, 70 semiconductor package 20a '90a surface 21 solder ball 30, 80 cover 31 > 81 opening 40, 90 probe unit 41 '91 probe holder 41a, 91a first member 41b, 91b second member 41c, 42a, 61a, 92a first holding hole 41d, 42b, 61b 92b second holding hole 23 323813 201237440 42, 92 holding hole 42c, 42e small diameter portion 42d, 42f large diameter portion 43 pin 43a, 51a, 52a, 54a, 54b, 102a front end portion 43b, 51b, 52b, 102b Flange portion 43c boss portion 50, 100 probe 51 - 101 first plunger 51c, 52c, 102c base end portion 52, 102 second plunger 53, 103 spring member 53a, 103a tightly wound portion 53b, 103b Winding portion 54 Spring probe 71 Lead 81a Third opening portion 81b Second opening portion 90b Projection portion 93 Plate spring 24 323813 s