JPH0644100Y2 - Positioning device for semiconductor elements - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to, for example, a transistor, a Hall element, and a Hall IC.
The present invention relates to a positioning device for measuring the electrical characteristics of semiconductor elements such as. More specifically, the present invention relates to a device for temporarily holding a semiconductor element conveyed by an inclined chute at a position where a contactor for measuring its electrical characteristics can properly contact a lead of the semiconductor element.

[Prior Art] Generally, a semiconductor device is manufactured by a series of measuring and sorting devices.
After the electrical characteristics are automatically measured, they are sorted and sorted to the stacking position according to the measured electrical characteristics. This measurement / sorting apparatus is usually a feeder for supplying semiconductor elements, an inclined chute for conveying semiconductor elements supplied from the feeder, and a conveyance gate apparatus for adjusting the conveyance interval of the semiconductor elements conveyed by the inclination chute to a required interval. And a measuring device having a positioning device for temporarily holding the semiconductor element at a fixed position during transportation, and a sorting device for sorting the semiconductor element to an integrated position according to the electrical characteristics measured by the measuring device. .

Conventionally, the positioning device used in the measuring device of the above-mentioned measuring and sorting device is only provided with a stopper for opening and closing the element head path of the semiconductor element to be conveyed. In this conventional device, the front surface of the element head of the semiconductor element being conveyed is brought into contact with the stopper by blocking the path by the stopper to temporarily hold it at a fixed position. In addition, the stopper opens the path after the electrical characteristics are measured to allow the semiconductor element to pass therethrough.

[Problems to be Solved by the Invention] However, in the above-described conventional device, when the stopper blocks the route, the semiconductor element being conveyed collides with the stopper and rebounds, and is caught on the way or slanted to the stopper. There is a problem that they come into contact with each other and their stop positions are not constant. Further, in the extreme case, the semiconductor element may jump out of the inclined chute.

If the stop position of the semiconductor element becomes irregular or the semiconductor element jumps out of the inclined chute, the contactor for measuring the electrical characteristics may cause a contact failure with the lead of the semiconductor element or may not be contactable. As a result, poor measurement or failure of measurement of electrical characteristics frequently occurs, leading to a decrease in operating rate and product reliability.

[Means for Solving Problems] Means for solving the above problems will be described with reference to FIGS. 1 and 2 corresponding to one embodiment of the present invention.
According to the present invention, a guide block 10 provided on an inclined chute 2 for carrying a semiconductor device 1 is provided with positioning surfaces 4a, 4b for positioning one side and an upper part of a device head 3 of the carried semiconductor device 1. Then, along the inclined chute 2, a positioning passage 5 is formed which is open at one side and above at the positioning surfaces 4a, 4b at the other side, and closes to the outlet of the positioning passage 5 and closes the element head. 3 is provided with a stopper 6 that opens and closes the path, and a side formed on the guide block 10 on the front side of the stopper 6 in the conveying direction of the semiconductor element 1 and on the other side where the positioning passage 5 is open. Of the semiconductor element 1 which is stopped by directly contacting the stopper 6 when moving forward and backward toward the positioning surface 4a of the guide block 10
The positioning pin 7 that presses the lateral positioning surface 4a formed on the above is provided.

[Operation] When the path of the element head 3 is closed by the stopper 6, the semiconductor element 1 being conveyed is stopped at the position because the element head 3 hits the stopper 6 to prevent the semiconductor element 1 from proceeding. At this time, the positioning passage 5 is located immediately in front of the stopper 6, and the positioning surfaces 4a and 4b on the lateral and upper sides are formed.
Therefore, the semiconductor element 1 is prevented from being largely repelled by the collision with the stopper 6 due to the presence of these.
Therefore, in the semiconductor element 1, the front surface of the element head (the front surface in the carrying direction) is correctly brought into contact with the stopper and stopped, and the shift of the stop position before and after in the carrying direction is prevented.

Even if the shift of the front and rear stop positions is prevented as described above, there is still a risk of the shift of the left and right stop positions with respect to the transport direction. When the front surface of the element head 3 is correctly abutted against the stopper 6 and stopped, this deviation is not so large. However, in measuring the electrical characteristics of a magnetoelectric conversion element such as a Hall element or a Hall IC, the distance from a magnetic field generation source such as a magnet may change, and as a result, the accuracy of the measured value may decrease.

Therefore, in the present invention, the positioning pin 7 is provided. That is, the positioning pin 7 is advanced to move the stopper 6
When the element head 3 of the semiconductor element 1 which is brought into direct contact with and is stopped by the element head 3 is pressed, the side surface of the element head 3 becomes a lateral positioning surface.
Abutting on the side 4a, the lateral positioning surface 4a is used as a reference for lateral positioning. Therefore, not only the front-rear direction but also the left-right stop position deviation can be prevented.

[Example] As shown in FIGS. 1 and 2, the inclined chute 2
Is one in which two plate materials are juxtaposed at appropriate intervals. As shown in FIG. 5, the inclined chute 2 is supported by a pedestal 8 and is attached so as to be inclined.

As shown in FIG. 3, for example, the semiconductor element 1 is composed of a resin-molded element head 3 containing a semiconductor chip and leads 9 protruding from the element head 3. In this semiconductor element 1, as shown in FIG. 2, the lead 9 is inserted between two plate materials constituting the inclined chute 2,
The element head 3 is slid down on the inclined chute 2 and is slid down along the inclined chute 2 and conveyed.

As shown in FIGS. 1, 2 and 4, a guide block 10 is located on the inclined chute 2. The guide block 10 includes a magnetic field generator 12 mounted on a stand 11.
On the inclined chute 2 (see FIGS. 2 and 5). The corner portion of the guide block 10 on the side projecting above the inclined chute 2 is cut out, and the positioning passage 5 is covered on the inclined chute 2 by covering one side and the upper side and opening the other side. Is formed. A wall surface that covers one side of the positioning passage 5 is a positioning surface 4a that defines a lateral position of the element head 3 by forming a pair with a positioning pin 7 described later. A wall surface that covers the upper side is a position above the element head. Is a positioning surface 4b that restricts and prevents excessive splashing.

The inlet side of the positioning passage 5 is slightly widened. This is preferable because the element head 3 is less likely to be caught at the entrance of the positioning passage 5. In addition, the open side of the positioning passage 5 does not necessarily have to be fully open, and it is sufficient if the positioning pin 7 described later is opened within a range in which it can move forward and backward. However, if one side is fully opened,
The element head 3 is less likely to be caught at the entrance or inside of the positioning passage 5, which is preferable.

On the outlet side of the positioning passage 5, a stopper 6 that opens and closes the path of the element head 3 is provided close to the outlet.
The stopper 6 is attached to the tip of the stopper attachment arm 13. As shown in FIG. 5, the stopper attachment arm 13 is connected to the air actuator 15 attached to the stand 11 via the spacer 14, and the stopper attachment arm 13 is used to move the stopper attachment arm 13 to the inclined chute. 2 The stopper 6 opens and closes the path of the element head 3 by moving the element head 3 upward and downward.

As shown in FIGS. 1 and 4, one end of the suction hole 16 is opened in the end surface of the stopper 6 on the side of the positioning passage 5. The other end of the suction hole 16 is connected to a suction device (not shown) such as a pump by a flexible hose 17,
The element head 3 of the conveyed semiconductor element 1 can be sucked. By providing such suction holes 16 and sucking the element head 3 with the suction holes 16, the front surface of the element head 3 (front surface in the transport direction) can be surely brought into close contact with the stopper 6, which is preferable. The suction of the element head 3 by the suction hole 16 is performed prior to the positioning by the positioning pin 7 described later, and is stopped at the time of the positioning by the positioning pin 7.

As shown in FIGS. 1, 2, and 5, a measurement block 19 attached to a measurement block attachment arm 18 is located on the open side of the positioning passage 5. The measurement block mounting arm 18 is supported on a support frame 20 extending from the stand 11. In addition, the measurement block mounting arm 18 is a measurement block air actuator 21
By a to 21c, it is possible to move back and forth, left and right, and up and down in the direction indicated by the arrow in the figure, that is, toward the inclined chute 2.
By this, the forward / backward control of the measurement block 19 and the adjustment of the vertical / horizontal position are performed.

The measuring block 19 includes the positioning pin 7 and the semiconductor element 1.
The number of contacts 22 corresponding to the number of the leads 9 are provided with their tips directed toward the inclined chute 2.

The positioning pin 7 is located at a position facing the side surface of the element head 3 of the semiconductor element 1 which is in contact with the stopper 6 and stopped. When the measuring block 19 is moved forward, the positioning pin 7 directly abuts the stopper 6 to press the stopped element head 3 and press it against the lateral positioning surface 4a. Then, the semiconductor element 1 slid down along the inclined chute 2 and conveyed, and the front surface of the element head 3 is correctly brought into contact with the stopper 6 and stopped, and then the element head 3 is moved by the positioning pin 7. By pressing the to the lateral positioning surface 4a,
It is possible to fix the semiconductor element 1 at a fixed position without any lateral displacement.

The positioning pin 7 is preferably elastically projected and supported by a spring 23 or the like as shown in FIG. 6, for example, so as not to press the element head 3 excessively strongly. This is preferable because excessive pressing force is absorbed by the positioning pin 7 retracting against the spring 23 and the semiconductor element 1 is not damaged by excessive pressing of the positioning pink.

Inclined chute 2 just below stopper 6 and guide block 10
A measuring notch 24 is formed on the side surface. From the measurement notch 24, the lead 9 of the semiconductor element 1 whose conveyance is stopped by the stopper 6 is exposed.

The contacts 22 provided on the measurement block 19 are located at positions facing the leads 9 exposed through the measurement notches 24, respectively. The amount of protrusion of the contact 22 on the side of the inclined chute 2 is slightly shorter than that of the positioning pin 7 described above, and when the measurement block 19 is advanced, the positioning pin 7 positions the semiconductor element 1 to be measured. Then, the lead 9 is contacted.

After measuring the characteristics of the magnetic field generator 12 with respect to the magnetic field via the contactor 22 contacting the lead 9 as described above, the measurement block 19 is retracted, and the positioning pin 7 and the contactor 22 are removed from the semiconductor element 1. Be separated. Further, subsequently to this, the stopper 6 is also pulled up, the path of the element head 3 is opened, and the semiconductor element 1 is further conveyed along the inclined chute 2. After the semiconductor element 1 is sent out, the closing of the three head paths of the element head by the stopper 6 and the subsequent advancing of the measurement block 19 are repeated at the timing when the next semiconductor element 1 is conveyed.

In this embodiment, the guide block 10 forming the positioning passage 5 is fixed and only the stopper 6 is vertically moved by the stopper mounting arm 13. However, the guide block 10 may be vertically moved together with the stopper 6. Although the magnetic field generator 12 is provided assuming a Hall element or a Hall IC, the magnetic field generator 12 is not always necessary if the semiconductor element 1 to be measured is not a magnetoelectric conversion element.

Next, with reference to FIG. 7, an example of the measuring and sorting apparatus provided with the present positioning device will be described.

First, the semiconductor elements 1 supplied from the feeder 25 onto the inclined chute 2 are sequentially sent out by the transfer gate device 26 at required intervals (intervals sufficient to complete the electrical characteristic measurement of the preceding semiconductor element 1). The sent semiconductor element slides down along the inclined chute 2 and reaches the measuring device 27.

In the measuring device 27, as described above, the semiconductor device 1 is temporarily held at a fixed position by the positioning device, and the electrical characteristics are measured during that time.

The semiconductor device whose electrical characteristics have been measured by the measuring device 27 is put on standby by the standby device 28 as necessary, and then the distribution device 29.
Be sorted by. That is, when it is confirmed from the measurement result of the measuring device 27 that the rotary chute 30 of the sorting device 29 is rotated and the outlet thereof is directed to the correct stacking part 31a or 31b ..., The standby device 28 sends out the semiconductor element 1. , And are sorted and sorted to the stacking position 31a or 31b ... According to the electrical characteristics. In particular, the passage sensors 32a, 32b ... Of the semiconductor element 1 are provided immediately before the integration positions 31a, 31b.
Until the passage sensor 32a, 32b ... confirms that the semiconductor element has been loaded into the correct stacking position 31a or 31b.
Next, it is preferable not to distribute the semiconductor elements 1. By doing so, it is possible to prevent the semiconductor element 1 from being caught in the rotary chute 30 and dropping to a different integration position 31a or 31b ... With the subsequent semiconductor element 1, and accurate measurement of electrical characteristics by the present positioning device. Can be prevented from becoming meaningless.

[Advantage of the Invention] According to the present invention, since the semiconductor element being conveyed can be always held at a fixed position for measurement, a measurement error due to a deviation of the measurement position of the semiconductor element can be prevented and the measurement accuracy can be improved. Product reliability is improved. In addition, it is possible to prevent the position of the semiconductor element from being greatly displaced and make the measurement impossible. Therefore, it is possible to eliminate the trouble of stopping and inspecting the device every time the measurement becomes impossible and improving the operation rate of the device.

[Brief description of drawings]

1 is a partial side view of an apparatus according to an embodiment of the present invention, FIG. 2 is a partial sectional view taken along line II-II of FIG. 1, and FIG. 3 is a view showing an example of a semiconductor device, FIG. 4 is an enlarged view of a portion of FIG. 1 excluding the measurement block, FIG. 5 is a general view from the II-II direction of FIG. 1 with a part in section, and FIG. FIG. 7 is an enlarged sectional view of FIG. 7, and is an explanatory view showing an example of a measuring and sorting apparatus equipped with the apparatus according to the present invention. 1: semiconductor element, 2: inclined chute, 3: element head, 4a, 4b: positioning surface, 5: positioning passage, 6: stopper, 7: positioning pin, 8: mount, 9: lead, 10: guide block, 11: Stand, 12: Magnetic field generator, 13: Stopper mounting arm, 14: Spacer, 15: Stopper air actuator, 16:
Suction hole, 17: Flexible hose, 18: Measuring block mounting arm, 19: Measuring block, 20: Support frame, 21a-21
c: Air actuator for measuring block, 22: Contact, 2
3: Spring, 24: Notch, 25: Feeder, 26: Conveying gate device, 27: Measuring device, 28: Standby device, 29: Sorting device, 30: Rotary chute, 31a, 31b ...: Stacking part, 32a,
32b ...: Passage sensor.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 21/66 G 7630-4M

Claims (1)

[Scope of utility model registration request] 1. A guide block provided on an inclined chute for conveying a semiconductor element is provided with a positioning surface for positioning one side and an upper side of an element head of the conveyed semiconductor element, and the positioning surface is arranged along the inclined chute. To form a positioning passage with one side and the upper side open and the other side open, and a stopper for opening and closing the path of the element head is provided close to the exit of this positioning passage. On the front side in the conveying direction of the semiconductor element, on the other side side where the positioning passage is opened, advance and retreat toward the side positioning surface formed on the guide block,
A positioning device for a semiconductor element, comprising a positioning pin for pressing the element head of the semiconductor element, which is brought into direct contact with a stopper and stopped, with a lateral positioning surface formed on a guide block when the forward movement is performed.