JPS58168251A - Supply shoot device - Google Patents

Abstract

PURPOSE:To shoot semiconductor devices by completely controlling the shooting timing of the devices with a plurality of semiconductor devices as a unit by shooting the devices fed in multiple series in individually separated state to next stage in a shooting unit before testing of a semiconductor device testing unit. CONSTITUTION:Only heading ICa1 of semiconductor devices such as ICa1-ICa3 fed in series from a magazine 30 is separated and dropped by the operations of pen air cylinders 25, 26, and only the third pen air cylinder 28 is first disconnected from the state of the dropped ICa1 anchored with the third pen air cylinder 28. The ICa1 is shot to next stage 40. Subsequently, the cylinder 26 is disconnected. The cylinder remains retaining the ICa3, and the cylinder 28 remains retarded from the chute row. The ICa2 disconnected is shot directly to the next stage 40.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a test device for continuously testing the electrical characteristics of semiconductor devices. Part O supply chute device KH.

[Technical background of the invention and its melting point]

For example, in the case of IO (integrated integrated circuit device) type semiconductor devices, it is necessary to conduct electrical characteristic tests on each manufactured product and to sort them into good and defective products. And, for rounding, which continuously and automatically performs the above-mentioned testing and sorting work on large quantities of steel products,
A visual testing device equipped with a so-called high-speed handler device has been used in the past.

IML is a general explanation of the conventional test equipment for semiconductor devices mentioned above. In the same eg, 1 is a pre-test shade part for arranging continuously supplied half-field devices in a single row. Semiconductor devices ai arranged in a single row under the shade s1 before the wrinkle test.

1, . . . are disposed immediately downstream of the pre-test chute section 1, and are configured to be shot one by one to the test head II2. In the test head section 2, the electric characteristics of the semiconductor devices are tested by chute, and it is determined whether the semiconductor devices are good or bad. And test head il
After l is empty, the next semiconductor device is tested (T)
A shot comes from III. The above semiconductor device is tested using a tester (not shown) that can be connected to a test spatula FIIJK. On the other hand, if the semiconductor device shot from the test head section 2 is a good product, the printing board section 3 receives a command from the tester (not shown) and places it immediately downstream. I would like to recommend a good quality chute section. 119. If the semiconductor device being shot is a defective product, the sorting chute 1 rotates by 90 degrees in response to a command from the tester (not shown) and rotates in the opposite direction! The defective semiconductor device is shot into the defective product shoe (II5) arranged in the defective product shoe II5.

As described above, the conventional test equipment for semiconductor devices has only one test head (←4), and the entire test head is configured as a single-row chute circuit system. Moreover, since the test head section ←4 was not configured to be able to test as many samples as Kl at the same time, a system was adopted in which the semiconductor devices were sequentially supplied to the test head 11 and tested one by one. However, there is a possibility that there will be a huge amount of lost time during this period.

Furthermore, when a large semiconductor device determined to be a defective product is to be shot into the defective product chute section 5, the sorting shoe (sJ) must be rotated, which also causes loss of time. Due to these factors, in conventional semiconductor device test equipment, the overall machine index is approximately 1.
The heating time is extremely high for 0 to 15 seconds, and this is a major obstacle to improving work efficiency and overall productivity.

By the way, the structure and operation of the pre-test shoe (ml) in the conventional semiconductor device testing apparatus are as follows.

FIG. 2 is a side view showing a schematic structure of the pre-test chute section 1. FIG. As shown in the figure, the pre-test chute section 1 is limited by the magazine section upper support frame and lower support frame to form nine chute rows, and these OtS-simulating chute rows pass through each other. The magazine section C and the supply chute section 1 are! ! It is installed tilted in the right direction,
Semiconductor devices are seated in the chute rows by gravity. On the other hand, the fixed chute section 9 is disposed substantially horizontally. A round detector IQ is provided near the upper end of the supply chute section 1 to detect whether or not a semiconductor device is present in that portion. Furthermore, two pen air cylinders 11.11 are provided in the lower part of the supply chute section 1 along the chute row. Of these, the upper pen air cylinder 11 presses the side wall of the semiconductor device being conveyed through the chute row to stop it, and the lower pen air cylinder 12 locks onto the lower end of the semiconductor device to stop it. It is meant to be moored.

In the pre-test chute section 1 of the above structure,! Gazin part 6
Semiconductor devices & ~ insects are sent in a rush as shown in the figure. These semiconductor devices ~a are moored by pen air cylinders 12 as shown, and semiconductor devices 1~1. is a semiconductor device 1. They are overlapped and stopped by the pen air cylinder 11 pressing against the side wall of the pen. In this state, when the pen air cylinder 12 first retreats from the chute row and releases its mooring, only the semiconductor device 1 is separated and passes through the arcuate chute portion 8 and is attached to the fixed chute portion. Subsequently, the pen air cylinder 12 protrudes into the shade row again, and this time, the pen air cylinder 1
1 pulls in and releases the presser foot. As a result, semiconductor device a
1-"-a @ falls and is moored to the pen air cylinder 12. Then, the pen air cylinder 11
protrudes again and this time presses the side wall of the semiconductor device 1.0 to stop it. Thereafter, the above operation is repeated, and the semiconductor devices 1° to 1e are separated one by one and placed into the fixed chute portion 9. In this way, the supply section 1
The role is to separate the semiconductor devices that are sent in bulk from the magazine section 1 one by one and transfer them to the next stage.

The large semiconductor devices that are shot one by one into the fixed shade section 9 are transferred immediately downstream by a shoot timing control mechanism consisting of a pen air cylinder and a pen nozzle provided at the tip of the fixed chute section 90 (not shown). The samples are shot one by one into the test head section 2 provided at the test head section 2. (9) If the magazine sC becomes empty and no semiconductor devices are fed, the detector 10 will no longer detect the presence of semiconductor devices. You can continue the test by replacing it with

By the way, as a consequence of the melting point in the conventional test equipment for semiconductor devices mentioned above,! The following three points can be cited as basic concepts for realizing an efficient semiconductor device with a small scene index. The first point is that by providing a number of test head sections 2 in parallel, the overall performance of the semiconductor device can be improved by providing a plurality of parallel test head sections branched from the pre-test chute section 1 and shot into separate test head sections. The main purpose is to use a large chute circuit system.

The second point is to replace the sorting chute section 1 with an efficient sorting chute device. However, since these two points and collapse are not directly covered by the present invention, the details thereof will be omitted. The remaining third concept is to enable the test head section 2 to test a plurality of semiconductor devices at the same time. Needless to say, this ninth step requires a test head section 2 with a structure that allows setting of multiple semiconductor devices at the same time, but this alone is not sufficient; A chute mechanism is needed that can reliably set the device. Moreover, such a chute mechanism is required not only in the part (fixed shade part 9 in the conventional example) where the semiconductor device is shot into contact with the test head part 2, but also in the supply part 11F. mechanism is required. Such a chute mechanism is a chute mechanism in which the same number of semiconductor devices as those to be simultaneously tested by the test head 1151 are treated as one unit, and the shoot timing of all of the IIa semiconductor devices can be completely controlled. Unless such a chute mechanism is made possible, it is not possible to reliably set a sensitive semiconductor device in the test head section 1, and therefore, according to the third concept described above! It is not possible to realize a test device for semiconductor devices with a small scene index.

Therefore, the conventional supply chute section 1 will be examined from this viewpoint as follows. As is clear from the foregoing, the pen air cylinder l'l, '1'''1 in the conventional supply seat section IK stores the semiconductor devices fed in large numbers from the magazine section 6 in 1 meter sections. This constitutes a ninth separation supply mechanism for supplying shade to the next stage, and also constitutes a shoot timing side control mechanism for controlling the shoot timing of each of these semiconductor devices. In other words, in the JIg2 diagram, semiconductor device 1
In □, the shoot timing is completely controlled by unmooring the pen air cylinder 12. However, in this case, the shot timing can only be completely controlled by -1:°□ with the electric conductor device. On the contrary, the semiconductor devices Otori and Hatake each fell one by one by 1lIA,
This is because the shoot timing is controlled only after the pen air cylinder 12 is moored and in good condition. Therefore, the conventional supply chute cannot realize the third concept.

Further, the conventional supply chute section 1 is unable to shoot several 1/11 semiconductors am as one unit, and in this respect as well, it is not suitable for realizing the third concept.

[Purpose of the invention]

A first object of the present invention is to separate a large number of semiconductor devices, which are fed in batches, one by one, in a pre-test sheet section of a semiconductor device testing apparatus, and then transfer them to the next section. To provide a supply chute electric manufacturing device capable of completely controlling the chute timing of each semiconductor device and chute a plurality of semiconductor devices as one unit. 9. A second object of the present invention is to provide the supply chute tie, which makes it possible to realize a semiconductor device testing apparatus configured to test a large number of semiconductor devices at the same time in the test head section. .

[Summary of the invention]

The feature of the supply chute device of the present invention is that the first and #! In addition to the two pen air cylinders mentioned above, a detector and a third pen air cylinder having the following functions are provided.

That is, this detector detects the semiconductor devices falling after being separated one by one by the separation supply and shoot timing machine #.

In addition, the third pen air cylinder protrudes into the chute 1'' by the detection signal of this detector, falls down and moored the next semiconductor device, and retreats from the chute row to release the mooring, thereby mooring the semiconductor device. This is to send the shot to the next stage.

Moreover, once the pen air cylinder of jI3 performs a shoot operation and retreats from the chute row, only one semiconductor device dropped from the separation supply and shoot timing control am mechanism is transferred to the pen air cylinder of @3. Even if the detector detects a fall of the semiconductor device, the mooring operation is not performed until the detector confirms that the semiconductor device has been shot directly to the next stage without being moored. Then, the detector detects an I[class shoot of 1iilL.
When a dropped semiconductor device is detected after a funeral, this detection signal (
-Protrudes into the chute and performs mooring operation. Therefore, the semiconductor device can be shot to the next stage in two ways: once it is moored to the third pen air cylinder and then shot, and when it is shot without being moored to the #13 pen air cylinder. It turns out that there is. A plurality of sets of this detector and the third pen air cylinder can be provided as necessary.

The feed chute device of the present invention can achieve the object of the invention by using the above-mentioned mold.

[Embodiments of the invention]

FIG. 3 is a flat view of a supply chute device according to an embodiment of the present invention, and FIG. 4 is a left side view thereof. In these figures, 21 is a supply shoe metering device. The supply chute device 72 has a chute row 24 defined by an upper support frame 22 and a lower support frame 23 .

This chute row 24 has semiconductor devices stacked inside it.

It is formed in a direction that can cause it to fall due to force. At the lower part of the supply chute device 21, two vent air cylinders zs and xi are provided m in the chute row 24. These two Ben Air cylinders 25 and 26 have the same functions as the two Ben Air cylinders 11 and 12 that constitute the separate supply and shade timing control mechanism provided in the conventional supply chute section. That is, the Ben-Air cylinder 26 protrudes into the chute row to lock the tip of the first semiconductor device that is fed in a large number of different ways, thereby anchoring all of these semiconductor devices. Well, the tip of the Ben-air cylinder 25 above it is held in #i contact by the Ben-air cylinder 26, and the semiconductor device that is being carried immediately after the semiconductor device is pressed down, so that it can be moved from there on. This is to prevent the semiconductor device from falling. Fourth
As shown in the figure, these two Ben Air cylinders 1
5.26 is provided with its tip part buried in the upper support frame 22. On the downstream side of the Ben Air cylinder 2-, there is a Ben Air cylinder x5. Detector 2 for detecting falling semiconductor devices that are separated one by one by the action of zg
1 is provided. An optical fiber sensor is used as this detector 21, and as shown in FIG. 4, it is installed on a lower support frame JJK. On the downstream side of the detector 21, a third Ben Air cylinder 28 is connected to the upper support frame 22.
and the lower support frame 2J in parallel thereto. This third Ben Air cylinder 21 is detected! When the semiconductor device 11 detects a falling semiconductor device, it protrudes into the chute row 24 to moor it, and when it retreats from the chute row and releases its mooring, it is moved to the Wi connection connection 40 of the semiconductor device. It has become. Moreover, once the unmooring operation is performed, the semiconductor device can be moved to the next one! If you directly synchronize to the R section, immediately after that, the Ben Air cylinder 25.2
Only one of the semiconductor devices that is separated from the semiconductor device 6 and falls is shot to the next stage portion 40 without being moored. Therefore, in this case, the semiconductor device ii! is released by the unmooring operation of the Benair cylinder 26. 11! He will be shot by the KR club. This Benair cylinder 2
The shooting operation of the RAM from 6 is detected by the detector 21 detecting the semiconductor device being shot, and detected! The next time 2r detects a fall of the semiconductor device, the Ben-Air cylinder 2# protrudes and anchors it. The above operations of the Ben Air cylinders 25, 26, and 18 are electrically controlled by a control device K (not shown).

Near the upper end of the supply shoe device 21, an optical fiber sensor is embedded in a lower support frame 23, and a detector 29 is provided. The skeleton detector 29 is Shu) M,? 4's place fj
This is to detect whether or not a semiconductor device is present up to the IL.

In addition, in the upper fiLIIil of the supply chute device 21,
A relatively large magazine section 30 is provided for carrying and delivering a large number of semiconductor devices to the shade row 24. t*, downstream of the supply shade device 21, there is disposed a portion 40 for tt* shading of semiconductor devices to the test head portion of the semiconductor device testing apparatus. As this next step section 40, the constant seat section 9 described in the conventional example can be used. In this case, it is necessary to have a chute mechanism suitable for realizing the above-described third concept.In addition, if a laterally movable distribution chute device is used as the next stage section 40, It is possible to take the semiconductor devices shot from 11JJ (supply shoe) and arrange a plurality of them in parallel downstream of the receiving shoe, thereby distributing them to each of the nine test heads. It also becomes possible to realize the concept. Needless to say, the distribution shade device in this case also requires a chute mechanism similar to the concept of the rattan 3.

The operation of the supply chute device having the above configuration will be explained below with reference to FIGS. 5(1) to 5(d).

The state shown in FIG. 5(a) is for semiconductor devices, such as Ions, which have been successively fed from the magazine section 30.

Only the first Ion of A-1 was separated by the action of the Ben-air cylinder 21. be. The operation from the state is as follows.

(1) "l!f Only the third Ben Air cylinder 2a releases its mooring. This causes l0a1 to move to the next stage m4.
It is sent to 0. Subsequently, Benair cylinder 26 releases its mooring. In this case, the own Ben-air cylinder 2j is IOa, which is tt, Ben-air cylinder j1
There is a retreat from the chute row to the praise. by this,
The unmoored I Oa 1 is shot to the m-joint section 40 . I Oa @ is directly transferred from the pen air cylinder 1 to the next stage section 40, which means that the detector 21
Detected by this! 21 is the next I Oa
When the fall of H is detected, the system becomes ready to instruct the mooring operation of the Ben Air cylinder 2a.

(Illustrated in FIG. S (b)) (1) Next, after the Ben-air cylinder 26 re-projects into the chute row and is successful, the Ben-air cylinder 2J releases the presser. As a result, Ion, ~a, falls as one,
It is moored to a protruding Ben Air cylinder 26. Subsequently, the Ben-air cylinder 2j protrudes and presses the side surface of l0a4 (as shown in FIG. 5(c)).

(-Next, the Ben Air cylinder 25 presses l0a4 and
The pen air cylinder 26 moves back.

I Oa @ is unmoored. Unmoored*
I Oa B falls but is detected! ! 21 detects this and projects the Ben Air cylinder 28 into the chute row,
As a result, I Oa @ is moored to the Ben Air cylinder 21. After the Ben-Air cylinder 26 protrudes into the shade row again, the Ben-Air cylinder 16□ releases the hold on l0a4, and Ions 4 to 1- fall together and are moored to the Ben-Air cylinder 26. . As a result, a state similar to stripe 5 (Fig. 1m) will result (5th ugliness (d))
.

In the operations (1) to (Iil) above, (1) is an operation to convert two IO "1 * ""L to the next stage 4G, and (i11 to (Ill) are two I/Os) O
'a@, This is a ball-loading O operation to prepare a4 for shooting to the next stage. In this way, the operation of shooting two ICs and the operation of loading 2 (1!) ICs are performed alternately, so if the supply chute device 121 of the above embodiment can be taken as one unit and transferred to the next stage section 40 one by one.Moreover, as is clear from the shooting operation in (1), the shoot timing of the two l0al and a@ that are shot as one unit is The Ben Air cylinders x and al9 to which they are each moored are fully controlled by the unmooring operations of 26.Therefore, the supply chute device 2 of the above embodiment is integrated into one test head. It is a sew that sets two IOs in the unit and tests them at the same time.

That is, it is equipped with a chute mechanism that meets the requirements for realizing the semiconductor device testing apparatus according to the third concept described above, and has a great effect in making it possible to realize the semiconductor device testing apparatus according to the above-mentioned concept. is obtained.

In addition, the supply chute device of the present example uses the above-mentioned distribution chute device as the next stage section 4Q. Therefore, it has the characteristic that it is well suited to the operation of the distribution chute installation for realizing the first concept described above, and in this respect as well, it is very suitable for realizing a semiconductor device with a small machine index. It is effective.

It should be noted that the present invention is not limited to the above embodiments,
By providing two or more third Ben-air cylinders 21, it is also possible to shoot three or more IOs as one unit to the next stage. In this case, instead of increasing the third Ben-air cylinder JJI, by increasing the number of Ben-air cylinders 1j that press the @ side of the IO, it is also possible to create a configuration in which three or more ■0s are shot as one. .

Further, as the detector IT, :2m, a photoelectric switch, a mital switch, or the like can be used instead of an optical fiber sensor.

〔Effect of the invention〕

As described above in detail, according to the supply chute device of the present invention, semiconductor devices that are fed in large numbers are separated one by one, and each semiconductor device is treated as one unit. It is possible to completely control the heating timing of a semiconductor device and to heat the next stage at the same time. As a result, it is possible to realize a highly efficient semiconductor device testing apparatus with a small machine index.

[Brief explanation of drawings]

Diagram 1 schematically shows the conventional test equipment for semiconductor devices: 111
□ 1i′ is an explanatory diagram showing a pre-test chute section in a conventional test equipment for semiconductor devices, and Figure 3 is a plan view showing a supply chute device according to an embodiment of the present invention. Yes, Figure 4 shows its facial expression, Figure 5! all(a)～(4
) is an explanatory diagram showing the operation of the supply chute device according to the embodiment of FIGS. 3 and 4. FIG. 11... Supply shade installation, 22... Upper support frame,
2J...Lower support frame, 24...Chute row, 25°26...Ben air cylinder, 21, 2fi...Detector, 21...Third pen air cylinder. Departure: Benkyushi Suzue Shikihiko J'□. Spear 311 Spear 4 Spear 51i (a) Spear 5i! 1 (b) Spear 51!1 (C) Spear 511 (d) 245-

Claims (1)

[Scope of Claims] (1) One sheet blade-F row, through which semiconductor devices are fed in a single row in large numbers by gravity, and the shade row Kli! A $1110 pen air cylinder that moored the first 0 $ conductor installation that was distributed in large numbers by issuing ink, and a large semiconductor device OI moored by the Chen No. 10 Ben air cylinder.
[Press the side wall of the semiconductor device located behind to prevent it from falling, and enable the first 04 & conductor device to separate and fall by removing the mooring decoration of the 10th pen air cylinder. In a supply shade device equipped with a second Ben-air cylinder that protrudes into the F row again after unmooring, the IK presser is released and the semiconductor device is dropped, and the unmooring operation of the Ben-air cylinder of the lsl is performed. Detection S detects a semiconductor device that is separating and falling, and when the semiconductor device is unmoored by SOO, the semiconductor device is directly moved to the next The supply shade device is characterized in that the mooring operation is not performed until the detector indicates that the supply shade is partially hesiated. (2)) A plurality of sets of the third Ben-air cylinders that move are provided in the detection I and the wrinkle detector.
Patent claim 0 @Ii # (1) Item 1ast
OA theory shade line placement. ((Translation) It is assumed that a plurality of Ben-air cylinders according to the above-mentioned method may be provided. 4411 Claims (1) The supply shade device according to Paragraph Ia. (4) An optical fiber sensor is used as the detector.Claims (1), (2) and (2) above are the supply system. (5) The supply shade device according to claim (4), wherein the front light distribution fiber sensor is embedded in a wall defining the shade row. (6) Any one of claims (1) to (5), characterized in that the first and second Ben Air cylinders are embedded in a wall that limits the shade row. The supply shade device according to item 1.