KR0118231Y1 - Insereing apparatus of package inte tube - Google Patents

Abstract

In the process of discharging the processed semiconductor assembly (package) in the assembly process of semiconductor manufacturing equipment, it is possible to smoothly insert individual packages into a tube to protect semiconductor assemblies that have completed various processes. An apparatus for inserting a semiconductor package into a tube in an equipment, comprising: a working beam and a package inserting device having a structure in which the working beam is placed on the working beam, is set on a setting position, and is sequentially inserted one by one into the tube. And a driving means for driving the pusher 10, an operating lever 18 for raising and lowering the setting block 60 in association with the operation of the driving means, and a panel 72 for supporting these components. Since the semiconductor package can be smoothly inserted into the tube, the semiconductor assembly can be protected.

Description

Device for inserting a semiconductor package into a tube

1 is a plan view showing a schematic configuration of a semiconductor manufacturing apparatus.

2 is a cross-sectional view showing the main components of the present invention.

3 is a sectional view of main parts of a drive means of the present invention.

* Explanation of symbols for main parts of the drawings

1: forming machine body 2: pickup device

10: pusher 12: transfer block

13 ': ball bearing 13: guide rod

14: cam body 14 ': inclined portion

16: roller 17: center

18: operating lever 19: driven roller

20: on loader 30: tool set

40: off loader 60: setting block

62: operating hole 64: compression spring

68: rail 70: rotation cylinder

71: pinion 72: panel

73: shaft 74: rack

76: linking 77: working beam

80: detection device L: lead frame

P: Package T: Tube

S: Setting position

The present invention relates to an apparatus for inserting a semiconductor package into a tube before entering the next fixation in semiconductor manufacturing, and more particularly, in the process of discharging the processed semiconductor assembly (package) in the semiconductor manufacturing equipment assembly process. The present invention relates to an apparatus for inserting a semiconductor package into a tube in a semiconductor manufacturing equipment which enables a package to be smoothly inserted into a tube, thereby protecting a semiconductor assembly having completed various processes.

In general, the manufacturing process of a semiconductor integrated circuit (IC) is performed in the order of design → mask manufacturing → wafer manufacturing → wafer processing → assembly → inspection → product shipment.

The assembling process in the above process means the process of dividing the circuit elements such as IC, LSI, and the like separately from each other in the wafer fabrication process and mounting them in an assembly, and largely dicing, die bonding, packaging, It can be divided into marking process.

The bonding process belongs to all processes, and there are three kinds of bonding processes. A die bonding is performed by bonding a chip (integrated circuit: IC) to a bonded body such as solder, gold, or resin on a precision processed substrate called a lead frame. A step (chip mounting step), a wire bonding step of connecting a connection electrode on the semiconductor chip with a terminal for external drawing of the package with a bonding wire, and a corresponding member of the surface electrode of the semiconductor chip, the wiring lead and the external electrode for wiring. This is a wireless bonding process that overlaps and joins several terminals simultaneously.

In addition, the packaging refers to the formation of a container having external conductors for arranging, connecting, and protecting the components of a semiconductor integrated circuit as a post-transporting tablet, and the finishing process is encapsulated using a lead working mold. It includes trimming / forming process for cutting out unnecessary parts of leadframe and forming terminal shape. Marking process is to print letters or symbols on the package surface. There is a laser marking to burn the surface of the package by irradiating a laser beam.

The order of these processes may vary slightly depending on the semiconductor wafer characteristics.

As described above, in order to manufacture a semiconductor, various processes are required. In particular, an assembly process using a forming machine requires a process of putting the semiconductor assembly into a tube in order to transfer the process to another process.

In the past, this insertion required manual operation by one operator, which leads to waste of manpower. Furthermore, incorrect insertion of a package due to increased operator fatigue results in enormous difficulty in the next step. The company was exposed to problems such as failure to meet the demands of the industry which is being automated. In addition, because the linear drive cylinder is used, there is a strain on each drive part due to the need to operate with a constant stroke.

The present invention has been made in view of the above problems, and its object is to provide a package inserting device which can automatically insert a package of processed objects into a tube one by one.

In order to achieve the above object, the device for inserting the semiconductor package of the present invention into the tube, as a package inserting device of the structure to be placed on the working beam and the transport beam and set in the setting position one by one in the tube, And a pusher, a driving means for driving the pusher, an operating lever for lifting and lowering the setting block in association with the operation of the driving means, and a base for supporting these parts.

Here, guide rods for ensuring smooth linear movement of the pusher may be additionally installed on both sides of the pusher or up and down, and the driving means may include a pinion having an inclined portion and a rack for fitting the pinion; It consists of a cam body which has an inclination part, and the conveying block connected to this cam body.

The actuating lever includes a roller rotatably mounted at both ends thereof and a center pin provided at an intermediate portion thereof. The linkage between the setting block and the actuating lever includes an actuating hole formed in the setting block. And a roller on one side of the operation lever embedded in the operation hole.

Therefore, a package inserting apparatus having a structure of sequentially inserting one into a tube, comprising: a pusher, a driving means for driving the pusher, an operating lever for lifting and lowering a setting block in association with the operation of the driving means, and supporting these parts. Since the base is configured, the individual packages can be smoothly inserted into the tube in the process of discharging the processed semiconductor assembly, thereby protecting the semiconductor assembly that has been subjected to various processes in a small manner.

EXAMPLE

Hereinafter, a device for inserting the semiconductor package of the present invention into a tube will be described in detail with reference to the accompanying drawings.

1 is a plan view showing a schematic configuration of a semiconductor manufacturing apparatus. Reference numeral 1 represents a forming machine body.

As shown in the drawing, a lead frame feeder (on loader) 20 and a floor feeding system are arranged on the right and upper sides, and a tool set including a lower die for actually carrying out the process in the center. (30) is positioned, and an off loader 40 for discharging the finished lead frame L and inserting the tube into the tube is arranged in the left and lower portions.

The supply unit 20 is provided with a pickup device 2 for sending the lead frame (L) to the processing unit 30 transfer line.

Next, the characteristic part of this invention is demonstrated in detail, referring FIG.

In these figures, reference numeral 10 denotes a pusher.

Pusher 10 of the rod-shaped is subjected to the vertical movement force by the transfer block (12). Reference numeral 13 is a guide rod for ensuring the accuracy of the linear motion of the transfer block (12). The package P is arrange | positioned at the space | interval a little from the tip of the pusher 10. FIG.

This package P is seated on the setting block 60.

The cam body 14 is fixed to the lower part of the said transfer block 12, and the front end of this cam body 14 has the convex inclination part 14 '.

The roller 16 which abuts on this cam body 14 is made to move up and down alternately with the driven roller 19 of the other end about the center piece 17. As shown in FIG.

Both rollers 16 and 19 are attached to both ends of the actuating lever 18 bent approximately at the letter A to rotate.

In addition, a driving means for operating the cam body 14 is located below the cam body 14.

These drive means, shown in more detail in FIGS. 2 and 3, consist of a rack 74 that engages a pinion 71 connected to an upper portion of the shaft 73 of the rotary cylinder 70. Reference numeral 76 denotes a connecting body connecting the rack 74 and the cam body 14. Reference numeral 77 denotes a warming beam for conveying the package P.

The setting block 60 is to repeat the lifting and lowering operation by the driven roller 19 coupled through the operation hole 62, but to ensure a more certain down state of the setting block 60, the compression spring ( 64) is installing.

Reference numeral 72 is a panel for installing the components, 13 'is a ball bearing for the smooth operation of the guide rod (13).

In addition, in FIG. 2, the tube T is set in the left part in which the apparatus of this invention is installed. The tube T is detected by the tube detecting device 80 at noon in its setting state.

Next, the effect of the present invention will be described.

In FIG. 2, when the package P placed on the working beam 77 and conveyed to the package inserting device reaches the setting position S, the setting block 60 is raised to raise the package P. Seat.

The rise of the setting block 60 is controlled according to a predetermined system sequence.

In addition, the pinion 71 connected to the upper portion of the shaft 73 of the rotation cylinder 70 by the operation of the rotation cylinder 70 rotates, the rack 71 is fitted to the pinion 71 is a straight line You exercise.

Accordingly, the transfer block 12 and the cam body 14 also move in a straight line to move the pusher 10 and the guide rod 13 forward.

On the other hand, the operation lever 18 rotates about the center pin 17 to cause the lifting operation of the setting block 60.

That is, when the cam body 14 moves in the direction of the arrow, the roller 16 installed at one side end of the operating lever 18 moves up the inclined portion 16 '. Then, the operation lever 18 rotates about the center pin 17 to lower the driven roller 19 installed at the other end.

In addition, if the rotation cylinder 70 is rotated in the opposite direction to operate in reverse to the above, just before the setting block 60 is raised, the package (P) is located in the setting position (S), the setting As the block 60 is pushed up to push the pusher 10, the package P to be inserted is inserted into the tube T. In FIG. 2, reference numeral 15 denotes a member supporting the guide rod 13, and reference numeral 68 denotes a rail supporting the guide rod 13 and supporting the setting block 60.

As described above, according to the apparatus for inserting a semiconductor package into a tube, various processes can be completed by smoothly inserting individual packages into the tube in the process of discharging the processed semiconductor assembly (package). One semiconductor assembly can be protected.

Claims (5)

A package inserting device having a structure of a walking beam and a structure which is placed on the walking beam, is transported and is set on a setting position to be inserted one by one into a tube, comprising: a pusher 10, drive means for driving the pusher 10, and A device for inserting a semiconductor package into a tube, characterized in that it comprises an operating lever (18) for raising and lowering the setting block (60) in association with the operation of the driving means, and a panel (72) for supporting these components. The semiconductor package of claim 1, wherein guide rods 13 are additionally installed at both sides of the pusher 10, and upper and lower guide rods 13 to ensure smooth movement of the pushers 19. Device. 2. The pinion (71) according to claim 1, wherein the driving means has a rotation cylinder (70) provided in the panel (72) and a pinion (71) connected to the shaft (73) of the rotation cylinder (70). ) And a rack 74 adapted to fit the pinion 71, a cam body 14 having an inclined portion 14 ', and a feed block 12 connected to the cam body 14, Device for inserting the semiconductor package into the tube. 2. The semiconductor device according to claim 1, wherein the actuating lever (18) comprises rollers (16) and (19) rotatably installed at both ends thereof, and a center pin (17) provided at an intermediate portion thereof. Device for inserting a package into a tube. The actuating structure of claim 1, wherein the linkage between the setting block (60) and the actuating lever (18) comprises an actuating hole (62) formed in the actuating block (60) and an actuating lever embedded in the actuating hole (62). An apparatus for inserting a semiconductor package into a tube, characterized by consisting of one side roller (19) of (18).