KR100707095B1 - Device for manufacturing semiconductor package and method for manufacturing the same - Google Patents

Device for manufacturing semiconductor package and method for manufacturing the same Download PDF

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KR100707095B1
KR100707095B1 KR1020010014138A KR20010014138A KR100707095B1 KR 100707095 B1 KR100707095 B1 KR 100707095B1 KR 1020010014138 A KR1020010014138 A KR 1020010014138A KR 20010014138 A KR20010014138 A KR 20010014138A KR 100707095 B1 KR100707095 B1 KR 100707095B1
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semiconductor package
lower guide
guide rail
singulation
scrubbing means
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KR1020010014138A
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Korean (ko)
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KR20020074277A (en
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김영헌
장철영
류창균
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앰코 테크놀로지 코리아 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
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    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

본 발명은 반도체 패키지의 싱귤레이션 장치에서 스트립 단위의 반도체 패키지가 최초 유입되는 도입부에 연재질의 스크러빙 수단을 설치하여, 싱귤레이션을 위하여 유입되는 반도체 패키지의 솔더볼을 상기 스크러빙 수단이 자동으로 문질러 줌으로써, 기존에 수작업으로 검사하던 방식을 배제하여 반도체 패키지의 싱귤레이션 공정 바로 전에 솔더볼의 융착상태를 자동으로 검사할 수 있도록 한 반도체 패키지 제조 장치 및 그 방법을 제공하고자 한 것이다.
According to the present invention, a scrubbing means is installed in the introduction part of a semiconductor package in a strip unit in which a strip unit is first introduced, and the scrubbing means automatically rubs solder balls of a semiconductor package introduced for singulation. The present invention provides a semiconductor package manufacturing apparatus and a method for automatically inspecting a solder ball fusion state immediately before a singulation process of a semiconductor package, excluding a manual inspection method.

솔더볼, 반도체 패키지, 스크러빙 수단, 싱귤레이션, 융착상태 검사Solder ball, semiconductor package, scrubbing means, singulation, weld inspection

Description

반도체 패키지 제조 장치 및 그 방법{Device for manufacturing semiconductor package and method for manufacturing the same} Device for manufacturing semiconductor package and method for manufacturing the same             

도 1a,1b,1c,1d는 본 발명에 따른 반도체 패키지 제조 장치의 일실시예를 나타내는 정면도로서, 이 제조 장치에 볼 스크러빙 수단이 고정되게 설치된 상태와, 그 작동 상태를 순서대로 나타낸 도면이다.1A, 1B, 1C, and 1D are front views showing one embodiment of a semiconductor package manufacturing apparatus according to the present invention, in which a ball scrubbing means is fixedly installed in the manufacturing apparatus, and an operation state thereof is sequentially shown.

도 2a,2b,2c,2d는 본 발명에 따른 반도체 패키지 제조장치의 다른 실시예를 나타내는 정면도로서, 이 제조 장치에 솔더볼 스크러빙 수단이 반도체 패키지의 이송방향을 따라 이송 가능하게 설치된 상태와, 그 작동 상태를 나타낸 도면이다.Figure 2a, 2b, 2c, 2d is a front view showing another embodiment of the semiconductor package manufacturing apparatus according to the present invention, the solder ball scrubbing means is installed in this manufacturing apparatus to be transported along the transfer direction of the semiconductor package, and its operation It is a figure which shows the state.

도 3은 본 발명에 따른 솔더볼 스크러빙 수단을 반도체 패키지의 이송방향을 따라 이송시키는 수단을 나타내는 개략도,Figure 3 is a schematic diagram showing a means for transferring the solder ball scrubbing means in accordance with the transfer direction of the semiconductor package,

도 4는 본 발명에 따른 반도체 패키지 제조 장치에 솔더볼 스크러빙 수단이 설치된 상태를 나타내는 일측면도,4 is a side view showing a state in which a solder ball scrubbing means is installed in a semiconductor package manufacturing apparatus according to the present invention;

도 5a,5b는 본 발명에 따른 반도체 패키지 제조 장치의 솔더볼 스크러빙 수단에 반도체 패키지의 솔더볼이 슬라이드 접촉되어, 그 부착상태를 검사하는 상태를 나타내는 요부 확대도 및 저면도.5A and 5B are main parts enlarged views and bottom views showing a state in which a solder ball of a semiconductor package is in sliding contact with a solder ball scrubbing means of a semiconductor package manufacturing apparatus according to the present invention, and the adhesion state thereof is examined;

도 6는 본 발명의 반도체 패키지 제조 장치에 적용되는 반도체 패키지의 일 종으로서, BGA 타입의 반도체 패키지를 나타내는 단면도.6 is a cross-sectional view illustrating a BGA type semiconductor package as one kind of semiconductor package applied to the semiconductor package manufacturing apparatus of the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

10 : 반도체 패키지 12 : 솔더볼(Solder ball)10 semiconductor package 12 solder ball

14 : 상부 가이드레일(Guide rail) 16 : 하부 가이드레일14: upper guide rail 16: lower guide rail

18 : 피딩툴 (Feeding tool) 20 : 펀칭툴18: Feeding tool 20: Punching tool

22 : 슬라이드 홀 23 : 슬라이드 홈22: slide hole 23: slide groove

24 : 피딩용 홀 26 : 핀24: Feeding hole 26: Pin

27 : 핀홀 28 : 정역모터27: pinhole 28: stationary motor

30 : 피니언(Pinion) 32 : 랙(Rack)30: Pinion 32: Rack

34 : 받침툴 40 : 센서34: support tool 40: sensor

100 : 스크러빙(Scrubbing)수단
100: scrubbing means

본 발명은 반도체 패키지 제조 장치 및 그 방법에 관한 것으로서, 더욱 상세하게는 스트립 형태로 제조된 반도체 패키지의 솔더볼에 대한 그 융착상태를 자동으로 검사할 수 있도록 한 반도체 패키지 제조 장치 및 그 방법에 관한 것이다.The present invention relates to a semiconductor package manufacturing apparatus and a method thereof, and more particularly, to a semiconductor package manufacturing apparatus and method for automatically inspecting the fusion state of the solder ball of the semiconductor package manufactured in the form of a strip. .

통상적으로 반도체 패키지는 반도체 칩의 각종 전기적인 신호를 외부로 용이하게 인출시키기 위하여 반도체 칩을 패키징하는 기술로서, 최근에는 입출력단자 수를 증대시킨 구조, 칩의 크기에 가깝게 패키지의 크기를 축소한 구조, 열방출 능력 및 전기적 수행능력을 향상시켜 제품의 신뢰성을 높일 수 있는 구조등 그 성능을 향상시킬 수 있도록 다양한 구조로 제조되고 있다.In general, a semiconductor package is a technology for packaging a semiconductor chip in order to easily draw various electrical signals of the semiconductor chip to the outside. Recently, a structure in which the number of input / output terminals is increased and the size of the package is reduced to be close to the size of the chip. In addition, it is manufactured in various structures to improve its performance, such as a structure that can improve the reliability of the product by improving heat dissipation ability and electrical performance.

특히, 리드프레임을 이용한 반도체 패키지보다 그 입출력 단자수를 크게 증가시킨 구조로서, 인쇄회로기판(PCB:Printed Circuit Board) 또는 회로필름과 같은 부재를 이용하여, 소위 BGA(Ball Grid Array) 타입의 반도체 패키지가 제조되고 있는데, 그 구조와 제조방법을 설명하면 다음과 같다.In particular, as a structure in which the number of input / output terminals is greatly increased than a semiconductor package using a lead frame, a so-called BGA (Ball Grid Array) type semiconductor is formed by using a member such as a printed circuit board (PCB) or circuit film. The package is manufactured, the structure and manufacturing method will be described as follows.

인쇄회로기판 또는 회로필름과 같은 부재를 이용한 BGA 타입의 반도체 패키지는 공통적으로 다수개의 반도체 패키지 영역이 스트립 형태로 배열된 부재(40)를 제공하는 단계와; 부재(40)의 각 칩탑재영역에 반도체 칩(42)을 부착하는 공정과; 부재(40)상에 식각 처리된 와이어 본딩용 전도성패턴과, 상기 반도체 칩(42)의 본딩패드간을 와이어(44)로 본딩하는 공정과; 상기 부재(40)의 몰딩영역에 수지(46)를 공급하여 상기 반도체 칩(42)과 와이어(44)등을 몰딩하는 공정과; 상기 부재(40)상에 식각 처리된 전도성패턴이 저면으로 노출되어 형성된 볼랜드(48)에 솔더볼(12)과 같은 구형 인출단자를 융착시키는 공정과; 상기 부재(40)의 각 반도체 패키지 영역의 라인을 펀칭수단으로 펀칭하여, 낱개의 반도체 패키지로 분리되도록 한 싱귤레이션 공정등을 경유시킴으로써, 첨부한 도 6에 도시한 바와 같이 일면에 다수의 솔더볼(12)이 융착되어 입출력 단자수를 크게 증대시킨 BGA타입의 반도체 패키지(10)로 제조되어진다.A BGA type semiconductor package using a member such as a printed circuit board or a circuit film includes the steps of providing a member 40 having a plurality of semiconductor package regions arranged in a strip form in common; Attaching the semiconductor chip 42 to each chip mounting region of the member 40; Bonding a conductive pattern for wire bonding etched on the member 40 and a bonding pad of the semiconductor chip 42 with a wire 44; Supplying a resin (46) to the molding region of the member (40) to mold the semiconductor chip (42) and the wire (44); Fusing a spherical lead terminal such as a solder ball 12 to the ball land 48 formed by exposing the conductive pattern etched on the member 40 to the bottom surface; A plurality of solder balls are formed on one surface of the member 40 by punching a line of each semiconductor package region by a punching means, and through a singulation process to separate the semiconductor packages into individual semiconductor packages. 12) is fabricated into a BGA type semiconductor package 10 in which the number of input / output terminals is greatly increased.

이때, 후공정 중의 하나로서 상기 BGA 반도체 패키지의 일면에 등간격의 배 열로 융착되어 입출력 단자 역할을 하는 다수의 솔더볼이 제대로 융착되어 있는지를 검사하여, 반도체 패키지 제품의 최종 신뢰성을 검사하게 되는데, 종래의 검사 방법은 다음과 같다.At this time, as one of the post-processes, it is inspected whether a plurality of solder balls that are fused at equal intervals on one surface of the BGA semiconductor package and serve as input / output terminals are properly fused to inspect final reliability of the semiconductor package product. The test method is as follows.

종래에 상기 솔더볼의 융착상태를 검사하는 방법은 BGA 반도체 패키지의 일면에 융착된 다수의 솔더볼을 작업자가 직접 손이나 충격을 주지 않는 공구수단 등을 이용하여 소정의 힘으로 밀어보는 방법을 시행하고 있다.Conventionally, the method of inspecting the welding state of the solder ball is a method of pushing a plurality of solder balls fused to one surface of the BGA semiconductor package with a predetermined force by using a tool means that does not directly impact the hand or impact. .

이렇게 솔더볼을 밀어 보았을 때, 융착되어 있던 솔더볼이 반도체 패키지로부터 단락되면 패키지의 불량으로 판단하게 된다.When the solder balls are pushed in this way, if the welded solder balls are shorted from the semiconductor package, it is determined that the package is defective.

이러한 종래의 방법은 이미 개개의 단위로 싱귤레이션된 반도체 패키지를 하나씩 일일이 검사함에 따라, 검사시간이 오래 걸려서 작업성을 크게 떨어뜨리게 되고, 또한 검사인원이 많이 투입되어 인건비등의 제조비용 상승을 초래하는 단점이 있으며, 특히 개개의 반도체 패키지를 일일히 수작업으로 검사하다 보면, 솔더볼의 융착 상태를 정확하게 검사하지 못하게 되는 단점이 있다.
In this conventional method, the semiconductor packages that have already been singulated into individual units are inspected one by one, which greatly reduces the workability due to the long inspection time, and also increases the production cost such as labor costs due to a large amount of inspection personnel. In particular, when manually inspecting each semiconductor package by hand, there is a disadvantage in that the welding state of the solder ball cannot be accurately inspected.

본 발명은 상기와 같은 점을 해결하기 위하여 안출한 것으로서, 반도체 패키지의 싱귤레이션 장치에서 스트립 단위의 반도체 패키지가 최초 유입되는 도입부에 연재질의 스크러빙 수단을 설치하여, 싱귤레이션을 위하여 유입되는 반도체 패키지의 솔더볼을 상기 스크러빙 수단이 자동으로 문질러 줌으로써, 별도의 공정 추가없이 반도체 패키지의 싱귤레이션 공정 바로 전에 솔더볼의 융착상태를 자동으로 검 사할 수 있도록 한 반도체 패키지 제조 장치 및 그 방법을 제공하는데 그 안출의 목적이 있는 것이다.
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and in the singulation device of a semiconductor package, a scrubbing means of a soft material is installed at an introduction portion at which a semiconductor package in a strip unit is introduced for the first time. The present invention provides a semiconductor package manufacturing apparatus and a method for automatically inspecting a solder ball fusion state immediately before a singulation process of a semiconductor package without additional process by rubbing solder balls automatically. Is there.

이하, 본 발명을 첨부도면을 참조로 설명하면 다음과 같다.Hereinafter, the present invention will be described with reference to the accompanying drawings.

상기한 목적을 달성하기 위한 본 발명의 장치는:The apparatus of the present invention for achieving the above object is:

도입부와 싱귤레이션 영역으로 나누어진 상부 및 하부 가이드 레일(14),(16)과, 상기 상부 및 하부 가이드레일(14),(16)의 도입부로 최초 유입된 스트립 단위의 반도체 패키지(10)를 싱귤레이션 영역으로 이송시키는 피딩툴(18)을 포함하는 반도체 패키지의 제조 장치에 있어서, Upper and lower guide rails 14 and 16 divided into an inlet and a singulation region, and a semiconductor package 10 in a strip unit first introduced into the inlet of the upper and lower guide rails 14 and 16. In the apparatus for manufacturing a semiconductor package comprising a feeding tool 18 for transferring to a singulation region,

상기 하부 가이드레일(16)에 상기 반도체 패키지(10)의 일면에 융착된 솔더볼(12)을 문질러줄 수 있는 높이로 연재질의 스크러빙 수단(100)을 고정되게 설치하여서 된 것을 특징으로 한다.The lower guide rail 16 is characterized in that it is fixed to install the scrubbing means 100 of the soft material to a height capable of rubbing the solder ball 12 fused to one surface of the semiconductor package 10.

바람직한 구현예로서, 상기 스크러빙 수단(100)을 하부 가이드레일(16)의 바로 아래쪽에 좌우로 이송 가능하게 설치할 수 있는 것을 특징으로 한다.In a preferred embodiment, the scrubbing means 100 is characterized in that it can be installed to be transported from side to side immediately below the lower guide rail (16).

특히, 상기 스크러빙 수단(100)을 좌우로 이송시키는 수단은 정역회전을 하는 구동수단과, 이 구동수단의 축에 회전 가능하게 장착된 피니언(30)과, 상기 스크러빙 수단(100)이 고정되게 장착되고 상기 피니언(30)에 맞물리며 직선 운동하는 랙(32)으로 구성된 것을 특징으로 한다.In particular, the means for conveying the scrubbing means 100 to the left and right are driven means for forward and reverse rotation, the pinion (30) rotatably mounted on the axis of the drive means, and the scrubbing means 100 is fixedly mounted And it is characterized in that the rack 32 is engaged with the pinion (30) and linearly move.

상기한 목적을 달성하기 위한 본 발명의 방법은: The method of the present invention for achieving the above object is:                     

싱귤레이션 장치의 상부 및 하부 가이드레일(14),(16)의 도입부로 스트립 단위의 반도체 패키지(10)가 최초 유입되는 단계와; 상기 도입부로부터 상기 반도체 패키지(10)가 상부 및 하부 가이드레일(14),(16)의 싱귤레이션 영역으로 이송되어 낱개의 단위로 싱귤레이션되는 단계를 포함하는 반도체 패키지 제조 방법에 있어서,Firstly introducing the semiconductor package 10 in a strip unit into the introduction portions of the upper and lower guide rails 14 and 16 of the singulation device; In the semiconductor package manufacturing method comprising the step of transferring the semiconductor package 10 from the introduction portion to the singulation region of the upper and lower guide rails (14, 16) by singulation unit,

상기 반도체 패키지(10)가 싱귤레이션 영역으로 이송되기 전에, 상기 싱귤레이션 장치의 하부 가이드레일(16)에 설치된 연재질의 스크러빙 수단(100)이 반도체 패키지(10)의 일면에 융착된 솔더볼(12)을 자동으로 문질러주어 달성되는 솔더볼(12)의 융착상태 검사 단계가 더 진행되는 것을 특징으로 한다.Before the semiconductor package 10 is transferred to the singulation region, the solder ball 12 in which the soft scrubbing means 100 installed on the lower guide rail 16 of the singulation apparatus is fused to one surface of the semiconductor package 10 is fused. It is characterized in that the fusion state inspection step of the solder ball 12 is achieved by rubbing automatically.

여기서 본 발명의 바람직한 실시예를 첨부도면을 참조로 더욱 상세하게 설명하면 다음과 같다.Hereinafter, the preferred embodiment of the present invention will be described in more detail with reference to the accompanying drawings.

첨부한 도 1a,1b,1c,1d는 본 발명에 따른 반도체 패키지 제조 장치의 일실시예를 나타내는 정면도로서, 상기 솔더볼 스크러빙 수단(100)이 고정되게 설치된 상태를 나타낸다.1A, 1B, 1C, and 1D are front views illustrating an embodiment of a semiconductor package manufacturing apparatus according to the present invention, and show a state in which the solder ball scrubbing means 100 is fixedly installed.

상기 반도체 패키지 제조장치는 칩 부착 공정과, 와이어 본딩공정과, 몰딩공정과, 솔더볼 융착 공정등의 주요공정이 완료된 스트립 단위의 반도체 패키지(10)를 낱개의 단위로 싱귤레이션하는 장치로서, 이 장치에는 상부 가이드레일(14)과 하부 가이드레일(16)이 소정의 간격을 유지하며 상하로 배치되어 있다.The semiconductor package manufacturing apparatus is a device for singulating the semiconductor package 10 in a strip unit in which main processes such as chip attaching process, wire bonding process, molding process, and solder ball fusion process have been completed. The upper guide rail 14 and the lower guide rail 16 are arranged up and down while maintaining a predetermined interval.

이때, 상기 상부 가이드레일(14)과 하부 가이드레일(16)의 상하 간격은 첨부한 도 4에 도시한 바와 같이, 스트립 단위의 반도체 패키지(10)의 양측단이 삽입되 어 이송되는 피딩(feeding)용 홀(24)로 형성된다.At this time, the upper and lower intervals of the upper guide rail 14 and the lower guide rail 16, as shown in the accompanying Figure 4, the feed side (feeding) is inserted and transported at both ends of the semiconductor package 10 of the strip unit ) Is formed as a hole 24.

특히, 상기 상부 가이드레일(14)과 하부 가이드레일(16)은 상기 반도체 패키지(10)가 유입되는 도입부와 싱귤레이션 영역으로 나누어지는데, 상기 도입부는 스트립 단위의 반도체 패키지(10)가 최초 유입되는 부분이고, 싱귤레이션 영역은 도입부로부터 반도체 패키지(10)가 상기 피딩용 홀(24)을 따라 이송되어 낱개의 단위로 싱귤레이션되는 영역이다.In particular, the upper guide rail 14 and the lower guide rail 16 are divided into an introduction portion and a singulation region into which the semiconductor package 10 is introduced, and the introduction portion is formed by the first introduction of the semiconductor package 10 in a strip unit. The singulation region is a region in which the semiconductor package 10 is transferred from the introduction portion along the feeding hole 24 and singulated in individual units.

상기 도입부에 해당하는 상부 가이드레일(14) 및 하부 가이드레일(16)에는 그 길이방향을 따라서 각각 슬라이드 홀(22)과 슬라이드 홈(23)이 상하로 일치되며 길다랗게 형성된다.In the upper guide rail 14 and the lower guide rail 16 corresponding to the introduction portion, the slide holes 22 and the slide grooves 23 are formed vertically and long along the longitudinal direction, respectively.

또한, 상기 반도체 패키지(10)의 도입부에 해당하는 상부 가이드 레일(14)의 위쪽에는 두 개의 핀(30)이 저면에 일체로 형성된 피딩툴(18)이 상하 이동 가능하게 배치되어 있고, 상기 싱귤레이션 영역에 해당하는 상부 가이드레일(14)의 위쪽에는 X축 및 Y축용 펀칭툴(20)이 상하로 이동 가능하게 배치되어 있으며, 상기 싱귤레이션 영역에 해당하는 하부 가이드레일(16)의 아래쪽에는 지지 역할을 하는 받침툴(34)이 배치되어 있다.In addition, a feeding tool 18 having two pins 30 integrally formed on the bottom thereof is disposed above the upper guide rail 14 corresponding to the introduction portion of the semiconductor package 10 to move upward and downward. On the upper side of the upper guide rail 14 corresponding to the ration area, the punching tools 20 for the X and Y axes are arranged to be movable upward and downward, and on the lower side of the lower guide rail 16 corresponding to the singulation area. A support tool 34 serving as a support is disposed.

여기서, 상기 반도체 패키지(10)의 도입부의 끝단부(싱귤레이션 영역과 바로 인접한 부분)에 해당하는 하부 가이드레일(16)에 고무(Rubber)와 같은 연재질의 스크러빙 수단(100)이 고정되게 설치되는 바, 상기 스크러빙 수단(100)은 상단 끝부분이 둔각을 갖도록 처리된 막대 형태로서, 그 길이는 반도체 패키지(10)의 일면에 융착된 솔더볼(12)의 배열폭보다 다소 큰 길이를 갖는다. Here, the scrubbing means 100 of a soft material, such as rubber, is fixedly installed on the lower guide rail 16 corresponding to the end portion (the portion immediately adjacent to the singulation region) of the introduction portion of the semiconductor package 10. Bar, the scrubbing means 100 is in the form of a rod processed so that the upper end is an obtuse angle, the length of the length is somewhat larger than the array width of the solder ball 12 fused to one surface of the semiconductor package 10.                     

상기와 같은 구조로 이루어진 본 발명의 반도체 패키지 제조장치의 작동상태를 설명하면 다음과 같다.Referring to the operating state of the semiconductor package manufacturing apparatus of the present invention having the above structure as follows.

우선, 상기 스트립 단위의 반도체 패키지(10)가 상기 도입부에 해당하는 상부 가이드레일(14)과 하부 가이드레일(16) 사이의 피딩용 홀(24)로 최초 유입되면, 상기 피딩툴(18)이 자동으로 하향 이동하게 된다.First, when the semiconductor package 10 of the strip unit first flows into the feeding hole 24 between the upper guide rail 14 and the lower guide rail 16 corresponding to the introduction portion, the feeding tool 18 is It will move down automatically.

이때, 상기 반도체 패키지(10)의 유입시 그 정렬상태를 하부 가이드레일(16)의 아래쪽에 설치된 센서(40)에서 감지하게 된다.In this case, when the semiconductor package 10 flows in, the alignment state is detected by the sensor 40 installed below the lower guide rail 16.

상기와 동시에, 피딩툴(18)의 핀(26)이 상기 상부 가이드레일(14)의 슬라이드 홀(22)로 삽입되고, 연속적으로 상기 피딩용 홀(24)에 삽입되어 있는 반도체 패키지의 양측 부분(구체적으로는, 다수의 반도체 패키지가 제조되어 있는 PCB 부재의 양측 부분)에 형성된 핀홀(27)과, 하부 가이드레일(16)의 슬라이드 홈(23)에 삽입되어진다.Simultaneously with this, the pins 26 of the feeding tool 18 are inserted into the slide holes 22 of the upper guide rail 14, and both sides of the semiconductor package are continuously inserted into the feeding holes 24. Specifically, it is inserted into the pinhole 27 and the slide groove 23 of the lower guide rail 16 formed on both sides of the PCB member in which a plurality of semiconductor packages are manufactured.

이어서, 상기 피딩툴(18)이 싱귤레이션 영역쪽으로 자동 이송되는 바, 이때 피딩툴(18)의 핀(26)이 상부 가이드레일(14)의 슬라이드 홀(22)과 하부 가이드레일(16)의 슬라이드 홈(23)을 따라 슬라이드 이동을 하는 동시에, 반도체 패키지(10)가 상기 핀(26)에 이끌리면서 피딩용 홀(24)을 따라 싱귤레이션 영역으로 이송되어진다.Subsequently, the feeding tool 18 is automatically transferred to the singulation region, wherein the pin 26 of the feeding tool 18 is moved to the slide hole 22 and the lower guide rail 16 of the upper guide rail 14. At the same time as the slide moves along the slide groove 23, the semiconductor package 10 is attracted to the pin 26 and transferred to the singulation region along the feeding hole 24.

즉, 상기 피딩툴(18)의 핀(26)이 상기 반도체 패키지(10)의 양측단에 형성된 핀홀(27)에 삽입된 상태이기 때문에, 피딩툴(18)의 핀(26)이 반도체 패키지(10)를 이끌고 가는 동작이 이루어지고, 그에따라 반도체 패키지(10)가 피딩용 홀(24)을 따라 싱귤레이션 영역쪽으로 슬라이드되며 이송되는 것이다.That is, since the pins 26 of the feeding tool 18 are inserted into the pinholes 27 formed at both ends of the semiconductor package 10, the pins 26 of the feeding tool 18 are formed in the semiconductor package ( 10) is guided and the semiconductor package 10 is moved along the feeding hole 24 toward the singulation region and transported accordingly.

이때, 첨부한 도 5a 내지 5b에 도시한 바와 같이, 상기 하부 가이드레일(16)에 고정되게 장착되어 있는 솔더볼 스크러빙 수단(100)의 상단 끝부분에 상기 반도체 패키지(10)의 일면에 융착되어 있는 다수의 솔더볼(12)이 문질러지는 접촉이 이루어지게 되어, 이송중인 반도체 패키지(10)의 솔더볼(12)에 대한 융착 상태를 자동으로 검사해준다.At this time, as shown in Figure 5a to 5b, the upper end of the solder ball scrubbing means 100 is fixed to the lower guide rail 16 is fused to one surface of the semiconductor package 10 A plurality of solder balls 12 are rubbed in contact with each other, thereby automatically checking the welding state of the solder balls 12 of the semiconductor package 10 being transferred.

물론, 상기 스크러빙 수단(100)과의 접촉에 의하여 상기 반도체 패키지(10)로부터 솔더볼(12)이 단락되면, 반도체 패키지(10)의 불량으로 판단하게 된다.Of course, when the solder ball 12 is shorted from the semiconductor package 10 by contact with the scrubbing means 100, it is determined that the semiconductor package 10 is defective.

한편, 상기 싱귤레이션 영역으로 이송된 반도체 패키지(10)는 위쪽에 배치되어 있는 펀칭툴(20)에 의하여 낱개의 단위로 싱귤레이션되어, 최종 제품으로 제조 완료된다.Meanwhile, the semiconductor package 10 transferred to the singulation region is singulated in a single unit by the punching tool 20 disposed above, and is manufactured as a final product.

여기서 첨부한 도 2a,2b,2c,2d를 참조로 본 발명에 따른 반도체 패키지 제조장치의 다른 실시예를 설명하면 다음과 같다.Hereinafter, another embodiment of the semiconductor package manufacturing apparatus according to the present invention will be described with reference to FIGS. 2A, 2B, 2C, and 2D.

다른 실시예로서의 특징은 상기 솔더볼 스크러빙 수단(100)이 일실시예와 같이 하부 가이드레일(16)에 고정되게 설치되지 않고, 좌우로 이송 가능하게 설치된 것을 특징으로 한다.Another embodiment is characterized in that the solder ball scrubbing means 100 is not fixed to the lower guide rail 16 as in one embodiment, but is installed to be transported from side to side.

상기 솔더볼 스크러빙 수단(100)을 좌우로 이송시킬 수 있는 수단은 다양한 기계적 기구와 전자 제어 메카니즘을 적용하여 구현할 수 있고, 그 하나의 구현예가 첨부한 도 3에 도시되어 있다.Means for transferring the solder ball scrubbing means 100 to the left and right may be implemented by applying a variety of mechanical mechanisms and electronic control mechanism, one embodiment is shown in Figure 3 attached.

첨부한 도 3에 도시한 바와 같이, 상기 솔더볼 스크러빙 수단(100)을 좌우로 이송시킬 수 있는 수단은 정역모터(28)와 같은 구동수단과, 이 구동수단의 회전축에 일체로 장착된 피니언(30)과, 이 피니언(30)과 맞물려 직선운동을 하는 랙(32)으로 구성되고, 이때 상기 랙(32)의 상면 일끝에 상기 스크러빙 수단(100)이 고정되게 장착되어진다.As shown in FIG. 3, the means for transferring the solder ball scrubbing means 100 left and right includes a driving means such as a stationary motor 28, and a pinion 30 integrally mounted to the rotating shaft of the driving means. And a rack 32 engaged with the pinion 30 to perform a linear motion, wherein the scrubbing means 100 is fixedly mounted to one end of the upper surface of the rack 32.

여기서 다른 실시예로서의 반도체 패키지 제조장치의 작동상태를 설명하면 다음과 같다.Herein, the operating state of the semiconductor package manufacturing apparatus according to another embodiment will be described.

상기 스트립 단위의 반도체 패키지(10)가 상부 및 하부 가이드레일(14),(16) 사이의 피딩용 홀(24)로 최초 유입된 다음, 피딩툴(18)이 하향 이동하는 동시에 피딩툴(18)의 핀(26)이 상기 상부 가이드레일(14)의 슬라이드 홀(23)과, 상기 반도체 패키지(10)의 양측 부분에 형성된 핀홀(27)과, 상기 하부 가이드레일(16)의 슬라이드 홈(23)에 연속적으로 삽입된 후, 상기 정역모터(28)가 구동되어진다.The semiconductor package 10 in the strip unit first flows into the feeding hole 24 between the upper and lower guide rails 14 and 16, and then the feeding tool 18 moves downward while simultaneously feeding the feeding tool 18. Pin 26 of the upper guide rail 14, the pin hole 27 formed on both sides of the semiconductor package 10, and the slide groove of the lower guide rail (16) After successively inserted 23, the stationary motor 28 is driven.

따라서, 상기 정역모터(28)의 구동과 동시에 피니언(30)이 회전을 하게 되고, 이 피니언(30)과 맞물려 있는 랙(32)이 직선운동을 하는 동시에 랙(32)에 일체로 고정된 스크러빙 수단(100)이 일방향으로 이송되면서, 상기 반도체 패키지(10) 일면에 융착된 다수의 솔더볼(12)을 문질러주게 된다.Accordingly, the pinion 30 rotates at the same time as the stationary motor 28 is driven, and the rack 32 engaged with the pinion 30 performs linear movement and scrubbing is integrally fixed to the rack 32. As the means 100 is transferred in one direction, the plurality of solder balls 12 fused to one surface of the semiconductor package 10 are rubbed.

이와 같이, 상기 반도체 패키지(10)의 싱귤레이션이 이루어지기 바로 전에 일방향으로 이송되는 상기 스크러빙 수단(100)에 의하여 반도체 패키지(10)의 솔더볼(12) 융착상태가 자동으로 검사되어, 기존의 수작업에 의존하여 비용이 많이들고 작업성이 크게 떨어지던 점을 완전히 해결할 수 있게 된다.As such, the fusion state of the solder ball 12 of the semiconductor package 10 is automatically inspected by the scrubbing means 100 that is transferred in one direction immediately before the singulation of the semiconductor package 10 is performed. Relying on this can be a complete solution to the high cost and low workability.

한편, 상기 일방향으로 이송되었던 스크러빙 수단(100)은 정역모터(28)의 역 회전에 의하여 원위치로 이송되어, 다음 유입되는 반도체 패키지(10)의 솔더볼(12)에 대한 융착상태를 검사하게 된다.
On the other hand, the scrubbing means 100 was transferred in one direction is transferred to the original position by the reverse rotation of the forward and reverse motor 28, to examine the fusion state of the solder ball 12 of the semiconductor package 10 introduced next.

이상에서 본 바와 같이, 본 발명에 따른 반도체 패키지 제조장치 및 그 방법에 의하면, 반도체 패키지의 싱귤레이션 장치에 솔더볼 스크러빙 수단을 고정 또는 좌우로 이송 가능하게 설치하여, 반도체 패키지의 솔더볼 융착상태 검사가 반도체 패키지의 싱귤레이션이 이루어지기 바로 전에 자동으로 이루어지도록 함으로써, 기존의 수작업에 의존하여 비용이 많이들고 작업성이 크게 떨어지던 점을 완전히 해결할 수 있는 장점을 제공하게 된다.As described above, according to the semiconductor package manufacturing apparatus and the method according to the present invention, the solder ball scrubbing means is fixed to the singulation device of the semiconductor package so as to be fixed or can be transferred to the left and right, the inspection of the solder ball fusion state of the semiconductor package By doing this automatically just before the singulation of the package, it offers the advantage of being able to rely on existing manual work to completely eliminate the costly and inefficient workability.

Claims (4)

도입부와 싱귤레이션 영역으로 나누어진 상부 및 하부 가이드 레일과, 상기 상부 및 하부 가이드레일의 도입부로 최초 유입된 스트립 단위의 반도체 패키지를 싱귤레이션 영역으로 이송시키는 피딩툴을 포함하는 반도체 패키지의 제조 장치에 있어서, An upper and lower guide rail divided into an introduction portion and a singulation region, and a feeding tool for transferring a semiconductor package in a strip unit first introduced into the introduction portion of the upper and lower guide rails to a singulation region. In 상기 하부 가이드레일에 상기 반도체 패키지의 일면에 융착된 솔더볼을 문질러줄 수 있는 높이로 연재질의 스크러빙 수단을 고정되게 설치하여서 된 것을 특징으로 하는 반도체 패키지 제조 장치.And a scrubbing means of a soft material fixedly installed on the lower guide rail at a height capable of rubbing the solder balls fused to one surface of the semiconductor package. 제 1 항에 있어서, 상기 스크러빙 수단을 하부 가이드레일의 바로 아래쪽에 좌우로 이송 가능하게 설치할 수 있는 것을 특징으로 하는 반도체 패키지 제조 장치.The semiconductor package manufacturing apparatus according to claim 1, wherein the scrubbing means can be installed to be moved from side to side immediately below the lower guide rail. 제 2 항에 있어서, 상기 스크러빙 수단을 좌우로 이송시키는 수단은 정역회전을 하는 구동수단과, 이 구동수단의 축에 회전 가능하게 장착된 피니언과, 상기 스크러빙 수단이 고정되게 장착되고 상기 피니언에 맞물리며 직선 운동하는 랙으로 구성된 것을 특징으로 하는 반도체 패키지 제조 장치.3. The apparatus according to claim 2, wherein the means for conveying the scrubbing means from side to side comprises: a drive means for forward and reverse rotation, a pinion rotatably mounted on an axis of the drive means, and the scrubbing means is fixedly mounted and engaged with the pinion. An apparatus for manufacturing a semiconductor package, comprising a rack moving linearly. 싱귤레이션 장치의 상부 및 하부 가이드레일의 도입부로 스트립 단위의 반도체 패키지가 최초 유입되는 단계와; 상기 도입부로부터 상기 반도체 패키지가 상부 및 하부 가이드레일의 싱귤레이션 영역으로 이송되어 낱개의 단위로 싱귤레이션되는 단계를 포함하는 반도체 패키지 제조 방법에 있어서,Firstly introducing a semiconductor package in a strip unit into an introduction of upper and lower guide rails of the singulation device; In the semiconductor package manufacturing method comprising the step of transferring the semiconductor package from the introduction portion to the singulation region of the upper and lower guide rail singly by a single unit, 상기 반도체 패키지가 싱귤레이션 영역으로 이송되기 전에, 상기 싱귤레이션 장치의 하부 가이드레일에 설치된 연재질의 스크러빙 수단이 반도체 패키지의 일면에 융착된 솔더볼을 자동으로 문질러주어 달성되는 솔더볼의 융착상태 검사 단계가 더 진행되는 것을 특징으로 하는 반도체 패키지 제조 방법.Before the semiconductor package is transferred to the singulation region, the step of inspecting the welding state of the solder ball, which is achieved by a soft scrubbing means installed on the lower guide rail of the singulation device, automatically rubs the solder ball bonded to one surface of the semiconductor package. The semiconductor package manufacturing method characterized by the above-mentioned.
KR1020010014138A 2001-03-19 2001-03-19 Device for manufacturing semiconductor package and method for manufacturing the same KR100707095B1 (en)

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KR19990016803A (en) * 1997-08-20 1999-03-15 황인길 Inspection part of inspection system for BGA semiconductor package
JP2000065892A (en) * 1998-06-12 2000-03-03 Machine Active Contact:Kk Jig for continuity inspection
KR20000045948A (en) * 1998-12-30 2000-07-25 마이클 디. 오브라이언 Apparatus and method for testing semiconductor package

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Publication number Priority date Publication date Assignee Title
KR19990016803A (en) * 1997-08-20 1999-03-15 황인길 Inspection part of inspection system for BGA semiconductor package
JP2000065892A (en) * 1998-06-12 2000-03-03 Machine Active Contact:Kk Jig for continuity inspection
KR20000045948A (en) * 1998-12-30 2000-07-25 마이클 디. 오브라이언 Apparatus and method for testing semiconductor package

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