201236096 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種叢集式LED晶片之檢測系統，尤指 一種用以檢驗叢集式LED晶片之工作狀態之檢測系統。 【先前技術】 隨著發光二極體(Light Emitting Diode ; LED)技術的成 熟，LED已經被廣泛的使用在照明領域中，而為了提供更 多樣化的照明方式，集中複數顆LED於單一晶片上的叢集 式LED晶片也受到許多廠商的重視。 然而相較於只具有單一 LED單元之LED晶片，叢集 式led晶片在檢測上一直存在有盲點，請參照第一圖，第 一圖係為叢集式LED晶片之示意圖，一個叢集式LED晶 片1〇〇會包括複數個LED單元11，當叢集式LED晶片100 中有少數LED單元11異常時，可能會造成叢集式led晶 片1 〇0於點冗k有部份區域骨度較低，而習知技術中所使 用的電性檢測方式’會有相當大的機率檢測不出這樣的異 常狀况，這是因為少數LED單元11異常可能只會導致總 電流非常微量的下降’並且使得總電流落在檢測的合格範 圍之内。 除此之外，習知技術也會利用光譜儀來檢測LED晶片 的光學特性’然而這樣的光學檢測僅能檢查叢集式LED晶 片發出光線之整體顏色及亮度是否正確，仍舊無法檢 測出叢集式LED晶片100上小範圍的暗區。 201236096 【發明内容】 本發明所欲解決之技術問題與目的： 緣此，本發明之主要目的係提供一種用以檢驗叢集式 LED晶片之工作狀悲之檢測糸統以及檢測方法’該檢測糸 統與檢測方法能夠檢測叢集式L E D晶片於點亮時之工作狀 態，以判別叢集式LED晶片實際使用時是否有缺陷。 • 本發明解決問題之技術手段： 一種叢集式LED晶片之檢測系統，係用以檢測一叢集 式LED晶片之工作狀態，該檢測系統係包含承載單元、電 源供應器以及光學檢測機；承載單元係用以承載該叢集式 LED晶片；電源供應器係用以提供該叢集式LED晶片一額 定工作電流，藉以使該叢集式LED晶片發出一工作光束； 光學檢測機係用以接收該工作光束，並據以判斷該工作狀 態。 ® 於本發明之一較佳實施例中，該光學檢測機係為一自 動光學檢測機（Automated Optical Inspection ; Α0Ι)。 於本發明之一較佳實施例中，該光學檢測機係包含影 像擷取單元與判斷單元，影像擷取單元係用以接收該工作 光束以得到一工作影像，並發送該工作影像；判斷單元係 用以自該影像擷取單元接收該工作影像，並據以判斷該工 作狀態；而此實施例中之較佳者，該判斷單元可以為一工 業電腦。 4 201236096 於本發明之一較佳實施例中，該判斷單元係將該工作 影像區分為複數個比對區間，並對該些比對區間之亮度進 行判別。 於本發明之一較佳實施例中，叢集式LED晶片之檢測 系統更可以包含一衰減片，該衰減片係設置於該光學檢測 機之前，藉以衰減該工作光束。 於本發明之一較佳實施例中，叢集式LED晶片之檢測 系統更可以包含一電流調整單元，該電流調整單元係電性 • 連結於該電源供應器與該叢集式LED晶片之間，藉以調整 該額定工作電流。 本發明更揭露一種叢集式LED晶片之檢測方法，係包 含以下步驟：（a)提供一額定工作電流至一叢集式LED晶 片，藉以使該叢集式LED晶片發出一工作光束；（b)以一光 學檢測機接收該工作光束，以得到一工作影像；（c)利用該 光學檢測機對該工作影像進行判別，以得到一工作狀態。 •本發明對照先前技術之功效： 相較於習知利用電性或光譜儀檢測叢集式LED晶片之 檢測方式，本發明之叢集式LED晶片之檢測系統與檢測方 法能夠於叢集式LED晶片點亮時，判別出叢集式LED晶 片是否有不正常之暗區產生，因此能夠有效提昇檢測叢集 式LED晶片之可靠度。 本發明所採用的具體實施例，將藉由以下之實施例及 圖式作進一步之說明。 201236096 【實施方式】 本發明係關於一種叢集式LED晶片之檢測系統，尤指 一種用以檢驗叢集式LED晶片之工作狀態之檢測系統。以 下茲列舉一較佳實施例以說明本發明，然熟習此項技藝者 皆知此僅為一舉例，而並非用以限定發明本身。有關此較 佳實施例之内容詳述如下。 請參閱第二圖與第三圖，第二圖係為本發明之檢測系 統之第一較佳實施例示意圖，第三圖係為本發明之檢測系 • 統之第二較佳實施例示意圖。本發明之叢集式LED晶片 100之檢測系統，係用以檢測一叢集式LED晶片100之工 作狀態，該檢測系統係包含承載單元21、電源供應器22 以及光學檢測機23。 承載單元21係用以承載該叢集式LED晶片100;電源 供應器22係用以提供該叢集式LED晶片100 —額定工作 電流，藉以使該叢集式LED晶片100發出一工作光束。 光學檢測機23係用以接收該工作光束，並據以判斷該 ® 工作狀態；其中，於本實施例之一較佳實施例，光學檢測 機可以是一自動光學檢測機（Automated Optical Inspection ; AOI)，然而在習知技術中，Α0Ι機台是用以檢 測待測物之外觀是否有瑕疵，其檢測方式是以外置光源照 亮待測物，其後再判斷待測物之表面是否有瑕疵，Α0Ι機 台之優點在於檢測外觀時能夠同時判斷瑕疵之位置，然而 若待測物外觀之亮度太高，Α0Ι機台就無法正確判斷待測 物外觀是否有瑕疵以及瑕疵之位置。 201236096 因此若使用Α0Ι機台作為本發明中之光學檢測機23， 那麼於本實施例中之較佳者，檢測系統可以更包含一衰減 片24，該衰減片24係設置於該光學檢測機23之前，藉以 衰減該工作光束；又或者檢測系統可以包含一電流調整單 元25，該電流調整單元25係電性連結於該電源供應器22 與該叢集式LED晶片100之間，藉以調整該額定工作電 流；上述兩種方式都可以降低光學檢測機23所接收到之光 線之亮度，以使光學檢測機23能夠正確無誤的判斷出叢集 • 式LED晶片100之工作狀態。 為了讓檢測的效率更高，衰減片24可以是由至少一個 衰減濾鏡所構成，並針對一或複數個波長之光線進行過 濾，而最理想之狀況是讓光學檢測機23於叢集式LED晶 片100正常工作時所接收之光線亮度差異小於1%，且光學 檢測機23接收工作光束所需之曝光時間能夠控制在5ms之 内，而當叢集式LED晶片100有暗區產生時，暗區之亮度 僅有正常亮度之10%〜80%;若是使用電流調整單元25來降 ® 低工作光束之亮度，將額定工作電流調低為原有的50%， 那麼工作光束之亮度就會降低至60%，因此額定工作電流 調低的幅度必須讓光學檢測機23所需之曝光時間能夠控 制在5ms之内較為理想。 請參閱第四圖，第四圖係為工作影像之分區比對示意 圖。於本實施例中之較佳者，光學檢測機23可以是包含影 像擷取單元231與判斷單元232，影像擷取單元231係用 以接收該工作光束以得到一工作影像P1，並發送該工作影 201236096 像PI，判斷單元232係用以自該影像擷取單元231接收該 工作影像P1，並據以判斷該工作狀態；而於本實施例中之 較佳者，判斷單元可以是一工業電腦；此外，該判斷單元 232可以將該工作影像P1區分為複數個比對區間Z1與 Z2，並對該些比對區間Z1與Z2之亮度進行判別，即可得 知叢集式LED晶片100是否有暗區產生；要強調的是，比 對區間Z1與Z2可以依照叢集式LED晶片100上LED單 元11之分佈位置做設計，但當然也可以是以任意形狀與大 • 小做設計。 請同時參閱第五圖，第五圖係為本發明之檢測方法流 程圖。本發明之叢集式LED晶片之檢測方法係包含以下步 驟： S101 :點亮叢集式LED晶片100,使叢集式LED晶片 100發射工作光束； S103 :當光學檢測機23是AOI機台時，可以透過衰 減片24衰減工作光束，或是透過電流調整單元25降低額 ® 定工作電流，藉以降低光學檢測機23所接收到之光線強 度； S105 :光學檢測機23接收叢集式LED晶片100所發 出之工作光束；以及 S107:光學檢測機23接收到工作光束之後得到工作影 像IM，並對工作影像P1進行判別。 相較於習知利用電性或光譜儀檢測叢集式LED晶片 100之檢測方式，本發明之叢集式LED晶片100之檢測系 201236096 統與檢測方法能夠於叢集式LED晶片100點亮時，判別出 叢集式LED晶片100是否有不正常之暗區產生，且若應用 AOI機台於本發明之檢測系統與檢測方法中，亦可以克服 習知AOI機台僅能檢測被動發光之待測物之缺點，綜合以 上優點，可知本發明能夠非常有效的提昇檢測叢集式LED 晶片100之可靠度。 藉由以上較佳具體實施例之詳述，係希望能更加清楚 描述本發明之特徵與精神，而並非以上述所揭露的較佳具 • 體實施例來對本發明之範疇加以限制。相反地，其目的是 希望能涵蓋各種改變及具相等性的安排於本發明所欲申請 之專利範圍的範_内。 【圖式簡單說明】 第一圖係為叢集式LED晶片之示意圖； 第二圖係為本發明之檢測系統之第一較佳實施例示意 圖； ® 第三圖係為本發明之檢測系統之第二較佳實施例示意 圖； 第四圖係為工作影像之分區比對示意圖；以及 第五圖係為本發明之檢測方法流程圖。 【主要元件符號說明】 叢集式LED晶片100 LED單元11 201236096 承載單元21 電源供應器22 光學檢測機23 影像擷取單元231 判斷單元232 衰減片24 電流調整單元25 工作影像P1 比對區間Zl、Z2 檢測方法流程圖S101〜S107201236096 VI. Description of the Invention: [Technical Field] The present invention relates to a detection system for a cluster LED chip, and more particularly to a detection system for inspecting the operational state of a cluster LED chip. [Prior Art] With the maturity of Light Emitting Diode (LED) technology, LEDs have been widely used in the field of illumination, and in order to provide a more diverse illumination method, a plurality of LEDs are concentrated on a single chip. The clustered LED chips on the top are also valued by many manufacturers. However, compared with LED chips with only a single LED unit, there is always a blind spot in the detection of cluster LED chips. Please refer to the first figure. The first picture is a schematic diagram of a cluster LED chip, a cluster LED chip. The plurality of LED units 11 may be included. When a small number of LED units 11 in the cluster LED chip 100 are abnormal, the clustered LED chip 1 〇0 may have a lower bone density in a part of the area. The electrical detection method used in the technology 'has a considerable probability of not detecting such an abnormal condition, because a few LED unit 11 abnormalities may only cause a very small drop in the total current' and cause the total current to fall on Within the qualified range of testing. In addition, conventional techniques also use spectrometers to detect the optical properties of LED wafers. However, such optical inspections can only check whether the overall color and brightness of the light emitted by the clustered LED chips are correct, and still cannot detect cluster LED chips. 100 dark areas in a small area. 201236096 SUMMARY OF INVENTION Technical problems and objects to be solved by the present invention: Accordingly, the main object of the present invention is to provide a detection system for detecting the operational sorrow of a cluster LED chip and a detection method 'the detection system The detection method can detect the working state of the cluster LED chip at the time of lighting to determine whether the cluster LED chip is defective in actual use. The technical means for solving the problem of the present invention: a detection system for a cluster LED chip for detecting the working state of a cluster LED chip, the detection system comprising a carrying unit, a power supply, and an optical detecting machine; The power supply is configured to provide a rated operating current of the clustered LED chip, thereby causing the cluster LED chip to emit a working beam; the optical detecting machine is configured to receive the working beam, and According to the judgment of the working state. In one preferred embodiment of the invention, the optical inspection machine is an automated optical inspection machine (Automated Optical Inspection; Α0Ι). In a preferred embodiment of the present invention, the optical detecting device comprises an image capturing unit and a determining unit, wherein the image capturing unit is configured to receive the working beam to obtain a working image, and send the working image; The working image is received from the image capturing unit, and the working state is determined accordingly. In the preferred embodiment, the determining unit can be an industrial computer. 4 201236096 In a preferred embodiment of the present invention, the determining unit divides the working image into a plurality of matching intervals, and discriminates the brightness of the comparing intervals. In a preferred embodiment of the present invention, the detection system of the cluster LED chip may further comprise an attenuating sheet disposed in front of the optical detector to attenuate the working beam. In a preferred embodiment of the present invention, the detection system of the cluster LED chip may further include a current adjustment unit electrically coupled between the power supply and the cluster LED chip. Adjust the rated operating current. The invention further discloses a method for detecting a cluster LED chip, comprising the steps of: (a) providing a rated operating current to a cluster LED chip, thereby causing the cluster LED chip to emit a working beam; (b) The optical detector receives the working beam to obtain a working image; and (c) discriminates the working image by the optical detector to obtain an operating state. • The present invention compares the efficacy of the prior art: The detection system and detection method of the cluster LED chip of the present invention can be used when the cluster LED chip is lit, compared to the conventional method of detecting the detection mode of the cluster LED chip by using an electric or spectrometer. It is determined whether the clustered LED chip has an abnormal dark area, so that the reliability of detecting the cluster LED chip can be effectively improved. Specific embodiments of the invention will be further illustrated by the following examples and drawings. 201236096 [Embodiment] The present invention relates to a detection system for a cluster LED chip, and more particularly to a detection system for inspecting the working state of a cluster LED chip. The present invention is illustrated by the following description of the preferred embodiments, which are to be understood by those skilled in the art. The contents of this preferred embodiment are detailed below. Referring to the second and third figures, the second drawing is a schematic view of a first preferred embodiment of the detection system of the present invention, and the third drawing is a schematic view of a second preferred embodiment of the detection system of the present invention. The detection system of the cluster LED chip 100 of the present invention is for detecting the working state of a cluster LED chip 100, which includes a carrying unit 21, a power supply 22, and an optical detector 23. The load unit 21 is used to carry the cluster LED chip 100; the power supply 22 is used to provide the cluster LED chip 100 - rated operating current, so that the cluster LED chip 100 emits a working beam. The optical detector 23 is configured to receive the working beam and determine the operating state of the optical beam. In one embodiment of the present embodiment, the optical detecting machine may be an automated optical inspection machine (AOI). However, in the prior art, the Α0Ι machine is used to detect whether the appearance of the object to be tested is flawed, and the detection method is that the external light source illuminates the object to be tested, and then the surface of the object to be tested is judged to be flawed. The advantage of the Α0Ι machine is that the position of the cymbal can be judged at the same time when the appearance is detected. However, if the brightness of the appearance of the object to be tested is too high, the Ι0Ι machine cannot correctly judge whether the appearance of the object to be tested is defective or not. 201236096 Therefore, if the Ι0Ι machine is used as the optical detecting machine 23 in the present invention, in the preferred embodiment of the present invention, the detecting system may further include an attenuating sheet 24, and the attenuating sheet 24 is disposed on the optical detecting machine 23. Previously, the working beam is attenuated; or the detection system can include a current adjustment unit 25 electrically coupled between the power supply 22 and the cluster LED chip 100 to adjust the rated operation. Current; both of the above methods can reduce the brightness of the light received by the optical detector 23, so that the optical detector 23 can correctly determine the working state of the cluster LED chip 100. In order to make the detection more efficient, the attenuating sheet 24 may be composed of at least one attenuation filter and filter for one or more wavelengths of light, and the most ideal condition is to have the optical detector 23 on the cluster LED chip. The difference in brightness of light received by 100 during normal operation is less than 1%, and the exposure time required for optical detector 23 to receive the working beam can be controlled within 5 ms, and when dark area of clustered LED chip 100 is generated, dark area The brightness is only 10%~80% of the normal brightness; if the current adjustment unit 25 is used to lower the brightness of the low working beam and the rated operating current is reduced to 50%, the brightness of the working beam will be reduced to 60. Therefore, the range of the rated operating current must be lowered to allow the exposure time required by the optical detector 23 to be controlled within 5 ms. Please refer to the fourth figure. The fourth picture is a schematic diagram of the partitioning of the working images. Preferably, the optical detector 23 includes an image capturing unit 231 and a determining unit 232. The image capturing unit 231 is configured to receive the working beam to obtain a working image P1, and send the work. Shadowing 201236096 Like PI, the determining unit 232 is configured to receive the working image P1 from the image capturing unit 231, and determine the working state according to the method; and in the preferred embodiment, the determining unit may be an industrial computer. In addition, the determining unit 232 can distinguish the working image P1 into a plurality of comparison intervals Z1 and Z2, and determine the brightness of the comparison intervals Z1 and Z2, so that whether the cluster LED chip 100 has a The dark area is generated; it is emphasized that the alignment intervals Z1 and Z2 can be designed according to the position of the LED unit 11 on the cluster LED chip 100, but it is of course also possible to design in any shape and size. Please also refer to the fifth figure, which is a flow chart of the detection method of the present invention. The method for detecting a cluster LED chip of the present invention comprises the following steps: S101: lighting the cluster LED chip 100 to cause the cluster LED chip 100 to emit a working beam; S103: when the optical detector 23 is an AOI machine, The attenuating sheet 24 attenuates the working beam, or reduces the amount of light received by the optical detector 23 by the current adjusting unit 25, thereby reducing the intensity of the light received by the optical detector 23. S105: The optical detector 23 receives the work performed by the cluster LED chip 100. a light beam; and S107: the optical detector 23 obtains the working image IM after receiving the working beam, and discriminates the working image P1. Compared with the conventional method for detecting the detection mode of the cluster LED chip 100 by using an electric or spectrometer, the detection system 201236096 and the detection method of the cluster LED chip 100 of the present invention can discriminate clusters when the cluster LED chip 100 is lit. Whether the LED chip 100 has an abnormal dark area is generated, and if the AOI machine is used in the detection system and the detection method of the present invention, the shortcomings of the conventional AOI machine can only detect the passive illumination object to be tested. Combining the above advantages, it can be seen that the present invention can very effectively improve the reliability of the detection cluster LED chip 100. The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the patent scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic diagram of a clustered LED chip; the second figure is a schematic view of a first preferred embodiment of the detection system of the present invention; 2 is a schematic diagram of a partitioning comparison of working images; and a fifth diagram is a flowchart of a detecting method of the present invention. [Main component symbol description] Cluster LED chip 100 LED unit 11 201236096 Carrier unit 21 Power supply 22 Optical detector 23 Image capturing unit 231 Judging unit 232 Attenuator 24 Current adjusting unit 25 Working image P1 Comparison interval Zl, Z2 Detection method flow chart S101~S107