TW201235781A - Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, permanent pattern, permanent pattern forming method and printed board - Google Patents

Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, permanent pattern, permanent pattern forming method and printed board Download PDF

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Publication number
TW201235781A
TW201235781A TW101104621A TW101104621A TW201235781A TW 201235781 A TW201235781 A TW 201235781A TW 101104621 A TW101104621 A TW 101104621A TW 101104621 A TW101104621 A TW 101104621A TW 201235781 A TW201235781 A TW 201235781A
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TW
Taiwan
Prior art keywords
group
compound
photosensitive
acid
photosensitive composition
Prior art date
Application number
TW101104621A
Other languages
English (en)
Chinese (zh)
Inventor
Daisuke Arioka
Hideki Tomizawa
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW201235781A publication Critical patent/TW201235781A/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW101104621A 2011-02-28 2012-02-14 Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, permanent pattern, permanent pattern forming method and printed board TW201235781A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011042953 2011-02-28

Publications (1)

Publication Number Publication Date
TW201235781A true TW201235781A (en) 2012-09-01

Family

ID=46757728

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101104621A TW201235781A (en) 2011-02-28 2012-02-14 Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, permanent pattern, permanent pattern forming method and printed board

Country Status (3)

Country Link
JP (1) JP2012194534A (ja)
TW (1) TW201235781A (ja)
WO (1) WO2012117786A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107382719A (zh) * 2017-06-23 2017-11-24 武汉长盈鑫科技有限公司 一种酸酐改性联苯氧杂环丁烷丙烯酸酯预聚物的制备方法
CN114524807A (zh) * 2022-03-03 2022-05-24 波米科技有限公司 一种三氮唑基交联剂及其制备方法、应用

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101908469B1 (ko) 2013-02-19 2018-10-16 후지필름 가부시키가이샤 근적외선 흡수성 조성물, 근적외선 차단 필터와 그 제조 방법, 및 카메라 모듈과 그 제조 방법
JP6247014B2 (ja) * 2013-04-04 2017-12-13 東京応化工業株式会社 感光性樹脂組成物
KR101865599B1 (ko) 2013-04-11 2018-06-08 후지필름 가부시키가이샤 근적외선 흡수성 조성물, 이것을 이용한 근적외선 차단 필터 및 그 제조 방법, 및 카메라 모듈 및 그 제조 방법
JP6159291B2 (ja) 2013-05-23 2017-07-05 富士フイルム株式会社 近赤外線吸収性組成物、これを用いた近赤外線カットフィルタおよびその製造方法、並びに、カメラモジュール
JP2015017244A (ja) 2013-06-12 2015-01-29 富士フイルム株式会社 硬化性組成物、硬化膜、近赤外線カットフィルタ、カメラモジュールおよびカメラモジュールの製造方法
JP6612970B2 (ja) * 2016-03-23 2019-11-27 富士フイルム株式会社 積層体、パターン状被めっき層付き基板の製造方法、金属層含有積層体の製造方法、タッチパネルセンサー、及びタッチパネル
JP6958188B2 (ja) * 2017-09-28 2021-11-02 昭和電工マテリアルズ株式会社 感光性樹脂組成物、並びに、これを用いた感光性エレメント、レジストパターンの形成方法、ソルダーレジスト、層間絶縁膜、層間絶縁膜の形成方法、プリント配線板の製造方法及びプリント配線板
KR102230622B1 (ko) * 2017-11-24 2021-03-22 주식회사 엘지화학 포토레지스트 조성물 및 이를 이용한 포토레지스트 필름
JPWO2021117586A1 (ja) * 2019-12-11 2021-06-17
JP7229304B2 (ja) * 2020-08-06 2023-02-27 株式会社タムラ製作所 感光性樹脂組成物及び感光性樹脂組成物を塗布したプリント配線板
CN111909409B (zh) * 2020-08-11 2022-07-05 河北工业大学 一种含唑环的低聚硅氧烷复合质子交换膜的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0643638A (ja) * 1992-03-17 1994-02-18 Fuji Photo Film Co Ltd 光重合性組成物
JP3254572B2 (ja) * 1996-06-28 2002-02-12 バンティコ株式会社 光重合性熱硬化性樹脂組成物
EP0822448B1 (en) * 1996-08-02 2000-11-02 E.I. Du Pont De Nemours And Company Flexible, flame-retardant, photoimageable composition for coating printed circuits
JP3295012B2 (ja) * 1996-08-20 2002-06-24 富士通株式会社 可視光硬化型ソルダーレジスト組成物及びソルダーレジストパターンの形成方法
JP5351155B2 (ja) * 2008-06-09 2013-11-27 旭化成イーマテリアルズ株式会社 ポリアミド樹脂、感光性樹脂組成物、硬化レリーフパターンの形成方法及び半導体装置
JP2010117452A (ja) * 2008-11-12 2010-05-27 Toyo Ink Mfg Co Ltd 感光性難燃樹脂組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107382719A (zh) * 2017-06-23 2017-11-24 武汉长盈鑫科技有限公司 一种酸酐改性联苯氧杂环丁烷丙烯酸酯预聚物的制备方法
CN107382719B (zh) * 2017-06-23 2020-07-14 武汉长盈鑫科技有限公司 一种酸酐改性联苯氧杂环丁烷丙烯酸酯预聚物的制备方法
CN114524807A (zh) * 2022-03-03 2022-05-24 波米科技有限公司 一种三氮唑基交联剂及其制备方法、应用

Also Published As

Publication number Publication date
JP2012194534A (ja) 2012-10-11
WO2012117786A1 (ja) 2012-09-07

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