TW201235403A - Encapsulating resin composition for preapplication, semiconductor chip, and semiconductor device - Google Patents

Encapsulating resin composition for preapplication, semiconductor chip, and semiconductor device Download PDF

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Publication number
TW201235403A
TW201235403A TW101103219A TW101103219A TW201235403A TW 201235403 A TW201235403 A TW 201235403A TW 101103219 A TW101103219 A TW 101103219A TW 101103219 A TW101103219 A TW 101103219A TW 201235403 A TW201235403 A TW 201235403A
Authority
TW
Taiwan
Prior art keywords
resin composition
sealing resin
wafer
viscosity
application
Prior art date
Application number
TW101103219A
Other languages
English (en)
Chinese (zh)
Inventor
Satoru Katsurayama
Daisuke Oka
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011026700A external-priority patent/JP2012167138A/ja
Priority claimed from JP2011026697A external-priority patent/JP2012167137A/ja
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW201235403A publication Critical patent/TW201235403A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW101103219A 2011-02-10 2012-02-01 Encapsulating resin composition for preapplication, semiconductor chip, and semiconductor device TW201235403A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011026700A JP2012167138A (ja) 2011-02-10 2011-02-10 プリアプライド用封止樹脂組成物、半導体チップおよび半導体装置
JP2011026697A JP2012167137A (ja) 2011-02-10 2011-02-10 プリアプライド用封止樹脂組成物、半導体チップおよび半導体装置

Publications (1)

Publication Number Publication Date
TW201235403A true TW201235403A (en) 2012-09-01

Family

ID=46638536

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101103219A TW201235403A (en) 2011-02-10 2012-02-01 Encapsulating resin composition for preapplication, semiconductor chip, and semiconductor device

Country Status (2)

Country Link
TW (1) TW201235403A (ja)
WO (1) WO2012108320A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694585B (zh) * 2014-10-06 2020-05-21 南韓商三星電子股份有限公司 半導體裝置封裝、封裝層疊以及包含封裝層疊的計算裝置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014106885B4 (de) * 2014-05-15 2022-01-20 Pictiva Displays International Limited Verfahren zur Herstellung einer Isolatorschicht, Verfahren zur Herstellung eines organischen optoelektronischen Bauelements umfassend eine Isolatorschicht und organisches optoelektronisches Bauelement umfassend eine Isolatorschicht
CN109312053B (zh) * 2016-06-02 2019-12-13 日立化成株式会社 树脂组合物以及层叠体的制造方法
WO2019106835A1 (ja) * 2017-12-01 2019-06-06 日立化成株式会社 樹脂組成物及び積層体の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5042529B2 (ja) * 2005-05-30 2012-10-03 株式会社アドマテックス 微小粒子含有組成物及びその製造方法
JP2008303283A (ja) * 2007-06-07 2008-12-18 Sumitomo Bakelite Co Ltd プリアプライド用封止樹脂組成物、及びそれを用いた半導体装置の製造方法、半導体装置
JP4686750B2 (ja) * 2008-09-24 2011-05-25 積水化学工業株式会社 硬化体及び積層体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694585B (zh) * 2014-10-06 2020-05-21 南韓商三星電子股份有限公司 半導體裝置封裝、封裝層疊以及包含封裝層疊的計算裝置

Also Published As

Publication number Publication date
WO2012108320A1 (ja) 2012-08-16

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