TW201233482A - Laser beam irradiation device and laser beam irradiation method - Google Patents

Laser beam irradiation device and laser beam irradiation method Download PDF

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Publication number
TW201233482A
TW201233482A TW100147292A TW100147292A TW201233482A TW 201233482 A TW201233482 A TW 201233482A TW 100147292 A TW100147292 A TW 100147292A TW 100147292 A TW100147292 A TW 100147292A TW 201233482 A TW201233482 A TW 201233482A
Authority
TW
Taiwan
Prior art keywords
laser light
laser
film
oscillator
output value
Prior art date
Application number
TW100147292A
Other languages
English (en)
Chinese (zh)
Inventor
Shin Oikawa
Rikiya Matsumoto
Sung-Wook Min
Jae-Hyoung Cho
Original Assignee
Sumitomo Chemical Co
Hardram Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co, Hardram Co Ltd filed Critical Sumitomo Chemical Co
Publication of TW201233482A publication Critical patent/TW201233482A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00788—Producing optical films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Laser Beam Processing (AREA)
  • Polarising Elements (AREA)
TW100147292A 2010-12-24 2011-12-20 Laser beam irradiation device and laser beam irradiation method TW201233482A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010288671A JP2012135782A (ja) 2010-12-24 2010-12-24 レーザー光照射装置およびレーザー光照射方法

Publications (1)

Publication Number Publication Date
TW201233482A true TW201233482A (en) 2012-08-16

Family

ID=46314031

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100147292A TW201233482A (en) 2010-12-24 2011-12-20 Laser beam irradiation device and laser beam irradiation method

Country Status (5)

Country Link
JP (1) JP2012135782A (https=)
KR (1) KR20140019313A (https=)
CN (1) CN103260816A (https=)
TW (1) TW201233482A (https=)
WO (1) WO2012086764A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI777625B (zh) * 2020-07-03 2022-09-11 日商住友重機械工業股份有限公司 雷射功率測量裝置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013128966A (ja) * 2011-12-22 2013-07-04 Sumitomo Chemical Co Ltd レーザー光照射装置、フィルム切断装置、レーザー光照射方法及びフィルム切断方法
JP6342949B2 (ja) 2016-05-17 2018-06-13 ファナック株式会社 反射光を抑制しながらレーザ加工を行うレーザ加工装置及びレーザ加工方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6478694A (en) * 1987-09-19 1989-03-24 Hitachi Maxell Method and device for cutting raw film consisting of plastic film as base material
JP3102322B2 (ja) * 1995-10-31 2000-10-23 日立電線株式会社 炭酸ガスレーザ光を用いた基板の加工方法およびその加工装置
JP2000357835A (ja) * 1999-06-15 2000-12-26 Amada Eng Center Co Ltd レーザ発振器
JP4274251B2 (ja) * 2007-01-24 2009-06-03 ソニー株式会社 レーザ描画方法及びレーザ描画装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI777625B (zh) * 2020-07-03 2022-09-11 日商住友重機械工業股份有限公司 雷射功率測量裝置

Also Published As

Publication number Publication date
CN103260816A (zh) 2013-08-21
JP2012135782A (ja) 2012-07-19
WO2012086764A1 (ja) 2012-06-28
KR20140019313A (ko) 2014-02-14

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