201221488 六、發明說明： 【發明所屬之技術領域】 本發明係關於玻璃、矽、陶究、半導體等脆性材料基 板之分斷1置，特別是關於具備將分斷時於脆性材料基板 之端部等產生之不要之端材之除去機構之脆 分斷裝置。 【先前技術】 以往，做為將脆性材料基板即玻璃基板分斷（折斷） 之方法’已知例如以專利文獻丨與專利文獻2所揭示，將 基板局部加熱及冷卻，#由於該加熱及冷卻及冷卻時產生 之熱應力（壓縮應力與拉伸冑力）α予貝先於基板之端部形 成之初期龜裂（觸發）為起點使龜裂往所望之方向^展，y 於基板形成刻劃線或完全分斷之分斷方法。 具體而言，做為加熱源使用雷射光束’藉由使保持於 平台上之基板對雷射光束相對移動，沿進行分斷之折斷預 定線局部照射加熱並追隨該局部照射加熱從冷卻單元之噴 t噴射冷媒液。此時利用因加熱而產生之壓縮應力、因冷 卻而產生之拉伸應力所導致之應力分布使龜裂於折斷預: 線之方向進展，形成一條刻劃線。 之後’除了脆性材料基板完全分斷之場合外，藉由沿 刻劃線壓抵折斷棒或壓接轉動滾筒使基板彎曲以將基板分 斷。 另外，若於折斷時產生之端材（切片）殘留於平台上 4 201221488 曰方、之後之折斷時成為故障之原a，故以把持機構握持端 材’藉由使把持機構往拉離之方向移動來將端材分 去（參照專利文獻3 )。 專利文獻1 :日本特開2004-182530號公報 專利文獻2:日本特開2005-263578號公報 專利文獻3:日本特開2〇〇9 〇〇1484號公報 【發明内容】 [發明欲解決之課題] 於脆性材料基板Μ形成刻劃 圖9係顯示使用雷射光束 線之加工之圖。 脆性材料基板Μ係載置於二分割之平台13、13上 口之多數空氣吸引孔Μ吸著保持。於形成於二 猫機構16之雷射1之下方配置有保持於掃 :二之雷射先束照射部17、冷媒液喷射喷嘴Μ。 "田折斷預定線s從雷射光束照 光束使加熱區域（雷射點）甚“ /射出之田射 接著以緊追-後之方:: 部性之I 縮應力並藉由 # ^ ,, 式攸冷媒液喷射噴嘴18喷射冷媒使拉 伸應力產生，使龜裂沿折 條折斷預定線s使直線狀=S進展。在如上述沿- 具備吸盤之機械手等搬精由 定線S來到雷射光㈣位:（圖不外）以使次-折斷預 ^ ^ φ ·置之方式使脆性材料基板Μ移 ΓΓ .劃，依序於所有折斷預定線S使龜裂產生。 傻 攸與使龜裂產味$ & 生之面相反側之面將相對於折斷 201221488 預定線s之部分以滾筒或折斷棒等分斷機構（圖 壓，以使脆性材料基板曲而分斷。分斷後為: (中間製品）之脆性姑姐苴u & — 馬^ 口口 基板M雖藉由機械手等搬送機構 ，旦不要之端材M1會殘留在圖之右側之平台13上。 此殘留在平台13之端材Μι寬度非常小，故°撼 械手之吸盤使吸著。 ‘、Λ機 此外’若雷射刻劃時之冷媒液浸透至端材與平 會強力附著於平a而，Pl3 u 曰 十。面即使吹送空氣等亦不會簡單 除去極困難。此外，六名★ “ ]平刀雕’ 二軋之。人送會導致於分斷時產生 璃屑等微細之屑粉飛舞而將作業環境劣化。 針對上迆問題，申嗜 人雖已提案如專利文獻3所示之 ”員握持立而材並除去之把持機構，但該機構為複雜 夾頭之機構全體需耍相杏曰 > 〜 型化且…：間’故有分斷裝置全體大 ¾•化且成為兩價之問題。 也述問題’本發明係以提供具備可將於基板分斷 、—之端材以簡單且小型之機構確實除去並集中於設置 :定位置之箱體以廢棄之端材除去機能之分斷裝置為目 的。 [解決課題之手段] 為了達成上述目的，在本發明係採用如下之技術手 :Ρ本發明之脆性材料基板之分斷裝置係一種脆性 材料基板之分斷裝置，將脆性材料基板載置於平台上，以 2形成手段沿折斷預定線使龜裂或切槽產生而將脆性材 ;、板刀％纟特徵在於：前述平台由主平台與旋動平台 6 201221488 構成’旋動平台配置於 置於. 之附近且形成為可載 形成為可在使端材附著基板之端材；前述旋動平台係 姿勢；設=: 態下從水平之姿勢旋動至傾倒 疋力平台之傾倒姿勢將附著 材推落之推出棒。 疋動十口之端 [發明之效果] 在本發明係使端材附著之旋動台本身往下方傾倒並以 =將端材往端材收納箱推落，故構成極簡單而 收納箱推落並集中，故下方藉由推出棒往端材 Γ會往外部，特別是上方之基板載置面飛散 良:作業環境之效果。特別是在冷媒液浸透至端:::： 之間之場合以往將端材除去非常困難，但由於可將： 推落’故可確實除去。 、冬而材 推出，係夾刻劃 本發明中’前述旋動平台、主平台 形成手段以左右一對形成。 稭此’不論於左右任—旋動平台有端材殘留比一 由使使端材附著之旋動平台傾倒而將端材除去。$可藉 此外’本發明中，於前述旋動平台與主平台 有㈣空間，使旋動平台在經過此移動空間往_ 2成 手段退離之方向水平移動後旋動至傾倒姿勢。 /成 藉此’即使在於平台之下方配置刻劃形成手段 亦可使此刻劃形成手段迴避而使旋動平台傾倒。野合 201221488 【實施方式】 、下基於顯不其實施形態之圖面說明本發明之 材料基板之分斷裝置之詳細。 a性 圖1及圖2係顯示本發明之脆性材料基板之分 之全體之前視圖’圖3係顯 、置 與平台部分之概略俯視圖，圖4〜8传：了=式輪送機 ,^ _ 口 你馮了依序說明端材除 作之i而材除去機構部分之擴大圖。 '、 分斷裝置A具備支持於機台，之左右一對主平 配置於此主平台2、2夕p弓香甜u：上 口 、 a貫負上構成端材除去機構β之— ‘刀之左右-對旋動平台3、3。主平台2、2與旋動平” :之上面係配置為成為同一水平面，將應劃線之脆性材料基 反載置於e亥上面。脆性材料基板Μ係藉由搬送機構4搬 =主平台2、2與旋動平台3、3上，且可藉由此搬送機 冓4在平台上於圖R左右方向使移動。做為此搬送機構 她 貫施例係採用由左右一對帶式輸送機4a、4a構成之 、構° =帶式輸送機4a、4a上載置脆性材料基板Μ並使移 至既定位置後，藉由使帶式輸送機4a、4a降下並如圖2 所：使後退’將脆性材料基板河載置於主平台2、2與旋動 平°、3、3上。因此，如圖3所示，藉由於主平台2'2與 旋動平台3 ' 3設有複數條平行之狹縫2a ' 3a且帶式輸送機 4a、4a亦配合此狹縫2a ' 3a之間隔複數平行形成細長狀， 帶式輪送機4a、4a可從圖丨之姿勢降下移動至圖2之姿勢。 另外，搬送機構4並不限於此，當然亦可為其他機構， 例如於下端具備吸盤之機械手等機構。 8 201221488 此外’於主半台2、2與旋動平台3、3設置利用。 吸引之多數吸引口以使可吸著保持於主平台2、'2與旋;礼 台3、3上載置之脆性材料基板μ較理想。 " 於左右之旋動平台3、3夕l 3之互相對向之端緣之間形成 於圖i之前後方向直線延伸之間隙5,於此間隙5 置有刻劃形成手段6。 在本實施例係做為刻劃形成手段6而使用雷射 構，設有雷射光束照射部6&與冷媒液喷射喷嘴^。雷 束照射部&與冷媒液嘴射喷嘴仏係於掃瞒機構6 可上：移動’可沿轨道-於垂直於紙面之方向移動為 二次針對包含旋動平台3、3之端材除去機構B說明。 κ施例中端材除去機構B雖係設有左右一對 為相同機構，故指只針對其 者 於圖4.至圖8詳述》 。之右側）之機構基 旋動平台3、3係形忐兔γ 8為支點從圖4之水平之姿勢旋=於滑動底座7之樞軸 姿勢。其旋動範圍為90度至丨::與圖8之最終傾倒 度。 又較理心。在此係設為1 00 才疋動平台3、3往傾倒姿勢 方之刻劃形成手段6而如 夺’為了不接觸位於下 往後退之方向水平移動後才不在從刻劃形成手段6 旋動平台3、3之間係 為此，於主平台2、2與 外，旋動平台3、3之，水平 勒二間9 (參照圖4 )。此 機台1之執道!。滑動來：：向之移動係藉由滑動底座7沿 7此外’此時之旋動平台3、3 201221488 之傾倒係先使在圖5之中間傾倒姿勢停止。此係為了使旋 ^平台3、3移動至後述之端材收納们1之上方時旋動平 台3、3之前料會接觸端材收納箱丨丨之傾斜導引板…。 广吏圖5之中間傾倒姿勢維持之狀態下，如圖6所示 使奴動平台3、3移動至配置於下方之端材收納箱11之上 方’在此位置如圖7所示旋動至最終傾倒姿勢。 另外，在使旋動平台3、3旋動至最終傾倒姿勢之位置 於機台1安裝有將附著於旋動平台3、3之前端之端材〇往 下方之端材收納箱U推落之推出棒12。 上述之旋動平台3、3之旋動與往水平方向之移動係以 驅動機構（圖示外）來進行。此外，此等動作與推出棒12 之操作係以電腦控制來進行。 其次針對動作說明。 如圖2所示，藉由搬送機構4而載置於主平台2、2與 旋動平台3、3上之脆性材料基板M藉由刻劃形成手段6, 亦即雷射光束照射部6a與冷媒液喷射喷嘴6b雷射刻劃，沿 折斷預定線形成龜裂（直線狀之刻劃線）。如上述於:條 折斷預定線使龜裂產生後，使脆性材料基板M藉由搬送機 構4移動以使次一折斷預定線成為雷射光束照射位置後進 行雷射刻劃，依序於所有折斷預定線使龜裂產生。 此後’從與使龜裂產生之面為相反側之面以滾筒或折 斷棒等分斷機構（圖示外）按壓，使脆性材料基板M變曲 而從刻劃線分斷。分斷後係成為製品（中間製品）之基板， 亦即位於圖2之左側之主平台2、2與旋動平台3、3上之 10 201221488 基板藉由搬送機構 ⑷殘留。此端材二 之旋動平台3、3有端材 土 係雷射刻劃時之冷媒液浸透至旋動平 面/、鸲材M1之間而強力附著於旋動平台3、3。 此外，端材Μ1係以立加ν 突出之狀態殘留其…從旋動平台3、3之前端少許 動平：S'去此端材M1並廢棄至端材收納箱11，先使旋 "二如圖5所示於水平方向移動以使從刻劃形成手 二、彳，使傾倒至於同圖之假想線顯示之中間傾倒姿 △在維持此中間傾倒姿勢之狀態下如圖6所示使旋動平 心動至配置於下方之端材收納II 11之上方，在此 位置如圖7所示旋動至最終傾倒姿勢。在此，>圖8所示 ::出棒12突出，按壓於附著於旋動平台3、3之前端之端 材ML之往下方露出之部分，使端材⑷從旋動平台 剝離而落人下方之端材收納箱n。 如上述’於刻劃時產生之端材Ml不會往外部飛散 實集中於特定之端材收納箱u，可集中廢棄。 ^ 另外’可於旋動平台3、3之前端部之—部分形成推出 棒1 2可通過之缺口，以使在以推出棒12將端材Ml推落护 推出棒12之前端確實抵接於端材Ml。 / 在本實施例之分斷裝置A係於左右形成有端材除去機 構B，故與上述相反地在於左側之旋動平台3、3上有端材 產生之場合可使左側之端材除去機構B作動而與前述 地將端材除去。 ’ 201221488 以上雖已針對本發明之代表性實施例說明，但本發明 並非必須特定為上述之實施形態。例如在上述實施例雖係 使用雷射照射機構，但亦可為以刀輪等機械式刻劃機構形 成切槽。此外，在本發明係可在達成其目的並殘離請求 之範圍之範圍内適當修正、變更。 [產業上之可利用性] 本發明之脆性材料基板之分斷裝置可於將由玻璃美 :利Γ:陶[化合物半導體等脆性材料構成之基板：斷 【圓式簡單說明】 —實施例之前視圖。 於旋動平台與主平台 圖1係顯示本發明之分斷裝置之 圖2係顯示將脆性材料基板載置 之狀態之前視圖。 不聆奉發明之分斷裝置 式輸送機與平Α ^ 文為搬送機構之帶 丹十口部分之概略俯視圖。 圖4係本發明之端材除去機構之 圖5係顯-固ζ 擴大說明圖。 ，、…不圖4之端材除去機 說明圖。 义動作之第1階段之 構之動作之第2階段之 構之動作之第3階段之 圖6係顯示圖4之端材除去機 說明圓。 圖7係顯示圖4之端材除去 説明圖。 動作之第4階 12 201221488 說明圖。 圖9係說明一般之分斷裝置之立體圖。 【主要元件符號說明】 Μ 基板 Ml 端材 A 分斷裝置 2 主平台 3 旋動平台 6 刻劃形成手段 6a 雷射光束照射部 6b 冷媒液喷射喷嘴 9 移動空間 11 端材收納箱 12 推出棒 13201221488 VI. Description of the Invention: [Technical Field] The present invention relates to the breaking of a substrate of a brittle material such as glass, enamel, ceramics, or semiconductor, and particularly to the end of a substrate of a brittle material when it is to be broken. A brittle breaking device that removes the unwanted end material removal mechanism. [Prior Art] Conventionally, a method of breaking (breaking) a glass substrate which is a brittle material substrate is known. For example, as disclosed in Patent Document 2 and Patent Document 2, the substrate is locally heated and cooled, # due to the heating and cooling. And the thermal stress (compressive stress and tensile force) generated during cooling, the initial crack (trigger) formed before the end of the substrate is the starting point, and the crack is in the direction of the desired direction, and y is formed on the substrate. The method of breaking the line or completely breaking it. Specifically, the laser beam is used as a heating source. By moving the substrate held on the platform relative to the laser beam, the predetermined line of the breaking is broken along the predetermined line, and the local illumination heating is followed by the cooling unit. Spray t to spray the refrigerant liquid. At this time, the stress distribution due to the compressive stress generated by the heating and the tensile stress generated by the cooling causes the crack to break in the direction of the line to form a scribe line. Thereafter, except for the case where the brittle material substrate is completely separated, the substrate is bent by pressing the broken bar along the scribe line or crimping the rotating drum to break the substrate. In addition, if the end material (slice) generated at the time of breaking remains on the platform 4 201221488, and then breaks into the original a, the holding mechanism holds the end material 'by pulling the holding mechanism away The direction is moved to separate the end material (refer to Patent Document 3). [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. Drawing a slash on a brittle material substrate Fig. 9 is a view showing processing using a laser beam line. The brittle material substrate is held by a plurality of air suction holes that are placed on the upper portions of the two divided platforms 13, 13. Below the laser 1 formed in the second cat mechanism 16, a laser beam irradiation unit 17 and a refrigerant liquid jet nozzle 保持 held by the sweep are disposed. "Field breaks the predetermined line s from the laser beam to make the heating area (laser point) even " / shot out of the field to follow the chasing - after the square:: Partial I contraction stress and by # ^, The 攸 攸 攸 液 18 18 18 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射Come to the laser light (four) position: (picture) to make the brittle material substrate move in the way of the second-breaking pre-^ φ · setting, the crack is generated in sequence for all the broken predetermined lines S. The side opposite to the surface of the cracked scent and the raw surface of the crack will be broken with a roller or a broken rod with respect to the portion of the predetermined line s of 201221488 (the pressure is pressed to break the brittle material substrate. After the break is: (intermediate product) brittle aunt 苴u & - horse ^ mouth substrate M, although the robot is used to transport the mechanism, the end material M1 will remain on the platform 13 on the right side of the figure. The width of the end material 平台ι on the platform 13 is very small, so the suction cup of the cymbal is sucked. If the refrigerant liquid is soaked in the laser to the end material and the flat will strongly adhere to the flat a, Pl3 u 曰 10. The surface will not be easily removed even if the air is blown. In addition, six ★ "" flat knife The eagle's 'two-rolling'. The person's delivery will cause the fine dust of the swarf to fly during the break and the working environment will deteriorate. In response to the problem of the sputum, the applicant has proposed a grip as shown in Patent Document 3. Holding the material and removing the holding mechanism, but the institution is a complex chuck. All of the institutions need to play apricots. _ Type and ...: 'There are all the breaking devices that are large and become two-price. The problem is also described as 'the present invention is to provide a terminal body that can be separated from the substrate, and the terminal material is removed in a simple and small manner and concentrated in the setting: the position of the box to remove the function of the discarded end material. [Means for Solving the Problem] In order to achieve the above object, the present invention employs the following technical hand: The breaking device of the brittle material substrate of the present invention is a breaking device for a brittle material substrate, and a brittle material is used. The substrate is placed on the flat In the above, the brittle material is generated by the 2 forming means to break or cut the groove along the predetermined line; the plate cutter is characterized in that the platform is composed of the main platform and the rotating platform 6 201221488. Adjacent to and formed into an end material that can be formed to allow the end material to adhere to the substrate; the aforementioned rotating platform is in a posture; and the tilting posture from the horizontal posture to the tilting force platform is set in the = state: Pushing the launching bar. The end of the ten mouths [effect of the invention] In the present invention, the rotating table itself to which the end material is attached is poured downward and the end material is pushed down to the end material storage box, so that the pole is formed. Simple and the storage box is pushed down and concentrated, so the bottom is pushed out to the outside by the push rod, especially the upper substrate mounting surface is scattered: the effect of the working environment. In particular, in the case where the refrigerant liquid is infiltrated between the ends::::, it has been difficult to remove the end material in the past, but it can be reliably removed because it can be pushed down. In the present invention, the above-mentioned rotary platform and main platform forming means are formed by a pair of right and left. The straw is left-to-right, and the rotary platform has an end-to-wall residual ratio. The end material is removed by pouring the rotary platform to which the end material is attached. In the present invention, there is a (four) space in the aforementioned rotating platform and the main platform, so that the rotating platform is horizontally moved in the direction of retreating from the moving space by the moving space, and then rotated to the tilting posture. Therefore, even if the scoring forming means is disposed below the platform, the scoring forming means can be avoided to cause the rotating platform to fall.野合201221488 [Embodiment] The details of the breaking device of the material substrate of the present invention will be described based on the drawings showing the embodiments. 1 and FIG. 2 show the entire front view of the brittle material substrate of the present invention. FIG. 3 is a schematic plan view of the display, the platform and the platform portion, and FIGS. 4 to 8: == type wheeling machine, ^ _ You Feng said in order to explain the expansion of the end material in addition to the part of the material removal mechanism. ', the breaking device A has support for the machine, the left and right pair of main flats are arranged on the main platform 2, 2 p 弓 弓 香 u : : : : : : : : 、 、 、 、 、 、 、 、 、 、 、 、 、 、 构成 构成 构成 构成 构成 构成Left and right - on the rotating platform 3, 3. The main platform 2, 2 and the rotary flat": the upper surface is configured to be the same horizontal plane, and the brittle material base to be reversed is placed on the e-hai. The brittle material substrate is transported by the transport mechanism 4 = main platform 2, 2 and the rotating platform 3, 3, and can be moved by the conveyor 冓 4 on the platform in the left and right direction of the figure R. For this transfer mechanism, the embodiment adopts a pair of left and right belt conveyors. The belts 4a, 4a are configured to have the belt conveyors 4a, 4a placed on the brittle material substrate and moved to a predetermined position, and then the belt conveyors 4a, 4a are lowered and as shown in Fig. 2: 'The brittle material substrate is placed on the main platform 2, 2 and the rotary flats, 3, 3. Therefore, as shown in Fig. 3, the main platform 2'2 and the rotating platform 3' 3 are provided with plural The strip-shaped slits 2a' to 3a and the belt conveyors 4a, 4a are formed in parallel with the slits 2a' to 3a in parallel, and the belt-type rounders 4a, 4a can be moved from the posture of the figure to the figure. In addition, the conveyance mechanism 4 is not limited to this, and may be other mechanisms, for example, a robot having a suction cup at the lower end, etc. 8 201221488 In addition, 'the main half 2, 2 and the rotating platform 3, 3 are set to use. Most of the suction ports are attracted so that the sip can be kept on the main platform 2, '2 and spin; uploading on the platform 3, 3 The brittle material substrate μ is ideal. " The gap between the mutually opposite end edges of the left and right rotating platforms 3 and 3 is formed in the gap 5 extending in the direction of the front and rear directions of FIG. There is a scribing forming means 6. In the present embodiment, a laser beam irradiating portion 6 & and a refrigerant liquid ejecting nozzle ^ are provided as the scribing forming means 6, and the thunder beam irradiating portion & The mouthpiece nozzle is attached to the broom mechanism 6: the movement 'can be moved along the track-in a direction perpendicular to the paper surface to be described twice for the end material removal mechanism B including the rotary table 3, 3. Although the material removal mechanism B is provided with the same pair of left and right mechanisms, the mechanism-based rotary platform 3 and 3 are only for the case of the right side of the figure. The fulcrum is rotated from the horizontal position of Fig. 4 to the pivotal posture of the sliding base 7. The range of rotation is 90 degrees to 丨:: and Fig. 8 In the end, the degree of dumping is more reasonable. In this case, it is set to 100, and then the platform 3 and 3 are tilted to the posture of the dumping posture, and the means 6 is formed, and it is only required to move horizontally in the direction of not going down. Not from the scoring forming means 6 between the rotating platforms 3, 3 for this purpose, on the main platform 2, 2 and outside, the rotating platform 3, 3, horizontally two between 9 (see Figure 4). 1)! Slide to:: Move to the base by sliding the base 7 along the 7th 'turning platform 3, 3 201221488 at this time, first tilting in the middle of Figure 5 to stop. This is for When the rotary table 3, 3 is moved to the upper side of the end material storage 1 which will be described later, the inclined guide plates of the end material storage box 料 are contacted before the tables 3 and 3 are rotated. In the state in which the middle tilting posture of FIG. 5 is maintained, as shown in FIG. 6, the slave platforms 3 and 3 are moved to the upper side of the end material storage box 11 disposed at the lower position, and the position is rotated as shown in FIG. The final dumping posture. Further, at the position where the rotary table 3, 3 is rotated to the final tilting position, the machine 1 is mounted with the end material storage box U which is attached to the front end of the rotary table 3, 3, and is pushed downward. Launched the stick 12. The above-described rotation of the rotary platforms 3, 3 and the movement in the horizontal direction are performed by a drive mechanism (outside the figure). Moreover, the operation of these actions and the push bar 12 is performed by computer control. Follow the instructions for the action. As shown in FIG. 2, the brittle material substrate M placed on the main platform 2, 2 and the rotating platforms 3, 3 by the transport mechanism 4 is formed by the scoring forming means 6, that is, the laser beam irradiating portion 6a and The refrigerant liquid ejecting nozzle 6b is laser-engraved, and a crack is formed along a line to be broken (linear straight line). After the crack is generated as described above, the brittle material substrate M is moved by the transport mechanism 4 so that the next broken predetermined line becomes the laser beam irradiation position, and the laser is scribed, followed by all the breaks. The predetermined line causes cracks to occur. Thereafter, the surface opposite to the surface on which the crack is generated is pressed by a breaking mechanism (not shown) such as a drum or a broken bar, and the brittle material substrate M is bent and cut off from the score line. After the breaking, it becomes the substrate of the product (intermediate product), that is, the 10 201221488 substrate on the main platform 2, 2 and the rotating platform 3, 3 on the left side of Fig. 2 is left by the conveying mechanism (4). The rotary table 3 and 3 of the end material 2 have the end material of the soil, and the refrigerant liquid is soaked into the swirling plane/the coffin M1 and strongly adheres to the rotating platform 3, 3. In addition, the end material Μ1 is left in a state of standing ν protruding... from the front end of the rotating platform 3, 3, a little leveling: S' goes to the end material M1 and discards it to the end material storage box 11, first spins " 2, as shown in FIG. 5, moving in the horizontal direction so that the hand 2 and 彳 are formed from the scribe, so that the intermediate tilting posture Δ which is tilted to the imaginary line display of the same figure is made as shown in FIG. 6 while maintaining the intermediate tilting posture. Rotate the flat heart to the top of the end material storage II 11 disposed below, and rotate it to the final tilting position as shown in FIG. 7 at this position. Here, as shown in Fig. 8, the rod 12 protrudes and is pressed against the portion of the end material ML attached to the front end of the rotary table 3, 3 to be exposed downward, so that the end material (4) is peeled off from the rotary table. The end material storage box n below the person. As described above, the end material M1 generated at the time of scoring does not scatter to the outside and concentrates on the specific end material storage box u, and can be disposed of in a concentrated manner. ^ In addition, the portion which can be rotated at the front end of the platform 3, 3 forms a notch through which the push-out bar 12 can pass, so that the front end of the push-rod 12 is pushed against the push-out bar 12 with the push-out bar 12 End material Ml. / In the breaking device A of the present embodiment, the end material removing mechanism B is formed on the right and left sides. Therefore, contrary to the above, the left side end material removing mechanism can be provided in the case where the end material is generated on the left rotating platforms 3 and 3. B operates to remove the end material as previously described. Although the above description of the representative embodiments of the present invention has been made, the present invention is not necessarily limited to the embodiments described above. For example, in the above embodiment, a laser irradiation mechanism is used, but a slit may be formed by a mechanical scribing mechanism such as a cutter wheel. Further, the present invention can be appropriately modified or changed within the scope of the scope of the claims and the scope of the claims. [Industrial Applicability] The breaking device of the brittle material substrate of the present invention can be obtained from a glass substrate: a substrate made of a brittle material such as a compound semiconductor: a broken [round simple description] - a front view of an embodiment . Fig. 1 is a front view showing a state in which a brittle material substrate is placed. Fig. 2 is a view showing a state in which a brittle material substrate is placed. Do not listen to the invention of the breaking device Conveyor and flat Α ^ text for the transport mechanism belt Dan 10 mouth part of the schematic top view. Fig. 4 is a perspective view showing an enlarged view of the end material removing mechanism of the present invention. ,, ... not the end material removal machine of Figure 4. The third stage of the operation of the second stage of the operation of the first stage of the action is shown in Fig. 6 which shows the end material removal machine of Fig. 4. Fig. 7 is a view showing the removal of the end material of Fig. 4. The fourth step of the action 12 201221488 explanatory diagram. Figure 9 is a perspective view showing a general breaking device. [Main component symbol description] 基板 Substrate Ml End material A breaking device 2 Main platform 3 Rotating platform 6 Scratch forming means 6a Laser beam irradiation unit 6b Refrigerant liquid injection nozzle 9 Moving space 11 End material storage box 12 Pushing rod 13