KR101277604B1 - Apparatus for dividing brittle material substrate - Google Patents

Abstract

(Problem) Provide a dividing device having a cutting material removal function capable of removing the cutting material generated at the time of dividing the substrate by a simple and compact mechanism and integrating and destroying it in a box installed at a fixed position. do.
(Solution means) As a dividing apparatus for separating the brittle material substrate M by generating cracks or cut grooves along the break scheduled line by the scribe forming means 6, the table on which the substrate is placed is the main table (2). ) And the rotary movement table 3, and the rotary movement table 3 is arranged in the vicinity of the scribe forming means 6 so that the end member M1 of the brittle material substrate M generated at the time of separation can be placed. The rotary movement table 3 is formed so as to be able to rotate to a longitudinal position with the end member M1 in a horizontal position, and the rotary movement table 3 rotates in a longitudinal position. It is set as the structure by which the extrusion bar 12 which pushes away the end material M1 attached to the table 3 is provided.

Description

Separation device for brittle material substrate {APPARATUS FOR DIVIDING BRITTLE MATERIAL SUBSTRATE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for dividing brittle material substrates, such as glass, silicon, ceramics, and semiconductors. It is related with the dividing apparatus of the brittle material board | substrate provided with the removal mechanism of viii).

Conventionally, as a method of dividing (breaking) a glass substrate which is a brittle material, for example, as disclosed in Patent Literature 1 and Patent Literature 2, the substrate is locally heated and cooled to generate thermal stress ( Compressive stress and tensile stress), starting from an initial crack (trigger) formed at the end of the substrate in advance, and advancing the crack in a desired direction to form a scribing line on the substrate, A dividing method is known.

Specifically, by using a laser beam as a heating source and moving a substrate held on a table relative to the laser beam, it is locally irradiated and heated along a break scheduled line for dividing. Together with this, the coolant liquid is injected from the nozzle of the cooling unit. At this time, using the stress distribution caused by the compressive stress generated by the heating and the tensile stress generated by the rapid cooling, the crack is advanced in the direction of the break scheduled line, thereby forming a single scribe line.

Except for the case where the brittle material substrate is completely divided, the substrate is broken by bending the substrate by pressing the brake bar along the scribe line or by rolling a roller.

On the other hand, if the cutting material (fragment) which is generated when the brake is left on the table is a cause of trouble during the subsequent break, holding the cutting material by the gripping mechanism and holding it in the direction of pulling apart. By moving the mechanism, the cutting material is removed and removed (see Patent Document 3).

Japanese Laid-Open Patent Publication No. 2004-182530 Japanese Laid-open Patent Publication 2005-263578 Japanese Laid-Open Patent Publication No. 2009-001484

9 is a view showing a process of forming a scribe line on the brittle material substrate M using a laser beam.

The brittle material substrate M is placed on the two divided tables 13 and 13, and is held by the plurality of air suction holes 14 opened toward the upper surface. The laser beam irradiator 17 held by the scanning mechanism 16 and the coolant liquid injection nozzle 18 are disposed below the space 15 formed between the two divided tables 13 and 13.

Scan the laser beam emitted from the laser beam irradiation section 17 along the break scheduled line S to generate a local compressive stress in the heating area (laser spot), and then from the coolant liquid injection nozzle 18 to follow immediately after. Tensile stress is generated by injecting the coolant, so that the crack is advanced along the break scheduled line (S). In this manner, after generating a linear crack (scribe line) along one of the break scheduled lines, the brittle material substrate M is transported by a conveyance mechanism (not shown) such as a robot arm provided with a suction plate. Then, the next break scheduled line is moved to the laser beam irradiation position to perform laser scribing, and cracks are generated in all the break scheduled lines S sequentially.

Next, the part facing the brake scheduled line S is pressed from the surface on the side opposite to the surface where the crack is generated by a splitting mechanism (not shown) such as a roller or a brake bar to warp the brittle material substrate M. Segment. After being divided, the brittle material substrate M to be a product (intermediate product) is taken out by a transfer mechanism such as a robot arm, but the unnecessary cutting material M1 remains on the table 13 on the right side of the drawing.

Since the cutting | edge material which remained on this table is very small, it cannot be made to adsorb | suck by the sucker of a robot arm.

In addition, when the refrigerant liquid at the time of laser scribing penetrates between the cutting material and the table, it is strongly adhered to the table surface, and thus it does not drop easily even when spraying air or the like, which is very difficult to remove. In addition, in the injection of air, fine debris powder such as a cullet generated at the time of division blows off, and the working environment is deteriorated.

Therefore, the applicant has proposed a gripping mechanism that grasps and cuts off the cutting edge by a chuck as shown in Patent Literature 3, etc., but since the mechanism is complicated and the whole mechanism of the chuck requires considerable space, the whole dividing apparatus There is a problem that becomes large and expensive.

Accordingly, the present invention provides a dividing device having a cutting material removal function capable of reliably removing cutting materials generated at the time of dividing a substrate by a simple and compact mechanism and accumulating them in a box installed at a fixed position. It aims to provide.

Further, an object of the present invention is to provide a dividing device having a cutting material removal function capable of removing the cutting material reliably even when the cutting material is strongly attached to the table, such as when the refrigerant liquid penetrates between the substrate and the table. do.

In order to achieve the above object, the present invention has taken the following technical means. That is, in the dividing apparatus of the brittle material substrate of the present invention, the dividing apparatus for dividing the brittle material substrate by placing the brittle material substrate on the table and generating cracks or cut grooves along the break scheduled line by the scribe forming means, wherein The table is composed of a main table and a rotary movement table, and the rotary movement table is disposed near the scribe forming means so as to place the cutting material of the brittle material substrate generated at the time of division, and the rotary movement table is It is formed so as to be rotatable to a longitudinal posture while attaching the end material in a horizontal posture, and the extrusion table for pushing down the end material attached to the rotary movement table in the longitudinal posture is provided.

In the present invention, since the rotary movement table itself with the cutting material is hardened downward to push the cutting material into the cutting material storage box by the extrusion bar, the configuration is very simple and compact, and the cutting material is a substrate. Since the extrusion bar is pushed down and accumulated in the sheet storage box by the extrusion bar below the mounting surface, debris powder such as cutting material and cullets adhered thereto is scattered to the outside, particularly the upper substrate placing surface. There is an effect which can maintain a favorable working environment, without doing as follows. In particular, in the case where the refrigerant liquid has penetrated between the cutting material and the table, it has been very difficult to remove the cutting material until now, but since the cutting material can be pushed down, it can be removed reliably.

In this invention, it is good to set it as the structure in which a rotary moving table, a main table, and an extrusion bar are formed by a pair of left and right across a scribe forming means.

Thereby, even if a cutting | edge material remains in either of the left and right rotational movement tables, a cutting | disconnection can be removed by hardening the rotational movement table of the side to which the cutting | disconnection material was attached.

Further, in the present invention, a movement space is formed between the rotation movement table and the main table, and the rotation movement table is moved horizontally in a direction away from the scribing means through this movement space, and then rotates to the longitudinal position. It is a good idea to do so.

As a result, even when the scribe forming means is disposed below the table, the scribe forming means can be avoided and the rotational movement table can be hardened.

1 is a front view showing an embodiment of a dividing apparatus according to the present invention.
2 is a front view showing a state where the brittle material substrate is placed on the rotary table and the main table.
3 is a schematic plan view of a belt conveyor and a table portion as a conveying mechanism in the dividing apparatus according to the present invention.
4 is an enlarged explanatory view of a cut material removal mechanism in the present invention.
It is explanatory drawing which shows the 1st step of the operation | movement of the cut material removal mechanism in FIG.
It is explanatory drawing which shows the 2nd step of the operation | movement of the cutting material removal mechanism in FIG.
It is explanatory drawing which shows the 3rd step of the operation | movement of the cut material removal mechanism in FIG.
It is explanatory drawing which shows the 4th step of the operation | movement of the cutting material removal mechanism in FIG.
9 is a perspective view for explaining a general dividing device.

(Mode for carrying out the invention)

EMBODIMENT OF THE INVENTION Hereinafter, the detail of the dividing apparatus of the brittle material substrate which concerns on this invention is demonstrated based on the figure which shows the embodiment.

1 and 2 are front views showing the whole of the dividing apparatus according to the present invention, FIG. 3 is a schematic plan view showing a belt conveyor and a table portion as a conveying mechanism, and FIGS. 4 to 8 show the operation of removing the cutting material in sequence. It is an enlarged view of the cut material removal mechanism part for demonstrating along.

The dividing device A is disposed between the left and right pairs of main tables 2 and 2 supported by the base 1 and the main tables 2 and 2, and the cutting material removal mechanism ( The pair of left and right rotational movement tables 3 and 3 which constitute a part of B) is provided. The upper surface of the main table 2 and the rotary movement table 3 are arrange | positioned so that it may become the same horizontal surface, and the brittle material board | substrate M which should be scribed is mounted on the upper surface. While the brittle material substrate M is conveyed on the main table 2 and the rotary movement table 3 by the conveying mechanism 4, it can be moved in the left-right direction in FIG. 1 on this table by this conveying apparatus. It is supposed to be. As this conveyance mechanism 4, in this embodiment, the mechanism by a pair of left and right belt conveyors 4a and 4a is employ | adopted. After placing the substrate M on the belt conveyors 4a and 4a and moving it to a predetermined position, the belt conveyor 4a is lowered and retracted as shown in FIG. 2, whereby the brittle material substrate M is moved to the main table ( 2) And put it on the rotary moving table (3). For this reason, as shown in FIG. 3, the plurality of sets of parallel slits 2a and 3a are provided in the main table 2 and the rotary movement table 3, and the belt conveyor 4a also The belt conveyor 4a can move down from the posture of FIG. 1 to the posture of FIG.

In addition, the conveyance mechanism 4 is not limited to this, It is a matter of course that a mechanism, such as a robot arm provided with a sucker at the lower end, may be sufficient.

In addition, it is preferable to form a plurality of suction ports by air in each of the tables 2 and 3 so as to adsorb and hold the brittle material substrate M placed on the main table 2 and the rotary movement table 3. .

Clearances 5 extending linearly in the front-rear direction of FIG. 1 are formed between the edges of the left and right rotational movement tables 3 and 3 facing each other, and a scribe is provided below this gap. Forming means 6 is arranged.

In this embodiment, the laser irradiation mechanism is adopted as the scribe forming means 6, and the laser beam irradiation part 6a and the refrigerant liquid injection nozzle 6b are provided. The laser beam irradiation part 6a and the coolant liquid injection nozzle 6b are held up and down by the scanning mechanism 6c, and can move in the direction perpendicular to the surface along the rail 6d.

Next, the cutting material removal mechanism B containing the rotation movement tables 3 and 3 is demonstrated. In the present embodiment, the single material removal mechanisms B are provided in a pair of right and left, but since they are the same mechanism, only the mechanism of one side (right side of the drawing) will be described in detail with reference to Figs.

The rotary movement table 3 is formed to rotate from the horizontal posture of FIG. 4 to the final longitudinal posture of FIGS. 7 and 8 with the pivot 8 held by the slide base 7 as a point. have. The rotational movement range is preferably about 90 degrees to about 100 degrees. Here it is 100 degrees.

When the rotary movement table 3 rotates in the longitudinal position, it moves horizontally in the direction to back from the scribe forming means 6, as shown in FIG. 5, so as not to touch the scribe forming means 6 below. It is made to rotate. Therefore, the movement space 9 (refer FIG. 4) is formed between the rotation movement table 3 and the main table 2. As shown in FIG. In addition, the horizontal movement of the rotary movement table 3 is performed by sliding the slide base 7 along the rail 10 of the base 1. In addition, the hardness of the rotation movement table 3 at this time is made to stop by the intermediate hardness posture of FIG. This is to prevent the front end of the rotary movement table 3 from touching the hardness guide plate 11a of the cutting edge storage box 11 when moving the rotary movement table 3 to the upper side of the edge storage box 11 mentioned later. to be.

While maintaining the intermediate | middle hardness posture of FIG. 5, as shown in FIG. 6, the rotary movement table 3 is moved to the upper side of the cutting | disconnection material storage box 11 arrange | positioned below, and it is shown in FIG. Rotational movement is made to the final longitudinal position.

In addition, the extrusion bar which pushes the end material C attached to the front-end | tip of the rotational movement table 3 to the lower end material storage box 11 at the position which rotated the rotational movement table 3 to the final hardness posture ( 12 is attached to the base 1.

The rotational movement of the rotary movement table 3 and the movement in the horizontal direction are performed by a drive mechanism (not shown). In addition, these operations and the operation of the extrusion bar 12 are performed by computer control.

Next, the operation will be described.

As shown in FIG. 2, the brittle material substrate M placed on the main table 2 and the rotary movement table 3 by the conveying mechanism 4 has a scribe forming means, that is, a laser beam irradiation part 6a. Laser scribe is performed by the coolant liquid injection nozzle 6b to form a crack (straight scribe line) along the break scheduled line. In this way, after a crack is generated in one break scheduled line, the brittle material substrate M is moved by a conveyance mechanism so that the next break scheduled line becomes the laser beam irradiation position, and a laser scribe is performed, and all the break scheduled Causing cracks in the lines.

Thereafter, the sheet is pressed from a surface opposite to the surface where the crack is generated by a splitting mechanism (not shown) such as a roller or a brake bar to bend the brittle material substrate to be divided from the scribe line. After being divided, the substrate to be a product (intermediate product), that is, the substrate on the main table 2 and the rotary movement table 3 on the left side in FIG. 2 is taken out by the conveying mechanism 4, The cutting material M1 is left in the rotary movement table 3. In the cutting material M1, the refrigerant liquid at the time of laser scribing penetrates between the upper surface of the table and the cutting material, and is strongly attached to the rotary movement table 3. In addition, the end material M1 is left in a state in which a part protrudes slightly from the tip of the rotary movement table 3.

In order to remove this cutting material M1 and to discard it to the cutting material storage box 11, first, the rotary movement table 3 is moved to a horizontal direction, as shown in FIG. 5, and it is evacuated by the scribe forming means 6, and the copper ( The hardness is made to the intermediate hardness position shown in the virtual line of the drawing.

While maintaining this intermediate | middle hardness posture, as shown in FIG. 6, the rotary movement table 3 is moved to the upper side of the cutting material storage box 11 arrange | positioned below, and it is the last as shown in FIG. Rotate and move to the longitudinal position. Here, as shown in FIG. 8, the extrusion bar 12 protrudes and is pushed to the part exposed below the cutting edge M1 attached to the front-end | tip of the rotary movement table 3, and rotational movement of cutting edge M1 is carried out. It peels off from the table 3, and falls to the lower cutting material storage box 11 below.

In this manner, the cutting material M1 generated at the time of scribing is surely integrated in the predetermined cutting material storage box 11 without scattering to the outside, and can be collected and discarded together.

In addition, when pushing off the cutting material M1 with the extrusion bar 12, the extrusion bar (a part of the front end part of the rotating movement table 3) is made so that the front-end | tip of the extrusion bar 12 may abut surely against the cutting material M1. 12) may form a cut-away that can pass.

In the dividing device A of this embodiment, since the cutting material removal mechanism B is formed in left and right, when cutting material generate | occur | produces on the left side rotary movement table 3 on the contrary to the above, the cutting material removal mechanism on the left side is performed. By operating (B), the cutting material can be removed in the same manner as above.

As mentioned above, although the typical Example of this invention was described, this invention is not necessarily specified to said embodiment. For example, although the scribe formation means 6 used the laser irradiation mechanism in the said Example, you may form the groove | channel cut | disconnected by mechanical scribe mechanisms, such as a cutter wheel. In addition, in the present invention, the object can be achieved and modified and changed as appropriate without departing from the scope of the claims.

The dividing apparatus of this invention can be used when dividing the board | substrate which consists of brittle materials, such as a glass substrate, a silicon, a ceramic, and a compound semiconductor.

M: Substrate
M1: cutting
A: dividing device
2: main table
3: rotary moving table
6: scribe forming means
6a: laser beam irradiation unit
6b: refrigerant liquid injection nozzle
9: moving space
11: single storage box
12: extrusion bar

Claims (5)

A dividing apparatus for placing a brittle material substrate on a table and dividing the brittle material substrate by scribing forming means to generate cracks or cut grooves along a break scheduled line,
The table is composed of a main table and a rotary movement table, and the rotary movement table has a protruding state in which a part of the end piece of the brittle material substrate generated at the time of division is exposed from the tip of the rotary movement table. It is formed so that it can be put on, it is also formed to be able to rotate to the hardness (경도) posture in a horizontal posture attached to the cutting material,
An apparatus for dividing a brittle material substrate, comprising: an extrusion bar for pushing the exposed protruding portion of the cutting material attached to the rotary movement table in a longitudinal position of the rotary movement table from an attachment surface side with the rotary movement table. The method of claim 1,
And the rotary moving table, the main table, and the extrusion bar are formed in a pair of right and left with scribe forming means therebetween. The method according to claim 1 or 2,
A moving space is formed between the rotating table and the main table, and the rotating table is moved horizontally in a direction away from the scribing means through the moving space, and then rotates to a hardness posture. Division device. The method of claim 2,
And said scribe forming means is constituted by a laser beam irradiating portion and a refrigerant liquid jet nozzle, and is disposed below the left and right rotary moving tables. The method of claim 3,
And said scribe forming means is constituted by a laser beam irradiating portion and a refrigerant liquid jet nozzle, and is disposed below the left and right rotary moving tables.

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