TW201446451A - Apparatus and method for cutting a non-metal substrate - Google Patents

Abstract

An apparatus for cutting a non-metal substrate, includes a table, a bending unit, an initial crack generator and an optical heater. The table supports a non-metal substrate. The bending unit is disposed over the table to apply bending stress to the non-metal substrate with respect to a cutting line of the non-metal substrate. The initial crack generator generates an initial crack at a cut-starting point of the cutting line of the non-metal substrate. The optical heater irradiates laser beam onto the cutting line of the non-metal substrate to form a scribing line.

Description

Apparatus and method for cutting non-metallic substrates Field of invention

Embodiments of the present invention relate to an apparatus and method for cutting a tempered glass substrate. More specifically, embodiments of the present invention relate to an apparatus and method for cutting a tempered glass substrate using a laser beam.

Background of the invention

In summary, a mechanical cutting method, a chemical cutting method, and a laser cutting method can be used to cut a non-metallic substrate, such as a tempered glass substrate. In this mechanical cutting method, a diamond wheel or a sandblaster can be used. In this chemical cutting method, a wet etching is used. According to the mechanical cutting method, there is a problem that fine cracks and fine particles are present on one surface of a non-metal substrate. According to the chemical cutting method, there is a problem of contamination by a chemical environment, and a problem of low productivity due to a long process time. Moreover, according to a conventional laser cutting method, an initial crack is formed, a laser cut is performed by the initial crack, and a physical impact is applied to a non-metallic substrate by a breaker to cut the non-metal. Metal substrate. However, due to the self-stress of the tempered glass substrate, the initial crack is not completely correctly conducted and the productivity is degraded.

Therefore, in order to solve the above problems of the mechanical cutting method, the chemical cutting method, and the laser cutting method, a method of cutting a non-metal substrate with a laser beam has recently been developed.

Figure 1 is a schematic diagram showing a conventional method of cutting a non-metallic substrate using a laser beam.

Referring to Figure 1, in accordance with the conventional method of cutting a non-metallic substrate, such as a glass substrate or a tempered glass substrate, using a laser beam, an initial crack 200 is formed using an initial crack generator 130. One of the non-metallic substrates 20 is cut at the starting point.

After the initial crack 200 is formed at one of the cutting starting points of the non-metal substrate 20, a laser beam is irradiated to the non-metal by the optical heating heater 140 in a direction A from the cutting starting point having the initial crack 200. One of the substrates 20 cuts the end point, and a scribe line 210 is formed from the cutting start point having the initial crack to the cutting end point of the non-metal substrate 20.

When the score line 210 is formed by the cutting start point having the initial crack 200 to the cutting end point of the non-metal substrate 20, a cooling material is used by the quenching head 150 from the cutting starting point having the initial crack 200. A sprayed end point of the non-metallic substrate 20 is sprayed along the heated score line 210 to cool the score line 210 and conduct the extension of the initial crack 200 to cut the non-metal substrate 20.

However, in the case of the non-metallic substrate, it may be difficult to conduct the crack to a desired depth and maintain the crack along the score line.

Therefore, the conventional method for cutting a non-metallic substrate cannot be used to cut a non-metallic substrate, such as a glass having a large area of tempering. Glass substrate.

Further, the conventional method for cutting a non-metal substrate is cooled by the quenching nozzle 150, so that the manufacturing cost of the apparatus for cutting a non-metal substrate is increased, and the manufacturing time thereof is increased to lower the productivity.

Summary of invention

Embodiments of the present invention provide a method and apparatus for cutting a non-metallic substrate that is capable of reducing a cutting process time and capable of cutting a non-metallic substrate having a large area.

Embodiments of the present invention also provide an apparatus and method for cutting a non-metallic substrate that enhances the linearity of a cutting line and the accuracy of a cutting plane.

Further features of the present invention will be described in the following description, and a part thereof will be apparent from the description.

A device for cutting a non-metallic substrate comprising a platform, a bending unit, an initial crack generator, and an optical heater. The platform supports a non-metallic substrate. The bending unit is disposed above the platform for applying a bending stress to the non-metallic substrate relative to a cutting line of the non-metallic substrate. The initial crack generator creates an initial crack at the cutting starting point of one of the cutting lines of the non-metallic substrate. The optical heater illuminates a laser beam onto a cutting line of the non-metallic substrate to form a scribe line.

For example, the bending unit can include a guide bar and a pair of push rods. The guide bar is mounted on the platform such that the guide bar is placed under the cutting line of the non-metallic substrate supported by the platform. The pair of push rods will push the platform toward the platform At both ends of the non-metal substrate, the cutting line is supported by the guide bar to apply bending stress to the non-metal substrate, and the non-metal substrate is bent to protrude upward.

For example, the guide bar can have a rounded portion that minimizes the contact area between the guide bar and the non-metallic substrate.

For example, the pair of pushers can have a rounded portion that minimizes a contact area between the pusher and the non-metallic substrate.

For example, the bending unit may include a push rod pushing the cutting line of the non-metal substrate downward, the substrate being supported by a platform having two mutually spaced apart pieces, and the cutting line is disposed on the cutting line Between the two pieces, bending stress is applied to the non-metallic substrate to be convex downward.

For example, the optical heater can be configured to be movable such that the optical heater illuminates the laser beam onto the non-metallic substrate along a cutting line of the non-metallic substrate.

Alternatively, the platform can be configured to be movable such that the optical applicator illuminates the laser beam onto the non-metallic substrate along a cutting line of the non-metallic substrate.

Moreover, both the platform and the optical heater can be configured to move in opposite directions such that the optical heater illuminates the laser beam onto the non-metallic substrate along a cutting line of the non-metallic substrate.

A method for cutting a non-metallic substrate, according to an embodiment comprising: forming an initial crack at a cutting start point of a cut line of a non-metal substrate, applying a bending stress to the non-metal substrate relative to the cutting line And borrowing an optical heater from one of the cutting lines different from the initial crack Irradiating the laser beam at the point of the starting point of the cutting to the cutting starting point having the initial crack to form a scribe line on the non-metallic substrate, and when the laser beam reaches the cutting starting point The score line conducts the initial crack to cut the non-metallic substrate.

A method for cutting a non-metallic substrate, according to another embodiment, comprising: applying a bending stress to a non-metallic substrate relative to a cutting line, forming an initial starting point at a cutting line of the non-metallic substrate a crack, and by means of an optical heater, a point on the cutting line different from the cutting starting point having the initial crack, irradiating the laser beam to the cutting starting point having the initial crack to be on the non-metallic substrate A scribe line is formed thereon, and when the laser beam reaches the cutting start point, the initial crack is conducted along the scribe line to cut the non-metal substrate.

The method may further include: when the laser beam reaches the cutting start point, again illuminating the laser beam from the cutting starting point to a cutting end point.

For example, applying a bending stress to a non-metallic substrate relative to a cutting line can push the non-metal base with a push rod when the cutting line of the non-metal substrate is supported by a guide bar to bend the non-metal substrate upward. Both ends of the material are used.

Alternatively, applying a bending stress to a non-metallic substrate relative to a cutting line, or when the non-metallic substrate is supported by a platform, the two non-metallic substrates are separated from each other, and the cutting line is disposed on the two pieces. Between the blocks, the non-metallic substrate is bent downward to push the cutting line of the non-metal substrate.

For example, the laser beam can be illuminated while the optical heater is moving On the non-metallic substrate.

Alternatively, the laser beam can be illuminated onto the non-metallic substrate as the non-metallic substrate moves.

Further, the laser beam may be irradiated onto the non-metal substrate when the optical heater and the tempered glass substrate move in opposite directions.

For example, the laser beam can be illuminated by a cutting end point of one of the non-metallic substrates to the cutting starting point having the initial crack.

For example, the laser beam can be illuminated by a point on a line between a cutting end point and the cutting starting point to the cutting starting point having the initial crack.

According to the apparatus and method for cutting a non-metallic substrate, the laser beam is irradiated onto a non-metallic substrate on which a bending stress is applied, and a cutting starting point different from the initial crack is applied. Irradiation to the cutting start point, so the score line is formed when the laser beam reaches the initial crack.

Therefore, when the laser beam reaches the initial crack, the initial crack will be conducted along the scribe line from the initial crack, and the non-metal substrate will be cut quickly and smoothly. As a result, it can prevent the non-metallic glass substrate from being cut along a curve.

Further, according to the present invention, the non-metallic substrate can be cut by only one laser scribing process without a mechanical breaking process, so that micro-cracks, chips and particles in a truncated surface can be prevented.

Moreover, according to the method of the present invention, the non-metal substrate can be cut only by the laser scribing process without the mechanical breaking process and using The cooling process of the quenching nozzle, therefore, reduces the number of processes used to cut the non-metallic substrate, while reducing process time and cost for manufacturing and servicing a device for cutting the non-metallic substrate.

The above general description and the following detailed description are intended to be illustrative and illustrative and are intended to provide a further description of the claimed invention.

20‧‧‧Non-metal substrate

110‧‧‧ platform

120‧‧‧Bending unit

121‧‧‧Guide bars

122‧‧‧Put

130‧‧‧Initial crack generator

140‧‧‧Optical heater

150‧‧‧Quenching nozzle

200‧‧‧ initial crack

210‧‧• score line

A, B‧‧ ‧ laser direction

C‧‧‧ cracking direction

S110~S140‧‧‧ cutting steps

The accompanying drawings are included to provide a further understanding of the invention

Figure 1 is a schematic diagram showing a conventional method of cutting a non-metallic substrate using a laser beam.

2 is a schematic diagram showing an apparatus and method for cutting a non-metallic substrate in accordance with an embodiment of the present invention.

Figure 3 is a perspective view showing a bending unit in accordance with an embodiment of the present invention.

Figure 4 is a cross-sectional view showing a bending unit in accordance with another embodiment of the present invention.

Figure 5 is a schematic view showing the direction of cutting a tempered glass substrate.

6 is a flow chart showing a method for cutting a non-metallic substrate in accordance with an embodiment of the present invention.

Figure 7 is a flow chart showing a method for cutting a non-metallic substrate in accordance with another embodiment of the present invention.

Detailed description of the preferred embodiment

The invention will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention. However, the invention may be embodied in many different forms and should not be construed as being limited to the described embodiments. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention will be fully conveyed to those skilled in the art. In the drawings, the size and relative sizes of the various layers and regions may be exaggerated for clarity.

It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, etc., such elements, components and/or sections It should not be restricted by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Therefore, one of the first elements, components or sections described below may also be referred to as a second element, component or section without departing from the scope of the invention.

The singular terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting. As used herein, the singular forms " " " " " " " " " " " " It is also to be understood that the terms "including" and / or "comprising", when used in the specification, are specifically meant to indicate the presence of the features, the complete, the steps, the operation, the components and/or components, but not The presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof are excluded.

All words used here unless they are defined differently (including technical and scientific terms) have the same meaning as generally understood by those skilled in the art to which the invention pertains. Please also understand that words such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with the meaning of the relevant technical content and should not be interpreted as an idealized or too formalized meaning. To interpret, unless explicitly defined as such.

For convenience, the same reference numerals will be used for a device that cuts a tempered substrate and the same or similar components of the conventional device.

Hereinafter, a device for cutting a tempered glass substrate according to an embodiment of the present invention will be described with reference to the accompanying drawings.

2 is a schematic view showing an apparatus and method for cutting a non-metallic substrate according to an embodiment of the present invention, and FIG. 3 is a perspective view showing a bending unit according to an embodiment of the present invention; . Figure 4 is a cross-sectional view showing a bending unit in accordance with another embodiment of the present invention, and Figure 5 is a schematic view showing the direction of a tempered glass substrate.

Referring to FIGS. 2 through 5, an apparatus for cutting a non-metallic substrate according to an embodiment of the present invention includes a platform 110, a bending unit 120, an initial crack generator 130, and an optical heater 140. .

A non-metallic substrate 20 is supported by the platform 110. The platform 110 includes an element for moving the non-metallic substrate 20 supported by the platform in a straight line direction.

The bending unit 120 is disposed above the platform 110. The bending unit 120 applies a non-metallic substrate 20 that is bent to stress on the platform 110 with respect to a cutting line (not shown) of the non-metallic substrate 20.

For example, the bending unit 120 can include a guide bar 121 and a pair of pushes Rod 122, as shown in FIG. The guide bar 121 is mounted on the platform 110, and the guide bar 121 is disposed under the cutting line of one of the non-metal substrates 20 supported by the platform 110. The pair of push rods 122 push the two ends of the non-metal substrate 20, and the cutting line is supported by the guide bar 121, and bending stress is applied to the non-metal substrate 20 toward the platform 110, so the non-metal substrate 20 will be bent to become curved. The guide bar 121 has a rounded portion 最小 which minimizes a contact area between the guide bar 121 and the non-metal substrate 20 when the non-metal substrate 20 is stably supported. Further, the pair of push rods 122 also has a rounded portion which minimizes the contact area between the push rod 122 and the non-metal substrate 20 when the non-metal substrate 20 is stably pressed. The initial crack is formed by the initial crack generator 130 at a cutting starting point of the upper surface of the non-metal substrate 20, and the substrate is convex upward.

In another example, the bending unit 120 can include a pusher 122, as shown in FIG. The pusher 122 pushes down a cutting line of the non-metallic substrate 20, so that bending stress is applied to the non-metallic substrate 20 to bend it downward. To this end, the platform 110 is formed by two pieces separated from each other, and the non-metal substrate 20 is disposed on the platform 110, and one cutting line of the non-metal substrate 20 is disposed on the flat Between the two blocks of the station 110. The initial crack is formed by the initial crack generator 130 at a cutting starting point of the lower surface of the non-metallic substrate 20, and the substrate is convex downward.

The bending unit 120 applies bending stress to the non-metal substrate 20, so that the non-metal substrate 20 can be cut at a high speed, the linearity of the cutting line is enhanced, and a non-metallic substrate 20 having a large area is A tempered glass substrate can be cut.

The initial crack generator 130 is assembled such that the initial crack generator is disposed above or below the non-metallic substrate 20. For example, when the bending stress is applied to the non-metal substrate 20 to bend the non-metal substrate 20 to protrude upward, the initial crack generator 130 is disposed above the non-metal substrate 20. Conversely, when the bending stress is applied to the non-metal substrate 20 to bend the non-metal substrate 20 to protrude downward, the initial crack generator 130 is disposed under the non-metal substrate 20. The initial crack generator 130 forms an initial crack 200 at the cutting starting point of one of the non-metallic substrates 20.

The optical heater 140 is disposed above or below the non-metal substrate 20 supported by the stage 110. The optical heater 140 is movable along a cutting line of the non-metallic substrate 20. The optical heater 140 illuminates a laser beam onto the cutting line to form a score line 210. In detail, when the apparatus for cutting a non-metallic substrate uses the bending unit 120 of FIG. 3, the optical heater 140 is disposed above the non-metal substrate 20 supported by the platform 110. Conversely, when the apparatus for cutting a non-metallic substrate uses the bending unit 120 of FIG. 4, the optical heater 140 is disposed below the non-metallic substrate 20 supported by the platform 110.

In accordance with the apparatus for cutting a non-metallic substrate of the present invention, the platform 110 supporting the non-metallic substrate 20 and the optical heater 140 are movable relative to each other along the cutting line.

For example, the platform supporting the non-metal substrate 20 is fixed, and the optical heater 140 can be moved along the cutting line of the metal substrate 20 to illuminate the laser beam on the non-metal substrate 20 to form the scribe line. 210.

Conversely, the optical heater 140 is fixed and irradiates a laser beam onto the non-metal substrate 20, and the platform supporting the non-metal substrate 20 moves, so that the optical heater 140 can be illuminated along the cutting line. The laser beam is used to form a score line 210.

Moreover, when the optical heater 140 forms a laser beam on the non-metal substrate 20 along the cutting line to form the scribe line 210, the platform 110 supporting the non-metal substrate 20 and the optical heater 140 are also Can move in the opposite direction. In other words, the platform supporting the non-metallic substrate 20 will move in a first direction while the optical heater 140 will move in a second direction opposite to the second direction and illuminate the laser along the cutting line. The scribe line 210 is formed by a bundle. When both the platform supporting the non-metallic substrate 20 and the optical heater 140 are movable in opposite directions, the optical heater 140 illuminates the laser beam along the cutting line on the non-metal substrate 20 to form the scribe line. At 210 o'clock, the score line 210 can be formed faster to reduce the processing time for cutting the non-metallic substrate 20.

Hereinafter, a method for cutting a non-metal substrate according to an embodiment of the present invention will be described with reference to FIGS. 2 to 7.

(Example 1)

6 is a flow chart showing a method for cutting a non-metallic substrate in accordance with an embodiment of the present invention.

Referring to FIGS. 2-6, in order to cut the non-metallic substrate 20 such as a tempered glass substrate, an initial crack 200 is formed by the initial crack generator 130 on the non-metal substrate supported by the platform 110. One of the one cutting lines cuts the starting point (step S110). For example, the initial crack 200 can be A first end of one of the cutting lines formed on the non-metallic substrate 20, or a second end of the cutting line of the non-metallic substrate 20, opposite to the first end.

After the initial crack 200 is formed, the bending stress is applied to the non-metal substrate 20 supported by the platform 100 by the bending unit 120, and the non-metal substrate is bent upward relative to the cutting line (step S120). . For example, the guide bar 212 supports the cutting line under the non-metal substrate 20, and the pair of push rods 122 push the two ends of the non-metal substrate 20 toward the platform 110, so the non-metal substrate bends. The cutting line is tied to the top of one of the non-metallic substrates, and a bending stress can be applied to the non-metallic substrate. Alternatively, the non-metallic substrate 20 is supported by a platform 110 comprising two sheets separated from each other, and a cutting line of the non-metal substrate 20 is disposed between the two pieces, and the cutting line is directed Pushing down, the non-metallic substrate 20 is bent and can apply bending stress to the non-metallic substrate 20.

That is, the scribe line 210 is formed on the non-metal substrate 20, and when the bending stress is applied to the non-metal substrate 20, the optical heater 140 is irradiated in one direction B from a point on the cutting line. The laser beam is beamed onto the cutting line to the initial crack 200, as shown in Figure 2 (step S130).

For example, the optical heater 140 can be moved such that the optical heater 140 can illuminate the laser beam from the point on the cutting line along the cutting line of the non-metallic substrate supported by the fixed platform 110 to the non-metal. An initial crack 200 is formed on the substrate to one end of the cutting line.

Alternatively, the platform 110 can be moved such that the fixed optical heater 140 can illuminate the laser beam from the point along the cutting line along the cutting line of the non-metallic substrate 20 to the non-metal supported by the platform 110. On substrate 20 To the initial crack 200 formed at one end of the cutting line.

Moreover, the platform 110 and the optical heater 140 can also be moved in opposite directions, so that the optical heater 140 can illuminate the laser beam on the non-metallic base along the cutting line of the non-metal substrate 20 from the point on the cutting line. The material 20 is applied to the initial crack 200 formed at one end of the cutting line, which reduces the cutting process time.

In the above, the laser beam is irradiated onto the non-metal substrate 20 from the point on the cutting line to the initial crack 200 by the optical heater 140.

For example, the laser beam can be illuminated onto the non-metallic substrate 20 by a cutting end point to the initial crack 200. In detail, when the initial crack 200 is formed at one of the first ends of the non-metal substrate 20, the laser beam may be from a second end of the non-metal substrate 20, which is opposite to the first end The scribe line 210 is formed by irradiating the non-metal substrate 20 to the first end where the initial crack 200 is formed. However, as described above, the laser beam may also be formed by a point of the cutting line that is not the end of the non-metallic substrate, and is irradiated to the initial crack 200 to form the score line 210.

When the laser beam reaches the initial crack 200 along the cutting line, the initial crack 200 will be conducted along the score line 210 from the initial crack 200 in a C direction as shown in FIG. 5, so the non-metal base The material 20 will be cut.

According to the present invention, the bending unit 120 applies bending stress to the non-metal substrate 20, so that the non-metal substrate 20 can be cut along the score line 210 more quickly. In addition, the linearity of the cutting line can be enhanced. Also, when the method is applied to a non-metallic substrate 20 such as a tempered glass substrate 20 At the time, the microcracks are not formed in one of the non-metallic substrates, and the fragments and the particles are not generated. Thus, the method of the present invention can be applied to non-metallic substrates having a large area, such as a tempered glass substrate.

In another aspect, a method for cutting a non-metallic substrate in accordance with the present invention optionally includes a process of again illuminating the initial crack 200 of the non-metallic substrate 20 after the laser beam reaches the initial crack 200. The laser beam is cut to the end of one of the non-metal substrates 20 (step S140).

When the method for cutting a non-metallic substrate comprises: after the laser beam reaches the initial crack 200, the laser beam is again irradiated by the initial crack 200 of the non-metal substrate 20 to one of the non-metal substrate 20 At the end point of the procedure, the non-metallic substrate 20 can be cut more cleanly and its debris and particles can be reduced.

(Example 2)

Hereinafter, a method for cutting a non-metal substrate according to another embodiment will be explained with reference to FIGS. 2 to 7.

Figure 7 is a flow chart showing a method for cutting a non-metallic substrate in accordance with another embodiment of the present invention.

The method for cutting a non-metal substrate according to another embodiment of the present invention is substantially the same as the previous embodiment except that the step of forming an initial crack (step S110) and the step of applying a bending stress (step S120) ) are interchanged. Therefore, some of the foregoing descriptions may be omitted.

Referring to FIG. 2, FIG. 3, FIG. 4 and FIG. 7, in order to cut the non-metallic substrate 20, such as a tempered glass substrate, bending stress is applied to the non-metal substrate supported by the platform 100. Metal substrate 20, while making the non The metal substrate is bent upward with respect to the cutting line (step S110). For example, the guide bar 212 supports the cutting line under the non-metal substrate 20, and the pair of push rods 122 push the two ends of the non-metal substrate 20 toward the platform 110, so that the non-metal substrate is Bending, so the cutting line will be on top of one of the non-metallic substrates, and the crucible can apply bending stress to the non-metallic substrate. Alternatively, the non-metallic substrate 20 is supported by a platform comprising two pieces separated from each other, and the cutting line of the non-metal substrate 20 is disposed between the two pieces, and the cutting line is to be downward. Pushing, the non-metallic substrate 20 is bent and a bending stress can be applied to the non-metallic substrate 20.

That is, when the bending stress is applied to the non-metal substrate 20, an initial crack 200 is formed by the initial crack generator 130 formed on one of the cutting lines of one of the non-metal substrates 20 supported by the platform 110. At the point (step S120). For example, the initial crack 200 can be formed at one of the first ends of the cut line of the non-metallic substrate 20, or at a second end of the cut line of the non-metal 20, which is opposite the first end.

嗣, when the bending is applied to the non-metallic substrate 20, the scribe line 210 is such that the optical heater 140 illuminates the laser beam from the cutting line to the initial crack in a direction B from a point on the cutting line. 200 is formed on the non-metal substrate 20 as shown in Fig. 2 (step S130).

When the laser beam reaches the initial crack 200 along the cutting line, the initial crack 200 is conducted and conducted along the scribe line 210 by the initial crack 200, as shown in one of the C directions of FIG. 5, and thus the non-metal substrate 20 will be cut off.

On the other hand, according to the invention for cutting a non-metal base The method of material optionally includes a process of irradiating the laser beam to the end of one of the non-metallic substrates 20 by the initial crack 200 of the non-metallic substrate 20 after the laser beam reaches the initial crack 200 (steps) S140).

According to the above method for cutting a non-metallic substrate, the laser beam is irradiated onto a non-metallic substrate 20 on which a bending stress is applied, and a cutting different from the initial crack 200 is used. The point of the starting point to the starting point of the cut, so that the score line will be formed when the laser beam reaches the initial crack 200.

At this time, the non-metal substrate 20 is in a state of receiving the bending stress applied by the bending unit 120.

Therefore, due to the bending stress and the laser beam, when the laser beam reaches the initial crack 200, the initial crack 200 is scribed by the initial crack 200 along the C direction as shown in FIG. The conduction extends so that the non-metallic substrate 20 is cut quickly and smoothly. As a result, the non-metallic glass substrate can be prevented from being cut along a curve.

Moreover, according to the present invention, the non-metallic substrate 20 can be cut by only one laser scribing procedure and one bending stress without passing through a mechanical breaking procedure, thus, micro-cracks, fragments and in a truncated surface. Particles are prevented and the cutting process time is reduced.

Moreover, according to the present invention, the non-metal substrate 20 can be cut by only a laser scribing process without the mechanical breaking process and a cooling process using a quenching nozzle, thereby cutting the non-metallic substrate. The number of procedures can be reduced, and the cost of a cutting process and the cost of manufacturing and servicing a device for cutting the non-metallic substrate can be reduced.

It will be apparent to those skilled in the art that various modifications and changes can be made in the present invention without departing from the spirit or scope of the invention. Therefore, it is intended that the present invention cover the modifications and variations of the invention, and the scope of the invention.

20‧‧‧Non-metal substrate

130‧‧‧Initial crack generator

140‧‧‧Optical heater

200‧‧‧ initial crack

210‧‧• score line

B‧‧‧Road direction

Claims (18)

An apparatus for cutting a non-metallic substrate, comprising: a platform supporting a non-metallic substrate; a bending unit disposed above the platform to apply a bending stress to the non-metallic substrate with respect to the cutting line a metal substrate; an initial crack generator for producing an initial crack at a cutting starting point of the cutting line of the non-metal substrate; and an optical heater for illuminating the laser beam on the cutting line of the non-metal substrate to form a moment Dash. The device of claim 1, wherein the bending unit comprises: a guide bar mounted on the platform, wherein the guide bar is disposed under the cutting line of the non-metal substrate supported by the platform; and a pair of pushes The rod may push the two ends of the non-metal substrate toward the platform, and the cutting line of the substrate is supported by the rod to apply bending stress to the non-metal substrate, and the non-metal substrate is bent to protrude upward . The device of claim 2, wherein the guide bar has a rounded portion that minimizes a contact area between the guide bar and the non-metallic substrate. The device of claim 2, wherein the pair of push rods have a rounded portion that minimizes a contact area between the push rod and the non-metallic substrate. The apparatus of claim 1, wherein the bending unit comprises: a pusher that pushes a cutting line of the non-metallic substrate downward, the substrate being supported by a platform having two pieces separated from each other a cutting line is disposed between the two pieces, so bending stress is applied to the The non-metallic substrate becomes convex downward. The apparatus of claim 1, wherein the optical heater is configured to be movable such that the optical heater illuminates the laser beam along the cutting line of the non-metallic substrate onto the non-metallic substrate. The device of claim 1, wherein the platform is configured to be movable such that the optical heater illuminates the laser beam onto the non-metallic substrate along a cutting line of the non-metallic substrate. The device of claim 1 wherein the platform and the optical heater are both configured to move in opposite directions such that the optical heater illuminates the laser beam along the cutting line of the non-metallic substrate to the non-metallic substrate On the material. A method for cutting a non-metallic substrate, comprising: forming an initial crack at a cutting starting point of a cutting line of one of the non-metallic substrates; applying a bending stress to the non-metallic substrate relative to the cutting line; By means of an optical heater, a point on the cutting line is different from the cutting starting point having the initial crack, and irradiating the laser beam to the cutting starting point having the initial crack to form a scribe on the non-metallic substrate a line, and when the laser beam reaches the cutting starting point, the initial crack can be conducted along the scribe line to cut the non-metallic substrate. A method for cutting a non-metallic substrate, comprising: applying a bending stress to a non-metallic substrate relative to a cutting line; forming an initial crack at a cutting starting point of the cutting line of the non-metallic substrate; The optical heater is a point on the cutting line, which is different from the a cutting starting point having an initial crack, irradiating the laser beam to the cutting starting point having the initial crack to form a scribe line on the non-metallic substrate, and when the laser beam reaches the cutting starting point The initial crack is conducted along the scribe line to cut the non-metallic substrate. The method of claim 9 or 10, further comprising: when the laser beam reaches the cutting start point, again irradiating the laser beam to the cutting end point by the cutting starting point. The method of claim 9 or 10, wherein applying a bending stress to a non-metallic substrate relative to a cutting line is performed by: bending the non-metallic substrate upward when the cutting line of the non-metallic substrate is supported by a guide bar At the time, the both ends of the non-metal substrate are pushed by the push rod. The method of claim 9 or 10, wherein applying a bending stress to a non-metallic substrate relative to a cutting line is performed as follows: when the non-metallic substrate is supported by a platform, the platform comprises two mutually separated pieces and When the cutting line is disposed between the two pieces, the cutting line of the non-metal substrate is pressed to bend the non-metal substrate downward. The method of claim 9 or 10, wherein the laser beam is incident on the non-metallic substrate while the controller is moving. The method of claim 9 or 10, wherein the laser beam is irradiated onto the non-metallic substrate while the non-metallic substrate is moving. The method of claim 9 or 10, wherein the laser beam is irradiated onto the tempered glass substrate when the optical heater and the non-metallic substrate are moved in opposite directions from each other. The method of claim 9 or 10, wherein the laser beam is irradiated from the cutting end of one of the non-metallic substrates to the cutting starting point having the initial crack. The method of claim 9 or 10, wherein the laser beam is illuminated by a point on a line between a cutting end point and the cutting starting point to the cutting starting point having the initial crack.