TW201821343A - Conveying member, conveying device and scribing system capable of smoothly cleaning an upper surface of a table with a simple structure - Google Patents

Conveying member, conveying device and scribing system capable of smoothly cleaning an upper surface of a table with a simple structure Download PDF

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Publication number
TW201821343A
TW201821343A TW106126025A TW106126025A TW201821343A TW 201821343 A TW201821343 A TW 201821343A TW 106126025 A TW106126025 A TW 106126025A TW 106126025 A TW106126025 A TW 106126025A TW 201821343 A TW201821343 A TW 201821343A
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Taiwan
Prior art keywords
stage
substrate
cleaning unit
cleaning
brush
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TW106126025A
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Chinese (zh)
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TWI746609B (en
Inventor
西尾仁孝
高松生芳
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日商三星鑽石工業股份有限公司
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Publication of TW201821343A publication Critical patent/TW201821343A/en
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B35/00Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
    • C03B35/14Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
    • C03B35/20Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames
    • C03B35/202Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames by supporting frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G45/00Lubricating, cleaning, or clearing devices
    • B65G45/10Cleaning devices
    • B65G45/18Cleaning devices comprising brushes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/20Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25HWORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H7/00Marking-out or setting-out work
    • B25H7/04Devices, e.g. scribers, for marking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043Making grooves, e.g. cutting

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

This invention aims to provide a conveying member capable of smoothly cleaning an upper surface of a table with a simple structure, a conveying device including the conveying member, and a scribing system including the conveying device. The conveying member 300 of this invention holds a substrate 10 and conveys it from a first table 110 to a second table 410. The conveying member 300 is disposed with a first cleaning unit 240 arranged at the rear of the substrate 10 in the conveying direction and in contact with the upper surface of the first table 110 in the process of conveying the substrate 10 from the first table 110 to the second table 410, so that the upper surface of the first table 110 is cleaned. The first cleaning unit 240 includes a brush 241 as a cleaning tool, and the brush 241 is moved while being in contact with the upper surface of the first table 110 to clean the upper surface of the first table 110.

Description

搬送體、搬送裝置及劃線系統Transport body, transport device and scribing system

本發明係關於一種用於吸附基板並搬送其之搬送體、具備該搬送體之搬送裝置、及具備該搬送裝置之劃線系統。The present invention relates to a transport body for adsorbing and transporting a substrate, a transport device including the transport body, and a scribing system including the transport device.

玻璃基板等之脆性材料基板之分斷係利用以下步驟而進行,即:在基板表面形成劃線之劃線步驟、及沿形成之劃線對基板表面附加特定之力之裂斷步驟。針對劃線之形成使用具備劃線頭之劃線裝置。 劃線裝置例如具備供載置基板之載台,劃線頭相對於載置於該載台之基板在水平方向及上下方向上移動。在劃線頭之下端安裝有輪保持器,切刀輪旋轉自如地由該輪保持器保持(例如專利文獻1)。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2004-26539號公報Fragmentation of a brittle material substrate such as a glass substrate is performed by the following steps: a scribing step of forming a scribing line on the substrate surface, and a breaking step of applying a specific force to the substrate surface along the formed scribing line. For the formation of the scribing line, a scribing device having a scribing head is used. The scribing device includes, for example, a stage on which a substrate is placed, and the scribing head moves in the horizontal direction and the vertical direction with respect to the substrate placed on the stage. A wheel holder is attached to the lower end of the scribing head, and the cutter wheel is rotatably held by the wheel holder (for example, Patent Document 1). [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2004-26539

[發明所欲解決之問題] 在劃線裝置中,在形成劃線時,自基板產生微小之玻璃屑(切屑)。若該玻璃屑附著於載台上或基板上,並於在載台與基板之間夾有玻璃屑之狀態下載台進行基板之吸附,則在基板之表面產生損傷或局部的色不均。且,若於在載台上存在玻璃屑之狀態下將基板載置於載台,則亦有基板之上表面之高度變得高於預先設想之高度,而成為基板之分斷不良之原因的問題。 鑒於上述之課題,本發明之目的在於提供一種可利用簡單的構成順滑地清掃載台之上表面之搬送體、具備該搬送體之搬送裝置、及具備該搬送裝置之劃線系統。 [解決問題之技術手段] 本發明之第1態樣係關於一種保持著基板並將其自第1載台搬送至第2載台之搬送體。本態樣之搬送體具備第1清掃單元,該第1清掃單元配置於前述基板之搬送方向後方,在將前述基板自第1載台搬送至前述第2載台之步驟中與前述第1載台之上表面接觸,而清掃前述第1載台之上表面。 根據本態樣之搬送體,在保持著基板並將其自第1載台搬送至第2載台之步驟中,第1清掃單元與第1載台之上表面接觸。因而,第1清掃單元伴隨著基板之搬送一面與第1載台之上表面接觸一面移動,而清掃第1載台之上表面。藉此,例如,即便玻璃屑等分散在第1載台之上表面,仍可利用第1清掃單元自第1載台去除玻璃屑等。因而,根據本態樣之搬送體,能夠利用在搬送體配置第1清掃單元之簡單的構成順滑地清掃第1載台之上表面。 在本態樣之搬送體中,前述第1清掃單元可採用具備以下部分之構成,即:第1清掃工具、及使前述第1清掃工具相對於前述第1載台之上表面接觸及分隔的第1驅動部。如此,在清掃第1載台之上表面之期間以外,能夠使第1清掃工具退避至上方。因而,能夠抑制第1清掃工具對搬送體之搬送造成障礙。 本態樣之搬送體可採用具備第2清掃單元之構成,該第2清掃單元配置於前述基板之搬送方向前方,在將前述基板自第1載台搬送至前述第2載台之步驟中與前述第2載台之上表面接觸,而清掃前述第2載台之上表面。根據該構成,在保持著基板並將其自第1載台搬送至第2載台之步驟中,第2清掃單元與第2載台之上表面接觸。因而,第2清掃單元伴隨著基板之搬送一面與第2載台之上表面接觸一面移動,而清掃第2載台之上表面。藉此,例如,即便玻璃屑等分散在第2載台之上表面,仍可利用第2清掃單元自第2載台去除玻璃屑等。因而,能夠利用簡單的構成順滑地清掃第2載台之上表面。 在此一情形下,前述第2清掃單元可採用具備以下部分之構成,即:第2清掃工具、及使前述第2清掃工具相對於前述第2載台之上表面接觸及分隔的第2驅動部。如此,在清掃第2載台之上表面之期間以外,能夠使第2清掃工具退避至上方。因而,能夠抑制第2清掃工具對搬送體之搬送造成障礙。 本發明之第2態樣係關於一種將基板自第1載台搬送至第2載台的搬送裝置。本態樣之搬送裝置具備:第1態樣之搬送體、及使前述搬送體在前述第1載台與前述第2載台之間移動的搬送部。 根據本態樣之搬送裝置可獲得與上述第1態樣相同之效果。 本態樣之搬送裝置可具備第3清掃單元,該第3清掃單元配置於前述第1載台與前述第2載台之間之搬送路徑,在將前述基板自第1載台搬送至前述第2載台之步驟中與前述基板之下表面接觸,而清掃前述基板之下表面。根據該構成,在將基板自第1載台搬送至第2載台之步驟中,第3清掃單元與基板之下表面接觸。因而,第3清掃單元伴隨著基板之搬送一面與基板之下表面接觸一面相對地移動,而清掃基板之下表面。藉此,例如,即便玻璃屑等附著於基板之下表面,仍可利用第3清掃單元自基板之下表面去除玻璃屑等。因而,能夠利用簡單的構成順滑地清掃基板之下表面。 在此一情形下,前述第3清掃單元可採用具備以下部分之構成,即:第3清掃工具、及使前述第3清掃工具相對於前述基板之下表面接觸及分隔的第3驅動部。如此,在清掃基板之下表面之期間以外,能夠使第3清掃工具退避至下方。因而,能夠抑制第3清掃工具對搬送體之搬送造成障礙。 本發明之第3態樣係關於一種劃線系統。本態樣之劃線系統具備:上述第2態樣之搬送裝置、及在載置於前述第1載台之前述基板形成劃線之劃線裝置。 根據本態樣之搬送裝置可獲得與上述第1態樣相同之效果。 本發明之第4態樣係關於一種保持著基板並將其自第1載台搬送至第2載台之搬送體。本態樣之搬送體具備清掃單元,該清掃單元配置於前述基板之搬送方向後方,在將前述基板自第1載台搬送至前述第2載台之步驟中與前述第2載台之上表面接觸,而清掃前述第2載台之上表面。 根據本態樣之搬送體,在保持著基板並將其自第1載台搬送至第2載台之步驟中,清掃單元與第2載台之上表面接觸。因而,清掃單元伴隨著基板之搬送一面與第2載台之上表面接觸一面移動,而清掃第2載台之上表面。藉此,例如,即便玻璃屑等分散在第2載台之上表面,仍可利用清掃單元自第2載台去除玻璃屑等。因而,能夠利用簡單的構成順滑地清掃第2載台之上表面。 [發明之效果] 如以上般,根據本發明能夠提供一種可利用簡單的構成順滑地清掃載台之上表面之搬送體、具備該搬送體之搬送裝置、及具備該搬送裝置之劃線系統。 本發明之效果以及意義可由以下所示之實施形態之說明而更加明確化。惟,以下所示之實施形態終極而言僅為將本發明實施化時之一個例示,本發明不受以下之實施形態所記載之內容任何限制。[Problems to be Solved by the Invention] In the scribing device, when the scribing is formed, minute glass chips (chips) are generated from the substrate. If the glass scraps are adhered to the stage or the substrate, and the substrate is adsorbed on the download stage with the glass scraps sandwiched between the stage and the substrate, damage to the surface of the substrate or local color unevenness will occur. In addition, if the substrate is placed on the stage in the presence of glass shavings on the stage, the height of the upper surface of the substrate becomes higher than a pre-conceived height, which becomes the cause of the poor breaking of the substrate. problem. In view of the above-mentioned problems, an object of the present invention is to provide a conveying body capable of smoothly cleaning an upper surface of a stage with a simple structure, a conveying device including the same, and a scribing system including the conveying device. [Technical means for solving the problem] A first aspect of the present invention relates to a carrier that holds a substrate and transfers it from the first stage to the second stage. The conveyance body in this aspect includes a first cleaning unit, which is disposed behind the substrate in the conveying direction of the substrate, and is in the step of conveying the substrate from the first stage to the second stage and the first stage. The upper surface is in contact, and the upper surface of the first stage is cleaned. According to the conveyance body of this aspect, in the step of holding the substrate and transferring it from the first stage to the second stage, the first cleaning unit is in contact with the upper surface of the first stage. Therefore, the first cleaning unit moves while contacting the upper surface of the first stage with the conveyance of the substrate, and cleans the upper surface of the first stage. Thereby, for example, even if glass scraps and the like are scattered on the upper surface of the first stage, the glass scraps and the like can be removed from the first stage by the first cleaning unit. Therefore, according to the conveyance body of this aspect, the upper surface of a 1st stage can be cleaned smoothly by the simple structure which arrange | positions a 1st cleaning unit in a conveyance body. In the conveyance body of this aspect, the first cleaning unit may be configured to include a first cleaning tool and a first cleaning tool that contacts and separates the first cleaning tool from the upper surface of the first stage. 1Drive section. In this manner, the first cleaning tool can be retracted to the top except during a period when the upper surface of the first stage is being cleaned. Therefore, it is possible to prevent the first cleaning tool from hindering the transport of the transport body. The conveyance body in this aspect may be configured with a second cleaning unit, which is disposed in front of the substrate in the conveying direction. In the step of conveying the substrate from the first stage to the second stage, it is the same as the above. The upper surface of the second stage is in contact, and the upper surface of the second stage is cleaned. According to this configuration, in the step of holding the substrate and transferring it from the first stage to the second stage, the second cleaning unit is in contact with the upper surface of the second stage. Therefore, the second cleaning unit moves while contacting the upper surface of the second stage while the substrate is being transported, and cleans the upper surface of the second stage. With this, for example, even if glass dust and the like are scattered on the upper surface of the second stage, the second cleaning unit can still remove glass debris and the like from the second stage. Therefore, the upper surface of the second stage can be cleaned smoothly with a simple configuration. In this case, the second cleaning unit may be configured to include a second cleaning tool and a second drive for contacting and separating the second cleaning tool with respect to the upper surface of the second stage. unit. In this way, the second cleaning tool can be retracted to the top except during a period when the upper surface of the second stage is being cleaned. Therefore, it is possible to prevent the second cleaning tool from hindering the transport of the transport body. A second aspect of the present invention relates to a transfer device that transfers a substrate from a first stage to a second stage. The conveying device of this aspect includes a conveying body of a first aspect, and a conveying unit that moves the conveying body between the first stage and the second stage. The conveying device according to this aspect can obtain the same effect as that of the first aspect described above. The conveying device in this aspect may include a third cleaning unit which is arranged on a conveying path between the first stage and the second stage, and conveys the substrate from the first stage to the second stage. In the step of the stage, the lower surface of the substrate is contacted, and the lower surface of the substrate is cleaned. According to this configuration, in the step of transferring the substrate from the first stage to the second stage, the third cleaning unit is in contact with the lower surface of the substrate. Therefore, the third cleaning unit moves relatively as the substrate is conveyed while contacting the lower surface of the substrate, and cleans the lower surface of the substrate. With this, for example, even if glass scraps and the like adhere to the lower surface of the substrate, the third cleaning unit can still remove the glass scraps and the like from the lower surface of the substrate. Therefore, the lower surface of the substrate can be cleaned smoothly with a simple configuration. In this case, the third cleaning unit may be configured to include a third cleaning tool and a third driving unit that contacts and separates the third cleaning tool from the lower surface of the substrate. In this way, the third cleaning tool can be retracted to the lower side except during the period when the lower surface of the substrate is cleaned. Therefore, it is possible to prevent the third cleaning tool from hindering the transport of the transport body. A third aspect of the present invention relates to a scribing system. The scribing system of this aspect includes the above-mentioned second aspect of the transfer device and a scribing device for forming a scribing line on the substrate placed on the first stage. The conveying device according to this aspect can obtain the same effect as that of the first aspect described above. A fourth aspect of the present invention relates to a carrier that holds a substrate and transfers the substrate from the first stage to the second stage. The conveyance body in this aspect includes a cleaning unit which is disposed behind the substrate in the conveying direction of the substrate, and contacts the upper surface of the second stage in the step of transferring the substrate from the first stage to the second stage. While cleaning the upper surface of the second stage. According to the conveyance body of this aspect, in the step of holding the substrate and transferring it from the first stage to the second stage, the cleaning unit is in contact with the upper surface of the second stage. Therefore, the cleaning unit moves while contacting the upper surface of the second stage while the substrate is being transported, and cleans the upper surface of the second stage. With this, for example, even if glass dust and the like are scattered on the upper surface of the second stage, the glass dust and the like can be removed from the second stage by the cleaning unit. Therefore, the upper surface of the second stage can be cleaned smoothly with a simple configuration. [Effects of the Invention] As described above, according to the present invention, it is possible to provide a conveying body capable of smoothly cleaning the upper surface of a stage with a simple structure, a conveying device having the same, and a scribing system having the same . The effect and significance of the present invention will be made clearer by the description of the embodiment shown below. However, the embodiment shown below is merely an example for implementing the present invention, and the present invention is not limited by the content described in the following embodiment.

以下,針對本發明之實施形態,參照圖式進行說明。此外,在各圖中,為了方便說明,附記有彼此正交之XYZ軸。X-Y平面係水平面,Z軸正方向係鉛直下方向。 圖1係顯示劃線系統1及裂斷系統2之構成之立體圖。 劃線系統1具備:劃線裝置100、及搬送裝置200。裂斷系統2具備:旋轉裝置400、及裂斷裝置500。劃線裝置100在基板10之上表面形成劃線。搬送裝置200將形成有劃線之基板10自劃線裝置100搬送至旋轉裝置400。旋轉裝置400使搬送之基板10在上下方向上旋轉而交接至裂斷裝置500。裂斷裝置500將交接之基板10沿劃線分斷。基板10係液晶面板等之脆弱性基板。 劃線裝置100具備:載台110、旋轉機構120、移動機構130、及劃線頭140。 載台110在俯視觀察下具有大致正方形之形狀,在上表面具備用於吸附基板10之多數個孔。利用未圖示之空壓源對載台110之孔賦予壓力。藉由對孔賦予負壓而將基板10吸附於載台110。載台110構成作為基板10之搬送起始之第1載台。 載台110係藉由旋轉機構120而繞與Z軸平行之旋轉軸可旋轉地被支持。旋轉機構120具備:用於可旋轉地支持載台110之支持機構、及用於使載台110旋轉之馬達。旋轉機構120設置於支持台121,與支持台121一起藉由移動機構130而在Y軸方向上被給送。 移動機構130具備:用於在Y軸方向上平行地導引支持台121之一對導引件131、用於在Y軸方向上平行地驅動支持台121之螺桿132、及驅動螺桿132之馬達(未圖示)。 劃線頭140係藉由拱狀之支持機構141而可在X軸方向上平行移動地被支持。劃線頭140藉由馬達而在X軸方向上被移送。在劃線頭140之下端安裝有輪保持器,切刀輪旋轉自如地由該輪保持器保持。劃線頭140在內部具備使輪保持器在上下方向上升降之升降機構。 在劃線動作時,利用移動機構130使吸附於載台110之基板10定位於劃線頭140之下方。其次,劃線頭140使輪保持器下降,以一定負荷將切刀輪在基板10之上表面按壓。在該狀態下,劃線頭140在X軸方向上被移送。藉此,在基板10之上表面形成與X軸平行之劃線。在基板10之上表面,與X軸平行之複數條劃線在Y軸方向上以特定之間隔形成。在進一步形成與該等劃線垂直之劃線時,利用旋轉機構120將載台110旋轉90。而後,利用相同之步驟在基板10之上表面形成劃線。 搬送裝置200具備:搬送軌道210、升降機構220、吸附單元230、以及2個清掃單元240及清掃單元250。 搬送軌道210包含在X軸方向上延伸之板狀之構件,在與X軸平行之方向上導引升降機構220。升降機構220具備:支持台221、支柱222、及移動體223。支持台221具備與搬送軌道210之Y軸方向之兩端卡合之一對槽221a。藉由一對槽221a與搬送軌道210卡合,而在X軸方向上導引支持台221。支持台221係由帶式輸送機211在X軸方向上驅動。 支柱222設置於支持台221。移動體223係在上下方向上可移動地被支柱222支持。在移動體223之內部設置有用於使移動體223沿支柱222移動之驅動部(未圖示)。驅動部例如具備:朝上下導引移動體223之滑件、及用於朝上下驅動移動體223之線性馬達。在移動體223之Y軸正側之端部設置有吸附單元230。 吸附單元230在俯視觀察下具有長方形之板狀之形狀。吸附單元230在下表面具備用於吸附基板10之多數個孔。利用未圖示之空壓源對吸附單元230之孔賦予壓力。藉由對孔賦予負壓,而將基板10吸附於吸附單元230。 在吸附單元230之X軸正側之端部及X軸負側之端部分別設置有清掃單元240。X軸正側之清掃單元240構成用於清掃劃線裝置100之載台110之上表面之第1清掃單元。且,X軸負側之清掃單元240構成用於清掃旋轉裝置400之載台410之上表面之第2清掃單元。該等2個清掃單元240分別利用刷子241清掃載台110、410之上表面。2個清掃單元240具有彼此相同之構成。清掃單元240之構成隨後將參照圖2(a)至圖2(d)進行說明。 此外,由吸附單元230與2個清掃單元240構成搬送體300。 清掃單元250配置於劃線裝置100之載台110與旋轉裝置400之載台410之間的基板10之搬送路徑。清掃單元250構成用於清掃基板10之下表面之第3清掃單元。清掃單元250利用刷子251清掃基板10之下表面。清掃單元250之構成隨後將參照圖2(e)、及圖2(f)進行說明。 旋轉裝置400具備:載台410、支軸420、及馬達430。 載台410在俯視觀察下具有長方形之板狀之形狀。載台410在上表面具備用於吸附基板10之多數個孔。利用未圖示之空壓源對載台410之孔賦予壓力。藉由對孔賦予負壓而將基板10吸附於載台410。載台410構成作為基板10之搬送目的地之第2載台。 載台410之下表面載置於接收台411。且,載台410在X軸正側之端部被連結於馬達430之旋轉軸之支軸420支持。藉由利用馬達430使支軸420旋轉,而載台410以支軸420為軸迴旋。藉由在吸附有基板10之狀態下,支軸420被旋轉,而基板10以被上下反轉之狀態載置於裂斷裝置500之載台510。在該狀態下,載台410解除基板10之吸附,裂斷裝置500側之載台510開始基板10之吸附。如此,基板10被交接至裂斷裝置500之載台510。 裂斷裝置500具備:載台510、旋轉機構520、移動機構530、及裂斷桿540。 載台510在俯視觀察下具有大致正方形之形狀,在上表面具備用於吸附基板10之多數個孔。利用未圖示之空壓源對載台510之孔賦予壓力。藉由對孔賦予負壓而將基板10吸附於載台510。 載台510係藉由旋轉機構520而繞與Z軸平行之旋轉軸可旋轉地被支持。旋轉機構520具備:用於可旋轉地支持載台510之支持機構、及用於使載台510旋轉之馬達。旋轉機構520設置於支持台521,與支持台521一起藉由移動機構530而在Y軸方向上被給送。 移動機構530具備:用於在Y軸方向上平行地導引支持台521之一對導引件531、用於在Y軸方向上平行地驅動支持台521之螺桿532、及驅動螺桿532之馬達(未圖示)。 裂斷桿540係藉由拱狀之支持機構541而可上下移動地被支持。裂斷桿540藉由馬達542而在Z軸方向上被移送。裂斷桿540藉由一對軸543而在Z軸方向上被導引。 此外,載台110、410、510係配置為在X軸方向上呈直線狀並排。 在裂斷動作時,利用移動機構530使吸附於載台510之基板10定位於裂斷桿540之下方。其次,裂斷桿540下降,且裂斷桿540被按壓至劃線之位置。藉此,基板10沿劃線被分斷。如此,沿各劃線將基板10分斷。於在基板10形成與Y軸方向平行之劃線時,在使載台510旋轉90後,利用相同之動作沿各劃線將基板10分斷。 圖2(a)至圖2(d)分別係示意性地顯示設置於搬送體300之清掃單元240之構成及動作之側視圖。在圖2(a)至圖2(d)中圖示有X軸負側之清掃單元240,但X軸正側之清掃單元240亦成為相同之構成。 清掃單元240具備:刷子241、支持構件242、汽缸243、一對軸244、及支持構件245。 刷子241成為毛密集之構成,構成為可去除玻璃屑等之塵埃。刷子241之Y軸方向寬度係與吸附單元230之Y軸方向之寬度大致相同。刷子241之Y軸方向之寬度係較可載置於劃線裝置100之載台110之基板10之Y軸方向之寬度更大地設定。 支持構件242設置於吸附單元230之端部。支持構件242支持汽缸243。汽缸243係氣缸,利用來自空壓源之壓力使驅動軸243a朝Z軸正方向突出。在驅動軸243a設置有支持構件245。且,支持構件245藉由一對軸244而在Z軸方向上被導引。一對軸244設置於支持構件245之上表面,並插入形成於支持構件242之孔。在支持構件245之下表面設置有刷子241。 若自圖2(a)、及圖2(b)之狀態對汽缸243賦予正壓,則驅動軸243a朝下方突出。藉此,如圖2(c)、及圖2(d)所示,刷子241與支持構件245一起下降。且,若自圖2(c)、及圖2(d)之狀態對汽缸243賦予負壓,則驅動軸243a朝上方縮回。藉此,如圖2(a)、及圖2(b)所示,刷子241與支持構件245一起上升。 圖2(e)、及圖2(f)分別係示意性地顯示清掃單元250之構成及動作之側視圖。 清掃單元250具備:刷子251、支持構件252、汽缸253、一對軸254、及支持構件255。 刷子251成為毛密集之構成,構成為可去除玻璃屑等之塵埃。刷子251之Y軸方向寬度係與吸附單元230之Y軸方向之寬度大致相同。刷子251之Y軸方向之寬度係較可載置於劃線裝置100之載台110之基板10之Y軸方向之寬度更大地設定。 支持構件252設置於被設置在地面之支持台(未圖示)。支持構件252支持汽缸253。汽缸253係氣缸,利用來自空壓源之壓力使驅動軸253a朝Z軸正方向突出。在驅動軸253a設置有支持構件255。且,支持構件255藉由一對軸254而在Z軸方向上被導引。一對軸254設置於支持構件255之下表面,並插入形成於支持構件252之孔。在支持構件255之上表面設置有刷子251。 若自圖2(e)之狀態對汽缸253賦予正壓,則驅動軸253a朝上方突出。藉此,如圖2(f)所示,刷子251與支持構件255一起上升。且,若自圖2(f)之狀態對汽缸253賦予負壓,則驅動軸253a朝下方縮回。藉此,如圖2(e)所示,刷子251與支持構件255一起下降。 圖3(a)係顯示搬送裝置200之構成之方塊圖。 搬送裝置200具備:搬送部201、圖1所示之搬送體300、壓力賦予部202、基板清掃部203、檢測部204、及控制部205。 搬送部201將基板10自劃線裝置100之載台110搬送至旋轉裝置400之載台410。搬送部201包含:圖1所示之搬送軌道210、帶式輸送機211、及升降機構220。 搬送體300具備:載台清掃部301、及吸附部302。載台清掃部301清掃圖1之載台110、410。載台清掃部301包含圖1所示之2個清掃單元240。吸附部302包含圖1所示之吸附單元230。 壓力賦予部202包含空壓源,對搬送體300及基板清掃部203賦予壓力。基板清掃部203清掃基板10之下表面。基板清掃部203包含圖1所示之清掃單元250。檢測部204包含用於檢測搬送體300之位置之感測器等之各種感測器。控制部205包含CPU等之演算處理電路、及ROM、RAM、硬碟等之記憶體。控制部205遵循記憶於記憶體之程式而控制各部。 圖3(b)係顯示搬送裝置200之搬送控制之流程圖。該控制係由圖3(a)所示之控制部205執行。以下,適宜地參照圖4(a)至圖9(b)說明控制部205之搬送控制。圖4(a)至圖9(b)分別係示意性地顯示搬送裝置200之動作之側視圖。 此外,以下,將劃線裝置100之載台110特別地稱為第1載台110,將旋轉裝置400之載台410特別地稱為第2載台410。又,將配置於搬送體300之2個清掃單元240中之基板10之搬送方向後側(X軸負側)之清掃單元240特別地稱為第1清掃單元240,將基板10之搬送方向前側(X軸正側)之清掃單元240特別地稱為第2清掃單元240。再者,將清掃單元250特別地稱為第3清掃單元250。 在基板10之搬送動作即將開始前,搬送體300被定位於第1載台110與第2載台410之間之中間位置(初始位置)。在該狀態下,利用升降機構220將搬送體300定位於上升位置,第1清掃單元240及第2清掃單元240之刷子241分別被定位於上升位置。且,第3清掃單元250之刷子251被定位於下降位置。 搬送動作一開始,則控制部205係如圖4(a)所示般將搬送體300移送至第1載台110之上方(S101)。其次,控制部205使搬送體300下降並使吸附單元230之下表面與基板10之上表面重合,進而使基板10之上表面吸附於吸附單元230(S102)。之後,控制部205係如圖4(b)所示般使搬送體300上升(S103)。藉此,基板10自第1載台110被抬起。 其次,控制部205係如圖5(a)所示般,使第1清掃單元240之刷子241下降,且使第3清掃單元250之刷子251上升(S104)。藉此,第1清掃單元240之刷子241之下端較第1載台110之上表面定位於稍微靠下方,且第3清掃單元250之刷子251之上端較吸附於吸附單元230之基板10之下表面定位於稍微靠上方。 之後,控制部205使搬送體300在朝向第2載台410之方向(X軸正方向)上移送(S105)。藉此,如圖5(b)所示,第1清掃單元240之刷子241一面抵接於第1載台110之上表面一面移動。如此,第1載台110之上表面被清掃。且,第3清掃單元250之刷子251一面抵接於基板10之下表面一面相對於基板10相對地移動。如此,基板10之下表面被清掃。 之後,控制部205一面進行搬送體300之移送,一面如圖6(a)所示般使第2清掃單元240之刷子241下降(S106)。藉此,第2清掃單元240之刷子241之下端較第2載台410之上表面定位於稍微靠下方。進而,若進行搬送體300之移送,則如圖6(b)所示般,第2清掃單元240之刷子241一面抵接於第2載台410之上表面一面移動。如此,第2載台410之上表面被清掃。 其次,控制部205係如圖7(a)所示般,使第1清掃單元240之刷子241上升,使第3清掃單元250之刷子251下降(S107)。藉此,第1清掃單元240之刷子241之下端較第1載台110之上表面定位於稍微靠上方,且第3清掃單元250之刷子251之上端較吸附於吸附單元230之基板10之下表面定位於稍微靠下方。 如圖7(b)所示,若將搬送體300移送至第2載台410之上方,則控制部205係如圖8(a)所示般使第2清掃單元240之刷子241上升(S108)。藉此,第2清掃單元240之刷子241之下端較第2載台410之上表面定位於稍微靠上方。 其次,控制部205使搬送體300下降並使基板10之下表面與第2載台410之上表面重合,進而使吸附單元230解除基板10之吸附(S109)。之後,控制部205係如圖8(b)所示般使搬送體300上升(S110)。藉此,基板10載置於第2載台410之上表面。如此,對於1個基板10之搬送動作結束。 如圖8(b)所示,在下一基板10載置於第1載台110時,控制部205返回圖3(b)之步驟S101,執行對於下一基板10之搬送控制。藉此,如圖9(a)所示,搬送體300被移送至第1載台110之上方。在圖8(b)之狀態下,在下一基板10未載置於第1載台110時,控制部205將搬送體300移送至第1載台110與第2載台410之間之初始位置。 之後,旋轉裝置400之載台410在吸附基板10之狀態下,如圖9(b)所示般,以支軸420為中心沿順時針方向旋轉。藉此,基板10以被上下反轉之狀態被交接至裂斷裝置500之載台510。之後,執行對於基板10之裂斷動作。 <實施形態之效果> 根據本實施形態,可獲得以下之效果。 在搬送體300保持著基板10並將其自第1載台110搬送至第2載台410之步驟中,如圖5(b)所示般,第1清掃單元240之刷子241與第1載台110之上表面接觸。因而,第1清掃單元240之刷子241伴隨著基板10之搬送一面與第1載台110之上表面接觸一面移動,而清掃第1載台110之上表面。藉此,例如,即便因劃線動作產生之玻璃屑等分散在第1載台110之上表面,仍可利用第1清掃單元240之刷子241自第1載台110去除玻璃屑等。因而,根據本實施形態之搬送體300,能夠利用在搬送體300配置第1清掃單元240之簡單的構成順滑地清掃第1載台110之上表面。 第1清掃單元240具備:刷子241(第1清掃工具)、及使刷子241相對於第1載台110之上表面接觸及分隔的汽缸243(第1驅動部)。藉此,在清掃第1載台110之上表面之期間以外,如圖7(a)所示般,能夠使第1清掃單元240之刷子241退避至上方。因而,能夠抑制刷子241對搬送體300之搬送造成障礙。 搬送體300在基板10之搬送方向(X軸正方向)之前側具備第2清掃單元240。藉此,在保持著基板10並將其自第1載台110搬送至第2載台410之步驟中,如圖6(b)所示般,第2清掃單元240之刷子241與第2載台410之上表面接觸。因而,第2清掃單元240之刷子241伴隨著基板10之搬送一面與第2載台410之上表面接觸一面移動,而清掃第2載台410之上表面。藉此,例如,即便玻璃屑等分散在第2載台410之上表面,仍可利用第2清掃單元240自第2載台410去除玻璃屑等。因而,能夠利用簡單的構成順滑地清掃第2載台410之上表面。 第2清掃單元240具備:刷子241(第2清掃工具)、及使刷子241相對於第2載台410之上表面接觸及分隔的汽缸243(第2驅動部)。藉此,在清掃第2載台410之上表面之期間以外,如圖8(a)所示般,能夠使第2清掃單元240之刷子241退避至上方。因而,能夠抑制刷子241對搬送體300之搬送造成障礙。 搬送裝置200具備配置於第1載台110與第2載台410之間之搬送路徑之第3清掃單元250。藉此,在將基板10自第1載台110搬送至第2載台410之步驟中,如圖5(b)所示,第3清掃單元250之刷子251與基板10之下表面接觸。因而,第3清掃單元250之刷子251伴隨著基板10之搬送一面與基板10之下表面接觸一面相對於基板10相對地移動,而清掃基板10之下表面。藉此,例如,即便玻璃屑等附著於基板之下表面,仍可利用第3清掃單元250自基板10之下表面去除玻璃屑等。因而,能夠利用簡單的構成順滑地清掃基板10之下表面。 第3清掃單元250具備:刷子251(第3清掃工具)、及使刷子251相對於基板10之下表面接觸及分隔的汽缸253(第3驅動部)。藉此,在清掃基板10之下表面之期間以外,如圖7(a)所示般,能夠使刷子251退避至下方。因而,能夠抑制刷子251對搬送體300之搬送造成障礙。 <變更例> 以上,針對本發明之實施形態進行了說明,但本發明不受上述實施形態任何限制,且本發明之實施形態除上述內容以外還可進行各種變更。 例如,在上述實施形態中,刷子241及刷子251可分別利用汽缸243及汽缸253升降,但可行的是,刷子241固定於上述實施形態之下降位置,且刷子251固定於上述實施形態之上升位置。利用該構成仍能夠伴隨著搬送體300之移送,利用刷子241及刷子251分別清掃第1載台110及第2載台410之上表面、及基板10之下表面。 又,在上述實施形態中,將基板10自劃線裝置100之載台110搬送至旋轉裝置400之載台410,但搬送起始之載台與搬送目的地之載台並不一定限定於其。例如,可行的是,搬送目的地之載台係裂斷裝置500之載台510。 又,在上述實施形態中配置有第1清掃單元240及第2清掃單元240、以及第3清掃單元250之3個清掃單元,但該等3個清掃單元可不一定全部為必須。例如,在不清掃第2載台410之上表面、或利用其它之清掃機構清掃第2載台410之上表面之情形下,可自搬送體300省略第2清掃單元240。或,在不清掃基板10之下表面、或利用其它之清掃結構清掃基板10之下表面之情形下,可省略第3清掃單元250。 又,在上述實施形態中,如圖8(a)至圖9(a)所示,在使搬送體300返回第1載台110之方向之時,使X軸正側之第2清掃單元240之刷子241上升,但可行的是,在使第2清掃單元240之刷子241下降之狀態下朝第1載台110之方向移送搬送體300,而以第2清掃單元240之刷子241清掃載置於第2載台410之基板10之上表面。在此一情形下,在以第2清掃單元240之刷子241清掃基板10之上表面之步驟中,較佳的是,基板10以不會因刷子241之接觸而導致位置偏離之方式由第2載台410吸附。 又,在上述實施形態中,如圖8(b)至圖9(a)所示,在使搬送體300返回第1載台110之方向時,使X軸負側之第1清掃單元240之刷子241維持為上升之狀態,但可行的是,在使第1清掃單元240之刷子241下降之狀態下朝第1載台110之方向移送搬送體300,而再次以第1清掃單元240之刷子241清掃第1載台110之上表面。 又,在上述實施形態中,利用汽缸243及汽缸253進行刷子241及刷子251之升降,但可使用例如馬達或柱塞等之其他之驅動源使刷子241及刷子251升降。且,用於清掃載台110、410及基板10之清掃工具並不限定於刷子241、251,可為海綿等之其他之清掃工具。 此外,本發明之實施形態在申請專利範圍所示之技術性思想之範圍內可適宜地進行各種變更。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing, for convenience of explanation, XYZ axes orthogonal to each other are added. The X-Y plane is the horizontal plane, and the positive direction of the Z axis is the vertical downward direction. FIG. 1 is a perspective view showing the configuration of the scribing system 1 and the breaking system 2. The scribing system 1 includes a scribing device 100 and a transfer device 200. The breaking system 2 includes a rotating device 400 and a breaking device 500. The scribing device 100 forms a scribing line on the upper surface of the substrate 10. The transfer device 200 transfers the substrate 10 on which the scribing is formed from the scribing device 100 to the rotation device 400. The rotating device 400 rotates the conveyed substrate 10 in the vertical direction and transfers it to the breaking device 500. The breaking device 500 cuts off the transferred substrate 10 along the scribe line. The substrate 10 is a fragile substrate such as a liquid crystal panel. The scribing device 100 includes a stage 110, a rotation mechanism 120, a moving mechanism 130, and a scribing head 140. The stage 110 has a substantially square shape in a plan view, and includes a plurality of holes for adsorbing the substrate 10 on the upper surface. A pressure is applied to the holes of the stage 110 by an air pressure source (not shown). The substrate 10 is attracted to the stage 110 by applying a negative pressure to the hole. The stage 110 constitutes a first stage that is the start of the transfer of the substrate 10. The stage 110 is rotatably supported by a rotation mechanism 120 about a rotation axis parallel to the Z axis. The rotation mechanism 120 includes a support mechanism for rotatably supporting the stage 110 and a motor for rotating the stage 110. The rotating mechanism 120 is provided on the support table 121 and is fed in the Y-axis direction by the moving mechanism 130 together with the support table 121. The moving mechanism 130 includes a pair of guides 131 for guiding the support table 121 in parallel in the Y-axis direction, a screw 132 for driving the support table 121 in parallel in the Y-axis direction, and a motor for driving the screw 132 (Not shown). The scribing head 140 is supported by the arch-shaped support mechanism 141 so as to be movable in parallel in the X-axis direction. The scribing head 140 is moved in the X-axis direction by a motor. A wheel holder is mounted on the lower end of the scribing head 140, and the cutter wheel is rotatably held by the wheel holder. The scribing head 140 is internally provided with a lifting mechanism for lifting and lowering the wheel holder in the vertical direction. During the scribing operation, the substrate 10 attracted to the stage 110 is positioned below the scribing head 140 by the moving mechanism 130. Next, the scribing head 140 lowers the wheel holder, and presses the cutter wheel on the upper surface of the substrate 10 with a certain load. In this state, the scribing head 140 is transferred in the X-axis direction. Thereby, a scribe line parallel to the X axis is formed on the upper surface of the substrate 10. On the upper surface of the substrate 10, a plurality of scribe lines parallel to the X axis are formed at specific intervals in the Y axis direction. When further forming a scribe line perpendicular to the scribe lines, the stage 110 is rotated 90 by the rotation mechanism 120. Then, a scribe line is formed on the upper surface of the substrate 10 by the same steps. The transfer device 200 includes a transfer rail 210, a lifting mechanism 220, an adsorption unit 230, and two cleaning units 240 and 250. The conveyance rail 210 includes a plate-shaped member extending in the X-axis direction, and guides the elevating mechanism 220 in a direction parallel to the X-axis. The elevating mechanism 220 includes a support stand 221, a support 222, and a moving body 223. The support base 221 includes a pair of grooves 221 a that engage with both ends in the Y-axis direction of the transport rail 210. The pair of grooves 221 a is engaged with the conveyance rail 210 to guide the support table 221 in the X-axis direction. The support table 221 is driven by the belt conveyor 211 in the X-axis direction. The pillar 222 is provided on the support stand 221. The moving body 223 is movably supported in the up-down direction by a support 222. A driving unit (not shown) for moving the moving body 223 along the support 222 is provided inside the moving body 223. The driving unit includes, for example, a slider that guides the moving body 223 upward and downward, and a linear motor for driving the moving body 223 upward and downward. A suction unit 230 is provided at an end portion on the positive side of the Y-axis of the moving body 223. The adsorption unit 230 has a rectangular plate-like shape in a plan view. The adsorption unit 230 includes a plurality of holes for adsorbing the substrate 10 on the lower surface. Pressure is applied to the holes of the adsorption unit 230 by an air pressure source (not shown). By applying a negative pressure to the holes, the substrate 10 is adsorbed on the adsorption unit 230. A cleaning unit 240 is provided at an end portion on the X-axis positive side and an end portion on the X-axis negative side of the adsorption unit 230, respectively. The cleaning unit 240 on the X-axis positive side constitutes a first cleaning unit for cleaning the upper surface of the stage 110 of the scribing device 100. In addition, the cleaning unit 240 on the negative side of the X axis constitutes a second cleaning unit for cleaning the upper surface of the stage 410 of the rotary device 400. The two cleaning units 240 clean the upper surfaces of the stages 110 and 410 with a brush 241, respectively. The two cleaning units 240 have the same configuration. The configuration of the cleaning unit 240 will be described later with reference to FIGS. 2 (a) to 2 (d). Moreover, the conveyance body 300 is comprised by the adsorption | suction unit 230 and the two cleaning units 240. The cleaning unit 250 is arranged on the conveyance path of the substrate 10 between the stage 110 of the scribing device 100 and the stage 410 of the rotation device 400. The cleaning unit 250 constitutes a third cleaning unit for cleaning the lower surface of the substrate 10. The cleaning unit 250 cleans the lower surface of the substrate 10 with a brush 251. The configuration of the cleaning unit 250 will be described later with reference to FIGS. 2 (e) and 2 (f). The rotating device 400 includes a stage 410, a support shaft 420, and a motor 430. The stage 410 has a rectangular plate-like shape in a plan view. The stage 410 includes a plurality of holes for sucking the substrate 10 on the upper surface. The hole of the stage 410 is pressured by an air pressure source (not shown). The substrate 10 is attracted to the stage 410 by applying a negative pressure to the hole. The stage 410 constitutes a second stage as a transfer destination of the substrate 10. The lower surface of the stage 410 is placed on the receiving stage 411. The end of the stage 410 on the positive side of the X-axis is supported by a support shaft 420 connected to a rotation shaft of the motor 430. By using the motor 430 to rotate the support shaft 420, the stage 410 is rotated about the support shaft 420 as an axis. In a state where the substrate 10 is adsorbed, the support shaft 420 is rotated, and the substrate 10 is placed on the stage 510 of the breaking device 500 in a state of being inverted upside down. In this state, the stage 410 releases the adsorption of the substrate 10, and the stage 510 on the side of the breaking device 500 starts the adsorption of the substrate 10. In this way, the substrate 10 is transferred to the stage 510 of the breaking device 500. The breaking device 500 includes a stage 510, a rotating mechanism 520, a moving mechanism 530, and a breaking lever 540. The stage 510 has a substantially square shape in a plan view, and includes a plurality of holes for adsorbing the substrate 10 on the upper surface. A hole in the stage 510 is pressured by an air pressure source (not shown). The substrate 10 is attracted to the stage 510 by applying a negative pressure to the hole. The stage 510 is rotatably supported by a rotation mechanism 520 about a rotation axis parallel to the Z axis. The rotation mechanism 520 includes a support mechanism for rotatably supporting the stage 510 and a motor for rotating the stage 510. The rotation mechanism 520 is provided on the support table 521 and is fed in the Y-axis direction by the moving mechanism 530 together with the support table 521. The moving mechanism 530 includes a pair of guides 531 for guiding the support table 521 in parallel in the Y-axis direction, a screw 532 for driving the support table 521 in parallel in the Y-axis direction, and a motor for driving the screw 532. (Not shown). The breaking lever 540 is supported by an arch-shaped support mechanism 541 so as to be movable up and down. The breaking lever 540 is moved in the Z-axis direction by a motor 542. The breaking lever 540 is guided in the Z-axis direction by a pair of shafts 543. The stages 110, 410, and 510 are arranged side by side in a straight line in the X-axis direction. During the breaking operation, the substrate 10 adsorbed on the stage 510 is positioned below the breaking rod 540 by the moving mechanism 530. Next, the rupture lever 540 is lowered, and the rupture lever 540 is pressed to the scribe position. Thereby, the substrate 10 is divided along the scribe line. In this manner, the substrate 10 is divided along each scribe line. When a scribe line is formed on the substrate 10 parallel to the Y-axis direction, after the stage 510 is rotated 90, the substrate 10 is divided along each scribe line by the same operation. 2 (a) to 2 (d) are side views schematically showing the configuration and operation of the cleaning unit 240 provided on the conveyance body 300, respectively. Although the cleaning unit 240 on the negative side of the X axis is shown in FIGS. 2 (a) to 2 (d), the cleaning unit 240 on the positive side of the X axis has the same configuration. The cleaning unit 240 includes a brush 241, a support member 242, a cylinder 243, a pair of shafts 244, and a support member 245. The brush 241 has a dense hair structure and is configured to remove dust such as glass shavings. The width in the Y-axis direction of the brush 241 is substantially the same as the width in the Y-axis direction of the suction unit 230. The width in the Y-axis direction of the brush 241 is set larger than the width in the Y-axis direction of the substrate 10 that can be placed on the stage 110 of the scribing device 100. The support member 242 is provided at an end portion of the adsorption unit 230. The support member 242 supports the cylinder 243. The cylinder 243 is a cylinder, and the driving shaft 243a is protruded in the positive direction of the Z-axis by the pressure from the air pressure source. A support member 245 is provided on the drive shaft 243a. The support member 245 is guided in the Z-axis direction by a pair of shafts 244. A pair of shafts 244 are disposed on the upper surface of the support member 245 and are inserted into holes formed in the support member 242. A brush 241 is provided on the lower surface of the support member 245. When positive pressure is applied to the cylinder 243 from the state of FIG. 2 (a) and FIG. 2 (b), the drive shaft 243a protrudes downward. Thereby, as shown in FIG. 2 (c) and FIG. 2 (d), the brush 241 is lowered together with the support member 245. When a negative pressure is applied to the cylinder 243 from the state of FIG. 2 (c) and FIG. 2 (d), the drive shaft 243a is retracted upward. As a result, as shown in FIGS. 2 (a) and 2 (b), the brush 241 and the support member 245 are raised together. 2 (e) and 2 (f) are side views schematically showing the structure and operation of the cleaning unit 250, respectively. The cleaning unit 250 includes a brush 251, a support member 252, a cylinder 253, a pair of shafts 254, and a support member 255. The brush 251 has a dense hair structure and is configured to remove dust such as glass dust. The width in the Y-axis direction of the brush 251 is substantially the same as the width in the Y-axis direction of the suction unit 230. The width in the Y-axis direction of the brush 251 is set larger than the width in the Y-axis direction of the substrate 10 that can be placed on the stage 110 of the scribing device 100. The support member 252 is provided on a support table (not shown) provided on the ground. The support member 252 supports the cylinder 253. The cylinder 253 is a cylinder, and the drive shaft 253a is protruded in the positive direction of the Z-axis by the pressure from the air pressure source. A support member 255 is provided on the drive shaft 253a. The support member 255 is guided in the Z-axis direction by a pair of shafts 254. A pair of shafts 254 are provided on the lower surface of the support member 255 and are inserted into holes formed in the support member 252. A brush 251 is provided on the upper surface of the support member 255. When positive pressure is applied to the cylinder 253 from the state of FIG. 2 (e), the drive shaft 253a protrudes upward. Thereby, as shown in FIG. 2 (f), the brush 251 rises together with the support member 255. When a negative pressure is applied to the cylinder 253 from the state of FIG. 2 (f), the drive shaft 253a is retracted downward. Thereby, as shown in FIG. 2 (e), the brush 251 is lowered together with the support member 255. FIG. 3 (a) is a block diagram showing the configuration of the transfer device 200. As shown in FIG. The transfer device 200 includes a transfer unit 201, a transfer body 300 shown in FIG. 1, a pressure applying unit 202, a substrate cleaning unit 203, a detection unit 204, and a control unit 205. The transfer unit 201 transfers the substrate 10 from the stage 110 of the scribing device 100 to the stage 410 of the rotation device 400. The transfer unit 201 includes a transfer rail 210, a belt conveyor 211, and a lifting mechanism 220 shown in FIG. 1. The transport body 300 includes a stage cleaning section 301 and a suction section 302. The stage cleaning section 301 cleans the stages 110 and 410 of FIG. 1. The stage cleaning unit 301 includes two cleaning units 240 shown in FIG. 1. The adsorption unit 302 includes an adsorption unit 230 shown in FIG. 1. The pressure applying section 202 includes an air pressure source, and applies pressure to the carrier 300 and the substrate cleaning section 203. The substrate cleaning section 203 cleans the lower surface of the substrate 10. The substrate cleaning unit 203 includes a cleaning unit 250 shown in FIG. 1. The detection unit 204 includes various sensors such as a sensor for detecting the position of the conveyance body 300. The control unit 205 includes a calculation processing circuit such as a CPU, and a memory such as a ROM, a RAM, and a hard disk. The control unit 205 controls each unit in accordance with a program stored in the memory. FIG. 3 (b) is a flowchart showing the conveyance control of the conveyance device 200. This control is executed by the control section 205 shown in FIG. 3 (a). Hereinafter, the conveyance control of the control unit 205 will be described with reference to FIGS. 4 (a) to 9 (b) as appropriate. 4 (a) to 9 (b) are side views schematically showing the operation of the conveying device 200, respectively. In addition, hereinafter, the stage 110 of the scribing device 100 is specifically referred to as a first stage 110, and the stage 410 of the rotation device 400 is particularly referred to as a second stage 410. In addition, the cleaning unit 240 disposed on the rear side (negative X-axis side) of the substrate 10 in the two cleaning units 240 of the carrier 300 is specifically referred to as the first cleaning unit 240, and the substrate 10 is transported on the front side. The cleaning unit 240 (positive side of the X axis) is particularly referred to as a second cleaning unit 240. The cleaning unit 250 is particularly referred to as a third cleaning unit 250. Immediately before the transfer operation of the substrate 10 is started, the transfer body 300 is positioned at an intermediate position (initial position) between the first stage 110 and the second stage 410. In this state, the conveyance body 300 is positioned at the raised position by the lifting mechanism 220, and the brushes 241 of the first cleaning unit 240 and the second cleaning unit 240 are positioned at the raised positions, respectively. The brush 251 of the third cleaning unit 250 is positioned at the lowered position. When the conveyance operation is started, the control unit 205 moves the conveyance body 300 above the first stage 110 as shown in FIG. 4 (a) (S101). Next, the control unit 205 lowers the conveyance body 300 and overlaps the lower surface of the adsorption unit 230 with the upper surface of the substrate 10, and further adsorbs the upper surface of the substrate 10 to the adsorption unit 230 (S102). Thereafter, the control unit 205 raises the conveyance body 300 as shown in FIG. 4 (b) (S103). Thereby, the substrate 10 is lifted from the first stage 110. Next, as shown in FIG. 5 (a), the control unit 205 lowers the brush 241 of the first cleaning unit 240 and raises the brush 251 of the third cleaning unit 250 (S104). Thereby, the lower end of the brush 241 of the first cleaning unit 240 is positioned slightly lower than the upper surface of the first stage 110, and the upper end of the brush 251 of the third cleaning unit 250 is adsorbed below the substrate 10 of the adsorption unit 230 The surface is positioned slightly above. After that, the control unit 205 moves the conveyance body 300 in the direction (positive X-axis direction) toward the second stage 410 (S105). As a result, as shown in FIG. 5 (b), the brush 241 of the first cleaning unit 240 moves while abutting against the upper surface of the first stage 110. In this way, the upper surface of the first stage 110 is cleaned. In addition, the brush 251 of the third cleaning unit 250 moves relatively to the substrate 10 while abutting on the lower surface of the substrate 10. In this way, the lower surface of the substrate 10 is cleaned. After that, the control unit 205 lowers the brush 241 of the second cleaning unit 240 as shown in FIG. 6 (a) while transferring the carrier 300 (S106). Accordingly, the lower end of the brush 241 of the second cleaning unit 240 is positioned slightly lower than the upper surface of the second stage 410. Furthermore, when the conveyance body 300 is moved, as shown in FIG. 6 (b), the brush 241 of the second cleaning unit 240 moves while abutting on the upper surface of the second stage 410. In this way, the upper surface of the second stage 410 is cleaned. Next, as shown in FIG. 7 (a), the control unit 205 raises the brush 241 of the first cleaning unit 240 and lowers the brush 251 of the third cleaning unit 250 (S107). As a result, the lower end of the brush 241 of the first cleaning unit 240 is positioned slightly above the upper surface of the first stage 110, and the upper end of the brush 251 of the third cleaning unit 250 is adsorbed below the substrate 10 of the adsorption unit 230. The surface is positioned slightly below. As shown in FIG. 7 (b), when the carrier 300 is moved above the second stage 410, the control unit 205 raises the brush 241 of the second cleaning unit 240 as shown in FIG. 8 (a) (S108 ). Thereby, the lower end of the brush 241 of the second cleaning unit 240 is positioned slightly above the upper surface of the second stage 410. Next, the control unit 205 lowers the conveyance body 300 and overlaps the lower surface of the substrate 10 with the upper surface of the second stage 410, and further causes the adsorption unit 230 to release the adsorption of the substrate 10 (S109). Thereafter, the control unit 205 raises the conveyance body 300 as shown in FIG. 8 (b) (S110). Thereby, the substrate 10 is placed on the upper surface of the second stage 410. In this way, the transport operation for one substrate 10 is completed. As shown in FIG. 8 (b), when the next substrate 10 is placed on the first stage 110, the control unit 205 returns to step S101 in FIG. 3 (b) and executes the conveyance control for the next substrate 10. As a result, as shown in FIG. 9 (a), the carrier 300 is transferred above the first stage 110. In the state of FIG. 8 (b), when the next substrate 10 is not placed on the first stage 110, the control unit 205 moves the carrier 300 to the initial position between the first stage 110 and the second stage 410. . After that, the stage 410 of the rotation device 400 rotates in a clockwise direction around the support shaft 420 as shown in FIG. 9 (b) while the substrate 10 is being adsorbed. Thereby, the substrate 10 is transferred to the stage 510 of the breaking device 500 in a state of being inverted upside down. Thereafter, a cracking operation on the substrate 10 is performed. <Effects of Embodiment> According to this embodiment, the following effects can be obtained. As shown in FIG. 5 (b), in the step where the carrier 300 holds the substrate 10 and transfers it from the first stage 110 to the second stage 410, as shown in FIG. 5 (b), the brush 241 of the first cleaning unit 240 and the first carrier The upper surface of the stage 110 is in contact. Therefore, the brush 241 of the first cleaning unit 240 moves while contacting the upper surface of the first stage 110 while the substrate 10 is being transported, and cleans the upper surface of the first stage 110. With this, for example, even if glass scraps or the like generated by the scribing operation are scattered on the upper surface of the first stage 110, the glass scraps or the like can be removed from the first stage 110 by the brush 241 of the first cleaning unit 240. Therefore, according to the conveyance body 300 of this embodiment, the upper surface of the 1st stage 110 can be cleaned smoothly with the simple structure which arrange | positions the 1st cleaning unit 240 in the conveyance body 300. The first cleaning unit 240 includes a brush 241 (first cleaning tool), and a cylinder 243 (first driving section) that contacts and separates the brush 241 from the upper surface of the first stage 110. As a result, the brush 241 of the first cleaning unit 240 can be retracted upward as shown in FIG. 7 (a) except during the time when the upper surface of the first stage 110 is cleaned. Therefore, it is possible to prevent the brush 241 from hindering the conveyance of the conveyance body 300. The transport body 300 includes a second cleaning unit 240 on the front side of the substrate 10 in the transport direction (positive X-axis direction). As a result, in the step of holding the substrate 10 and transferring it from the first stage 110 to the second stage 410, as shown in FIG. 6 (b), the brush 241 of the second cleaning unit 240 and the second stage The upper surface of the stage 410 is in contact. Therefore, the brush 241 of the second cleaning unit 240 moves while contacting the upper surface of the second stage 410 while the substrate 10 is being transported, and cleans the upper surface of the second stage 410. Thereby, for example, even if glass scraps and the like are scattered on the upper surface of the second stage 410, the second cleaning unit 240 can still remove the glass scraps and the like from the second stage 410. Therefore, the upper surface of the second stage 410 can be cleaned smoothly with a simple configuration. The second cleaning unit 240 includes a brush 241 (a second cleaning tool), and a cylinder 243 (a second driving unit) that contacts and separates the brush 241 from the upper surface of the second stage 410. As a result, the brush 241 of the second cleaning unit 240 can be retracted upward as shown in FIG. 8 (a) except during the time when the upper surface of the second stage 410 is cleaned. Therefore, it is possible to prevent the brush 241 from hindering the conveyance of the conveyance body 300. The transfer device 200 includes a third cleaning unit 250 arranged on a transfer path between the first stage 110 and the second stage 410. Thereby, in the step of transferring the substrate 10 from the first stage 110 to the second stage 410, as shown in FIG. 5 (b), the brush 251 of the third cleaning unit 250 is in contact with the lower surface of the substrate 10. Therefore, the brush 251 of the third cleaning unit 250 moves relative to the substrate 10 while the substrate 10 is in contact with the lower surface of the substrate 10 while being conveyed, and cleans the lower surface of the substrate 10. With this, for example, even if glass scraps and the like adhere to the lower surface of the substrate, the third cleaning unit 250 can still remove the glass scraps and the like from the lower surface of the substrate 10. Therefore, the lower surface of the substrate 10 can be cleaned smoothly with a simple configuration. The third cleaning unit 250 includes a brush 251 (third cleaning tool), and a cylinder 253 (third driving section) that contacts and separates the brush 251 from the lower surface of the substrate 10. As a result, the brush 251 can be retracted downward as shown in FIG. 7 (a) except during the period when the lower surface of the substrate 10 is cleaned. Therefore, it is possible to prevent the brush 251 from hindering the conveyance of the conveyance body 300. <Modifications> The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments, and the embodiments of the present invention can be variously modified in addition to the above. For example, in the above embodiment, the brush 241 and the brush 251 can be raised and lowered by the cylinder 243 and the cylinder 253, respectively, but it is feasible that the brush 241 is fixed at the lowered position of the above embodiment, and the brush 251 is fixed at the raised position of the above embodiment. . With this configuration, the upper surface of the first stage 110 and the second stage 410 and the lower surface of the substrate 10 can be cleaned with the brush 241 and the brush 251, respectively, with the transfer of the carrier 300. Furthermore, in the above-mentioned embodiment, the substrate 10 is transferred from the stage 110 of the scribing device 100 to the stage 410 of the rotary device 400, but the stage at which the transfer is started and the stage at the transfer destination are not necessarily limited to these. . For example, it is possible that the carrier of the transfer destination is the carrier 510 of the breaking device 500. Moreover, although the three cleaning units of the 1st cleaning unit 240, the 2nd cleaning unit 240, and the 3rd cleaning unit 250 are arrange | positioned in the said embodiment, all these 3 cleaning units may not necessarily be necessary. For example, when the upper surface of the second stage 410 is not cleaned, or when the upper surface of the second stage 410 is cleaned by another cleaning mechanism, the second cleaning unit 240 may be omitted from the carrier 300. Alternatively, when the lower surface of the substrate 10 is not cleaned or the lower surface of the substrate 10 is cleaned with another cleaning structure, the third cleaning unit 250 may be omitted. In the above embodiment, as shown in FIGS. 8 (a) to 9 (a), when the transport body 300 is returned to the direction of the first stage 110, the second cleaning unit 240 on the positive side of the X axis is returned. The brush 241 is raised, but it is possible to move the carrier 300 toward the first stage 110 while the brush 241 of the second cleaning unit 240 is lowered, and clean and place the brush 241 of the second cleaning unit 240 On the upper surface of the substrate 10 on the second stage 410. In this case, in the step of cleaning the upper surface of the substrate 10 with the brush 241 of the second cleaning unit 240, it is preferable that the substrate 10 is moved from the second to the second in a manner that does not cause positional deviation due to the contact of the brush 241. The stage 410 is adsorbed. Moreover, in the above-mentioned embodiment, as shown in FIGS. 8 (b) to 9 (a), when returning the carrier 300 to the direction of the first stage 110, the first cleaning unit 240 on the negative side of the X-axis is moved. The brush 241 is maintained in a raised state, but it is feasible to transfer the carrier 300 toward the first stage 110 with the brush 241 of the first cleaning unit 240 lowered, and use the brush of the first cleaning unit 240 again. 241 Cleans the upper surface of the first stage 110. In the above-mentioned embodiment, the brush 241 and the brush 251 are raised and lowered by using the cylinder 243 and the cylinder 253. However, the brush 241 and the brush 251 may be raised and lowered by using another driving source such as a motor or a plunger. In addition, the cleaning tools for cleaning the stages 110 and 410 and the substrate 10 are not limited to the brushes 241 and 251, and may be other cleaning tools such as sponges. In addition, the embodiment of the present invention can be appropriately modified in various ways within the scope of the technical idea shown in the scope of the patent application.

1‧‧‧劃線系統 1‧‧‧ Crossing system

2‧‧‧裂斷系統 2‧‧‧ Split System

10‧‧‧基板 10‧‧‧ substrate

100‧‧‧劃線裝置 100‧‧‧ scribing device

110‧‧‧第1載台/載台 110‧‧‧1st stage / stage

120‧‧‧旋轉機構 120‧‧‧ rotating mechanism

121‧‧‧支持台 121‧‧‧Support Desk

130‧‧‧移動機構 130‧‧‧mobile agency

131‧‧‧導引件 131‧‧‧Guide

132‧‧‧螺桿 132‧‧‧Screw

140‧‧‧劃線頭 140‧‧‧ crossed head

141‧‧‧支持機構 141‧‧‧Support institutions

200‧‧‧搬送裝置 200‧‧‧ transfer device

201‧‧‧搬送部 201‧‧‧Transportation Department

202‧‧‧壓力賦予部 202‧‧‧Pressure imparting department

203‧‧‧基板清掃部 203‧‧‧Substrate cleaning department

204‧‧‧檢測部 204‧‧‧Testing Department

205‧‧‧控制部 205‧‧‧Control Department

210‧‧‧搬送軌道 210‧‧‧ transport track

211‧‧‧帶式輸送機 211‧‧‧belt conveyor

220‧‧‧升降機構 220‧‧‧Lifting mechanism

221‧‧‧支持台 221‧‧‧Support Desk

221a‧‧‧槽 221a‧‧‧slot

222‧‧‧支柱 222‧‧‧ Pillar

223‧‧‧移動體 223‧‧‧mobile

230‧‧‧吸附單元 230‧‧‧ Adsorption unit

240‧‧‧第1清掃單元/清掃單元/第2清掃單元 240‧‧‧ 1st cleaning unit / cleaning unit / 2nd cleaning unit

241‧‧‧刷子 241‧‧‧Brush

242‧‧‧支持構件 242‧‧‧Support components

243‧‧‧汽缸 243‧‧‧Cylinder

243a‧‧‧驅動軸 243a‧‧‧Drive shaft

244‧‧‧軸 244‧‧‧axis

245‧‧‧支持構件 245‧‧‧Support components

250‧‧‧第3清掃單元/清掃單元 250‧‧‧ 3rd cleaning unit / cleaning unit

251‧‧‧刷子 251‧‧‧Brushes

252‧‧‧支持構件 252‧‧‧Support components

253‧‧‧汽缸 253‧‧‧Cylinder

253a‧‧‧驅動軸 253a‧‧‧Drive shaft

254‧‧‧軸 254‧‧‧axis

255‧‧‧支持構件 255‧‧‧ supporting components

300‧‧‧搬送體 300‧‧‧ transport body

301‧‧‧載台清掃部 301‧‧‧Platform cleaning department

302‧‧‧吸附部 302‧‧‧Adsorption Department

400‧‧‧旋轉裝置 400‧‧‧ rotating device

410‧‧‧第2載台/載台 410‧‧‧Second carrier / carrier

411‧‧‧接收台 411‧‧‧Receiving Station

420‧‧‧支軸 420‧‧‧ support shaft

430‧‧‧馬達 430‧‧‧Motor

500‧‧‧裂斷裝置 500‧‧‧ Splitting device

510‧‧‧載台 510‧‧‧ carrier

520‧‧‧旋轉機構 520‧‧‧rotating mechanism

521‧‧‧支持台 521‧‧‧Support Desk

530‧‧‧移動機構 530‧‧‧mobile agency

531‧‧‧導引件 531‧‧‧Guide

532‧‧‧螺桿 532‧‧‧Screw

540‧‧‧裂斷桿 540‧‧‧ split rod

541‧‧‧支持機構 541‧‧‧ Supporting Organizations

542‧‧‧馬達 542‧‧‧Motor

543‧‧‧軸 543‧‧‧axis

圖1係顯示實施形態之劃線系統及裂斷系統之構成之立體圖。 圖2(a)至圖2(d)分別係示意性地顯示設置於實施形態之搬送體之清掃單元之構成及動作之側視圖。圖2(e)、及圖2(f)分別係示意性地顯示與實施形態之搬送體不同地配置之清掃單元之構成及動作之側視圖。 圖3(a)係顯示實施形態之搬送裝置之構成之方塊圖。圖3(b)係顯示實施形態之搬送裝置之搬送控制之流程圖。 圖4(a)、及圖4(b)分別係示意性地顯示實施形態之搬送裝置之動作之側視圖。 圖5(a)、及圖5(b)分別係示意性地顯示實施形態之搬送裝置之動作之側視圖。 圖6(a)、及圖6(b)分別係示意性地顯示實施形態之搬送裝置之動作之側視圖。 圖7(a)、及圖7(b)分別係示意性地顯示實施形態之搬送裝置之動作之側視圖。 圖8(a)、及圖8(b)分別係示意性地顯示實施形態之搬送裝置之動作之側視圖。 圖9(a)、及圖9(b)分別係示意性地顯示實施形態之搬送裝置之動作之側視圖。FIG. 1 is a perspective view showing the configuration of the scribing system and the breaking system of the embodiment. 2 (a) to 2 (d) are side views schematically showing the structure and operation of a cleaning unit provided on a transport body according to an embodiment. Fig. 2 (e) and Fig. 2 (f) are side views each schematically showing the configuration and operation of a cleaning unit which is arranged differently from the conveyance body of the embodiment. Fig. 3 (a) is a block diagram showing the configuration of the conveying device of the embodiment. Fig. 3 (b) is a flowchart showing the conveyance control of the conveyance device according to the embodiment. Fig. 4 (a) and Fig. 4 (b) are side views each schematically showing the operation of the conveying device according to the embodiment. Fig. 5 (a) and Fig. 5 (b) are side views each schematically showing the operation of the conveying device according to the embodiment. Fig. 6 (a) and Fig. 6 (b) are side views each schematically showing the operation of the conveying device according to the embodiment. Fig. 7 (a) and Fig. 7 (b) are side views each schematically showing the operation of the conveying device according to the embodiment. Fig. 8 (a) and Fig. 8 (b) are side views each schematically showing the operation of the conveying device according to the embodiment. Fig. 9 (a) and Fig. 9 (b) are side views each schematically showing the operation of the conveying device according to the embodiment.

Claims (9)

一種搬送體,其特徵在於其係保持著基板並將其自第1載台搬送至第2載台者,其具備第1清掃單元,該第1清掃單元配置於前述基板之搬送方向後方,在將前述基板自前述第1載台搬送至前述第2載台之步驟中與前述第1載台之上表面接觸,而清掃前述第1載台之上表面。A transfer body is characterized in that it is a person who holds a substrate and transfers it from the first stage to the second stage, and includes a first cleaning unit which is disposed behind the substrate in the direction of transportation of the substrate, In the step of transferring the substrate from the first stage to the second stage, the substrate is brought into contact with the upper surface of the first stage, and the upper surface of the first stage is cleaned. 如請求項1之搬送體,其中前述第1清掃單元具備:第1清掃工具、及使前述第1清掃工具相對於前述第1載台之上表面接觸及分隔的第1驅動部。For example, the conveyance body according to claim 1, wherein the first cleaning unit includes a first cleaning tool and a first driving unit that contacts and separates the first cleaning tool with respect to the upper surface of the first stage. 如請求項1或2之搬送體,其中具備第2清掃單元,該第2清掃單元配置於前述基板之搬送方向前方,在將前述基板自前述第1載台搬送至前述第2載台之步驟中與前述第2載台之上表面接觸,而清掃前述第2載台之上表面。For example, if the conveyance body of item 1 or 2 includes a second cleaning unit, the second cleaning unit is arranged in front of the substrate in the conveying direction, and the step of transferring the substrate from the first carrier to the second carrier In contact with the upper surface of the second stage, the upper surface of the second stage is cleaned. 如請求項3之搬送體,其中前述第2清掃單元具備:第2清掃工具、及使前述第2清掃工具相對於前述第2載台之上表面接觸及分隔的第2驅動部。In the conveyance body of claim 3, the second cleaning unit includes a second cleaning tool, and a second driving unit that contacts and separates the second cleaning tool from the upper surface of the second stage. 一種搬送裝置,其具備: 如請求項1至4中任一項之搬送體;及 使前述搬送體在前述第1載台與前述第2載台之間移動之搬送部。A transfer device includes: a transfer body according to any one of claims 1 to 4; and a transfer unit that moves the transfer body between the first carrier and the second carrier. 如請求項5之搬送裝置,其中具備第3清掃單元,該第3清掃單元配置於前述第1載台與前述第2載台之間之搬送路徑,在將前述基板自前述第1載台搬送至前述第2載台之步驟中與前述基板之下表面接觸,而清掃前述基板之下表面。For example, the transfer device of claim 5 includes a third cleaning unit which is disposed on a transfer path between the first carrier and the second carrier, and transports the substrate from the first carrier. In the step up to the second stage, the lower surface of the substrate is contacted, and the lower surface of the substrate is cleaned. 如請求項6之搬送裝置,其中前述第3清掃單元具備:第3清掃工具、及使前述第3清掃工具相對於前述基板之下表面接觸及分隔的第3驅動部。The transporting device according to claim 6, wherein the third cleaning unit includes: a third cleaning tool; and a third driving unit that contacts and separates the third cleaning tool from the lower surface of the substrate. 一種劃線系統,其具備: 如請求項5至7中任一項之搬送裝置;及 在載置於前述第1載台之前述基板形成劃線之劃線裝置。A scribing system comprising: a transfer device according to any one of claims 5 to 7; and a scribing device for forming a scribing line on the substrate on the first stage. 一種搬送體,其特徵在於其係保持著基板並將其自第1載台搬送至第2載台者,其具備清掃單元,該清掃單元配置於前述基板之搬送方向後方,在將前述基板自第1載台搬送至前述第2載台之步驟中與前述第2載台之上表面接觸,而清掃前述第2載台之上表面。A transfer body is characterized in that it is a person who holds a substrate and transfers it from the first stage to the second stage, and is provided with a cleaning unit which is arranged behind the substrate in the conveying direction, and transfers the substrate from the substrate. In the step of transferring the first carrier to the second carrier, the upper surface of the second carrier is brought into contact with the upper surface of the second carrier, and the upper surface of the second carrier is cleaned.
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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109129386A (en) * 2018-07-10 2019-01-04 伯恩光学(惠州)有限公司 Pen machine
TWI758826B (en) * 2020-08-19 2022-03-21 萬潤科技股份有限公司 Cutting method, cutting equipment and auxiliary components used in the cutting method
CN113333416B (en) * 2021-06-16 2023-04-18 昆明欧迈科技有限公司 Pipe tobacco case cleaning device
CN113695308B (en) * 2021-07-20 2023-01-13 山东力冠微电子装备有限公司 Semiconductor wafer pretreatment system
CN114472266B (en) * 2022-01-14 2023-07-28 南京尚科得科技发展有限公司 Medical isolation box acrylic plate treatment equipment

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2539911Y2 (en) * 1992-01-13 1997-07-02 三星ダイヤモンド工業株式会社 Cleaning and transfer machine in automatic board cutting equipment
JP2578845Y2 (en) * 1992-07-29 1998-08-20 三星ダイヤモンド工業株式会社 Transfer machine with positioning function in automatic substrate cutting device
JP2004026539A (en) 2002-06-24 2004-01-29 Nakamura Tome Precision Ind Co Ltd Method and apparatus for cutting glass substrate
JP4243990B2 (en) * 2003-07-11 2009-03-25 日東電工株式会社 Semiconductor wafer transfer method and transfer apparatus
JP2009157247A (en) * 2007-12-27 2009-07-16 Orc Mfg Co Ltd Exposure apparatus
TWI406326B (en) * 2008-10-24 2013-08-21 Macronix Int Co Ltd Dust collecting device, auto clean device and auto clean method
CN201357414Y (en) * 2009-02-19 2009-12-09 北京京东方光电科技有限公司 Mechanical arm
JP2011041444A (en) * 2009-08-18 2011-02-24 Yokogawa Electric Corp Planar motor
KR101968792B1 (en) * 2011-11-16 2019-04-12 니폰 덴키 가라스 가부시키가이샤 Glass plate cleaving device, method for cleaving glass plate, method for manufacturing glass plate, and glass plate cleaving system
JP2014091652A (en) * 2012-11-05 2014-05-19 Mitsuboshi Diamond Industrial Co Ltd Substrate segmentation apparatus
CN203700180U (en) * 2014-01-17 2014-07-09 宫庆长 Cullet sweeping device
CN204325131U (en) * 2014-12-26 2015-05-13 芜湖东旭光电装备技术有限公司 Glass chip clearing device
WO2016159062A1 (en) * 2015-03-30 2016-10-06 株式会社ニコン Object conveyance apparatus, exposure apparatus, flat panel display production method, device production method, object conveyance method, and exposure method
CN104889979B (en) * 2015-05-20 2016-08-24 洛阳中冶重工机械有限公司 A kind of vacuum cap type palletizing mechanical arm
CN204779332U (en) * 2015-06-10 2015-11-18 江西赣悦光伏玻璃有限公司 Intelligent cutting equipment of photovoltaic glass
CN205011631U (en) * 2015-09-25 2016-02-03 嵊州市寰鼎玻璃科技有限公司 A automatic cutting machine for glass makes
CN205387544U (en) * 2016-03-17 2016-07-20 日本电气硝子株式会社 Device for cutting sheet glass
CN105922113B (en) * 2016-06-20 2019-02-22 广东华技达精密机械有限公司 Mainboard cleaning machine and mainboard cleaning method

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