TW201221341A - Lamination process and thin film structure - Google Patents

Lamination process and thin film structure Download PDF

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Publication number
TW201221341A
TW201221341A TW99140200A TW99140200A TW201221341A TW 201221341 A TW201221341 A TW 201221341A TW 99140200 A TW99140200 A TW 99140200A TW 99140200 A TW99140200 A TW 99140200A TW 201221341 A TW201221341 A TW 201221341A
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Taiwan
Prior art keywords
substrate
carrier
flexible film
stage
film
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TW99140200A
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Chinese (zh)
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TWI402161B (en
Inventor
Jung-Ching Liou
Chien-Sen Huang
Shih-Hsien Wang
hua-an Zhang
Hsiu-Chu Liu
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Au Optronics Corp
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Priority to TW99140200A priority Critical patent/TWI402161B/en
Priority to CN 201110031077 priority patent/CN102173171B/en
Publication of TW201221341A publication Critical patent/TW201221341A/en
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Publication of TWI402161B publication Critical patent/TWI402161B/en

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  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

A lamination process and a thin film structure manufactured by the lamination process are described. The lamination process includes providing a first plate and a second plate. A flexible thin film is disposed on the first plate, a substrate is disposed on the second plate, and an adhesive is coated on the substrate. The first plate is turned to dispose above the second plate. A pressing roller presses on the thin film such that the thin film contacts with the adhesive on the substrate. The second plate is moved along a first direction and the pressing roller is rolled along a second direction opposite to the first direction, and the moving rate of the second plate and the rolling rate of the pressing roller are the same. The thin film structure manufactured by the lamination process has a roller area and a non-roller area, wherein the thickness of the adhesive on the roll area is thinner than on the non-roller area. Therefore, it results to solve the uniform and pollution problem.

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201221341 AU1007049 35885twf.doc/n 六、發明說明: 【發明所屬之技術領域】 本發明是有關於一種貼合程序以及薄膜結構。 【先前技術】 一般來說’顯示面板或是觸控面板在製作完成之後, ,會在面板上貼附-層保制。而傳聽護膜的貼附方式 是在面板之表面塗佈一層膠材之後,直接將保護膜放置在 膠材上。接著再以滾輪將保護臈壓平以使保護臈貼附於面 板上。 但是,傳統貼合方法所存在的問題是,在滾輪滾壓的 過程之中,膠材容易溢出而污染到滾輪或是機台。另外’ 在滾壓過程之巾通常會加熱’而此加熱溫度往往會造成膠 材產生内縮或是外擴,而導致保護膜的貼附不平整。另外, 在滾壓過程之中,滾輪的滾壓也經常使保護膜產生皺折。 【發明内容】 本發明提供一種貼合程序與以此貼合程序製出的薄 膜結構,其可⑽免傳統貼合程序所存在的貼 答以 及膠材污染機台等等問題。 本發明提出-種貼合程序,其包括提供第 及第二承載台。將軟性薄膜設置在第—承载台上^ ό又置在第二承載台上,並且於基板上塗佈膠材。將一 載台翻轉至第二承載台上方。將加壓滾輪壓著在軟性薄膜 201221341 AU1007049 35885twf.doc/n 以第一方向移動 上,以使軟性薄膜與基板上之膠材 — 第二承載台並且以第二方向滾動 := 貼合於基板上,其中第-方向與第二錢軟性薄膜 載台的移動速度與加壓滾輪的滾動速度相同目反’且第二承 本發明提出一種薄膜結構,1命二 — 及膠材。軟性薄,位於基板上。·材位‘基板二 之間’其巾軟性賴具有滾壓區與麵壓區,而滾壓區之 膠材厚度會小於非滾壓區之膠材厚度。 基於上述’本發明使用特殊的接合程序將軟性薄膜貼 合在基板上’可轉決傳賴合程序畴在_合 以及膠材污染機台等等問題。 為讓本發明之上述特徵和優點能更明顯易懂,下文特 舉實施例’並配合所附圖式作詳細說明如下。 、 【實施方式】 圖1A至圖1G是根據本發明一實施例之貼合程序的 示意圖。請參照圖1A,本實施例之貼合程序首先提供第一 承載台100以及第二承載台200。接著,將軟性薄膜no 設置在第一承載台100上,另外將基板220設置在第二承 載台上200。軟性薄膜110包括有機聚合物材料,且基板 220例如是玻璃基板、碎基板或是其他硬質基板。在此, 軟性薄膜110是透過工具(例如是口字形叉具)而放置在第 一承載台100之表面上。而基板220則是透過機械手臂放 置於自第二承載台200伸出的頂針202上。 2〇i22i2!J·— 根據本實施例,第一承載台100以及第二承載台200 分別為加熱承載台。特別是,在貼合程序之中,第一承載 台100以及第一承載台200的加熱溫度相同,如此可使第 一承載台100上之軟性薄膜11〇以及第二承載台上200之 基板220的溫度相同。 此外’在第一承載台1〇〇與第二承載台200上方更包 括設置有加壓滾輪300,其後續是用來對軟性薄膜11〇進 行滚壓程序。在此,加壓滾輪300為加熱式加壓滚輪,且 所述加壓滚輪300的加熱溫度與第一承載台1〇〇以及第二 承載台200的加熱溫度相同。舉例而言,第一承載台100、 第二承載台200以及加壓滾輪300的加熱溫度例如是攝氏 80度〜90度,但本發明不限於此。上述溫度主要是根據軟 性薄膜110以及基板220之材質選用而定,且所述溫度也 與後續所使用的膠材成分有關。 另外,根據本實施例,第一承載台100以及第A承載 台200分別為真空承載台,以使軟性薄膜110與基板220 可分別被真空吸附在第一承載台100以及第二承載台2〇〇 上,如圖1B所示,軟性薄膜110因為第一承載台1〇〇之 真空吸附作用而固定在第一承載台100上,而第二承載台 200之頂針202降下之後,基板220也會因為第二承載台 200之真空吸附作用而固定在第二承載台200上。 值得一提的是,本實施例可在將基板220放置到第二 承載台200之前就先在基板220上塗佈膠材400,因此放 置在第二承載台200上之基板220表面覆蓋有一層膠材 201221341 AU1007049 35885twf.d〇c/n 400。根據其他實施例’膠材也可以在後續步驟才塗佈至基 板220上。所述膠材400例如是熱溶膠。因此,透過第一 承載台100、第二承載台200以及加壓滾輪300的加熱溫 度可使得膠材400融化成液體狀態。 有關膠材400之塗佈進一步說明如下,在請參照圖 3A ’本實施例中,基板220具有塗佈區222,且膠材400 是全面性地塗佈於基板220之塗佈區222。根據本發明之 另一實施例,膠材400是局部地塗佈在基板220之塗佈區 222内’而膠材400是在經過後續的滾壓程序之後才全面 地覆蓋於基板220之塗佈區222内。無論是上述何種塗佈 方式’膠材400塗佈的區域(塗佈區222)的面積是小於基板 220的面積或是尺寸。 請回到圖1B,在使軟性薄膜11〇與基板22〇分別固 定在第一承載台1〇〇以及第二承載台2〇〇上之後,接著, 可進一步進行一對位程序。如圖1C所示,為了確保軟性 薄膜110與基板220分別準確地放置在第一承載台1〇〇以 及第二承載台200之特定位置,本實施例更進一步進行對 位補償程序,以使軟性薄膜110與第一承載台1〇〇對位, 且使基板220與第二承載台200對位。上述之對位補償程 序例如可採用影像處理裝置1〇4 (例如是CCD)來檢查軟性 薄膜110與第一承載台1〇〇之間的對位誤差,並且採用影 像處理裝置204 (例如是CCD)來檢查基板22〇與第二承載 台200之間的對位誤差。之後,便可直接藉由調整第一承 載台100以及第二承載台200之間的相對位置來進行對位 201221341 Αυιυυ/υ49 35885twf.doc/n 補償。舉例來說,可藉由調整第二承載台200的χ方向、 Y方向以及R(角度)方向的位置來進行位置補償。 之後’請參照圖1D,將第一承載台1〇〇翻轉至第二 承載台200上方。根據本實施例,將第一承載台1〇〇翻轉 至第二承載台200上方之方法例如是將第一承载台1〇〇原 地翻轉180度,以使第一承載台1〇〇上之軟性薄膜11〇面 向下方。另外’將第二承載台200往左邊移動,使得第二 承載台200位於第一承載台1〇〇的下方,如圖ιέ所示, 但本發明僅以將第二承載台200往左邊移動來說明第二承 載台200位於第一承載台1〇〇之下方,但不以此為限,也 可將第一承載台100移動至第二承載台200上方,以視各 機台或是其他因素而設計調整。在本實施例中,此步驟是 為將軟性薄膜110可位於基板220與膠材400之上方,以 利進行後續之貼合步驟。在第一承載台1〇〇翻轉至第二承 載台200上方之後,可進行對位補償,也就是將先前所計 算出的對位誤差進行補償。舉例來說,此時,可藉由調整 第二承載台200的X方向、γ方向以及R(角度)方向的位 置來進行位置補償’以使第一承載台1〇〇上之軟性薄膜11〇 與第二承載台200上的基板220精確對位。 根據本實施例’在將第一承載台1〇〇翻轉至第二承載 台200上之後,第二承載台200與第一承載台之間具 有銳角炎角0。換言之,第一承載台1〇〇與第二承載台2〇〇 是彼此相對向但兩者不平行設置。第二承載台丨⑻與第一 承載台200之間的銳角夾角可根據機台的狀態、薄膜的尺 201221341 AU1007049 35885tw£doc/n 寸或是其他因素而加以調整。 接著,將加壓滾輪300壓著在軟性薄膜11〇上,以使 軟性薄膜110之一端與基板220上之膠材4〇〇接觸,如圖 1F所示。加壓/袞輪3〇〇是壓著在一部份的軟性薄膜I】。 上,使得軟性薄膜11〇之一端與基板22〇上之膠材4〇〇接 觸。 接著,請同時參照圖1F以及圖2,以第一方向214 # 移動第二承載台200並且以第二方向302滾動加壓滾輪 300’以使軟性薄膜11〇逐漸地貼合於基板22〇上。特別是, 上述第一方向204與第二方向302相反,且第二承載台200 的移動速度與加壓滾輪300的滾動速度相同。根據一實施 例’上述之加壓滾輪300為雙驅動加壓滾輪。所謂雙驅動 加壓滾輪指的是加壓滚輪300具有雙邊(左右)施力機制。 而且在加壓滾輪300上還設置有壓力檢測計,以檢測加壓 滚輪300左右驅動下兩側的壓力大小。如此一來,可以在 滾壓過程之中同時進行壓力補償,以使左右壓力平均或一 鲁 致。同時,在本實施例中,加壓滾輪3〇〇為一主動式滾輪, 換句話說’加壓滾輪300受到驅動而其滾輪可自行滾動, 而非需於第二承載台200上施力才可發生滾輪滾動,但不 以此為限,於不同機台上的設計選擇,也可使用被動式之 滾輪。 值得一提的是,本實施例之第一承載台100為分段式 真空承載台(如圖2A與圖2B所示),第一承載台1〇〇具有 多段真空吸附裝置。因此’當第二承載台200以第一 201221341 AU1007049 35885twf.doc/n 方向214移動時,藉由第一承載台loo之多段真空吸附裝 置的分段真空調節,可使軟性薄膜11〇隨著第二承载 台200的移動而逐漸脫離第一承載台ι〇〇進而貼合於基板 220上。另外,在上述之滾壓程序過程之中,可進一步利 用夹持裝置250將軟性薄膜11〇之一端夾於第二承載台 200上’以避免軟性薄膜u〇在加壓滾輪3〇〇的滚壓過程 之中產生滑動。更詳細來說,如圖2A所示,當在第一承 載台100翻轉至第二承載台200上方之後,夾持裝置250 此時是朝向上方。接著,當要進行滾壓程序之前,可將夾 持裝置往下扳動,如圖2B所示,以固定住軟性薄膜11〇 之一端。但不以此為限,夾持裝置25〇也可在未進行固定 作用時是朝向外侧,經由轉向而再進行固定作用。然,在 本實施例中’為了使軟性薄膜110之一端可以順利地被固 疋於第二承載台200上,因此,將軟性薄膜11〇設置在第 一承载台1〇〇時,會將軟性薄膜n〇之一端預留部分面積, 如圖2A所示’使其預留部分112凸出於第一承载台1〇〇 且不貼附於第一承載台1〇〇,以利於後續夾持機構25〇夾 持步驟之進行。 在持續圖1F所示之移動第二承載台200以及滚動加 壓滾輪,直到軟性薄膜110完全脫離第一承載台1〇〇 而完全貼附在基板220上之後,如圖1G所示,第二承載 台200之頂針2〇2再度升起,以使基板220離開第二承載 台2〇〇之表面。接著,機械手臂將取走貼附有軟性薄膜ιι〇 之基板220。根據本實施例,上述貼附有軟性薄祺11〇之 201221341 AU1007049 35885twf.doc/n 基板22G可接著進—步進行紫外光照射 ,以使軟性薄膜110 與基板220之間的膠材固化。 值得一提的是,在上述將軟性薄膜110貼合在基板220 上之後,如圖3B所示’實際上基板22〇的尺寸大於軟性 薄膜110的尺寸,更進一步來說,在本實施例中,軟性薄 膜U〇之邊緣與基板220的邊緣相距5 mm〜15mm(即D1 等於5 mm〜15mm)。而由圖3B可知,軟性薄膜11〇的尺 φ 寸實際上也小於膠材400塗佈的面積。 另外’如圖3C所示’在將軟性薄膜11〇貼合在基板 220上之滾壓程序之過程中,加壓滾輪3〇〇的滚壓區31〇 的範圍小於軟性薄膜110貼附於基板220上的範圍,也就 疋加壓滾輪3〇〇之滚壓區310的範圍小於軟性薄膜11〇的 尺寸。更進一步來說’在本實施例中,加壓滾輪3〇〇之滾 壓區310的邊緣與軟性薄膜11〇之邊緣相距2 mm〜 5mm(即 D2 等於 2 mm 〜5mm)。 承上所述,由於本實施例膠材400塗佈的面積小於基 籲 板220的尺寸,因此,膠材400在滚壓過程之中,基板220 具有能夠容納溢膠的空間,使得膠材400可以溢到基板220 上而降低污染到承載台100、200的機會。另外,因為軟性 薄膜110的尺寸小於基板220的尺寸且加壓滚輪300的滚 壓區310的範圍小於軟性薄膜110的尺寸,因此膠材400 不但不會污染到承載台100、200,也不會污染到加壓滚輪 300。另外,因為軟性薄膜110的尺寸小於基板220的尺寸 且加壓滾輪300的滚壓區31〇的範圍小於軟性薄膜110的 201221341 AU1007049 35885twf.doc/n 尺寸,因此在滾壓的過程之中或之後,膠材400也不會有 内縮以及外擴的問題產生。 由上述貼合程序所形成的薄膜結構如圖4所示,其包 括基板220、軟性薄膜11〇以及膠材400。軟性薄膜11〇 位於基板220上’而膠材400位於基板220與軟性薄膜11〇 之間’其中軟性薄膜110具有滾壓區310與非滚壓區320。 上述滚壓區310指的是在滾壓程序之中加壓滾輪接觸的範 圍’而非滾壓區320則是滾壓程序之中加壓滚輪不會接觸 滾壓的範圍。本實施例中,由於在滾壓程序中加壓滾輪不 _ 會全面滾壓軟性薄膜11〇以及膠材4〇〇所在之處。因此, 在上述滾壓程序之後,位於滾壓區31〇之膠材4〇〇的厚度 T1會小於位於非滾壓區32〇之膠材4〇〇的厚度T2。 更進一步來說,上述膠材400塗佈的範圍大於軟性薄 膜110的尺寸’且膠材400塗佈的範圍小於基板220的尺 寸。然,在本實施例中,滾壓區31〇的邊緣與軟性薄膜1〇〇 之邊緣相距2 mm〜5mm,而基板220的尺寸大於軟性薄 膜110的尺寸,且軟性薄膜110之邊緣與基板22〇的邊緣 鲁 相距5 mm〜15mm(如圖3B以及圖3C所示)。 非滾壓區320 —般又稱為無效區,其在後續會以切割 程序切除,而所保留下來的滾壓區31〇通常又可稱為有效 區。由於非滾壓區320(無效區)在後續程序會加以切除,因 此即使該處的膠材400厚度較厚,也不影響滾壓區31〇(有 效區)内之軟性薄膜的平整度。 綜上所述,本發明使用特殊的接合程序將軟性薄膜貼 12 201221341 AUl 007049 35885twf.doc/n 二貼合程序所存在的貼合不平整 等等問題。另外’因為膠材塗佈區的面 積小於基板的尺寸,因此若膠材在滾壓過程之中若發 膠之狀況’其所溢出的膠材仍保持滞留於基板上不合 巧染到承載台。此外,因為軟性薄膜的尺寸小於基板的又 寸且加壓滾輪的滾壓區的範圍小於軟性薄膜的尺寸,因此 膠1不但不會污染到承載台,也不會污染到加壓滾輪,而 •且膠材也不會有内縮以及外擴的問題產生。 雖然本發明已以實施例揭露如上,然其並非用以限定 本發明,任何所屬技術領域中具有通常知識者,在不脫離 本發明之精神和範圍内,當可作些許之更動與潤飾,故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 一圖1A至圖1G是根據本發明一實施例之貼合程序的 不意圖。 鲁 圖2A與圖2B是圖ιέ步驟之詳細圖示。 圖3A至圖3C是將軟性薄膜接合於基板上的上視圖。 圖4是根據本發明一實施例之薄膜結構的剖面示意 圖。 【主要元件符號說明】 1〇〇 :第一承載台 101 :多段真空吸附裝置 13 201221341 AU1UU7U49 35885twf.doc/n 104 :影像處理裝置 110 :軟性薄膜 112 :預留部分 200 :第二承載台 202 :頂針 204 :影像處理裝置 214 :移動方向 220 :基板 222 :塗佈區 250 :夾持裝置 300 :加壓滾輪 302 :滾動方向 310 :滚壓區 320 :非滚壓區 400 :膠材 Dl、D2 :距離 ΤΙ、T2 :厚度201221341 AU1007049 35885twf.doc/n VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a bonding procedure and a film structure. [Prior Art] Generally, after the display panel or the touch panel is completed, the layer protection is attached to the panel. The sound-absorbing film is attached by applying a layer of glue to the surface of the panel and directly placing the protective film on the glue. Then use a roller to flatten the protective file to attach the protective file to the panel. However, the conventional lamination method has the problem that during the rolling process of the roller, the rubber material easily overflows and contaminates the roller or the machine table. In addition, the towel in the rolling process usually heats up, and this heating temperature tends to cause the rubber to shrink or expand, resulting in uneven adhesion of the protective film. In addition, during the rolling process, the rolling of the roller often causes the protective film to wrinkle. SUMMARY OF THE INVENTION The present invention provides a bonding process and a film structure produced by the bonding process, which can (10) avoid the problems of the conventional bonding process and the contamination of the machine. The present invention provides a fitting procedure that includes providing a second and a second carrier. The flexible film is placed on the first carrier, and then placed on the second carrier, and the adhesive is coated on the substrate. Flip a stage above the second stage. The pressure roller is pressed against the flexible film 201221341 AU1007049 35885twf.doc/n to move in the first direction to make the flexible film and the glue on the substrate - the second stage and roll in the second direction: = fit to the substrate In the above, the moving speed of the first direction and the second money flexible film stage is the same as the rolling speed of the pressure roller, and the second invention provides a film structure, a life-two and a rubber material. Soft and thin, located on the substrate. ·The material position between the two substrates is soft and has a rolling zone and a surface pressing zone, and the thickness of the rubber in the rolling zone is smaller than the thickness of the non-rolling zone. Based on the above-mentioned 'The present invention uses a special bonding procedure to attach a flexible film to a substrate', it is possible to transfer the problem of the domain and the contamination of the machine. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] Figs. 1A to 1G are schematic views of a bonding procedure according to an embodiment of the present invention. Referring to FIG. 1A, the bonding procedure of the present embodiment first provides a first carrier 100 and a second carrier 200. Next, the flexible film no is placed on the first stage 100, and the substrate 220 is placed on the second stage 200. The flexible film 110 comprises an organic polymer material, and the substrate 220 is, for example, a glass substrate, a broken substrate or other hard substrate. Here, the flexible film 110 is placed on the surface of the first stage 100 by a tool such as a chevron. The substrate 220 is placed on the ejector pin 202 extending from the second stage 200 through a mechanical arm. 2〇i22i2!J· According to the present embodiment, the first stage 100 and the second stage 200 are respectively heating stage. In particular, in the bonding process, the heating temperature of the first carrier 100 and the first carrier 200 is the same, so that the flexible film 11 on the first carrier 100 and the substrate 220 on the second carrier 200 can be The temperature is the same. Further, above the first stage 1 〇〇 and the second stage 200, a pressure roller 300 is further provided, which is subsequently used to perform a rolling process on the flexible film 11. Here, the pressure roller 300 is a heated pressure roller, and the heating temperature of the pressure roller 300 is the same as the heating temperature of the first stage 1 〇〇 and the second stage 200. For example, the heating temperature of the first stage 100, the second stage 200, and the pressure roller 300 is, for example, 80 to 90 degrees Celsius, but the present invention is not limited thereto. The above temperature is mainly determined depending on the materials of the flexible film 110 and the substrate 220, and the temperature is also related to the composition of the subsequently used rubber. In addition, according to the embodiment, the first carrier 100 and the A-stage carrier 200 are respectively vacuum carrying platforms, so that the flexible film 110 and the substrate 220 can be vacuum-adsorbed to the first carrier 100 and the second carrier 2, respectively. As shown in FIG. 1B, the flexible film 110 is fixed on the first stage 100 due to the vacuum adsorption of the first stage 1 ,, and after the ejector pin 202 of the second stage 200 is lowered, the substrate 220 is also Because of the vacuum adsorption of the second stage 200, it is fixed on the second stage 200. It should be noted that, in this embodiment, the adhesive material 400 may be coated on the substrate 220 before the substrate 220 is placed on the second loading stage 200. Therefore, the surface of the substrate 220 placed on the second loading stage 200 is covered with a layer. Glue 201221341 AU1007049 35885twf.d〇c/n 400. According to other embodiments, the glue may also be applied to the substrate 220 in a subsequent step. The glue 400 is, for example, a hot melt. Therefore, the heating temperature of the first stage 100, the second stage 200, and the pressure roller 300 can cause the glue 400 to melt into a liquid state. The coating of the adhesive material 400 is further described below. Referring to FIG. 3A', in the present embodiment, the substrate 220 has a coating zone 222, and the adhesive material 400 is applied to the coating zone 222 of the substrate 220 in a comprehensive manner. According to another embodiment of the present invention, the glue material 400 is partially coated in the coating zone 222 of the substrate 220, and the glue material 400 is completely coated on the substrate 220 after undergoing a subsequent rolling process. Within area 222. Regardless of the coating method described above, the area of the coating area (coating area 222) to which the adhesive material 400 is applied is smaller than the area or size of the substrate 220. Referring back to Fig. 1B, after the flexible film 11A and the substrate 22 are fixed to the first stage 1 and the second stage 2, respectively, a pair of bit programs can be further performed. As shown in FIG. 1C, in order to ensure that the flexible film 110 and the substrate 220 are accurately placed at specific positions of the first stage 1 and the second stage 200, the embodiment further performs a registration compensation process to make the softness The film 110 is aligned with the first stage 1 , and the substrate 220 is aligned with the second stage 200. The above-mentioned registration compensation program can use, for example, an image processing device 1〇4 (for example, a CCD) to check the alignment error between the flexible film 110 and the first stage 1〇〇, and employs an image processing device 204 (for example, a CCD). ) to check the alignment error between the substrate 22 〇 and the second stage 200. Thereafter, the alignment of the 201221341 Αυιυυ/υ49 35885twf.doc/n can be directly compensated by adjusting the relative position between the first loading platform 100 and the second loading platform 200. For example, position compensation can be performed by adjusting the positions of the second stage 200 in the x-direction, the Y-direction, and the R (angle) direction. Thereafter, referring to Fig. 1D, the first stage 1〇〇 is turned over to the second stage 200. According to the embodiment, the method of flipping the first loading platform 1 to the second loading platform 200 is, for example, flipping the first loading platform 1 180 degrees in order to make the first loading platform 1 The flexible film 11〇 faces downward. In addition, the second loading platform 200 is moved to the left side, so that the second loading platform 200 is located below the first loading platform 1 ,, as shown in FIG. ,, but the present invention only moves the second loading platform 200 to the left. The second loading platform 200 is located below the first loading platform 1 , but not limited thereto. The first loading platform 100 can also be moved above the second loading platform 200 to view each machine or other factors. And the design is adjusted. In this embodiment, this step is to place the flexible film 110 above the substrate 220 and the adhesive material 400 for subsequent bonding steps. After the first stage 1 is flipped over the second stage 200, the alignment compensation can be performed, i.e., the previously calculated registration error is compensated. For example, at this time, the position compensation can be performed by adjusting the positions of the X direction, the γ direction, and the R (angle) direction of the second stage 200 to make the flexible film 11 on the first stage 1 It is precisely aligned with the substrate 220 on the second stage 200. According to the present embodiment, after the first stage 1 is turned over onto the second stage 200, the second stage 200 and the first stage have an acute angle of incidence of zero. In other words, the first stage 1 〇〇 and the second stage 2 〇〇 are opposed to each other but are not arranged in parallel. The acute angle between the second carrier (8) and the first carrier 200 can be adjusted depending on the state of the machine, the size of the film, the size of the film, or the other factors. Next, the pressure roller 300 is pressed against the flexible film 11A so that one end of the flexible film 110 is brought into contact with the glue 4 on the substrate 220 as shown in Fig. 1F. The pressurizing/rolling wheel 3〇〇 is a soft film I] pressed against a part. On the top, one end of the flexible film 11 is brought into contact with the glue 4 on the substrate 22. Next, referring to FIG. 1F and FIG. 2 simultaneously, the second stage 200 is moved in the first direction 214 # and the pressure roller 300 ′ is rolled in the second direction 302 to gradually fit the flexible film 11〇 onto the substrate 22〇. . In particular, the first direction 204 is opposite to the second direction 302, and the moving speed of the second stage 200 is the same as the rolling speed of the pressure roller 300. According to an embodiment, the pressure roller 300 described above is a double drive pressure roller. The so-called double drive press roller means that the pressure roller 300 has a bilateral (left and right) force applying mechanism. Further, a pressure detector is further provided on the pressure roller 300 to detect the pressure of the two sides of the pressure roller 300 driven to the left and right. In this way, pressure compensation can be performed simultaneously during the rolling process so that the left and right pressures are averaged or eliminated. Meanwhile, in the present embodiment, the pressure roller 3 is an active roller. In other words, the pressure roller 300 is driven and the roller can roll by itself, instead of applying force on the second carrier 200. The scroll wheel is scrolled, but not limited to this. For the design choice on different machines, a passive roller can also be used. It is worth mentioning that the first carrying platform 100 of the embodiment is a segmented vacuum carrying platform (as shown in Figs. 2A and 2B), and the first carrying platform 1 has a multi-stage vacuum adsorption device. Therefore, when the second stage 200 is moved in the first 201221341 AU1007049 35885twf.doc/n direction 214, the soft film 11 can be made by the segmental vacuum adjustment of the multi-stage vacuum adsorption device of the first stage loo. The movement of the second stage 200 gradually disengages from the first stage ι and is then attached to the substrate 220. In addition, during the rolling process described above, the clamping device 250 can be further used to clamp one end of the flexible film 11 to the second carrier 200 to prevent the soft film from rolling on the pressing roller 3〇〇. Sliding occurs during the pressing process. In more detail, as shown in Fig. 2A, after the first stage 100 is turned over to the second stage 200, the holding device 250 is now facing upward. Next, before the rolling process is to be performed, the holding device can be pulled downward as shown in Fig. 2B to fix one end of the flexible film 11〇. However, it is not limited thereto, and the holding device 25A may be oriented toward the outside when not being fixed, and may be further fixed by steering. However, in the present embodiment, in order to allow one end of the flexible film 110 to be smoothly fixed to the second stage 200, the soft film 11 is softened when it is placed on the first stage 1〇〇. A portion of the film n 预留 has a reserved area, as shown in FIG. 2A, such that the reserved portion 112 protrudes from the first stage 1 不 and is not attached to the first stage 1 〇〇 to facilitate subsequent clamping The mechanism 25 is subjected to a clamping step. After the second loading stage 200 and the rolling pressure roller are moved as shown in FIG. 1F, until the flexible film 110 is completely detached from the first stage 1 and is completely attached to the substrate 220, as shown in FIG. 1G, The ejector pin 2 2 of the second stage 200 is raised again to move the substrate 220 away from the surface of the second stage 2 . Next, the robot arm will remove the substrate 220 to which the flexible film is attached. According to the present embodiment, the above-mentioned 201221341 AU1007049 35885twf.doc/n substrate 22G to which the flexible film 11 is attached can be further irradiated with ultraviolet light to cure the glue between the flexible film 110 and the substrate 220. It is to be noted that, after the flexible film 110 is attached to the substrate 220 as described above, the size of the substrate 22 is substantially larger than the size of the flexible film 110 as shown in FIG. 3B, and further, in this embodiment. The edge of the flexible film U is spaced from the edge of the substrate 220 by 5 mm to 15 mm (i.e., D1 is equal to 5 mm to 15 mm). As can be seen from Fig. 3B, the ruler φ of the flexible film 11〇 is actually smaller than the area coated by the glue 400. In addition, as shown in FIG. 3C, during the rolling process of bonding the flexible film 11 〇 on the substrate 220, the range of the rolling zone 31 加压 of the pressure roller 3 小于 is smaller than that of the flexible film 110 attached to the substrate. The range on 220, that is, the range of the rolling zone 310 of the pressure roller 3 is smaller than the size of the flexible film 11A. Further, in the present embodiment, the edge of the rolling zone 310 of the pressure roller 3 is spaced 2 mm to 5 mm from the edge of the flexible film 11 (i.e., D2 is equal to 2 mm to 5 mm). As described above, since the area coated by the rubber material 400 of the embodiment is smaller than the size of the base board 220, the substrate 400 has a space capable of accommodating the glue during the rolling process, so that the glue 400 It can spill over the substrate 220 to reduce the chance of contamination to the stage 100, 200. In addition, since the size of the flexible film 110 is smaller than the size of the substrate 220 and the range of the rolling zone 310 of the pressure roller 300 is smaller than the size of the flexible film 110, the rubber material 400 does not contaminate the carrier 100, 200 nor Contaminated to the pressure roller 300. In addition, since the size of the flexible film 110 is smaller than the size of the substrate 220 and the range of the rolling region 31A of the pressure roller 300 is smaller than the size of the 201221341 AU1007049 35885twf.doc/n of the flexible film 110, during or after the rolling process The glue 400 does not have problems with retraction and expansion. The film structure formed by the above bonding process is as shown in Fig. 4, and includes a substrate 220, a flexible film 11A, and a glue 400. The flexible film 11 is located on the substrate 220 and the glue 400 is located between the substrate 220 and the flexible film 11A. The flexible film 110 has a rolling zone 310 and a non-rolling zone 320. The above-described rolling zone 310 refers to the range in which the pressure roller contacts in the rolling process, and the rolling zone 320 is a range in which the pressing roller does not contact the rolling in the rolling process. In this embodiment, since the pressure roller is not rolled in the rolling process, the soft film 11 〇 and the glue 4 〇〇 are fully rolled. Therefore, after the above-described rolling process, the thickness T1 of the rubber material 4〇〇 located in the rolling zone 31〇 is smaller than the thickness T2 of the rubber material 4〇〇 located in the non-rolling zone 32〇. Furthermore, the range in which the above-mentioned rubber material 400 is applied is larger than the size of the flexible film 110 and the range in which the rubber material 400 is applied is smaller than the size of the substrate 220. However, in this embodiment, the edge of the rolling zone 31〇 is 2 mm to 5 mm from the edge of the flexible film 1〇〇, and the size of the substrate 220 is larger than the size of the flexible film 110, and the edge of the flexible film 110 and the substrate 22 The edges of the crucible are 5 mm to 15 mm apart (as shown in Fig. 3B and Fig. 3C). The non-rolling zone 320 is also commonly referred to as an inactive zone, which is subsequently cut by a cutting procedure, and the remaining rolling zone 31〇 is often referred to as an active zone. Since the non-rolling zone 320 (invalid zone) is removed in the subsequent process, even if the thickness of the rubber material 400 is thick, the flatness of the soft film in the rolling zone 31 (effective zone) is not affected. In summary, the present invention uses a special bonding procedure to attach the soft film to the problem of unevenness in the bonding process of the 201221341 AU1 007049 35885twf.doc/n two-fitting procedure. In addition, because the area of the coating area of the rubber material is smaller than the size of the substrate, if the rubber material is in the state of rolling during the rolling process, the rubber material overflowing remains on the substrate and is not easily dyed on the carrying table. In addition, since the size of the flexible film is smaller than that of the substrate and the range of the rolling zone of the pressure roller is smaller than the size of the soft film, the glue 1 not only does not contaminate the carrier but also pollutes the pressure roller, and And the rubber material does not have problems with retraction and expansion. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A to Fig. 1G are schematic views of a bonding procedure according to an embodiment of the present invention. Lu Tu 2A and FIG. 2B are detailed illustrations of the steps of FIG. 3A to 3C are top views of a flexible film bonded to a substrate. Figure 4 is a cross-sectional schematic view of a film structure in accordance with an embodiment of the present invention. [Main component symbol description] 1〇〇: First stage 101: Multi-stage vacuum adsorption device 13 201221341 AU1UU7U49 35885twf.doc/n 104: Image processing device 110: Flexible film 112: Reserved portion 200: Second carrier 202: Thimble 204: image processing device 214: moving direction 220: substrate 222: coating zone 250: clamping device 300: pressing roller 302: rolling direction 310: rolling zone 320: non-rolling zone 400: glue Dl, D2 : Distance ΤΙ, T2: Thickness

Claims (1)

201221341 AU1007049 35885twf.doc/n 七、申請專利範圍: 1.一種貼合程序,包括: 提供一第-承載台以及一第二承載台; 膜之?:3_設置在該第一承載台上,其中該軟性薄 承載A ./、預料分’ a該預留部分未貼附於該第- 佈_=基板設置在料二錢台上,並且㈣基板上塗 性薄料二承料上方,以使該軟 與該基mm相上,酬軟性薄膜 f動今Λ 1 =向移動5亥第二承載台並且以—第二方向 動,加㈣輪,以魏軟性薄難合於該基板上, 的移方向與料二方向相反,且該第二承載台 的移動速度與該加壓滾輪的軸速度相同。 板且專利範圍第1項所述之貼合程序,其中該基 且在錄板上㈣該騎之方法包括將 镇材王©性地塗佈於縣板之該塗佈區内。 ^如申請專利_第丨項所述之貼合程序,其中該基 从^佈區,在錄板±塗佈該膠材之方法包括將該 ^局π地塗佈在縣板之财佈區内,且在將該軟性薄 务i合於該基板上之後,轉材全面地塗佈於該基板之該 室佈區内。 15 201221341 AUl007049 35885twf.doc/n 4. 如申請專利範圍第1項所述之貼合程序,其中該加 壓滾輪的一滾壓區的範圍小於該軟性薄膜貼附於該基板上 的範圍。 5. 如申請專利範圍第4項所述之貼合程序,其中該加 壓滾輪的滾壓區的邊緣與該軟性薄膜之邊緣相距2 〜 5mm ° 6.如申請專利範圍第4項所述之貼合程序,其中該基 板的尺寸大於該軟性薄膜的尺寸,且該軟性薄膜之邊緣與 該基板的邊緣相距5 min〜15mm。 7. 如申請專利範圍第1項所述之貼合程序,其中該第 一承載台以及該第二承載台分別為一加熱承載台了且^第 一承載台以及該第二承載台的加熱溫度相同。 8. 如申請專利範圍第7項所述之貼合程序,其中該加 壓滾輪為一加熱式加壓滾輪,且該加壓滾輪的加熱溫^ 該第一承載台以及該第二承載台的加熱溫度相同。 9. 如申請專利範圍第1項所述之貼合程序,其中該 一承載台以及該第二承載台分別為一真空承载台,'以= 軟性薄膜與該基板分別被真空吸附在該第一承载台以及= 第二承載台上。 Λ 10. 如申請專利範圍第丨項所述之貼合程序,其中誃 一承載台為-分段式真空承載台,以使該第二承載台= 動時使該第一承載台上之該軟性薄膜可以逐漸、 载台而貼合於該基板上。 承 11. 如申請專利範圍第1項所述之貼合程序其中將兮 201221341 AU1007049 35885twf.doc/n 第一承載台翻轉至該第二承载台上之後’該第二承載台與 該第一承載台之間具有一銳角夾角。 12.如申請專利範圍第1項所述之貼合程序,其中在將 該軟性薄膜設置在該第一承載台上’且將該基板設置在該 第二承載台上之後,更包括進行一對位補償程序,以使該 軟性薄膜與該第一承載台對位,且使該基板與該第二承載 台對位。201221341 AU1007049 35885twf.doc/n VII. Patent application scope: 1. A fitting procedure comprising: providing a first-bearing station and a second carrying platform; and the film: 3_ is disposed on the first carrying platform, Wherein the soft thin bearing A./, the predetermined portion 'a the reserved portion is not attached to the first cloth_=substrate is disposed on the material two money table, and (4) the substrate is coated with the thin material two materials above, so that The soft phase is opposite to the base mm, and the soft film f moves to the next stage 1 = moves to the second stage of the second stage and moves in the second direction, plus the (four) wheel, so that the softness is thin and difficult to fit on the substrate. The direction of movement is opposite to the direction of the material two, and the moving speed of the second stage is the same as the shaft speed of the pressure roller. The bonding procedure described in the first aspect of the invention, wherein the method of riding on the substrate (4) comprises applying the slab to the coating zone of the county plate. ^ The application procedure of the patent application _ , , , , , , , , , ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± After the softness is combined on the substrate, the material is completely applied to the chamber region of the substrate. The bonding procedure of claim 1, wherein a range of the rolling zone of the pressing roller is smaller than a range in which the flexible film is attached to the substrate. 5. The bonding procedure of claim 4, wherein the edge of the rolling zone of the pressure roller is 2 to 5 mm apart from the edge of the flexible film. 6. As described in claim 4 a bonding process, wherein the size of the substrate is larger than the size of the flexible film, and the edge of the flexible film is 5 min to 15 mm from the edge of the substrate. 7. The bonding procedure of claim 1, wherein the first carrier and the second carrier are respectively a heating platform and the heating temperature of the first carrier and the second carrier the same. 8. The bonding procedure of claim 7, wherein the pressure roller is a heated pressure roller, and the heating temperature of the pressure roller is the first carrier and the second carrier The heating temperature is the same. 9. The bonding procedure of claim 1, wherein the one carrier and the second carrier are respectively a vacuum carrying platform, and the vacuum film and the substrate are respectively vacuum-adsorbed in the first The carrier station and = the second carrier. Λ 10. The bonding procedure of claim </ RTI> wherein the first carrier is a segmented vacuum carrier such that the second carrier = the time on the first carrier The flexible film can be attached to the substrate gradually and on the stage. 11. The bonding procedure of claim 1, wherein the second carrier and the first carrier are after the first carrier is flipped onto the second carrier There is an acute angle between the stations. 12. The bonding procedure of claim 1, wherein the placing the flexible film on the first stage and after the substrate is disposed on the second stage further comprises performing a pair a bit compensation procedure for aligning the flexible film with the first carrier and aligning the substrate with the second carrier. 13·如申請專利範圍第1項所述之貼合程序,其中將該 軟性薄膜貼合於該基板上之後,更包括進行一膠材固化程 序。 14.如申請專利範圍第丨項所述之貼合程序,其中加壓 滚輪壓著在該軟性薄膜步驟,更包括利用一夾持裝置將該 軟性薄膜之一端該預留部分夾於該第一承載台上。 ^一種薄臈結構,包括: 一基板; 干入丨土得联 一、从必似丄,从汉 薄膜:::滾:’其—該軟性 度小於該非滚壓區之該=:而_區之該膠材厚 ㈣H申料·㈣丨5項騎之_輯,μ該 大於該軟性薄膜的尺寸,且該膠材尺寸小;:基 17 201221341 AU1007049 35885twf.doc/n 18.如申請專利範圍第15項所述之薄膜結構,其中該 基板的尺寸大於該軟性薄膜的尺寸,且該軟性薄膜之邊緣 與該基板的邊緣相距5 mm〜15mm。13. The bonding procedure of claim 1, wherein the bonding of the flexible film to the substrate further comprises performing a curing process. 14. The bonding procedure of claim </ RTI> wherein the pressing roller is pressed against the flexible film step, and further comprising: clamping the reserved portion of the flexible film to the first portion by using a clamping device On the carrying platform. ^ A thin crucible structure, comprising: a substrate; dry into the bauxite to get one, from the must, from the Han film::: roll: 'the - the softness is less than the non-rolling zone =: and _ zone The thickness of the rubber material is (4) H application material (4) 丨 5 item riding _ series, μ is larger than the size of the soft film, and the size of the rubber material is small; base 17 201221341 AU1007049 35885twf.doc/n 18. If the patent application scope The film structure according to Item 15, wherein the size of the substrate is larger than the size of the flexible film, and the edge of the flexible film is 5 mm to 15 mm from the edge of the substrate. 1818
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