201216234 六、發明說明： 【發明所屬之技術領域】 在液晶注入製程或是光學膠貼合製程中，為避免使流體或 ^體包覆空氣於兩片透明基板中間，使其產生氣泡的缺陷。最 ㊉見的方法就是在真空㈣巾做貼合的製程，以有效減少氣泡 的形成。 在真空腔體中’以真空吸持是無法發揮作用的，所以工作 面朝下懸掛的基板便無法伽真空吸持這種方式細定。目前201216234 VI. Description of the Invention: [Technical Fields of the Invention] In the liquid crystal injection process or the optical adhesive bonding process, in order to prevent the fluid or the body from being coated with air in the middle of the two transparent substrates, bubbles are generated. The most common method is to make a laminating process in a vacuum (four) towel to effectively reduce the formation of bubbles. In the vacuum chamber, vacuum suction does not work, so the substrate that is suspended from the working surface cannot be vacuum-held. Currently
可見的吸持方式就是彻靜電的吸引力或是水絲面張力來 吸持基板。 【先前技術】 在^液晶顯不器面板中將流體封入基板間並利用密封劑來貼 合該等基板之貼合1業。或觸控面板中，將光學膠貼合於觸控 面板模組與液晶顯示器面板間以改善透光性之光學膠貼合作 業’均可於真空中製作以降低氣泡殘留的缺陷^其中貼合面朝 下之基板無法以真空吸盤吸持，也因此有其它吸持方式的發 明，以下為一發明專利之摘錄。 凊參閱第一圖所示，本圖來自中華民國發明專利1227862， 申凊人為芝浦機械電子裝置股份有限公司，其發明係一種靜電 及著裝置，其係用以吸著保持基板者，其特徵在於該靜電吸著 ^置包含：機台，係由介電質所形成且具有利用靜電力來保持 ^述基板之保持面；電極，係設於前述機台；直流電源，係對 别述電極施加直流電壓；及切換機構，係用以切換前述直流電 源施加於前述電極之直流電壓的極性，藉此，在對前述電極施 力:預^極性之直流電壓且將前述基板保持於前述保持面後，可 操作前述切換機構’以對前述電極施加不同極性之直流電壓p 此發明之控制流程需複雜的陰、陽極電壓切換，亦需控制氣體 201216234 壓力使氣體易於形成電離之帶電粒子，過程中需確保電荷不消 失，完成貼合後亦需將所帶靜電去除，過程相當複雜。 其它類似專利列表如下: 專利(公開)證號 200807758 國別 專利名稱 主要原理 TW 吸附保持裝及吸附保 持方法 利用水的表 面張力 2002-154647 JP Substrate holder, holding method · · · 利用液體的 表面張力 2003-330031 JP Substrate holding apparatus ··· 利用水的表 面張力 7270587 US Apparatus and method for manufacturing · · · 靜電吸持 本發明之主要目的，在於提供一種用於真空中之可靠且簡 單之吸持方法，使製程的技術成本降低。 【發明内容】The visible way of holding is to hold the substrate with the attraction of static electricity or the tension of the surface of the water. [Prior Art] In the liquid crystal display panel, a fluid is sealed between the substrates, and the bonding agent is used to bond the substrates. Or in the touch panel, the optical adhesive is adhered between the touch panel module and the liquid crystal display panel to improve the translucency of the optical adhesive bonding industry, which can be fabricated in a vacuum to reduce the defect of air bubbles. The substrate facing down cannot be sucked by the vacuum chuck, and thus there are other inventions of the holding method. The following is an excerpt of an invention patent.凊Refer to the first figure, this picture is from the Republic of China invention patent 1227862, the applicant is Shibaura Mechatronics Co., Ltd., the invention is an electrostatic and device, which is used to suck and hold the substrate, which is characterized by The electrostatic absorbing device includes: a machine body formed of a dielectric material and having a holding surface for holding the substrate by an electrostatic force; an electrode disposed on the machine base; and a DC power source applied to the electrode a DC voltage; and a switching mechanism for switching a polarity of a DC voltage applied to the electrode by the DC power source, thereby applying a force to the electrode: pre-polar DC voltage and holding the substrate after the holding surface The switching mechanism can be operated to apply a DC voltage of different polarity to the electrodes. The control process of the invention requires complicated switching of anode and anode voltages, and the pressure of the gas 201216234 is also required to make the gas easily form ionized charged particles. Make sure that the charge does not disappear, and the static electricity must be removed after the bonding is completed. The process is quite complicated. The list of other similar patents is as follows: Patent (public) license number 200807758 Main patent name Main principle TW Adsorption holding and adsorption holding method Surface tension using water 2002-154647 JP Substrate holder, holding method · · · Surface tension using liquid 2003 -330031 JP Substrate holding apparatus ···· Surface tension using water 7270587 US Apparatus and method for manufacturing · · · Electrostatic absorption The main object of the present invention is to provide a reliable and simple holding method for vacuum, so that The technical cost of the process is reduced. [Summary of the Invention]
在液晶注入或光學膠貼合的製程中，須將兩片基板充填入 所須之物質，使基板具備所需之性質。一般是將待充填之材料 先塗，於其中一置於下方之基板，另一基板對位後下降至下方 ，板完成貼合。但在此過程巾，很容綠會將紐&入而造成 氣泡殘留。為了解決氣泡殘留的問題，故將此製程移至 體中進行，也確實改善了氣泡殘留。 /二 常用來吸持基板的真空吸盤真空腔體中無法達成作用，因 ^便有了靜電吸_靠液面張力的吸附等方法被開發出 來，如先前技術所述。但是這些技術所需的程序較繁 多。例如，靜電吸持法需依照順序開關陰陽極， 亦須去除所帶之靜電。液體表面張力法須以降溫到露點= 201216234 ϊϊ f，制赌脉分絲面張力侧來吸持 ίϊ里ίΐίίΐ溫度均需_ ’才可減少因溫差導致之尺 產轉錢象。也®此基絲面的水氣亦 會被包覆入充填層中，這也是需要避免的。In the process of liquid crystal injection or optical adhesive bonding, two substrates are filled with the required materials to impart the desired properties to the substrate. Generally, the material to be filled is first coated, one of which is placed on the lower substrate, the other substrate is aligned, and then lowered to the lower side, and the board is finished. However, in this process, it is very green and will cause the bubbles to remain. In order to solve the problem of residual bubbles, moving the process to the body also improves the bubble residue. / 2 The vacuum chuck that is often used to hold the substrate cannot achieve its function in the vacuum chamber, because electrostatic absorption - adsorption by liquid level tension has been developed, as described in the prior art. But these technologies require a lot of programs. For example, the electrostatic holding method needs to switch the anode and cathode in order, and also remove the static electricity. The liquid surface tension method must be cooled to the dew point = 201216234 ϊϊ f, and the gambling pulse surface tension side is used to hold the ϊ ΐ ΐ ΐ ΐ ΐ ΐ 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才Also, the moisture of this base surface is also encapsulated in the filling layer, which is also to be avoided.
為克服這些問題，採用黏性物質或膠帶來固持機 可以在真輯境巾魏。這些黏性物質 或充填作業完成後直接移除或經過降低黏 後移除’例如可重貼型之膠帶、矽橡膠卿隱 rubber)、低黏度膠、紫外線降黏性膠或加熱降黏性膠等。 本發明（一）為一種基板貼合裝置，包含：一真空腔 基^貼合健可在麵魏巾進行；上基板承載台：位於真^ ΐ體’將第一基板用黏性物質固持於下方;黏性物 板承載台下方，用以固持第一基板;第-基板： 下方’並被黏性物質固持住;下基板承載台：用 j载tii; 1二基板：置於下紐承載台上方；液/膠 狀物.塗佈於第一基板，用以充填於兩月基板間。 ^咸少腔體内之壓力，等同於減少腔體内之氣體分子，可降 低氣泡殘餘之程度，其中真空腔體内之壓力為〇到〇· 5標 氣壓力（atm)之間。 ·、 玻璃基板與塑夥基板為液晶面板與觸控面板常見之材質。 腔體上半部與腔體下半部密合後，開始使用真线將 内部空氣抽離，使腔體内部減壓。 •在減壓完成後，上基板承载台會與下基板承载台可互相靠 近使第一基板上之液狀物接觸第一基板，使待充填之液/膠狀 物展開於兩基板之央層間。 基板貼合完成後再將黏性物質從基板承载台與貼合後之基 板脫離。 201216234 黏性物質在製程完成後須可被去除，故可使用可重貼之材 質、可經加鱗絲性之材質、或可經料、_射降低黏性之 材質，使黏性物質容易被去除。 - 為使操作簡單化，可先將黏性物質與磁性材料塊先預黏貼 於第-基板°如此便可糊可控獅力之上絲纟纟吸取與釋 放已預黏貼之磁性材料塊 或是將黏性物質與互鎖塊先預黏貼 於第一基板。如此便可利用具互鎖槽之上承載台來勾取盥釋放 已預黏貼之互鎖塊。 …In order to overcome these problems, the use of adhesive materials or tape to hold the machine can be used in the real world. These adhesive substances or filling operations are directly removed or after the adhesive is removed to remove 'for example, re-stickable tape, 矽 rubber 隐 ru rubber, low viscosity glue, UV viscosity reducing glue or heating viscosity reducing glue Wait. The invention (1) is a substrate bonding device, comprising: a vacuum cavity base; the bonding substrate can be carried out on the surface Wei towel; the upper substrate carrier: located in the true body 将 body, the first substrate is held by the viscous material Bottom; under the viscous plate carrier, for holding the first substrate; the first substrate: the lower part 'is held by the viscous material; the lower substrate carrier: the ji with j; 1 the second substrate: placed under the bottom Above the stage; liquid/gel. It is applied to the first substrate for filling between the two substrates. ^ The pressure in the salty cavity is equivalent to reducing the gas molecules in the cavity, which can reduce the degree of bubble residue, wherein the pressure in the vacuum chamber is between 〇·5 standard gas pressure (atm). · The glass substrate and the plastic substrate are common materials for the liquid crystal panel and the touch panel. After the upper part of the cavity is in close contact with the lower half of the cavity, the inner air is removed by the use of a positive line to decompress the inside of the cavity. After the decompression is completed, the upper substrate carrier and the lower substrate carrier can be close to each other such that the liquid on the first substrate contacts the first substrate, and the liquid/gel to be filled is spread between the central layers of the two substrates. . After the substrate is bonded, the adhesive material is detached from the substrate carrier and the bonded substrate. 201216234 Adhesive material must be removed after the process is completed, so it can be used with re-sticking materials, materials that can be scaly, or materials that can pass through the material and reduce the viscosity. Remove. - In order to simplify the operation, the adhesive material and the magnetic material block can be pre-adhered to the first substrate. Thus, the magnetic material block can be sucked and released by the silk force on the controllable lion force or The adhesive substance and the interlocking block are pre-adhered to the first substrate. In this way, the pre-adhesive interlocking block can be released by using the carrier above the interlocking slot. ...
本發明（一）為一種基板貼合裝置，包含：一真空腔體：使 基板貼合作業可在減壓環境中進行；上基板承載台··位於真空 腔體内的上方’可控制磁力將預置磁性材料塊之第一基板固持 於下方；複數個磁性材料塊：用黏性物質與第一基板貼合；黏 性物質：貼合磁性材料塊與第一基板；第一基板：複數個磁性 材料塊用黏性物質與基板貼合；下基板承載台：用於承載第二 基板，第二基板：置於下基板承載台上方；液/膠狀物：塗佈 於第二基板，用以充填於兩片基板間。 j咸少腔體内之壓力，等同於減少腔體内之氣體分子，可降 低氣泡殘餘之程度’其中真空腔體内之壓力為0到0.5標準大 氣壓力（atm)之間。 玻璃基板與塑膠基板為液晶面板與觸控面板常見之材質。 腔體上半部與腔體下半部密合後，開始使用真空泵將腔體 内部空氣抽離，使腔體内部減壓。 在減壓完成後’上基板承載台會與下基板承載台可互相靠 近使第二基板上之液狀物接觸第一基板，使待充填之液/膠狀 物展開於兩基板之夾層間。 基板貼合完成後再將上基板承載台之磁力釋放，使已貼合 完成之基板與磁性材料塊從基板承載台脫離。磁性材料塊為可 201216234 鐵磁或順磁或磁性複合材料，如鐵金屬。 在製程完錢須可被去除，故可使將重貼之材 ^ 料賴姆低黏性之 其ΛίΓΙϊ為一種基板貼合裝置，包含：一真空腔體：使 内可ί減壓環境中進行；上基板承載台：位於真空 ί 鋪將預置互鎖塊之第—基_持於下 ^丄複數個互鎖塊：用黏性物f與第—基板貼合；黏性物質：The invention (1) is a substrate bonding device, comprising: a vacuum chamber: the substrate bonding cooperation can be performed in a decompression environment; the upper substrate carrying platform is located above the vacuum chamber, and the magnetic force can be controlled The first substrate of the preset magnetic material block is held under; the plurality of magnetic material blocks: bonding with the first substrate by the viscous material; the viscous substance: the magnetic material block and the first substrate; the first substrate: a plurality of The magnetic material block is adhered to the substrate by the adhesive material; the lower substrate carrying platform is used for carrying the second substrate, the second substrate is placed above the lower substrate carrying platform; and the liquid/gel is coated on the second substrate, Filled between two substrates. j. The pressure in the cavity is equivalent to reducing the gas molecules in the cavity, which can reduce the degree of bubble residue. The pressure in the vacuum chamber is between 0 and 0.5 standard atmospheric pressure (atm). The glass substrate and the plastic substrate are common materials for the liquid crystal panel and the touch panel. After the upper half of the cavity is in close contact with the lower half of the cavity, the vacuum pump is used to evacuate the air inside the cavity to decompress the inside of the cavity. After the decompression is completed, the upper substrate carrier and the lower substrate carrier can be close to each other such that the liquid on the second substrate contacts the first substrate, and the liquid/gel to be filled is spread between the interlayers of the two substrates. After the substrate is bonded, the magnetic force of the upper substrate carrier is released, and the bonded substrate and the magnetic material block are detached from the substrate carrier. The magnetic material block is a 201216234 ferromagnetic or paramagnetic or magnetic composite material such as iron metal. The process must be removed after the process is completed, so that the material of the re-applied material can be made into a substrate-bonding device, including: a vacuum chamber: allowing the internal pressure to be reduced in the environment. Upper substrate carrier: located in the vacuum ί shop will be the pre-interlock block of the first - base _ hold under the 丄 丄 multiple interlocking blocks: with the adhesive f and the first substrate; adhesive:
盘if*，，與第—基板;第—基板:複數個互鎖塊用黏性物質 °;下基板承載台：用於承載第二基板；第二基板： =下基板承載台上方；液/膠狀物：塗佈於第 充填於兩片基板間。 ^咸少腔體内之壓力，等同於減少雜内之氣齡子， ，，泡殘餘之程度，其巾真空腔勒之壓力為Q到◦ 氣壓力（atm)之間。 玻璃基板與塑膠基板為液晶面板與觸控面板常見之材質。 腔體上半部無體下半㈣合後，開始使用真妓將腔體 内邛空氣抽離，使腔體内部減壓。 在，壓完成後，上基板承載台會與下基板承載台可互相靠 从，第一基板上之液狀物接觸第一基板，使待充填之液/膠狀 物展開於兩基板之夾層間。 人^5板貼合完成後再將上基板承載台之互鎖塊釋放，使已貼 二凡成之基板與互鎖塊從基板承載台脫離。互鎖塊與上承 有相對應之肩部，可互鎖產生支撐。 σ 黏性物質在製程完成後須可被去除，故可使用可重貼之材 I、可經加熱降低黏性之材質、或可經紫外線照射降低黏性之 材質’使黏性物質容易被去除。 201216234 為期使對於本創作之目的、功效及構造特徵能有更詳細明 確的瞭解，茲舉出如下述較佳之實施例並配合圖示說明如后： 【實施方式】 以下說明請參照第二圖，此圖為基板貼合裝置發明（一）之 剖面圖。其工作方式為：首先將黏性物質110預黏於第一基板 109或是上承載台108，再將第一基板109與上承載台1〇8嶝 由黏性物質110而貼合。接著將第二基板104預塗佈液狀之密 封用框膠105與充填之液/膠狀物ι〇6後放置於下承載台1〇3 • 上。當真空腔體下半部1〇1與腔體上半部107尚未密合^，上 承載台108與腔體上半部1〇7在同一側，下承載台1〇3盥腔體 下半部101在同一側。 兩基板被固持完成後，腔體下半部與腔體上半部1〇7 開始靠近，並壓迫腔體密封件1〇2使腔體密合，密合後^由腔 體氣體通道111，開始對腔體抽真空減壓，減壓完成後I承載 台108與下承载台1〇3開始靠近使預塗佈之液/膠狀物1〇5、 106開始接觸’直到兩基板之貼合間隙到達設定值後停止。 貼合完之基板將黏性物質11〇經減低黏性之製程後，將完 鲁成貼合之基板取出，如使用不需減低黏性而可直接分離之膠^ 或黏性物質110時，則直接將基板取出^ 夕 如此發明（一）之貼合工作便完成。 以下說明請參照第三圖，此圖為基板貼合裝置發明（二)之 剖面圖。其工作方式為：首先將磁性材料塊113用黏性物 114預黏於第一基板109，再將已預黏完成之苐一基板1〇9、 113、114與磁力控制之上承載台112.經由磁力作^固定於 磁力控制之上承載台112。接著將第二、基板104預塗佈 密封用框膠105與充填之液/膠狀物1〇6後放置於下承載台1〇3 上。當真空腔體下半部1〇1與腔體上半部1〇7尚未密合上 201216234 承，台112與腔體上半部1〇7在同一側 下半部101在同一側。 iui、腔媸 被固j夺完成後’腔體下半部1〇1與腔體上半部ι〇7 二^蓄3^迫腔11密封件102使腔體密合。密合後經由腔 1^_對腔體抽真空賴，減奴成後磁力控 ιης #與下承載台1〇3開始靠近使預塗佈之液/膠 背u、1〇6開始接觸，直到兩基板之貼合間隙到達設定值 俊停止。 ρ ρίίίίϋ磁力控制之上承載台112將磁力釋放，使得 黏，雜，將雖_ 113和== 分離，如使用*需減低黏性而可直接分離之 膠帶或雜物質114時，則直接與基板分離。 如此發明（二)之貼合工作便完成。 以下說明請參照第_，此圖為基板貼合裝置發明（三)之 ° 作方式為：首先將互鎖塊115用黏性物質117預 2第-絲109，再紅讎完成之第_基板⑽、115、117 二互鎖槽之上承載台116經由互鎖裝置作用而固定於具互 用框。接著將第二基板1〇4預塗佈液狀之密封 5與充填之液/膠狀物1〇6後放置於下承載台1〇3 二©真空腔體下半部101與腔體上半部1〇7尚未密合時，上 ΊΓ主二與腔體上半部107在同一側，下承載台103與腔體 下半σΡ 101在同"側。 _兩f板被固持完成後’腔體下半部1G1與腔體上半部107 近，越迫腔體密封件1〇2使腔體密合。密合後經由腔 =氧體通道111，開始對腔體抽真空減璧，減麗完成後具互鎖 載台116與下承載台103開始靠近使預塗佈之液/謬 、106開始接觸，直到兩基板之貼合贿到達設定值 201216234 後停止。 貼合完具互鎖槽之上承載台116將互鎖塊115釋放，使得 已貼合完成之基板與互鎖塊115可被移出，再將黏性物質117 經減低黏性之製程後’將互鎖塊115和黏性物質117與完成貼 合之基板分離’如使用不需減低黏性而可直接分離之膠帶黏 性物質117時’則直接與基板分離。 如此發明（三）之貼合工作便完成。 以上之實施例說明，僅為本創作之較佳實施例說明，凡習 於此項技術者當可依據本創作之上述實施例說明而作其它種 種之改良及變化。然巾這些依據本創作實施例所作的種種改良 及變化，當仍屬於本創作之創作精神及界定之專利範圍内。 【圖式簡單說明】 第一圖 習知之基板貼合裝置。 B®本發明㈠之基板貼合裝置剖面圖。 =二本發明（二)之基板貼合裝置剖面圖。 第四八，3圖本發日月（三)之基板貝占合裝置剖面圖。 【主要元件符號說明】 101 102 103 104 105 106 107 108 109 110 腔體下半部 腔體密封件 下基板承載台 第二基板 密封用框膠(液/膠狀物） 充填之液/膠狀物 腔體上半部 上基板承載台 第一基板 黏性物質 201216234 111 腔體氣體通道 112 磁力控制之上基板承載台 113 磁性材料塊 114 黏性物質 115 互鎖塊 116 具互鎖槽之上基板承載台 117 黏性物質Disk if*,, and the first substrate; the first substrate: a plurality of adhesive blocks for the interlocking block; the lower substrate carrier: for carrying the second substrate; the second substrate: = the upper substrate carrier; liquid / Glue: coated on the first filling between the two substrates. ^ The pressure in the salty cavity is equivalent to reducing the age of the gas, and the degree of bubble residue. The pressure of the vacuum chamber is between Q and helium pressure (atm). The glass substrate and the plastic substrate are common materials for the liquid crystal panel and the touch panel. After the lower half of the upper part of the cavity is closed, the internal air is removed from the cavity and the internal pressure of the cavity is decompressed. After the pressing is completed, the upper substrate carrying platform and the lower substrate carrying platform can abut each other, and the liquid material on the first substrate contacts the first substrate, so that the liquid/gel to be filled is spread between the interlayers of the two substrates. . After the bonding of the board is completed, the interlocking block of the upper substrate carrying table is released, so that the substrate and the interlocking block which have been attached are detached from the substrate carrying platform. The interlocking block has a shoulder corresponding to the upper bearing and can be interlocked to provide support. σ Viscous material must be removed after the process is completed, so it can be used to re-stick the material I, the material that can be heated to reduce the viscosity, or the material that can be cured by UV irradiation to make the sticky material easy to be removed. . 201216234 For a more detailed and clear understanding of the purpose, function and structural features of the present invention, the following preferred embodiments are illustrated with the following description: [Embodiment] Please refer to the second figure for the following description. This figure is a cross-sectional view of the substrate bonding apparatus invention (1). The working mode is as follows: firstly, the adhesive material 110 is pre-adhered to the first substrate 109 or the upper carrier 108, and then the first substrate 109 and the upper carrier 1〇8 are bonded by the adhesive material 110. Next, the second substrate 104 is pre-coated with the liquid sealant sealant 105 and the filled liquid/glue 〇6, and placed on the lower stage 1〇3. When the lower half 1〇1 of the vacuum chamber is not in close contact with the upper half 107 of the cavity, the upper stage 108 is on the same side as the upper part 1〇7 of the cavity, and the lower stage of the lower stage 1〇3盥 cavity The part 101 is on the same side. After the two substrates are held, the lower half of the cavity begins to approach the upper half of the cavity 1〇7, and presses the cavity seal 1〇2 to make the cavity close, and after the close, the cavity gas passage 111, The cavity is evacuated and decompressed. After the decompression is completed, the I carrier 108 and the lower carrier 1〇3 begin to approach, so that the pre-coated liquid/glue 1〇5, 106 starts to contact' until the two substrates are bonded. The gap stops after reaching the set value. After the bonded substrate is subjected to the process of reducing the viscosity of the adhesive substance 11, the substrate which has been laminated is removed, and if the adhesive or the adhesive substance 110 which can be directly separated without reducing the viscosity is used, Then, the substrate is directly taken out, and the bonding work of the invention (1) is completed. For the following description, please refer to the third drawing, which is a cross-sectional view of the substrate bonding apparatus invention (2). The working mode is as follows: firstly, the magnetic material block 113 is pre-adhered to the first substrate 109 by the adhesive 114, and then the pre-adhesive finished substrate 1〇9, 113, 114 and the magnetic control upper loading platform 112. The magnetic field is fixed to the upper stage 112 by magnetic force. Next, the second substrate 104 is pre-coated with the sealant 105 and the filled liquid/glue 1〇6 and placed on the lower stage 1〇3. When the lower half of the vacuum chamber 1〇1 is not in close contact with the upper half of the cavity 1〇7, the stage 112 is on the same side as the upper half of the cavity 1〇7 on the same side lower half 101. After the iui and the cavity are completed, the lower half of the cavity is 1〇1 and the upper part of the cavity is 〇72, and the cavity 11 is sealed by the sealing member 102 to make the cavity close. After the close-up, the cavity is evacuated through the cavity 1^_, and the magnetic control is completed after the slave is removed. #Starting with the lower carrier 1〇3, the pre-coating liquid/rubber back u, 1〇6 is started to contact until The bonding gap between the two substrates reaches the set value and stops. ρ ρ ί ί ϋ ϋ ϋ ϋ 112 112 112 112 112 112 112 112 112 112 112 112 112 112 112 112 ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ Separation. The fitting work of the invention (2) is completed. For the following description, please refer to the _, this figure is the substrate bonding device invention (3). The method is as follows: first, the interlocking block 115 is pre-treated with the viscous material 117, and the _substrate is completed by red 雠(10), 115, 117 The two interlocking grooves above the carrying platform 116 are fixed to the inter-frame by the action of the interlocking device. Then, the second substrate 1〇4 is pre-coated with the liquid seal 5 and the filled liquid/glue 1〇6, and then placed on the lower stage 1〇3 2 vacuum chamber lower half 101 and the upper part of the cavity When the portion 1〇7 is not yet in close contact, the upper main body 2 is on the same side as the upper half portion 107 of the cavity, and the lower carrying stage 103 is on the same side as the lower half σΡ 101 of the cavity. After the two plates are held, the lower half of the cavity 1G1 is close to the upper half 107 of the cavity, and the cavity seal 1〇2 is forced to close the cavity. After the sealing, the cavity is evacuated and reduced by the cavity = oxygen channel 111. After the reduction is completed, the interlocking stage 116 and the lower stage 103 start to approach, so that the pre-coated liquid/谬, 106 starts to contact. Until the binding of the two substrates reaches the set value 201216234 and stops. The carrier 116 is released from the mating groove to release the interlocking block 115, so that the bonded substrate and the interlocking block 115 can be removed, and then the adhesive 117 is subjected to the process of reducing the viscosity. The interlocking block 115 and the viscous substance 117 are separated from the substrate to be bonded. When the tape viscous material 117 which can be directly separated without reducing the viscosity is used, it is directly separated from the substrate. The fitting work of the invention (3) is completed. The above embodiments are merely illustrative of the preferred embodiments of the present invention, and those skilled in the art can make various other modifications and changes as described in the above embodiments of the present invention. However, all the improvements and changes made in accordance with the present embodiment are still within the scope of the creative spirit and definition of the creation. [Simple description of the drawings] The first figure is a conventional substrate bonding device. B® Sectional view of the substrate bonding apparatus of the invention (1). = Section 2 of the substrate bonding apparatus of the invention (2). The fourth and third figures are the cross-sections of the substrate shelling device of the sun and the moon (3). [Main component symbol description] 101 102 103 104 105 106 107 108 109 110 cavity lower half cavity seal lower substrate carrier second substrate sealing frame glue (liquid/glue) filling liquid/glue Upper substrate upper substrate carrier substrate first substrate viscous material 201216234 111 cavity gas channel 112 magnetic control upper substrate carrier 113 magnetic material block 114 viscous material 115 interlocking block 116 with interlocking groove above substrate carrier Table 117 sticky substance