KR101049927B1 - Silicone coated plastic bonding sheet and method of making same - Google Patents

Abstract

The present invention relates to a silicon-coated plastic bonding sheet and a method of manufacturing the same, wherein the silicon-coated plastic bonding sheet according to the present invention comprises a base layer having a surface modified by plasma-treating plastic; And a silicone coating layer formed by adding at least one of the following chemical formulas (1), (2) and (3) to silicon and chemically bonding the substrate layer with a catalyst of the following formula (4).

According to the present invention, silicon is coated on a plastic without a primer by chemical bonding by generating a reactive functional group on a plastic surface through a plasma treatment, adding a specific silicone composition to silicon, and using a specific catalyst And its adhesive strength is also remarkably excellent.

Plastics, Silicon, Plasma, Adhesion, Heat treatment, Polyethylene terephthalate, Teflon, Polyimide

Description

TECHNICAL FIELD [0001] The present invention relates to a silicone-coated plastic bonding sheet and a method of manufacturing the same.

TECHNICAL FIELD The present invention relates to a silicon-coated plastic bonding sheet and a method of manufacturing the same, and more particularly, to a method of manufacturing a silicon-coated plastic bonding sheet by coating silicon on a plastic without using a primer by chemical bonding by using a plasma treatment, a silicone composition and a catalyst, To a silicon-coated plastic bonding sheet and a method of manufacturing the same.

Generally, silicone is excellent in tensile strength, heat resistance, cold resistance, water resistance, electrical insulation and abrasion resistance, and has unique elasticity and is used as a gasket for various electronic products. However, due to the inherent dendritic properties of silicon, such silicones can not bond to each other when they are coated with other polymers and dots / adhesives, so that they can not bond silicon to other materials and their elasticity hysteresis There is a problem that can not be done.

In order to overcome the above-mentioned problems, it has been attempted to overcome the above-mentioned problems by joining a plastic substrate such as a polyester film and the silicone with a tape coated with an adhesive or an adhesive, And still has a problem that it is easily peeled off by an external impact such as heat.

Silicon is excellent in heat resistance, electrical insulation, etc., and has unique elasticity. Therefore, silicon is used as a bonding sheet for attaching the panel to a flexible printed circuit (FPC) when manufacturing LCD and PDP panels. .

At the same time, Teflon exhibits excellent non-tackiness for water as well as oil because of its excellent non-tackiness. Especially, it has excellent electric insulation, but it has polarity of surface and can not be bonded with other materials / , And despite its excellent non-tackiness, it is not commercially available as a general coating fabric.

Currently, there are two types of bonding sheets used in the copper market: 1) silicon is calendered to form silicon itself, and 2) Skived Teflon is used.

However, although silicon used as such a bonding sheet has silicone mold releasability and weak adhesive property, its properties are much lower than that of Teflon film, which causes anisotropic conductivity There is a problem that a film (anisotropic conducting film, ACF) is transferred to the silicon surface to cause defects.

Teflon film having excellent releasability may be used to improve the strength of the Teflon film. However, such a Teflon film has a problem in that the Teflon film is deformed by heat to shorten its service life, And a silicone which is excellent in heat resistance and elasticity is mounted on the upper part and used as a bonding sheet which is supplied independently.

Further, as shown in Experiments 2 and 2, the silicon produced by the conventional condensation-type curing method is significantly higher in thickness reduction ratio before and after the coating than in the addition type curing system. In particular, There is a problem in that the physical properties such as compression properties and tensile strength of the silicon itself, which are important factors of the properties of the molded silicone, are inferior to those of the silicon produced by the addition type hardening. In addition, the silicon produced by the conventional condensation type curing method requires curing time several days at room temperature due to curing at room temperature, so that mass productivity is a problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a method for producing a thermosetting resin composition, which comprises forming a reactive functional group on a plastic surface through plasma treatment, adding a specific silicone composition to silicon, It is an object of the present invention to provide a silicone-coated plastic bonding sheet which is coated with silicone on a plastic without a primer and has excellent adhesion.

In addition, unlike the conventional condensation type room temperature curing, the addition type curing is introduced to solve the problem of mass production, and a heat treatment process is introduced to improve the adhesion reactivity between the plastic and the silicon coating in one process, To thereby provide a method of manufacturing a silicon-coated plastic bonding sheet in which not only the adhesion of the bonding sheet is further enhanced but also the productivity is improved.

According to an aspect of the present invention, there is provided a silicon-coated plastic bonding sheet,

A substrate layer whose surface is modified by plasma-treating plastic; And a silicone coating layer formed by adding at least one of the following chemical formulas (1), (2) and (3) to silicon and chemically bonding the substrate layer with a catalyst of the following formula (4).

[Chemical Formula 1]

(2)

3MgO · 4SiO ₂ · H ₂ O

(3)

(L: 리간드, ligand)(X: first organic group, OR: second organic group)
[Chemical Formula 4]

(L: ligand, ligand)

delete

The surface of the base layer has a contact angle of 5 to 95 °. At least one of the above-mentioned Formula 1, Formula 2 and Formula 3 is 0.1 to 50 parts by weight based on 100 parts by weight of the silicone .

The catalyst may be used in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the silicone. In the formula (3), X may be a vinyl group, an epoxy group, a methacryloxy group, an amino group, or a mercapto group And the OR of Formula 3 is at least one of a methoxy group and an ethoxy group.

According to another aspect of the present invention, there is provided a method of manufacturing a silicon-coated plastic bonding sheet,

A plasma treatment step of plasma treating the plastic substrate at a pressure of 10 ^-2 torr or less, argon alone, or in an atmosphere containing argon alone or in an atmosphere containing oxygen or nitrogen to generate a reactive functional group on the surface; A step of preparing a silicone composition by adding to the silicon at least one of the above-mentioned formula (1), (2) and (3) and adding the catalyst of the formula (4) A coating step of coating the silicone composition by applying the silicone composition to the plastic substrate to cause a chemical bonding reaction; And heat treating the plastic substrate at a temperature of 50 to 500 ° C for 10 seconds to 48 hours.

The plastic substrate is made of at least one of polyethylene terephthalate (PET), Teflon, and polyimide (PI).

The method may further include a drying step in which the plastic substrate is dried at a temperature of 30 to 200 DEG C for 1 minute to 2 hours between the coating step and the heat treatment step.

Wherein the weight ratio of the argon to the nitrogen or the argon to the nitrogen is from 1: 1 to 1: 4, and at least one of the formula (1), (2) And one of them is 0.1 to 50 parts by weight based on 100 parts by weight of the silicone.

In addition, the surface of the plastic substrate modified through the plasma treatment step has a contact angle of 5 ° to 95 °, and the catalyst is 0.1 to 10 parts by weight based on 100 parts by weight of the silicon.

X in Formula 3 is at least one of a vinyl group, an epoxy group, a methacryloxy group, an amino group, or a mercapto group, and the OR in Formula 3 may be a methoxy group or an ethoxy group. And at least one of the groups.

According to the silicon-coated plastic bonding sheet and the method of manufacturing the same according to the present invention, unlike the conventional method, by generating a reactive functional group through plasma treatment on a plastic surface, adding a specific silicone composition to silicon, By bonding, silicon can be coated on plastic without primer, and its adhesion is also remarkably excellent.

In addition, unlike the conventional condensation type room temperature curing, the addition type curing is introduced to solve the problem of mass production, and a heat treatment process is introduced to improve the adhesion reactivity between the plastic and the silicon coating in one process, , There is an advantage that not only the adhesion of the bonding sheet is further strengthened but also the productivity is improved.

Hereinafter, a silicon-coated plastic bonding sheet according to the present invention and a method of manufacturing the same will be described in detail with reference to the drawings.

First, as shown in FIG. 1, the silicon-coated plastic bonding sheet according to the present invention comprises a base layer 11 having a surface modified by plasma treatment of a plastic 10, a base layer 11 made of silicon (silicon, And a silicone coating layer 20 added with at least one of the following chemical formulas (1), (2) and (3) and chemically bonded to the substrate layer (11) by adding a catalyst of the following chemical formula (4).

[Chemical Formula 1]

(2)

3MgO · 4SiO ₂ · H ₂ O

(3)

(X: first organic group, OR: second organic group)
[Chemical Formula 4]

(L: 리간드, ligand)

(L: ligand, ligand)

delete

delete

Here, the plastic is made of polyethylene terephthalate (PET)

(PET), Teflon, or polyimide (PI). This is the most effective material for the surface modification according to the present invention and thus the adhesion to silicon.

Here, the plasma treatment is performed in order to increase the adhesive strength so as to generate a reactive functional group on the plastic substrate surface 11 so as to facilitate the silicon coating, and detailed conditions and processes for the plasma treatment will be described below.

The contact angle of the substrate layer surface 11 modified by such a plasma treatment is preferably 5 to 95, and most preferably 30 to 60. The reactive functional groups are generated on the surface of the plastic substrate layer due to the plasma treatment of the specific conditions mentioned below, so that the average contact angle before plasma treatment is greatly reduced compared with that of 100 to 120 DEG. When the contact angle is less than 5 DEG, the productivity is lowered, and the adhesive force is rather reduced. When the contact angle is more than 95 DEG, the adhesive force is not increased to an appropriate level.

The above-mentioned chemical formulas (1), (2), and (3) are adhesion additive materials, which are combined with silicon to increase the adhesive force with the plastic substrate layer. The above chemical formulas (1), (2) and (3), which can be chemically bonded to the reactive functional groups on the surface of the modified plastic substrate layer, are subjected to several experiments to obtain a compound capable of binding most strongly with the reactive functional group on the surface of the plasma- Which is added to silicon so as to maximize the adhesion between the plastic substrate layer and the silicon coating layer.

Wherein X is a functional organic group and OR is a hydrolyzable organic group and X is at least one of a vinyl group, an epoxy group, a methacryloxy group, an amino group, or a mercapto group And OR preferably includes at least one of a methoxy group or an ethoxy group. Through several experiments, it can be seen that the addition of the above formula 3 to the silicon is the most effective as an additive material that can improve the adhesive strength most.

The content of at least one of Formula 1, Formula 2 or Formula 3 is preferably 0.1 to 50 parts by weight, more preferably 0.1 to 30 parts by weight based on 100 parts by weight of the silicone. When the amount is less than 0.1 part by weight, the effect of improving the adhesive force is insignificant. When the amount is more than 50 parts by weight, not only the economical efficiency is lowered but also the required property of silicon is significantly lowered.

Unlike the conventional condensation-type room temperature curing, the catalyst of the following formula (4) facilitates the addition reaction so as to allow curing of the additive type, thereby facilitating the chemical bonding between the plastic substrate layer and the silicon coating layer do. As a result, the curing time can be remarkably shortened and the adhesive force can be improved, thereby solving the conventional problem of mass production.

The content of the catalyst is preferably 0.1 to 10 parts by weight, more preferably 0.1 to 5 parts by weight based on 100 parts by weight of the silicone. When the amount is less than 0.1 part by weight, the effect of improving the reactivity of the addition reaction is insignificant. When the amount is more than 10 parts by weight, not only the economical efficiency is lowered but also the reaction is disturbed.

Next, a method of manufacturing a silicon-coated plastic bonding sheet according to the present invention includes a plasma processing step (S10), a silicon composition manufacturing step (S20), a coating step (S30), a heat treatment step (S40 ).

The plasma treatment step S10 is a step of plasma-treating the plastic substrate at a pressure of 10 ^-2 torr or less, argon alone, or in an atmosphere containing argon with oxygen or nitrogen to generate reactive functional groups on the surface. This is carried out to produce a reactive functional group on the plastic substrate and to improve the bonding strength with the silicone coating layer which is applied and cured to the plastic substrate.

Here, the plastic substrate is made of at least one of polyethylene terephthalate (PET), Teflon, or polyimide (PI). This is the most effective material for the surface modification according to the present invention and thus the adhesion to silicon.

Here, the reactive functional group is an oxygen-containing functional group such as -OH, -OOH, -COOH, -C-O-, -C = O, -O-C-O- or the like.

Unlike the general plasma treatment, in the present invention, the plasma treatment was performed under the condition that the bonding strength with the silicon coating layer can be maximized through several experiments through optimization of the plastic substrate. Hereinafter, the plasma treatment conditions will be described.

First, the pressure is preferably 10 ^-2 torr or less, and most preferably 10 ^-3 torr to 10 ^-7 torr, in order to produce an effective reactive functional group on the surface of the plastic substrate. When the pressure exceeds 10 ^-2 torr, there arises a problem that arc discharge due to impurities occurs or density of reactive functional groups is lowered due to scattering.

Next, it is preferable that the gas to be filled for the plasma treatment is filled with argon alone or the argon is further filled with oxygen or nitrogen. Other inert gases such as helium may be used instead of argon, but argon is most effective. Here, the argon gas is an inert gas, which does not react with other gases but is only involved in ionization excitation. Oxygen acts as a surface cleaning agent that chemically combines and evacuates oxygen formed on the plastic substrate after vacuum evacuation do. In addition, nitrogen plays a role of changing the chain structure of the surface of the plastic substrate to generate a new functional group to increase the bonding force. The ionization excitation means a process in which ionization of gas is caused by an external electric source to generate an excited state having a high energy.

The amount of argon is preferably 10 to 100 sccm, and most preferably 20 to 60 sccm when the argon is filled alone. If it is less than 10 sccm, there is a problem that ionization excitation is not sufficiently generated. If it exceeds 100 sccm, the pressure exceeds 10 ^-2 torr or the economical efficiency is low, and the generation density of reactive functional groups is low.

In the case of filling argon with oxygen or argon with nitrogen, the weight ratio of argon to oxygen or argon to nitrogen is preferably 1: 1 to 1: 4, more preferably 1: 1 to 1: : 3 is effective. If it is outside the above range, there is a problem that the reactivity of oxygen or nitrogen is high and the density of the reactive functional groups is lowered.

Plasma treatment of the plastic surface is performed using the Ion Beam Assisted Reaction (IAR) under the above conditions. An ion assisted reaction method is a method in which a surface of a polymer material is irradiated with ions having a predetermined energy to change its surface to an activated state and at the same time a reactive gas is injected around the surface of the material to be modified, .

3, the surface of the plastic substrate 30 is irradiated with the ion beam 31 by the ion gun 32 while passing the plastic substrate 30 through the substrate holder 34, The reactive gas 33 is injected. A positive charge discharged by the ion beam 31 on the surface of the plastic substrate 30 generates a negative charge on the surface of the plastic substrate 30 and forms a reactive functional group by the action of the filled reactive gas 33.

After the plasma treatment step (S10), the plastic substrate surface is modified to facilitate adhesion as described above.

The step (S20) of preparing the silicone composition is a step of preparing a silicone composition by adding a catalyst represented by the following formula (1) or (2) or (3)

[Chemical Formula 1]

(2)

3MgO · 4SiO ₂ · H ₂ O

(3)

(X: first organic group, OR: second organic group)
[Chemical Formula 4]

(L: ligand, ligand)

delete

delete

The formula 1 is the same as the formula 1 described above. The formula 2 is the same as the formula 2, and the formula 3 is the same as the formula 3. Each content and its significance are also as described above.

However, the silicone composition includes silicon in the formula (1), (2) or (3) and the catalyst.

The coating step S30 is a step of coating the silicone composition by applying the silicone composition to the plastic substrate to cause a chemical bonding reaction. This is a step of applying the liquid silicone composition on the surface of the plasma-treated plastic substrate so that the plastic substrate is chemically bonded to the silicone composition without the primer by the addition reaction as described above.

(S31) after the coating step (S30), before the heat treatment step (S40), through the drying chamber, i.e., at a temperature of 30 to 200 DEG C for 1 minute to 2 hours.

Finally, the heat treatment step (S40) is a step of applying heat to the plastic substrate at a temperature of 50 to 500 DEG C for 10 seconds to 48 hours. This is because micro-irregularities are formed on the surface of the plastic substrate by the plasma treatment. The silicone composition applied to the surface of the plastic substrate is bonded to the plastic substrate by chemical bonding, but there is a partially separated space due to the fine irregularities. If the heat treatment step is performed under the above-described conditions, the silicone composition is instantaneously softened, and penetrates to every corner of the micro concavo-convex portion of the surface of the plastic substrate, thereby bonding more strongly. FIG. 4A shows the attachment state before the heat treatment step, and FIG. 4B shows the attachment state after the heat treatment step, which is a characteristic of the heat treatment step of the present invention. This has led to the development of a step of effectively increasing the adhesive force through several studies and experiments in consideration of the characteristics of the plasma treatment of the present invention and the characteristics of the silicone composition of the present invention as compared with other polymeric materials, .

The heat treatment temperature is preferably 50 to 500 ° C, and more preferably 150 to 250 ° C. When the temperature is lower than 50 deg. C, the silicone composition is not sufficiently softened and the effect of the heat treatment is insignificant. When the temperature exceeds 500 deg. C, the materials are deformed.

Further, the heat treatment time should be controlled according to the heat treatment temperature (i.e., if the heat treatment temperature is high, shortening the heat treatment time and increasing the heat treatment time if the heat treatment temperature is low), the heat treatment is preferably performed for 10 seconds to 48 hours. Preferably for 5 minutes to 4 hours. In the case of heat treatment with only 10 seconds, there is almost no heat treatment effect as demonstrated by the following experiment, and when it exceeds 48 hours, economical efficiency is lowered, and in case of high temperature, the material is severely deformed.

Hereinafter, the effects of the present invention will be demonstrated through examples of a silicon-coated plastic bonding sheet and a method of manufacturing the same according to the present invention.

Example 1

An active functional group was formed by ionization treatment on the surface of the plastic substrate by plasma treatment so that the plasma treatment condition was set to argon alone and a voltage of 2,000 V / 0.05 to 0.5 A (100 to 1000 W) was applied.

20 parts by weight of the adhesion improvers (1) and (2), and 0.5 part by weight of the catalyst of the formula (4) were applied to the surface of the plastic substrate treated with the plasma to 100 parts by weight of silicon and silicon Treated at 200 캜 for 5 minutes to prepare a silicone-coated plastic bonding sheet.

Example 2

Other conditions were the same as in Example 1, and the plasma treatment conditions were changed to a weight ratio of argon to oxygen of 1: 1.

Example 3

Other conditions were the same as in Example 1, and only the plasma treatment conditions were changed to a weight ratio of argon and nitrogen of 1: 2.

Example 4

Other conditions were the same as in Example 1, except that the contents of the above Formulas 1 and 2 were changed to 30 parts by weight and the catalyst of Formula 4 was changed to 0.2 parts by weight.

Example 5

The other conditions were the same as in Example 1, and the heat treatment conditions were changed to heat treatment at a temperature of 200 캜 for 30 minutes.

Comparative Example 1

Other conditions were the same as in Example 1, and the heat treatment step was omitted.

Comparative Example 2

Other conditions were the same as in Example 1, and the plasma treatment conditions were changed to a weight ratio of argon to oxygen of 2: 1.

Comparative Example 3

Other conditions were the same as in Example 2, except that the contents of the above Formulas 1 and 2 were changed to 50 parts by weight and the catalyst of Formula 4 was changed to 0.01 part by weight.

<Experiment 1>

The silicone-coated plastic bonding sheets prepared according to Examples 1 to 5 and Comparative Examples 1 to 3 were tested for peeling, compression bonding, and thickness reduction ratio as shown in Table 1 below.

[Table 1]

Whether or not peeling Squeezed state Thickness reduction rate Example 1 ○ pass pass Example 2 ○ pass pass Example 3 ○ pass pass Example 4 ○ pass pass Example 5 ◎ pass pass Comparative Example 1 X fail fail Comparative Example 2 △ fail pass Comparative Example 3 X fail fail

  ※ Whether or not to peel off is determined by peeling the FPCB by 20 peelings.

    ⊚ indicates no peeling at all, ◯ indicates almost no peeling, Δ indicates slightly peeling, and X indicates peeling completely.

  ※ When the FPCB squeeze is more than 20 degrees, the squeezing state is accepted.

  ※ Thickness reduction rate should be passed after FPCB squeezing is carried out 20 times and the thickness reduction ratio before and after squeezing is within 5%.

As shown in Table 1, it was confirmed that Examples 1 to 5 according to the present invention did not cause peeling, and that the adhesive strength was excellent, and the pressed state and thickness reduction rate were also excellent. On the other hand, in Comparative Examples 1 to 3, The squeezed state was not good either.

Therefore, it can be seen that the heat treatment step of the present invention is included, and the adhesion strength is remarkably excellent when it is carried out within the numerical range of the present invention.

<Experiment 2>

The properties of a silicone-coated plastic bonding sheet prepared by conventional condensation-type curing and a silicone-coated plastic bonding sheet cured by the addition type of the present invention were compared. The results are shown in Table 2 below.

[Table 2]

Conventional condensation type The addition type Measuring conditions Thickness before aging 275 탆 317 탆 Micrometer (탆)
(Resolution 0.001 mm) Thickness after aging 225 탆 310 탆 Thickness reduction rate after aging 18.2% 2.2% Attachment △ (weak) O Squeeze inspection Squeezed state 2 strokes, bubble generation Twenty 370 ° C, 60 kgf / 7 sec Compression ratio (%) Not measurable
(Silicon breakage) 2.1% After twenty strokes
Thickness reduction rate

As shown in Table 2, in the case of the conventional condensation type system, the physical properties are degraded such that the thickness reduction rate is high, the adhesion is poor, and the compression can not be measured. In the case of the addition type system of the present invention, , Adhesion and compression ratio are also excellent.

<Experiment 3>

Experiments were carried out to measure the adhesive force with the heat treatment temperature and time. This was produced according to the production method of the present invention, but only the heat treatment temperature and time were changed. The results are shown in Table 3 below.

[Table 3]

Heat treatment temperature

Contact time 5 seconds 30 seconds 30 ℃ Not attached Not attached 60 ° C 70% attached 95% attached 100 ℃ 90% attached 100% attached 400 ° C 100% attached 100% attached 600 ℃ 100% attached
(But somewhat deformed) Modified

As shown in Table 3, adhesion between the plastic substrate and the silicone composition was strong when the heat treatment was performed within the range of the present invention, and it was confirmed that when the heat treatment was performed outside the range, the adhesion force was lowered or deformed .

<Experiment 4>

In the plasma treatment step, an experiment was conducted to compare the contact angles before and after the surface treatment in the case where argon and oxygen were added together when argon alone was added to the gas. The results are shown in Table 4 below and Figs. 5A, 5B and 5C.

[Table 4]

gas argon
Argon + oxygen
Whether surface treatment X O X O Primary (contact angle) 111.94 [deg.] 88.32 [deg.] 111.94 [deg.] 84.70 ° Secondary (contact angle) 111.24 [deg.] 89.17 [deg.] 111.24 [deg.] 80.78 [deg.] Third (contact angle) 111.10 [deg.] 87.02 DEG 111.10 [deg.] 83.33 DEG Average contact angle 111.43 [deg.] 88.17 [deg.] 111.43 [deg.] 82.94 [deg.]

As shown in Table 4 and FIG. 5A, FIG. 5B, and FIG. 5C, when the surface treatment is performed according to the plasma condition of the present invention, the contact angle is measured to fall within the range of the present invention. I was able to notice this remarkable difference. This confirms that the plasma treatment of the present invention increases the adhesive force by forming irregularities.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It is clear that the present invention can be suitably modified and applied in the same manner. Therefore, the above description does not limit the scope of the present invention, which is defined by the limitations of the following claims.

1 is a cross-sectional view of a silicon-coated plastic bonding sheet of the present invention

Fig. 2 is a flow chart sequentially showing a method of producing the silicon-coated plastic bonding sheet of the present invention

FIG. 3 is a schematic view showing a plasma processing step in the method of manufacturing the silicon-coated plastic bonding sheet of the present invention

4A is a cross-sectional view of a silicon-coated plastic bonding sheet without the heat treatment step of the present invention

4B is a cross-sectional view of a silicon-coated plastic bonding sheet after the heat treatment step of the present invention

5A is a photograph showing the contact angle of the surface of the plastic substrate before the plasma processing step of the present invention

Fig. 5B is a photograph showing the contact angle of the surface of the plastic substrate after the plasma treatment step (argon gas alone) of the present invention

FIG. 5C is a photograph showing the contact angle of the surface of the plastic substrate after the plasma treatment step (argon + oxygen) of the present invention

Description of the Related Art [0002]

10: substrate layer

11: surface-modified substrate layer

20: silicone coating layer

30: plastic substrate

31: ion beam

32: Ion gun

33: Reactive gas

34: substrate holder

Claims (14)

A substrate layer whose surface is modified by plasma-treating plastic; And a silicone coating layer formed by adding at least one of the following chemical formulas (1), (2) and (3) to silicon and chemically bonding to the substrate layer by adding a catalyst of the following chemical formula (4) X in the formula (3) is at least one of a vinyl group, an epoxy group, a methacryloxy group, an amino group or a mercapto group, and the OR group in the following formula (3) is a methoxy group or an ethoxy group. Lt; RTI ID = 0.0 &gt; Wherein at least one of the following formulas (1), (2) and (3) is 0.1 to 50 parts by weight based on 100 parts by weight of the silicone, and the catalyst is 0.1 to 10 parts by weight with respect to 100 parts by weight of the silicone. Coated plastic bonding sheet. [Chemical Formula 1]

(2) 3MgO · 4SiO ₂ · H ₂ O (3)

(X: first organic group, OR: second organic group) [Chemical Formula 4]

(L: ligand, ligand) The method according to claim 1, The plastic may be selected from the group consisting of polyethylene terephthalate, (PET), Teflon, or polyimide (PI). 3. The method according to claim 1 or 2, Wherein the surface of the base layer has a contact angle of 5 DEG to 95 DEG. delete delete delete A plasma treatment step of plasma treating the plastic substrate at a pressure of 10 ^-2 torr or less, argon alone, or in an atmosphere containing argon alone or in an atmosphere containing oxygen or nitrogen to generate a reactive functional group on the surface; Preparing a silicone composition by adding at least one of the following general formula (1) or (2) or (3) to silicon and adding a catalyst of the following general formula (4) to a silicone composition; A coating step of coating the silicone composition by applying the silicone composition to the plastic substrate to cause a chemical bonding reaction; And a heat treatment step of applying heat to the plastic substrate at a temperature of 50 to 500 ° C for 10 seconds to 700 minutes, X in the formula (3) is at least one of a vinyl group, an epoxy group, a methacryloxy group, an amino group or a mercapto group, and the OR group in the following formula (3) is a methoxy group or an ethoxy group. Lt; RTI ID = 0.0 &gt; Wherein at least one of the following formulas (1), (2) and (3) is 0.1 to 50 parts by weight based on 100 parts by weight of the silicone, and the catalyst is 0.1 to 10 parts by weight with respect to 100 parts by weight of the silicone. A method of manufacturing a coated plastic bonding sheet. [Chemical Formula 1]

(2) 3MgO · 4SiO ₂ · H ₂ O (3)

(X: first organic group, OR: second organic group) [Chemical Formula 4]

(L: ligand, ligand) 8. The method of claim 7, Wherein the plastic substrate is made of at least one of polyethylene terephthalate (PET), Teflon, or polyimide (PI). 9. The method according to claim 7 or 8, Further comprising a drying step in which the plastic substrate is dried at a temperature of 30 to 200 DEG C for 1 minute to 2 hours between the coating step and the heat treatment step. 9. The method according to claim 7 or 8, Wherein the argon alone comprises 10 to 100 sccm and the weight ratio of argon to oxygen or argon to nitrogen is from 1: 1 to 1: 4. delete 9. The method according to claim 7 or 8, Wherein the surface of the plastic substrate modified through the plasma treatment step has a contact angle of 5 ° to 95 °. delete delete

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