CN108695447A - A kind of packaging system and method for flat-panel monitor - Google Patents
A kind of packaging system and method for flat-panel monitor Download PDFInfo
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- CN108695447A CN108695447A CN201710234571.5A CN201710234571A CN108695447A CN 108695447 A CN108695447 A CN 108695447A CN 201710234571 A CN201710234571 A CN 201710234571A CN 108695447 A CN108695447 A CN 108695447A
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- glue
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- panel monitor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The present invention relates to display encapsulation technology field, the present invention provides a kind of packaging system and method for flat-panel monitor, which includes:Flat-panel monitor is fixed on pallet;In the surface smear glue of flat-panel monitor, and on glue upper layer, coverslip is set;In coverslip and pallet both ends setting electric field and continue the first preset time period until removing the water oxygen in glue;The second preset time period of illumination is carried out to coverslip and pallet, so that coverslip is bonded completely with flat-panel monitor, by the way that electric field is arranged in coverslip and pallet both ends and continues the first preset time, thoroughly removal flat-panel monitor can be reached and encapsulate the water oxygen between coverslip, improve the leakproofness of flat-panel monitor, water oxygen effectively inside isolation each layer of flat-panel monitor, to optimize the photoelectric efficiency of each layer of flat-panel monitor and keep the transmittability of each layer carrier, enhance the concatenation ability of luminous zone and each buffering interlayer, effectively increase the performance and used life of flat-panel monitor.
Description
Technical field
The present invention relates to display encapsulation technology field more particularly to the packaging systems and method of a kind of flat-panel monitor.
Background technology
In recent years with the fast development of display technology, using semiconductor film material as the Organic Light Emitting Diode of luminescent layer
(OLED) it is had received widespread attention with light emitting diode with quantum dots (QLED).Compared with LCD, liquid crystal backlight and color are not needed
The good features such as purity is high, luminous efficiency is high, luminescent color is adjustable and stability is high make semiconductive thin film light-emitting diodes
Pipe is with a wide range of applications in flat display field.
With constantly bringing forth new ideas for flat panel display, to the encapsulation of new display, there is huge challenges.Display
The quality of encapsulation directly affects the structure and performance of display, is required with industrialization production the efficiency of display encapsulation at present
Target also differs greatly, and is included in the vacuum degree deficiency occurred in the display encapsulation process after completing and packaging plastic and table
The imperfection of face contact, prevents flat-panel monitor from giving full play to primary characteristic, to influence its photoelectric properties.
Industrialization encapsulation at present is mainly with Optical transparent adhesive (i.e. Optically Clear Adhesive, abbreviation OCA glue)
Based on, have the advantages that uniform, refractive index is consistent, translucency is good and stickiness is good etc..According to the difference of packaging plastic thickness
Different fields is can be applied to, main application is:Display assembling, lens assembling, touch screen, panel, glass and plastics
The fitting of material.
The method of packaged flat plate display is commonly dispenser encapsulation, although this method can reach industrialization and efficiency
It is promoted, but can have some factors of instability for the performance of display itself, encapsulated especially for industrial production
The incomplete encapsulation occurred afterwards makes the rising of water oxygen concentration cause display performance impaired.
Invention content
The purpose of the present invention is to provide a kind of packaging system of flat-panel monitor and methods, can solve in the prior art
Being packaged to cause not exclusively to encapsulate to display using dispenser makes the rising of water oxygen concentration cause display performance is impaired to ask
Topic.
The invention is realized in this way first aspect present invention provides a kind of packaging method of flat-panel monitor, the envelope
Dress method includes:
Flat-panel monitor is fixed on pallet;
In the surface smear glue of the flat-panel monitor, and on the glue upper layer, coverslip is set;
In the coverslip and pallet both ends setting electric field and continue the first preset time period until removing the water
Water oxygen in glue;
The second preset time period of illumination is carried out to the coverslip and the pallet, so that the coverslip and the tablet
Display is bonded completely.
Based in a first aspect, the first embodiment as first aspect, described in the coverslip and the pallet
Both ends are arranged electric field and continue the first preset time period until removing the water oxygen in the glue, including:
Electric field is set in the coverslip and the pallet both ends, keeps the acrylic acid anion in the glue anti-along electric field
Direction moves and is completely attached to respectively with the coverslip surface and the tray surface and sharpened with reaching;
Electric field is closed after persistently setting the first preset time period of electric field is until remove the water oxygen in the glue.
The first embodiment based on first aspect, it is described persistently to set as second of embodiment of first aspect
Electric field is closed after the first preset time period of electric field is set until removing the water oxygen in the glue, including:
Persistently setting electric field closes electric field in 2 minutes after the water oxygen removed in the glue.
Based in a first aspect, the third embodiment as first aspect, described on the surface of the flat-panel monitor
Glue is smeared, including:
Glue is uniformly smeared on the surface of the flat-panel monitor.
Based in a first aspect, the 4th kind of embodiment as first aspect, described to the coverslip and the pallet
The second preset time period of illumination is carried out, including:
UV lamp illumination is carried out 3 to 5 minutes to the coverslip and the pallet so that the glue hardens.
Second aspect of the present invention provides a kind of packaging system of flat-panel monitor, and the packaging system includes:
Fixed cell, for flat-panel monitor to be fixed on pallet;
Dispensing unit, for the surface smear glue in the flat-panel monitor;
Upper pressure unit, for coverslip to be arranged on the glue upper layer;
High voltage electrostatic generation unit is preset for electric field to be arranged and continues first in the coverslip and the pallet both ends
Period is until remove the water oxygen in the glue;
Light illuminating unit, for carrying out the second preset time period of illumination to the coverslip and the pallet, so that the lid
Slide is bonded completely with the flat-panel monitor.
Based on second aspect, as the first embodiment of second aspect, the high voltage electrostatic generation unit is described
Coverslip is arranged electric field with the pallet both ends and continues the first preset time period until removing the water oxygen in the glue, specifically
For:
Electric field is set in the coverslip and the pallet both ends, keeps the acrylic acid anion in the glue anti-along electric field
Direction moves and is completely attached to respectively with the coverslip surface and the tray surface and sharpened with reaching;
Electric field is closed after persistently setting the first preset time period of electric field is until remove the water oxygen in the glue.
The first embodiment based on second aspect, as second of embodiment of second aspect, the high pressure is quiet
Electric generating unit closes electric field after the first preset time period of electric field is persistently arranged until removing the water oxygen in the glue, specifically
For:
Persistently setting electric field closes electric field in 2 minutes after the water oxygen removed in the glue.
Based on second aspect, as the third embodiment of second aspect, the dispensing unit is in the FPD
The surface smear glue of device, specially:
Glue is uniformly smeared on the surface of the flat-panel monitor.
Based on second aspect, as the 4th kind of embodiment of second aspect, the light illuminating unit to the coverslip with
The pallet carries out the second preset time period of illumination, specially:
UV lamp illumination is carried out 3 to 5 minutes to the coverslip and the pallet so that the glue hardens.
The present invention provides a kind of packaging system and method for flat-panel monitor, by the way that electricity is arranged in coverslip and pallet both ends
Field simultaneously continues the first preset time period, can reach thoroughly removal flat-panel monitor and encapsulate the water oxygen between coverslip, improve
The leakproofness of flat-panel monitor, and effectively completely cut off the water oxygen inside flat-panel monitor each layer, reach high vacuum levels, to most
It optimizes the photoelectric efficiency of each layer of flat-panel monitor and keeps the transmittability of each layer carrier, enhance luminous zone and each buffering
The concatenation ability of interlayer effectively increases the performance and used life of flat-panel monitor.
Description of the drawings
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description be only the present invention some
Embodiment for those of ordinary skill in the art without having to pay creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is a kind of flow chart of the packaging method for flat-panel monitor that an embodiment of the present invention provides;
Fig. 2 is a kind of structural schematic diagram of the packaging system for flat-panel monitor that another embodiment of the invention provides;
Fig. 3 is a kind of structural schematic diagram of the packaging system for flat-panel monitor that another embodiment of the invention provides.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In order to illustrate technical scheme of the present invention, illustrated below by specific embodiment.
The embodiment of the present invention provides a kind of packaging method of flat-panel monitor, as shown in Figure 1, the packaging method includes:
Flat-panel monitor is fixed on pallet by step S101..
In step S101, before being packaged to flat-panel monitor, first flat-panel monitor is fixed on pallet, it can be with
Using existing various fixed forms, the mode that vacuum suction may be used in this step is fixed.
Step S102. flat-panel monitor surface smear glue, and glue upper layer be arranged coverslip.
In step s 102, the OCA glues in dispenser are uniformly applied to flat-panel monitor by controlling dispenser
On surface, wherein dispensing shape can be Amoled (Active Matrix/Organic Light Emitting Diode,
Active-matrix organic light emitting diode (AMOLED) panel) Y-map shapes or for keep display surface performance mouthpiece shape, wait for by
After glue applies uniformly, the fixation supporting point of dispenser is set to rotate and remove dispenser for 90 ° in the horizontal direction for fulcrum, and in glue
Upper lamination upper cover slide.
Step S103. is in coverslip and pallet both ends setting electric field and continues the first preset time period until in removal glue
Water oxygen.
In step s 103, it is provided with after coverslip and is opened at the both ends of coverslip and pallet on the flat display
Electric field, so that the ion motion in glue realizes that the water oxygen in removal glue, step S103 include the following steps:
Electric field is arranged in coverslip and pallet both ends in step S1031., makes the acrylic acid anion in glue along electric field negative side
It completely attaches to movement and with coverslip surface and tray surface and is sharpened with reaching respectively.
In step S1031, the solute main component of the OCA glues on flat-panel monitor is acrylic acid, and acrylic acid is by height
Molecular organic compound forms, and is the dielectric of conduction and is polar substances, and resistivity is relatively low, there is certain conductive capability,
Since the dielectric of polar molecule composition is when by DC Electric Field, shows electrically, be arranged in coverslip and pallet both ends
Electric field, OCA glues make electronegative acrylic particles be oriented along the opposite direction of electric field under 4kV plus high-pressure static electric fields
Movement, anion acrylic particles reach with flat-panel monitor and coverslip full contact to be sharpened and is separated with solvent.
Step S1032. closes electric field after the first preset time period of electric field is persistently arranged until removing the water oxygen in glue.
In step S1032, electric field is closed after the water oxygen being persistently arranged in 2 minutes removal glues of electric field, at this point, top is inhaled
Disk is detached from coverslip.
It should be noted that extra electric field added in this step belongs to electrostatic spraying, this method is only to resin and pigment
Equal macromolecular organic compounds generate electrostatic field effect, do not interfere with each layer of flat-panel monitor and original structure and performance.
Step S104. carries out the second preset time period of illumination to coverslip and pallet, so that coverslip and flat-panel monitor
Fitting completely.
In step S104, UV lamp illumination is carried out 3 to 5 minutes to coverslip and pallet so that glue hardening, UV lamp illumination
The remaining bubble of OCA glues itself is removed afterwards and cures OCA glues, and coverslip surface is thoroughly made to be contacted with flat-panel monitor surface
Reach seamless bubble-free isolation water oxygen, forms complete fitting.
The flat-panel monitor encapsulation technology that the embodiment of the present invention is provided can be used for OLED tablets, QLED quantum dot light emittings
The thin-film package of layer and Micro LED.
The packaging method that the embodiment of the present invention is provided is electrostatic spray, which belongs to novel flat-plate and show
Packaging method, packaging efficiency is high, is suitable for automatic production line, can reach commercial production level.
The embodiment of the present invention provides a kind of packaging method of flat-panel monitor, is changed by way of electrostatic spraying traditional
The OCA glue glue dispensing and packaging methods of flat-panel monitor can reach thoroughly removal flat-panel monitor and envelope by the packaging method
Water oxygen between capping slide improves the leakproofness of flat-panel monitor, and effectively completely cuts off the water inside each layer of flat-panel monitor
Oxygen reaches high vacuum levels, to optimize the photoelectric efficiency of each layer of flat-panel monitor and keep the transmission of each layer carrier
Ability enhances the concatenation ability of luminous zone and each buffering interlayer, effectively increases the performance and used life of flat-panel monitor.
Another kind embodiment of the invention provides a kind of packaging system 20 of flat-panel monitor, as shown in Fig. 2, packaging system 20
Including:
Fixed cell 201, for flat-panel monitor to be fixed on pallet;
Dispensing unit 202, for the surface smear glue in flat-panel monitor;
Upper pressure unit 203, for coverslip to be arranged on glue upper layer;
High voltage electrostatic generation unit 204, for electric field to be arranged in coverslip and pallet both ends and continues the first preset time
Duan Zhizhi removes the water oxygen in glue;
Light illuminating unit 205, for carrying out the second preset time period of illumination to coverslip and pallet, so that coverslip and tablet
Display is bonded completely.
For fixed cell 201, flat-panel monitor is fixed on pallet, existing various fixed forms may be used,
The mode that vacuum suction may be used is fixed.
For dispensing unit 202, dispenser may be used, it is by controlling dispenser that the OCA glues in dispenser is uniform
It is applied on the surface of flat-panel monitor, wherein dispensing shape can refer to the Y-map shapes of Amoled or to keep display
The mouthpiece shape of surface property, after applying glue uniformly, it is fulcrum 90 ° of rotations in the horizontal direction to make the fixation supporting point of dispenser
Turn and remove dispenser, and is laminated upper cover slide on glue.
Can be HV generator, for exporting 4kV plus high-pressure electrostatic for high voltage electrostatic generation unit 204
Electric field.
For light illuminating unit 205, UV hardening equipments, such as UV lamp may be used.
Further, high voltage electrostatic generation unit 204 is arranged electric field and continues first and presets in coverslip and pallet both ends
Period is until remove the water oxygen in glue, specially:
Electric field is set in coverslip and pallet both ends, the acrylic acid anion in glue is made to move and divide along electric field negative direction
It does not completely attach to coverslip surface and tray surface and is sharpened with reaching;
Electric field is closed after persistently setting the first preset time period of electric field is until remove the water oxygen in glue.
Further, the first preset time period of electric field is persistently arranged until in removal glue in high voltage electrostatic generation unit 204
Water oxygen after close electric field, specially:
Persistently electric field is closed after the water oxygen in 2 minutes removal glues of setting electric field.
Further, dispensing unit 202 flat-panel monitor surface smear glue, specially:
Glue is uniformly smeared on the surface of flat-panel monitor.
Further, light illuminating unit 205 carries out the second preset time period of illumination to coverslip and pallet, specially:
UV lamp illumination is carried out 3 to 5 minutes to coverslip and pallet so that glue hardens.
The specific work process of each unit in the packaging system of above-mentioned flat-panel monitor can refer to preceding method embodiment
In corresponding process, details are not described herein.
The packaging method of the present invention is specifically described below by the operating diagram of specific encapsulating structure:
As shown in figure 3, flat-panel monitor 301 is fixed on pallet 302, control dispenser 304 uniformly applies OCA glues
It being put on the surface of flat-panel monitor 301, coverslip 305 is set on glue upper layer, coverslip 305 is equipped with top chuck 306,
Electric field is set with 302 both ends of pallet in top chuck 306 by HV generator 303,307 and is continued 2 minutes until going
Except the water oxygen in glue, and top chuck 306 is made to be detached from coverslip 305, by UV lamp 308 to coverslip 305 and pallet 302
UV lamp illumination is carried out 3 to 5 minutes so that glue hardening, removes the remaining bubble of OCA glues itself and cure OCA after UV lamp illumination
Glue thoroughly makes 305 surface of coverslip be contacted with 301 surface of flat-panel monitor and reaches seamless bubble-free isolation water oxygen, formed
Complete fitting.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
The specific implementation of the present invention is confined to these explanations.For those of ordinary skill in the art to which the present invention belongs, exist
Several equivalent substitute or obvious modifications are made under the premise of not departing from present inventive concept, and performance or use is identical, all should
It is considered as belonging to present invention scope of patent protection determined by the appended claims.
Claims (10)
1. a kind of packaging method of flat-panel monitor, which is characterized in that the packaging method includes:
Flat-panel monitor is fixed on pallet;
In the surface smear glue of the flat-panel monitor, and on the glue upper layer, coverslip is set;
In the coverslip and pallet both ends setting electric field and continue the first preset time period until removing in the glue
Water oxygen;
The second preset time period of illumination is carried out to the coverslip and the pallet, so that the coverslip and the FPD
Device is bonded completely.
2. packaging method as described in claim 1, which is characterized in that described to be arranged in the coverslip and the pallet both ends
Electric field simultaneously continues the first preset time period until removing the water oxygen in the glue, including:
Electric field is set in the coverslip and the pallet both ends, makes the acrylic acid anion in the glue along electric field negative direction
It moves and is completely attached to respectively with the coverslip surface and the tray surface and sharpened with reaching;
Electric field is closed after persistently setting the first preset time period of electric field is until remove the water oxygen in the glue.
3. packaging method as claimed in claim 2, which is characterized in that it is described persistently setting the first preset time period of electric field until
Electric field is closed after removing the water oxygen in the glue, including:
Persistently setting electric field closes electric field in 2 minutes after the water oxygen removed in the glue.
4. packaging method as described in claim 1, which is characterized in that the surface smear water in the flat-panel monitor
Glue, including:
Glue is uniformly smeared on the surface of the flat-panel monitor.
5. packaging method as described in claim 1, which is characterized in that described to carry out illumination to the coverslip and the pallet
Second preset time period, including:
UV lamp illumination is carried out 3 to 5 minutes to the coverslip and the pallet so that the glue hardens.
6. a kind of packaging system of flat-panel monitor, which is characterized in that the packaging system includes:
Fixed cell, for flat-panel monitor to be fixed on pallet;
Dispensing unit, for the surface smear glue in the flat-panel monitor;
Upper pressure unit, for coverslip to be arranged on the glue upper layer;
High voltage electrostatic generation unit, for electric field to be arranged in the coverslip and the pallet both ends and continues the first preset time
Duan Zhizhi removes the water oxygen in the glue;
Light illuminating unit, for carrying out the second preset time period of illumination to the coverslip and the pallet, so that the coverslip
It is bonded completely with the flat-panel monitor.
7. packaging system as claimed in claim 6, which is characterized in that the high voltage electrostatic generation unit the coverslip with
The pallet both ends are arranged electric field and continue the first preset time period until removing the water oxygen in the glue, specially:
Electric field is set in the coverslip and the pallet both ends, makes the acrylic acid anion in the glue along electric field negative direction
It moves and is completely attached to respectively with the coverslip surface and the tray surface and sharpened with reaching;
Electric field is closed after persistently setting the first preset time period of electric field is until remove the water oxygen in the glue.
8. packaging system as claimed in claim 7, which is characterized in that electric field is persistently arranged in the high voltage electrostatic generation unit
One preset time period closes electric field after removing the water oxygen in the glue, specially:
Persistently setting electric field closes electric field in 2 minutes after the water oxygen removed in the glue.
9. packaging system as claimed in claim 6, which is characterized in that the dispensing unit is on the surface of the flat-panel monitor
Glue is smeared, specially:
Glue is uniformly smeared on the surface of the flat-panel monitor.
10. packaging system as claimed in claim 6, which is characterized in that the light illuminating unit is to the coverslip and the support
Disk carries out the second preset time period of illumination, specially:
UV lamp illumination is carried out 3 to 5 minutes to the coverslip and the pallet so that the glue hardens.
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CN201710234571.5A CN108695447B (en) | 2017-04-11 | 2017-04-11 | Packaging device and method for flat panel display |
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CN201710234571.5A CN108695447B (en) | 2017-04-11 | 2017-04-11 | Packaging device and method for flat panel display |
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CN108695447A true CN108695447A (en) | 2018-10-23 |
CN108695447B CN108695447B (en) | 2020-06-19 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109745009A (en) * | 2019-01-31 | 2019-05-14 | 北京超维景生物科技有限公司 | Mini microscope probe, microscope detection device and laser scanning microscope |
CN113150701A (en) * | 2021-03-30 | 2021-07-23 | 歌尔股份有限公司 | Bonding process and display device |
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CN204486153U (en) * | 2015-03-25 | 2015-07-22 | 深圳市台冠触控科技有限公司 | A kind of glue laminating apparatus of capacitive touch screen |
CN105045436A (en) * | 2015-09-15 | 2015-11-11 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof, and display device |
CN105867669A (en) * | 2015-01-23 | 2016-08-17 | 冠捷投资有限公司 | Display apparatus with a dehumidification structure |
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CN1264115A (en) * | 1999-02-01 | 2000-08-23 | 欧利生电气株式会社 | Adhesive system and adhesive method |
JP2002080801A (en) * | 2000-09-06 | 2002-03-22 | Sony Disc Technology:Kk | Process and device for attaching round flat plate and process and device for preparing optical disc |
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CN108695447B (en) | 2020-06-19 |
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