TW201215249A - Film forming device - Google Patents
Film forming device Download PDFInfo
- Publication number
- TW201215249A TW201215249A TW100122194A TW100122194A TW201215249A TW 201215249 A TW201215249 A TW 201215249A TW 100122194 A TW100122194 A TW 100122194A TW 100122194 A TW100122194 A TW 100122194A TW 201215249 A TW201215249 A TW 201215249A
- Authority
- TW
- Taiwan
- Prior art keywords
- target
- magnetron
- electrode
- substrate
- sputtering
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010147918A JP5352537B2 (ja) | 2010-06-29 | 2010-06-29 | 成膜装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201215249A true TW201215249A (en) | 2012-04-01 |
Family
ID=45425764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100122194A TW201215249A (en) | 2010-06-29 | 2011-06-24 | Film forming device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5352537B2 (ko) |
KR (1) | KR101269738B1 (ko) |
CN (1) | CN102312207B (ko) |
TW (1) | TW201215249A (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6672595B2 (ja) * | 2015-03-17 | 2020-03-25 | 凸版印刷株式会社 | 成膜装置 |
JP2018147813A (ja) | 2017-03-08 | 2018-09-20 | 株式会社ジャパンディスプレイ | 表示装置の製造方法及び表示装置 |
JP6970624B2 (ja) * | 2018-02-13 | 2021-11-24 | 東京エレクトロン株式会社 | 成膜システム及び基板上に膜を形成する方法 |
JP7215305B2 (ja) * | 2019-04-04 | 2023-01-31 | 日本電産株式会社 | プラズマ処理装置用の治具、および、プラズマ処理システム |
CN111863284B (zh) * | 2020-06-24 | 2022-03-25 | 中国工程物理研究院激光聚变研究中心 | 深冷靶低温吸附抑制开启机构 |
CN113088918B (zh) * | 2021-04-19 | 2022-11-25 | 辽宁分子流科技有限公司 | 一种智能蒸发镀膜机 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05287519A (ja) * | 1992-04-10 | 1993-11-02 | Fujitsu Ltd | スパッタ装置 |
JPH06322534A (ja) * | 1993-05-07 | 1994-11-22 | Sharp Corp | 薄膜形成方法及び薄膜形成装置 |
JPH07310181A (ja) * | 1994-05-13 | 1995-11-28 | Hitachi Ltd | 直流マグネトロンスパッタ方法及び装置 |
JPH08165569A (ja) * | 1994-12-12 | 1996-06-25 | Chugai Ro Co Ltd | 反応性マグネトロンスパッタリング成膜装置 |
JP2000192239A (ja) * | 1998-12-22 | 2000-07-11 | Matsushita Electric Ind Co Ltd | スパッタリング方法およびスパッタリング装置 |
JP2003303681A (ja) * | 2002-04-09 | 2003-10-24 | Sharp Corp | 有機led素子およびその製造方法、有機led表示装置 |
JP4635570B2 (ja) * | 2004-11-08 | 2011-02-23 | 凸版印刷株式会社 | 有機エレクトロルミネッセンス素子の製造方法および製造装置 |
JP2007095338A (ja) * | 2005-09-27 | 2007-04-12 | Toppan Printing Co Ltd | 有機電界発光素子及びその製造方法 |
JP2008214687A (ja) | 2007-03-02 | 2008-09-18 | Toppan Printing Co Ltd | 成膜方法、スパッタリング装置、スパッタリングターゲットおよび有機電界発光装置の製造方法 |
JP5002532B2 (ja) * | 2008-05-27 | 2012-08-15 | 株式会社アルバック | スパッタリング方法及びスパッタリング装置 |
JP5287519B2 (ja) * | 2009-06-03 | 2013-09-11 | 株式会社ジェイテクト | 摺動式トリポード型等速ジョイント |
-
2010
- 2010-06-29 JP JP2010147918A patent/JP5352537B2/ja not_active Expired - Fee Related
-
2011
- 2011-06-24 TW TW100122194A patent/TW201215249A/zh unknown
- 2011-06-28 KR KR1020110062792A patent/KR101269738B1/ko not_active IP Right Cessation
- 2011-06-29 CN CN2011101777150A patent/CN102312207B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN102312207B (zh) | 2013-10-23 |
KR20120001654A (ko) | 2012-01-04 |
KR101269738B1 (ko) | 2013-05-30 |
JP5352537B2 (ja) | 2013-11-27 |
JP2012012633A (ja) | 2012-01-19 |
CN102312207A (zh) | 2012-01-11 |
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