201208394 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種麥克風，更具體而言，尤指一種具 備兩個印刷電路基板*並且在兩個印刷電路基板之間具備 隔開支撐部件，進而提高音頻特性且同時實現結構簡單化 的麥克風。 【先前技術】 通常，廣泛使用於移動通信終端機或音頻系統等的電 容式麥克風，由偏壓元件、形成與聲壓對應地發生變化的 電容c之一對膜片/背板、以及用於緩衝輸出信號的結型場 效應電晶體（JFET)構成。這種傳統方式的電容式麥克風是 透過以下方式構成的。在一個殼體内依序嵌入振動板、墊 片環、絕緣環、背板、通電環之後，最後放入安裝有電路 部件的印刷電路基板，然後將殼體的末端部分向印刷電路 基板側折彎，從而完成一個組裝體。 近年來，在麥克風上整合小型裝置的技術，係利用微 細加工的半導體加工技術。稱做微機電系統（MEMS : Micro Electro Mechanical System)的這種技術中，透過應用半導 體程序’特別是積體電路技術的微細加工技術，能夠製造 出以//m為單位的超小型感測器或致動器及電子機械構造 物。利用這樣的微細加工技術而製造的MEMS晶片麥克風 具有以下優點：透過超精密微細加工，將習知的振動板、 墊片環、絕緣環、背板、通電環等傳統的麥克風部件小型 201208394 化、高性能化、多功能化、整合化，進而能夠提高穩定性 及可靠性。 第1圖是概略性地表示利用微機電系統（MEMS)晶 片120之習知的矽電容式麥克風100的一示範例之剖面 圖。矽電容式麥克風100由以下部件構成：印刷電路基板 110、安裝在印刷電路基板no上的微機電系統晶片120、 特殊目的型半導體（ASIC)晶片的放大器130 ;以及形成 有聲孔140的殼體150。 該微機電系統晶片120為以下結構：利用微機電系統 技術，在矽片上形成背板121之後，隔著墊片122有振動 模123。在背板121上形成有聲孔124。 在第1圖所示的矽電容式麥克風100中，在殼體上部 具有聲孔140，在下部的單一印刷電路基板上安裝微機電系 統晶片120。雖然未以圖式表示，在印刷電路基板的下側面 具有用於與外部裝置進行電連接的連接端子。 在該情況下，外部的聲音引入到形成於殼體150上的 聲孔140中而使得振動模123振動，此時由元件符號126 表示微機電系統晶片的内部空間就是背腔空間。背腔空間 是指，以振動模為基準，引入外部音頻的一側的相反側的 空間。 即，以第1圖所示的麥克風100，在基板110上安裝微 機電系統晶片120的情況下，外部音頻透過聲孔140而引 入並傳達到微機電系統晶片的振動膜123,而此時在被傳達 外部音頻的振動膜的相反側所限定的空間126就是背腔空 201208394 間。 只有充分確保背腔空間才能確保麥克風的整體性能， 但在該情況下由於微機電系統晶片120的尺寸非常小，因 此難以確保充分大小的背腔空間。因此，存在麥克風音質 下降的問題。而且，該問題是由於在一個基板上安裝包括 微機電系統晶片的所有部件，在殼體上具備聲孔的結構而 引起的。 【發明内容】 本發明是鑒於上述問題而進行研發，本發明的目的在 於提供一種下述的麥克風：為了充分確保背腔空間而具備 兩個印刷電路基板’在該兩個印刷電路基板之間具備隔開 支撐部件，將微機電系統晶片安裝於靠近聲孔的印刷電路 基板上，從而能夠容易組裝且同時具備高標準的音頻特性。 本發明的麥克風包括：形成有外部聲孔的殼體；第一 印刷電路基板，與該殼體的内部結合，有與該外部聲孔連 通的内部聲孔；微機電系統晶片（MEMS Chip)，其安裝於 該第一印刷電路基板的内側面，且位於形成有該内部聲孔 的位置處；第二印刷電路基板，以與該第一印刷電路基板 隔開的方式與該殼體的内部結合，在其外側面上形成有多 個連接端子；多個導電性連接部件，將該第一印刷電路基 板和第二印刷電路基板電連接；以及隔開支撐部件，其設 置在該第一印刷電路基板與第二印刷電路基板之間，使第 一印刷電路基板和第二印刷電路基板在保持彼此間的間隔 201208394 的狀態下得到支撐。 另外，較佳地，該隔開支撐部件包括上下貫通的内部 空間及形成該内部空間的邊緣部。 另外，較佳地，該隔開支標部件具有收納部，該收納 部用於收納各該導電性連接部件。 另外，較佳地，該隔間支撐部件包括上下貫通的内部 空間及形成該内部空間的邊緣部，該收納部位於該邊緣部 的角落。 另外，較佳地，該導電性連接部件是線圈形狀的導電 性彈簧。 另外，較佳地，該導電性連接部件為柱狀。 另外，較佳地，該導電性連接部件具有彈性。 另外，較佳地，該導電性連接部件的外側面是由具有 導電性質的物質進行鍍膜而成的。 另外，較佳地，該殼體的一側面開放，該外部聲孔形 f於該殼體的另-側面，該第—印刷電路基板、隔開支撐 部件及第二印刷電路基板依序層疊於該殼體的内部，從該 另-側面朝向-側而延伸的側面之端部向内側方向折贊而 將層疊於其内部的該第一印刷電路基板、隔開支撐部件及 第二印刷電路基板固定於殼體的内部，該導電性連接部件 具有彈性，並在彈性變形的狀態下進行了結合。 根據本發明的麥克風，由於具備兩個印刷電路基板， 在該兩個印刷電路基板之間具備隔開支撐部件，因此能夠 容易組裝且同時具備高標準的音頻特性。 201208394 另外，能夠將兩個印刷電路基 :保的空間用作背腔空間，從而能夠改善麥 隔開支撐部 能夠容易實 另外’由於在兩個印刷電路基板之間具備 件，因此能夠容易調整背腔空間。 另外，在具備導電性連接部件的情況下， 現兩個印刷電路基板之間的電連接。 【實施方式】 以下’參照第2圖至第6圖，詳細說明根據本發明的 一實施例的麥克風。 本實施例的麥克風1作為將語音、音頻、聲音等聲波 轉換為電信號的裝置’包括：殼體1G、第-印刷電路基板 〇微機電系統晶片30、第二印刷電路基板40、導電性連 接°卩件50及隔開支撐部件60。麥克風1主要使用於便攜電 話、PDA、手機等個人用移動通信終端機。 ^ °亥设體10構成麥克風1的外部形狀。在其内部安裝進 >于操作時所需的各種部件。殼體10的一側面開放，在另一 側面11形成有外部聲孔12。外部聲孔12以貫通的方式形 成，藉此將外部的音頻引入到殼體内部。 在本實施例的情況下，殼體10是各面形成為直四角形 的六面體。但是’在其他實施例的情況下，殼體的整體形 狀可進行各種變形。即，殼體可以是圓筒形狀，也可以是 k平方向的剖面為橢圓形的柱狀。 201208394 殼體10具備從另—側面11向下方延伸而形成四個側 面14在各側面μ的下端部具有捲曲部16。如第3圖和 第5圖所示，在捲曲部16位於與側面相同的平面上的狀態 下，向殼體内部嵌入其他部件之後，將捲曲部16折疊（捲 曲）如第4圖和第6圖所示的形狀，從而固定内部部件。 ^在本實施例的情況下，透過捲曲殼體側面下端的捲曲 4 16而儿成内部部件的固定及組裝。因此，無需單獨地使 用黏接劑之類的固定手段將内部部件之間進行固定。 尤其是，在本實施例的情況下，由於導電性連接部件 50具有彈性’並且在彈性變形的狀態下進行結合，因此在 第一印刷電路基板2〇與第二印刷電路基板4〇之間 固的電連接及固定。 设體10由具有優異地雜訊切斷特性的鎳、銅、鋁等導 電材料或它們的合金構成。 該第一印刷電路基板20與殼體1〇的另一侧面u的内 侧結合。第一印刷電路基板20以第2圖及第4圖的方向為 基準，在其下側面安裝微機電系統晶片30及放大器7〇等 電子部件。由於在第一印刷電路基板2〇上安裝各種電子部 件，因此將該第一印刷電路基板2 〇又稱為印刷電路基板模 具（DIE)。 ' 另外，在其他實施例的情況下，可根據需求而將第一 印刷電路基板從殼體的另一側面隔開距離而固定。在該情 況下，可以在第一印刷電路基板與殼體的另一側面之間具 備用於保持間隔的單獨的結構，或者也可以在殼體的内壁 201208394 具備突出部。 在第一印刷電路基板20上以貫通的方式形成内部聲孔 22，該内部聲孔22與殼體10的外部聲孔12連通（連接而 通過的狀態）。 在本實施例的情況下，如第6圖所示，外部聲孔12與 内部聲孔22以彼此不接觸的方式構成。即，外部聲孔12 與内部聲孔22以彼此錯開的方式配置。因此，透過外部聲 孔12而引入的外部音頻，經過形成於殼體10與第一印刷 電路基板之間的音頻路徑24之後，透過内部聲孔22而傳 達至微機電系統晶片30。但是，在其他實施例的情況下， 外部聲孔12與内部聲孔22也可以以彼此接觸的方式構成。 參照第3圖，在本實施例的情況下，在第一印刷電路 基板20的外側面具有銅鍵層26。銅鑛層26的中間部分被 腐蝕而形成音頻路徑24。 另外，在其他實施例的情況下，根據使用者的需求， 可對音頻路徑的長度、方向、形狀或高度進行各種變形。 另外，關於形成音頻路徑的方式，除了本實施例的腐蝕銅 層而形成的方式以外，還可以利用切削、金屬鑄型、注塑 等方式。 另外，音頻路徑不限於本實施例這樣形成在第一印刷 電路基板上，只要能夠連通外部聲孔和内部聲孔，則可以 形成在殼體上，也可以在兩側分別形成之後彼此結合而構 成。 該微機電系統晶片30安裝在第一印刷電路基板的内側 201208394 面。在此，所謂内側面是指，朝向内部空間62的面。微機 電系統晶片30與内部聲孔22相對而配置。所謂相對配置 是指，微機電系統晶片30包括形成有内部聲孔22的部分 安裝在基板上，以使微機電系統晶片30能夠接收透過内部 聲孔22而引入的音頻信號。 微機電糸統晶片3 0產生將接收到的音頻號轉換為電 信號的作用。如背景技術中所述，微機電系統晶片30包括 振動膜、墊片、背板等構成。另外，在第一印刷電路基板 20的内側面安裝有微機電系統晶片30的同時，還安裝有放 大器70。 放大器70產生接收由微機電系統晶片30產生的電信 號而進行放大的作用。放大器70又被稱為特殊目的型半導 體（ASIC)晶片。另外，在其他實施例的情況下，可根據 需求而將放大器70安裝在第二印刷電路基板20上。 該第二印刷電路基板40與殼體10的開放的一側面結 合。透過與殼體10之開放的面結合，進而與殼體10共同 限定内部空間62。第二印刷電路基板40與第一印刷電路基 板20隔開距離而配置。 在第二印刷電路基板40的外側面上具有多個連接端子 42。在本實施例中，連接端子42共具有4個。連接端子又 被稱為接續端子或襯墊。該第二印刷電路基板40又稱為襯 墊印刷電路基板。連接端子42與内部的微機電系統晶片30 及放大器70電連接而產生與外部裝置進行連接的作用。連 接端子42的數量可以根據需求而進行增減，並且也可以根 ⑤ 201208394 據需求而變更配置位置。 另外，第一印刷電路基板和第二印刷電路基板既可以 由硬的一般材質製成，也可以由柔軟性材質製成。 並且，該導電性連接部件50的數量為複數個，該導電 性連接部件50產生將第一印刷電路基板20和第二印刷電 路基板40電連接的作用。 在本實施例中，導電性連接部件50以在每個角落設置 一個的方式共設置四個。各導電性連接部件50是將導電性 金屬線折彎成線圈形狀的彈簀。由於構成為彈簧，因此即 使組裝公差不夠精確，也能夠簡單且可靠地實現第一印刷 電路基板20與第二印刷電路基板40之間的電連接。 另外，在其他實施例的情況下，導電性連接部件在形 狀和材質等上除了將導電金屬線折彎而構成的彈簧形狀之 外，在將第一印刷電路基板和第二印刷電路基板電連接的 範圍内可進行各種變形。 即，導電性連接部件50在其材質上無需一定是金屬， 也可以是導電性矽，或者也可以由非導電性物質構成外部 形狀，且在其外侧面上通過鑛金等方法而構成鑛層。另外， 導電性連接部件在其形狀上可以是單純的圓柱形狀或銷狀 (插銷形狀），而不是彈簧。 在導電性連接部件形成為銷狀的情況下，第一印刷電 路基板和第二印刷電路基板分別具有能夠固定這種導電性 連接部件的兩端部的槽部，從而在沒有其他結構的協助的 情況下，也能夠將導電性連接部件直接固定到第一印刷電 11 201208394 路基板和苐二印刷電路基板。 另外，該隔開支撐部件60位於第一印刷電路基板2〇 與第二印刷電路基板4〇之間，該隔開支撐部件6〇以保持 彼此間的間隔方式支撐第一印刷電路基板2〇和第二印刷電 路基板40。 參照第3圖及第5圖可知，隔開支撐部件6〇形成為四 角形的框架形狀，與第一印刷電路基板2〇及第二印刷電路 基板4 0的形狀對應。隔開支撐部件6 〇的中間部分是空的， 藉此與第-印刷電路基板2〇及第二印刷電路基板仙共同 限定内部空間62。並且’圍繞内部空間62的部分是輪靡部 64。隔開支撐部件60具有與第一印刷電路基板2〇和第1 印刷電路基板40彼此隔開的距離對應的寬度。 隔開支樓部件60具有收納部66，該收納部％收納並 支撐多個導電性連接部件5G中的每—個。收納部％為側 面的一部分係開放的圓筒形狀，藉此彈簧形狀的導電性連 接部件5G在上下方向簡單地結合之後不會向水平方向脫 I納部6 6以在每個角落（或角部）設置一個 f式共配置四個。將彈簧形狀的導電性連接部件50夾入 =之後’將其收納部66與其他部件一起敌入殼體中 ^後^曲部16捲曲則可簡單地完成麥克風丨的組裝。 而形情況下’收納部可以不形成在角落 著外^ 分’例如可㈣成在巾_分，也可以: 者外周相形成在中間部分而不是形成在㈣，也可以 12 ⑤ 201208394 ^分形成在㈣’而剩下的-部分形成在中間部分。 為四實施财，關支撐料6G在整體上形成 2角形，而在其他實施例中可進行各種變形。即，在整 可形成為S]形、四角形以外的多角形，橢圓形等形狀。 北2夕卜，在本實施例中，内部空間62為背腔空間。即， 月腔表示續機3G的振_結構為基準，外部 音頻被傳達的-侧的相反侧的空間’因此在本實施例中， 在以與内部聲孔22相對的方式安裝微機電系統晶片30的 情況下’以微機電系統晶片3G所具有的振動模為基準時， 内部空間62位於外部音頻傳達的—侧的相反側，從 空間62為背腔空間。 σ| 因此，只要調整隔開支撐部件6〇的厚度和輪摩部64 的體積就能夠調整背腔的空間的大小和形狀。 以下將對具備该結構之本發明一實施例的麥克風^其 作用和效果進行說明。 〃 本實施例的麥克風1在彼此隔開距離而配置的第一印 刷電路基板20與第二印刷電路基板4〇之間具有隔開支樓 部件60 ’並且以與第一印刷電路基板2〇的内部聲孔u相 對的方式具備微機電系統晶片3〇，因此能夠將形成於第一 印刷電路基板20與第二印刷電路基板4〇之間的内部空間 用作背腔空間。因此，根據本發明能夠充分確保背腔空間， 其結果能夠改善麥克風的音頻特性。 另外，透過調整隔開支撐部件6〇的厚度及形狀，能夠 容易地調整背腔空間的大小及形狀。 13 201208394 另外，透過隔開支撐部件60，能夠將第一印刷電路基 板20與第二印刷電路基板4〇以彼此隔開距離的狀態穩定 地固定。另外，在隔開支撐部件⑼具備收納部％的情況 下，能夠簡單且牢固地組裝導電性連接部件5〇。 月/ 另外，由於使用於第1圖所示之習知的麥克風中 的微機電系統晶片120是在殼體上形成聲孔並安骏到美板 上的類型’因此需要在其内部具備背腔空間。這種微機電 系統晶片120與使用於在基板上形成聲孔且在該聲孔中安 裝微機電系統晶片的麥克風（未示於圖式）中的微機電系 統晶片的結構是不同的。即，根據麥克風聲孔之配置位置 的不同’所使用的微機電糸統晶片的結構也不同。 但是，在本實施例的情況下，利用兩個分離的基板， 且在該兩個基板之間具備隔開支撐部件，靠近形成於殼體 的外部聲孔而設置微機電系統晶片，因此能夠充分確保背 腔空間’從而能夠使用與在基板上形成聲孔類型的麥克風 中的微機電系統晶片相同結構的微機電系統晶片。 另外’在本實施例的情況下，形成於殼體10的外部聲 孔12與形成於第一印刷電路基板2〇的内部聲孔22彼此不 接觸而錯開地形成，並且外部聲孔12與内部聲孔22透過 音頻路徑24而連通，因此能夠將音頻路徑24多樣化。 另外’由於外部聲孔12與内部聲孔22彼此不接觸而 錯開地配置’因此能夠防止内部的微機電系統晶片或放大 器等電子部件直接暴露在外部的各種光，例以可視光線、 紫外線、紅外線等。 201208394 而上述優點可透過測試來得到確認。即，在50Hz的條 件下’對習知的麥克風10〇和本實施例的麥克風1的光敏 度進行了測試，其結果在習知的麥克風的情況下獲得了 -44.9dB的值’在本實施例的麥克風的情況下獲得了-63.6dB 的值。 另外’將印刷電路基板在物理上分為兩個基板而使 用’因此能夠分別使用單層結構的印刷電路基板，而不是 使用結合為多層結構的印刷電路基板。因此，印刷電路基 板的製造簡單，與習知情況相比，能夠節省費用。 另外，在本實施例的麥克風1中，以在第一印刷電路 基板與第二印刷電路基板之間具備隔開支撐部件為例進行 了說明，但本發明不限於此。即，也可以不具備隔開支撐 部件’而是僅利用導電性連接部件來將第一印刷電路基板 和第二印刷電路基板保持為彼此隔開距離的狀態。 另外’在本實施例的麥克風1中，以外部聲孔和内部 聲孔彼此不接觸的情況為例進行了說明，但是本發明不限 於此。即’也可以外部聲孔和内部聲孔彼此接觸的方式形 成’並且在這種結構的實施例中’能夠獲得除了因兩個聲 孔彼此不接觸而獲得的效果之外的其他所有的效果。 本發明在上文中已以較佳實施例揭露，然熟習本項技 術者應理解的是’該實施例僅用於描繪本發明，而不應解 讀為限制本發明之範圍。應注意的是，舉凡與該實施例等 效之變化與置換，均應設為涵蓋於本發明之範疇内。因此， 本發明之保護範圍當以申請專利範圍所界定者為準。 15 201208394 【圖式簡單說明】 第1圖係習知的麥克風之概略性剖面圖。 第2圖係根縣發明—實_之麥克風的立體圖 第3圖係第2圖之麥克風的分解立體圖。 第4圖係第2圖之麥克風的仰視立體圖。 第5圖係第2圖之麥克風的仰視分解圖。 $6 ®n 2圖之麥克風的概略性剖面圖。 【主要元件符號說明】 ⑤ 1 麥克風 10 殼體 11 威體的另一侧面 12 外部聲孔 14 侧面 16 捲曲部 20 弟一印刷電路基板 22 内部聲孔 24 音頻路徑 26 銅錢層 30 微機電系統晶片 40 第二印刷電路基板 42 連接端子 50 導電性連接部件 60 隔開支撐部件 201208394 62 内部空間 64 輪廓部 66 收納部 70 放大器 100 矽電容式麥克風 110 印刷電路基板 120 微機電糸統（MEMS )晶片 121 背板 122 墊片 123 振動膜 124 聲孔 126 背腔空間 130 特殊目的型半導體(ASIC)晶片 140 聲孔 150 殼體 17201208394 VI. Description of the Invention: [Technical Field] The present invention relates to a microphone, and more particularly to a device having two printed circuit boards* and having spaced support members between two printed circuit boards. Further, the microphone is improved in audio characteristics while simplifying the structure. [Prior Art] Generally, a condenser microphone widely used in a mobile communication terminal or an audio system or the like is formed by a biasing element, a capacitor c which changes in accordance with sound pressure, a diaphragm/backplane, and A junction field effect transistor (JFET) that buffers the output signal. This conventional mode of condenser microphone is constructed in the following manner. After inserting the vibrating plate, the spacer ring, the insulating ring, the back plate, and the energizing ring in a casing, the printed circuit board on which the circuit component is mounted is finally placed, and then the end portion of the casing is folded toward the side of the printed circuit board. Bend to complete an assembly. In recent years, the technology of integrating small devices on a microphone is a semiconductor processing technique using microfabrication. In this technology called MEMS (Micro Electro Mechanical System), ultra-small sensors in / / m can be fabricated by applying the semiconductor program 'especially the micro-machining technology of integrated circuit technology. Or actuators and electromechanical structures. The MEMS wafer microphone manufactured by such microfabrication technology has the following advantages: a conventional microphone component such as a vibrating plate, a spacer ring, an insulating ring, a back plate, and an energized ring is smallly made by ultra-precision micro-machining, 201208394, High performance, versatility, and integration to improve stability and reliability. Fig. 1 is a cross-sectional view schematically showing an exemplary example of a conventional condenser microphone 100 using a microelectromechanical system (MEMS) wafer 120. The tantalum condenser microphone 100 is composed of a printed circuit board 110, a microelectromechanical system wafer 120 mounted on the printed circuit board no, an amplifier 130 of a special purpose semiconductor (ASIC) wafer, and a housing 150 having the sound hole 140 formed therein. . The MEMS wafer 120 has a structure in which a vibration mode 123 is formed via a spacer 122 after forming the backing plate 121 on the cymbal by means of MEMS technology. A sound hole 124 is formed in the back plate 121. In the tantalum condenser microphone 100 shown in Fig. 1, a sound hole 140 is provided in the upper portion of the casing, and the microelectromechanical system chip 120 is mounted on the lower single printed circuit board. Although not shown in the drawings, a connection terminal for electrically connecting to an external device is provided on the lower side surface of the printed circuit board. In this case, an external sound is introduced into the sound hole 140 formed in the casing 150 to cause the vibration mode 123 to vibrate, and at this time, the internal space of the MEMS wafer by the component symbol 126 is the back cavity space. The back cavity space refers to a space on the opposite side to the side on which the external audio is introduced, based on the vibration mode. That is, in the case where the MEMS wafer 120 is mounted on the substrate 110 in the microphone 100 shown in FIG. 1, the external audio is introduced through the sound hole 140 and transmitted to the diaphragm 123 of the MEMS wafer. The space 126 defined by the opposite side of the diaphragm that is conveyed by the external audio is the back cavity 201208394. Only by sufficiently ensuring the back cavity space can the overall performance of the microphone be ensured, but in this case, since the size of the MEMS wafer 120 is very small, it is difficult to secure a sufficiently sized back cavity space. Therefore, there is a problem that the sound quality of the microphone is lowered. Moreover, this problem is caused by mounting all the components including the MEMS wafer on one substrate and having the structure of the sound holes on the casing. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a microphone including two printed circuit boards ′ between the two printed circuit boards in order to sufficiently secure a back cavity space. By detaching the support member, the MEMS wafer is mounted on a printed circuit board close to the sound hole, so that it can be easily assembled and has high standard audio characteristics. The microphone of the present invention comprises: a housing formed with an external acoustic hole; a first printed circuit substrate coupled to the interior of the housing, having an internal acoustic aperture in communication with the external acoustic aperture; a MEMS Chip, Mounted on the inner side surface of the first printed circuit board and located at a position where the inner sound hole is formed; the second printed circuit board is coupled to the inside of the case in a manner spaced apart from the first printed circuit board a plurality of connection terminals formed on the outer side surface thereof; a plurality of conductive connection members electrically connecting the first printed circuit board and the second printed circuit board; and a support member disposed on the first printed circuit Between the substrate and the second printed circuit board, the first printed circuit board and the second printed circuit board are supported while maintaining the interval 201208394 therebetween. Further, preferably, the partition supporting member includes an inner space penetrating up and down and an edge portion forming the inner space. Further, preferably, the spacer member has a housing portion for housing each of the conductive connecting members. Further, preferably, the compartment supporting member includes an inner space penetrating vertically, and an edge portion forming the inner space, the receiving portion being located at a corner of the edge portion. Further, preferably, the conductive connecting member is a coil-shaped conductive spring. Further, preferably, the conductive connecting member has a columnar shape. Further, preferably, the conductive connecting member has elasticity. Further, preferably, the outer side surface of the conductive connecting member is formed by coating a substance having a conductive property. In addition, preferably, one side of the casing is open, and the outer acoustic hole shape f is on the other side of the casing, and the first printed circuit board, the partition supporting member and the second printed circuit board are sequentially stacked on the other side. The inside of the casing, the end portion of the side surface extending from the other side surface toward the side is folded inward, and the first printed circuit board, the partition supporting member, and the second printed circuit board are laminated inside Fixed to the inside of the casing, the conductive connecting member has elasticity and is bonded in an elastically deformed state. According to the microphone of the present invention, since the two printed circuit boards are provided and the supporting members are provided between the two printed circuit boards, it is easy to assemble and has high-standard audio characteristics. 201208394 In addition, two printed circuit bases can be used as the back cavity space, so that the wheat partition support portion can be easily improved. Since the components are provided between the two printed circuit boards, the back can be easily adjusted. Cavity space. Further, in the case where the conductive connecting member is provided, electrical connection between the two printed circuit boards is now performed. [Embodiment] Hereinafter, a microphone according to an embodiment of the present invention will be described in detail with reference to Figs. 2 to 6 . The microphone 1 of the present embodiment as a device for converting sound waves such as voice, audio, sound, etc. into electrical signals includes: a casing 1G, a first printed circuit board, a microelectromechanical system wafer 30, a second printed circuit board 40, and a conductive connection The member 50 is spaced apart from the support member 60. The microphone 1 is mainly used for personal mobile communication terminals such as portable telephones, PDAs, and mobile phones. ^ ° The housing 10 constitutes the outer shape of the microphone 1. Installed inside it > various components required for operation. One side of the casing 10 is open, and an outer sound hole 12 is formed on the other side 11. The outer sound hole 12 is formed in a penetrating manner, thereby introducing external audio into the inside of the casing. In the case of this embodiment, the casing 10 is a hexahedron in which each surface is formed into a straight square shape. However, in the case of other embodiments, the overall shape of the housing can be variously modified. That is, the casing may have a cylindrical shape or a columnar shape in which the cross section in the k-direction is elliptical. 201208394 The casing 10 is provided with four side faces 14 extending downward from the other side surface 11 to have curled portions 16 at the lower end portions of the respective side faces μ. As shown in FIGS. 3 and 5, after the curled portion 16 is placed on the same plane as the side surface, after the other members are fitted into the inside of the casing, the curled portion 16 is folded (curled) as shown in Figs. 4 and 6. The shape shown in the figure, thereby fixing the internal parts. In the case of the present embodiment, the inner member is fixed and assembled by crimping the lower end of the side of the casing. Therefore, it is not necessary to separately fix the internal members by fixing means such as an adhesive. In particular, in the case of the present embodiment, since the conductive connecting member 50 has elasticity 'and is bonded in an elastically deformed state, it is fixed between the first printed circuit board 2'' and the second printed circuit board 4'' Electrical connection and fixing. The body 10 is made of a conductive material such as nickel, copper or aluminum having excellent noise-cutting characteristics or an alloy thereof. The first printed circuit board 20 is coupled to the inner side of the other side surface u of the casing 1A. The first printed circuit board 20 is mounted with electronic components such as the microelectromechanical system chip 30 and the amplifier 7A on the lower side thereof with reference to the directions of Figs. 2 and 4 . Since the various electronic components are mounted on the first printed circuit board 2, the first printed circuit board 2 is also referred to as a printed circuit board mold (DIE). Further, in the case of other embodiments, the first printed circuit board can be fixed from the other side of the casing by a distance as needed. In this case, a separate structure for maintaining the space may be provided between the first printed circuit board and the other side of the casing, or a protrusion may be provided on the inner wall 201208394 of the casing. An internal acoustic hole 22 is formed in a penetrating manner on the first printed circuit board 20, and the internal acoustic hole 22 communicates with the external acoustic hole 12 of the casing 10 (a state in which it is connected and passed). In the case of this embodiment, as shown in Fig. 6, the outer sound hole 12 and the inner sound hole 22 are formed so as not to be in contact with each other. That is, the outer sound hole 12 and the inner sound hole 22 are arranged to be shifted from each other. Therefore, the external audio introduced through the external sound hole 12 passes through the internal acoustic hole 22 through the audio path 24 formed between the casing 10 and the first printed circuit board, and is transmitted to the MEMS wafer 30. However, in the case of other embodiments, the outer acoustic hole 12 and the inner acoustic hole 22 may also be configured to be in contact with each other. Referring to Fig. 3, in the case of this embodiment, a copper key layer 26 is provided on the outer surface of the first printed circuit board 20. The middle portion of the copper ore layer 26 is etched to form an audio path 24. Additionally, in the case of other embodiments, various variations in the length, direction, shape or height of the audio path may be made depending on the needs of the user. Further, as for the manner of forming the audio path, in addition to the method of etching the copper layer of the present embodiment, it is also possible to use cutting, metal casting, injection molding or the like. In addition, the audio path is not limited to being formed on the first printed circuit board as in this embodiment, and may be formed on the casing as long as it can communicate with the external sound hole and the internal sound hole, or may be combined with each other after being formed on both sides. . The MEMS wafer 30 is mounted on the inside of the first printed circuit board 201208394. Here, the inner side surface means a surface that faces the inner space 62. The microcomputer system chip 30 is disposed opposite to the internal sound hole 22. The so-called relative arrangement means that the MEMS wafer 30 includes a portion in which the internal acoustic holes 22 are formed to be mounted on the substrate to enable the MEMS wafer 30 to receive the audio signal introduced through the internal acoustic holes 22. The MEMS wafer 30 generates the function of converting the received audio number into an electrical signal. As described in the background, the MEMS wafer 30 includes a diaphragm, a spacer, a back sheet, and the like. Further, the MEMS wafer 30 is mounted on the inner side surface of the first printed circuit board 20, and an amplifier 70 is also mounted. Amplifier 70 produces the function of receiving the electrical signals generated by MEMS wafer 30 for amplification. Amplifier 70 is also known as a special purpose semiconductor (ASIC) wafer. Further, in the case of other embodiments, the amplifier 70 can be mounted on the second printed circuit board 20 as needed. The second printed circuit board 40 is joined to an open side of the casing 10. The inner space 62 is defined together with the housing 10 by being coupled to the open face of the housing 10. The second printed circuit board 40 is disposed at a distance from the first printed circuit board 20. A plurality of connection terminals 42 are provided on the outer surface of the second printed circuit board 40. In the present embodiment, the connection terminals 42 have a total of four. The connection terminals are also referred to as connection terminals or pads. The second printed circuit board 40 is also referred to as a pad printed circuit board. The connection terminal 42 is electrically connected to the internal MEMS wafer 30 and the amplifier 70 to cause connection with an external device. The number of connection terminals 42 can be increased or decreased according to requirements, and the configuration position can also be changed according to the requirements of 201208394. Further, the first printed circuit board and the second printed circuit board may be made of a hard general material or a soft material. Further, the number of the conductive connecting members 50 is plural, and the conductive connecting member 50 functions to electrically connect the first printed circuit board 20 and the second printed circuit board 40. In the present embodiment, the conductive connecting members 50 are provided in a total of four in such a manner that one is provided at each corner. Each of the conductive connecting members 50 is a magazine that bends a conductive metal wire into a coil shape. Since it is configured as a spring, electrical connection between the first printed circuit board 20 and the second printed circuit board 40 can be realized simply and reliably even if the assembly tolerance is not accurate enough. Further, in the case of the other embodiment, the conductive connecting member electrically connects the first printed circuit board and the second printed circuit board in addition to the spring shape formed by bending the conductive metal wire in shape, material, or the like. Various modifications are possible within the scope of the invention. In other words, the conductive connecting member 50 does not need to be a metal in its material, and may be electrically conductive or may be formed of a non-conductive material, and may be formed of a mineral layer by a method such as gold ore. . Further, the conductive connecting member may have a simple cylindrical shape or a pin shape (a pin shape) instead of a spring. In the case where the conductive connecting member is formed in a pin shape, the first printed circuit board and the second printed circuit board each have a groove portion capable of fixing both end portions of such a conductive connecting member, thereby being assisted by other structures. In this case, the conductive connecting member can be directly fixed to the first printed circuit 11 201208394 road substrate and the second printed circuit board. Further, the partition supporting member 60 is located between the first printed circuit board 2'' and the second printed circuit board 4'', and the spaced apart supporting members 6'' support the first printed circuit board 2'' while maintaining a space therebetween The second printed circuit board 40. Referring to Figs. 3 and 5, the partition supporting member 6'' is formed in a quadrangular frame shape, and corresponds to the shapes of the first printed circuit board 2'' and the second printed circuit board 40. The intermediate portion separating the support members 6 is empty, thereby defining the internal space 62 together with the first printed circuit board 2 and the second printed circuit board. And the portion surrounding the inner space 62 is the rim portion 64. The partition supporting member 60 has a width corresponding to a distance separating the first printed circuit board 2A and the first printed circuit board 40 from each other. The partition member 60 has a accommodating portion 66 that accommodates and supports each of the plurality of conductive connecting members 5G. The accommodating portion % is a cylindrical shape in which a part of the side surface is open, and the spring-shaped conductive connecting member 5G is simply joined in the vertical direction, and then does not detach the portion 6 6 in the horizontal direction at each corner (or corner) Department) Set a f-type total configuration of four. After the spring-shaped conductive connecting member 50 is sandwiched by =, the accommodating portion 66 is encased in the casing together with other members. After the curved portion 16 is curled, the assembly of the microphone cymbal can be easily performed. In the case of the shape, the accommodating portion may not be formed at the corner and may be formed into a towel. For example, the outer peripheral phase may be formed in the middle portion instead of being formed at (four), or may be formed at 12 5 201208394 ^. The (four) 'and the remaining' part is formed in the middle part. For the fourth implementation, the support material 6G forms a square shape as a whole, and various other modifications are possible in other embodiments. Namely, it may be formed into a polygonal shape such as an S] shape or a square shape, an elliptical shape or the like. In the north, in the present embodiment, the internal space 62 is a back cavity space. That is, the moon cavity indicates that the vibration_structure of the extension 3G is the reference, and the external audio is transmitted to the space on the opposite side of the side. Therefore, in the present embodiment, the MEMS wafer is mounted in a manner opposite to the inner sound hole 22. In the case of 30, when the vibration mode of the MEMS wafer 3G is used as a reference, the internal space 62 is located on the opposite side of the side from which the external audio is transmitted, and the space 62 is the back cavity space. σ| Therefore, the size and shape of the space of the back cavity can be adjusted by adjusting the thickness of the support member 6A and the volume of the wheel portion 64. The operation and effect of the microphone according to an embodiment of the present invention having this configuration will be described below. The microphone 1 of the present embodiment has a partition member 60' between the first printed circuit board 20 and the second printed circuit board 4A disposed at a distance from each other and with the inside of the first printed circuit board 2 Since the sound hole u is provided in a manner to face the MEMS wafer 3, the internal space formed between the first printed circuit board 20 and the second printed circuit board 4 can be used as the back cavity space. Therefore, according to the present invention, the back cavity space can be sufficiently ensured, with the result that the audio characteristics of the microphone can be improved. Further, by adjusting the thickness and shape of the support member 6A, the size and shape of the back cavity space can be easily adjusted. 13 201208394 In addition, by separating the support member 60, the first printed circuit board 20 and the second printed circuit board 4 can be stably fixed in a state of being spaced apart from each other. Further, when the partition supporting member (9) is provided with the accommodating portion%, the conductive connecting member 5A can be easily and firmly assembled. Month / In addition, since the MEMS wafer 120 used in the conventional microphone shown in Fig. 1 is of the type that forms a sound hole on the casing and is safely mounted on the US board, it is necessary to have a back cavity inside thereof. space. This MEMS wafer 120 differs from the structure of a microelectromechanical system wafer used in a microphone (not shown) for forming an acoustic hole in a substrate and mounting a MEMS wafer in the acoustic hole. That is, the structure of the microelectromechanical system wafer used differs depending on the arrangement position of the microphone sound holes. However, in the case of the present embodiment, two separate substrates are used, and a support member is provided between the two substrates, and a microelectromechanical system wafer is provided close to the external sound hole formed in the case, so that it is sufficient The back cavity space is ensured to enable the use of a microelectromechanical system wafer of the same structure as the microelectromechanical system wafer in the microphone of the sound hole type formed on the substrate. Further, in the case of the present embodiment, the outer sound hole 12 formed in the casing 10 and the inner sound hole 22 formed in the first printed circuit board 2 are not formed in contact with each other and are staggered, and the outer sound hole 12 and the inside are formed. The sound holes 22 communicate through the audio path 24, so the audio path 24 can be diversified. In addition, 'the external sound hole 12 and the inner sound hole 22 are arranged in a staggered manner without being in contact with each other'. Therefore, it is possible to prevent various light such as an internal MEMS film or an amplifier from being directly exposed to the outside, such as visible light, ultraviolet light, or infrared light. Wait. 201208394 and the above advantages can be confirmed by testing. That is, the sensitivity of the conventional microphone 10A and the microphone 1 of the present embodiment was tested under the condition of 50 Hz, and as a result, a value of -44.9 dB was obtained in the case of a conventional microphone' in this embodiment. In the case of the microphone of the example, a value of -63.6 dB is obtained. Further, the printed circuit board is physically divided into two substrates. Therefore, it is possible to use a single-layer printed circuit board instead of a printed circuit board combined in a multilayer structure. Therefore, the manufacture of the printed circuit board is simple, and the cost can be saved as compared with the conventional case. Further, in the microphone 1 of the present embodiment, the case where the support member is provided between the first printed circuit board and the second printed circuit board has been described as an example, but the present invention is not limited thereto. In other words, the first printed circuit board and the second printed circuit board may be held apart from each other by the conductive connecting member without providing the supporting member. Further, in the microphone 1 of the present embodiment, the case where the external sound hole and the internal sound hole are not in contact with each other has been described as an example, but the present invention is not limited thereto. That is, it is also possible to form the outer sound hole and the inner sound hole in contact with each other and in the embodiment of such a structure, it is possible to obtain all the effects other than the effect obtained by the two sound holes not contacting each other. The invention has been described above in terms of preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations that are equivalent to the embodiments are intended to be within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application. 15 201208394 [Simple description of the drawings] Fig. 1 is a schematic cross-sectional view of a conventional microphone. Fig. 2 is a perspective view of a microphone of the invention of the present invention. Fig. 3 is an exploded perspective view of the microphone of Fig. 2. Figure 4 is a bottom perspective view of the microphone of Figure 2. Figure 5 is a bottom exploded view of the microphone of Figure 2. A schematic cross-sectional view of the microphone of the $6 ® n 2 diagram. [Main component symbol description] 5 1 Microphone 10 Housing 11 The other side of the power module 12 External sound hole 14 Side 16 Curl 20 Brother 1 Printed circuit board 22 Internal sound hole 24 Audio path 26 Copper layer 30 MEMS wafer 40 Second printed circuit board 42 connection terminal 50 conductive connection member 60 separation support member 201208394 62 internal space 64 contour portion 66 housing portion 70 amplifier 100 tantalum condenser microphone 110 printed circuit substrate 120 microelectromechanical system (MEMS) wafer 121 back Plate 122 Shim 123 Vibration film 124 Sound hole 126 Back cavity space 130 Special purpose semiconductor (ASIC) wafer 140 Sound hole 150 Housing 17