TWI527469B - Microphone - Google Patents
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- TWI527469B TWI527469B TW100117761A TW100117761A TWI527469B TW I527469 B TWI527469 B TW I527469B TW 100117761 A TW100117761 A TW 100117761A TW 100117761 A TW100117761 A TW 100117761A TW I527469 B TWI527469 B TW I527469B
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- printed circuit
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- 239000000758 substrate Substances 0.000 claims description 14
- 238000005192 partition Methods 0.000 claims description 9
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- 238000005516 engineering process Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
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- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
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- 238000005520 cutting process Methods 0.000 description 2
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- 230000005236 sound signal Effects 0.000 description 2
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- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
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- 239000003990 capacitor Substances 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Micromachines (AREA)
Description
本發明係關於一種麥克風，更具體而言，尤指一種關於以下結構的麥克風組裝體：透過充分確保背腔空間(back chamber volume)而能夠提高音頻特性。The present invention relates to a microphone, and more particularly to a microphone assembly for a structure in which audio characteristics can be improved by sufficiently ensuring a back chamber volume.
通常，廣泛使用於移動通信終端機或音頻系統等的電容式麥克風，由偏壓元件、形成與聲壓對應地發生變化的電容C之一對膜片/背板、以及用於緩衝輸出信號的結型場效應電晶體(JFET)構成。這種傳統方式的電容式麥克風是透過以下方式構成的。在一個殼體內依序嵌入振動板、墊片環、絕緣環、背板、通電環之後，最後放入安裝有電路部件的印刷電路基板，然後將殼體的末端部分向印刷電路基板側折彎，進而完成一個組裝體。Generally, a condenser microphone widely used in a mobile communication terminal or an audio system or the like, a biasing element, a capacitor C which forms a change corresponding to a sound pressure, a diaphragm/backplane, and a buffer for outputting signals A junction field effect transistor (JFET) is constructed. This conventional mode of condenser microphone is constructed in the following manner. After the vibrating plate, the spacer ring, the insulating ring, the back plate, and the energizing ring are sequentially embedded in one casing, the printed circuit board on which the circuit component is mounted is finally placed, and then the end portion of the casing is bent toward the side of the printed circuit board. , and then complete an assembly.
近年來，在麥克風上整合小型裝置的技術，係利用微細加工的半導體加工技術。稱做微機電系統(MEMS：Micro Electro Mechanical System)的這種技術中，透過應用半導體工序，特別是積體電路技術的微細加工技術，能夠製造出以μm為單位的超小型感測器或致動器及電子機械構造物。利用這樣的微細加工技術而製造的MEMS晶片麥克風具有以下優點：透過超精密微細加工，將以往的振動板、墊片環、絕緣環、背板、通電環等傳統的麥克風部件小型化、高性能化、多功能化、整合化，進而能夠提高穩定性及可靠性。In recent years, the technology of integrating small devices on a microphone is a semiconductor processing technology that utilizes microfabrication. In this technology called Micro Electro Mechanical System (MEMS), ultra-small sensors in μm can be fabricated by applying semiconductor processes, especially microfabrication technology of integrated circuit technology. Actuators and electromechanical structures. The MEMS wafer microphone manufactured by such microfabrication technology has the advantages of miniaturizing and high-performance conventional microphone components such as a vibrating plate, a spacer ring, an insulating ring, a back plate, and an energized ring by ultra-precision micro-machining. It is multi-functional, integrated, and can improve stability and reliability.
第1圖是概略性地表示利用微機電系統(MEMS)晶片120之習知的矽電容式麥克風100的一示範例之剖面圖。矽電容式麥克風100由以下部件構成：印刷電路基板110、安裝在印刷電路基板110上的微機電系統晶片120、特殊目的型半導體(ASIC)晶片130；以及形成有聲孔140的殼體150。FIG. 1 is a cross-sectional view schematically showing an exemplary example of a conventional capacitive microphone 100 using a microelectromechanical system (MEMS) wafer 120. The tantalum condenser microphone 100 is composed of a printed circuit board 110, a microelectromechanical system wafer 120 mounted on the printed circuit board 110, a special purpose semiconductor (ASIC) wafer 130, and a case 150 in which the sound hole 140 is formed.
該微機電系統晶片120為以下結構：利用微機電系統技術，在矽片上形成背板121之後，隔著墊片122形成有振動模123。在背板121上形成有聲孔124。The MEMS wafer 120 has a structure in which a vibration mode 123 is formed via a spacer 122 after forming the backing plate 121 on the cymbal by means of MEMS technology. A sound hole 124 is formed in the back plate 121.
在第1圖所示的矽電容式麥克風100中，在殼體上部具有聲孔140，在下部的單一印刷電路基板上安裝微機電系統晶片120。雖然未以圖式表示，在印刷電路基板的下側面具有用於與外部裝置進行電連接的連接端子。In the tantalum condenser microphone 100 shown in Fig. 1, a sound hole 140 is provided in the upper portion of the casing, and the MEMS wafer 120 is mounted on the lower single printed circuit board. Although not shown in the drawings, a connection terminal for electrically connecting to an external device is provided on the lower side surface of the printed circuit board.
在該情況下，外部的聲音引入到形成於殼體150上的聲孔140中而使得振動模123振動，此時由元件符號126表示微機電系統晶片的內部空間就是背腔空間。背腔空間是指，以振動模為基準，引入外部音頻的一側的相反側的空間。In this case, an external sound is introduced into the sound hole 140 formed in the casing 150 to cause the vibration mode 123 to vibrate, and at this time, the internal space of the MEMS wafer by the component symbol 126 is the back cavity space. The back cavity space refers to a space on the opposite side to the side on which the external audio is introduced, based on the vibration mode.
即，以第1圖所示的麥克風100，在基板上安裝微機電系統晶片的情況下，外部音頻透過聲孔140而引入並傳達到微機電系統晶片的振動膜123，而此時在被傳達外部音頻的振動膜的相反側所限定的空間126就是背腔空間。That is, in the case where the MEMS system wafer is mounted on the substrate in the microphone 100 shown in Fig. 1, the external audio is introduced through the sound hole 140 and transmitted to the diaphragm 123 of the MEMS wafer, and is transmitted at this time. The space 126 defined by the opposite side of the diaphragm of the external audio is the back cavity space.
只有充分確保背腔空間才能確保麥克風的整體性能，但在該情況下由於微機電系統晶片120的尺寸非常小，因此在微機電系統晶片內部形成背腔空間的情況下，難以確保充分大小的背腔空間。因此，存在麥克風音質下降的問題。It is only sufficient to ensure the back cavity space to ensure the overall performance of the microphone, but in this case, since the size of the MEMS wafer 120 is very small, it is difficult to ensure a sufficient size back in the case of forming a back cavity space inside the MEMS wafer. Cavity space. Therefore, there is a problem that the sound quality of the microphone is lowered.
本發明是鑒於上述問題而進行研發，本發明的目的在於提供一種能夠充分確保背腔空間的麥克風。The present invention has been made in view of the above problems, and an object of the present invention is to provide a microphone capable of sufficiently securing a back cavity space.
本發明麥克風的特徵包括：殼體，其一側面為開放，在另一側面形成有外部聲孔；第一印刷電路基板，其與該殼體的另一側面結合，並形成有與該外部聲孔連通的內部聲孔；微機電系統晶片，其與該內部聲孔以相對的方式安裝於該第一印刷電路基板的內側面；第二印刷電路基板，其與該殼體之開放的一側面結合，與該第一印刷電路基板隔開配置，並且在該第二印刷電路基板的外側面形成有多個連接端子；以及將該第一印刷電路基板和第二印刷電路基板電連接的多個導電性連接部件。The microphone of the present invention includes: a housing having one side open and an outer sound hole formed on the other side; a first printed circuit board coupled to the other side of the housing and formed with the external sound An internal acoustic hole communicating with the hole; a MEMS wafer mounted to the inner side of the first printed circuit substrate in an opposite manner to the internal acoustic hole; and a second printed circuit substrate having an open side of the housing Bonding, spaced apart from the first printed circuit board, and having a plurality of connection terminals formed on an outer side surface of the second printed circuit board; and a plurality of electrically connecting the first printed circuit board and the second printed circuit board Conductive connecting parts.
另外，較佳地，該導電性連接部件為線圈形狀的導電性彈簧，或者為柱狀，又或者具有彈性。Further, preferably, the conductive connecting member is a coil-shaped conductive spring, or has a columnar shape or has elasticity.
另外，較佳地，在該第一印刷電路基板與第二印刷電路基板之間具有隔開支撐部件，以使第一印刷電路基板與第二印刷電路基板在保持彼此間的間隔的狀態下得到支撐。Further, preferably, a support member is provided between the first printed circuit board and the second printed circuit board so that the first printed circuit board and the second printed circuit board are maintained in a state of being spaced apart from each other. support.
另外，較佳地，該隔開支撐部件係與該第一印刷電路基板及第二印刷電路基板的形狀對應的尺寸，並具有與該第一印刷電路基板和該第二印刷電路基板彼此隔開的距離對應的厚度，且在其中間具有空的內部空間。In addition, preferably, the spaced apart support members are sized corresponding to the shapes of the first printed circuit substrate and the second printed circuit substrate, and are spaced apart from the first printed circuit substrate and the second printed circuit substrate The distance corresponds to the thickness and has an empty interior space in between.
另外，較佳地，在該隔開支撐部件上具有收納部，該收納部用於收納並支撐各該導電性連接部件。Further, preferably, the partition supporting member has a housing portion for accommodating and supporting each of the conductive connecting members.
另外，較佳地，該殼體的外部聲孔和該第一印刷電路基板的內部聲孔以彼此不接觸的方式配置，該外部聲孔和該內部聲孔透過形成於殼體與第一印刷電路基板之間的音頻路徑而連通。In addition, preferably, the outer sound hole of the casing and the inner sound hole of the first printed circuit board are disposed not in contact with each other, and the outer sound hole and the inner sound hole are formed through the casing and the first printing. The audio path between the circuit boards is connected.
另外，較佳地，在該第一印刷電路基板的外側面上具有鍍層，該音頻路徑包括該第一印刷電路基板的外側面的鍍層被腐蝕而形成的路徑。Further, preferably, a plating layer is provided on an outer surface of the first printed circuit board, and the audio path includes a path formed by etching of a plating layer on an outer surface of the first printed circuit board.
根據本發明的麥克風，能夠充分確保背腔空間而改善麥克風的音頻特性。According to the microphone of the present invention, the back cavity space can be sufficiently ensured to improve the audio characteristics of the microphone.
另外，本發明能夠根據需求而調整背腔空間的大小。In addition, the present invention can adjust the size of the back cavity space as needed.
另外，在具備隔開支撐部件的情況下，組裝方便，並且容易進行背腔空間的調整。In addition, in the case where the support member is provided, the assembly is convenient, and the adjustment of the back cavity space is easy.
另外，在將外部聲孔和內部聲孔以彼此不接觸的方式配置，並透過音頻路徑使得外部音引入到內部空間的情況下，能夠防止包括微機電系統晶片在內的內部部件直接暴露在光下。In addition, in the case where the external sound hole and the internal sound hole are disposed in such a manner that they are not in contact with each other and the external sound is introduced into the internal space through the audio path, internal components including the MEMS wafer can be prevented from being directly exposed to the light. under.
以下，參照第2圖至第6圖，詳細說明根據本發明一實施例的麥克風。本實施例的麥克風1作為將語音、音頻、聲音等聲波轉換為電信號的裝置，包括：殼體10、第一印刷電路基板20、微機電系統晶片30、第二印刷電路基板40、導電性連接部件50及隔開支撐部件60。特別是，本發明的麥克風1主要使用於便攜電話、PDA、3G手機等個人用移動通信終端機。Hereinafter, a microphone according to an embodiment of the present invention will be described in detail with reference to FIGS. 2 to 6. The microphone 1 of the present embodiment is used as a device for converting sound waves such as voice, audio, sound, and the like into an electrical signal, and includes: a casing 10, a first printed circuit board 20, a microelectromechanical system chip 30, a second printed circuit board 40, and conductivity. The connecting member 50 and the supporting member 60 are separated. In particular, the microphone 1 of the present invention is mainly used in personal mobile communication terminals such as mobile phones, PDAs, and 3G mobile phones.
該殼體10構成麥克風的外形。在其內部安裝各種部件。殼體10的一側面為開放，在另一側面11形成有外部聲孔12。外部聲孔12以貫通的方式形成，藉此將外部的音頻引入到殼體內部。The housing 10 constitutes the outer shape of the microphone. Install various components inside. One side of the casing 10 is open, and an outer sound hole 12 is formed on the other side 11. The external sound hole 12 is formed in a penetrating manner, thereby introducing external audio into the inside of the casing.
在本實施例的情況下，殼體10是各面形成為直四角形的六面體。但是，在其他實施例的情況下，殼體的整體形狀可進行各種變形。即，殼體可以是圓筒形狀，也可以是水平方向的剖面為橢圓形的柱狀。In the case of the present embodiment, the casing 10 is a hexahedron in which each surface is formed into a straight square shape. However, in the case of other embodiments, the overall shape of the housing can be variously modified. That is, the casing may have a cylindrical shape or a columnar shape having an elliptical cross section in the horizontal direction.
殼體10具備從另一側面11向下方延伸而形成4個側面14。在各側面14的下端部具有捲曲部16。在第3圖和第5圖所示的狀態下，將圖式的其他部件嵌入殼體內部之後，捲曲部16捲曲如第4圖和第6圖所示的形狀，進而固定內部部件。The casing 10 is provided to extend downward from the other side surface 11 to form four side faces 14 . A curl portion 16 is provided at a lower end portion of each side surface 14. In the state shown in Figs. 3 and 5, after the other members of the drawings are fitted into the inside of the casing, the curled portion 16 is curled as shown in Figs. 4 and 6, thereby fixing the internal members.
在本實施例的情況下，透過捲曲殼體側面下端的捲曲部16而完成內部部件的固定及組裝。因此，無需單獨地使用粘接劑之類的固定手段將內部部件之間進行固定。In the case of the present embodiment, the fixing and assembly of the inner member are completed by crimping the curled portion 16 at the lower end of the side surface of the casing. Therefore, it is not necessary to separately fix the internal members by using a fixing means such as an adhesive.
殼體10由具有優異地噪音切斷特性的鎳、銅、鋁等導電材料或它們的合金構成。The casing 10 is composed of a conductive material such as nickel, copper or aluminum having excellent noise-cutting characteristics or an alloy thereof.
該第一印刷電路基板20與殼體10的另一側面11的內側結合。第一印刷電路基板20以第2圖及第4圖的方向為基準，在其下側面安裝微機電系統晶片30及放大器70等電子部件。由於在第一印刷電路基板20上安裝各種電子部件，因此將該第一印刷電路基板20又稱為印刷電路基板模具(DIE)。The first printed circuit board 20 is coupled to the inner side of the other side surface 11 of the casing 10. The first printed circuit board 20 is mounted with electronic components such as the MEMS wafer 30 and the amplifier 70 on the lower side thereof with reference to the directions of FIGS. 2 and 4. Since the various electronic components are mounted on the first printed circuit board 20, the first printed circuit board 20 is also referred to as a printed circuit board mold (DIE).
在第一印刷電路基板20上以貫通的方式形成內部聲孔22，該內部聲孔22與殼體10的外部聲孔12連通(連接而通過的狀態)。The inner acoustic hole 22 is formed in a penetrating manner on the first printed circuit board 20, and the inner acoustic hole 22 communicates with the external acoustic hole 12 of the casing 10 (a state in which it is connected and passed).
在本實施例的情況下，如第6圖所示，外部聲孔12與內部聲孔22以彼此不接觸的方式構成。即，外部聲孔12與內部聲孔22以彼此錯開的方式配置。因此，透過外部聲孔12而引入的外部音頻，經過形成於殼體10與第一印刷電路基板之間的音頻路徑24之後，透過內部聲孔22而傳達至微機電系統晶片30。In the case of the present embodiment, as shown in Fig. 6, the outer sound hole 12 and the inner sound hole 22 are configured not to be in contact with each other. That is, the outer sound hole 12 and the inner sound hole 22 are arranged to be shifted from each other. Therefore, the external audio introduced through the external sound hole 12 is transmitted to the MEMS wafer 30 through the internal sound hole 22 after being formed through the audio path 24 formed between the casing 10 and the first printed circuit board.
參照第3圖，在本實施例的情況下，在第一印刷電路基板20的外側面具有銅鍍層26。銅鍍層26的中間部分被腐蝕而形成音頻路徑24。Referring to Fig. 3, in the case of this embodiment, a copper plating layer 26 is provided on the outer surface of the first printed circuit board 20. The intermediate portion of the copper plating 26 is etched to form the audio path 24.
另外，在其他實施例的情況下，根據使用者的需求，對音頻路徑的長度、方向、形狀或高度進行各種變形。另外，關於形成音頻路徑的方式，除了本實施例的腐蝕銅層而形成的方式以外，還可以利用切削、金屬鑄型、注塑等方式。Further, in the case of other embodiments, various variations of the length, direction, shape or height of the audio path are made according to the needs of the user. Further, as for the manner of forming the audio path, in addition to the method of etching the copper layer of the present embodiment, cutting, metal casting, injection molding, or the like may be used.
另外，音頻路徑不限於本實施例這樣形成在第一印刷電路基板上，只要能夠連通外部聲孔和內部聲孔，則可以形成在殼體上，也可以在兩側分別形成之後彼此聯合而構成。In addition, the audio path is not limited to being formed on the first printed circuit board as in the present embodiment, and may be formed on the casing as long as it can communicate with the external sound hole and the internal sound hole, or may be combined with each other after being formed on both sides. .
該微機電系統晶片30安裝在第一印刷電路基板的內側面。在此，所謂內側面是指，朝向內部空間62的面。微機電系統晶片30與內部聲孔22相對而配置。所謂相對配置是指，微機電系統晶片30安裝在形成有內部聲孔22的部分，以使微機電系統晶片30能夠接收透過內部聲孔22而引入的音頻信號。The MEMS wafer 30 is mounted on the inner side of the first printed circuit board. Here, the inner side surface means a surface that faces the inner space 62. The MEMS wafer 30 is disposed opposite the inner acoustic aperture 22. By relative configuration is meant that the MEMS wafer 30 is mounted in a portion in which the internal acoustic apertures 22 are formed to enable the MEMS wafer 30 to receive audio signals that are introduced through the internal acoustic apertures 22.
微機電系統晶片30產生將接收到的音頻信號轉換為電信號的作用。如背景技術中所述，微機電系統晶片30包括振動膜、墊片、背板等構成。另外，在第一印刷電路基板20的內側面安裝有微機電系統晶片30的同時，還安裝有放大器70。The MEMS wafer 30 produces the function of converting the received audio signal into an electrical signal. As described in the background, the MEMS wafer 30 includes a diaphragm, a gasket, a backing plate, and the like. Further, the MEMS wafer 30 is mounted on the inner side surface of the first printed circuit board 20, and an amplifier 70 is mounted.
放大器70產生接收由微機電系統晶片30產生的電信號而進行放大的作用。放大器70又被稱為特殊目的型半導體(ASIC)晶片。雖然未詳細以圖式表示，微機電系統晶片30與放大器70透過鍵合金絲(gold bonding wire)彼此連接。放大器70與第一印刷電路基板20電連接。Amplifier 70 produces the function of receiving an electrical signal generated by MEMS wafer 30 for amplification. Amplifier 70 is also known as a special purpose semiconductor (ASIC) wafer. Although not shown in detail in the drawings, the MEMS wafer 30 and the amplifier 70 are connected to each other through a gold bonding wire. The amplifier 70 is electrically connected to the first printed circuit board 20.
該第二印刷電路基板40與殼體10的開放的一側面結合。透過與殼體10之開放的面結合，進而與殼體10共同限定內部空間62。第二印刷電路基板40與第一印刷電路基板20隔開配置。The second printed circuit board 40 is coupled to an open side of the housing 10. The inner space 62 is defined together with the housing 10 by being coupled to the open face of the housing 10. The second printed circuit board 40 is disposed apart from the first printed circuit board 20.
在第二印刷電路基板40的外側面上具有多個連接端子42。在本實施例中，連接端子42共具有4個。連接端子又被稱為接續端子或襯墊。該第二印刷電路基板40又稱為襯墊印刷電路基板。連接端子42與內部的微機電系統晶片30及放大器70電連接而產生與外部裝置進行連接的作用。連接端子42的數量可以根據需求而進行增減，並且也可以根據需求而變更配置位置。A plurality of connection terminals 42 are provided on the outer surface of the second printed circuit board 40. In the present embodiment, the connection terminals 42 have a total of four. The connection terminals are also referred to as connection terminals or pads. The second printed circuit board 40 is also referred to as a pad printed circuit board. The connection terminal 42 is electrically connected to the internal MEMS wafer 30 and the amplifier 70 to cause connection with an external device. The number of connection terminals 42 can be increased or decreased according to requirements, and the arrangement position can also be changed as needed.
並且，該導電性連接部件50的數量為複數個，該導電性連接部件50產生將第一印刷電路基板20和第二印刷電路基板40電連接的作用。Further, the number of the conductive connecting members 50 is plural, and the conductive connecting member 50 functions to electrically connect the first printed circuit board 20 and the second printed circuit board 40.
在本實施例中，導電性連接部件50以在每個角落設置一個的方式共設置4個。各導電性連接部件50是將導電性金屬線折彎成線圈形狀的彈簧。由於構成為彈簧，因此即使組裝公差不夠精確，也能夠簡單且可靠地實現第一印刷電路基板20與第二印刷電路基板40之間的電連接。In the present embodiment, the conductive connecting members 50 are provided in a total of four in each corner. Each of the conductive connecting members 50 is a spring that bends a conductive metal wire into a coil shape. Since it is configured as a spring, electrical connection between the first printed circuit board 20 and the second printed circuit board 40 can be realized simply and reliably even if the assembly tolerance is not accurate enough.
另外，在其他實施例的情況下，導電性連接部件在形狀和材質等上除了將導電金屬線折彎而構成的彈簧形狀之外，在將第一印刷電路基板和第二印刷電路基板電連接的範圍內可進行各種變形。Further, in the case of the other embodiment, the conductive connecting member electrically connects the first printed circuit board and the second printed circuit board in addition to the spring shape formed by bending the conductive metal wire in shape, material, or the like. Various modifications are possible within the scope of the invention.
即，導電性連接部件50在其材質上無需一定是金屬，也可以是導電性矽，或者也可以由非導電性物質構成形狀之後，在其外側面上鍍金而構成鍍層。另外，導電性連接部件在其形狀上可以是單純的圓柱形狀或銷形狀，而不是彈簧。In other words, the conductive connecting member 50 does not need to be a metal, and may be made of a conductive material, or may be formed of a non-conductive material, and then plated on the outer surface thereof to form a plating layer. Further, the conductive connecting member may have a simple cylindrical shape or a pin shape in its shape instead of a spring.
在導電性連接部件形成為銷形狀的情況下，第一印刷電路基板和第二印刷電路基板分別具有能夠固定這種導電性連接部件的兩端部的槽部，進而在沒有其他結構的協助的情況下，也能夠將導電性連接部件直接固定到第一印刷電路基板和第二印刷電路基板。In the case where the conductive connecting member is formed in a pin shape, the first printed circuit board and the second printed circuit board each have a groove portion capable of fixing both end portions of the conductive connecting member, and further, without the assistance of other structures. In this case, the conductive connecting member can be directly fixed to the first printed circuit board and the second printed circuit board.
另外，在本實施例中，第一印刷電路基板20與第二印刷電路基板40之間還具有隔開支撐部件60，該隔開支撐部件60使得第一印刷電路基板20和第二印刷電路基板40在保持彼此間的間隔狀態下得到支撐。In addition, in the embodiment, the first printed circuit board 20 and the second printed circuit board 40 further have a partition supporting member 60 that makes the first printed circuit board 20 and the second printed circuit board 40 is supported while maintaining a spacing between each other.
參照第3圖及第5圖可知，隔開支撐部件60形成為四角形的框架形狀，與第一印刷電路基板20及第二印刷電路基板40的形狀對應。隔開支撐部件60的中間部分是空的，藉此與第一印刷電路基板20及第二印刷電路基板40共同限定內部空間62。並且，圍繞內部空間62的部分是輪廓部64。隔開支撐部件60具有與第一印刷電路基板20和第二印刷電路基板40彼此隔開的距離對應的寬度。Referring to FIGS. 3 and 5, the partition supporting member 60 is formed in a quadrangular frame shape and corresponds to the shapes of the first printed circuit board 20 and the second printed circuit board 40. The intermediate portion separating the support members 60 is empty, thereby defining the internal space 62 together with the first printed circuit board 20 and the second printed circuit board 40. Also, the portion surrounding the internal space 62 is the contour portion 64. The partition supporting member 60 has a width corresponding to a distance separating the first printed circuit board 20 and the second printed circuit board 40 from each other.
隔開支撐部件60具有收納部66，該收納部66收納並支撐多個導電性連接部件中的每一個。收納部66為側面的一部分係開放的圓筒形狀，藉此彈簧形狀的導電性連接部件50在上下方向簡單地結合之後不會向水平方向脫離。並且，收納部66以在每個角部設置一個的方式共配置4個。將彈簧形狀的導電性連接部件50夾入收納部66之後，將其收納部66與其他部件一起嵌入殼體中，然後將捲曲部16捲曲則可簡單地完成麥克風1的組裝。The partition supporting member 60 has a housing portion 66 that accommodates and supports each of the plurality of conductive connecting members. The accommodating portion 66 has a cylindrical shape in which a part of the side surface is opened, and the spring-shaped conductive connecting member 50 is simply detached in the horizontal direction after being simply joined in the vertical direction. Further, the storage unit 66 is disposed in a total of four at each corner. After the spring-shaped conductive connecting member 50 is sandwiched between the accommodating portions 66, the accommodating portion 66 is fitted into the casing together with other members, and then the crimping portion 16 is crimped to easily assemble the microphone 1.
另外，在本實施例中，內部空間62為背腔空間。即，背腔表示以微機電系統晶片30的振動模結構為基準，外部音頻被傳達的一側的相反側的空間，因此在本實施例中，在以與內部聲孔22相對的方式安裝微機電系統晶片30的情況下，以微機電系統晶片30所具有的振動模為基準時，內部空間62成為位於外部音頻被傳達的一側的相反側的空間，因此內部空間62為背腔空間。Further, in the present embodiment, the internal space 62 is a back cavity space. That is, the back cavity represents the space on the opposite side to the side on which the external audio is transmitted based on the vibration mode structure of the MEMS wafer 30, and therefore, in the present embodiment, the micro is mounted in a manner opposite to the inner sound hole 22. In the case of the electromechanical system wafer 30, when the vibration mode of the MEMS wafer 30 is used as a reference, since the internal space 62 is a space on the opposite side to the side on which the external audio is transmitted, the internal space 62 is a back cavity space.
因此，只要調整隔開支撐部件60的厚度和輪廓部64的體積就能夠調整背腔的空間的大小和形狀。Therefore, the size and shape of the space of the back cavity can be adjusted by adjusting the thickness of the support member 60 and the volume of the contour portion 64.
以下將對具備該結構之本發明一實施例的麥克風1，其作用和效果進行說明。The operation and effect of the microphone 1 according to an embodiment of the present invention having the above configuration will be described below.
在本實施例的麥克風1中，在殼體10內部具有根據導電性連接部件50而彼此電連接且彼此隔開配置的第一印刷電路基板20和第二印刷電路基板40，並且以與第一印刷電路基板20的內部聲孔22相對的方式設有微機電系統晶片30，因此能夠將形成於第一印刷電路基板20和第二印刷電路基板40之間的內部空間用作背腔空間。In the microphone 1 of the present embodiment, the first printed circuit board 20 and the second printed circuit board 40 which are electrically connected to each other and are spaced apart from each other according to the conductive connecting member 50 are provided inside the casing 10, and are first and The microelectromechanical system wafer 30 is provided in such a manner that the inner acoustic holes 22 of the printed circuit board 20 are opposed to each other, so that the internal space formed between the first printed circuit board 20 and the second printed circuit board 40 can be used as the back cavity space.
因此，根據本發明，能夠充分確保背腔空間，其結果能夠改善麥克風的音頻特性。Therefore, according to the present invention, the back cavity space can be sufficiently ensured, with the result that the audio characteristics of the microphone can be improved.
另外，透過調整第一印刷電路基板20和第二印刷電路基板40之間的間隔而能夠容易地調整背腔空間的大小。Further, the size of the back cavity space can be easily adjusted by adjusting the interval between the first printed circuit board 20 and the second printed circuit board 40.
特別是，在本實施例的情況下，由於在第一印刷電路基板20與第二印刷電路基板40之間具有隔開支撐部件60，因此能夠容易地變更其形狀和模樣，也能夠將產生背腔作用的內部空間62之體積容易地調整到必要的程度。In particular, in the case of the present embodiment, since the support member 60 is provided between the first printed circuit board 20 and the second printed circuit board 40, the shape and the pattern can be easily changed, and the back can be generated. The volume of the internal space 62 of the cavity is easily adjusted to the extent necessary.
另外，透過隔開支撐部件60，能夠將第一印刷電路基板20和第二印刷電路基板40在彼此隔開的狀態下穩定地固定。並且，隔開支撐部件60具有收納部66，因此能夠簡單且堅固地組裝彈簧形狀的導電性連接部件50。Further, by separating the support members 60, the first printed circuit board 20 and the second printed circuit board 40 can be stably fixed in a state of being spaced apart from each other. Further, since the partition supporting member 60 has the accommodating portion 66, the spring-shaped conductive connecting member 50 can be easily and firmly assembled.
另外，由於使用於第1圖所示之習知的麥克風100中的微機電系統晶片120是在殼體上形成聲孔並安裝到基板上的類型，因此需要在其內部具備背腔空間。這種微機電系統晶片120與在基板上形成聲孔且在該聲孔中安裝微機電系統晶片的麥克風中的微機電系統晶片的結構是不同的。即，根據麥克風聲孔之配置位置的不同，微機電系統晶片的結構也不同。Further, since the MEMS wafer 120 used in the conventional microphone 100 shown in Fig. 1 is of a type in which an acoustic hole is formed in the casing and mounted on the substrate, it is necessary to provide a back cavity space therein. Such a MEMS wafer 120 differs in structure from a MEMS wafer in which a sound hole is formed on a substrate and a microelectromechanical system wafer is mounted in the sound hole. That is, the structure of the MEMS wafer differs depending on the arrangement position of the microphone sound holes.
但是，在本實施例的情況下，利用兩個分離的基板，靠近形成於殼體的外部聲孔而設置微機電系統晶片，因此能夠充分確保背腔空間，進而能夠使用與在基板上形成聲孔類型的麥克風中的微機電系統晶片相同的微機電系統晶片。However, in the case of the present embodiment, the MEMS system wafer is provided close to the external sound hole formed in the casing by using two separate substrates, so that the back cavity space can be sufficiently ensured, and the sound can be formed and formed on the substrate. The microelectromechanical system wafer in the hole type microphone is the same MEMS wafer.
另外，在本實施例的情況下，殼體10的外部聲孔12和第一印刷電路基板20的內部聲孔22彼此不接觸而錯開形成，並且外部聲孔12和內部聲孔22透過音頻路徑24而連通，因此能夠將音頻路徑24多樣化。Further, in the case of the present embodiment, the outer sound hole 12 of the casing 10 and the inner sound hole 22 of the first printed circuit board 20 are staggered without being in contact with each other, and the outer sound hole 12 and the inner sound hole 22 are transmitted through the audio path. 24 is connected, so the audio path 24 can be diversified.
另外，由於外部聲孔12和內部聲孔22彼此不接觸而錯開形成，因此能夠防止內部的微機電系統晶片或放大器等電子部件直接暴露在外部的各種光，例如可視光線、紫外線、紅外線等。Further, since the external acoustic hole 12 and the internal acoustic hole 22 are formed in a staggered manner, it is possible to prevent various internal light such as visible light, ultraviolet rays, infrared rays, and the like from being directly exposed to external electronic components such as a microelectromechanical system chip or an amplifier.
而上述優點可透過測試來得到確認。即，在50Hz的條件下，對習知的麥克風100和本實施例的麥克風1的光敏度(light sensitivity)進行了測試，其結果在習知的麥克風的情況下獲得了-44.9dB的值，在本實施例的麥克風的情況下獲得了-63.6dB的值。The above advantages can be confirmed by testing. That is, the light sensitivity of the conventional microphone 100 and the microphone 1 of the present embodiment was tested under the condition of 50 Hz, and the result was a value of -44.9 dB in the case of a conventional microphone. A value of -63.6 dB was obtained in the case of the microphone of the present embodiment.
另外，將印刷電路基板在物理上分為兩個基板而使用，因此能夠使用單層結構的印刷電路基板，而不是使用結合為多層結構的印刷電路基板。因此，印刷電路基板簡單的製造，與以往情況相比，能夠節省費用。Further, since the printed circuit board is physically divided into two substrates, it is possible to use a printed circuit board having a single-layer structure instead of using a printed circuit board combined in a multilayer structure. Therefore, the printed circuit board can be easily manufactured, and the cost can be saved compared with the conventional case.
另外，第7圖和第8圖表示對本實施例的麥克風1和第1圖所示之習知的麥克風100，其音頻特性進行實驗的結果資料。從各圖表右側的高音記錄可知，本實施例的麥克風1與習知的麥克風相比，因充分確保了背腔空間，因此顯著改善了音頻特性。Further, Fig. 7 and Fig. 8 show the results of experiments on the audio characteristics of the microphone 1 of the present embodiment and the conventional microphone 100 shown in Fig. 1. As can be seen from the treble recording on the right side of each graph, the microphone 1 of the present embodiment significantly improves the audio characteristics as compared with the conventional microphone because the back cavity space is sufficiently ensured.
另外，在本實施例的麥克風1中，以在第一印刷電路基板和第二印刷電路基板之間具備隔開支撐部件為例進行了說明，但本發明不限於此。即，也可以不使用隔開支撐部件，而是僅利用導電性連接部件來將第一印刷電路基板和第二印刷電路基板保持為彼此隔開的狀態。Further, in the microphone 1 of the present embodiment, the case where the support member is provided between the first printed circuit board and the second printed circuit board has been described as an example, but the present invention is not limited thereto. That is, the first printed circuit board and the second printed circuit board may be held apart from each other by only the conductive connecting member without using the partition supporting member.
另外，在本實施例的麥克風1中，以外部聲孔和內部聲孔彼此不接觸的情況為例進行了說明，但是本發明不限於此。即，也可以外部聲孔和內部聲孔彼此相對的方式形成，並且在這種結構的實施例中，能夠獲得除了因兩個聲孔彼此不接觸而獲得的效果之外的其他所有的效果。Further, in the microphone 1 of the present embodiment, the case where the external sound hole and the internal sound hole are not in contact with each other has been described as an example, but the present invention is not limited thereto. That is, it is also possible to form the outer sound hole and the inner sound hole opposed to each other, and in the embodiment of such a structure, all the effects other than the effect obtained by the two sound holes not contacting each other can be obtained.
1．．．麥克風1. . . microphone
10．．．殼體10. . . case
11．．．殼體的另一側面11. . . The other side of the housing
12．．．外部聲孔12. . . External sound hole
14．．．側面14. . . side
16．．．捲曲部16. . . Curl
20．．．第一印刷電路基板20. . . First printed circuit board
22．．．內部聲孔twenty two. . . Internal sound hole
24．．．音頻路徑twenty four. . . Audio path
26．．．銅鍍層26. . . Copper plating
30．．．微機電系統晶片30. . . MEMS wafer
40．．．第二印刷電路基板40. . . Second printed circuit board
42．．．連接端子42. . . Connection terminal
50．．．導電性連接部件50. . . Conductive connecting member
60．．．隔開支撐部件60. . . Separating support members
62．．．內部空間62. . . Internal space
64．．．輪廓部64. . . Contour
66．．．收納部66. . . Storage department
70．．．放大器70. . . Amplifier
100．．．矽電容式麥克風100. . . Tantalum condenser microphone
110．．．印刷電路基板110. . . Printed circuit board
120．．．微機電系統(MEMS)晶片120. . . Microelectromechanical system (MEMS) wafer
121．．．背板121. . . Backplane
122．．．墊片122. . . Gasket
123．．．振動膜123. . . Vibrating membrane
124．．．聲孔124. . . Sound hole
126．．．背腔空間126. . . Dorsal space
130．．．特殊目的型半導體(ASIC)晶片130. . . Special purpose semiconductor (ASIC) wafer
140．．．聲孔140. . . Sound hole
150．．．殼體150. . . case
第1圖係習知的麥克風之概略性剖面圖。Fig. 1 is a schematic cross-sectional view of a conventional microphone.
第2圖係本發明一實施例之麥克風的立體圖。Fig. 2 is a perspective view of a microphone according to an embodiment of the present invention.
第3圖係第2圖之麥克風的分解立體圖。Fig. 3 is an exploded perspective view of the microphone of Fig. 2.
第4圖係第2圖之麥克風的仰視立體圖。Figure 4 is a bottom perspective view of the microphone of Figure 2.
第5圖係第2圖之麥克風的仰視分解圖。Figure 5 is a bottom exploded view of the microphone of Figure 2.
第6圖係第2圖之麥克風的概略性剖面圖。Fig. 6 is a schematic cross-sectional view of the microphone of Fig. 2.
第7圖和第8圖係對第2圖之麥克風和第1圖之習知的麥克風，其音頻特性進行比較的參照圖表。Fig. 7 and Fig. 8 are reference charts for comparing the audio characteristics of the microphone of Fig. 2 and the conventional microphone of Fig. 1.
11．．．殼體的另一側面11. . . The other side of the housing
12．．．外部聲孔12. . . External sound hole
14．．．側面14. . . side
16．．．捲曲部16. . . Curl
20．．．第一印刷電路基板20. . . First printed circuit board
22．．．內部聲孔twenty two. . . Internal sound hole
24．．．音頻路徑twenty four. . . Audio path
26．．．銅鍍層26. . . Copper plating
30．．．微機電系統晶片30. . . MEMS wafer
40．．．第二印刷電路基板40. . . Second printed circuit board
42．．．連接端子42. . . Connection terminal
62．．．內部空間62. . . Internal space
64．．．輪廓部64. . . Contour
70．．．放大器70. . . Amplifier
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20100047662A KR101094452B1 (en) | 2010-05-20 | 2010-05-20 | Microphone assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201216723A TW201216723A (en) | 2012-04-16 |
| TWI527469B true TWI527469B (en) | 2016-03-21 |
Family
ID=44983125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100117761A TWI527469B (en) | 2010-05-20 | 2011-05-20 | Microphone |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101094452B1 (en) |
| CN (2) | CN202135311U (en) |
| TW (1) | TWI527469B (en) |
| WO (1) | WO2011145790A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI730834B (en) * | 2020-07-03 | 2021-06-11 | 加高電子股份有限公司 | Microphone structure |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI573469B (en) * | 2012-02-22 | 2017-03-01 | 美律實業股份有限公司 | Mems microphone module |
| CN102892064A (en) * | 2012-10-30 | 2013-01-23 | 无锡芯奥微传感技术有限公司 | Electroacoustic sensor packaging structure for microcomputer |
| KR101496192B1 (en) * | 2013-04-11 | 2015-02-27 | 싸니코전자 주식회사 | Mems microphone having piezo membrane |
| US10499161B2 (en) | 2014-06-23 | 2019-12-03 | Tdk Corporation | Microphone and method of manufacturing a microphone |
| CN112399733A (en) * | 2019-08-16 | 2021-02-23 | Oppo（重庆）智能科技有限公司 | Electronic equipment |
| US11259104B2 (en) * | 2020-06-23 | 2022-02-22 | Knowles Electronics, Llc | Adapters for microphones and combinations thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007081614A (en) * | 2005-09-13 | 2007-03-29 | Star Micronics Co Ltd | Condenser microphone |
| JP2007082034A (en) * | 2005-09-16 | 2007-03-29 | Matsushita Electric Works Ltd | Silicon microphone package |
| KR100722686B1 (en) | 2006-05-09 | 2007-05-30 | 주식회사 비에스이 | Silicon condenser microphone having additional back chamber and sound hole in pcb |
| KR100982239B1 (en) * | 2007-11-02 | 2010-09-14 | 주식회사 비에스이 | Mems microphone package |
| CN201274566Y (en) | 2008-09-26 | 2009-07-15 | 瑞声声学科技(深圳)有限公司 | MEMS microphone |
-
2010
- 2010-05-20 KR KR20100047662A patent/KR101094452B1/en active IP Right Grant
- 2010-11-26 WO PCT/KR2010/008452 patent/WO2011145790A1/en active Application Filing
-
2011
- 2011-05-18 CN CN2011201590313U patent/CN202135311U/en not_active Expired - Fee Related
- 2011-05-18 CN CN2011101300669A patent/CN102256190A/en active Pending
- 2011-05-20 TW TW100117761A patent/TWI527469B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI730834B (en) * | 2020-07-03 | 2021-06-11 | 加高電子股份有限公司 | Microphone structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201216723A (en) | 2012-04-16 |
| KR20110128058A (en) | 2011-11-28 |
| CN102256190A (en) | 2011-11-23 |
| WO2011145790A1 (en) | 2011-11-24 |
| CN202135311U (en) | 2012-02-01 |
| KR101094452B1 (en) | 2011-12-15 |
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