TWI730834B - Microphone structure - Google Patents

Abstract

A microphone structure is provided, which includes a substrate, a partition member, a lid, an application-specific integrated circuit (ASIC) chip and a microphone chip. The substrate includes a first side and a second side opposite to the first side. The first side has a recessed structure recessed into a surface of the first side to form a recessed space. The partition member is configured to form an accommodating space at the second side of the substrate. The lid covers the partition member, and a sound transmission space is formed between the lid and the substrate. The lid has a sound hole communicated with the sound transmission space. The ASIC chip is disposed on the second side and is electrically connected to the substrate. The microphone chip is disposed on the second side and is electrically connected to the substrate and the ASIC chip. The substrate has a first communicating hole and the second communicating hole. The first communicating hole communicates the sound transmission space and the recessed space, and the second communicating hole communicates the accommodating space and the recessed space. The microphone chip is disposed to align with the second communicating hole.

Description

Microphone structure

The present disclosure relates to a microphone structure, and particularly refers to a front-in microphone structure with back-in sound characteristics.

The existing microphone structure is mainly divided into two types: forward-sound microphone structure and backward-sound microphone structure. Among them, the common forward sound microphone structure mainly uses the sound from the upper cover to enter the space where the microphone chip and the specific application chip are located as the front cavity, and when the sound enters the front cavity and passes through the microphone chip, the cavity of the microphone chip itself is the back Cavity.

However, the sound sensitivity is mainly determined by the volume of the back cavity. Therefore, when the cavity of the microphone chip itself is used as the back cavity, the problem of low sensitivity often occurs due to the too small volume of the back cavity.

Therefore, one purpose of the embodiments of the present disclosure is to provide a microphone structure. Among them, the substrate structure design of the microphone structure can directly form a sound transmission channel together with the application end components, so that the microphone structure has the function of forward sound, and at the same time has the advantage of a large back cavity for back-in sound.

According to the above objective of the embodiments of the disclosure, a microphone structure is provided. This microphone structure is configured to be connected to the application end components. The microphone structure includes a substrate, a spacer, a cover, an application-specific chip, and a microphone chip. The substrate has a first side and a second side opposite to each other, wherein the first side has a recessed structure recessed from the surface of the first side to form a recessed space. The partition is configured to form an accommodating space on the second side of the substrate. The cover body is arranged on the partition, and the cover body and the base plate jointly form a sound transmission space, wherein a sound inlet hole is provided on the cover body to communicate with the sound transmission space. The application-specific chip is arranged in the accommodating space and is electrically connected to the substrate. The microphone chip is arranged in the accommodating space and is electrically connected to the substrate and the specific application chip. The substrate has a first through hole and a second through hole, wherein the first through hole communicates with the sound transmission space and the recessed space, the second through hole communicates with the accommodating space and the recessed space, and the microphone chip is arranged in alignment with the second Pass the position of the through hole.

According to an embodiment of the present disclosure, the above-mentioned partition is a retaining wall, the retaining wall surrounds a specific application chip and a microphone chip, and the space enclosed by the retaining wall is an accommodating space. The cover body is a plate body, which is arranged on the retaining wall, and covers an accommodation space and a sound transmission space.

According to an embodiment of the disclosure, the above-mentioned accommodating space is formed by recessing from the second side surface of the substrate. The first through hole penetrates from the second side of the substrate to the recessed space of the substrate to form a sound transmission space. A part of the substrate separating the accommodating space and the sound transmission space is defined as a partition. The cover body is a plate body, and the cover is provided with accommodating space and sound transmission space.

According to an embodiment of the present disclosure, the above-mentioned partition is a cover, which is arranged on the second side of the substrate and forms an accommodating space with the substrate. The cross section of the cover body is ㄇ shape, the cover is arranged outside the cover body and forms a sound transmission space with the base plate.

According to an embodiment of the present disclosure, the above-mentioned substrate is provided with a first sealing ring at a position corresponding to the cover, and the cover is joined to the first sealing ring through conductive glue or non-conductive glue. The position of the substrate corresponding to the cover is provided with a second sealing ring, and the cover is connected to the second sealing ring through conductive glue or non-conductive glue.

According to an embodiment of the present disclosure, the above-mentioned substrate is a ceramic substrate, a printed circuit substrate or a resin substrate.

According to an embodiment of the disclosure, the second side of the above-mentioned substrate is provided with at least one bonding pad in the accommodating space, and the first side of the substrate is provided with at least one pad adjacent to the recessed structure. Wherein, the bonding pad and the bonding pad are electrically connected to each other through a conductive structure penetrating the substrate.

According to an embodiment of the present disclosure, the peripheral ring of the concave structure on the first side of the above-mentioned substrate is provided with a sealing ring structure, and the sealing ring structure is connected to another sealing ring structure on the application end part through conductive glue.

It can be seen from the above that the present disclosure mainly changes the structure of the substrate of the microphone structure and its relative position configuration with the microphone chip, so that when the microphone structure is installed in the application end product, it can maintain the forward sound function of the microphone structure and make the microphone The structure has a large back cavity volume. Specifically, the present disclosure is to form an open space on the substrate by providing a recessed structure on one side of the substrate, and form two non-communicating accommodating spaces and sound transmission spaces on the other side of the substrate. Then, the first through hole and the second through hole are opened on the substrate so that the recessed space is respectively connected to the accommodating space and the sound transmission space, thereby changing the sound transmission path of the microphone structure, thereby enabling the microphone structure to have The forward sound function and the effect of the large back cavity space.

Please refer to FIG. 1 and FIG. 2 at the same time. FIG. 1 and FIG. 2 are respectively an external schematic diagram and a cross-sectional schematic diagram of a microphone structure according to the first embodiment of the present disclosure. The microphone structure 100 of this embodiment is configured to be connected to the application end component 200, and can directly form a sound transmission space that can be used as the microphone structure 100 together with the application end component 200. In this embodiment, the microphone structure 100 mainly includes a substrate 110, a spacer 120, a cover 130, an application-specific chip 140, and a microphone chip 150. In an embodiment, the substrate 110 may be a ceramic substrate, a printed circuit substrate or a resin substrate, but not limited to these examples. Among them, the application-specific chip 140 and the microphone chip 150 are electrically connected to the substrate 110, and the application-specific chip 140 is mainly used to detect the structural deformation of the microphone chip 150 and convert it into an electrical signal, which is then transmitted to related processing components, such as a baseband processor. Or amplifiers, etc.

Please refer to FIGS. 2 to 4, in which FIG. 3 shows an exploded schematic diagram of a microphone structure according to the first embodiment of the present disclosure, and FIG. 4 shows the substrate of a microphone structure according to the first embodiment of the present disclosure Schematic diagram of the bottom angle. The substrate 110 has a first side 111 and a second side 112 opposite to each other. The first side 111 of the substrate 110 has a recessed structure 111a, and the recessed structure 111a is recessed from the surface of the first side 111 to form a recessed space A1.

As shown in FIG. 2, the partition 120 is configured to form an accommodating space A2 on the second side 112 of the substrate 110. In this embodiment, the partition 120 is a retaining wall, and the partition 120 surrounds the application-specific chip 140 and the microphone chip 150. In some examples, the retaining wall can be formed in a variety of ways. For example, the retaining wall can be directly erected to surround the application-specific chip 140 and the microphone chip 150 on the second side 112 of the substrate 110, so that the application-specific chip 140 and the microphone chip 150 is located in the accommodating space A2 enclosed by the retaining wall. In other embodiments, the accommodating space A2 may also be a space formed by a groove provided on the surface of the second side 112 of the substrate 110, and the inner wall of the groove may be defined as a retaining wall.

As shown in FIGS. 2 to 4, the substrate 110 has a first through hole T1 and a second through hole T2. Wherein, the first through hole T1 penetrates from the second side 112 of the substrate 110 to the recessed space A1 of the substrate 110 to form a sound transmission space A3, and makes the recessed space A1 and the sound transmission space A3 communicate with each other. The second through hole T2 penetrates from the surface of the substrate 110 in the accommodating space A2 to the recessed space A1 of the substrate 110 so that the accommodating space A2 of the substrate 110 and the recessed space A1 communicate with each other. As shown in FIG. 2, the accommodating space A2 and the sound transmission space A3 are not connected to each other, but are separated by the partition 120. In other words, the partition 120 may also belong to a part of the substrate 110 to separate the accommodating space A2 and the sound transmission space A3.

Please continue to refer to FIGS. 2 to 4, in this embodiment, the application-specific chip 140 and the microphone chip 150 are disposed in the accommodating space A2, and the microphone chip 150 is disposed in the second through hole T2 of the alignment substrate 110 position. The cover 130 covers the partition 120, and the cover 130 covers the accommodating space A2 and the sound transmission space A3. In one embodiment, the cover 130 may be bonded to the substrate 110 through conductive glue or non-conductive glue. Wherein, the cover 130 is provided with a sound inlet 131 connected to the sound transmission space A3, but does not communicate with the accommodating space A2. Therefore, external sound waves can enter the sound transmission space A3 from the sound inlet 131 and then enter the recessed space A1, and then It is transmitted to the cavity of the microphone chip 150 through the second transmission hole T2. Therefore, the cavity of the microphone chip 150 is the front cavity of the microphone structure 100, and the accommodating space A2 where the microphone chip 150 is located is the back cavity of the microphone structure 100.

That is to say, by providing an open recessed structure 111a on the substrate 110, when the substrate 110 is coupled to the application end member 200 as shown in FIG. 1, sound waves can enter from the sound inlet 131 of the cover 130 In the case of the microphone structure 100, the recessed space A1 of the concave structure 111a can directly communicate with the sound transmission space A3 to form a sound transmission channel to guide the acoustic waveguide to the microphone chip 150 to maintain the forward sound function of the microphone structure 100. The accommodating space A2 on the substrate 110 can be directly used as the back cavity of the microphone structure 100, so that the forward-sounding microphone structure 100 can have a large back cavity volume, so the sensitivity of the microphone structure 100 can be improved.

As shown in Figures 2 and 4, the peripheral ring of the recessed structure 111a on the first side 111 of the substrate 110 is provided with a sealing ring structure S1, and the sealing ring structure S1 is connected to the application end part shown in Figure 1 through conductive glue Another seal ring structure S2 on 200. As shown in FIG. 2, the substrate 110 is provided with at least one bonding pad 301 located in the accommodating space A2, and the first side 111 of the substrate 110 is provided with at least one pad 302 adjacent to the recessed structure 111a. Wherein, the bonding pad 301 and the bonding pad 302 are electrically connected to each other through a conductive structure 303 penetrating through the substrate 110, thereby guiding electrical signals to the outside of the product.

In this disclosure, the substrate of the microphone structure can also have different structural designs. Please refer to FIGS. 5 to 8 at the same time, in which FIGS. 5 and 6 are respectively an external schematic diagram and a cross-sectional schematic diagram of a microphone structure according to the second embodiment of the present disclosure. FIG. 7 is an exploded schematic diagram of a microphone structure according to the second embodiment of the present disclosure. FIG. 8 is a schematic diagram illustrating a bottom angle of a microphone structure according to the second embodiment of the present disclosure.

As shown in FIGS. 5 and 6, the microphone structure 400 mainly includes a substrate 410, a spacer 420, a cover 430, an application-specific chip 440 and a microphone chip 450. The application-specific chip 440 and the microphone chip 450 are disposed on the substrate 410 and are electrically connected to the substrate 410. In this embodiment, the substrate 410 is flat.

As shown in FIGS. 5 to 8, the substrate 410 has a first side 411 and a second side 412 opposite to each other. The first side 411 of the substrate 410 has a recessed structure 411a, and the recessed structure 411a is from the first side 411 The surface is recessed to form a recessed space A4. In this embodiment, the partition 420 is a cover structure with a cross-section of an ㄇ-shaped structure, and the partition 420 is disposed on the second side 412 of the base plate 410 and forms an accommodation space A5 together with the base plate 410. As shown in FIG. 7, the second side 412 of the substrate 410 is provided with a first sealing ring S3 at a position corresponding to the partition 420 (cover), and the partition 420 can be bonded to the substrate 410 with conductive glue or non-conductive glue. In an embodiment, the material of the partition 420 (cover) may be PCB, metal, or glass. In this embodiment, the application-specific chip 440 and the microphone chip 450 are disposed on the second side 412 of the substrate 410 and located in the accommodating space A5.

As shown in FIG. 6 and FIG. 7, in this embodiment, the cover 430 has a U-shaped structure and covers the partition 420, and the cover 430 and the substrate 410 jointly form a sound transmission space A6. In an embodiment, the substrate 410 is provided with a second sealing ring S4 at a position corresponding to the cover 430, and the cover 430 is bonded to the second sealing ring S4 through conductive glue or non-conductive glue. In addition, the substrate 410 has a first through hole T3 and a second through hole T4. Wherein, the first through hole T3 penetrates from the surface of the substrate 410 in the sound transmission space A6 to the recessed space A4 of the substrate 410 so that the recessed space A4 and the sound transmission space A6 communicate with each other. The second through hole T4 penetrates from the surface of the substrate 410 in the accommodating space A5 to the recessed space A4 of the substrate 410, so that the accommodating space A5 of the substrate 410 and the recessed space A4 communicate with each other. As shown in FIG. 6, the accommodating space A5 and the sound transmission space A6 are not connected to each other, but are separated by a partition 420.

As shown in FIGS. 6 and 7, the application-specific chip 440 and the microphone chip 450 are disposed in the accommodating space A5, and the microphone chip 450 is disposed at the position of the second through hole T4 of the alignment substrate 410. In this embodiment, the cover 430 is provided with a sound inlet 431 connected to the sound transmission space A6, but not connected to the accommodating space A5. Therefore, external sound waves can enter the sound transmission space A6 from the sound inlet 431 and can be transmitted by the first The through hole T3 enters the recessed space A4, and then passes to the cavity of the microphone chip 450 through the second through hole T4. Therefore, the cavity of the microphone chip 450 is the front cavity of the microphone structure 400, and the accommodating space A5 where the microphone chip 450 is located is the back cavity of the microphone structure 400.

In other words, by providing an open recessed structure 411a on the substrate 410, when the substrate 410 is coupled to the application end member 200 as shown in FIG. 1, sound waves can enter from the sound inlet 431 of the cover 430 When the microphone structure 400 is used, the recessed space A4 of the recessed structure 411a can directly communicate with the sound transmission space A6 to form a sound transmission channel to guide the acoustic waveguide to the microphone chip 450 to maintain the forward sound function of the microphone structure 400. The accommodating space A5 on the substrate 410 can be directly used as the back cavity of the microphone structure 400, so that the forward-sounding microphone structure 400 can have a large back cavity volume, so the sensitivity of the microphone structure 400 can be improved.

As shown in Figures 6 and 8, the peripheral ring of the recessed structure 411a on the first side 411 of the substrate 410 is provided with a sealing ring structure S5, and the sealing ring structure S5 is connected to the application end part as shown in Figure 1 through conductive glue Another seal ring structure S2 on 200. As shown in FIG. 6, the substrate 410 is provided with at least one bonding pad 501 located in the accommodating space A5, and the first side 411 of the substrate 410 is provided with at least one pad 502 adjacent to the recessed structure 411a. Wherein, the bonding pad 501 and the bonding pad 502 are electrically connected to each other through a conductive structure (not shown) penetrating through the substrate 410, thereby guiding electrical signals to the outside of the product.

As can be seen from the above-mentioned embodiments of the present disclosure, the present disclosure mainly changes the structure of the substrate of the microphone structure and its relative position configuration with the microphone chip, so that when the microphone structure is installed on the application end product, the forward sound of the microphone structure can be maintained at the same time. Function and make the microphone structure have a large back cavity volume. Specifically, in the present disclosure, an open space is formed on the substrate by providing a recessed structure on one side of the substrate, and two non-communicating accommodating spaces and sound transmission spaces are formed on the other side of the substrate. Then, the first through hole and the second through hole are opened on the substrate so that the recessed space is respectively connected to the accommodating space and the sound transmission space, thereby changing the sound transmission path of the microphone structure, thereby enabling the microphone structure to have The forward sound function and the effect of the large back cavity space.

100: Microphone structure 110: substrate 111: first side 111a: Recessed structure 112: second side 120: divider 130: cover 131: Sound Hole 140: specific application chip 150: Microphone chip 200: Application-side components 301: Pad 302: Pad 303: conductive structure 400: Microphone structure 410: substrate 411: first side 411a: Recessed structure 412: second side 420: divider 430: Lid 431: Sound Hole 440: specific application chip 450: Microphone chip 501: Pad 502: Pad A1: Recessed space A2: Housing space A3: Sound transmission space A4: Recessed space A5: Housing space A6: Sound transmission space S1: Sealing ring structure S2: Sealing ring structure S3: The first sealing ring S4: The second sealing ring S5: Sealing ring structure T1: First pass through hole T2: Second pass through hole T3: First pass through hole T4: Second pass through hole

For a more complete understanding of the embodiments and their advantages, reference is now made to the following description in conjunction with the accompanying drawings, in which: [Figure 1] is a schematic diagram showing the appearance of a microphone structure according to the first embodiment of the present disclosure; [Figure 2] is a schematic cross-sectional view of a microphone structure according to the first embodiment of the present disclosure; [Figure 3] is an exploded schematic diagram showing a microphone structure according to the first embodiment of the present disclosure; [Fig. 4] is a schematic diagram showing the bottom angle of the substrate of a microphone structure according to the first embodiment of the present disclosure; [Fig. 5] is a schematic diagram showing the appearance of a microphone structure according to the second embodiment of the present disclosure; [Figure 6] is a schematic cross-sectional view of a microphone structure according to the second embodiment of the present disclosure; [Fig. 7] is an exploded schematic diagram showing a microphone structure according to the second embodiment of the present disclosure; and [Fig. 8] is a schematic diagram showing the bottom angle of a microphone structure according to the second embodiment of the present disclosure.

Domestic deposit information (please note in the order of deposit institution, date and number) no Foreign hosting information (please note in the order of hosting country, institution, date, and number) no

400: Microphone structure

410: substrate

411: first side

411a: Recessed structure

412: second side

420: divider

430: Lid

431: Sound Hole

440: specific application chip

450: Microphone chip

501: Pad

502: Pad

A4: Recessed space

A5: Housing space

A6: Sound transmission space

S5: Sealing ring structure

T3: First pass through hole

T4: Second pass through hole

Claims (8)

A microphone structure configured to be connected to an application end component, wherein the microphone structure includes: a substrate having a first side and a second side opposite to each other, wherein the first side has a concave structure from the first side The surface is recessed to form a recessed space; a partition is configured to form an accommodating space on the second side of the substrate; a cover is disposed on the partition, and the cover and the substrate are formed together A sound transmission space, wherein the cover is provided with a sound inlet hole connected to the sound transmission space, wherein the sound transmission space communicates with the recessed space, and forms a sound transmission channel together with the application end component; a specific application chip is provided In the accommodating space and electrically connected to the substrate; and a microphone chip arranged in the accommodating space and electrically connected to the substrate and the specific application chip; wherein the substrate has a first through hole And a second through hole, wherein the first through hole communicates with the sound transmission space and the recessed space, the second through hole communicates with the accommodating space and the recessed space, and the microphone chip is arranged in alignment with the The location of the second pass-through hole. The microphone structure according to claim 1, wherein the partition is a retaining wall, wherein the retaining wall surrounds the application-specific chip and the microphone chip, and the space enclosed by the retaining wall is the accommodating space; And the cover is a plate, which is arranged on the retaining wall, and covers the accommodating space and the sound transmission space. The microphone structure according to claim 1, wherein the accommodating space is formed by recessing from the second side surface of the substrate; the first through hole penetrates from the second side of the substrate to the substrate The recessed space forms the sound transmission space; a part of the substrate that separates the accommodating space and the sound transmission space is defined as the partition; the cover is a plate and covers the accommodating space and the sound transmission space. The microphone structure of claim 1, wherein the partition is a cover provided on the second side of the substrate and forms the accommodating space with the substrate; and the cross section of the cover is ㄇ-shaped, and the cover is provided It is outside the cover and forms the sound transmission space with the substrate. The microphone structure of claim 4, wherein the substrate is provided with a first sealing ring at a position corresponding to the cover, and the cover is bonded to the first sealing ring through conductive glue or non-conductive glue; and the substrate A second sealing ring is arranged at a position corresponding to the cover, and the cover is joined to the second sealing ring through conductive glue or non-conductive glue. The microphone structure according to any one of claim 1 to claim 5, wherein the substrate is a ceramic substrate, a printed circuit substrate, or a resin substrate. The microphone structure according to any one of claim 1 to claim 5, wherein the second side of the substrate is provided with at least one solder pad located in the accommodating space, and the first side of the substrate is provided with at least A bonding pad is adjacent to the recessed structure, wherein the at least one bonding pad and the at least one bonding pad are electrically connected to each other through at least one conductive structure penetrating through the substrate. The microphone structure according to any one of claim 1 to claim 5, wherein the peripheral ring of the concave structure on the first side of the substrate is provided with a sealing ring structure, and the sealing ring structure is connected to Another sealing ring structure on the application end part.

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