KR101320573B1 - Microphone - Google Patents

Microphone Download PDF

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Publication number
KR101320573B1
KR101320573B1 KR20110127252A KR20110127252A KR101320573B1 KR 101320573 B1 KR101320573 B1 KR 101320573B1 KR 20110127252 A KR20110127252 A KR 20110127252A KR 20110127252 A KR20110127252 A KR 20110127252A KR 101320573 B1 KR101320573 B1 KR 101320573B1
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KR
South Korea
Prior art keywords
mems
case
circuit board
sound hole
internal
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Application number
KR20110127252A
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Korean (ko)
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KR20130060932A (en
Inventor
이상호
심용현
Original Assignee
주식회사 비에스이
롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드
동관 바오싱 일렉트로닉스 컴퍼니 리미티드
톈진 비에스이 일렉트로닉스 컴퍼니 리미티드
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Application filed by 주식회사 비에스이, 롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드, 동관 바오싱 일렉트로닉스 컴퍼니 리미티드, 톈진 비에스이 일렉트로닉스 컴퍼니 리미티드 filed Critical 주식회사 비에스이
Priority to KR20110127252A priority Critical patent/KR101320573B1/en
Publication of KR20130060932A publication Critical patent/KR20130060932A/en
Application granted granted Critical
Publication of KR101320573B1 publication Critical patent/KR101320573B1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials

Abstract

The present invention relates to a MEMS microphone, comprising a side wall and an upper wall, the lower side of which is an open case; A printed circuit board coupled to the lower side of the case; A MEMS chip provided on the printed circuit board and having a MEMS inner space; And at least one sound hole provided on one side of the case so as to allow external sound to flow therein, wherein the MEMS microphone is configured to communicate the sound hole with the MEMS inner space. An internal communication unit is provided to form an acoustic path, and the external sound introduced through the sound hole is configured to enter the internal space of the MEMS chip through the acoustic path of the internal communication unit.

Description

MEMS microphone {Microphone}

The present invention relates to a MEMS microphone, and more particularly, to a microphone capable of securing a back chamber space of a MEMS chip and capable of improving acoustic characteristics.

The microphone is essentially used for a mobile communication terminal. Traditional condenser microphones consist of a diaphragm / backplate pair forming a capacitor C that changes in response to sound pressure, and a field effect transistor (JFET) for buffering the output signal.

In this conventional condenser microphone, a diaphragm, a spacer ring, an insulating ring, a back plate, and a conductive ring are sequentially inserted into a case, and finally, a printed circuit board on which circuit components are mounted is inserted, And bent to the substrate side to complete one assembly.

In recent years, semiconductor processing technology using micromachining has been applied as a technique for integrating micro devices in microphones. This technology, called MEMS (Micro Electro Mechanical System), can be used to fabricate ultra-small sensors, actuators and electromechanical structures in the order of micrometers by using micro-machining techniques, particularly those applied in semiconductor processing.

MEMS microphone manufactured using this micromachining technology is manufactured by miniaturization, high performance, multifunctionalization, and integration of conventional microphone parts such as diaphragm, spacer ring, insulation ring, back plate, and conduction ring through ultra-precision micro machining. As an advantage, stability and reliability can be improved.

1 is a schematic cross-sectional view of one example of a conventional MEMS microphone 100 having a MEMS chip 120. As shown in FIG. The MEMS microphone 100 includes a printed circuit board 110, a MEMS chip 120 mounted on the printed circuit board 110, a special purpose semiconductor (ASIC) chip 130, also called an amplifier, and a sound hole 140. The case 150 is comprised.

In this configuration, the space indicated by reference numeral 126 is a space formed inside the MEMS chip. In this type of MEMS microphone in which sound holes are formed in the case, the MEMS internal space 126 is a back chamber. The back chamber is a space for circulation of air generated during vibration of the diaphragm provided in the MEMS chip, and is a space for preventing acoustic resistance. That is, the space referred to as the back chamber means the space on the opposite side of the side from which the external sound is introduced with respect to the diaphragm. As the size of the back chamber increases, the sensitivity increases, and the SNR (single to noise ratio) value increases.

Meanwhile, FIG. 2 shows a MEMS microphone 102 of a type in which a sound hole 140 is formed on a printed circuit board 110 instead of a case. No through holes are formed in the case 150. The external sound is introduced through the sound hole 140. In this case, the back chamber is not the MEMS chip inner space, but the inner space 151 of the case serves as the back chamber.

2, since the back chamber is the internal space 151 of the case, sufficient space is ensured. However, in the case of the MEMS microphone 100 of FIG. 1, the back chamber is provided in the MEMS internal space 126 ), There is a disadvantage that it is not enough and is too small.

When the back chamber is too small as in the case of FIG. 1, there is a problem that the SNR value is small and the sensitivity is poor and the sound quality is deteriorated.

Patent Publication No. 2008-0005801

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a MEMS microphone which can sufficiently improve a sound quality by securing a space of a back chamber.

The present invention relates to a MEMS microphone, comprising a side wall and an upper wall, the lower side of which is an open case; A printed circuit board coupled to the lower side of the case; A MEMS chip provided on the printed circuit board and having a MEMS inner space; And at least one sound hole provided on one side of the case so as to allow external sound to flow therein, wherein the inside of the case forms an acoustic passage for communicating the sound hole with the MEMS inner space. The communication unit is provided, and the external sound introduced through the sound hole is configured to enter the internal space of the MEMS chip through the acoustic passage of the internal communication unit.

On the other hand, the internal communication unit, it is preferable that the first communication member is coupled to the sound hole and the second communication member is located below the MEMS chip.

The first communication member may be a rubber material having elasticity, the second communication member may be a circuit board material or a metal material, and the MEMS chip may be mounted on the second communication member.

On the other hand, the internal communication unit, the first communication member and the internal acoustic passage including the substrate, the first communication member, the sound passage in communication with the sound hole, the upper end is coupled to the sound hole and the lower end Is provided to be coupled to the circuit communication point of the upper side of the printed circuit board, the substrate inner acoustic passage, formed in the printed circuit board, the MEMS inner space and the circuit communication point is connected to each other, the sound hole It is also preferable that the external sound introduced through the through the acoustic passage of the first communication member and the substrate internal acoustic passage of the printed circuit board to enter the internal space of the MEMS.

In addition, the first communication member is preferably made of a rubber material having elasticity.

On the other hand, the sound hole is also preferably formed on the side wall.

According to the MEMS microphone of the present invention, since the internal communication portion includes an acoustic passage for communicating the internal space of the MEMS chip from the sound holes formed in the case, the back chamber can be increased to obtain an effect of improving the acoustic characteristics. .

In addition, according to the MEMS microphone of the present invention, it is possible to obtain the effect that the same kind of MEMS chip (memes transducer) applied to MEMS microphones having sound holes on a printed circuit board can be used.

1 is a schematic cross-sectional view of a conventional MEMS microphone,
2 is a schematic cross-sectional view of another conventional MEMS microphone,
3 is a schematic cross-sectional view of a MEMS microphone of one embodiment according to the present invention;
4 is a schematic cross-sectional view of a MEMS microphone of another embodiment according to the present invention;
5 is a schematic cross-sectional view of another embodiment of a MEMS microphone according to the present invention.

With respect to the MEMS microphone according to an embodiment of the present invention, with reference to Figure 3 will be described in detail.

MEMS microphone 1 of the present embodiment is a device for converting sound waves, such as voice, sound, sound, etc. into an electrical signal, mainly used in mobile phones, smart phones, small acoustic devices, etc., the case 10, the printed circuit board ( 20), the MEMS chip 30, the amplifier 40, the sound hole 50 and the internal communication unit 60 is configured to include.

In particular, the MEMS microphone 1 of the present invention relates to a type in which a sound hole into which sound is introduced from the outside is formed in a case, and is mainly used in a mobile communication terminal such as a mobile phone or a smartphone. However, the application is not limited to this, and it is possible to apply to all small-sized electronic apparatuses using a small-sized MEMS microphone.

The case 10 includes a side wall 12 and an upper wall 14. The lower side is open. In the case of this embodiment, the case 10 is open at the bottom and the upper wall 14 and the four side walls 12 are each rectangular. The lower end of the case 10 is fixed to the printed circuit board 20 by a conventional method, for example, a conventional method such as soldering or welding.

However, in the case of another embodiment, the overall shape of the case may be variously modified. That is, the case may have a cylindrical shape, or may have a columnar shape in which the cross section in the horizontal direction is elliptical or polygonal.

The printed circuit board 20 is coupled to the open lower side of the case 10. As the printed circuit board 20 is coupled, the inner space of the case is sealed except for the sound holes 50. The printed circuit board 20 is directly or indirectly mounted with electrical components such as the MEMS chip 30 and the amplifier 40. The printed circuit board 20 is also called a die (DIE) printed circuit board because various electric components are mounted.

The MEMS chip 30, also called a MEMS transducer, is provided on the printed circuit board 20. Herein, the term 'equipped with' means that the MEMS chip 30 is directly mounted on the printed circuit board or indirectly mounted on the printed circuit board through another member such as the second communication members 64 and 64a. It means. The MEMS chip 30 is the same kind as the MEMS chip used in the conventional MEMS microphones in which sound holes are formed in a printed circuit board.

An empty space is provided inside the lower portion of the MEMS chip 30, which is called the MEMS inner space 36.

On the other hand, the component indicated by 40 is an amplifier. The amplifier 40 receives and amplifies the electric signal received from the MEMS chip 30. The amplifier 40 is also called a special purpose semiconductor (ASIC) chip. Although not shown in detail, the MEMS chip 30 and the amplifier 40 are connected to each other by a conductor such as a gold bonding wire.

The sound hole 50 is formed through the upper wall 14 of the case 10. External sound is introduced into the case 10 through the sound hole 50. One sound hole 50 is provided in the present embodiment, but may be provided in two or more as necessary.

The internal communication unit 60 is provided inside the case 10 and forms acoustic passages 63 and 65. The sound paths 63 and 65 communicate the sound holes 50 and the MEMS inner space 36. Thus, the external sound introduced through the sound hole 50 enters the MEMS inner space 36 of the MEMS chip 30 through the sound paths 63 and 65 formed by the internal communication unit 60. By forming such an acoustic path, the back chamber space can be made into the space 16 inside the case 10 instead of the MEMS inner space 36, thereby improving the acoustic performance.

On the other hand, in the present embodiment, the internal communication unit 60 is composed of a first communication member 62 and a second communication member (64).

One end of the first communication member 62 is coupled to the sound hole 50. The other end of the lower portion is coupled to the second communication member 64. The MEMS chip 30 is mounted on the upper surface of the second communication member 64. MEMS chip 30 is configured to be electrically coupled to the printed circuit board (20). For this purpose, the second communication member 64 is preferably made of a circuit board material.

In another embodiment, the second communication member may be made of a metal material. The MEMS chip and the printed circuit board fixed to the upper surface of the second communication member may be electrically connected to each other through separate conductors. The second communication member 64 is located below the MEMS chip 30. In addition, the first communication member is made of a rubber material having elasticity.

The MEMS microphone 1 of this embodiment has the above-described structure and has the following actions and effects.

In the present embodiment, the sound paths 63 and 65 allow the external sound introduced through the sound hole 50 to be introduced into the MEMS inner space 36 of the MEMS chip 30 in the case 10. The internal communication part 60 to form is provided.

As a result, in the conventional case in which sound holes are formed in the case, the sound is not satisfied due to insufficient internal MEMS space being the back chamber, and the size of the back chamber becomes the entire internal space 16 of the case. This has the advantage of being improved.

Since the size of the back chamber is one of the factors directly affecting the acoustic characteristics, in the case of this embodiment, the back chamber is remarkably enlarged and the acoustic characteristics are remarkably improved, compared with the type of similar conventional MEMS microphone.

In addition, the conventional MEMS chip is different from the type used in the MEMS microphone of the type of sound holes formed on the printed circuit board, and the type used in the MEMS microphone of the type of sound holes formed in the case. The advantage is that the same type used for the MEMS microphones formed on the circuit board can be used as it is, that is, there is no need to distinguish two types of MEMS chips according to the types of MEMS microphones. What is necessary is just to provide it.

In addition, when the internal communication unit 60 is separated into first and second communication members 62 and 64 divided into upper and lower parts, the overall assemblability of the MEMS microphone is not significantly complicated as compared with the conventional type. That is, when the first communication member 62 is coupled to the case 10 and the second communication member 64 is mounted on the printed circuit board 20, and assembled together, the first communication member 62 can be easily assembled. Because of the internal communication unit 60 is to reduce the additional process or difficulty in the special assembly.

On the other hand, Figure 4 shows a MEMS microphone 1a of another embodiment according to the present invention. Compared to the embodiment illustrated in FIG. 3, in the case of the reference number to which 'a' is added, the same function as the configuration using the same reference number is performed.

The MEMS microphone 1a of this embodiment differs from the previous embodiment in that the sound hole 50 is formed in the side wall 12 instead of the upper wall. There is no restriction on the position at which the sound hole 50 is provided, and it is formed on one side of the side wall 12 as necessary.

Of the remaining configuration except for the position where the sound hole 50 is formed, the specific shape is slightly changed in comparison with the foregoing embodiment is a configuration related to the internal communication portion 60a.

In the present embodiment, the upper end portion of the first communication portion 62a constituting the internal communication portion 60a is coupled to the sound hole 50 formed in the side wall 12. The lower portion of the second communicating portion 64a coupled to the first communicating portion 64 is open as compared with the second communicating portion 64 of FIG. 3. However, when the second communication unit 64a is firmly mounted on the printed circuit board 20, the acoustic path 65a is formed.

Except for the specific shape of the position of the sound hole and the internal communication unit 60a, the remaining components are the same, and thus, further description thereof will be omitted.

The present embodiment in which the sound holes 50 are formed on the sidewalls may have all the advantages obtained by having an internal communication portion as compared with the previous embodiment, and additionally the following advantages may be provided by providing the sound holes on the sidewalls. have.

In recent years, electronic devices such as smartphones having a thin vertical thickness are often formed on the side of sound inlets, but the MEMS microphone 1a of the present embodiment is a surface facing the sound inlets formed on the side of the electronic device. Since the sound holes 50 are provided on the side walls 12, there is no need for a space for a separate sound path, so that space utilization is increased and the overall thickness of the smartphone can be made thinner than in the related art. .

Conventionally, an additional height is required in consideration of the sound path, but the present embodiment has an advantage that the formation of the sound path is possible even without this additional height.

In addition, since the MEMS microphone 1a of the present embodiment has sound holes only on the side walls and not on the upper side walls, the SMT (surface mount technology) pickup which vacuum-adsorbs the upper side walls prevents damage to internal parts that may occur due to the vacuum pressure. In addition, there is an advantage that can be prevented due to the inflow of foreign matters during cleaning.

In addition, the MEMS microphone 1a of the present embodiment has an advantage of preventing a process defect since interference with a tool is reduced in an SMT process.

On the other hand, Fig. 5 discloses a MEMS microphone 1b of yet another embodiment according to the present invention. Compared to the embodiment illustrated in FIG. 3, in the case of a reference number to which 'a' is added, unless otherwise described, a function similar to a configuration using the same reference number is performed.

Compared with the embodiment illustrated in FIG. 4, the MEMS microphone 1b of the present embodiment has the same position where the sound holes 50 are formed, but the specific shape of the internal communication unit 60b is somewhat different.

In the present embodiment, the internal communication portion 60b is composed of a first communication portion 62b and a substrate internal acoustic passage 65b. As shown in Fig. 5, the first communication part 62b is open at one side and is coupled to the side wall 120. The upper end of the first communication part 62b is connected to the sound hole 50. And its lower end is coupled to a circuit communication point 66b on the printed circuit board 20.

An acoustic path 61b in communication with the sound hole 50 is provided in the first communication member 62b. The upper end of the first communication member 62b is coupled to the sound hole 50, and the lower end thereof is coupled to the circuit communication point 66b of the upper side of the printed circuit board 20. The substrate internal acoustic passage 65b is formed inside the printed circuit board 20 and is formed such that the MEMS internal space 36 and the circuit communication point 66b are connected to each other.

In the present embodiment, the external sound introduced through the sound hole 50 is the internal space of the MEMS via the acoustic passage 61b of the first communication member 62b and the internal acoustic passage 65b of the printed circuit board 20. Configured to enter 36.

Except for the specific shape of the internal communication unit 60a, the remaining components are the same, and thus, further description thereof will be omitted.

On the other hand, the specific shape of the internal communication member, it is possible to be variously changed as long as it can guide the sound introduced through the sound hole into the MEMS inner space of the MEMS chip.

1, 1a, 1b ... MEMS microphone
10 ... case 12 ... side wall
14 ... upper wall 20 ... printed circuit board
30 ... MEMS Chip 40 ... Amplifier
50 ... side wall sound hole 60 ... internal communication member

Claims (6)

  1. delete
  2. A case having a side wall and an upper wall, the lower side of which is open;
    A printed circuit board coupled to the lower side of the case;
    A MEMS chip provided on the printed circuit board and having a MEMS inner space; And
    Is provided on one side of the case, at least one sound hole penetrated so that external sound can be introduced;
    Inside the case, an internal communication unit is formed to form an acoustic path for communicating the sound hole and the internal space of the MEMS, and the external sound introduced through the sound hole passes through the acoustic path of the internal communication part of the MEMS chip internal space. Configured to enter
    The internal communication unit, MEMS microphone, characterized in that the first communication member is coupled to the sound hole and a second communication member located below the MEMS chip.
  3. 3. The method of claim 2,
    The first communication member is a rubber material having elasticity,
    The second communication member is a circuit board material or metal material,
    The MEMS chip is a MEMS microphone, characterized in that mounted on the second communication member.
  4. A case having a side wall and an upper wall, the lower side of which is open;
    A printed circuit board coupled to the lower side of the case;
    A MEMS chip provided on the printed circuit board and having a MEMS inner space; And
    Is provided on one side of the case, at least one sound hole penetrated so that external sound can be introduced;
    Inside the case, an internal communication unit is formed to form an acoustic path for communicating the sound hole and the internal space of the MEMS, and the external sound introduced through the sound hole passes through the acoustic path of the internal communication part of the MEMS chip internal space. Configured to enter
    The internal communication unit is configured to include a first communication member and the substrate inner acoustic passage,
    The first communication member is provided with an acoustic passage communicating with the sound hole, an upper end of which is coupled to the sound hole, and a lower end of which is coupled to a circuit communication point of an upper side of the printed circuit board.
    The substrate internal acoustic passage is formed on the printed circuit board, and the MEMS internal space and the circuit communication point are connected to each other.
    And an external sound introduced through the sound hole enters the internal space of the MEMS via the acoustic passage of the first communication member and the internal acoustic passage of the printed circuit board.
  5. 5. The method of claim 4,
    The MEMS microphone, characterized in that the first communication member is made of a rubber material having elasticity.
  6. The method according to claim 2 or 4,
    MEMS microphone, characterized in that the sound hole is formed on the side wall.
KR20110127252A 2011-11-30 2011-11-30 Microphone KR101320573B1 (en)

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KR20110127252A KR101320573B1 (en) 2011-11-30 2011-11-30 Microphone
CN2012101919175A CN102790939A (en) 2011-11-30 2012-06-12 Microphone of microelectromechnical system
US13/494,336 US8750550B2 (en) 2011-11-30 2012-06-12 MEMS microphone

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KR20130060932A KR20130060932A (en) 2013-06-10
KR101320573B1 true KR101320573B1 (en) 2013-10-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101454325B1 (en) * 2013-08-07 2014-11-03 주식회사 비에스이 MEMS microphone

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140089768A (en) * 2013-01-07 2014-07-16 삼성전자주식회사 Electronic device with sensor for detecting external environment
JP2014158140A (en) * 2013-02-15 2014-08-28 Funai Electric Co Ltd Voice input device
CN104185099A (en) * 2013-05-28 2014-12-03 上海耐普微电子有限公司 Micromechanical microphone and electronic device containing same
KR101369464B1 (en) * 2013-06-27 2014-03-06 주식회사 비에스이 Microphone
US10154330B2 (en) 2013-07-03 2018-12-11 Harman International Industries, Incorporated Gradient micro-electro-mechanical systems (MEMS) microphone
CN103663352B (en) * 2013-12-30 2017-11-07 上海集成电路研发中心有限公司 A kind of MEMS microphone package structure and method for packing
DE102014105849B3 (en) * 2014-04-25 2015-09-17 Epcos Ag Microphone with increased back volume and method of manufacture
US10499161B2 (en) * 2014-06-23 2019-12-03 Tdk Corporation Microphone and method of manufacturing a microphone
US9955246B2 (en) * 2014-07-03 2018-04-24 Harman International Industries, Incorporated Gradient micro-electro-mechanical systems (MEMS) microphone with varying height assemblies
US20160071506A1 (en) * 2014-09-09 2016-03-10 Knowles Electronics, Llc Acoustic Interface Assembly With Porous Material
CN106716095A (en) * 2014-09-19 2017-05-24 株式会社村田制作所 Pressure sensor module
KR101619253B1 (en) 2014-11-26 2016-05-10 현대자동차 주식회사 Microphone and method manufacturing the same
CN107258089A (en) * 2014-12-23 2017-10-17 思睿逻辑国际半导体有限公司 MEMS transducer packaging part
KR20170112567A (en) * 2016-03-31 2017-10-12 엘지이노텍 주식회사 Composite sensor package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080005779U (en) * 2007-05-26 2008-12-01 고어텍 인크 Silicon condenser microphone
KR20080005778U (en) * 2007-05-26 2008-12-01 고어텍 인크 Silicon microphone having dust prevention sound hole

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1886008B (en) * 2005-06-23 2011-12-07 歌尔声学股份有限公司 Long channel silicon microphone
KR100797443B1 (en) 2006-07-10 2008-01-23 주식회사 비에스이 Packging structure of mems microphone
CN201169537Y (en) * 2008-01-28 2008-12-24 菱生精密工业股份有限公司 Micro-electromechanical microphone encapsulation structure
CN201207730Y (en) * 2008-03-01 2009-03-11 歌尔声学股份有限公司 Ultra-thin miniature microphone
DE102008053327A1 (en) * 2008-10-27 2010-04-29 Epcos Ag Microphone arrangement for use in communication technology, has cased microphone, and acoustic channel connecting sound entry opening and environment above interconnect device on side of interconnect device
CN201323652Y (en) * 2008-12-13 2009-10-07 歌尔声学股份有限公司 Silicon condenser microphone
CN101478710B (en) * 2009-01-17 2012-10-17 歌尔声学股份有限公司 Silicon capacitor microphone
WO2010095203A1 (en) * 2009-02-17 2010-08-26 株式会社 村田製作所 Acoustic transducer unit
EP2381698A1 (en) * 2010-04-21 2011-10-26 Nxp B.V. Microphone
WO2011132009A2 (en) * 2010-04-23 2011-10-27 Nyiradi Laszlo Driving indicator with led integrated in bracelet for cyclists and motor-cyclists

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080005779U (en) * 2007-05-26 2008-12-01 고어텍 인크 Silicon condenser microphone
KR20080005778U (en) * 2007-05-26 2008-12-01 고어텍 인크 Silicon microphone having dust prevention sound hole

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101454325B1 (en) * 2013-08-07 2014-11-03 주식회사 비에스이 MEMS microphone

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CN102790939A (en) 2012-11-21
KR20130060932A (en) 2013-06-10
US8750550B2 (en) 2014-06-10

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