CN102316402A

CN102316402A - Microphone

Info

Publication number: CN102316402A
Application number: CN2011101302467A
Authority: CN
Inventors: 李相镐; 愖鄘贤; 许亨龙
Original assignee: DONGGUAN BAOXING ELECTRONICS Co Ltd; RONGCHENG BAOXING ELECTRONIC CO Ltd; TIANJIN BSE ELECTRONICS CO Ltd; BO SUNG ELECTRICS Co Ltd
Current assignee: DONGGUAN BAOXING ELECTRONICS Co Ltd; RONGCHENG BAOXING ELECTRONIC CO Ltd; TIANJIN BSE ELECTRONICS CO Ltd; BO SUNG ELECTRICS Co Ltd; BSE Co Ltd
Priority date: 2010-07-09
Filing date: 2011-05-19
Publication date: 2012-01-11
Also published as: KR20120005768A; TW201208394A; WO2012005434A3; CN202135313U; WO2012005434A2; KR101130335B1

Abstract

The present invention relates to microphone, it is characterized in that, comprising: the housing that is formed with outside sound hole; The 1st tellite, it combines with the inside of said housing, is formed with the sound hole, inside that is communicated with said outside sound hole; Chip of micro-electro-mechanical system, it is installed on the medial surface of said the 1st tellite, and is positioned at the position that is formed with said inner sound hole; The 2nd tellite, it is formed with a plurality of splicing ears to combine with the inside of said housing with mode that said the 1st tellite separates configuration on its lateral surface; A plurality of conductive connecting member, it is electrically connected said the 1st tellite and the 2nd tellite; And separating support unit, it is arranged between said the 1st tellite and the 2nd tellite, so that the 1st tellite and the 2nd tellite are supported to keep state at interval each other.

Description

Microphone

Technical field

The present invention relates to microphone, more specifically, relate to and possess two tellites, and between two tellites, possess the support unit of separating, thus the microphone of the simplification of implementation structure when improving acoustic characteristic.

Background technology

Usually, the Electret Condencer Microphone that is widely used in mobile communication terminal or audio system etc. by biased element, form and a pair of diaphragm/back-plate of the capacitor C that acoustic pressure (sound pressure) changes accordingly and the junction field effect transistor (JFET) that is used for buffer output signal constitute.The Electret Condencer Microphone of this traditional approach constitutes through following mode.In a housing, embed successively after oscillating plate, gasket ring, dead ring, backboard, the energising ring, put into the tellite that circuit block is installed at last, then with the end portion of housing to the bending of tellite side, thereby accomplish an assembly.

In recent years, as the technology of integrated tiny device on microphone and be suitable for the semiconductor processing technology of utilizing microfabrication.In this technology that is called MEMS (MEMS:Micro Electro Mechanical System); Used the particularly Micrometer-Nanometer Processing Technology of integrated circuit technique of semiconductor process through utilization, can produce with μ m is miniature transducer or the actuator and the electric mechanical structure of unit.The MEMS chip microphone of utilizing such Micrometer-Nanometer Processing Technology and making has following advantage: through the ultraprecise microfabrication; With traditional microphone assembly miniaturization, high performance, multifunctions, integrated such as in the past oscillating plate, gasket ring, dead ring, backboard, energising rings, thereby can improve stability and reliability.

Fig. 1 is the profile of an example of diagrammatically representing to utilize the silica-based condenser microphone in the past 100 of MEMS (MEMS) chip 120.Silica-based condenser microphone 100 is by constituting like lower component: tellite 110, be installed in chip of micro-electro-mechanical system 120 on the tellite 110, be called the amplifier 130 of specific purposes N-type semiconductor N (ASIC) chip again; And the housing 150 that forms sound hole 140.

Said chip of micro-electro-mechanical system 120 is following structure: utilize micro electro mechanical system (MEMS) technology, on silicon chip, form after the backboard 121, be formed with diaphragm 123 across pad 122.On backboard 121, form sound hole 124.

In MEMS condenser microphone shown in Figure 1 100, have hole 140 on housing top, on the single tellite of bottom, chip of micro-electro-mechanical system 120 is installed.Though do not illustrate, have at the downside of tellite and be used for the splicing ear that is electrically connected with external device (ED).

In this case, sound external is incorporated into the sound hole 140 that is formed at housing 150 and makes diaphragm 123 vibrate, and exactly carry on the back chamber (back chmber:126) space by the inner space of the chip of micro-electro-mechanical system of Reference numeral 126 expressions this moment.Back of the body cavity space is meant, is benchmark with the diaphragm, the space of the opposition side of a side of introducing external audio.

Promptly; Microphone 100 as shown in Figure 1; Installing on the substrate 110 under the situation of chip of micro-electro-mechanical system 120; The vibrating membrane 123 of chip of micro-electro-mechanical system is introduced and be communicated to external audio through sound hole 140, and be exactly to carry on the back cavity space in the space that opposition side limited 126 of the vibrating membrane of being passed on external audio at this moment.

Have only the space of fully having guaranteed back of the body chamber just can guarantee the overall performance of microphone, but, therefore be difficult to guarantee the fully space in the back of the body chamber of size in this case because the size of chip of micro-electro-mechanical system 120 is very little.Thus, the problem that has the tonequality decline of microphone.And this problem is that the structure that on housing, possesses hole causes because all parts that comprise chip of micro-electro-mechanical system are installed on a substrate.

Summary of the invention

The present invention puts in view of the above problems and researches and develops; The object of the present invention is to provide a kind of following microphone: possess two tellites in order fully to guarantee to carry on the back the space in chamber; Between these two tellites, possesses the support unit of separating; Chip of micro-electro-mechanical system is installed on the tellite near the sound hole, thereby possesses high-level acoustic characteristic when can assemble easily.

Microphone of the present invention comprises: the housing that is formed with outside sound hole; The 1st tellite, it combines with the inside of said housing, is formed with the sound hole, inside that is communicated with said outside sound hole; Chip of micro-electro-mechanical system (MEMSChip), it is installed on the medial surface of said the 1st tellite, and is positioned at the position that is formed with said inner sound hole; The 2nd tellite, it is formed with a plurality of splicing ears to combine with the inside of said housing with mode that said the 1st tellite separates on its lateral surface; A plurality of conductive connecting member, it is electrically connected said the 1st tellite and the 2nd tellite; And separating support unit, it is arranged between said the 1st tellite and the 2nd tellite, so that the 1st tellite and the 2nd tellite are supported under the state that keeps interval to each other.

In addition, preferably, saidly separate the edge part that support unit comprises the inner space of up/down perforation and forms this inner space.

In addition, preferably, the said support unit that separates has the incorporating section, and this incorporating section is used to take in each said conductive connecting member.

In addition, preferably, saidly separate the edge part that support unit comprises the inner space of up/down perforation and forms this inner space, said incorporating section is positioned at the corner of said edge part.

In addition, preferably, said conductive connecting member is the conductivity spring of coil shape.

In addition, preferably, said conductive connecting member is a column.

In addition, preferably, said conductive connecting member has elasticity.

In addition, preferably, the lateral surface of said conductive connecting member is to carry out plated film by the material with conduction property to form.

In addition; Preferably; One side of said housing is open; Said outside sound hole is formed at the another side of said housing, said the 1st tellite, separates support unit and the 2nd tellite stacks gradually the inside in said housing, the lateral ends direction bending to the inside of extending towards a side from said another side and will be laminated in its inner said the 1st tellite, separate the inside that support unit and the 2nd tellite are fixed in housing; Said conductive connecting member has elasticity, and under the state of strain, combines.

According to microphone of the present invention, owing to possess two tellites, between these two tellites, possess the support unit of separating, possess high-level acoustic characteristic when therefore can assemble easily.

In addition, can with between two tellites by separating space that support unit guarantees as back of the body cavity space, thereby can improve the acoustic characteristic of microphone.

In addition, owing between two tellites, possess the support unit of separating, therefore can adjust back of the body cavity space easily.

In addition, possessing under the situation of conductive connecting member, can realize two electrical connections between the tellite easily.

Description of drawings

Fig. 1 is the diagrammatical profile of microphone in the past.

Fig. 2 is the stereogram according to the microphone of one embodiment of the invention.

Fig. 3 is the exploded perspective view of the microphone of Fig. 2.

Fig. 4 is the stereogram when seeing the microphone of Fig. 2 from the below.

Fig. 5 is the exploded view when seeing the microphone of Fig. 2 from the below.

Fig. 6 is the diagrammatical profile of the microphone of Fig. 2.

Symbol description

1 microphone; 10 housings; 12 outside holes; 20 the 1st tellites; 22 inner holes; 24 audio paths; 30 chip of micro-electro-mechanical system; 40 the 2nd tellites; 42 splicing ears; 50 conductive connecting member; 60 separate support unit; 70 amplifiers

Embodiment

Below, with reference to Fig. 2 to Fig. 6, specify microphone according to one embodiment of the invention.

The microphone 1 of present embodiment comprises as the device that sound waves such as voice, audio frequency, sound is converted into the signal of telecommunication: housing the 10, the 1st tellite 20, chip of micro-electro-mechanical system the 30, the 2nd tellite 40, conductive connecting member 50 and separate support unit 60.Microphone 1 mainly is used in personal mobile communication terminals such as portable phone, PDA, 3G mobile.

Said housing 10 constitutes the external shape of microphone 1.Portion is equipped with various parts required when operating within it.One side of housing 10 is open, and 11 are formed with outside sound hole 12 in the another side.Outside sound hole 12 forms with the mode that connects, and outside thus audio frequency is incorporated into enclosure interior.

Under the situation of present embodiment, housing 10 is that each face forms straight dimetric hexahedron.But under the situation of other embodiment, the global shape of housing can carry out various distortion.That is, housing can be a drum, and the section that also can be horizontal direction is oval-shaped column.

Housing 10 possesses from the another side 11 and extends downwards and 4 sides 14 forming.Has curled portion 16 in the bottom of each side 14.Like Fig. 3 and shown in Figure 5, be positioned under the state on the plane identical in curled portion 16 with the side, after enclosure interior embeds miscellaneous part, be like Fig. 4 and shape shown in Figure 6 with curled portion 16 folding (curling), thus the fixing internal parts.

Under the situation of present embodiment, accomplish the fixing and assembling of internal part through the curled portion 16 of the side lower end of curling.Therefore, need not to be used for the fixing means of independent bonding agent and so on fixing between the internal part.

Particularly, under the situation of present embodiment,, therefore between the 1st tellite 20 and the 2nd tellite 40, realize firm being electrically connected and fixing under the state of strain because conductive connecting member 50 has elasticity, and combines.

Housing 10 constitutes by having electric conducting material such as nickel, copper, aluminium or their alloy that excellent noise cuts off characteristic.

Said the 1st tellite 20 combines with the inboard of the another side 11 of housing 10.The 1st tellite 20 is a benchmark with the direction of Fig. 2 and Fig. 4, and electronic units such as chip of micro-electro-mechanical system 30 and amplifier 70 are installed at its downside.Owing to various electronic units are installed on the 1st tellite 20, therefore the 1st tellite 20 are called tellite mould (DIE) again.

In addition, under the situation of other embodiment, can be as required and with the 1st tellite from the another side partition distance of housing and fix.In this case, can between the another side of the 1st tellite and housing, possess the separate structures that is used to keep the interval, perhaps also can possess protuberance at the inwall of housing.

On the 1st tellite 20, be formed with the outside sound hole 12 of housing 10 and be communicated with the sound hole, inside 22 of (be connected and leading to state) with the mode that connects.

Under the situation of present embodiment, as shown in Figure 6, outside sound hole 12 and inner sound hole 22 constitute with discontiguous mode each other.That is, outside sound hole 12 and inner sound hole 22 dispose with the mode that staggers each other.Therefore, the external audio of introducing through outside sound hole 12 is conveyed to chip of micro-electro-mechanical system 30 through being formed at after the audio path 24 between housing 10 and the 1st tellite through hole 22, inside.But under the situation of other embodiment, outside sound hole 12 also can constitute with the mode that contacts with each other with inner sound hole 22.

With reference to Fig. 3, under the situation of present embodiment, has copper coating 26 at the lateral surface of the 1st tellite 20.The mid portion of coating 26 is corroded away and forms audio path 24.

In addition, under the situation of other embodiment,, can or highly carry out various distortion to length, direction, the shape of audio path according to user's needs.In addition, about forming the mode of audio path, the mode that forms except the corrosion copper layer of present embodiment, can also utilize modes such as cutting, metal mold, injection moulding.

In addition, audio path is not limited to as present embodiment, be formed on the 1st tellite, as long as can be communicated with outside sound hole and inner sound hole, then both can be formed on the housing, also can after both sides form respectively, be bonded to each other and constitutes.

Said chip of micro-electro-mechanical system 30 is installed in the medial surface of the 1st tellite.At this, so-called medial surface is meant, 62 the face towards the inner space.Chip of micro-electro-mechanical system 30 disposes with inner sound hole 22 relatively.So-called configuration relatively is meant that chip of micro-electro-mechanical system 30 comprises the part that is formed with inner sound hole 22 and is installed on the substrate, so that chip of micro-electro-mechanical system 30 can receive the audio signal of introducing through inner sound hole 22.

Chip of micro-electro-mechanical system 30 plays and converts the audio signal that receives into action of electric signals.As described in the background technology, chip of micro-electro-mechanical system 30 involving vibrations films, pad, backboard etc. and constitute.In addition, when the medial surface of the 1st tellite 20 is equipped with chip of micro-electro-mechanical system 30, amplifier 70 is installed also.

Amplifier 70 plays the effect that reception is amplified by the signal of telecommunication of chip of micro-electro-mechanical system 30 generations.Amplifier 70 specific purposes N-type semiconductor N (ASIC) chip that is otherwise known as.In addition, under the situation of other embodiment, can as required amplifier 70 be installed on the 2nd tellite 20.

Said the 2nd tellite 40 combines with a side of the opening of housing 10.Through combining with the face of the opening of housing 10, thus with the housing 10 common inner spaces 62 that limit.The 2nd tellite 40 and the 1st tellite 20 partition distance and dispose.

On the lateral surface of the 2nd tellite 40, have a plurality of splicing ears 42.In the present embodiment, splicing ear 42 has 4 altogether.Splicing ear terminal or the liner (pad) of continuing that be otherwise known as.The 2nd tellite 40 is called the liner tellite again.Splicing ear 42 is electrically connected with inner chip of micro-electro-mechanical system 30 and amplifier 70 and plays the effect that is connected with external device (ED).The quantity of splicing ear 42 can increase and decrease as required, and also can change allocation position as required.

In addition, the 1st tellite and the 2nd tellite both can be processed by hard general material, also can be processed by the flexibility material.

And the quantity of said conductive connecting member 50 is a plurality of, and this conductive connecting member 50 plays the effect with the

1st tellite

20 and 40 electrical connections of the 2nd tellite.

In the present embodiment, conductive connecting member 50 is provided with 4 altogether with the mode that is provided with in each bight.Each conductive connecting member 50 is the springs that the conductive metal line are bent into coil shape.Owing to constitute spring,, also can realize being electrically connected between the 1st tellite 20 and the 2nd tellite 40 even therefore assembling tolerance is accurate inadequately simple and reliablely.

In addition; Under the situation of other embodiment; Conductive connecting member on shape and the material etc. except the spring shape that the conductive metal wire bending is constituted, in the scope that the 1st tellite and the 2nd tellite are electrically connected, can carry out various distortion.

That is, it must be metal that conductive connecting member 50 need not on its material, also can be conductivity silicon, perhaps also can constitute external shape by non-conductive material, and on its lateral surface, constitutes coating through method such as gold-plated.In addition, conductive connecting member can be simple cylindrical shape or pin shape at it in shape, rather than spring.

Form in conductive connecting member under the situation of pin shape; The 1st tellite and the 2nd tellite have the slot part at the both ends that can fix this conductive connecting member respectively; Thereby under the situation of the assistance that does not have other structures, also can conductive connecting member directly be fixed to the 1st tellite and the 2nd tellite.

In addition, the said support unit 60 that separates is between the 1st tellite 20 and the 2nd tellite 40, and this separates support unit 60 and supports the 1st tellite 20 and the 2nd tellite 40 with the mode that keeps interval to each other.

Can know with reference to Fig. 3 and Fig. 5, separate support unit 60 and form dimetric frame shape, so that corresponding with the shape of the 1st tellite 20 and the 2nd tellite 40.The mid portion that separates support unit 60 is empty, thus with the 1st tellite 20 and the 2nd tellite 40 common inner spaces 62 that limit.And, are profile portion 64 around the part of inner space 62.Separate support unit 60 and have the corresponding width of distance that separates each other with the 1st tellite 20 and the 2nd tellite 40.

Separate support unit 60 and have incorporating section 66, each in a plurality of conductive connecting member 50 is taken in and supported in this incorporating section 66.Incorporating section 66 be the part of side by open drum, the conductive connecting member 50 of spring shape can not break away to horizontal direction after above-below direction combines simply thus.

And incorporating section 66 is so that (or bight) is provided with one mode and disposes 4 altogether in the every nook and cranny.The conductive connecting member 50 of spring shape is sandwiched after the incorporating section 66, it is embedded in the housing with miscellaneous part, curled portion 16 is curled then can accomplish the assemblings of microphone 1 simply then.In addition; Under the situation of other embodiment, the incorporating section can not be formed on the corner, and is formed on other parts; For example can be formed on mid portion; Also can be formed on mid portion rather than be formed on the bight, also can a part be formed on the corner, and a remaining part be formed on mid portion along peripheral part.

In addition, in the present embodiment, separate support unit 60 and form quadrangle on the whole, and can carry out various distortion in other embodiments.That is, can form circle, the polygonal beyond the quadrangle on the whole, shapes such as ellipse.

In addition, in the present embodiment, inner space 62 becomes back of the body cavity space.Promptly; Back of the body chamber representes that the diaphragm structure with chip of micro-electro-mechanical system 30 is a benchmark, the space of the opposition side of the side that external audio is passed on, therefore in the present embodiment; To install under the situation of chip of micro-electro-mechanical system 30 with inner sound hole 22 relative modes; When the diaphragm that is had with chip of micro-electro-mechanical system 30 was benchmark, inner space 62 was positioned at the opposition side of the side that external audio passes on, thereby inner space 62 becomes back of the body chamber.

Therefore, as long as the volume of thickness that adjustment separates support unit 60 and profile portion 64 just can be adjusted the size and the shape in the space of carrying on the back the chamber.

Below, the effect and the effect of the microphone 1 of one embodiment of the invention of possessing said structure described.

Has the support unit of separating 60 between the 1st tellite 20 that the microphone 1 of present embodiment disposes separating each other distance and the 2nd tellite 40; And sound hole, the inside 22 relative modes with the 1st tellite 20 possess chip of micro-electro-mechanical system 30, therefore can the inner space that be formed between the 1st tellite 20 and the 2nd tellite 40 be used as back of the body cavity space.Therefore, can fully guarantee to carry on the back the space in chamber according to the present invention, its result can improve the acoustic characteristic of microphone.

In addition, separate thickness and the shape of support unit 60 through adjustment and can easily adjust the size and the shape of back of the body cavity space.

In addition, through separating support unit 60, can be with the 1st tellite 20 and the 2nd tellite 40 fixing in stable conditionly with the distance that separates each other.In addition, separating under the situation that support unit 60 possesses incorporating section 66, can be simply and assemble conductive connecting member 50 securely.

In addition, because the chip of micro-electro-mechanical system 120 that is used in the microphone in the past 100 shown in Figure 1 is in formation sound hole on the housing and is installed to the type on the substrate that therefore needing within it, portion possesses back of the body cavity space.This chip of micro-electro-mechanical system 120 is different with the structure that is used on substrate formation sound hole and the chip of micro-electro-mechanical system in the microphone (not shown) of chip of micro-electro-mechanical system is installed in this hole.That is, according to the difference of allocation position in the sound hole of microphone, the structure of employed chip of micro-electro-mechanical system is also different.

But; Under the situation of present embodiment; Utilize the substrate of two separation, and between these two substrates, possess the support unit of separating, chip of micro-electro-mechanical system is set near the outside sound hole that is formed at housing; Therefore the space in chamber can be fully guaranteed to carry on the back, thereby the chip of micro-electro-mechanical system of the chip of micro-electro-mechanical system same structure in the microphone of the type in formation sound hole on substrate can be used and be used in.

In addition; Under the situation of present embodiment; The outside sound hole 12 that is formed at housing 10 does not contact each other with the sound hole, inside 22 that is formed at the 1st tellite 20 and forms with staggering; And outside sound hole 12 is communicated with through audio path 24 with inner sound hole 22, therefore can be with audio path 24 variations.

In addition, owing to outside sound hole 12 does not contact configuration each other with inner sound hole 22 with staggering, can prevent that therefore electronic units such as inner chip of micro-electro-mechanical system or amplifier are directly exposed to outside various light, for example visible rays, ultraviolet ray, infrared ray etc.

And above-mentioned advantage can obtain confirming through test.Promptly; Under the condition of 50Hz; Light sensitivity (light sensitivity) to the microphone 1 of microphone in the past 100 and present embodiment is tested; Its result obtained under the situation of in the past microphone-value of 44.9dB, under the situation of the microphone of present embodiment, obtained-value of 63.6dB.

In addition, tellite is used physically being divided into two substrates, therefore can use the tellite of single layer structure respectively, rather than use the integrated tellite that is combined into sandwich construction.Therefore, the manufacturing of tellite is simple, compares with situation in the past, can cost saving.

In addition, Fig. 7 and Fig. 8 represent the result data that the acoustic characteristic to microphone of present embodiment 1 and microphone in the past 100 shown in Figure 1 experimentizes.Can know that from the high pitch record on the right side of each chart the microphone 1 of present embodiment is compared the space of fully having guaranteed back of the body chamber with microphone in the past, significantly improved acoustic characteristic thus.

In addition, in the microphone 1 of present embodiment, be that example is illustrated between the 1st tellite and the 2nd tellite, to possess the support unit of separating, but the invention is not restricted to this.That is, also can not possess the support unit of separating, but only utilize conductive connecting member the 1st tellite and the 2nd tellite to be remained the state of the distance that separates each other.

In addition, in the microphone 10 of present embodiment, be that example is illustrated with outside sound hole with the discontiguous each other situation in inner sound hole, but the invention is not restricted to this.That is, also can form, and in the embodiment of this structure, can obtain except not contacting other all effects the effect that obtains each other because of two sound holes with outside sound hole and the mode that inner sound hole contacts with each other.

Claims

1. a microphone is characterized in that, this microphone comprises:

Be formed with the housing in outside sound hole;

The 1st tellite, it combines with the inside of said housing, is formed with the sound hole, inside that is communicated with said outside sound hole;

Chip of micro-electro-mechanical system, it is installed on the medial surface of said the 1st tellite, and is positioned at the position that is formed with said inner sound hole;

The 2nd tellite, it is formed with a plurality of splicing ears to combine with the inside of said housing with mode that said the 1st tellite separates on its lateral surface;

A plurality of conductive connecting member, it is electrically connected said the 1st tellite and the 2nd tellite; And

Separate support unit, it is arranged between said the 1st tellite and the 2nd tellite, so that the 1st tellite and the 2nd tellite are supported under the state that keeps interval to each other.

2. microphone according to claim 1 is characterized in that,

Saidly separate the edge part that support unit comprises the inner space of up/down perforation and forms this inner space.

3. microphone according to claim 1 is characterized in that,

The said support unit that separates has the incorporating section, and this incorporating section is used to take in each said conductive connecting member.

4. microphone according to claim 3 is characterized in that,

Saidly separate the edge part that support unit comprises the inner space of up/down perforation and forms this inner space,

Said incorporating section is positioned at the corner of said edge part.

5. microphone according to claim 1 is characterized in that,

Said conductive connecting member is the conductivity spring of coil shape.

6. microphone according to claim 1 is characterized in that,

Said conductive connecting member is a column.

7. microphone according to claim 1 is characterized in that,

Said conductive connecting member has elasticity.

8. microphone according to claim 1 is characterized in that,

The lateral surface of said conductive connecting member is to carry out plated film by the material with conduction property to form.

9. microphone according to claim 1 is characterized in that,

One side of said housing is open,

Said outside sound hole is formed at the another side of said housing,

Said the 1st tellite, separate support unit and the 2nd tellite stacks gradually the inside in said housing,

The lateral ends direction bending to the inside of extending towards a side and will be laminated in its inner said the 1st tellite, separate the inside that support unit and the 2nd tellite are fixed in housing from said another side,

Said conductive connecting member has elasticity, and under the state of strain, combines.