201216726 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種麥克風，更具體而言，尤指一種藉 由具備可防止透過聲孔的光直接到達微機電系統晶片之音 頻路徑，而能夠提高音頻特性的麥克風。 【先前技術】 通常，廣泛使用於移動通信終端機或音頻系統等的電 容式麥克風，由偏壓元件、形成與聲壓對應地發生變化的 電容c之一對膜片/背板、以及用於缓衝輸出信號的結型場 效應電晶體（JFET)構成。這種傳統方式的電容式麥克風是 透過以下方式構成的。在一個殼體内依序嵌入振動板、墊 片環、絕緣環、背板、通電環之後，最後放入安裝有電路 部件的印刷電路基板，然後將殼體的末端部分向印刷電路 基板側折彎，進而完成一個組裝體。 近年來，在麥克風上整合小型裝置的技術，係利用微 細加工的半導體加工技術。在稱作微機電系統（MEMS : Micro Electro Mechanical System)的這種技術中，透過應 用半導體程序5特別是積體電路技術的微細加工技術’能 夠製造出以μιη為單位的超小型感測器或致動器及電子機 械構造物。利用這樣的微細加工技術而製造的具有微機電 系統晶片的麥克風具有以下優點：通過超精密微細加工， 將以往的振動板、墊片環、絕緣環、背板、通電環等傳統 的麥克風部件小型化、高性能化、多功能化、整合化，進 201216726 而能夠提高穩定性及可靠性。 第1圖是概略性地表示利用微機電系統（MEMS)晶 片120之習知的石夕電容式麥克風1〇〇的一示範例之剖面 圖。石夕電容式麥克風_由以下料構成：印刷電路基板 110、安裝在印刷電路基板110上的微機電系統晶片12〇、 稱作特殊目的型半導體（ASIC)晶片的放大器130;以及 形成有聲孔140的殼體150。 在第1圖所示㈣電容式麥克風議巾，在殼體上部 具有聲孔M0,在位於下料印刷電路基板上安裝有微機電 系統晶片no。在印刷電路基板11G的下侧面具有與外部裝 置進行電連接的連接端子。外部的聲音引入到形成於殼體 150上的聲孔14〇中而傳達到微機電系統晶片⑽，並轉換 為電彳5號，該電信號被傳達到放大器13〇而被放大。 但是，在這種習知的麥克風100之情況下，由於形成 為聲孔140貫通殼體的上部結才冓，因此存在諸多問題。 即，除了音頻之外，可視光線、紅外線、紫外線等光 也透過聲孔140練外部傳達職機電祕晶片12〇和放 大器130。如果各種光到達微機電系統晶片或放大器，則光 雜訊增大，對性能產生不良的影響。 另外’由於貫通殼體的聲孔而未形成音頻路徑，因此 不能保持高毅段m即，由料能形成所預料的 曰頻路傻’因此難以進行高頻波段的調整，從而在音頻特 性上存在問題。 另外，第2圖表示利用微機電系統晶片220的另一態 ⑧ 4 201216726 樣的石夕電容式麥克風200的剖面圖。麥克風200 ★丄 由印刷 電路基板210、女裝於印刷電路基板21〇的微機電系繞曰 220、放大器130及殼體250構成。麥克風2〇〇 明片 耳r子L 240 形成在印刷電路基板210上，而不是形成在殼體上。 的聲音引入形成於基板210上的聲孔24〇中 外 電系統晶片220。 中而傳達到微機 雖然這種結構的麥克風與之前說明習知的麥克風 之結構稍稍不同，但是仍然有可能除了音頻之外的可彳100 線、紅外線、紫外線等光透過聲孔24〇而從外部傳、光 機電系統晶片220,並且由於未形成有音頻路徑 」微 調整高頻波段。 【發明内容】 本發明是鐾於上述的問題而進行研發，本發 在於提供這樣的麥克風：透過具備防止外部㈣直、 到内部之音頻路徑，進而能夠切斷光雜訊的發生。丨入 本發明的目的在於提供一種透過具備音頻路 音頻特性的高標準麥克風。 改善 本發明麥克風的特徵包括：殼體’其一 電路基板，其安裝於該殼體的内部；微機電系統晶片，p= 電:=上;以及放大器’其與該微_ 、、先曰曰片電連接’並4於該印刷電路基板上， 備使外部音傳達__電祕“的音齡彳i，該立頻 路徑彎曲地形成’錢該微機電系统晶片與放大器不二接 5 201216726 暴露在外部空間。 另外，較佳地，在該殼體上有外部聲孔，該印刷電路 基板由第一印刷電路基板和第二印刷電路基板構成，該第 一印刷電路基板與該殼體的另一側結合，並形成有與該外 部聲孔連通的内部聲孔，該第二印刷電路基板與該殼體的 一側結合，並且與該第一印刷電路基板隔開配置，在該第 二印刷電路基板的外侧面形成有多個連接端子，該微機電 系統晶片與該内部聲孔以相對配置的方式安裝於該第一印 刷電路基板的内側面，該外部聲孔與該内部聲孔彼此不接 觸，該音頻路徑形成於該殼體的另一側面與該第一印刷電 路基板之間的空間，包括以該外部聲孔與該内部聲孔彼此 連接的方式形成的空間。 另外，較佳地，該第一印刷電路基板與該殼體的另一 侧面緊密結合，在緊密結合於該殼體的另一側面的第一印 刷電路基板的外侧面具備鍍層，該音頻路徑包括該第一印 刷電路基板的外側面的鍍層的一部分被腐蝕而形成的内部 路徑空間。 另外，該内部路徑空間可沿著直線或曲線而形成。 另外，較佳地，該印刷電路基板與該殼體的一側結合， 在該印刷電路基板上具備外部聲孔、基板内部路徑空間及 内部聲孔，該外部聲孔是以與外部空間相接觸的方式形成 於該印刷電路基板的外侧面的槽，該内部聲孔是以與該殼 體的内部空間接觸的方式形成的槽，該基板内部路徑空間 是以將該外部聲孔與内部聲孔連通的方式形成於該印刷電 201216726 路基板的内部的空間。 JK,丨φ另外，較佳地，該印刷電路基板包括至少一個雙面印 ^ . 該外部聲孔形成於接觸到該印刷電路基板外 π * Μ 該内部聲孔形成於接觸到該印刷電路基板内 雷狹其把/層，該基板内部路徑空間形成在位於該印刷 電路基板中間的至少一個中間層。 線而佳地，該基板内部路徑空間可沿著直線或曲 根據本發明 接暴露在由聲孔 的麥克風，能夠防止微機電系統晶片等直 引入的光中。 根據本發明的麥克風， 得到高標準的音頻特性。 透過具備音頻路控，進而能夠 【實施方式】 乂下參照第3圖至第6圖’詳細說明根據本發明的 —實施例的麥克風。 本實施例的麥克風1作為將語音、音頻、聲音等聲波 轉換為電彳&说的裝置’包括··殼體10、印刷電路基板、微 機電系統晶片30、放大器50及音頻路徑6〇。 該殼體10構成麥克風的外形。在其内部安裝有各種部 件。殼體10的一側面開放’在另一側面11形成有外部聲 孔12。外部聲孔12以貫通的方式形成，從而將外部的音頻 引入到殼體内部。 在本實施例的情況下’殼體1〇是各面形成為矩形的六 201216726 面體。但是，在其他實施例的情況下，殼體的整體形狀可 進行各種變形。即，殼體可以是圓筒形狀，也可以是水平 方向的剖面為擴圓形的柱狀。 殼體10具備從另一側面11向下方延伸而形成四個側 面14。在各侧面14的下端部具有捲曲部16。在第4圖和 第6圖所示的狀態下，將圖式的其他部件喪入殼體内部之 後’將捲曲部16捲曲如第5圖所示的形狀，進而固定内部 部件。 在本實施例的情況下，通過捲曲殼體側面下端的捲曲 部Μ而完成内部部件的固定及組裝。因此，無需單獨地使 用黏接劑之類的固定手段將内部部件之間進行固定。 殼體10由具有優異地雜訊切斷特性的鎳、銅、鋁等導 電材料或它們的合金構成。 在本實施例的情況下，該印刷電路基板由第一印刷電 路基板20及第二印刷電路基板40構成。但是’在其他實 施例的情況下，印刷電路基板可以不分為兩個，也可以形 成為一個。 該第一印刷電路基板20與殼體10的另一侧面11的内 侧結合。以第4圖和第6圖的方向為基準’第一印刷電路 基板20在其下側面安裝微機電系統晶片30及稱作特殊目 的型半導體（ASIC)晶片的放大器50。由於在第一印刷電 路基板20上安裝各種電子部件，因此將該第一印刷電路基 板2〇又稱作印刷電路基板模具（DIE)。 在第一印刷電路基板20上以貫通的方式形成内部聲孔 ⑧ 201216726 22’與殼體1G的外部聲孔12連通(連接而通過的狀態）。 在本實施例的情況下，如第3圖所示，外部聲孔ι2與 内部聲孔22以彼此不接觸的方式構成，，外部聲孔12 與内部聲孔22彼此錯開地配置。 該第一印刷電路基板4〇與殼體10開放的-側面結 。透過與设體1G開故的面結合，從而與殼體共同限 定内部空間82。第二印刷電路基板4〇與第一印刷電路基板 20隔開距離配置。 在第二印刷電路基板4〇的外侧面上具有多個連接端子 42。在本實施例中，連接端子42共具有4個。連接端子又 被稱作接續端子或襯墊。該第二印刷電路基板4〇又稱作襯 墊印刷電路基板。連接端子42與内部的微機電系統晶片3〇 及放大器50電連接而產生與外部裝置進行連接的作用。連 接端子42的數量可以根據需求而進行增減，並且也可以根 據需求而變更配置位置。 該微機電系統晶3。安|在第__印刷電路基板如的 内侧面。在此，所謂内側面是指，朝向内部空間62的面。 微機電㈣W 30糾部聲相對而配置。所謂相對 配置是指，微機電系統晶片3〇 6 # & ,,丄 _ m ~安裝在形成有内部聲孔22 的部分，以使微機電系統晶片Αμ ^ 30能夠接收透過内部聲孔22 而引入的音頻信號。 微機電系統晶片30產生將& & ^ ’接收到的音頻信號轉換為電 1s就的作用。另外，在第一印屈丨 ^ ^ ^ , j電路基板20的内侧面安裝 有微機電系統晶片30的同時，％ ^ 還女裝有放大器50。 201216726 放大益50產生從微機電系統晶片30接收電信號而進 订放大的作用。雖然未詳細以圖式表示，微機電系統晶片 Ο，、放大器50透過鐽合金絲（gyd b〇n(jing wire)而彼此 連接。放大器5G與第—印刷電路基板2Q電連接。 另外’本實施例的麥克風1還具有將第一印刷電路基 板2〇與第一印刷電路基板4〇彼此電連接的導電性連接部 件70。 導電性連接部件70以在各角部設置一個的方式共設置 四個各導電ϋ連接部件7〇是將導電性金屬線彎曲成線圈 形狀的彈簧。由於由彈簧構成’因此即使組裝公差不夠精 確’也能關單^•可靠地實現第—印刷電路基板2G盘第二 印刷電路基板40之間的電連接。 一 另外’在其他實施例的情況下，導 將導電金屬線彎曲而構成的二= 範圍内可進行各==基板與第二印刷電路基板電連接的 即’導電性連接料7G在純質上―― 3以:==也可，_物一質：狀 部件在其形狀上可 狀），而不是彈簧。 狀或銷狀（插銷形 201216726 的協助的情況下，也能夠將導電性連接部件直接固定到第 印刷電路基板和第二印刷電路基板。 另外，在本實施例中，在第一印刷電路基板20與第二 印刷電路基板40之間遷具有隔開支撐部件8〇,該隔開支撐 部件80使得第一印刷電路基板2〇和第二印刷電路基板4〇 在保持彼此間的間隔狀態下得到支撐。 參照第4圖及第6圖可知，隔開支撐部件80為四角形 的框架形狀，與第一印刷電路基板2〇及第二印刷電路基板 40的形狀對應。隔開支撐部件8〇的中間部分是空的，藉此 與第一印刷電路基板20及第二印刷電路基板40共同限定 内部空間82。並且，圍繞内部空間82的部分是輪廓部84。 隔開支撐部件80具有與第一印刷電路基板20和第二印刷 電路基板40彼此隔開的距離對應的寬度。 隔開支撐部件80具有收納部86，該收納部86收納並 支撐多個導電性連接部件70中的每一個。收納部86為側 面的一部分被開放的圓筒形狀，藉此彈簧形狀的導電性連 接部件70在上下方向簡單地夾入之後不會向水平方向脫 離。並且，收納部86以在各角部設置一個的方式共配置有 四個。將彈簧形狀的導電性連接部件70夾入各收納部86 之後’將其收納部86與其他部件一起嵌入殼體中，然後將 捲曲部16捲曲則可簡單地完成麥克風1的組裝。 該音頻路徑60為外部的音到達微機電系統晶片30而 形成的路徑。在本實施例的情況下，外部音頻透過外部聲 孔12而引入之後，經過形成於殼體1〇與第一印刷電路基 201216726 板之間的内部路徑空間24,並且透過内部聲孔22而傳達到 微機電系統晶片3〇。 即曰頻路# 60由外部聲孔12和内部路捏空間24及 内部聲孔22構成。參照第3圖，在本實施例的情況下，音 頻路杈60彎曲地形成。因此，微機電系統晶片30不直接 暴露在外部空間。在本實施例中’舉出了音頻路徑彎曲一 -人的例子’但是在其他實施例的情況下，可根據需要而將 音頻路徑彎曲兩次以上。 另外’在本實施例的情況下’即使音頻路徑6〇未被，彎 曲’但是由於微機電系統晶片30以將内部聲孔22全部遮 住的方式安裴’因此放大器50不會直接暴露在外部。並且， 即使微機電系統晶片不以遮住聲孔的方式安裝，但由於具 有，彎曲的音頻路徑，因此放大器50不會直接暴露在外部。 參照第3圖和第4圖，在本實施例的情況下，在第— 印刷電路基板2〇的外侧面具有銅鍍層26。在本實施例中， 錢層26的中間部分的一部分被腐蚀而形成内部路徑空間 24 °在此，内部路徑空間24沿著直線而形成，但是在其他 實施例的情況下，也可以沿著曲線而形成。 另外’在其他實施例的情況下，可根據使用者的需求， 對構成音頻路徑的内部路徑空間的長度、方向、形狀或高 度進行各種變形。但是，音頻路徑必須形成彎曲。另外， 關於形成音頻路徑的方式，除了本實施例的腐蝕銅層而形 成的方式以外，還可以利用切削、金屬鑄型、注塑等方式 而形成。 ⑧ 12 201216726 另外，音頻路徑不限於本實施例這樣形成在第一印刷 電路基板上’只要能夠連通外部聲孔和内部聲孔，則可以 形成在殼體上，也可以分別形成在兩側之後將彼此結合而 構成。 另外’在其他實施例的情況下，音頻路徑可以包括形 成在殼體的另一侧面與第一印刷電路基板之間的空間而構 成。即’形成在殼體的另一侧面與第一印刷電路基板之間 的内部空間使得外部聲孔與内部聲孔彼此連接，内部空間 和外部聲孔及内部空間相結合而構成音頻路徑。 對於該實施例未以圖式表示，在此參照第一實施例而 進行說明如下：將殼體的另一侧面11與第一印刷電路基板 20彼此隔開距離而配置，在其之間構成内部空間。這樣的 内部空間構成音頻路徑的一部分。此時，在殼體的另一側 面11與第一印刷電路基板2〇之間可以追加設置用於保持 彼此間隔的部件。另外，在這樣情況下，在追加的部件上 以各種形狀和體積形成連接外部聲孔和内部聲孔的内部空 間。 以下將對具備該結構之本發明一實施例的麥克風i，其 作用和效果進行說明。 本實施例的麥克風1構成為外部的音經過彎曲的音頻 路徑而到達微機電系統晶片的結構’因此能夠防止光雜訊 的發生。即’能夠防止内部的微機電系統晶片或放大器等 電子部件直接暴露在外部的各種光，例如可視光線、紫外 線、紅外線等。 13 201216726 因此能夠保持高頻波段 另外，由於形成有音頻路徑 的一貫性。 頻特ί外’此夠對音頻路徑進行各種變形而獲得較佳的音 划外’、在本實施例的情況下，由於透過腐贿層的- σ刀Α形路徑的—部分之内料徑 製造容易，*且還能_更形狀。 因此不僅 第7圖是根據本發明另—實施例之麥克風la的概略性 剖面圖。 本實施例的麥克風la與上述的實施例一樣，音頻路徑 咖被彎曲。由此，透過具備被料的音頻路徑而防止微機 ，系統晶片3Ga被直接暴露在外部。根據本實施例能夠獲 知與上述實施例相同或適當修改之程度的作用和效果。 但是，與上述實施例的結構上的區別在於，音頻路徑 6〇a形成在位於殼體的一侧的單一的印刷電路基板2〇a 上。以下將對結構上的區別進行說明。 在本實施例的情況下，具備一個印刷電路基板2〇a，該 印刷電路基板20a與殼體i〇a 一侧結合。在印刷電路基板 2〇a上具備外部聲孔22a、基板内部路徑空間24a及内部聲 孔 26a。 外部聲孔22a是與印刷電路基板20a的外部空間接觸 地形成的空間。内部聲孔26a是與殼體l〇a的内部空間相 接觸地形成的空間。基板内部路徑空間24a是為了連通外 部聲孔22a和内部聲孔24a而形成在印刷電路基板2〇a的 201216726 内部的空間。 另外，在本實施例的情況下，印刷電路基板20a包括 至少一個雙面印刷電路基板。具體而言，雙面印刷電路基 板20a由配置在其中間的内部絕緣層21a和分別形成在其 内部絕緣層21a的上下部的銅板層23a、42a構成。另外， 雙面印刷電路基板在其上部還具有上部絕緣層25a。而下部 的銅板層42a是通過蝕刻的方法僅保留連接端子42a而將 其他部分全部.去除的狀態。 另外’在本實施例的情況下，接觸到印刷電路基板外 部的外部層是指内部絕緣層21a，而不是指下部的銅板層 42a。因此’在本實施例的情況下，外部聲孔22&形成在内 部絕緣層21a上，内部聲孔26a形成在上部絕緣層25a上， 基板内部路徑空間24a形成在銅板層2%上。基板内部路 徑空間24a可根據需要來沿著直線或曲線形成為各種較佳 的形狀。 /本發明在上文中已以較佳實施例揭露，然熟習本項技 解的是’該實施例僅用於描繪本發明，而不應解 ^二化明之範圍。應注意的是，舉凡與該實施例等 ,0 ^換，均應設為涵蓋於本發明之範疇内。因此， 保護範圍當以申請專利範圍所界定者為準。 【圖式簡單說明】 第圖係$知的麥克風之概略性剖面圖。 第2圖係習知的 的另一麥克風之概略性剖面圖。 15 201216726 第3圖係根據本發明一實施例的麥克風之概略性剖面圖。 第4圖係第3圖的麥克風之分解立體圖。 第5圖係第3圖的麥克風之仰視立體圖。 第6圖係第3圖的麥克風之仰視分解立體圖。 第7圖係根據本發明另一實施例的麥克風之概略性剖面圖。 【主要元件符號說明】 1 麥克風 la 麥克風 10 殼體 10a 殼體 11 殼體的另一測面 12 外部聲孔 14 侧面 14a 侧面 16 捲曲部 16a 捲曲部 20 第一印刷電路基板 20a -印刷電路基板 21a 内部絕緣層 22 内部聲孔 22a 外部聲孔 23a 上部的銅板層 24 内部路徑空間 201216726 24a 内部路徑空間 25a 上部絕緣層 26 銅鑛層 26a 内部聲孔 30 微機電糸統晶片 30a 微機電系統晶片 40 第二印刷電路基板 42 連接端子 42a 下部的銅板層 50 放大器 50a 放大器 60 音頻路徑 60a 音頻路徑 70 導電性連接部件 80 隔開支撐部件 82 内部空間 84 輪廓部 86 收納部 100 砍電容式麥克風 110 印刷電路基板 120 微機電糸統晶片 130 放大器 140 聲孔 150 殼體 17 201216726 200 矽電容式麥克風 210 印刷電路基 220 微機電糸統晶片 240 聲孔 250 殼體201216726 VI. Description of the Invention: [Technical Field] The present invention relates to a microphone, and more particularly to an audio path capable of preventing light directly transmitted through a sound hole from reaching a MEMS wafer. A microphone that enhances audio characteristics. [Prior Art] Generally, a condenser microphone widely used in a mobile communication terminal or an audio system or the like is formed by a biasing element, a capacitor c which changes in accordance with sound pressure, a diaphragm/backplane, and A junction field effect transistor (JFET) that buffers the output signal. This conventional mode of condenser microphone is constructed in the following manner. After inserting the vibrating plate, the spacer ring, the insulating ring, the back plate, and the energizing ring in a casing, the printed circuit board on which the circuit component is mounted is finally placed, and then the end portion of the casing is folded toward the side of the printed circuit board. Bend and complete an assembly. In recent years, the technology of integrating small devices on a microphone is a semiconductor processing technique using microfabrication. In such a technology called Micro Electro Mechanical System (MEMS), ultra-small sensors in μιη can be manufactured by applying a semiconductor program 5, in particular, a microfabrication technology of integrated circuit technology. Actuators and electromechanical structures. A microphone having a microelectromechanical system wafer manufactured by such microfabrication technology has the advantages of miniaturizing conventional microphone components such as a vibrating plate, a spacer ring, an insulating ring, a backing plate, and an energizing ring by ultra-precision micromachining. It is high-performance, multi-functional, and integrated. It can improve stability and reliability by entering 201216726. Fig. 1 is a cross-sectional view schematically showing an exemplary example of a conventional lithography condenser microphone 1 using a microelectromechanical system (MEMS) wafer 120. The Shishi condenser microphone is composed of a printed circuit board 110, a MEMS wafer 12 mounted on the printed circuit board 110, an amplifier 130 called a special purpose semiconductor (ASIC) wafer, and a sound hole 140 formed therein. Housing 150. As shown in Fig. 1, the fourth type of condenser microphone has a sound hole M0 on the upper portion of the casing and a micro-electromechanical system chip no on the printed circuit board. On the lower side surface of the printed circuit board 11G, there is a connection terminal electrically connected to an external device. The external sound is introduced into the acoustic hole 14〇 formed in the casing 150 and transmitted to the MEMS wafer (10), and is converted into the electric cymbal No. 5, and the electric signal is transmitted to the amplifier 13 〇 to be amplified. However, in the case of the conventional microphone 100, since the sound hole 140 is formed to penetrate the upper portion of the casing, there are many problems. That is, in addition to the audio, visible light, infrared rays, ultraviolet rays, and the like are also transmitted through the sound hole 140 to externally transmit the servo chip 12 and the amplifier 130. If various light reaches the MEMS wafer or amplifier, the optical noise increases and adversely affects performance. In addition, since the audio path is not formed due to the sound hole penetrating through the casing, it is impossible to maintain the high-performance section m, that is, the material can form the expected frequency of the 曰 frequency road, so it is difficult to adjust the high-frequency band, thereby improving the audio characteristics. There is a problem. In addition, Fig. 2 is a cross-sectional view showing another embodiment of the lithography condenser microphone 200 using the MEMS wafer 220. The microphone 200 is composed of a printed circuit board 210, a microelectromechanical winding 220 of a printed circuit board 21, a magnifier 130, and a casing 250. The microphone 2 〇〇 the tab ear L 240 is formed on the printed circuit board 210 instead of being formed on the casing. The sound is introduced into the acoustic hole 24 形成 formed on the substrate 210. It is transmitted to the microcomputer. Although the microphone of this structure is slightly different from the structure of the conventional microphone, it is still possible that the light of the 100-line, infrared, ultraviolet light, etc. other than the audio is transmitted through the sound hole 24〇 from the outside. The optical and electrical system wafer 220 is transferred, and the high frequency band is finely adjusted because the audio path is not formed. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a microphone capable of preventing the occurrence of optical noise by preventing an external (four) straight to internal audio path. The object of the present invention is to provide a high standard microphone that has audio characteristics. Features for improving the microphone of the present invention include: a housing 'a circuit substrate mounted to the inside of the housing; a MEMS wafer, p=electric:=up; and an amplifier' with the micro_, 曰曰The chip is electrically connected to the printed circuit board, and the external sound is transmitted to the sound age 彳i, and the vertical frequency path is curved to form a 'money. The MEMS wafer and the amplifier are not connected 5 201216726 Further, preferably, the housing has an external sound hole, and the printed circuit board is composed of a first printed circuit board and a second printed circuit board, the first printed circuit board and the case The other side is combined and formed with an internal acoustic hole communicating with the external acoustic hole, the second printed circuit substrate being coupled to one side of the housing and spaced apart from the first printed circuit substrate, in the second The outer surface of the printed circuit board is formed with a plurality of connecting terminals, and the MEMS chip and the inner sound hole are mounted on the inner side of the first printed circuit board in an opposite arrangement, the outer sound hole and the inner sound hole In this non-contact, the audio path is formed in a space between the other side of the housing and the first printed circuit board, and includes a space formed by connecting the external sound hole and the inner sound hole to each other. Preferably, the first printed circuit board is tightly coupled to the other side of the housing, and a plating layer is provided on an outer side of the first printed circuit board that is tightly coupled to the other side of the housing, the audio path including the first An internal path space formed by etching a portion of the plating layer on the outer surface of the printed circuit board. The internal path space may be formed along a straight line or a curved line. Further, preferably, the printed circuit board and the housing are The printed circuit board is provided with an external acoustic hole, a substrate internal path space, and an internal acoustic hole, and the external acoustic hole is formed in a groove formed on the outer surface of the printed circuit board so as to be in contact with the external space. The sound hole is a groove formed in contact with the inner space of the housing, and the internal path space of the substrate is to connect the outer sound hole with the inner sound hole The method is formed in a space inside the substrate of the printed circuit 201216726. JK, 丨φ In addition, preferably, the printed circuit substrate includes at least one double-sided printing. The external acoustic hole is formed to be in contact with the printed circuit board. * Μ The internal sound hole is formed in contact with the thimble/layer in the printed circuit board, and the internal path space of the substrate is formed in at least one intermediate layer located in the middle of the printed circuit board. Preferably, the internal path of the substrate The space can be exposed to the microphone by the sound hole along the straight line or the curved line according to the present invention, and can prevent the direct introduction of light from the microelectromechanical system wafer or the like. According to the microphone of the present invention, a high standard audio characteristic is obtained. Further, the microphone according to the present invention will be described in detail with reference to FIGS. 3 to 6 of the present invention. The microphone 1 of the present embodiment is used to convert sound waves such as voice, audio, sound, etc. into electric power & The device referred to includes a housing 10, a printed circuit board, a MEMS wafer 30, an amplifier 50, and an audio path 6A. The housing 10 constitutes the outer shape of the microphone. Various components are installed inside. One side of the casing 10 is open', and an outer sound hole 12 is formed on the other side surface 11. The outer sound hole 12 is formed in a penetrating manner to introduce external audio into the inside of the casing. In the case of the present embodiment, the casing 1 is a six 201216726 plane body in which each surface is formed in a rectangular shape. However, in the case of other embodiments, the overall shape of the housing can be variously modified. That is, the casing may have a cylindrical shape or a columnar shape in which the cross section in the horizontal direction is an expanded circular shape. The casing 10 is provided to extend downward from the other side surface 11 to form four side faces 14. A curl portion 16 is provided at a lower end portion of each side surface 14. In the state shown in Figs. 4 and 6, after the other members of the drawing are smashed into the inside of the casing, the curled portion 16 is curled as shown in Fig. 5, and the internal member is fixed. In the case of this embodiment, the fixing and assembly of the inner member is completed by crimping the curl portion at the lower end of the side surface of the casing. Therefore, it is not necessary to separately fix the internal members by fixing means such as an adhesive. The casing 10 is composed of a conductive material such as nickel, copper or aluminum having excellent noise-cutting characteristics or an alloy thereof. In the case of this embodiment, the printed circuit board is composed of the first printed circuit board 20 and the second printed circuit board 40. However, in the case of other embodiments, the printed circuit board may be divided into two or may be formed into one. The first printed circuit board 20 is coupled to the inner side of the other side surface 11 of the casing 10. Based on the directions of Figs. 4 and 6, the first printed circuit board 20 has a microelectromechanical system chip 30 and an amplifier 50 called a special purpose semiconductor (ASIC) chip mounted on the lower side thereof. Since the various electronic components are mounted on the first printed circuit board 20, the first printed circuit board 2 is also referred to as a printed circuit board mold (DIE). The internal acoustic hole 8 201216726 22' is formed to penetrate the external acoustic hole 12 of the casing 1G in a penetrating manner on the first printed circuit board 20 (a state in which it is connected and passed). In the case of this embodiment, as shown in Fig. 3, the outer acoustic hole ι2 and the inner acoustic hole 22 are not in contact with each other, and the outer acoustic hole 12 and the inner acoustic hole 22 are arranged to be shifted from each other. The first printed circuit board 4 is connected to the open side of the casing 10. The internal space 82 is defined together with the casing by being combined with the surface of the installation 1G. The second printed circuit board 4A is disposed at a distance from the first printed circuit board 20. A plurality of connection terminals 42 are provided on the outer surface of the second printed circuit board 4''. In the present embodiment, the connection terminals 42 have a total of four. The connection terminals are also referred to as connection terminals or pads. The second printed circuit board 4 is also referred to as a pad printed circuit board. The connection terminal 42 is electrically connected to the internal MEMS wafer 3A and the amplifier 50 to cause connection with an external device. The number of connection terminals 42 can be increased or decreased according to requirements, and the configuration position can also be changed according to requirements. The microelectromechanical system crystal 3. On the inner side of the __printed circuit board. Here, the inner side surface means a surface that faces the inner space 62. The MEMS (4) W 30 correction part is relatively configured. The so-called relative configuration means that the MEMS wafer 3〇6# &, 丄_m~ is mounted on the portion in which the internal acoustic hole 22 is formed, so that the MEMS wafer Αμ^30 can be received through the internal acoustic hole 22. The introduced audio signal. The MEMS wafer 30 produces the effect of converting the audio signal received by && ^ ' into electrical 1s. Further, while the MEMS wafer 30 is mounted on the inner side surface of the first printed circuit board ^ ^ , j circuit board 20, the amplifier 50 is also provided. 201216726 Amplification benefit 50 produces the effect of receiving an electrical signal from the MEMS wafer 30 to customize the amplification. Although not shown in detail in the drawings, the MEMS chip, the amplifier 50 is connected to each other through a gyd wire (gy wire). The amplifier 5G is electrically connected to the first printed circuit board 2Q. The microphone 1 of the example further has a conductive connecting member 70 that electrically connects the first printed circuit board 2〇 and the first printed circuit board 4〇 to each other. The conductive connecting member 70 is provided in a total of four at each corner. Each of the conductive cymbal connecting members 7 is a spring that bends the conductive metal wire into a coil shape. Since it is constituted by a spring, "Even if the assembly tolerance is not accurate enough", it can be turned off ^• reliably realize the first printed circuit board 2G disk second Electrical connection between the printed circuit boards 40. In addition, in the case of other embodiments, the two=============================================================================== 'The conductive connecting material 7G is on the pure quality - 3 is: == also, _ matter: the shape of the component can be shaped like it), not the spring. In the case of a pin shape or a pin shape (in the case of the pin shape 201216726, the conductive connecting member can be directly fixed to the first printed circuit board and the second printed circuit board. Further, in the present embodiment, in the first printed circuit board 20 Interposed between the second printed circuit board 40 and the second printed circuit board 40, the spaced apart support member 80 allows the first printed circuit board 2 and the second printed circuit board 4 to be supported while being spaced apart from each other. 4 and FIG. 6, the partition supporting member 80 has a quadrangular frame shape and corresponds to the shapes of the first printed circuit board 2 and the second printed circuit board 40. The intermediate portion of the support member 8A is partitioned. It is empty, thereby defining an internal space 82 together with the first printed circuit substrate 20 and the second printed circuit substrate 40. And, a portion surrounding the internal space 82 is a contour portion 84. The partition supporting member 80 has a first printed circuit The distance between the substrate 20 and the second printed circuit board 40 is different from each other. The partition supporting member 80 has a housing portion 86 that accommodates and supports a plurality of conductive portions. Each of the connecting members 70. The accommodating portion 86 has a cylindrical shape in which a part of the side surface is opened, and the spring-shaped conductive connecting member 70 is not easily detached in the horizontal direction after being simply inserted in the vertical direction. Four parts are disposed in total at each corner portion. After the spring-shaped conductive connecting member 70 is sandwiched between the accommodating portions 86, the accommodating portion 86 is fitted into the casing together with other members, and then The curling portion 16 is crimped to simply complete the assembly of the microphone 1. The audio path 60 is a path formed by external sounds reaching the MEMS wafer 30. In the case of the present embodiment, external audio is introduced through the external sound hole 12. Thereafter, it passes through the internal path space 24 formed between the casing 1 and the first printed circuit substrate 201216726, and is transmitted to the MEMS wafer 3 through the internal acoustic hole 22. That is, the frequency is #60 by external sound. The hole 12 and the internal path pinch space 24 and the internal sound hole 22 are formed. Referring to Fig. 3, in the case of the present embodiment, the audio path 60 is formed in a curved manner. Therefore, the MEMS wafer 30 is formed. It is not directly exposed to the external space. In the present embodiment, 'the example of the audio path bending one-person is given' but in the case of other embodiments, the audio path can be bent twice or more as needed. In the case of the embodiment, 'even if the audio path 6 is not, bent' but since the MEMS wafer 30 is amplified in such a manner as to completely cover the internal sound hole 22, the amplifier 50 is not directly exposed to the outside. The MEMS wafer is not mounted in such a manner as to cover the sound hole, but since it has a curved audio path, the amplifier 50 is not directly exposed to the outside. Referring to Figures 3 and 4, in the case of this embodiment, A copper plating layer 26 is provided on the outer surface of the first printed circuit board 2''. In the present embodiment, a portion of the intermediate portion of the money layer 26 is etched to form an internal path space 24° where the internal path space 24 is formed along a straight line, but in other embodiments, it may be along a curve And formed. Further, in the case of other embodiments, the length, direction, shape or height of the internal path space constituting the audio path can be variously modified according to the needs of the user. However, the audio path must be curved. Further, the manner of forming the audio path can be formed by cutting, metal casting, injection molding or the like in addition to the method of etching the copper layer of the present embodiment. 8 12 201216726 In addition, the audio path is not limited to being formed on the first printed circuit board as in the present embodiment. 'As long as the external sound hole and the internal sound hole can be connected, it may be formed on the casing, or may be formed on both sides separately. They are combined with each other. Further, in the case of other embodiments, the audio path may include a space formed between the other side of the casing and the first printed circuit board. That is, the internal space formed between the other side surface of the casing and the first printed circuit board allows the external sound hole and the internal sound hole to be connected to each other, and the internal space and the external sound hole and the internal space are combined to constitute an audio path. This embodiment is not shown in the drawings, and is described herein with reference to the first embodiment in that the other side surface 11 of the casing and the first printed circuit board 20 are disposed at a distance from each other, and an internal portion is formed therebetween. space. Such internal space forms part of the audio path. At this time, a member for maintaining a distance between each other may be additionally provided between the other side surface 11 of the casing and the first printed circuit board 2''. Further, in this case, the internal space connecting the external sound hole and the internal sound hole is formed in various shapes and volumes on the additional member. The operation and effect of the microphone i according to an embodiment of the present invention having this configuration will be described below. The microphone 1 of the present embodiment is constructed such that an external sound passes through a curved audio path to reach the structure of the microelectromechanical system wafer. Therefore, occurrence of optical noise can be prevented. That is, it is possible to prevent various kinds of light such as visible light, ultraviolet rays, infrared rays, and the like from being directly exposed to external electronic components such as MEMS wafers or amplifiers. 13 201216726 Therefore, it is possible to maintain the high frequency band. In addition, the consistency of the audio path is formed. In addition, in the case of the present embodiment, the inner diameter of the portion of the path of the slash-removed layer is traversed. Made easily, * and can also be more shaped. Therefore, not only Fig. 7 is a schematic cross-sectional view of a microphone 1a according to another embodiment of the present invention. The microphone la of the present embodiment is the same as the above-described embodiment, and the audio path is curved. Thereby, the microcomputer is prevented from passing through the audio path having the material to be fed, and the system wafer 3Ga is directly exposed to the outside. According to the present embodiment, the effects and effects of the same or appropriate modifications as those of the above embodiment can be known. However, the structural difference from the above embodiment is that the audio path 6A is formed on a single printed circuit board 2A on one side of the casing. The structural differences will be explained below. In the case of this embodiment, a printed circuit board 2A is provided, and the printed circuit board 20a is coupled to the side of the casing i〇a. The printed circuit board 2A has an external acoustic hole 22a, a substrate internal path space 24a, and an internal acoustic hole 26a. The external sound hole 22a is a space formed in contact with the outer space of the printed circuit board 20a. The inner sound hole 26a is a space formed in contact with the inner space of the casing 10a. The substrate internal path space 24a is a space formed inside the 201216726 of the printed circuit board 2A in order to connect the external sound hole 22a and the internal sound hole 24a. Further, in the case of the present embodiment, the printed circuit board 20a includes at least one double-sided printed circuit board. Specifically, the double-sided printed circuit board 20a is composed of an inner insulating layer 21a disposed therebetween and a copper plate layer 23a, 42a formed on the upper and lower portions of the inner insulating layer 21a, respectively. Further, the double-sided printed circuit board further has an upper insulating layer 25a on the upper portion thereof. On the other hand, the lower copper plate layer 42a is in a state in which only the connection terminal 42a is left by the etching method and all other portions are removed. Further, in the case of the present embodiment, the outer layer contacting the outer portion of the printed circuit board means the inner insulating layer 21a, not the lower copper plate layer 42a. Therefore, in the case of the present embodiment, the outer acoustic holes 22 & are formed on the inner insulating layer 21a, the inner acoustic holes 26a are formed on the upper insulating layer 25a, and the inner substrate path spaces 24a are formed on the copper plate layer 2%. The substrate internal path space 24a can be formed into various preferred shapes along a straight line or a curved line as needed. The invention has been described above in terms of preferred embodiments, and it is to be understood that the present invention is only intended to depict the invention and should not be construed as limited. It should be noted that the same as the embodiment, etc., should be included in the scope of the present invention. Therefore, the scope of protection is subject to the definition of the scope of patent application. [Simple description of the drawing] The figure is a schematic sectional view of a microphone known as $. Figure 2 is a schematic cross-sectional view of another conventional microphone. 15 201216726 FIG. 3 is a schematic cross-sectional view of a microphone according to an embodiment of the present invention. Fig. 4 is an exploded perspective view of the microphone of Fig. 3. Fig. 5 is a bottom perspective view of the microphone of Fig. 3. Fig. 6 is a bottom perspective exploded view of the microphone of Fig. 3. Figure 7 is a schematic cross-sectional view of a microphone in accordance with another embodiment of the present invention. [Main component symbol description] 1 microphone la microphone 10 housing 10a housing 11 another measuring surface of the housing 12 external sound hole 14 side surface 14a side surface 16 curling portion 16a curling portion 20 first printed circuit board 20a - printed circuit board 21a Internal insulating layer 22 Internal sound hole 22a External sound hole 23a Upper copper plate layer 24 Internal path space 201216726 24a Internal path space 25a Upper insulating layer 26 Copper ore layer 26a Internal sound hole 30 Microelectromechanical system wafer 30a MEMS wafer 40 2 printed circuit board 42 connection terminal 42a lower copper plate layer 50 amplifier 50a amplifier 60 audio path 60a audio path 70 conductive connection member 80 partition support member 82 internal space 84 contour portion 86 housing portion 100 chopped condenser microphone 110 printed circuit board 120 MEMS wafer 130 amplifier 140 sound hole 150 housing 17 201216726 200 tantalum condenser microphone 210 printed circuit base 220 MEMS wafer 240 sound hole 250 housing