201207408 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種測試裝置，且 用以測試待測物之測試裴置。 奇另】疋有關於一種 【先前技術】 隨著高科技技術的進步、產品功能 上對於電子產品朝向輕薄化的要求，必須= 板上’設置比以往電子產品中更多：電：產。口的電路 下，業者無不致力提升空間的利用率得；m勢 件的集積度大幅的提升。 寻電子產印中7〇 在電子產品的設計或製造過程中 各元件是否能符合規範’並判斷其是以 電性是否正常、功能是否良:檢=件隨== 間來設置測試治具。相對來說，為了在電路 治具，必須犧牲設置電子元件的空間。 饥上。又置劂忒 請同時參照第im1b圖’第1A圖繪示習知 試裝置的别面圖’第1B圖繪示習知第u圖 於 測試時的别面圖。測試裝置_即為—測試治且:置並 設置於-電路板14G上，用以測試—待測物i3q、之電性是 否正常或功能是否良好。待測物130具有多個接點i3i及 對應各接點131之夕個鲜球132。測試治具1 〇 1具有一座 體110、多個探針111、一蓋體120、一轉軸121 ^一卡榫 122。 座體110設置於電路板140上，並具有一凹槽η]、一 I. 201207408 上表面U5、一下表面116及一卡槽117。上表面115及下 表面U6係為座體11〇之相對兩表面，凹槽112之一開口 1B位於上表面115。卡槽117位於座體11〇之一侧邊。各 探針ill之一端突出於凹槽112之底部114，用以接觸於待 測物130之銲球132;另一端則位於座體ι1〇之下表面116, 並電性連接電路板140。 蓋體120位於座體11〇上，並藉由轉軸121連接於座 體，使蓋體120可相對於座體n〇上下轉動。蓋體120 用以施加壓力於待測物丨3〇’使各探針111緊密接觸於待測 春物130之各銲球132。卡榫122連接於蓋體12〇之一側， 並具有一凸部123，凸部123用以與座體11〇之卡槽117 扣合，以將蓋體120卡合於座體11〇上。 當待測物130進行測試時，藉由蓋上蓋體120並將其 卡合於座體110之方式，使蓋體12〇施加壓力於待測物13〇 上’讓各探針111緊密接觸於各銲球132。待測物130經由 探針111電性連接電路板14〇，以進行電性或功能測試。 在此種測試裝置100直接設置於電路板14〇上的方式 中’由於座體11〇的下表面116直接接觸於電路板140,使 # 電子元件14丨僅能設置於測試裝置1〇〇之外側的電路板140 上’以致降低了電路板140上空間的利用率。尤其是相較 於被測試的待測物130而言，測試裝置1〇〇具有較大的體 積，會大幅地佔用電路板140上的空間，無法符合現今欲 在電路板140上設置更多電子元件mi的需求。另一方面’ 若電路板140上的可用空間太小，難以提供足夠的空間以 設置測試裝置100時，將使得測試裝置100無法設置於電 路板140上，導致無法測試待測物13〇。 201207408 【發明内容】 本發明之目的，係提供一種測試裝置，用以解決電路 板上空間的利用率無法提升的問題，並避免測試裝置無法 設置於電路板上。 本發明一方面係提出一種測試裝置，用以在一電路板 上測試一待測物。測試裝置包含一第一載體、一第二載體 以及一測試治具。第一載體位於電路板上，並電性連接電 路板，且第一載體具有一第一長度。第二載體位於第一載 體上，並電性連接第一載體，且第二載體具有一第二長度。 測試治具位於第二載體上，並電性連接第二載體及待測 物。其中，第二長度大於第一長度，第一載體、第二載體 與電路板之間形成一可用空間。 依據本發明一實施例，可用空間位於第一載體之兩側 或周圍。電路板上設置有至少一電子元件，電子元件位於 可用空間處。電路板具有多個銲墊，第一載體具有一第一 面、一第二面、多個第一接墊及多個第二接墊。第一面面 對電路板並具有第一長度，第二面相對於第一面。第一接 墊位於第一面上並對準銲墊，第二接墊位於第二面上並對 準第一接墊。 依據本發明一實施例，測試裝置更包含多個第一導電 體，第一導電體位於銲墊與第一接墊之間，並電性連接電 路板及第一載體。第一載體具有多個第一導通孔或多個第 一導電材料，第一導通孔貫穿第一載體、第一接墊及第二 接墊。第一導電材料位於第一導通孔内，並電性連接第一 接墊與第二接墊。 依據本發明一實施例，測試裝置更包含多個第二導電 體，第二導電體位於第二接墊與第三接墊之間，並電性連 接第一載體及第二載體。第二載體具有一第三面、一第四 201207408 =個具有多個第二導通孔或多個第1 以:Γί試治具。第三接墊位“三 導電材料位於貫穿第二载體及第三接整，3 1 π第一導通孔内並電性連接第三接墊。第一 針。座'體位，測試治具具有-座體及多個探 =第下“相對 一庇邱第一端及一第二端，第一端突出於凹雜+ 接第i載體。連接待測物，第二端突出於下表面並電^連 依據本發明一實施例，測試裝置更包含至少^ 孔、至少-定位元件、至少一貫穿孔置及更至二:以位 ΐ二 貫穿第二載體及測試治具，固定材料位： 本發明另-方面係提出_種測試裝置用以在一電路 板上待測物。測試裝置包含—載體以及一測試治 具二载，錄電路板上’並電性連接電路板，且載體具有 趙接载體及待測物:其 板之間形成-可用空間。 心、第二部分與電路 可用空間處。電路板具有多個4子=二元= 201207408 面及多個接墊。第一面面對電路板並具有第一長度，接墊 位於第一面上並對準銲墊。第二部分具有一第二面及一第 三面，第二面面對第一部分並具有第二長度，第三面相對 於第二面並面對測試治具。 依據本發明一實施例，測試裝置更包含多個導電體， 導電體位於銲墊與接墊之間，並電性連接電路板及載體。 載體具有多個導通孔或多個導電材料，導通孔貫穿載體及 接墊，導電材料位於導通孔内並電性連接接墊。 依據本發明一實施例，測試治具具有一座體及多個探 針。座體位於第二部分上，並具有一凹槽、一上表面及一 下表面。凹槽之一開口位於上表面，下表面相對於上表面 並面對載體。探針位於座體中，待測物位於探針上。每一 探針具有一第一端及一第二端，第一端突出於凹槽之底部 並電性連接待測物，第二端突出於下表面並電性連接載體。 依據本發明一實施例，測試裝置更包含至少一定位 孔、至少一定位元件及一固定材料。定位孔位於測試治具 上，定位元件位於第二部分上並對準定位孔，固定材料位 於載體與測試治具之間。 本發明又一方面係提出一種測試裝置，用以在一電路 板上測試一待測物。測試裝置包含一载體以及一測試治 具。載體位於電路板上，並電性連接電路板，且載體具有 一第一長度。測試治具位於載體上，並電性連接載體及待 測物，且測試治具具有一第二長度。第二長度大於第一長 度，載體、測試治具與電路板之間形成一可用空間。 依據本發明一實施例，可用空間位於載體之兩侧或周 圍，電路板上設置有至少一電子元件，電子元件位於可用 空間處。電路板具有多個銲墊，載體具有一第一面、一第 二面及多個接墊。第一面面對電路板並具有第一長度，第 201207408 ^面相對於第一面並面對測 對準銲墊。 八接墊位於第一面上並 依據本發明一實施例，測續 導電體位於銲墊與接墊之門，、置更包含多個導電體， 載體具有多個導通孔戎夕：道•電性連接電路板及载體。 接墊，導電材料位於導通孔内並電性連接接藝。貝穿载體及 依據本發明一實施例， Λ 探針。座體位於載體上，並且口/、八有一座體及多個 及一下矣而。m播 並具有一凹槽、相對之一上表面 並具有第一長曰二：開口位於上表面’下表面面對載體 -底=電以二端’第-端突出於凹槽之 接载體。連接待物’第二端突出於下表面並電性連 依，本發明一實施例，測試裝置更包含至少一定位 孔、一疋位元件及一固定材料。定位孔位於測試治具 上，定位元件位於電路板上並對準定位孔，固定材料位於 載體及測試治具之間。 1上述依照本發明實施例之測試裝置’利用載體來承置 • 測試治具，使測試治具、載體及電路板之間形成一可用空 間:以增加電路板上空間的利用率，並避免測試治具之尺 寸受到電路板上空間的限制，讓測試治具輕易地設置於基 板上，進而提升使用上的便利性。 【實施方式】 依照本發明各實施例之測試裝置中，測試治具設置在 載體上’載體連接於電路板之表面的長度小於測試治具的 長度’使測試治具、载體及電路板之間形成一可用空間。 如此’將可設置更多的電子元件在測試治具之下方的電路 201207408 - 板上，或者讓尺寸較大的測試治具可以設置到電路板上。 : 請同時參照第2A及2B圖，第2A圖繪示本發明一實 施例之測試裝置的剖面圖，第2B圖繪示本發明第2A圖之 測試裝置於測試時的剖面圖。測試裝置200之一侧電性連 接一電路板270，另一側用以電性連接一待測物280 ’以測 試待測物280的電性或功能。 測試裝置200包含一第一載體210、一第二載體220 及一測試治具230。第一載體210位於電路板270上，並 電性連接電路板270。第一載體210具有一高度H1及一第 一長度L1，第一長度L1的方向平行於電路板270。第二 9 載體220位於第一載體210上，並電性連接第一載體210。 第二載體220具有一第二長度L2,第二長度L2的方向平 行於電路板270，並大於第一載體210的第一長度L1。由 於第二載體220設置於第一載體210上，使得第二載體220 與電路板270間至少相隔第一載體210之高度H1。測試治 具230位於第二載體220上，並電性連接第二載體220及 待測物280。 基於前述測試裝置200之配置方式，第一載體21〇、 第二載體220及電路板270之間係形成一可用空間29〇， 響 可用空間290可以用來設置更多的電子元件272於電路板 270上。同時，測試裝置200僅需佔用電路板270上第一 長度L1的空間，即可設置比第一長度L1更大尺寸的測試 治具230。 如第2A圖所示，第一載體21〇大致與第二載體220 置中對齊，使第二載體220分別突出於第一载體21()之左 側及右側一長度L3，故可用空間290係分別位於第一載體 210之左右兩側。然而’本發明之技術並不限制於此，第 ' 一載體210及第二载體220亦可靠右對齊或靠左對齊，使 201207408 得可用空間290位於第一載體210之左側或右側。此外， 可用空間290亦可位於第一載體210之周圍。其他第一载 體210及第二載體220之相對配置關係，凡是第二載體22〇 之尺寸大於第一載體210之尺寸，讓第二載體220、第一 載體210及電路板270之間形成可用空間290者，均屬於 本發明之範圍。 ' 第一載體210具有一第一面211、一第二面212、多個 第一接墊213及多個第二接墊214。第一面211及第二面 212為第一載體210相對之兩表面，第一面211面對電路 板270並具有第一長度L1。第一面211及第二面212係以 具有相同的第一長度L1為例，但在另一實施例中，第二面 212之長度亦可小於或大於第一面211之第一長度L1。各 第一接墊213位於第一面211上，各第二接塾214位於第 二面212上。電路板270具有多個銲墊271，各第一接塾 213對準各銲墊271，以分別接觸於各銲墊271。第一載體 210之各第二接墊214對準各第一接墊213。 第一載體210具有多個第一導通孔215，各第一導通 孔215貝穿第一載體210、各第一接墊213及各第二接墊 214。另外，第一載體21〇亦可選擇性地具有多個第一導電 材料216，各第一導電材料216位於各第一導通孔215之 内部或内壁上，並電性連接第一接墊213與第二接墊214。 測試裝置200更包含多個第一導電體24〇，各第一導 電體240位於各銲墊271及各第一接墊213之間，用以電 性連接電路板270及第一載體210。 第二載體220具有一第三面221、一第四面222及多 = 第三面221及第四面222為第二載體220 相對之兩表面，第三面221面對第一載體21〇並具有第二 長度L2，第四面222面對測試治具230。第三接墊223位 201207408 • 於第三面221上，且各第三接墊223對準各第二接墊214。， 第三面221及第四面222係以具有相同的第二長度l2為 例’但在另一實施例中，第四面222之長度亦可小於或大 於第三面221之第二長度L2。 第二載體220具有多個第二導通孔224，各第二導通 孔224貫穿第二載體220及各第三接墊223。另外，第二 載體220亦可選擇性地具有多個第二導電材料225，各第 二導電材料225位於各第二導通孔224之内部或内壁上， 並電性連接各第三接墊223。 測試裝置200更包含多個第二導電體241，各第二導 電體241位於各第二接塾214及各第三接塾223之間，用 以電性連接第一載體21〇及第二載體220。 第一载體210經由第一導電體240電性連接電路板 270’第二載體220經由第二導電體241電性連接第一載體 210。具體來說，第二載體220之第三面221係與電路板 270相隔一高度H2,高度H2包含第一載體21〇之/高度則、 第一導電體240之高度及第二導電體241之高度。又 測試治具230具有一座體231及多個探針232。座體 φ 231位於第一載體220上，並具有一凹槽235、一上表面 238及一下表面239。上表面238及下表面239分別為座體 231相對之兩表面，凹槽235之一開口幻6位於上表面 238,下表面239面對第二載體220。各探針232位於座體 231中，待測物280位於各探針232上。每一 有一第一端233及一第二端234,第一端加突出於凹& 235之一底部237’第二端234電性連接第二導電材料225。 在此，應用於本實施例測試裝置200之探針232 /其可包 含但不限於伸縮探針、彈性探針及固定禊 八 於一實施财，各探針232之第二突出於座體 201207408 231的下表面239’並延伸至各第二導通孔224内以電性連 接各第二導電材料225，但各探針232電性連接各第二導 電材料225之方式並不以此種方式為限。舉例來說，各探 針232之第二端234亦可與下表面239齊平。當測試治具 230設置於第二載體220上時，下表面239係與第二載體 220之第四面222接觸，使各探針232接觸並電性連接各 第二導電材料225。另外，待測物28〇具有多個接點281 或多個銲球282,各探針232突出於底部252b之第一端233 用以接觸於各接點281或各鲜球282。 一測試裝置2〇〇更包含至少一定位孔25〇及至少一定位 疋件上51 l定位孔250可位於第二載體22〇之第四面222 上，定位元件251可位於測試治具23〇之座體231 面239上，並對準及插入定位孔25〇，使測試治具2如定 位於第二載體220上。另一方面，定位孔25〇及定位元件 251也可相反配置，亦即將定位孔25〇設於座體23ι之下 表面239，定位元件251設於第二載體220之第四面222， 使測試治具230定位於第二載體220上。 測試裝置200更包含至少一貫穿孔26〇及至 =26卜貫穿孔260貫穿座體231及第二載體22〇，固定 =2=位於貫穿孔細内，並用以固定座體231及第二 如第2A圖所示，當對待測物28〇進行測試 置於各探針232上，使各探針232之第一端233 觸待測物280的接點281或各鲜球282，此 恩係以第一端233接觸銲球282為例。 m2Β圖所示，以一壓力291施加於待測物 為抽知球282緊密接觸於各探針232。若各探針232 +縮探針或彈性探針，當施加屋力291於待測物時， 201207408 各探針232的長度會縮短。使用者可以手動方式施加壓力 291於待測物280，讓各銲球282緊密接觸於各探針232。 然而’本發明並不限制於手動方式，實際應用上亦可利用 蓋體、油壓、氣壓或機械作動等方式，將壓力291施加於 待測物280。 當各銲球282緊密接觸於各探針232時，待測物280 的電性訊號依序經由待測物280之接點281、銲球282、探 針232、第二導電材料225、第二導電體241、第一導電材 料216、第一導電體240及銲墊271傳遞至電路板270。最 後，再由電路板270傳遞電性訊號至測試電路及顯示螢幕 (未纟會示）專裝置，以取得並顯示測試結果。 上述依照本實施例之測試裝置200,藉由具有較小之 第一長度L1的第一載體210連接於電路板270上，並利用 具有較大之第二長度L2的第二载體220來設置測試治具 230。電路板270、第一載體210及第二載體220之間形成 可用空間290 ’可以用來設置更多的電子元件272於測試 治具230下方的電路板270上。同時，採用長度不相等的 第一載體210及第二載體220，讓電路板270之有限空間 上可以設置尺寸較大的測試治具230。 請同時參照第3A及3B圖，第3A圖繪示本發明另一 實施例之測試裝置的剖面圖，第3B圖繪示本發明第3 A圖 之測試裝置於測試時的剖面圖。測試裝置3〇〇之一側電性 連接電路板360 ’另一側用以電性連接待測物370，以測試 待測物370的電性或功能。 測試裝置300包含一載體310及一測試治具320。載 體310位於電路板360上，並電性連接電路板36〇。載體 310具有一第一部分311及一第二部分312，兩部分可為一 體成型、切割成型或組合構成。第一部分311位於電路板 201207408 360上，並具有一高度H3及一第一長度L4,第一長度L4 的方向平行於電路板360。第二部分312位於第一部分311 上，並與電路板360相隔至少高度H3。第二部分312具有 一第二長度L5，第二長度L5的方向平行於電路板360， 並大於第一部分311的第一長度L4。測試治具320位於載 體310上，並電性連接載體310及待測物370。 基於測試裝置300之配置方式，第一部分311、第二 部分312及電路板360之間係形成一可用空間380，可用 空間380用以設置更多的電子元件362於電路板360上。 同時，測試裝置300僅需佔用電路板360上第一長度L4 的空間，即可設置比第一長度L4更大尺寸的測試治具320。 如第3A圖所示，第一部分311大致與第二部分312 置中對齊，使第二部分312分別突出於第一部分311之左 側及右側一長度L6，故可用空間380係分別位於第一部分 311的左右兩側。然而，本發明之技術並不限制於此，第 一部分311及第二部分312亦可靠右對齊或靠左對齊，使 得可用空間380僅位於第一部分311之左侧或右側。此外， 可用空間380亦可位於第一部分311之周圍。其他第一部 分311及第二部分312之相對配置關係，凡是第二部分312 之尺寸大於第一部分311之尺寸，讓第二部分312、第一 部分311及電路板360之間形成可用空間380者，均屬於 本發明之範圍。 第一部分311具有一第一面313及多個接墊316。第 一面313面對電路板360並具有第一長度L4，各接墊316 位於第一面313上。電路板360具有多個銲墊361，各接 墊316對準各録墊361，以分別接觸於各銲塾361。第二部 分312具有一第二面314及一第三面315，第二面314及 第三面315為第二部分312相對之兩表面，第二面314面 201207408 分3U並具有第二長度L5’第三面315面對測試 載體310具有多個導通孔317，各導通孔317貫穿載 體310及各接墊316。載體310亦可選擇性地具有多個導 電材料318，各導電材料318位於各導通孔317之内部或 内壁上’並電性連接各接墊316。 測试裝置300更包含多個導電體，各導電體33〇 位於電路板360的銲墊361與第一部分311的接墊316之 間，用以電性連接電路板360及載體31〇。載體31〇係藉 由導電體330電性連接電路板細，使得第二部分312之 第二面314與電路板360之間相隔一高度則，高度則包 含第一部分311之高度H3及導電體33〇之高度。201207408 VI. Description of the Invention: [Technical Field] The present invention relates to a test apparatus and a test apparatus for testing a test object. Odd to another] There is a kind of [previous technology] With the advancement of high-tech technology and the demand for electronic products to be thinner and lighter, the on-board setting must be more than the previous electronic products: electricity: production. Under the circuit of the mouth, the operators are all committed to improving the utilization of space; the accumulation of m potential is greatly improved. Looking for electronic production and printing 7〇 In the design or manufacturing process of electronic products, whether each component can meet the specifications ’ and judge whether it is normal or not, whether it is electrical or not: check the test fixture with ==. Relatively speaking, in order to be in the circuit fixture, it is necessary to sacrifice the space for setting electronic components. Hunger. Further, please refer to Fig. 1A for the first embodiment of the conventional test device. Fig. 1B is a view showing the conventional view at the time of the test. The test device _ is a test and is placed on the circuit board 14G to test whether the electrical property of the object to be tested i3q is normal or functional. The object to be tested 130 has a plurality of contacts i3i and a pair of fresh balls 132 corresponding to the respective contacts 131. The test fixture 1 〇 1 has a body 110, a plurality of probes 111, a cover 120, and a rotating shaft 121 ^ a cassette 122. The base 110 is disposed on the circuit board 140 and has a recess η], an I. 201207408 upper surface U5, a lower surface 116 and a card slot 117. The upper surface 115 and the lower surface U6 are opposite surfaces of the base 11 ,, and one opening 1B of the recess 112 is located on the upper surface 115. The card slot 117 is located on one side of the seat body 11''. One end of each probe ill protrudes from the bottom 114 of the recess 112 for contacting the solder ball 132 of the object to be tested 130; the other end is located at the lower surface 116 of the base ι1 and electrically connected to the circuit board 140. The cover body 120 is located on the base 11b and is coupled to the base by the rotating shaft 121, so that the cover 120 can be rotated up and down with respect to the base n. The cover 120 is used to apply pressure to the object to be tested 使3〇' so that the probes 111 are in close contact with the solder balls 132 of the spring object 130 to be tested. The latch 122 is connected to one side of the cover 12 and has a convex portion 123 for engaging with the slot 117 of the base 11 to engage the cover 120 with the base 11 . When the test object 130 is tested, the cover body 12 is pressed against the object to be tested 13 by placing the cover body 120 and engaging it with the base 110, so that the probes 111 are in close contact with each other. Each solder ball 132. The object to be tested 130 is electrically connected to the circuit board 14 via the probe 111 for electrical or functional testing. In the manner in which the test device 100 is directly disposed on the circuit board 14 ' 'Because the lower surface 116 of the base 11 直接 directly contacts the circuit board 140 , the # electronic component 14 丨 can only be placed on the test device 1 On the outer circuit board 140', the utilization of the space on the circuit board 140 is reduced. In particular, the test device 1 has a larger volume than the object to be tested 130, which greatly occupies space on the circuit board 140, and cannot conform to the current desire to set more electrons on the circuit board 140. The demand for component mi. On the other hand, if the available space on the circuit board 140 is too small, it is difficult to provide sufficient space to set the test apparatus 100, so that the test apparatus 100 cannot be placed on the circuit board 140, resulting in failure to test the object to be tested. 201207408 SUMMARY OF THE INVENTION An object of the present invention is to provide a test apparatus for solving the problem that the utilization of space on a circuit board cannot be improved, and to prevent the test apparatus from being disposed on the circuit board. In one aspect of the invention, a test apparatus is provided for testing a test object on a circuit board. The test device includes a first carrier, a second carrier, and a test fixture. The first carrier is located on the circuit board and electrically connected to the circuit board, and the first carrier has a first length. The second carrier is located on the first carrier and electrically connected to the first carrier, and the second carrier has a second length. The test fixture is located on the second carrier and electrically connected to the second carrier and the sample to be tested. Wherein the second length is greater than the first length, and a space is formed between the first carrier and the second carrier and the circuit board. According to an embodiment of the invention, the available space is located on or around the first carrier. At least one electronic component is disposed on the circuit board, and the electronic component is located at an available space. The circuit board has a plurality of pads, and the first carrier has a first surface, a second surface, a plurality of first pads and a plurality of second pads. The first face faces the circuit board and has a first length, the second face being opposite the first face. The first pad is on the first side and aligned with the pad, and the second pad is on the second side to align the first pad. According to an embodiment of the invention, the testing device further includes a plurality of first conductive bodies, the first conductive body being located between the solder pads and the first pads, and electrically connecting the circuit board and the first carrier. The first carrier has a plurality of first vias or a plurality of first conductive materials, and the first vias penetrate the first carrier, the first pads and the second pads. The first conductive material is located in the first via hole and electrically connected to the first pad and the second pad. According to an embodiment of the invention, the testing device further includes a plurality of second electrical conductors, the second electrical conductors being located between the second pads and the third pads, and electrically connecting the first carrier and the second carrier. The second carrier has a third surface, a fourth 201207408=one having a plurality of second via holes or a plurality of first ones: a test fixture. The third pad position "the three conductive materials are located through the second carrier and the third alignment, the 3 1 π first via hole and electrically connected to the third pad. The first pin. the seat position, the test fixture has - a seat and a plurality of probes = the first "relative to a first end of a sheltered Qiu and a second end, the first end protrudes from the concave hybrid + the i-th carrier. Connecting the object to be tested, the second end protrudes from the lower surface and is electrically connected. According to an embodiment of the invention, the testing device further comprises at least a hole, at least a positioning element, at least a uniform perforation, and even two: Second carrier and test fixture, fixed material position: Another aspect of the invention is to provide a test device for the object to be tested on a circuit board. The test device comprises a carrier and a test fixture, and the circuit board is electrically connected to the circuit board, and the carrier has a splicing carrier and an object to be tested: a space is formed between the plates. Heart, second part and circuit available space. The board has multiple 4 sub = binary = 201207408 face and multiple pads. The first side faces the circuit board and has a first length, the pads being on the first side and aligned with the pads. The second portion has a second side and a third side, the second side facing the first portion and having a second length, the third side being opposite the second side and facing the test fixture. According to an embodiment of the invention, the testing device further comprises a plurality of electrical conductors, the electrical conductors being located between the pads and the pads, and electrically connecting the circuit board and the carrier. The carrier has a plurality of conductive vias or a plurality of conductive materials, the conductive vias penetrating through the carrier and the pads, and the conductive material is located in the vias and electrically connected to the pads. According to an embodiment of the invention, the test fixture has a body and a plurality of probes. The seat body is located on the second portion and has a groove, an upper surface and a lower surface. One of the grooves has an opening on the upper surface, and the lower surface faces the upper surface and faces the carrier. The probe is located in the body and the analyte is located on the probe. Each of the probes has a first end and a second end. The first end protrudes from the bottom of the recess and is electrically connected to the object to be tested. The second end protrudes from the lower surface and is electrically connected to the carrier. According to an embodiment of the invention, the testing device further comprises at least one positioning hole, at least one positioning component and a fixing material. The positioning hole is located on the test fixture, and the positioning component is located on the second portion and aligned with the positioning hole, and the fixing material is located between the carrier and the test fixture. In still another aspect of the invention, a test apparatus is provided for testing a test object on a circuit board. The test device includes a carrier and a test fixture. The carrier is located on the circuit board and electrically connected to the circuit board, and the carrier has a first length. The test fixture is located on the carrier and electrically connected to the carrier and the object to be tested, and the test fixture has a second length. The second length is greater than the first length, and a space is formed between the carrier, the test fixture and the circuit board. According to an embodiment of the invention, the available space is located on or around the carrier, and the circuit board is provided with at least one electronic component, the electronic component being located at the available space. The circuit board has a plurality of pads, and the carrier has a first side, a second side and a plurality of pads. The first side faces the circuit board and has a first length, and the 201207408 surface faces the first surface and faces the alignment pad. The eighth pad is located on the first surface and according to an embodiment of the invention, the test conductor is located at the gate of the pad and the pad, and the device further comprises a plurality of electrical conductors, and the carrier has a plurality of conductive vias: Sexual connection between the board and the carrier. The pad is provided with a conductive material in the via hole and electrically connected to the device. The shell piercing carrier and the probe according to an embodiment of the invention. The seat is located on the carrier, and the mouth/eight has a body and a plurality of and a plurality of ones. M seeding and having a groove, opposite one of the upper surfaces and having a first length II: the opening is located on the upper surface 'lower surface facing the carrier-bottom=electrically at the two ends' the first end protrudes from the groove carrier . The second end of the connecting device protrudes from the lower surface and is electrically connected. According to an embodiment of the invention, the testing device further comprises at least one positioning hole, a clamping element and a fixing material. The positioning hole is located on the test fixture, the positioning component is located on the circuit board and aligned with the positioning hole, and the fixing material is located between the carrier and the test fixture. 1 The above test apparatus according to an embodiment of the present invention uses a carrier to mount a test fixture to form a space between the test fixture, the carrier and the circuit board: to increase the utilization of space on the board and avoid testing. The size of the jig is limited by the space on the board, allowing the test fixture to be easily placed on the substrate, thereby improving the convenience of use. [Embodiment] In the test device according to various embodiments of the present invention, the test fixture is disposed on the carrier, and the length of the carrier connected to the surface of the circuit board is less than the length of the test fixture, so that the test fixture, the carrier, and the circuit board are Form an available space. In this way, more electronic components can be placed on the circuit under the test fixture 201207408 - or a larger test fixture can be placed on the board. Please refer to FIGS. 2A and 2B simultaneously. FIG. 2A is a cross-sectional view showing a test apparatus according to an embodiment of the present invention, and FIG. 2B is a cross-sectional view showing the test apparatus of FIG. 2A of the present invention in a test. One side of the test device 200 is electrically connected to a circuit board 270, and the other side is electrically connected to a test object 280' to test the electrical properties or functions of the test object 280. The testing device 200 includes a first carrier 210, a second carrier 220, and a test fixture 230. The first carrier 210 is located on the circuit board 270 and electrically connected to the circuit board 270. The first carrier 210 has a height H1 and a first length L1, and the direction of the first length L1 is parallel to the circuit board 270. The second 9 carrier 220 is located on the first carrier 210 and electrically connected to the first carrier 210. The second carrier 220 has a second length L2 that is parallel to the circuit board 270 and greater than the first length L1 of the first carrier 210. The second carrier 220 is disposed on the first carrier 210 such that the second carrier 220 and the circuit board 270 are at least separated from the height H1 of the first carrier 210. The test fixture 230 is located on the second carrier 220 and electrically connected to the second carrier 220 and the object to be tested 280. Based on the configuration of the test device 200, a space 29 is formed between the first carrier 21, the second carrier 220 and the circuit board 270, and the available space 290 can be used to set more electronic components 272 on the circuit board. On 270. At the same time, the test apparatus 200 only needs to occupy the space of the first length L1 of the circuit board 270, that is, the test fixture 230 having a size larger than the first length L1 can be set. As shown in FIG. 2A, the first carrier 21 is substantially aligned with the second carrier 220 such that the second carrier 220 protrudes from the left side and the right side of the first carrier 21 () by a length L3, so that the available space 290 is They are respectively located on the left and right sides of the first carrier 210. However, the technique of the present invention is not limited thereto, and the first carrier 210 and the second carrier 220 are also reliably right-aligned or left-aligned, so that the available space 290 of 201207408 is located to the left or right of the first carrier 210. Additionally, the available space 290 can also be located around the first carrier 210. The relative arrangement relationship between the other first carrier 210 and the second carrier 220 is such that the size of the second carrier 22 is larger than the size of the first carrier 210, so that the second carrier 220, the first carrier 210, and the circuit board 270 are formed. Space 290 is within the scope of the invention. The first carrier 210 has a first surface 211, a second surface 212, a plurality of first pads 213, and a plurality of second pads 214. The first surface 211 and the second surface 212 are opposite surfaces of the first carrier 210, and the first surface 211 faces the circuit board 270 and has a first length L1. The first surface 211 and the second surface 212 are exemplified by having the same first length L1, but in another embodiment, the length of the second surface 212 may be smaller or larger than the first length L1 of the first surface 211. Each of the first pads 213 is located on the first surface 211, and each of the second ports 214 is located on the second surface 212. The circuit board 270 has a plurality of pads 271, and each of the first pads 213 is aligned with each of the pads 271 to contact the pads 271, respectively. Each of the second pads 214 of the first carrier 210 is aligned with each of the first pads 213. The first carrier 210 has a plurality of first vias 215, and each of the first vias 215 passes through the first carrier 210, the first pads 213, and the second pads 214. In addition, the first carrier 21A can also have a plurality of first conductive materials 216, and each of the first conductive materials 216 is located on the inner or inner wall of each of the first vias 215, and is electrically connected to the first pads 213 and The second pad 214. The test device 200 further includes a plurality of first conductive bodies 24, and each of the first conductive bodies 240 is disposed between each of the pads 271 and the first pads 213 for electrically connecting the circuit board 270 and the first carrier 210. The second carrier 220 has a third surface 221, a fourth surface 222, and a plurality of third surfaces 221 and a second surface 222 that are opposite surfaces of the second carrier 220. The third surface 221 faces the first carrier 21 and There is a second length L2, and the fourth face 222 faces the test fixture 230. The third pad 223 is 201207408 • on the third surface 221, and each third pad 223 is aligned with each of the second pads 214. The third surface 221 and the fourth surface 222 are exemplified by having the same second length l2. However, in another embodiment, the length of the fourth surface 222 may also be smaller or larger than the second length L2 of the third surface 221 . . The second carrier 220 has a plurality of second vias 224, and each of the second vias 224 extends through the second carrier 220 and each of the third pads 223. In addition, the second carrier 220 can also have a plurality of second conductive materials 225, and each of the second conductive materials 225 is disposed on the inner or inner wall of each of the second vias 224 and electrically connected to each of the third pads 223. The test device 200 further includes a plurality of second electrical conductors 241, and each of the second electrical conductors 241 is located between each of the second interfaces 214 and the third interfaces 223 for electrically connecting the first carrier 21 and the second carrier. 220. The first carrier 210 is electrically connected to the first carrier 210 via the second conductive body 241 via the first conductive body 240 electrically connected to the circuit board 270 ′. Specifically, the third surface 221 of the second carrier 220 is separated from the circuit board 270 by a height H2, and the height H2 includes the height/level of the first carrier 21, the height of the first conductor 240, and the second conductor 241. height. Further, the test fixture 230 has a body 231 and a plurality of probes 232. The seat φ 231 is located on the first carrier 220 and has a recess 235, an upper surface 238 and a lower surface 239. The upper surface 238 and the lower surface 239 are opposite surfaces of the base 231, respectively. One of the recesses 235 is located on the upper surface 238, and the lower surface 239 faces the second carrier 220. Each probe 232 is located in the base 231, and the object to be tested 280 is located on each of the probes 232. Each of the first end 233 and the second end 234 has a first end 235 and a second end 234 of the bottom 237' of the recess & 235 electrically connected to the second conductive material 225. Here, the probe 232 applied to the testing device 200 of the present embodiment may include, but is not limited to, a telescopic probe, an elastic probe, and a fixed one. The second probe of each of the probes 232 protrudes from the seat 201207408. The lower surface 239' of the 231 extends into each of the second vias 224 to electrically connect the second conductive materials 225. However, the manner in which the probes 232 are electrically connected to the second conductive materials 225 is not in this manner. limit. For example, the second end 234 of each probe 232 can also be flush with the lower surface 239. When the test fixture 230 is disposed on the second carrier 220, the lower surface 239 is in contact with the fourth surface 222 of the second carrier 220, so that the probes 232 are in contact with each other and electrically connected to the second conductive materials 225. In addition, the object to be tested 28 has a plurality of contacts 281 or a plurality of solder balls 282, and each of the probes 232 protrudes from the first end 233 of the bottom portion 252b for contacting the contacts 281 or the respective fresh balls 282. A test device 2 further includes at least one positioning hole 25 and at least one positioning member. The positioning hole 250 can be located on the fourth surface 222 of the second carrier 22, and the positioning member 251 can be located at the test fixture 23 The seat 231 is on the surface 239 and is aligned and inserted into the positioning hole 25A to position the test fixture 2 on the second carrier 220. On the other hand, the positioning hole 25〇 and the positioning component 251 can also be oppositely disposed, that is, the positioning hole 25 is disposed on the lower surface 239 of the base body 23ι, and the positioning component 251 is disposed on the fourth surface 222 of the second carrier 220 for testing. The jig 230 is positioned on the second carrier 220. The test device 200 further includes at least a through hole 26 〇 and a 260 piece through hole 260 through the base 231 and the second carrier 22 〇, and the fixing = 2 = is located in the through hole, and is used for fixing the seat 231 and the second as the second 2A. As shown in the figure, when the test object 28 is tested, it is placed on each probe 232, so that the first end 233 of each probe 232 touches the contact point 281 of the object to be tested 280 or each fresh ball 282. One end 233 is in contact with the solder ball 282 as an example. As shown in the m2 diagram, a pressure 291 is applied to the object to be tested so that the ball 282 is in close contact with each of the probes 232. If each probe 232 + shrink probe or elastic probe, when the house force 291 is applied to the object to be tested, the length of each probe 232 of 201207408 will be shortened. The user can manually apply pressure 291 to the object to be tested 280 such that each of the solder balls 282 is in intimate contact with each of the probes 232. However, the present invention is not limited to the manual mode, and the pressure 291 may be applied to the object to be tested 280 by means of a cover, oil pressure, air pressure or mechanical action. When the solder balls 282 are in close contact with the probes 232, the electrical signals of the test object 280 sequentially pass through the contacts 281 of the test object 280, the solder balls 282, the probes 232, the second conductive materials 225, and the second The electrical conductor 241, the first conductive material 216, the first electrical conductor 240, and the pad 271 are transferred to the circuit board 270. Finally, the electrical signal is transmitted from the circuit board 270 to the test circuit and the display screen (not shown) to obtain and display the test result. The test apparatus 200 according to the present embodiment is connected to the circuit board 270 by the first carrier 210 having the smaller first length L1, and is set by the second carrier 220 having the second second length L2. Test fixture 230. The available space 290' between the circuit board 270, the first carrier 210 and the second carrier 220 can be used to place more electronic components 272 on the circuit board 270 below the test fixture 230. At the same time, the first carrier 210 and the second carrier 220 having different lengths are used, so that the test fixture 230 having a large size can be disposed in the limited space of the circuit board 270. 3A and 3B, FIG. 3A is a cross-sectional view showing a test apparatus according to another embodiment of the present invention, and FIG. 3B is a cross-sectional view showing the test apparatus according to FIG. 3A of the present invention. One side of the test device 3 is electrically connected to the circuit board 360' and the other side is used to electrically connect the object to be tested 370 to test the electrical properties or functions of the object to be tested 370. The test device 300 includes a carrier 310 and a test fixture 320. The carrier 310 is located on the circuit board 360 and electrically connected to the circuit board 36A. The carrier 310 has a first portion 311 and a second portion 312 which may be integrally formed, cut-formed or combined. The first portion 311 is located on the circuit board 201207408 360 and has a height H3 and a first length L4, the direction of the first length L4 being parallel to the circuit board 360. The second portion 312 is located on the first portion 311 and is at least a height H3 from the circuit board 360. The second portion 312 has a second length L5 that is parallel to the circuit board 360 and greater than the first length L4 of the first portion 311. The test fixture 320 is located on the carrier 310 and electrically connected to the carrier 310 and the object to be tested 370. Based on the configuration of the test device 300, an available space 380 is formed between the first portion 311, the second portion 312, and the circuit board 360. The available space 380 is used to set more electronic components 362 on the circuit board 360. At the same time, the test device 300 only needs to occupy the space of the first length L4 on the circuit board 360, and the test fixture 320 having a larger size than the first length L4 can be disposed. As shown in FIG. 3A, the first portion 311 is substantially aligned with the second portion 312 such that the second portion 312 protrudes from the left and right sides of the first portion 311 by a length L6, so that the available space 380 is located in the first portion 311, respectively. Left and right sides. However, the technique of the present invention is not limited thereto, and the first portion 311 and the second portion 312 are also reliably right-aligned or left-aligned such that the available space 380 is located only to the left or right of the first portion 311. Further, the available space 380 may also be located around the first portion 311. The relative arrangement relationship between the other first portion 311 and the second portion 312, where the size of the second portion 312 is larger than the size of the first portion 311, and the space 380 is formed between the second portion 312, the first portion 311 and the circuit board 360, It is within the scope of the invention. The first portion 311 has a first surface 313 and a plurality of pads 316. The first side 313 faces the circuit board 360 and has a first length L4, and each pad 316 is located on the first side 313. The circuit board 360 has a plurality of pads 361, each of which is aligned with each of the pads 361 to contact the pads 361, respectively. The second portion 312 has a second surface 314 and a third surface 315. The second surface 314 and the third surface 315 are opposite surfaces of the second portion 312. The second surface 314 is 201207408 divided into 3U and has a second length L5. The third surface 315 faces the test carrier 310 and has a plurality of via holes 317 , each of which extends through the carrier 310 and each of the pads 316 . The carrier 310 can also selectively have a plurality of conductive materials 318, each of which is located on the inner or inner wall of each of the vias 317 and electrically connected to each of the pads 316. The test device 300 further includes a plurality of electrical conductors. The electrical conductors 33 are disposed between the pads 361 of the circuit board 360 and the pads 316 of the first portion 311 for electrically connecting the circuit board 360 and the carrier 31. The carrier 31 is electrically connected to the circuit board by the electrical conductor 330 so that the second surface 314 of the second portion 312 is separated from the circuit board 360 by a height, and the height includes the height H3 of the first portion 311 and the electrical conductor 33. The height of the dragonfly.
:則气台具32〇具有一座體切及多個探針η2。座體 立於分312上’並具有一凹槽325、一上表面 321 下H 329。上表面328及下表面329分別為座體 m之兩表面’凹槽325之一開口 326位於上表面 由7 29面對載體31。。各探針322位於座體奶 ί丄Γ t於各探針322上。每一探針322具有-f 一一第二端324，第-端323突出於凹槽325 底°卩327 ’第二端324電性連接導電材料318。 321 中’各探針322之第二端324突出於座體 的下表面Μ9，並延伸至導通孔317内以電性連接導電 材料318 ’但探針322電性連接導電材料318之方 以此種方式為限。舉例來說各探 ^ :與:表面-齊平。 ϊιΓΛΐϋ下表面329係與第二部分312之第三 = 315接觸’使各探針322接觸並電 318。另外，待測物370具有多個接點爪或多個銲導球電= 201207408 各探針322冑出於底部327之第1 323用以接觸於各接 點371或各銲球372。 測試裝置300更包含至少一定位孔34〇及至少一定位 元4 341，定位孔34〇可位於測試治具32〇之座體321的 下表面329，定位元件341可位於第二部分312之第三面 315，並對準及插入定位孔34〇，使測試治具定位於載 體310上。另一方面，定位孔34〇及定位元件341也可相 反配置，亦即將定位孔340設於第二部分312之第三面 315，定位元件341設於座體321之下表面329測^ 具320定位於載體31〇上。 ^/〇 測試震置300更包含一固定材料35〇，固定材料350 位=載體310之第二部分312的第三面315與座體321的 下表面329之間，用以固定載體31〇及座體321。於一實 1^材料350可為一黏合層’並用以黏合載體310 及座體321。 如第3Α圖所示，當對待測物37〇進行測試時，先將 待測物370置於各探針322上，並使各探針322突出於底 部327之第一端323分別對準並接觸於待測物的各接 點371或各銲球372，此處係以接觸於各銲球為例。 谓3Β圖所示，以一壓力381施加於待測物 370，使各知球372緊密接觸於各探針322。 緊密接觸於各探針322肖，待測物37G的電性訊號依序經 由接點37卜銲球372、探針322、導電材料318、導 330及銲墊361傳遞至電路板36〇。最後，再由電路板36〇 傳遞至測試電路及顯示螢幕(未繪示）等裝置上。 上述依照本實施例之測試裝置300,利用一個載體31〇 將測試治具320連接至電路板36〇上。載體31〇之第二部 分312的第二長度L5大於第一部分311第一長度μ，使 201207408 得電路板360、第一部分311及第二部分312之間形成可 用空間380。以此種方式’測試治具320下方的電路板360 上可以設置更多的電子元件362，且電路板360上可以設 置尺寸較大的測試治具320。 請同時參照第4A及4B圖，第4A圖繪示本發明又一 實施例之測試裝置的剖面圖，第4B圖繪示本發明第4A圖 之測試裝置於測試時的剖面圖。測試裝置400之一側電性 連接電路板460 ’另一側用以電性連接待測物470，以測試 待測物470的電性或功能。 測試裝置400包含一載體410及一測試治具420。載 體410位於電路板460上，並電性連接電路板460。載體 410具有一高度H5 ’且其平行於電路板460的方向上具有 第一長度L7。測試治具420位於載體410上，並電性連接 載體410及待測物470。測試治具420與電路板460相隔 至少一高度H5，且其平行於電路板460的方向上具有一第 二長度L8,第二長度L8大於第一長度L7。 基於前述之配置方式，載體410、測試治具420及電 路板460之間形成一可用空間48〇，可用空間48〇可以用 來設置更多的電子元件462於電路板460上。同時，測試 裝置400僅需佔用電路板460上第一長度L7的空間，即可 設置比第一長度L7更大尺寸的測試治具420。 如第4A圖所示，載體410大致與測試治具420置中 對齊’使測試治具420分別突出於載體410之左侧及右侧 一長度L9 ’故可用空間480係分別位於載體410之左右兩 側。然而’本發明之技術並不限制於此，載體410及測試 治具420亦可靠右對齊或者靠左對齊，使得可用空間480 僅位於載體410之左側或右側。此外，可用空間480亦可 位於載體41〇的周圍。其他載體41〇及測試治具420之相 17 201207408 對配置關係，凡是測試治具420之尺寸大於載體410之尺 寸，讓測試治具420、載體410及電路板460之間形成可 用空間480者，均屬於本發明之範圍。 载體410包含一第一面411、第二面412及多個接墊 413。第一面411及第二面412為載體410相對之兩表面， 第一面411面對電路板460並具有第一長度L7,第二面412 面對測試治具420，各接塾413位於第一面411上。電路 板460具有多個鮮墊461 ’各接塾413對準各銲墊461，以 分別接觸於各銲墊461。: The gas table 32 has a body cut and a plurality of probes η2. The body stands on section 312' and has a recess 325 and an upper surface 321 under H 329. Upper surface 328 and lower surface 329 are respectively the two surfaces of the body m. One of the openings 326 of the recess 325 is located on the upper surface and faces the carrier 31 by 729. . Each probe 322 is located on the body of the probe 322. Each of the probes 322 has a -f-second end 324, and the first end 323 protrudes from the bottom 324 of the recess 325. The second end 324 is electrically connected to the conductive material 318. The second end 324 of each of the probes 321 protrudes from the lower surface Μ 9 of the base body and extends into the through hole 317 to electrically connect the conductive material 318 ′ but the probe 322 is electrically connected to the conductive material 318 The method is limited. For example, each exploration ^ : with: surface - flush. The lower surface 329 is in contact with the third = 315 of the second portion 312 to bring the probes 322 into contact and electrically 318. In addition, the object to be tested 370 has a plurality of contact claws or a plurality of soldering ball powers. 201207408 Each probe 322 is out of the first 323 of the bottom portion 327 for contacting the respective contacts 371 or the solder balls 372. The testing device 300 further includes at least one positioning hole 34 〇 and at least one positioning element 4 341 . The positioning hole 34 〇 can be located at the lower surface 329 of the seat 321 of the test fixture 32 , and the positioning component 341 can be located at the second portion 312 . Three sides 315 are aligned and inserted into the positioning holes 34A to position the test fixture on the carrier 310. On the other hand, the positioning hole 34 and the positioning member 341 can also be oppositely disposed, that is, the positioning hole 340 is disposed on the third surface 315 of the second portion 312, and the positioning member 341 is disposed on the lower surface 329 of the base 321 It is located on the carrier 31〇. The ^/〇 test stimulator 300 further includes a fixing material 35 〇, the fixing material 350 position = between the third surface 315 of the second portion 312 of the carrier 310 and the lower surface 329 of the base 321 for fixing the carrier 31 〇 Seat 321. The material 350 can be an adhesive layer ′ and is used to bond the carrier 310 and the seat 321 . As shown in FIG. 3, when the test object 37 is tested, the object to be tested 370 is first placed on each of the probes 322, and the probes 322 are protruded from the first end 323 of the bottom portion 327, respectively. Each contact 371 or each solder ball 372 that is in contact with the object to be tested is exemplified by contact with each solder ball. As shown in Fig. 3, a pressure 381 is applied to the object to be tested 370 so that the respective balls 372 are in close contact with the respective probes 322. In close contact with each of the probes 322, the electrical signal of the object to be tested 37G is sequentially transmitted to the circuit board 36A via the contacts 37, the solder balls 372, the probes 322, the conductive materials 318, the leads 330, and the pads 361. Finally, it is transferred from the circuit board 36〇 to the test circuit and the display screen (not shown). In the above test apparatus 300 according to the present embodiment, the test fixture 320 is connected to the circuit board 36 by a carrier 31. The second length L5 of the second portion 312 of the carrier 31 is greater than the first length μ of the first portion 311, such that a usable space 380 is formed between the circuit board 360, the first portion 311 and the second portion 312 of the 201207408. In this manner, more electronic components 362 can be disposed on the circuit board 360 below the test fixture 320, and a test fixture 320 having a larger size can be disposed on the circuit board 360. Referring to Figures 4A and 4B, FIG. 4A is a cross-sectional view showing a test apparatus according to still another embodiment of the present invention, and FIG. 4B is a cross-sectional view showing the test apparatus of FIG. 4A of the present invention. One side of the test device 400 is electrically connected to the circuit board 460' and the other side is used to electrically connect the object to be tested 470 to test the electrical properties or functions of the object to be tested 470. The test device 400 includes a carrier 410 and a test fixture 420. The carrier 410 is located on the circuit board 460 and electrically connected to the circuit board 460. The carrier 410 has a height H5' and has a first length L7 in a direction parallel to the circuit board 460. The test fixture 420 is located on the carrier 410 and electrically connected to the carrier 410 and the object to be tested 470. The test fixture 420 is separated from the circuit board 460 by at least one height H5 and has a second length L8 in a direction parallel to the circuit board 460, the second length L8 being greater than the first length L7. Based on the foregoing configuration, a free space 48〇 is formed between the carrier 410, the test fixture 420, and the circuit board 460. The available space 48〇 can be used to set more electronic components 462 on the circuit board 460. At the same time, the test apparatus 400 only needs to occupy the space of the first length L7 on the circuit board 460, and the test fixture 420 having a larger size than the first length L7 can be disposed. As shown in FIG. 4A, the carrier 410 is substantially aligned with the test fixture 420 'so that the test fixture 420 protrudes from the left and right sides of the carrier 410 by a length L9', so that the available space 480 is located at the left and right of the carrier 410, respectively. On both sides. However, the technique of the present invention is not limited thereto, and the carrier 410 and the test fixture 420 are also reliably right-aligned or left-aligned such that the available space 480 is located only to the left or right of the carrier 410. In addition, the available space 480 can also be located around the carrier 41〇. The other carrier 41〇 and the test fixture 420 phase 17 201207408 For the configuration relationship, where the test fixture 420 is larger than the size of the carrier 410, the test fixture 420, the carrier 410 and the circuit board 460 form a free space 480, All are within the scope of the invention. The carrier 410 includes a first surface 411, a second surface 412, and a plurality of pads 413. The first surface 411 and the second surface 412 are opposite surfaces of the carrier 410. The first surface 411 faces the circuit board 460 and has a first length L7. The second surface 412 faces the test fixture 420, and each interface 413 is located at the first surface 411. One side is 411. The circuit board 460 has a plurality of fresh pads 461' each of the pads 413 aligned with the pads 461 to be in contact with the pads 461, respectively.
載體410具有多個導通孔414，各導通孔414貫穿载 體410及各接塾413。載體410亦可選擇性地具有多個導 電材料415，各導電材料415位於各導通孔414之内部或 内壁上，並電性連接各接墊413。 測試裝置400更包含多個導電體43〇，各導電體“ο 位於各銲墊461與各接墊413之間，用以電性連接電路板 460及載體410。 州瑪洛兴兴有一座體421及多個探針422。座 421具有一凹槽425、相對之一上表面428及一下表面42 凹槽425之一開口 426位於上表面428。下表 ，體彻，並具有第二長度L8e各探針42二面於座體面4 :’待測物470位於各探針422上。每一探針422具有 之：？二？一笛第二端424，第一端423突出於凹槽4 二$底。P 427，第二端424電性連接載體41〇之導電材 於-實施例中，各探針422之第二端424突出於心 421的下表面429,並延伸至各導帛 、 導電材料415，但各探針422各^==以電性連接> 方式+播方★電11連接各導電材料415 : 大並不以此種方式為限。舉例來說，各探針422電性; 201207408 接各導電材料415之第二端424亦可與下表面429齊平。 另外’待測物470具有多個接點471或多個銲球472，各 探針422突出於底部427之第一端423用以接觸於各接點 471或各銲球472。 測試裝置400更具有至少一定位元件441及至少一定 位孔440 ’定位孔440位於測試治具420之座體421的下 表面429，定位元件441位於電路板46〇上，並對準及插 入定位孔440，使測試治具42〇定位於載體410上。另— 方面，定位孔440及定位元件441也可相反配置，亦即將 定位孔440設於電路板460，定位元件441設於座體421 的下表面429 ’使測試治具420定位於載體410上。 測試裝置400更包含一固定材料45〇，固定材料45〇 位於載體410及測試治具420之間。於一實施例中，固定 材料450可為一黏合層，用以黏合載體41〇及座體421。 載體410經由導電體430電性連接電路板46〇，測試治具 420藉由固定材料450設置於載體41〇上。座體421之下 表面429與電路板460之間相隔一高度H6，高度H6包含 載體410之高度H5及固定材料45〇之高度。 如第4A圖所示，當對待測物47〇進行測試時，先將 待測物470置於各探針422上，並使各探針422分別對準 並接觸待測物470的各接點471或各銲球472，此處係以 接觸於各銲球472為例。 接著，如第3B圖所示，以一壓力481施加於待測物 470，使各銲球472緊密接觸於各探針422。當各銲球472 緊雄、接觸於各探針422時，待測物470的電訊號依序經由 接點471、銲球472、探針422、導電材料415、導電體“ο 及銲墊461傳遞至電路板460。最後，再由電路板46〇傳 遞至測試電路及顯示螢幕(未繪示）等裝置上。 201207408 本實施例之測試裝置400中，具有較大長度之測試治 具420係藉由較小長度的载體41〇連接至電路板46〇上， 使得電路板460、載體410及座體421之間形成可用空間 480’可用空間480可以設置更多的電子元件462於電路板 460上’且電路板460上亦可設置尺寸較大的測試治具42〇。 在上述各個實施例t，各電路板可為印刷電路板、載 板、基板、功能板或承载件等。待測物可為半導體元件、 半導體晶片、封裝晶片、封裝體、封裝結構、電子元件或 任何的，測元件。载體可為承餅、載板、㈣板、增高 板固疋板疋位板、封膠、絕緣體或非導電體等。輝塾 可為接點、接墊、連接墊、金屬墊、導電墊或引指等。 導電材料可為導電元件、導電體、金屬材料:金屬層 =或凸塊等。接點可為接墊、銲墊、連接塾/金屬塾' 引指、引腳或導線架等。銲球可為金屬球、] 凸塊或導電體等。導通孔可A導雷孔、+泉錫衣 固定材料導電貝穿孔或開孔等。 等。探針可Α 、螺絲、黏性材料、勘膠或黏合層 空Γ可用空間可以用工設置=個 同時測：;空間的利用率。 士======== 性。再者，測試震置中 。、升使用上的彈 治具’具有設計簡單與成本經_來設置測試 201207408 —雖然本發明已以實施方式揭露如上，然其並非用以限 ^本發明，任何熟習此技藝者，在不脫離本發明之精神和 範圍内，當可作各種之更動與潤飾，因此本發明之保護範 圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 ▲為讓本發明之上述和其他目的、特徵、優點與實 能更明顯易懂，所附圖式之說明如下： 第1A圖 第1B圖 面圖。 第2A圖 第2B圖 剖面圖。 第3A圖 圖。 第3B圖 剖面圖。 第4A圖 圖。 第4B圖 剖面圖。The carrier 410 has a plurality of vias 414, each of which extends through the carrier 410 and each of the pads 413. The carrier 410 can also have a plurality of conductive materials 415. The conductive materials 415 are located on the inner or inner walls of the vias 414 and electrically connected to the pads 413. The testing device 400 further includes a plurality of electrical conductors 43. Each of the electrical conductors ο is located between each of the pads 461 and the pads 413 for electrically connecting the circuit board 460 and the carrier 410. The state has a body. 421 and a plurality of probes 422. The seat 421 has a recess 425, an opposite upper surface 428 and a lower surface 42. The opening 426 of the recess 425 is located on the upper surface 428. The lower table is well-formed and has a second length L8e Each probe 42 has two sides on the body surface 4: 'The object to be tested 470 is located on each probe 422. Each probe 422 has: a second end 424, and a first end 423 protrudes from the groove 4 The second end 424 is electrically connected to the conductive material of the carrier 41. In the embodiment, the second end 424 of each probe 422 protrudes from the lower surface 429 of the core 421 and extends to each of the guides. , conductive material 415, but each probe 422 ^ = = electrically connected > way + broadcast ★ electric 11 connected to each conductive material 415: large is not limited in this way. For example, each probe 422 electrical; 201207408 The second end 424 of each conductive material 415 can also be flush with the lower surface 429. In addition, the test object 470 has a plurality of contacts 471 or a plurality of soldering 472, each probe 422 protrudes from the first end 423 of the bottom portion 427 for contacting the contacts 471 or the solder balls 472. The testing device 400 further has at least one positioning component 441 and at least one positioning hole 440. The lower surface 429 of the seat 421 of the fixture 420 is tested. The positioning member 441 is located on the circuit board 46 and aligned and inserted into the positioning hole 440 to position the test fixture 42 on the carrier 410. Alternatively, the positioning hole The 440 and the positioning component 441 can also be disposed oppositely, that is, the positioning hole 440 is disposed on the circuit board 460, and the positioning component 441 is disposed on the lower surface 429 ′ of the base 421 to position the test fixture 420 on the carrier 410. The testing device 400 further includes A fixing material 45 〇, the fixing material 45 〇 is located between the carrier 410 and the test fixture 420. In one embodiment, the fixing material 450 can be an adhesive layer for bonding the carrier 41 〇 and the seat 421. The electrical conductor 430 is electrically connected to the circuit board 46, and the test fixture 420 is disposed on the carrier 41 by the fixing material 450. The lower surface 429 of the base 421 is separated from the circuit board 460 by a height H6, and the height H6 includes the carrier 410. Height H5 and fixture 45 〇 height. As shown in Fig. 4A, when the test object 47 is tested, the test object 470 is first placed on each probe 422, and each probe 422 is aligned and contacted with the test object. Each of the contacts 471 or the solder balls 472 of the 470 is exemplified by contact with each of the solder balls 472. Next, as shown in FIG. 3B, a pressure 481 is applied to the object to be tested 470 to make the solder balls 472. It is in close contact with each probe 422. When the solder balls 472 are tight and contact with the probes 422, the electrical signals of the test object 470 are sequentially passed through the contacts 471, the solder balls 472, the probes 422, the conductive material 415, the conductors ο and the pads 461. It is transferred to the circuit board 460. Finally, it is transferred from the circuit board 46 to the test circuit and the display screen (not shown), etc. 201207408 In the test device 400 of the embodiment, the test fixture 420 has a large length. The smaller length of the carrier 41 is connected to the circuit board 46, so that the available space 480' is available between the circuit board 460, the carrier 410 and the base 421. The available space 480 can be used to set more electronic components 462 on the circuit board. A test fixture 42 having a larger size may also be disposed on the circuit board 460. In each of the above embodiments t, each circuit board may be a printed circuit board, a carrier board, a substrate, a function board or a carrier, etc. The measuring object may be a semiconductor component, a semiconductor wafer, a packaged wafer, a package, a package structure, an electronic component or any measuring component. The carrier may be a carrier, a carrier, a (four) plate, a height-increasing plate, a clamping plate, Sealing, insulator or non-conductor Hui can be a contact, a pad, a connection pad, a metal pad, a conductive pad or a lead. etc. The conductive material can be a conductive element, a conductor, a metal material: a metal layer = or a bump, etc. The contact can be a pad , solder pad, connection 塾 / metal 塾 'lead, pin or lead frame, etc. The solder ball can be a metal ball, a bump or a conductor, etc. The via hole can be A guide hole, + spring tin fixed material conductive Perforation or opening of the shell, etc. etc. The probe can be Α, screw, adhesive material, rubber or adhesive layer. The available space can be set by work = one simultaneous measurement:; space utilization. Shi ====== == Sex. In addition, the test is in the middle of the test. The lift fixture used has a simple design and cost to set the test 201207408. Although the invention has been disclosed in the above embodiments, it is not limited to In the present invention, the scope of the present invention is defined by the scope of the appended claims, unless otherwise departing from the spirit and scope of the invention. Brief description of the schema] ▲ for the above and other purposes of the present invention The features, advantages, and practicalities are more apparent, and the description of the drawings is as follows: Fig. 1A, Fig. 1B, Fig. 2A, Fig. 2B, Fig. 3A, Fig. 3B, Fig. 3B 4A map. Section 4B cross-sectional view.
繪示習知一種測試治具的剖面圖。 繪示習知第1A圖之測試裝置於測試時的剖 繪示本發明一實施例之測試裝置的剖面圖。 繪示本發明第2A圖之測試裝置於測試時的 繪示本發明另-實施例之測試裝置的剖面 繪示本發明第3A圖之測試裝置於測試時的 繪示本發明又—實施例之測試裝置的剖面 繪示本發明第4A圖之測試裝置於測試時的 【主要元件符號說明】 111 :探針 112 :凹槽 113 :開口 100 :測試裝置 101 :測試治具 110 :座體 21 201207408A cross-sectional view of a conventional test fixture is shown. A cross-sectional view of a test apparatus according to an embodiment of the present invention is shown in a cross-sectional view of a test apparatus of the prior art. The test device of the second embodiment of the present invention is shown in a cross-sectional view of the test device according to another embodiment of the present invention. The test device of the third embodiment of the present invention is shown in the test. The cross section of the test apparatus shows the main component symbol description of the test apparatus of FIG. 4A of the present invention. 111: Probe 112: Groove 113: Opening 100: Test apparatus 101: Test fixture 110: Seat 21 201207408
114 :底部 232 ： 115 :上表面 233 ： 116 :下表面 234 ： 117 :卡槽 235 ： 120 :蓋體 236 ： 121 :轉轴 237 : 122 :卡榫 238 : 123 :凸部 239 ： 130 :待測物 240 : 131 :接點 241 : 132 :銲球 250 ： 140 :電路板 251 ： 141 :電子元件 260 : 200 :測試裝置 261 ： 210 :第一載體 270 ： 211 :第一面 271 : 212 :第二面 272 ： 213 :第一接墊 280 : 214 :第二接墊 281 ： 215 :第一導通孔 282 ： 216 :第一導電材料 290 ： 220 :第二載體 291 ： 221 :第三面 300 ： 222 :第四面 310 ： 223 :第三接墊 311 : 224 :第二導通孔 312 : 225 :第二導電材料 313 : 230 :測試治具 314 231 :座體 315 探針 第一端 第二端 凹槽 開口 底部 上表面 下表面 第一導電體 第二導電體 定位孔 定位元件 貫穿孔 固定材料 電路板 銲墊 電子元件 待測物 接點 鲜球 可用空間 壓力 測試裝置 載體 第一部分 第二部分 第一面 •第—面 :第三面 22 201207408 ’ 316:接墊 317 :導通孔 318 :導電材料 320 :測試治具 321 :座體 322 :探針 323 :第一端 324 :第二端 325 :凹槽 326 :開口 • 327 :底部 328 :上表面 329 :下表面 330 :導電體 340 :定位孔 341 :定位元件 350 :固定材料 360 :電路板 361 :銲墊 • 362 :電子元件 370 :待測物 371 :接點 372 :銲球 380 :可用空間 381 :壓力 400 :測試裝置 410 :載體 ， 411 :第一面 412 :第二面 413 ： 接墊 414 : 導通孔 415 ： 導電材料 420 ： 測試治具 421 ： 座體 422 ： 探針 423 ： 第一端 424 ： 第二端 425 ： 凹槽 426 ： 開口 427 ： 底部 428 ： 上表面 429 ： 下表面 430 ： 導電體 440 ： 定位孔 441 ： 定位元件 450 ： 固定材料 460 ： 電路板 461 : 銲墊 462 ： 電子元件 470 ： 待測物 471 ： 接點 472 ： 鲜球 480 ： 可用空間 481 ： 壓力 H1〜 H6 :高度 L1、 L4、L7 :第一 長度 L2、 L5、L8 :第二 長度 L3、 L6、L9 :長度 23114: bottom 232 : 115 : upper surface 233 : 116 : lower surface 234 : 117 : card slot 235 : 120 : cover 236 : 121 : shaft 237 : 122 : cassette 238 : 123 : convex 239 : 130 : Measuring object 240 : 131 : Contact 241 : 132 : Solder ball 250 : 140 : Circuit board 251 : 141 : Electronic component 260 : 200 : Test device 261 : 210 : First carrier 270 : 211 : First side 271 : 212 : Second surface 272: 213: first pad 280: 214: second pad 281: 215: first via 282: 216: first conductive material 290: 220: second carrier 291: 221: third face 300 : 222 : fourth side 310 : 223 : third pad 311 : 224 : second via 312 : 225 : second conductive material 313 : 230 : test fixture 314 231 : seat 315 probe first end second End groove opening bottom upper surface lower surface first conductor second conductor positioning hole positioning member through hole fixing material circuit board pad electronic component test object contact fresh ball available space pressure test device carrier first part second part One side • the first side: the third side 22 201 207408 '316: pad 317: via 318: conductive material 320: test fixture 321 : seat 322 : probe 323 : first end 324 : second end 325 : recess 326 : opening • 327 : bottom 328 : Upper surface 329: lower surface 330: conductor 340: positioning hole 341: positioning member 350: fixing material 360: circuit board 361: pad • 362: electronic component 370: object to be tested 371: contact 372: solder ball 380: Available space 381: Pressure 400: Test device 410: Carrier, 411: First face 412: Second face 413: Pad 414: Via 415: Conductive material 420: Test fixture 421: Seat 422: Probe 423: First end 424: second end 425: groove 426: opening 427: bottom 428: upper surface 429: lower surface 430: electrical conductor 440: positioning hole 441: positioning element 450: fixing material 460: circuit board 461: pad 462 : Electronic component 470 : Object to be tested 471 : Contact 472 : Fresh ball 480 : Available space 481 : Pressure H1 to H6 : Height L1 , L4 , L7 : First length L2 , L5 , L8 : Second Length L3, L6, L9: Length 23