WO2009136721A3 - A test socket and a fabrication method therefor - Google Patents

A test socket and a fabrication method therefor Download PDF

Info

Publication number
WO2009136721A3
WO2009136721A3 PCT/KR2009/002360 KR2009002360W WO2009136721A3 WO 2009136721 A3 WO2009136721 A3 WO 2009136721A3 KR 2009002360 W KR2009002360 W KR 2009002360W WO 2009136721 A3 WO2009136721 A3 WO 2009136721A3
Authority
WO
WIPO (PCT)
Prior art keywords
housing
test socket
method therefor
fabrication method
holes
Prior art date
Application number
PCT/KR2009/002360
Other languages
French (fr)
Korean (ko)
Other versions
WO2009136721A2 (en
Inventor
이재학
Original Assignee
(주)아이에스시테크놀러지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)아이에스시테크놀러지 filed Critical (주)아이에스시테크놀러지
Publication of WO2009136721A2 publication Critical patent/WO2009136721A2/en
Publication of WO2009136721A3 publication Critical patent/WO2009136721A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention relates to a test socket and a fabrication method therefor. In particular, the present invention relates to a test socket for electrically connecting terminals for an electric component and a pad of a testing device, and a fabrication method therefor, the test socket comprising: a housing with a multiplicity of longitudinally extending through holes formed in counter positions of the terminals for the electronic component; and a conductive member joined with the housing and electrically connected to the terminals for the electronic component and to the pad of the testing device, wherein the conductive member includes: a multiplicity of first conductors arranged, on the upper side of the housing, in counter positions of the through holes, while remaining in fixed positions with respect to each other by means of a first film; a multiplicity of second conductors arranged, on the lower side of the housing, in counter positions of the through holes, while remaining in fixed positions with respect to each other by means of a second film bonded to the housing; and electrically connected members which are inserted into the through holes, each having an upper end contacting the lower surface of the first conductor and a lower end contacting the top surface of the second conductor. Here, the first conductors and the electrically connected members are joined together by soldering, and the second conductors and the electrically-connected members are also joined together by soldering.
PCT/KR2009/002360 2008-05-06 2009-05-06 A test socket and a fabrication method therefor WO2009136721A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080041874A KR100926776B1 (en) 2008-05-06 2008-05-06 Manufacturing method of test socket
KR10-2008-0041874 2008-05-06

Publications (2)

Publication Number Publication Date
WO2009136721A2 WO2009136721A2 (en) 2009-11-12
WO2009136721A3 true WO2009136721A3 (en) 2010-02-25

Family

ID=41265147

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/002360 WO2009136721A2 (en) 2008-05-06 2009-05-06 A test socket and a fabrication method therefor

Country Status (2)

Country Link
KR (1) KR100926776B1 (en)
WO (1) WO2009136721A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100968622B1 (en) 2008-02-25 2010-07-08 주식회사 아이에스시테크놀러지 Test socket and fabrication method thereof
KR101266124B1 (en) 2012-04-03 2013-05-27 주식회사 아이에스시 Test socket with high density conduction section and fabrication method thereof
KR102692131B1 (en) * 2018-12-17 2024-08-07 주식회사 아이에스시 Connector for electrical connection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084047A (en) * 2001-06-29 2003-03-19 Sony Corp Measuring jig for semiconductor device
KR20060062824A (en) * 2004-12-06 2006-06-12 주식회사 아이에스시테크놀러지 Silicone connector for testing semiconductor package
JP2006194620A (en) * 2005-01-11 2006-07-27 Tokyo Electron Ltd Probe card and contact structure for inspection

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151550A (en) 2000-11-15 2002-05-24 Nec Corp Semiconductor device, its manufacturing method and coil spring cutting jig and coil spring feeding jig for use therein

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084047A (en) * 2001-06-29 2003-03-19 Sony Corp Measuring jig for semiconductor device
KR20060062824A (en) * 2004-12-06 2006-06-12 주식회사 아이에스시테크놀러지 Silicone connector for testing semiconductor package
JP2006194620A (en) * 2005-01-11 2006-07-27 Tokyo Electron Ltd Probe card and contact structure for inspection

Also Published As

Publication number Publication date
KR100926776B1 (en) 2009-11-16
WO2009136721A2 (en) 2009-11-12
KR20090116136A (en) 2009-11-11

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