CN114076837A - Bearing device - Google Patents

Bearing device Download PDF

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Publication number
CN114076837A
CN114076837A CN202010800867.0A CN202010800867A CN114076837A CN 114076837 A CN114076837 A CN 114076837A CN 202010800867 A CN202010800867 A CN 202010800867A CN 114076837 A CN114076837 A CN 114076837A
Authority
CN
China
Prior art keywords
base
target
disposed
limiting
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010800867.0A
Other languages
Chinese (zh)
Inventor
陈承韶
杜昭明
杨志明
廖茂发
刘翰其
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siliconware Precision Industries Co Ltd
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Publication of CN114076837A publication Critical patent/CN114076837A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06705Apparatus for holding or moving single probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention relates to a bearing device, in particular to a bearing device for a detection machine table, which is characterized in that a limiting piece is detachably arranged on a placing area of a base, a positioning piece pivoted with the limiting piece is far away from or close to the limiting piece, and the base is sealed by a cover body, so that when the bearing device is used, a probe is clamped and positioned in the placing area through the matching of the limiting piece and the positioning piece, and then the bearing device is arranged on the detection machine table, and the placing stability of a probe card is improved.

Description

Bearing device
Technical Field
The present invention relates to a carrier, and more particularly, to a removable carrier for testing in a semiconductor manufacturing process.
Background
With the rapid development of the electronic industry, electronic products are also gradually moving toward multi-function and high-performance. At present, there are many technologies applied in the field of Chip packaging, such as flip Chip Package modules, such as Chip Scale Package (CSP), Direct Chip Attached Package (DCA), or Multi-Chip Module Package (MCM), or three-dimensional stacking and integrating chips into a three-dimensional integrated circuit (3D IC) Chip stacking Module.
The electrical test equipment used in the sealing stage of the existing sealing and testing plant adopts a standard detection machine, and the standard detection machine is used for detecting a single electronic packaging piece and a terminal product thereof.
However, it is known that the specifications of the electronic package are often changed during the inspection operation, so the inspection factory needs to configure different Probe cards (Probe cards) according to the design requirements of different electronic packages, and thus needs to configure the inspection machine matching the Probe cards (Probe cards), which results in time consuming steps for replacing the inspection machine, and expensive expenses for purchasing various inspection machines, which makes it difficult to reduce the manufacturing cost of the electronic package and the terminal product thereof.
Therefore, it is an object of the present invention to overcome the above-mentioned drawbacks of the prior art.
Disclosure of Invention
To solve the above-mentioned problems, the present invention provides a carrier apparatus for improving the stability of a probe card.
The bearing device of the invention comprises: the base is provided with a placing area for placing a target object; the limiting piece is arranged on the placing area of the base to limit the target object; a positioning member pivotally connected to the base or the limiting member in a freely pivotable manner, and configured to position the target on the placement area of the base; and a cover body pivoted to the base to cover the target.
In the above-mentioned bearing device, the placing area is hollow so as to form an accommodating space with the limiting member.
In the above-mentioned carrying device, the position-limiting member is detachably and correspondingly disposed on the base.
In the above-mentioned bearing device, the position-limiting member is an annular frame.
In the above-mentioned carrying device, the position-limiting member is disposed in a manner of being rotatable relative to the base.
In the above-mentioned bearing device, a stop portion fixedly connected to the positioning element is disposed at an edge of the position-limiting element.
In the above-mentioned bearing device, a fixing portion fixedly connected to the position-limiting member is disposed at an edge of the positioning member.
In the above-mentioned carrying device, at least one telescopic structure is disposed between the positioning element and the base.
In the above-mentioned bearing device, at least one telescopic structure is disposed between the cover and the base.
The above-mentioned carrying device further includes at least one fixing structure disposed on the base to limit a displacement range of the wire of the target.
In view of the above, when the carrying device of the present invention is used, the positioning member and the positioning member are mainly used to cooperate to position the target object in the placement area, and then the carrying device is installed in the detection machine, so that the carrying device can improve the placement stability of the target object, and the target object is not easily damaged. Therefore, when the bearing device is used for carrying out semiconductor packaging detection operation, different probe cards (namely the target object) can be taken and replaced according to the specification of the electronic packaging part without replacing a detection machine table, so that the detection time is saved, and the detection operation can be carried out only by using a single detection machine table matched with the bearing device, so that the equipment cost can be greatly saved, and the manufacturing cost of the electronic packaging part and a terminal product thereof can be reduced.
Drawings
Fig. 1 is a schematic view of a carrying device of the present invention.
Fig. 2 is a schematic top plan view of the bearing device of the present invention when an object is mounted.
Fig. 3A to fig. 3B are partial side views illustrating a position limiting member and a position determining member of a bearing device of the invention during operation.
Description of the reference numerals
1 bearing device
10 protective member
11: base
11a placement area
112 supporting structure
12 limiting part
12a inner peripheral surface
120 stopping part
120a port
120b track
121 a driving part
13 positioning part
13a outer peripheral surface
130 fixed part
131,141 telescopic structure
132 operating part
133 buffer part
14 cover body
142 handle
143 gap of
15,16 fixing structure
151 bundling part
161 guide groove
2: target object
A, A' target directions
B, C pressing direction
S, an accommodating space.
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.
It should be understood that the structures, proportions, and dimensions shown in the drawings and described herein are for illustrative purposes only and are not intended to limit the scope of the present invention, which is defined by the claims, but rather by the claims. In addition, the terms "above", "first", "second" and "a" as used herein are for the sake of clarity only, and are not intended to limit the scope of the present invention, and changes or modifications of the relative relationship between them are considered to be within the scope of the present invention without substantial technical changes.
Fig. 1 is a perspective view of a carrying device 1 of the present invention. As shown in fig. 1, the carrying device 1 includes: a base 11, a limiting member 12, a positioning member 13 and a cover 14.
The base 11 is a substantially rectangular base for supporting a target 2, as shown in fig. 2, and can be mounted on a testing machine (not shown).
In this embodiment, the target 2 is a Probe Card (Probe Card) for testing by a testing machine.
In addition, a placement area 11a for placing the object 2 is defined at the center of the base 11. For example, the placement region 11a is a circular hollow, and a frame-shaped supporting structure 112 is formed at the bottom of the hollow. Specifically, a hollow-bottom basin-shaped protection member 10 is disposed in the placement area 11a, and the supporting structure 112 is a symmetrical frame and disposed at the bottom of the protection member 10, so as to stably support the target object 2. It should be understood that the embodiments of the placement area 11a are various and not limited to the above, and thus, the present invention is described herein.
The limiting member 12 is a ring-shaped frame body, which is detachably disposed on the base 11 corresponding to the placing area 11a, so as to facilitate replacement of the limiting members 12 with different sizes.
In the embodiment, the position-limiting member 12 abuts against the wall surface of the protecting member 10 to be placed on the upper surface of the base 11, so that the position-limiting member 12 does not fall off from the placing area 11a, and the assembling and disassembling are facilitated. For example, the limiting member 12 is substantially aligned with the edge of the placing region 11a to form a receiving space S in the placing region 11a to frame the object 2, thereby facilitating the installation of the object 2. Specifically, the position-limiting member 12 can rotate relative to the base 11 to rotate to a desired position. It should be understood that the limiting member 12 is not limited to the above description, but may be various.
In addition, at least one position of the edge of the position-limiting member 12 can be configured with at least one stopping portion 120 as required to stop the positioning member 13. For example, the stopper 120 is a corner groove, and as shown in fig. 3A, the stopper 120 has a port 120a and a track 120b communicating with the port 120a and turning opposite to the port 120 a. Specifically, the port 120a communicates with the top surface of the position-limiting member 12, and the rail 120b extends obliquely along the inner circumferential surface 12a of the position-limiting member 12.
In addition, the position-limiting member 12 can be configured with a driving portion 121, such as a handle, as required, so as to facilitate pulling or rotating the position-limiting member 12.
The positioning element 13 is an annular frame body, which is pivotally connected to one side of the base 11 and/or one side of the limiting element 12 in a freely pivotable manner so as to move close to or away from the limiting element 12, and the positioning element 13 is used for positioning the target 2 on the placement area 11a of the base 11.
In the embodiment, the other side of the positioning element 13 opposite to the pivot joint is provided with a control portion 132, such as a handle, for being held, so that an operator can hold the control portion 132 to lift or cover the positioning element 13.
In addition, at least one telescopic structure 131 such as an oil pressure rod or an air pressure rod can be disposed between the base 11 and the positioning member 13 as required. For example, the retractable structure 131 is a retractable mechanism, and two opposite ends thereof are movably connected to the base 11 and the positioning member 13, respectively, so as to extend and retract the positioning member 13. It should be understood that the telescopic structure 131 is not limited to the above-mentioned various types, such as a spring mechanism.
In addition, the positioning element 13 can be configured with at least one fixing portion 130 corresponding to the stopping portion 120 of the limiting element 12, so that the fixing portion 130 is engaged with the stopping portion 120, and the positioning element 13 and the limiting element 12 are fixedly connected to each other. For example, the fixing portion 130 is a convex column, and is formed on the outer peripheral surface 13a of the positioning member 13 so as to enter and exit the track 120b from the port 120a of the stopper 120. Specifically, as shown in fig. 3A to 3B, after the positioning element 13 is covered, the fixing portion 130 enters one side of the rail 120B from the port 120a, and then the limiting element 12 is rotated along the target direction a (clockwise as shown in fig. 3A or fig. 1) to make the fixing portion 130 located at the other side of the rail 120B, so that the fixing portion 130 cannot leave the rail 120B from the port 120a, thereby fixedly connecting the positioning element 13 and the limiting element 12, that is, the positioning element 13 is not bounced upward by the telescopic structure 131.
In addition, the surface of the positioning element 13 facing the limiting element 12 may have a plurality of convex-column-shaped buffering portions 133, such as rubber or other elastic materials, which are arranged at intervals along the bottom surface of the annular frame, so that when the positioning element 13 presses the target object 2, the buffering portions 133 can be pressed against and contact the target object 2, thereby preventing the target object 2 from being scratched or cracked.
Therefore, when placing the object 2 into the accommodating space S, the positioning element 13 is pivoted toward the limiting element 12 (in a pressing direction B shown in fig. 1) to cover the supporting structure 112, so that the positioning element 13 presses the periphery of the object 2, so that the main probe of the object 2 (probe card) is exposed out of the positioning element 13, and then the limiting element 12 is rotated to fix the positioning element 13. On the contrary, when the detection operation is completed or the target object 2 needs to be replaced, the limiting member 12 is rotated in the opposite direction of the target direction a (as the target direction a' shown in fig. 3B or the counterclockwise direction in fig. 1), so that the fixing portion 130 is located at the port 120a of the rail 120B, the fixing portion 130 can leave the rail 120B from the port 120a, that is, the positioning member 13 is sprung upwards by the telescopic structure 131, so as to pivot and lift the positioning member 13, that is, the user can replace the target object 2 from the accommodating space S.
The cover 14 is pivotally connected to the base 11 to move toward or away from the base 11.
In the embodiment, the other side of the cover 14 opposite to the pivot joint is provided with a handle 142 for holding, so that an operator can hold the handle 142 to lift or cover the cover 14. Therefore, when the target 2 is placed in the accommodating space S, the positioning element 13 abuts against the target 2, and then the cover 14 is rotated toward the base 11 (as shown in the pressing direction C in fig. 1) to cover the upper side of the base 11, so that the cover 14 covers the target 2 to achieve the purpose of dust prevention, and the target 2 can be operated in the detection machine. On the other hand, when the detection operation is completed or the target object 2 needs to be replaced, the cover 14 and the positioning member 13 can be pivoted and lifted in sequence to replace the target object 2 from the accommodating space S.
In addition, at least one telescopic structure 141 such as an oil pressure rod or an air pressure rod can be disposed between the base 11 and the cover 14 as required. For example, the retractable structure 141 is a retractable mechanism, and two opposite ends thereof are movably connected to the base 11 and the cover 14 respectively, so as to be correspondingly retractable and rotatable during the operation of the cover 14. It should be understood that the telescopic structure 141 is not limited to the above-mentioned spring mechanism.
In addition, corresponding fixing structures (such as embedding, clamping, buckling, screwing, etc.) can be respectively disposed between the cover 14 and the base 11, so that the cover 14 can be temporarily fixed to the base 11 when in the under-cover state, thereby preventing foreign matters from entering the accommodating space S due to the looseness of the cover 14 during the detection process or the transportation process of the carrying device 1, and preventing the damage of the target 2.
In addition, one side of the cover 14 is provided with a notch 143 for passing the wire (not shown) of the target 2. For example, a fixing structure 16 corresponding to the notch 143 may be disposed on the base 11, and the upper edge thereof may have a plurality of guiding grooves 161 for guiding wires, such as radio frequency cables (RF cables), of the target 2 to pass through and electrically connect to a detection machine. Specifically, after the cover 14 is covered, the notch 143 is adapted to accommodate the fixing structure 16 to limit the displacement range of the wire of the target 2, so that the wire of the target 2 is constrained by the cover 14 and the fixing structure 16 and will not move, and the wire is prevented from bending, thereby maintaining the stability of signal transmission of the wire.
It should be understood that, depending on the wiring type of the object 2, the carrying device 1 can design various fixing structures on the base 11, such as the flat cable type fixing structure 15 having the bundling portion 151, so as to integrate the flat cable type wire of the object 2 into the bundling portion 151 and achieve the purpose of preventing the flat cable type wire of the object 2 from bending.
Therefore, when the carrying device 1 of the present invention is used, the positioning member 12 and the positioning member 13 are matched to position the target 2 in the accommodating space S, and then the carrying device 1 is installed in the inspection machine, and the wire of the target 2 is electrically connected to the inspection machine or the electronic package, so that the carrying device 1 not only can improve the placing stability of the target 2, so that the target 2 is not easily damaged, but also can ensure the good state of the wire of the target 2 through the fixing structures 15 and 16 to stably transmit signals, so as to ensure the reliability of the inspection operation.
In summary, when the carrier device 1 of the present invention performs the semiconductor package inspection operation, different probe cards (i.e. the target 2) can be replaced according to the specification of the electronic package without replacing the inspection machine, so as to save the inspection time, and the inspection operation can be performed only by using a single inspection machine in combination with the carrier device 1 (e.g. directly replacing the carrier device 1 according to the specification of the target 2), so that the equipment cost can be greatly saved, and the manufacturing cost of the electronic package and the terminal product thereof can be reduced.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above-described embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.

Claims (10)

1. A load bearing device, comprising:
the base is provided with a placing area for placing a target object;
the limiting piece is arranged on the placing area of the base to limit the target object;
a positioning member pivotally connected to the base or the limiting member in a freely pivotable manner, and configured to position the target on the placement area of the base; and
a cover pivotally connected to the base for covering the object.
2. The carrying device as claimed in claim 1, wherein the placement region is hollow to form an accommodating space with the position-limiting member.
3. The carrying device as claimed in claim 1, wherein the position-limiting member is detachably disposed on the base.
4. The carrier device of claim 1 wherein the retainer is a ring-shaped frame.
5. The carrier device of claim 1, wherein the retaining member is rotatably disposed relative to the base.
6. The carrier device as claimed in claim 1, wherein a stop portion is disposed at an edge of the position-limiting member and is fixedly connected to the positioning member.
7. The carrier device as claimed in claim 1, wherein a fixing portion is disposed at an edge of the positioning member and is fixed to the position-limiting member.
8. The carrying device as claimed in claim 1, wherein at least one telescopic structure is disposed between the positioning member and the base.
9. The carrier in claim 1, wherein at least one retractable structure is disposed between the cover and the base.
10. The carrier device of claim 1 further comprising at least one securing structure disposed on the base to limit the range of displacement of the wire of the target.
CN202010800867.0A 2020-08-03 2020-08-11 Bearing device Pending CN114076837A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW109126195A TWI741715B (en) 2020-08-03 2020-08-03 Carrier device
TW109126195 2020-08-03

Publications (1)

Publication Number Publication Date
CN114076837A true CN114076837A (en) 2022-02-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010800867.0A Pending CN114076837A (en) 2020-08-03 2020-08-11 Bearing device

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CN (1) CN114076837A (en)
TW (1) TWI741715B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101052886A (en) * 2004-09-03 2007-10-10 塞莱敦体系股份有限公司 Replaceable probe apparatus for probing semiconductor wafer
TW200823469A (en) * 2006-11-29 2008-06-01 Advanced Semiconductor Eng Testing jig
TW201207408A (en) * 2010-08-11 2012-02-16 Chipsip Technology Co Ltd Test apparatus
CN209673858U (en) * 2019-02-21 2019-11-22 紫光宏茂微电子(上海)有限公司 The vertical jig for placing probe card can be stablized
CN209979682U (en) * 2019-01-31 2020-01-21 杭州广立微电子有限公司 Test head for probe station

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4832207B2 (en) * 2006-08-09 2011-12-07 富士通セミコンダクター株式会社 Transport tray for prober equipment
JP6466128B2 (en) * 2014-10-08 2019-02-06 株式会社日本マイクロニクス Probe card
TW201710685A (en) * 2015-09-11 2017-03-16 Wei-Fang Fan Test socket structure, and assembly method of integrated circuit test structure comprising the same enabling significantly shortening the time required to install probes in subsequent applications by directly and integrally assembling probes with upper and lower covers
TWI669509B (en) * 2016-11-03 2019-08-21 台灣福雷電子股份有限公司 Ic test socket and method for determining esd decay time capability of ic test socket
TWI621194B (en) * 2017-06-28 2018-04-11 中華精測科技股份有限公司 Testing board component
TWI677691B (en) * 2017-06-28 2019-11-21 萬潤科技股份有限公司 Electronic component detection method and device, and carrier disk used in the detection method
JP6948873B2 (en) * 2017-07-31 2021-10-13 東京エレクトロン株式会社 How to calibrate the measuring instrument and the case
TW202009503A (en) * 2018-08-10 2020-03-01 蔚華科技股份有限公司 Pogo pin thin plate structure capable of improving production work efficiency and reducing manufacturing cost

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101052886A (en) * 2004-09-03 2007-10-10 塞莱敦体系股份有限公司 Replaceable probe apparatus for probing semiconductor wafer
CN102253251A (en) * 2004-09-03 2011-11-23 塞莱敦体系股份有限公司 Replaceable probe apparatus for probing semiconductor wafer
TW200823469A (en) * 2006-11-29 2008-06-01 Advanced Semiconductor Eng Testing jig
TW201207408A (en) * 2010-08-11 2012-02-16 Chipsip Technology Co Ltd Test apparatus
CN209979682U (en) * 2019-01-31 2020-01-21 杭州广立微电子有限公司 Test head for probe station
CN209673858U (en) * 2019-02-21 2019-11-22 紫光宏茂微电子(上海)有限公司 The vertical jig for placing probe card can be stablized

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TWI741715B (en) 2021-10-01

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