TWI710775B - Testing device for antenna in package ic - Google Patents

Abstract

A testing device for testing an antenna in package IC is disclosed. The wireless chip includes a signal antenna. The testing device includes a substrate including a socket disposed on the substrate. The socket has a positioning surface for supporting the antenna in package IC. A movable arm includes a pick-and-place head movable above the socket for extracting and placing the antenna in package IC on the positioning surface. A reflector is movably disposed above the socket. A signal receiving chip located on one side of the socket and below the reflector is electrically connected to the substrate. The antenna in package IC is configured to emit wireless signals which are to be reflected to the receiving chip via the reflector for testing.

Description

Integrated circuit chip testing device

This application relates to a testing device, in particular to a testing device for integrated circuit chips with wireless antennas.

Wireless transmission and wireless communication technologies have been widely used in all walks of life, and have gradually replaced traditional methods of information dissemination, thereby creating a new generation of electronic industries. In order to meet the needs of wireless transmission and communication, all kinds of electronic products have the function of wireless transmission. Among them, an integrated circuit (IC) with a wireless antenna is one of the indispensable components.

The traditional wireless antenna IC chip mainly includes an antenna and a microcircuit, and has an antenna in package (AIP) structure. By setting the IC chip in the electronic product, wireless signal transmission can be performed with the receiving or transmitting end. Therefore, the testing of wireless antenna IC chips is also a major part of the production cost. Currently, there is no uniform specification for automatic mass production and testing of AIP chips, and it is even necessary to rely on personnel to manually pick and place chips in sockets, which seriously affects production efficiency. Specifically, in the traditional automatic mass production test equipment for AIP chips, the socket is equipped with a test antenna and the socket has an upper cover. During the test, the personnel need to use a suction pen to pick up and place the chip on the socket, and then cover the upper cover of the socket, and then press the chip with the upper cover to make the solder ball of the chip conduct with the pogo pin on the socket. Since the test antenna on the upper cover of the socket needs to receive the wireless signal from the chip, it will interfere with the transfer machine to pick up and place the chip, making it difficult to realize automated testing. In addition, the current signal testing method for wireless antenna IC chips is to use a test antenna to transmit the test signal to expensive automatic test equipment (ATE) for final testing. However, for basic wireless signal testing, ATE is expensive and not the best solution for testing.

The purpose of the present application is to provide a testing device for integrated circuit chips with wireless signal antennas, which can perform rapid and accurate automated testing of the signal quality of integrated circuit chips in a chip carrier.

Another object of the present application is to provide a testing device for integrated circuit chips that can automatically detect whether the wireless signal of the integrated circuit chip meets the testing standard on the same test platform through an unobstructed signal transmission environment.

In order to achieve the foregoing objective, the present application provides a testing device for an integrated circuit chip. The integrated circuit chip includes a wireless signal antenna and a tin spherical surface provided on the bottom of the integrated circuit chip. The testing device includes: a carrier including a The socket provided on the carrier board has a flexible board for holding the integrated circuit chip; a movable arm which can move above the socket for picking up and placing the integrated circuit chip on The soft board; a reflective cover with a reflective surface, which can be movably installed above the socket; and a wireless receiving element, located on one side of the socket and below the reflective surface, and electrically connected to the carrier The board, wherein the wireless signal antenna of the integrated circuit chip is used to send out a wireless signal, and is reflected to the wireless receiving element through the reflective surface for testing.

According to an embodiment of the present application, the testing device further includes a socket upper cover, which is movably disposed above the socket, and includes a connecting portion and a pressing post, wherein the connecting portion is disposed facing the socket, and the pressing The pressing post is arranged on the connecting part and extends a predetermined distance in the direction of the socket for pressing against the edge of the integrated circuit chip.

According to another embodiment of the present application, the testing device further includes an open space formed between the pressing column, the connecting portion and the reflecting surface, and is exposed on the socket.

According to another embodiment of the present application, the reflective cover is disposed below the connecting portion of the upper cover of the socket, and one end of the reflective cover is located directly above the socket, and the other end is inclined downwardly toward the carrier board.

According to another embodiment of the present application, the other end of the reflective cover extends to the wireless receiving element.

According to another embodiment of the present application, an end of the pressing post of the upper cover of the socket close to the socket is further provided with a protruding strip corresponding to the periphery of the integrated circuit chip.

According to another embodiment of the present application, the testing device further includes a shield for covering the upper cover of the socket and the reflector.

According to another embodiment of the present application, the movable arm includes a suction nozzle portion, which is arranged corresponding to the periphery of the integrated circuit chip, and is used for positioning and sucking the integrated circuit chip.

According to another embodiment of the present application, the suction nozzle is made of a penetrating material that can penetrate wireless signals.

According to another embodiment of the present application, the suction nozzle of the movable arm further includes an opening, and the opening includes an opening and a shutter movably disposed on the opening.

According to another embodiment of the present application, the reflector is connected to the movable arm and located above the movable arm, and the reflector is linked directly above the socket according to the movement of the movable arm.

According to another embodiment of the present application, the reflective surface is a parabolic mirror reflective surface, which has a concave portion facing the socket.

According to another embodiment of the present application, the wireless receiving element is arranged on the same surface of the carrier board where the socket is provided.

According to another embodiment of the present application, the socket is provided with a vacuum suction device for vacuum suction of the integrated circuit chip from the direction of the socket.

The testing device of the integrated circuit chip of the present application can establish a far-field test environment through the cooperation of the movable arm, the upper cover of the socket and the reflector, or the cooperation of the movable arm and the reflector, and the reflection surface of the parabolic mirror Measure the spherical wave signal emitted by the integrated circuit chip. With the cooperation of the suction nozzle part of the movable arm, the upper cover of the socket and the reflecting surface, the signal transmission path of the integrated circuit chip can be prevented from being blocked, which can effectively achieve a fast and accurate measurement effect. With the cooperation of the movable arm and the reflective surface alone, and the use of the penetrating material of the suction nozzle, the signal of the integrated circuit chip can be penetrated or diffracted, thereby achieving a fast and accurate measurement effect. In addition, the test device of the present application can also use the vacuum suction device of the socket, which can also make the signal of the integrated circuit chip smoothly penetrate or diffract to the reflective surface, and accurately send to the wireless receiving element, thereby completing the signal test. The testing device for integrated circuit chips of the present application utilizes the arrangement of wireless receiving components and reflectors, which effectively solves the problem that traditional integrated circuit chips are difficult to automatically test, and reduces the need for traditional automatic test equipment (ATE) Expensive testing costs, which in turn achieves the completion of automated testing of integrated circuit chips on the wafer transfer machine, which greatly increases the testing capacity and meets the demand for mass production.

The present application is a testing device for testing integrated circuit chips with wireless signal transceiving functions, so as to ensure that the integrated circuit chips can operate correctly in electronic products after being loaded. The integrated circuit chip of the present application can be applied to electronic products that require wireless transmission functions, such as smart phones or tablets, and can be applied to 4G or 5G mobile communication technologies. In particular, the testing device of the present application completes automated testing in a wafer handler (handler). Please refer to Figure 1. FIG. 1 is a schematic structural diagram of an embodiment of a testing device for integrated circuit chips of the present application. In this embodiment, the testing device 1 of the integrated circuit chip 6 of the present application includes a carrier board 2, a movable arm 3, a reflective cover 4, a socket cover 5, and a wireless receiving element 7 (as shown in FIG. 1 And shown in Figure 3). The carrier board 2 is a printed circuit board, which includes a socket 21 arranged on the carrier board 2, wherein the socket 21 has a flexible board 211 for holding the integrated circuit chip 6, which is used for solder balls The flexible circuit board for high-speed transmission in contact, and a plurality of pogo pins (not shown) exposed on the flexible board 211. The integrated circuit chip 6 includes a wireless signal antenna 61 encapsulated inside, and a tin spherical surface 62 provided on one side of the integrated circuit chip 6, on which tin balls (not shown) are arranged, the wireless signal antenna 61 Used to transmit or receive wireless signals. The reflector 4 includes a reflecting surface 41, which is a parabolic mirror reflecting surface, and has a recess 40 (as shown in FIG. 3) facing the socket 21. The wireless receiving element 7 is located on one side of the socket 21 and under the reflector 4 and is electrically connected to the carrier board 2. In this embodiment, the wireless receiving element 7 has a wireless antenna, which is specifically a receiving antenna circuit board (as shown in FIGS. 1-4), for receiving signals from the wireless signal antenna 61. Specifically, the wireless receiving element 7 is arranged on the same surface of the carrier board 2 where the socket 21 is provided, that is, the wireless receiving element 7 and the socket 21 are separated by a predetermined distance and located on the same side.

As shown in FIG. 1, the movable arm 3 includes a suction nozzle 31 which can be moved above the socket 21 for picking up and placing the integrated circuit chip 6 on the flexible board 211. As shown in FIG. 1, the end of the movable arm 3 opposite to the suction nozzle portion 31 is omitted and not fully shown. It is set in the conveyor (not shown), wherein the movable arm 3 uses vacuum suction technology , The integrated circuit chip 6 is positioned and sucked by the sucking nozzle portion 31.

FIG. 2 is a schematic diagram of the structure of the movable arm 3 where the integrated circuit chip 6 is placed. As shown in FIG. 2, the movable arm 3 moves downward toward the socket 21 and places the integrated circuit chip 6 on the flexible board 211.

FIG. 3 is another schematic diagram of the structure of the testing device in FIG. 1. As shown in Fig. 3, the socket upper cover 5 can be movably arranged above the socket 21, wherein the socket upper cover 5 shown in Fig. 3 is omitted, and it is not fully shown that it is installed in the automatic feeder. Specifically, the socket upper cover 5 includes a connecting portion 51 and a pressing column 52, wherein the connecting portion 51 is disposed facing the socket 21, and the pressing column 52 is disposed on the connecting portion 51 and facing the socket 21. Extend a predetermined distance. As shown in FIG. 3, the pressing column 52 is perpendicular to the socket 21. Specifically, in this embodiment, the reflective cover 4 is disposed under the connecting portion 51 of the upper cover 5 of the socket, and one end of the reflective cover 4 is located directly above the socket 21, and the other end faces the carrier board 2. The direction of is inclined downward, and the other end of the reflective surface 4 extends above the wireless receiving element 7. In other words, the reflective surface 41 corresponds to one end of the wireless receiving element 7, and its height relative to the carrier board 2 is lower than the height of the other end of the reflective surface 41 relative to the carrier board 2. Specifically, an outer frame 20 is provided around the socket 2, and an end of the pressing column 52 close to the socket 21 is further provided with a protruding bar 521, which is provided around the integrated circuit chip 6 and is located on the outer side. Between the frame 20 and the base 21. In addition, an open space 50 is formed between the pressing column 52, the connecting portion 51 and the reflecting surface 4, which is exposed on the socket 21. That is, the pressing column 52 is arranged at a position adjacent to the frame 20 relative to the socket 21, and thus does not block the upper part of the central part of the socket 21.

Please refer to FIG. 3 in conjunction with FIG. 1, FIG. 2 and FIG. 4. FIG. 4 is a schematic diagram of the structure of the socket cover 5 pressing the integrated circuit chip 6. The testing device 1 of this embodiment is completed by the cooperation of the movable arm 3 and the upper cover 5 of the socket. In the actual test, after the integrated circuit chip 6 is placed on the socket 21 by the movable arm 3, the movable arm 3 is moved away (as shown in Figs. 1 and 2), and then the upper cover 5 of the socket is moved down and combined Press the integrated circuit chip 6 (as shown in FIG. 3); at this time, the protruding strips 521 of the pressing column 52 press against the outermost edge of the integrated circuit chip 6 to make the bottom of the integrated circuit chip 6 The solder ball is positioned and electrically connected to the pogo pin end (pogo pin) of the socket 21 (as shown in FIG. 4). After that, the integrated circuit chip 6 sends out wireless signals through control. Since the open space 50 of the upper cover 5 of the socket is located directly above the integrated circuit chip 6, the wireless signal will not be blocked, so that the spherical wave signal of the wireless signal is transmitted upwards to the reflecting surface 4 and passes through The reflection of the reflective surface 4 forms a plane wave, which is directed to the wireless receiving element 7 below (as shown in FIG. 4). The wireless receiving element 7 smoothly receives the wireless signal and transmits it to an external computing device (for example, The computer) performs calculations to generate test results to test whether the signal transmission function of the integrated circuit chip 6 is normal.

3 and 4, the testing device 1 of this embodiment further includes a shielding body 501 for covering the socket upper cover 5 and the reflective cover 4, wherein the shielding body 501 is made of a wave-absorbing material, Reduce the loss of the wireless signal of the integrated circuit chip 6 caused by external interference or multiple reflections.

Please refer to FIG. 5 to FIG. 8 for another embodiment of the testing device 1 of the present application. The main difference between the embodiment described in FIGS. 5 to 8 and the foregoing embodiment is that the embodiment of FIG. 5 does not use the pressure arm 5, and the structural relationship of the reflector is not the same. As shown in FIG. 5, the test device 1 of this embodiment includes a carrier board 2, a movable arm 3, a reflector 4, an integrated circuit chip 6 and a wireless receiving element 7, which are the same as those in the previous embodiment. Do not repeat it again. Specifically, the reflector 4 of this embodiment is connected to the movable arm 3 and is located above the movable arm 3 (as shown in FIG. 5), and the reflector 4 can be linked according to the movement of the movable arm 3 Just above the socket 21. In addition, the wireless receiving element 7 of this embodiment is a wireless receiving chip for receiving signals from the wireless signal antenna 61. Specifically, the reflective cover 4 has a reflective surface 41, which corresponds to one end of the outer frame 20, and the height relative to the carrier 2 is lower than the other end of the reflective surface 41, so that the concave portion 40 of the reflective surface 41 faces The direction of the wireless receiving element 7 is set. In particular, the suction nozzle portion 31 is made of a penetrating material that can penetrate wireless signals.

Please refer to Figure 5 in conjunction with Figure 6-7. When the testing device 1 of this embodiment is operating, the movable arm 3 first places the integrated circuit chip 6 on the socket 21, and then the suction nozzle portion 31 of the movable arm 3 presses the integrated circuit chip 6 (As shown in Figure 6). Since the suction nozzle portion 31 is made of a penetrating material that can penetrate wireless signals, the signal wave of the wireless signal emitted by the integrated circuit chip 6 can still be transmitted to the reflecting surface 41 through the suction nozzle portion 31, and It is reflected by the reflective surface 41 to the wireless receiving element 7. In other words, even if the suction nozzle portion 31 is covered on the integrated circuit chip 6, it will not affect the signal emission quality, and it can still be reflected to the wireless receiving element 7 through the reflecting surface 4 to complete the test operation.

Refer to Figure 8. The socket 21 of the testing device 1 shown in FIG. 8 is further equipped with a vacuum suction device 210 for sucking the integrated circuit chip 6 from below the socket 21 through several gaps (not shown) of the socket 21. That is, the movable arm 3 can be moved away after the integrated circuit chip 6 is placed, so that the suction nozzle portion 31 and the integrated circuit chip 6 can be kept at a predetermined distance for freeing the integrated circuit chip The signal diffraction space of 6 does not require force to press the integrated circuit chip 6. At this time, the integrated circuit chip 6 can be continuously sucked by the vacuum suction device 210, so that the integrated circuit chip 6 and the socket 21 are electrically connected, and the wireless signal can be transmitted to the reflecting surface 41 and reflected more quickly To the wireless receiving component 7 to complete the test operation. The principle of the vacuum suction device 210 is the same as the general vacuum suction principle, that is, a vacuum pump (not shown) is used to generate adsorption.

Please refer to FIG. 9, which is another structural diagram of the testing device of FIG. 5. In this embodiment, in order to ensure that the suction nozzle portion 31 does not affect the signal quality at all, the suction nozzle portion 31 may further include an opening 32. The opening 32 includes an opening 321 and a movably disposed at the opening. 321 on the shutter 322. Specifically, when the suction nozzle portion 31 presses the integrated circuit chip 6, the shutter 322 can automatically move and open the opening 321 so that the wireless signal of the integrated circuit chip 6 can be protected from the suction. The mouth 31 is shielded and emitted to the reflecting surface 41, and is reflected to the wireless receiving element 7 more quickly, thereby completing the test operation. Once the test operation is completed, the shutter 322 closes the opening 321 and returns to a normal state.

In summary, the testing device for integrated circuit chips of the present application can establish a far-field test environment through the cooperation of the movable arm, the upper cover of the socket and the reflector, or the cooperation of the movable arm and the reflector, and pass the The reflective surface of the curved reflector is used to measure the signal emitted by the integrated circuit chip. With the cooperation of the movable arm, the upper cover of the socket, and the reflective surface, the signal transmission path of the integrated circuit chip can be prevented from being blocked, which can effectively achieve rapid and accurate measurement effects. With the cooperation of the movable arm and the reflective surface alone, and the use of the penetrating material of the pick-and-place head, the signal of the integrated circuit chip can be penetrated or diffracted, thereby achieving rapid and accurate measurement. In addition, the test device of the present application can also use the opening of the movable arm and the vacuum suction device of the socket, which can also enable the signal of the integrated circuit chip to be smoothly and accurately sent to the wireless receiving component, thereby completing the signal test . The testing device for integrated circuit chips of the present application utilizes the arrangement of wireless receiving components and reflective surfaces, which effectively solves the problem that traditional integrated circuit chips are difficult to automatically test, and reduces the need for traditional automatic test equipment (ATE) Expensive testing costs, which in turn achieves the completion of automated testing of integrated circuit chips on the wafer transfer machine, which greatly increases the testing capacity and meets the demand for mass production.

This embodiment is used to illustrate the technical idea of the present invention, but not to limit the technical idea of the present invention. Therefore, the scope of rights of the present invention is not limited to this embodiment. The protection scope of the present invention should be interpreted by the claims, and it should be interpreted that all technical ideas that are the same or equivalent to the above protection scope are included in the scope of the present invention.

1: Test device 2: carrier board 20: Outer frame 21: socket 210: Vacuum suction device 211: Soft Board 3: movable arm 31: Nozzle 32: Opening 321: open 322: Shutter 4: reflector 40: recess 41: reflective surface 5: Socket cover 50: open space 501: Shield 51: connecting part 52: pressure column 521: Rib 6: Integrated circuit chip 61: Wireless signal antenna 62: Tin spherical surface 7: Wireless receiving components

FIG. 1 is a schematic structural diagram of an embodiment of an integrated circuit chip testing device of the present application. FIG. 2 is a schematic structural diagram of an integrated circuit chip placed on a movable arm of the testing device of FIG. 1. Fig. 3 is another schematic diagram of the structure of the testing device of Fig. 1 for showing an upper cover of a socket. FIG. 4 is a schematic structural diagram of the upper cover of the socket of FIG. 3 pressing the integrated circuit chip. FIG. 5 is a schematic structural diagram of another embodiment of the testing device for integrated circuit chips of this application. 6 is a schematic diagram of the structure of the integrated circuit chip placed on a movable arm of the testing device of FIG. 5. FIG. 7 is a schematic view showing the structure of the movable arm of FIG. 6 pressing on the integrated circuit chip. FIG. 8 is another schematic diagram of the structure of the testing device of FIG. 5. FIG. 9 is another schematic diagram of the structure of the testing device of FIG. 5.

1: Test device

2: carrier board

20: Outer frame

21: socket

211: Soft Board

4: reflector

40: recess

41: reflective surface

5: Socket cover

50: open space

501: Shield

51: connecting part

52: pressure column

521: Rib

6: Integrated circuit chip

61: Wireless signal antenna

62: Tin spherical surface

7: Wireless receiving components

Claims (12)

A test device for an integrated circuit chip. The integrated circuit chip includes a wireless signal antenna. The test device includes a carrier board, including a socket provided on the carrier board, and a socket for receiving the integrated circuit A flexible board for the chip; a movable arm that can be moved above the socket for picking up and placing the integrated circuit chip on the flexible board; a reflector with a reflective surface that can be movably installed on the socket Above; a socket upper cover, which is movably arranged above the socket, and includes a connecting portion and a pressing column, wherein the connecting portion faces the socket set, the pressing column is arranged on the connecting portion, and Extending a predetermined distance in the direction of the socket for pressing against the edge of the integrated circuit chip; and a wireless receiving element located on one side of the socket and below the reflecting surface and electrically connected to the carrier board , Wherein the wireless signal antenna of the integrated circuit chip is used to emit a wireless signal, and is reflected to the wireless receiving element through the reflective surface for testing. As for the testing device of the integrated circuit chip described in item 1 of the scope of patent application, an open space is formed between the pressing column, the connecting portion and the reflecting surface, and is exposed on the socket. As for the testing device of the integrated circuit chip described in the first item of the scope of patent application, the reflective cover is arranged below the connecting part of the upper cover of the socket, and one end of the reflective cover is located directly above the socket, and the other end faces the load. The direction of the board is inclined downward. Such as the testing device of the integrated circuit chip described in item 3 of the scope of patent application, wherein the other end of the reflective cover extends to the wireless receiving element. For example, in the testing device of the integrated circuit chip described in the first item of the scope of patent application, an end of the pressing post of the socket cover close to the socket is further provided with a protruding strip corresponding to the surrounding of the integrated circuit chip. For example, the integrated circuit chip testing device described in the first item of the scope of patent application further includes a shielding body for covering the upper cover of the socket and the reflecting cover. A test device for an integrated circuit chip. The integrated circuit chip includes a wireless signal antenna. The test device includes a carrier board, including a socket provided on the carrier board, and a socket for receiving the integrated circuit A flexible board for the chip; a movable arm that can be moved above the socket for picking up and placing the integrated circuit chip on the flexible board; a reflector with a reflective surface that can be movably installed on the socket And a wireless receiving element located on one side of the socket and below the reflecting surface, and is electrically connected to the carrier board, wherein the wireless signal antenna of the integrated circuit chip is used to send out wireless signals through The reflective surface is reflected to the wireless receiving element for testing; wherein the movable arm includes a suction nozzle portion, which is arranged corresponding to the periphery of the integrated circuit chip, and is used for positioning and sucking the integrated circuit chip; wherein the reflective cover Connected to the movable arm and located above the movable arm, the reflector is linked to the socket directly above the socket according to the movement of the movable arm. For example, the testing device of the integrated circuit chip described in item 7 of the scope of patent application, wherein the suction nozzle part is made of a penetrating material that can penetrate wireless signals. For example, the testing device for integrated circuit chips described in the scope of the patent application, wherein the suction nozzle of the movable arm further includes an opening, the opening includes an opening and a shield movably disposed on the opening . According to the test device of the integrated circuit chip described in the first item of the scope of patent application, the reflective surface is a parabolic mirror reflective surface, which has a concave portion facing the socket. For the test device of integrated circuit chip described in the first item of the patent application, the wireless receiving element is arranged on the same surface of the carrier board where the socket is provided. For the test device of the integrated circuit chip described in the first item of the scope of patent application, the socket is provided with a vacuum suction device for vacuum suction of the integrated circuit chip from the direction of the socket.

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