TWI416134B - Test apparatus - Google Patents

Abstract

A test apparatus for testing an object on an electric circuit is provided. The test apparatus includes a first carrier, a second carrier and a test socket. The first carrier having a first length is situated on and electrically connected to the circuit board. The second carrier having a second length is situated on and electrically connected to the first carrier. The test socket is situated on and electrically connected to the second carrier and the object. The second length is larger than the first length, so a usable space is formed among the first carrier, the second carrier and the circuit board.

Description

Test device

The present invention relates to a test apparatus, and more particularly to a test apparatus for testing a test object.

With the advancement of high-tech technology, the complication of product functions, and the demand for lighter and thinner electronic products on the market, more components must be accommodated in the limited internal space of electronic products. For example, on the circuit board of an electronic product, more components are installed than in the prior electronic products. Under such a trend, the industry is committed to improving the utilization of space, so that the accumulation of components in electronic products is greatly improved.

In the design or manufacturing process of electronic products, in order to test whether the components on the circuit board can meet the specifications and determine whether they can operate normally on the circuit board, it is necessary to apply test fixtures to detect components, thereby testing whether the electrical properties of the components are Normal and functional. However, as more and more electronic components are placed on the board, it is increasingly difficult to remove enough space on the board to set up the test fixture. Relatively speaking, in order to set up a test fixture on a circuit board, it is necessary to sacrifice space for setting electronic components.

Please refer to FIGS. 1A and 1B simultaneously. FIG. 1A is a cross-sectional view showing a conventional testing device, and FIG. 1B is a cross-sectional view showing the testing device of the conventional FIG. 1A in testing. The test device 100 is a test fixture 101 and is disposed on a circuit board 140 for testing whether the electrical property of the object to be tested 130 is normal or functional. The object to be tested 130 has a plurality of contacts 131 and a plurality of solder balls 132 corresponding to the contacts 131. The test fixture 101 has a body 110, a plurality of probes 111, a cover 120, a rotating shaft 121 and a cassette 122.

The base 110 is disposed on the circuit board 140 and has a recess 112, an upper surface 115, a lower surface 116, and a card slot 117. The upper surface 115 and the lower surface 116 are opposite surfaces of the base 110, and one of the openings 112 of the recess 112 is located on the upper surface 115. The card slot 117 is located on one side of the seat body 110. One end of each of the probes 111 protrudes from the bottom 114 of the recess 112 for contacting the solder balls 132 of the object to be tested 130; the other end is located at the lower surface 116 of the base 110 and electrically connected to the circuit board 140.

The cover 120 is located on the base 110 and is coupled to the base 110 by a rotating shaft 121 to rotate the cover 120 up and down relative to the base 110. The cover 120 is used to apply pressure to the object to be tested 130 so that the probes 111 are in close contact with the solder balls 132 of the object to be tested 130. The latch 122 is connected to one side of the cover 120 and has a convex portion 123 for engaging with the slot 117 of the base 110 to engage the cover 120 with the base 110.

When the test object 130 is tested, the cover body 120 is pressed against the object to be tested 130 by covering the cover body 120 and engaging the cover body 120, so that the probes 111 are in close contact with each solder. Ball 132. The object to be tested 130 is electrically connected to the circuit board 140 via the probe 111 for electrical or functional testing.

In such a manner that the test device 100 is directly disposed on the circuit board 140, since the lower surface 116 of the base 110 directly contacts the circuit board 140, the electronic component 141 can be disposed only on the circuit board 140 on the outer side of the test device 100. Therefore, the utilization of the space on the circuit board 140 is reduced. In particular, the test apparatus 100 has a large volume compared to the object 130 to be tested, which greatly occupies space on the circuit board 140, and is incapable of conforming to the current desire to provide more electronic components on the circuit board 140. Demand. On the other hand, if the available space on the circuit board 140 is too small to provide sufficient space to set the test apparatus 100, the test apparatus 100 cannot be placed on the circuit board 140, resulting in failure to test the object to be tested 130.

It is an object of the present invention to provide a test apparatus for solving the problem that the utilization of space on a circuit board cannot be improved, and to prevent the test apparatus from being disposed on the circuit board.

One aspect of the invention provides a test apparatus for testing a test object on a circuit board. The testing device includes a first carrier, a second carrier, and a test fixture. The first carrier is located on the circuit board and electrically connected to the circuit board, and the first carrier has a first length. The second carrier is located on the first carrier and electrically connected to the first carrier, and the second carrier has a second length. The test fixture is located on the second carrier and electrically connected to the second carrier and the object to be tested. Wherein, the second length is greater than the first length, and a space is formed between the first carrier and the second carrier and the circuit board.

According to an embodiment of the invention, the available space is located on or around the first carrier. At least one electronic component is disposed on the circuit board, and the electronic component is located at an available space. The circuit board has a plurality of pads, and the first carrier has a first surface, a second surface, a plurality of first pads and a plurality of second pads. The first side faces the circuit board and has a first length, the second side being opposite the first side. The first pad is on the first surface and is aligned with the pad, and the second pad is on the second surface and aligned with the first pad.

According to an embodiment of the invention, the testing device further includes a plurality of first electrical conductors, the first electrical conductors being located between the solder pads and the first pads, and electrically connecting the circuit board and the first carrier. The first carrier has a plurality of first vias or a plurality of first conductive materials, and the first vias penetrate the first carrier, the first pads, and the second pads. The first conductive material is located in the first via hole and electrically connected to the first pad and the second pad.

According to an embodiment of the invention, the testing device further includes a plurality of second electrical conductors, the second electrical conductors being located between the second pads and the third pads, and electrically connecting the first carrier and the second carrier. The second carrier has a third surface, a fourth surface and a plurality of third pads, and has a plurality of second via holes or a plurality of second conductive materials. The third face faces the first carrier and has a second length, the fourth face being opposite the third face and facing the test fixture. The third pad is located on the third surface and is aligned with the second pad. The second conductive hole penetrates the second carrier and the third pad. The second conductive material is located in the second via hole and electrically connected to the third pad.

According to an embodiment of the invention, the test fixture has a body and a plurality of probes. The seat body is located on the second carrier and has a groove, an upper surface and a lower surface. One of the recesses is located on the upper surface, and the lower surface is opposite the upper surface and faces the second carrier. The probe is located in the body and the analyte is located on the probe. Each of the probes has a first end and a second end. The first end protrudes from the bottom of one of the grooves and is electrically connected to the object to be tested. The second end protrudes from the lower surface and is electrically connected to the second carrier.

According to an embodiment of the invention, the testing device further comprises at least one positioning hole, at least one positioning element, at least a consistent perforation and at least one fixing material. The positioning hole is located on the second carrier, and the positioning component is located on the test fixture and aligned with the positioning hole. The through hole penetrates through the second carrier and the test fixture, and the fixing material is located in the through hole.

Another aspect of the invention provides a test apparatus for testing a test object on a circuit board. The test device includes a carrier and a test fixture. The carrier is located on the circuit board and electrically connected to the circuit board, and the carrier has a first portion and a second portion. The first portion is located on the circuit board and has a first length, the second portion being located on the first portion and having a second length. The test fixture is located on the carrier and electrically connected to the carrier and the analyte. Wherein, the second length is greater than the first length, and a space is formed between the first portion and the second portion and the circuit board.

According to an embodiment of the invention, the available space is located on or around the first portion. At least one electronic component is disposed on the circuit board, and the electronic component is located at an available space. The circuit board has a plurality of pads, and the first portion has a first surface and a plurality of pads. The first side faces the circuit board and has a first length, the pads being on the first side and aligned with the pads. The second portion has a second surface and a third surface, the second surface facing the first portion and having a second length, the third surface facing the second surface facing the test fixture.

According to an embodiment of the invention, the testing device further comprises a plurality of electrical conductors, the electrical conductors being located between the pads and the pads, and electrically connecting the circuit board and the carrier. The carrier has a plurality of conductive vias or a plurality of conductive materials, the conductive vias penetrating through the carrier and the pads, and the conductive material is located in the vias and electrically connected to the pads.

According to an embodiment of the invention, the test fixture has a body and a plurality of probes. The seat body is located on the second portion and has a groove, an upper surface and a lower surface. One of the recesses is located on the upper surface, and the lower surface is opposite the upper surface and faces the carrier. The probe is located in the body and the analyte is located on the probe. Each of the probes has a first end and a second end. The first end protrudes from the bottom of the groove and is electrically connected to the object to be tested. The second end protrudes from the lower surface and is electrically connected to the carrier.

According to an embodiment of the invention, the testing device further comprises at least one positioning hole, at least one positioning component and a fixing material. The positioning hole is located on the test fixture, the positioning component is located on the second part and aligned with the positioning hole, and the fixing material is located between the carrier and the test fixture.

In another aspect of the invention, a test apparatus is provided for testing a test object on a circuit board. The test device includes a carrier and a test fixture. The carrier is located on the circuit board and electrically connected to the circuit board, and the carrier has a first length. The test fixture is located on the carrier and electrically connected to the carrier and the object to be tested, and the test fixture has a second length. The second length is greater than the first length, and a space is formed between the carrier, the test fixture and the circuit board.

According to an embodiment of the invention, the available space is located on or around the carrier, and the circuit board is provided with at least one electronic component, the electronic component being located at the available space. The circuit board has a plurality of pads, and the carrier has a first surface, a second surface and a plurality of pads. The first face faces the circuit board and has a first length, the second face being opposite the first face and facing the test fixture. The pads are on the first side and aligned with the pads.

According to an embodiment of the invention, the testing device further comprises a plurality of electrical conductors, the electrical conductors being located between the pads and the pads, and electrically connecting the circuit board and the carrier. The carrier has a plurality of vias or a plurality of conductive materials. The via hole penetrates the carrier and the pad, and the conductive material is located in the via hole and electrically connected to the pad.

According to an embodiment of the invention, the test fixture has a body and a plurality of probes. The seat body is located on the carrier and has a recess, an upper surface and a lower surface. One of the grooves has an opening on the upper surface, and the lower surface faces the carrier and has a second length. The probe is located in the body and the analyte is located on the probe. Each of the probes has a first end and a second end. The first end protrudes from the bottom of one of the grooves and is electrically connected to the object to be tested. The second end protrudes from the lower surface and is electrically connected to the carrier.

According to an embodiment of the invention, the testing device further comprises at least one positioning hole, at least one positioning component and a fixing material. The positioning hole is located on the test fixture, the positioning component is located on the circuit board and aligned with the positioning hole, and the fixing material is located between the carrier and the test fixture.

The testing device according to the embodiment of the present invention uses a carrier to mount a test fixture to form a usable space between the test fixture, the carrier and the circuit board, thereby increasing the utilization of the space on the circuit board and avoiding the test fixture. The size is limited by the space on the board, allowing the test fixture to be easily placed on the substrate, thereby improving the convenience of use.

In the testing device according to various embodiments of the present invention, the test fixture is disposed on the carrier, and the length of the carrier connected to the surface of the circuit board is less than the length of the test fixture, so that a space is formed between the test fixture, the carrier and the circuit board. . In this way, more electronic components can be placed on the circuit board under the test fixture, or a larger test fixture can be placed on the circuit board.

Please refer to FIG. 2A and FIG. 2B simultaneously. FIG. 2A is a cross-sectional view showing a test apparatus according to an embodiment of the present invention, and FIG. 2B is a cross-sectional view showing the test apparatus of FIG. 2A of the present invention. One side of the test device 200 is electrically connected to a circuit board 270, and the other side is electrically connected to a test object 280 to test the electrical properties or functions of the test object 280.

The testing device 200 includes a first carrier 210, a second carrier 220, and a test fixture 230. The first carrier 210 is located on the circuit board 270 and electrically connected to the circuit board 270. The first carrier 210 has a height H1 and a first length L1, and the direction of the first length L1 is parallel to the circuit board 270. The second carrier 220 is located on the first carrier 210 and electrically connected to the first carrier 210. The second carrier 220 has a second length L2 that is parallel to the circuit board 270 and greater than the first length L1 of the first carrier 210. Since the second carrier 220 is disposed on the first carrier 210, the second carrier 220 and the circuit board 270 are at least separated from the height H1 of the first carrier 210. The test fixture 230 is located on the second carrier 220 and electrically connected to the second carrier 220 and the object to be tested 280.

Based on the configuration of the test device 200, a space 290 is formed between the first carrier 210, the second carrier 220, and the circuit board 270. The available space 290 can be used to set more electronic components 272 on the circuit board 270. At the same time, the test apparatus 200 only needs to occupy the space of the first length L1 on the circuit board 270, that is, the test fixture 230 having a larger size than the first length L1 can be disposed.

As shown in FIG. 2A, the first carrier 210 is substantially aligned with the second carrier 220 such that the second carrier 220 protrudes from the left side and the right side of the first carrier 210 by a length L3, so that the available space 290 is located at the first position. The left and right sides of the carrier 210. However, the technique of the present invention is not limited thereto, and the first carrier 210 and the second carrier 220 are also reliably right-aligned or left-aligned such that the available space 290 is located on the left or right side of the first carrier 210. In addition, the available space 290 can also be located around the first carrier 210. The relative arrangement relationship between the other first carrier 210 and the second carrier 220 is such that the size of the second carrier 220 is larger than the size of the first carrier 210, so that a space 290 is formed between the second carrier 220, the first carrier 210 and the circuit board 270. All of them fall within the scope of the invention.

The first carrier 210 has a first surface 211 , a second surface 212 , a plurality of first pads 213 , and a plurality of second pads 214 . The first surface 211 and the second surface 212 are opposite surfaces of the first carrier 210. The first surface 211 faces the circuit board 270 and has a first length L1. The first surface 211 and the second surface 212 are exemplified by the same first length L1. However, in another embodiment, the second surface 212 may have a length smaller than or greater than the first length L1 of the first surface 211. Each of the first pads 213 is located on the first surface 211 , and each of the second pads 214 is located on the second surface 212 . The circuit board 270 has a plurality of pads 271, and each of the first pads 213 is aligned with each of the pads 271 to respectively contact the pads 271. Each of the second pads 214 of the first carrier 210 is aligned with each of the first pads 213.

The first carrier 210 has a plurality of first vias 215 , and each of the first vias 215 extends through the first carrier 210 , the first pads 213 , and the second pads 214 . In addition, the first carrier 210 can also have a plurality of first conductive materials 216, each of the first conductive materials 216 is located on the inner or inner wall of each of the first vias 215, and is electrically connected to the first pads 213 and The second pad 214.

The test device 200 further includes a plurality of first conductive bodies 240. The first conductive bodies 240 are located between the pads 271 and the first pads 213 for electrically connecting the circuit board 270 and the first carrier 210.

The second carrier 220 has a third surface 221 , a fourth surface 222 , and a plurality of third pads 223 . The third surface 221 and the fourth surface 222 are opposite surfaces of the second carrier 220. The third surface 221 faces the first carrier 210 and has a second length L2. The fourth surface 222 faces the test fixture 230. The third pad 223 is located on the third surface 221 , and each of the third pads 223 is aligned with each of the second pads 214 . The third surface 221 and the fourth surface 222 are exemplified by having the same second length L2. However, in another embodiment, the length of the fourth surface 222 may also be smaller or larger than the second length L2 of the third surface 221 . .

The second carrier 220 has a plurality of second vias 224 , and each of the second vias 224 extends through the second carrier 220 and each of the third pads 223 . In addition, the second carrier 220 can also have a plurality of second conductive materials 225, and each of the second conductive materials 225 is located on the inner or inner wall of each of the second vias 224, and is electrically connected to each of the third pads 223. .

The test device 200 further includes a plurality of second conductive bodies 241. The second conductive bodies 241 are located between the second pads 214 and the third pads 223 for electrically connecting the first carrier 210 and the second carrier 220. .

The first carrier 210 is electrically connected to the circuit board 270 via the first conductor 240 , and the second carrier 220 is electrically connected to the first carrier 210 via the second conductor 241 . Specifically, the third surface 221 of the second carrier 220 is separated from the circuit board 270 by a height H2. The height H2 includes the height H1 of the first carrier 210, the height of the first conductor 240, and the height of the second conductor 241.

The test fixture 230 has a body 231 and a plurality of probes 232. The seat body 231 is located on the second carrier 220 and has a recess 235, an upper surface 238 and a lower surface 239. The upper surface 238 and the lower surface 239 are opposite surfaces of the base 231, respectively. One opening 236 of the recess 235 is located on the upper surface 238, and the lower surface 239 faces the second carrier 220. Each probe 232 is located in the base 231, and the object to be tested 280 is located on each of the probes 232. Each of the probes 232 has a first end 233 and a second end 234 . The first end 233 protrudes from a bottom 237 of the recess 235 , and the second end 234 is electrically connected to the second conductive material 225 . Here, the probe 232 applied to the testing device 200 of the present embodiment may include, but is not limited to, a telescopic probe, an elastic probe, and a fixed probe.

In one embodiment, the second end 234 of each of the probes 232 protrudes from the lower surface 239 of the base 231 and extends into each of the second conductive vias 224 to electrically connect the second conductive materials 225, but each probe The manner in which the second conductive material 225 is electrically connected to the 232 is not limited in this manner. For example, the second end 234 of each probe 232 can also be flush with the lower surface 239. When the test fixture 230 is disposed on the second carrier 220, the lower surface 239 is in contact with the fourth surface 222 of the second carrier 220, so that the probes 232 are in contact with each other and electrically connected to the second conductive materials 225. In addition, the object to be tested 280 has a plurality of contacts 281 or a plurality of solder balls 282, and each of the probes 232 protrudes from the first end 233 of the bottom portion 252b for contacting the contacts 281 or the solder balls 282.

The testing device 200 further includes at least one positioning hole 250 and at least one positioning component 251. The positioning hole 250 can be located on the fourth surface 222 of the second carrier 220. The positioning component 251 can be located on the lower surface 239 of the base 231 of the test fixture 230. The positioning holes 250 are aligned and inserted to position the test fixture 230 on the second carrier 220. On the other hand, the positioning hole 250 and the positioning component 251 can also be oppositely disposed, that is, the positioning hole 250 is disposed on the lower surface 239 of the base 231, and the positioning component 251 is disposed on the fourth surface 222 of the second carrier 220 to enable the test fixture. 230 is positioned on the second carrier 220.

The test device 200 further includes at least a uniform through hole 260 and at least one fixing material 261. The through hole 260 penetrates through the base 231 and the second carrier 220. The fixing material 261 is located in the through hole 260 and is used for fixing the base 231 and the second carrier 220.

As shown in FIG. 2A, when the object to be tested 280 is tested, the object to be tested 280 is first placed on each of the probes 232, so that the first ends 233 of the probes 232 are respectively aligned with and in contact with the object to be tested 280. The contact 281 or each solder ball 282 is exemplified by the first end 233 contacting the solder ball 282.

Next, as shown in FIG. 2B, a pressure 291 is applied to the object to be tested 280 so that the solder balls 282 are in close contact with the respective probes 232. If each probe 232 is a telescopic probe or an elastic probe, when a pressure 291 is applied to the object to be tested 280, the length of each probe 232 is shortened. The user can manually apply pressure 291 to the object to be tested 280 such that each of the solder balls 282 is in intimate contact with each of the probes 232. However, the present invention is not limited to the manual mode. In practice, the pressure 291 may be applied to the object to be tested 280 by means of a cover, oil pressure, air pressure, or mechanical actuation.

When the solder balls 282 are in close contact with the probes 232, the electrical signals of the test object 280 sequentially pass through the contacts 281 of the test object 280, the solder balls 282, the probes 232, the second conductive materials 225, and the second The electrical conductor 241, the first conductive material 216, the first electrical conductor 240, and the pad 271 are transferred to the circuit board 270. Finally, the circuit board 270 transmits electrical signals to the test circuit and a display screen (not shown) to obtain and display the test results.

The test apparatus 200 according to the present embodiment is connected to the circuit board 270 by the first carrier 210 having the smaller first length L1, and the test is set by using the second carrier 220 having the second second length L2. Fixture 230. A space 290 is formed between the circuit board 270, the first carrier 210, and the second carrier 220, and can be used to set more electronic components 272 on the circuit board 270 below the test fixture 230. At the same time, the first carrier 210 and the second carrier 220 having different lengths are used, so that the test fixture 230 having a larger size can be disposed on the limited space of the circuit board 270.

Please refer to FIG. 3A and FIG. 3B simultaneously. FIG. 3A is a cross-sectional view showing a test apparatus according to another embodiment of the present invention, and FIG. 3B is a cross-sectional view showing the test apparatus of FIG. 3A of the present invention. One side of the test device 300 is electrically connected to the circuit board 360, and the other side is electrically connected to the object to be tested 370 to test the electrical properties or functions of the object to be tested 370.

The test device 300 includes a carrier 310 and a test fixture 320. The carrier 310 is located on the circuit board 360 and electrically connected to the circuit board 360. The carrier 310 has a first portion 311 and a second portion 312, and the two portions may be integrally formed, cut-formed or combined. The first portion 311 is located on the circuit board 360 and has a height H3 and a first length L4. The direction of the first length L4 is parallel to the circuit board 360. The second portion 312 is located on the first portion 311 and is at least a height H3 from the circuit board 360. The second portion 312 has a second length L5 that is parallel to the circuit board 360 and greater than the first length L4 of the first portion 311. The test fixture 320 is located on the carrier 310 and electrically connected to the carrier 310 and the object to be tested 370.

Based on the configuration of the test device 300, an available space 380 is formed between the first portion 311, the second portion 312, and the circuit board 360. The available space 380 is used to set more electronic components 362 on the circuit board 360. At the same time, the test device 300 only needs to occupy the space of the first length L4 on the circuit board 360, and the test fixture 320 having a larger size than the first length L4 can be disposed.

As shown in FIG. 3A, the first portion 311 is substantially aligned with the second portion 312 such that the second portion 312 protrudes from the left and right sides of the first portion 311 by a length L6, so that the available space 380 is located in the first portion 311, respectively. Left and right sides. However, the technique of the present invention is not limited thereto, and the first portion 311 and the second portion 312 are also reliably right-aligned or left-aligned such that the available space 380 is located only to the left or right of the first portion 311. Further, the available space 380 may also be located around the first portion 311. The relative arrangement relationship between the other first portion 311 and the second portion 312, where the size of the second portion 312 is larger than the size of the first portion 311, and the space 380 is formed between the second portion 312, the first portion 311 and the circuit board 360, It is within the scope of the invention.

The first portion 311 has a first surface 313 and a plurality of pads 316. The first face 313 faces the circuit board 360 and has a first length L4, and each pad 316 is located on the first face 313. The circuit board 360 has a plurality of pads 361, each of which is aligned with each of the pads 361 to contact the pads 361, respectively. The second portion 312 has a second surface 314 and a third surface 315. The second surface 314 and the third surface 315 are opposite surfaces of the second portion 312. The second surface 314 faces the first portion 311 and has a second length. L5, the third side 315 faces the test fixture 320.

The carrier 310 has a plurality of vias 317 , and each of the vias 317 extends through the carrier 310 and each of the pads 316 . The carrier 310 can also have a plurality of conductive materials 318. The conductive materials 318 are located on the inner or inner wall of each of the via holes 317 and electrically connected to the pads 316.

The test device 300 further includes a plurality of electrical conductors 330. The electrical conductors 330 are disposed between the pads 361 of the circuit board 360 and the pads 316 of the first portion 311 for electrically connecting the circuit board 360 and the carrier 310. The carrier 310 is electrically connected to the circuit board 360 by the electrical conductor 330 such that the second surface 314 of the second portion 312 is separated from the circuit board 360 by a height H4. The height H4 includes the height H3 of the first portion 311 and the electrical conductor 330. height.

The test fixture 320 has a body 321 and a plurality of probes 322. The seat 321 is located on the second portion 312 and has a recess 325, an upper surface 328 and a lower surface 329. The upper surface 328 and the lower surface 329 are opposite surfaces of the base 321 respectively. One opening 326 of the recess 325 is located on the upper surface 328, and the lower surface 329 faces the carrier 310. Each probe 322 is located in the base 321 and the object to be tested 370 is located on each of the probes 322. Each of the probes 322 has a first end 323 and a second end 324 . The first end 323 protrudes from a bottom 327 of the recess 325 , and the second end 324 is electrically connected to the conductive material 318 .

In one embodiment, the second end 324 of each of the probes 322 protrudes from the lower surface 329 of the base 321 and extends into the via 317 to electrically connect the conductive material 318, but the probe 322 is electrically connected to the conductive material 318. The method is not limited in this way. For example, the second end 324 of each probe 322 can also be flush with the lower surface 329. When the test fixture 320 is disposed on the second portion 312 of the carrier 310, the lower surface 329 is in contact with the third surface 315 of the second portion 312, such that each probe 322 contacts and electrically connects the conductive materials 318. In addition, the object to be tested 370 has a plurality of contacts 371 or a plurality of solder balls 372. Each of the probes 322 protrudes from the first end 323 of the bottom portion 327 for contacting the contacts 371 or the solder balls 372.

The testing device 300 further includes at least one positioning hole 340 and at least one positioning component 341. The positioning hole 340 can be located at the lower surface 329 of the seat 321 of the test fixture 320, and the positioning component 341 can be located at the third surface 315 of the second portion 312. The positioning holes 340 are aligned and inserted to position the test fixture 320 on the carrier 310. On the other hand, the positioning hole 340 and the positioning component 341 can also be oppositely disposed, that is, the positioning hole 340 is disposed on the third surface 315 of the second portion 312, and the positioning component 341 is disposed on the lower surface 329 of the base 321 to enable the test fixture. 320 is positioned on carrier 310.

The test device 300 further includes a fixing material 350 between the third surface 315 of the second portion 312 of the carrier 310 and the lower surface 329 of the base 321 for fixing the carrier 310 and the base 321 . In one embodiment, the fixing material 350 can be an adhesive layer and used to bond the carrier 310 and the base 321 .

As shown in FIG. 3A, when the object to be tested 370 is tested, the object to be tested 370 is first placed on each of the probes 322, and the probes 322 are protruded from the first end 323 of the bottom portion 327 to be aligned and contacted, respectively. Each contact 371 or each solder ball 372 of the object to be tested 370 is exemplified by contact with each solder ball 372.

Next, as shown in FIG. 3B, a pressure 381 is applied to the object to be tested 370 so that each of the solder balls 372 is in close contact with each of the probes 322. When the solder balls 372 are in close contact with the probes 322, the electrical signals of the test object 370 are sequentially transmitted to the contacts 371, the solder balls 372, the probes 322, the conductive materials 318, the conductive bodies 330, and the pads 361 to Circuit board 360. Finally, the circuit board 360 is transmitted to the test circuit and the display screen (not shown) and the like.

The test apparatus 300 according to the present embodiment described above connects the test fixture 320 to the circuit board 360 by means of a carrier 310. The second length L5 of the second portion 312 of the carrier 310 is greater than the first length L4 of the first portion 311 such that a usable space 380 is formed between the circuit board 360, the first portion 311, and the second portion 312. In this manner, more electronic components 362 can be disposed on the circuit board 360 below the test fixture 320, and a larger size test fixture 320 can be disposed on the circuit board 360.

Please refer to FIG. 4A and FIG. 4B simultaneously. FIG. 4A is a cross-sectional view showing a test apparatus according to another embodiment of the present invention, and FIG. 4B is a cross-sectional view showing the test apparatus of FIG. 4A of the present invention. One side of the testing device 400 is electrically connected to the circuit board 460, and the other side is electrically connected to the object to be tested 470 to test the electrical properties or functions of the object to be tested 470.

The test device 400 includes a carrier 410 and a test fixture 420. The carrier 410 is located on the circuit board 460 and electrically connected to the circuit board 460. The carrier 410 has a height H5 and has a first length L7 in a direction parallel to the circuit board 460. The test fixture 420 is located on the carrier 410 and electrically connected to the carrier 410 and the object to be tested 470. The test fixture 420 is separated from the circuit board 460 by at least one height H5 and has a second length L8 in a direction parallel to the circuit board 460, the second length L8 being greater than the first length L7.

Based on the foregoing configuration, a usable space 480 is formed between the carrier 410, the test fixture 420, and the circuit board 460. The available space 480 can be used to set more electronic components 462 on the circuit board 460. At the same time, the test device 400 only needs to occupy the space of the first length L7 on the circuit board 460, that is, the test fixture 420 having a larger size than the first length L7 can be disposed.

As shown in FIG. 4A, the carrier 410 is substantially aligned with the test fixture 420 such that the test fixture 420 protrudes from the left and right sides of the carrier 410 by a length L9, so that the available space 480 is located on the left and right sides of the carrier 410, respectively. . However, the technique of the present invention is not limited thereto, and the carrier 410 and the test fixture 420 are also reliably right-aligned or left-aligned such that the available space 480 is located only to the left or right of the carrier 410. Additionally, available space 480 can also be located around carrier 410. The relative arrangement relationship between the other carrier 410 and the test fixture 420, where the size of the test fixture 420 is larger than the size of the carrier 410, and the available space 480 is formed between the test fixture 420, the carrier 410 and the circuit board 460, all belong to the present invention. The scope.

The carrier 410 includes a first surface 411, a second surface 412, and a plurality of pads 413. The first surface 411 and the second surface 412 are opposite surfaces of the carrier 410. The first surface 411 faces the circuit board 460 and has a first length L7. The second surface 412 faces the test fixture 420, and each of the pads 413 is located at the first surface 411. One side is 411. The circuit board 460 has a plurality of pads 461, and the pads 413 are aligned with the pads 461 to respectively contact the pads 461.

The carrier 410 has a plurality of vias 414 , each of which extends through the carrier 410 and each of the pads 413 . The carrier 410 can also have a plurality of conductive materials 415. The conductive materials 415 are located on the inner or inner wall of each of the via holes 414 and electrically connected to the pads 413.

The test device 400 further includes a plurality of electrical conductors 430. The electrical conductors 430 are disposed between the pads 461 and the pads 413 for electrically connecting the circuit board 460 and the carrier 410.

The test fixture 420 has a body 421 and a plurality of probes 422. The seat 421 has a recess 425, an opposite upper surface 428 and a lower surface 429. One of the openings 426 of the recess 425 is located on the upper surface 428. The lower surface 429 faces the carrier 410 and has a second length L8. Each probe 422 is located in the base 421, and the object to be tested 470 is located on each of the probes 422. Each of the probes 422 has a first end 423 and a second end 424. The first end 423 protrudes from a bottom portion 427 of the recess 425, and the second end 424 is electrically connected to the conductive material 415 of the carrier 410.

In one embodiment, the second end 424 of each of the probes 422 protrudes from the lower surface 429 of the base 421 and extends into each of the vias 414 to electrically connect the conductive materials 415, but the probes 422 are electrically connected. The manner of each conductive material 415 is not limited in this manner. For example, the second ends 424 of the conductive materials 415 electrically connected to the probes 422 can also be flush with the lower surface 429. In addition, the object to be tested 470 has a plurality of contacts 471 or a plurality of solder balls 472. Each of the probes 422 protrudes from the first end 423 of the bottom portion 427 for contacting the contacts 471 or the solder balls 472.

The testing device 400 further has at least one positioning component 441 and at least one positioning hole 440. The positioning hole 440 is located on the lower surface 429 of the base 421 of the test fixture 420. The positioning component 441 is located on the circuit board 460 and is aligned and inserted into the positioning hole. 440, positioning test fixture 420 on carrier 410. On the other hand, the positioning hole 440 and the positioning component 441 can also be oppositely disposed, that is, the positioning hole 440 is disposed on the circuit board 460, and the positioning component 441 is disposed on the lower surface 429 of the base 421 to position the test fixture 420 on the carrier 410. .

The testing device 400 further includes a fixing material 450 between the carrier 410 and the test fixture 420. In one embodiment, the fixing material 450 can be an adhesive layer for bonding the carrier 410 and the base 421. The carrier 410 is electrically connected to the circuit board 460 via the electrical conductor 430, and the test fixture 420 is disposed on the carrier 410 by the fixing material 450. The lower surface 429 of the base 421 is separated from the circuit board 460 by a height H6, and the height H6 includes the height H5 of the carrier 410 and the height of the fixing material 450.

As shown in FIG. 4A, when the object to be tested 470 is tested, the object to be tested 470 is first placed on each of the probes 422, and the probes 422 are respectively aligned and contacted with the contacts 471 of the object to be tested 470. Or each solder ball 472 is exemplified by contact with each solder ball 472.

Next, as shown in FIG. 3B, a pressure 481 is applied to the object to be tested 470 so that each of the solder balls 472 is in close contact with each of the probes 422. When the solder balls 472 are in close contact with the probes 422, the electrical signals of the test object 470 are sequentially transmitted to the circuit via the contacts 471, the solder balls 472, the probes 422, the conductive materials 415, the conductors 430, and the pads 461. Board 460. Finally, the circuit board 460 is transferred to the test circuit and the display screen (not shown) and the like.

In the test apparatus 400 of the present embodiment, the test fixture 420 having a larger length is connected to the circuit board 460 by the carrier 410 of a smaller length, so that a space is formed between the circuit board 460, the carrier 410 and the base 421. 480, the available space 480 can be provided with more electronic components 462 on the circuit board 460, and the test fixture 420 having a larger size can also be disposed on the circuit board 460.

In each of the above embodiments, each of the circuit boards may be a printed circuit board, a carrier board, a substrate, a function board, or a carrier. The object to be tested may be a semiconductor component, a semiconductor wafer, a package wafer, a package, a package structure, an electronic component, or any of the components to be tested. The carrier may be a carrier, a carrier, a pad, a heightening plate, a fixing plate, a positioning plate, a sealant, an insulator or a non-conductor. The pads can be contacts, pads, connection pads, metal pads, conductive pads or fingers.

The conductive material may be a conductive element, an electrical conductor, a metal material, a metal layer or a metal needle or the like. The electrical conductor can be a conductive element, a metal ball, a gold ball, a solder ball, a solder ball or a bump. The contacts can be pads, pads, connection pads, metal pads, fingers, pins or lead frames. The solder balls may be metal balls, gold balls, solder balls, bumps or electric conductors. The via hole may be a conductive hole, a through hole or an opening, or the like. The fixing material can be a fixing component, a screw, a viscous material, an adhesive or an adhesive layer. The probe can be a fixed probe, an elastic probe or a telescopic probe or the like. The pressure can be manual, cover, oil pressure, air pressure or mechanical actuation.

According to the testing device of the above embodiments, the length of the surface of the carrier connected to the circuit board is smaller than the length of the test fixture, so that a space is formed between the test fixture, the carrier and the circuit board, and the available space can be used to set more electrons. Components are placed on the board to increase the utilization of space on the board. At the same time, the method of connecting the test fixture with the carrier can avoid the limitation of the size of the test fixture on the space on the circuit board, so that the test fixture can use a larger size test fixture according to actual needs, thereby improving the flexibility of use. Furthermore, in the test device, the test fixture is provided by a carrier having a simple structure, which has the advantages of simple design and cost economy.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100. . . Test device

101. . . Test Fixture

110. . . Seat

111. . . Probe

112. . . Groove

113. . . Opening

114. . . bottom

115. . . Upper surface

116. . . lower surface

117. . . Card slot

120. . . Cover

121. . . Rotating shaft

122. . . Latch

123. . . Convex

130. . . Analyte

131. . . contact

132. . . Solder ball

140. . . Circuit board

141. . . Electronic component

200. . . Test device

210. . . First carrier

211. . . First side

212. . . Second side

213. . . First pad

214. . . Second pad

215. . . First via

216. . . First conductive material

220. . . Second carrier

221. . . Third side

222. . . Fourth side

223. . . Third pad

224. . . Second via

225. . . Second conductive material

230. . . Test Fixture

231. . . Seat

232. . . Probe

233. . . First end

234. . . Second end

235. . . Groove

236. . . Opening

237. . . bottom

238. . . Upper surface

239. . . lower surface

240. . . First conductor

241. . . Second conductor

250. . . Positioning hole

251. . . Positioning element

260. . . Through hole

261. . . Fixing material

270. . . Circuit board

271. . . Solder pad

272. . . Electronic component

280. . . Analyte

281. . . contact

282. . . Solder ball

290. . . Available space

291. . . pressure

300. . . Test device

310. . . Carrier

311. . . first part

312. . . the second part

313. . . First side

314. . . Second side

315. . . Third side

316. . . Pad

317. . . Via

318. . . Conductive material

320. . . Test Fixture

321. . . Seat

322. . . Probe

323. . . First end

324. . . Second end

325. . . Groove

326. . . Opening

327. . . bottom

328. . . Upper surface

329. . . lower surface

330. . . Electrical conductor

340. . . Positioning hole

341. . . Positioning element

350. . . Fixing material

360. . . Circuit board

361. . . Solder pad

362. . . Electronic component

370. . . Analyte

371. . . contact

372. . . Solder ball

380. . . Available space

381. . . pressure

400. . . Test device

410. . . Carrier

411. . . First side

412. . . Second side

413. . . Pad

414. . . Via

415. . . Conductive material

420. . . Test Fixture

421. . . Seat

422. . . Probe

423. . . First end

424. . . Second end

425. . . Groove

426. . . Opening

427. . . bottom

428. . . Upper surface

429. . . lower surface

430. . . Electrical conductor

440. . . Positioning hole

441. . . Positioning element

450. . . Fixing material

460. . . Circuit board

461. . . Solder pad

462. . . Electronic component

470. . . Analyte

471. . . contact

472. . . Solder ball

480. . . Available space

481. . . pressure

H1～H6. . . height

L1, L4, L7. . . First length

L2, L5, L8. . . Second length

L3, L6, L9. . . length

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

FIG. 1A is a cross-sectional view showing a conventional test fixture.

FIG. 1B is a cross-sectional view showing the test apparatus of the conventional FIG. 1A at the time of testing.

2A is a cross-sectional view showing a test apparatus according to an embodiment of the present invention.

Figure 2B is a cross-sectional view showing the test apparatus of Figure 2A of the present invention during testing.

3A is a cross-sectional view showing a test apparatus according to another embodiment of the present invention.

Figure 3B is a cross-sectional view showing the test apparatus of Figure 3A of the present invention during testing.

4A is a cross-sectional view showing a test apparatus according to still another embodiment of the present invention.

Figure 4B is a cross-sectional view showing the test apparatus of Figure 4A of the present invention when tested.

200. . . Test device

210. . . First carrier

211. . . First side

212. . . Second side

213. . . First pad

214. . . Second pad

215. . . First via

216. . . First conductive material

220. . . Second carrier

221. . . Third side

222. . . Fourth side

223. . . Third pad

224. . . Second via

225. . . Second conductive material

230. . . Test Fixture

231. . . Seat

232. . . Probe

233. . . First end

234. . . Second end

235. . . Groove

236. . . Opening

237. . . bottom

238. . . Upper surface

239. . . lower surface

240. . . First conductor

241. . . Second conductor

250. . . Positioning hole

251. . . Positioning element

260. . . Through hole

261. . . Fixing material

270. . . Circuit board

271. . . Solder pad

272. . . Electronic component

280. . . Analyte

281. . . contact

282. . . Solder ball

290. . . Available space

291. . . pressure

H2. . . height

Claims (13)

A test device for testing a test object on a circuit board, the test device comprising: a first carrier on the circuit board and electrically connected to the circuit board, and the first carrier has a first a second carrier on the first carrier and electrically connected to the first carrier, and the second carrier has a second length; and a test fixture on the second carrier and electrically Connecting the second carrier and the object to be tested; wherein the second length is greater than the first length, a space is formed between the first carrier, the second carrier and the circuit board, and wherein the available space is located On or around the first carrier, the circuit board is provided with at least one electronic component, the electronic component is located at the available space, the circuit board has a plurality of pads, the first carrier has a first surface, a first Two sides, a plurality of first pads and a plurality of second pads, the first face facing the circuit board and having the first length, the second face being opposite to the first face, the first pads are located Aligning the pads on the first surface, the The second pads located on the second surface and aligned with the first pads. The test device of claim 1, further comprising a plurality of first electrical conductors, wherein the first electrical conductors are located between the solder pads and the first pads, and electrically connected to the circuit board And the first carrier, the first carrier has a plurality of first via holes or a plurality of first conductive materials, the first conductive vias penetrating the first carrier, the first pads and the second pads The first conductive material is located in the first conductive vias and electrically connected to the first pads and the second pads. The test device of claim 1, further comprising a plurality of second electrical conductors, wherein the second electrical conductors are located at the second pads Between the third pads, and electrically connecting the first carrier and the second carrier, the second carrier has a third surface, a fourth surface and a plurality of third pads, and has a plurality of second a via hole or a plurality of second conductive materials, the third surface facing the first carrier and having the second length, the fourth surface facing the third surface facing the test fixture, the third pads The second conductive vias are located in the second vias and the second conductive vias are located in the second vias and the second conductive vias are located in the second vias and Electrically connecting the third pads. The test device of claim 1, wherein the test fixture has a body and a plurality of probes, the base is located on the second carrier and has a groove, an upper surface and a lower surface. One of the recesses is located at the upper surface, the lower surface is opposite to the upper surface and faces the second carrier, the probes are located in the base body, and the object to be tested is located on the probes, each The probe has a first end and a second end. The first end protrudes from a bottom of the recess and is electrically connected to the object to be tested. The second end protrudes from the lower surface and is electrically connected to the second end. Carrier. The test device of claim 1, further comprising at least one positioning hole, at least one positioning component, at least one continuous hole and at least one fixing material, the positioning hole is located on the second carrier, and the positioning component is located in the test The fixing hole is aligned with the positioning hole, and the through hole penetrates the second carrier and the test fixture, and the fixing material is located in the through hole. A test device for testing a test object on a circuit board, the test device comprising: a carrier on the circuit board and electrically connected to the circuit board, and the carrier has a first portion and a second a portion, the first portion is located on the circuit board and has a first length, the second portion is located on the first portion and has a second length; a test fixture is disposed on the carrier and electrically connected to the carrier and the object to be tested; wherein the second length is greater than the first length, and the first portion, the second portion and the circuit board form a An available space, wherein the available space is located on or around the first portion, the circuit board is provided with at least one electronic component, the electronic component is located at the available space, the circuit board has a plurality of pads, the first portion Having a first surface and a plurality of pads, the first surface facing the circuit board and having the first length, the pads being located on the first surface and aligned with the pads, the second portion having a second face and a third face, the second face facing the first portion and having the second length, the third face facing the test face relative to the second face. The test device of claim 6, further comprising a plurality of electrical conductors, the electrical conductors being located between the pads and the pads, and electrically connecting the circuit board and the carrier, the carrier And a plurality of conductive vias or a plurality of conductive materials, the conductive vias penetrating through the carrier and the pads, and the conductive materials are located in the vias and electrically connected to the pads. The test device of claim 6, wherein the test fixture has a body and a plurality of probes, the seat body is located on the second portion, and has a groove, an upper surface and a lower surface. One of the recesses is located at the upper surface, the lower surface faces the carrier with respect to the upper surface, the probes are located in the base, and the object to be tested is located on the probes, each probe The first end protrudes from the bottom of the recess and is electrically connected to the object to be tested. The second end protrudes from the lower surface and is electrically connected to the carrier. The test device of claim 6, further comprising at least one positioning hole, at least one positioning component and a fixing material, the positioning hole position In the test fixture, the positioning component is located on the second portion and aligned with the positioning hole, and the fixing material is located between the carrier and the test fixture. A test device for testing a test object on a circuit board, the test device comprising: a carrier on the circuit board, electrically connected to the circuit board, and the carrier has a first length; and a a test fixture is disposed on the carrier and electrically connected to the carrier and the object to be tested, and the test fixture has a second length; wherein the second length is greater than the first length, the carrier, the test Forming a usable space with the circuit board, wherein the available space is located on or around the carrier, the circuit board is provided with at least one electronic component, the electronic component is located at the available space, the circuit board has a plurality of pads, the carrier having a first surface, a second surface, and a plurality of pads, the first surface facing the circuit board and having the first length, the second surface being opposite to the first surface For the test fixture, the pads are located on the first surface and aligned with the pads. The test device of claim 10, further comprising a plurality of electrical conductors, the electrical conductors being located between the pads and the pads, and electrically connecting the circuit board and the carrier, the carrier And a plurality of conductive vias or a plurality of conductive materials, the conductive vias penetrating through the carrier and the pads, and the conductive materials are located in the vias and electrically connected to the pads. The test device of claim 10, wherein the test fixture further has a body and a plurality of probes, the base is located on the carrier and has a groove, an upper surface and a lower surface One of the recesses is located at the upper surface, the lower surface faces the carrier and has the second length, the probes are located in the base, and the object to be tested is located on the probes, each probe The needle has a first end and a second end, the first end protruding from One end of the groove is electrically connected to the object to be tested, and the second end protrudes from the lower surface and is electrically connected to the carrier. The test device of claim 10, further comprising at least one positioning hole, at least one positioning component and a fixing material, the positioning hole is located on the test fixture, the positioning component is located on the circuit board and aligned The positioning hole is located between the carrier and the test fixture.