CN112444723B - Test device and test flow using same - Google Patents
Test device and test flow using same Download PDFInfo
- Publication number
- CN112444723B CN112444723B CN201910831626.XA CN201910831626A CN112444723B CN 112444723 B CN112444723 B CN 112444723B CN 201910831626 A CN201910831626 A CN 201910831626A CN 112444723 B CN112444723 B CN 112444723B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- chip
- module
- pick
- testing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
Abstract
The invention provides a testing device, which is used for testing a chip, and the chip is connected on a circuit board in a flip chip manner. The testing device comprises a testing module and a taking and placing module. The test module includes a plurality of probes. The pick-and-place module is provided with an accommodating space. The pick-and-place module comprises an adsorption head, a first gas pipeline and a second gas pipeline. The adsorption head is positioned in the accommodating space. The first air pipeline is communicated with the adsorption head. The second gas pipeline is communicated with the accommodating space. When the chip is tested, the circuit board and the chip are arranged in the accommodating space, the adsorption head is contacted with the back surface of the chip, the probes are electrically connected to the circuit board, and the end point of the second gas pipeline is basically not contacted with the circuit board and the chip. A test flow using the test apparatus is also provided.
Description
Technical Field
The present invention relates to a test apparatus and a test process using the same, and more particularly, to a test apparatus and a test process using the same, which are suitable for testing a chip flip-chip bonded on a circuit board.
Background
In recent years, with the rise and fall of electronic technologies, the high-tech electronic industry has been developed, so that more humanized and functional electronic products are continuously developed and designed towards light, thin, short and small trends.
Thinner electronic products, however, may be less tolerant to stress. Therefore, during the manufacturing process of the electronic product (e.g., during the testing of unfinished products or intermediate structures), breakage or chipping may be easily caused.
Disclosure of Invention
The invention provides a testing device and a testing process using the same, which can reduce the possibility of breakage or fragmentation of a circuit board and/or a chip on the circuit board.
The testing device of the invention tests the chip, and the chip is jointed on the circuit board in a flip chip manner. The testing device comprises a testing module and a taking and placing module. The test module includes a plurality of probes. The pick-and-place module is provided with an accommodating space. The pick-and-place module comprises an adsorption head, a first air pipeline and a second air pipeline. The adsorption head is positioned in the accommodating space. The first air pipeline is communicated with the adsorption head. The second gas pipeline is communicated with the accommodating space. When the chip is tested, the circuit board and the chip are arranged in the accommodating space, the adsorption head is contacted with the back surface of the chip, the probes are electrically connected to the circuit board, and the end point of the second gas pipeline is basically not contacted with the circuit board and the chip.
In an embodiment of the present invention, the first gas line and the second gas line are not communicated with each other.
In an embodiment of the invention, the pick-and-place module further includes a fastening groove, the fastening groove has a step surface and a bottom surface, and the step surface and the bottom surface form an accommodating space.
In an embodiment of the invention, the adsorption head is disposed on the bottom surface, and the end point of the second gas pipeline is located on the bottom surface.
In an embodiment of the invention, the accommodating space has a first area and a second area, the first area has a first depth, the second area has a second depth, and the second depth is greater than the first depth.
In one embodiment of the present invention, the adsorption head is located in the second zone, and the end point of the second gas line is not located in the second zone.
The test flow of the present invention includes the following steps. The foregoing test device is provided. An electronic device is provided, wherein the electronic device comprises a circuit board and a chip flip-chip bonded on the circuit board. The electronic element is picked up by the pick-and-place module of the testing device. The pick-and-place module for picking up the electronic element is close to the test module. The circuit board of the electronic element picked up by the picking and placing module is electrically connected with the probes for testing.
In an embodiment of the present invention, the step of electrically connecting the circuit board of the electronic component picked up by the pick-and-place module to the plurality of probes includes sequentially performing the following step (1) and step (2). The step (1): the pick-and-place module for picking up the electronic element is close to the test module, so that the circuit board of the electronic element picked up by the pick-and-place module is electrically connected with at least one of the probes. Step (2): and filling gas into the accommodating space through the second gas pipeline.
In an embodiment of the present invention, the method further includes performing the step (1) and the step (2) a plurality of times.
In an embodiment of the invention, after the pick-and-place module of the testing apparatus picks up the electronic component, the electronic component and the pick-and-place module substantially form an enclosed space, and the end point of the second gas pipeline is communicated with the enclosed space.
Based on the above, the testing device and the testing process using the same of the present invention can reduce the possibility of breakage or chipping of the circuit board and/or the chip on the circuit board.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
FIG. 1 is a partial flow diagram of a test flow according to an embodiment of the present invention;
FIGS. 2A-2C are schematic side views of a portion of a test flow according to an embodiment of the invention;
FIG. 2D is a schematic cross-sectional side view of a portion of a test flow in accordance with one embodiment of the present invention;
FIG. 3 is a partial timing diagram of a test flow according to an embodiment of the invention.
The reference numbers illustrate:
100: testing device
200: taking and placing module
210: containing space
211: first region
T1: first depth
212: second region
T2: second depth
220: adsorption head
230: first gas pipeline
234: endpoint
240: second gas pipeline
244: endpoint
250: clamping groove
255: the top surface
256: step surface
256a: first tread
256b: connecting surface
256c: second tread
257: bottom surface
260: test arm
270: closed space
300: test module
310: probe needle
311: first conductive terminal
312: elastic conductive piece
313: second conductive terminal
320: base seat
325: upper surface of
327: lower surface
330: circuit board
338: contact pad
400: electronic component
410: circuit board
415: first surface
417: second surface
420: chip and method for manufacturing the same
425: active surface
427: back side of the panel
430: conductive terminal
R: region(s)
S11, S12, S20, S30, S40: step (ii) of
Detailed Description
FIG. 1 is a partial flow diagram of a test flow according to an embodiment of the present invention. Fig. 2A to 2C are schematic side views of a part of a testing process according to an embodiment of the invention. FIG. 2D is a schematic diagram of a partial cross-sectional side view of a test flow according to an embodiment of the invention. FIG. 2D may be the same or similar to the cross-sectional view of region R in FIG. 2A. FIG. 3 is a partial timing diagram of a test flow according to an embodiment of the invention.
Referring to fig. 1, fig. 2A and fig. 2D, in step S11, a testing apparatus 100 is provided. The testing apparatus 100 includes a pick-and-place module 200 and a testing module 300. The pick-and-place module 200 has a receiving space 210. The pick-and-place module 200 includes a suction head 220, a first gas line 230, and a second gas line 240. The suction head 220 is located in the accommodating space 210. The first air line 230 is connected to the adsorption head 220. The second gas pipeline 240 is communicated with the accommodating space 210. The test module 300 includes a plurality of probes 310.
In this embodiment, the first gas pipeline 230 may be directly connected to the adsorption head 220, and the second gas pipeline 240 may be directly connected to the accommodating space 210.
In this embodiment, the pick-and-place module 200 may further include a snap groove (nes) 250. The engaging slot 250 may be secured to the test arm 260 by a clamp, clip, latch, or other suitable fixture or corresponding means. The engaging groove 250 has a top surface 255 (i.e., the surface farthest from the testing arm 260), a stepped surface 256, and a bottom surface 257 (i.e., the surface closest to the testing arm 260 within the receiving space 210). Stepped surface 256 connects top surface 255 with bottom surface 257. The stepped surface 256 and the bottom surface 257 may form an open receiving space 210. In other words, the accommodating space 210 in the engaging groove 250 may have a first area 211 and a second area 212, wherein the first area 211 has a first depth T1, the second area 212 has a second depth T2, and the second depth T2 is greater than the first depth T1.
In the present embodiment, the stepped surface 256 may include a first stepped surface 256a, a connection surface 256b, and a second stepped surface 256c. Connecting surface 256b is located between first tread 256a and second tread 256c. First tread 256a may be connected to top surface 255. The second tread 256c may be connected to the bottom surface 257.
In this embodiment, the adsorption head 220 may be disposed on the bottom surface 257, and the end point 244 of the second gas pipeline 240 may be located on the bottom surface 257. In other words, the adsorption head 220 may be located in the second region 212 of the accommodating space 210, and the end 244 of the second gas pipeline 240 is not located in the first region 211 of the accommodating space 210 (e.g., may be located in the second region 212 of the accommodating space 210).
In the present embodiment, the first gas line 230 and the second gas line 240 are not communicated with each other. For example, in an open space, if the first gas line 230 is pressurized or depressurized, the gas pressure in the second gas line 240 is not substantially pressurized or depressurized correspondingly; or if the pressure in the second gas line 240 is increased or decreased, the pressure in the first gas line 230 is not substantially increased or decreased accordingly. In short, in an open space, the increase and decrease of the gas pressure in the first gas pipeline 230 and the increase and decrease of the gas pressure in the second gas pipeline 240 are not substantially linked.
In this embodiment, the suction head 220 may be made of a polymer material having elasticity. For example, the suction head 220 may include a rubber suction cup, and the terminal 234 of the first air pipeline 230 may be directly connected to the suction head 220, but the invention is not limited thereto.
In the present embodiment, the test module 300 may further include a base (socket) 320 and a circuit board 330. The probe 310 may be embedded in the base 320, and the probe 310 may be electrically connected to a corresponding contact pad 338 on the circuit board 330. For example, the probe 310 may include a first conductive end 311, an elastic conductive member 312, and a second conductive end 313. The first conductive terminal 311 may protrude from the upper surface 325 of the base 320 to contact a device under test (e.g., an electronic device 400 described below). The second conductive end 313 may protrude from the lower surface 327 of the base 320 to contact a corresponding contact pad 338 on the circuit board 330. The elastic conductive member 312 is located at the first conductive end 311 and the second conductive end 313.
In the present embodiment, the elastic conductive member 312 is, for example, a spring made of a conductive material. That is, the probe 310 may be a pogo pin.
In one embodiment, the elastic conductive member 312 has an elastic coefficient of about 60 g/mm (g/mm) to about 90 g/mm, but the invention is not limited thereto.
In an embodiment, the pick-and-place module 200 and/or the test module 300 may have alignment elements thereon, but the invention is not limited thereto. For example, the pick-and-place module 200 and the testing module 300 may have positioning holes (guide holes) and corresponding positioning pins (guide pins).
Referring to fig. 1 and fig. 2B, in step S12, an electronic device 400 is provided. The electronic component 400 includes a wiring board 410 and a chip 420 (die). The wiring board 410 has a first surface 415 and a second surface 417 opposite to each other. The chip 420 is disposed on the first surface 415 of the circuit board 410, and the chip 420 can be electrically connected to the circuit board 410 by flip chip bonding (flip chip bonding).
In the present embodiment, the wiring board 410 may have a core layer (not shown). The core layer may include a polymer glass fiber composite substrate, a glass substrate, a ceramic substrate, an insulating silicon substrate, a Polyimide (PI) glass fiber composite substrate. The core layer may constitute a double-sided wiring board (double-sided wiring board) with at least two wiring layers located at opposite sides thereof. For example, the circuit board 410 may be a Copper Clad Laminate (CCL) or other suitable printed circuit board, but the invention is not limited thereto.
In one embodiment, the circuit board 410 may be referred to as a hard board (PCB).
In one embodiment, the thickness of the circuit board 410 is substantially less than or equal to 1.6 millimeters (mm), but the invention is not limited thereto.
In one embodiment, the circuit board 410 has a size of about 10 mm × 10 mm to 25 mm × 25 mm, but the invention is not limited thereto.
In this embodiment, the chip 420 on the wiring board 410 may be bare die (bare die). In other words, the wiring board 410 does not have a molding compound (molding compound) thereon that encapsulates the chip 420.
In one embodiment, the connection pads on the chip 420 may be electrically connected to corresponding circuits (not shown) in the circuit board 410 via corresponding bumps (bumps) (not shown). The bumps may include tin, lead, gold, or a combination thereof, but the present invention is not limited thereto.
In an embodiment, an underfill (not shown) may be filled between the chip 420 and the circuit board 410, but the invention is not limited thereto.
In one embodiment, the thickness of chip 420 is substantially less than or equal to 1.0 millimeter (mm), although the invention is not limited thereto.
In this embodiment, the electronic component 400 may further include a plurality of conductive terminals 430. The plurality of conductive terminals 430 may be disposed on the second surface 417 of the circuit board 410 in an array, but the invention is not limited thereto. The conductive terminals 430 are solder balls, for example, but the invention is not limited thereto.
In an embodiment, the number of the conductive terminals 430 may be greater than or equal to 400, but the invention is not limited thereto.
Referring to fig. 1 and fig. 2B, in step S20, the pick-and-place module 200 of the testing apparatus 100 is used to pick up the electronic device 400.
For example, the suction head 220 of the pick-and-place module 200 may be moved to above the chip 420 on the circuit board 410. Next, the suction head 220 may be brought into contact with the back surface 427 of the chip 420 (i.e., the surface opposite to the active surface 425) by evacuating the first gas line 230 so that the pressure in the first gas line 230 is less than the ambient pressure, and the chip 420 may be fixed on the suction head 220. That is, the circuit board 410 and the chip 420 flip-chip bonded on the circuit board 410 can be disposed in the accommodating space 210.
In the present embodiment, after the pick-and-place module 200 of the testing apparatus 100 picks up the electronic component 400, the electronic component 400 and the pick-and-place module 200 substantially form the closed space 270 (i.e., a portion of the accommodating space 210).
In this embodiment, the suction head 220 sucks the chip 420, so that the circuit board 410 of the electronic component 400 can be correspondingly brought into contact with the connection surface 256 b. In this way, the electronic component 400, the second step surface 256c and the bottom surface 257 form the enclosed space 270. That is, when the first gas line 230 is pumped to adsorb the chip 420, the gas pressure in the enclosed space 270 is not substantially decreased correspondingly; or the second gas pipe 240 is pumped to increase the pressure in the enclosed space 270, the electronic component 400 is not substantially separated from the suction head 220 of the pick-and-place module 200.
In this embodiment, the end 244 of the second gas line 240 communicates with the enclosed space 270. That is, the end 244 of the second gas line 240 does not substantially contact the electronic component 400.
Notably, enclosed space 270 is not a completely closed system (closed system). For example, gas may be pumped into the enclosed space 270 or pumped out of the enclosed space 270 through a predetermined line (e.g., the second gas line 240); or some gas may be transferred between the interior or exterior of enclosed space 270 through a slit at the interface (e.g., the interface between circuit board 410 and connecting surface 256 b).
Referring to fig. 1 and fig. 2B to fig. 2C, in step S30, the pick-and-place module 200 for picking up the electronic component 400 is close to the test module 300.
In one embodiment, the pick-and-place module 200 for picking up the electronic component 400 may be moved toward the test module 300, but the invention is not limited thereto. In another embodiment, the testing module 300 may be moved toward the electronic component 400 picked up by the pick-and-place module 200.
Referring to fig. 1 and fig. 2C, in step S40, the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 is electrically connected to the probes 310 for testing. That is, the testing apparatus 100 is suitable for testing the chip 420 flip-chip mounted on the circuit board 410.
In this embodiment, the step of electrically connecting the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 to the plurality of probes 310 may include sequentially performing the following step (1) and step (2).
The step (1): the pick-and-place module 200 for picking up the electronic component 400 is close to the test module 300, so that the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 is electrically connected to at least one of the probes 310.
Step (2): the enclosed space 270 (i.e., a portion of the accommodating space 210) is filled with gas through the second gas pipe 240.
After the gas is injected into the enclosed space 270 through the second gas line 240, the pressure of the gas in the enclosed space 270 may be raised. Thus, the pressure applied to the first surface 415 of the circuit board 410 (e.g., the air pressure in the enclosed space 270) can be close to the pressure applied to the second surface 417 of the circuit board 410 (e.g., the stress transferred directly or indirectly to the second surface 417 by the contact force applied by the probes 310 to the conductive terminals 430) so as to reduce the possibility of breakage or chipping of the circuit board 410 and/or the chip 420 on the circuit board 410.
In this embodiment, the step (1) and the step (2) may be performed a plurality of times.
Please refer to fig. 1, fig. 2C to fig. 2D and fig. 3. Fig. 3 can be a graph showing the relationship between the corresponding relative pressures and the corresponding relative compression amounts in the steps (1) to (6), the testing step, and the steps (7) to (12). It should be noted that in fig. 3, the horizontal axis is only used to indicate the steps, and does not necessarily represent the time duration of the steps; in addition, in fig. 3, the connecting lines (e.g., solid lines, dashed lines, dot-dashed lines) are only used to indicate the corresponding relative pressures and corresponding relative compression trends before and after the steps are performed, and do not necessarily represent the relationship between the relative pressures and the compression during the steps are performed. In addition, in fig. 3, the solid line may be a line connecting the relative compression amounts (e.g., triangular dots) of at least one probe 310 before and after the respective steps are performed, the dotted line may be a line connecting the pressure values (e.g., square dots) applied to the second surface 417 of the circuit board 410 before and after the respective steps are performed, and the dotted line may be a line connecting the pressure values (e.g., diamond dots) applied to the first surface 415 of the circuit board 410 before and after the respective steps are performed. In the vertical axis on the left side of fig. 3, the relative pressure P is indicated 1 To P 10 The values of (A) are sequentially higher. That is, the relative pressure P 1 Is less than the relative pressure P 2 Value of (2), relative pressure P 2 Is less than the relative pressure P 3 And so on. In the vertical axis on the right side of FIG. 3, the relative compression X is indicated 1 To X 10 The values of (A) are sequentially higher. That is, the relative compression amount X 1 Is less than the relative compression amount X 2 Value of (2), relative compression amount X 2 Is less than the relative compression amount X 3 And so on.
For example, referring to fig. 3, the step of electrically connecting the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 to the plurality of probes 310 may include sequentially performing the following steps (1) to (6), wherein the steps (3) and (5) are substantially the same or similar to the step (1), and the steps (4) and (6) are substantially the same or similar to the step (2).
After the above-mentioned step (1) and the above-mentioned step (2), the contact end (e.g., the first conductive end 311; shown in fig. 2D) of the probe 310 can be in good contact with the contact end (e.g., the corresponding conductive terminal 430) of the electronic component 400, and/or the contact end (e.g., the second conductive end 313) of the probe 310 can be in good contact with the contact end (e.g., the corresponding contact pad 338; shown in fig. 2D) of the circuit board 330, and the possibility of breakage or chipping of the circuit board 410 and/or the chip 420 on the circuit board 410 can be reduced.
In this embodiment, after the electronic component 400 is electrically connected to the circuit board 330 through the probes 310, a testing step may be performed. The testing step may include, for example, circuit testing or electrical testing. The parameters (recipe) and contents of the testing procedure can be adjusted according to the design or usage requirements, and the invention is not limited thereto.
In this embodiment, after the test step is stopped or completed, the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 may be electrically separated from the corresponding probe 310.
The step of electrically separating the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 from the corresponding probe 310 may include the following steps (7) and (8) in sequence.
Step (7): gas is drawn from the enclosed space 270 (i.e., a portion of the accommodating space 210) through the second gas line 240.
Step (8): the pick-and-place module 200 for picking up the electronic component 400 is far away from the test module 300.
After gas is withdrawn from enclosed space 270 through second gas line 240, the pressure of the gas within enclosed space 270 may be reduced. Thus, the pressure applied to the first surface 415 of the circuit board 410 (e.g., the air pressure in the enclosed space 270) can be close to the pressure applied to the second surface 417 of the circuit board 410 (e.g., the stress transferred directly or indirectly to the second surface 417 by the contact force applied by the probes 310 to the conductive terminals 430) so as to reduce the possibility of breakage or chipping of the circuit board 410 and/or the chip 420 on the circuit board 410.
In this embodiment, the step (7) and the step (8) may be performed a plurality of times.
For example, referring to fig. 3, the step of electrically separating the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 from the corresponding probe 310 may include the following steps (7) to (12) in sequence, wherein the steps (9) and (11) are substantially the same as or similar to the step (7), and the steps (10) and (12) are substantially the same as or similar to the step (8).
After the step (7) and the step (8), the contact ends (e.g., the first conductive ends 311) of the probes 310 and the contact ends (e.g., the corresponding conductive terminals 430) of the electronic component 400 can be electrically separated, and the possibility of breakage or chipping of the circuit board 410 and/or the chip 420 on the circuit board 410 can be reduced.
In summary, the testing apparatus and the testing process using the same of the present invention can reduce the possibility of breakage or chipping of the circuit board and/or the chip on the circuit board.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. A testing apparatus for testing a chip flip-chip bonded on a circuit board, the testing apparatus comprising:
a test module comprising a plurality of probes; and
get and put the module, have the accommodation space, just get and put the module and include:
the adsorption head is positioned in the accommodating space;
the first gas pipeline is communicated with the adsorption head; and
a second gas pipeline communicated with the accommodating space,
wherein before testing the chip, when the adsorption head of the pick-and-place module of the testing device picks up the chip which is flip chip bonded on the circuit board, the first gas pipeline communicated with the adsorption head is a gas suction pipeline, and the second gas pipeline communicated with the accommodating space is a gas inlet pipeline,
when the chip is tested, a closed space is formed between the pick-and-place module and the circuit board, the chip is arranged in the accommodating space, the adsorption head is in contact with the back surface of the chip, the probes are electrically connected to the circuit board, and the end point of the second gas pipeline is basically not in contact with the circuit board and the chip.
2. The test device of claim 1, wherein the first gas line and the second gas line are not in communication with each other.
3. The testing device of claim 1, wherein the picking and placing module further comprises a latch groove, the latch groove has a stepped surface and a bottom surface, and the stepped surface and the bottom surface form the accommodating space.
4. The test device of claim 3, wherein the adsorption head is disposed on the bottom surface, and an end point of the second gas line is located on the bottom surface.
5. The test device of claim 1, wherein the receiving space has a first region and a second region, the first region has a first depth, the second region has a second depth, and the second depth is greater than the first depth.
6. The test device of claim 5, wherein the adsorption head is located in the second zone and an endpoint of the second gas line is not located in the first zone.
7. A test flow, comprising:
providing a test device according to claim 1;
providing an electronic element which comprises the circuit board and the chip which is in flip chip bonding on the circuit board;
picking up the electronic element by the picking and placing module of the testing device; and
the pick-and-place module for picking up the electronic element is close to the test module; and
and electrically connecting the circuit board of the electronic element picked up by the pick-and-place module to the probes for testing.
8. The testing process of claim 7, wherein the step of electrically connecting the circuit board of the electronic component picked up by the pick-and-place module to the plurality of probes comprises the following steps (1) and (2) in sequence:
the step (1): the pick-and-place module for picking up the electronic element is close to the test module, so that the circuit board of the electronic element picked up by the pick-and-place module is electrically connected with at least one of the probes; and
step (2): and filling gas into the accommodating space through the second gas pipeline.
9. The test flow of claim 8, further comprising: performing the (1) th step and the (2) th step a plurality of times.
10. The test flow of claim 7, wherein the electronic component and the pick-and-place module substantially form the enclosed space after the electronic component is picked up by the pick-and-place module of the testing apparatus, and the end of the second gas pipeline is communicated with the enclosed space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910831626.XA CN112444723B (en) | 2019-09-04 | 2019-09-04 | Test device and test flow using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910831626.XA CN112444723B (en) | 2019-09-04 | 2019-09-04 | Test device and test flow using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112444723A CN112444723A (en) | 2021-03-05 |
| CN112444723B true CN112444723B (en) | 2022-12-16 |
Family
ID=74734910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910831626.XA Active CN112444723B (en) | 2019-09-04 | 2019-09-04 | Test device and test flow using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112444723B (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI251081B (en) * | 2004-08-11 | 2006-03-11 | King Yuan Electronics Co Ltd | Method and apparatus for picking up an electric component under test |
| KR101149334B1 (en) * | 2007-10-31 | 2012-06-01 | 가부시키가이샤 아드반테스트 | An abnormality detecting apparatus for detecting abnormarlity at interface portion of contact arm, An electronic device testing apparatus and An electronic device testing system with the same, and An abnormality detecting method |
| WO2009130793A1 (en) * | 2008-04-25 | 2009-10-29 | 株式会社アドバンテスト | Test system and probe apparatus |
| CN102017115B (en) * | 2008-04-25 | 2012-07-25 | 爱德万测试株式会社 | Test system and probe apparatus |
| CN101587165A (en) * | 2008-05-23 | 2009-11-25 | 旺矽科技股份有限公司 | Wafer acceptance testing method, contact mat and probe card |
| JP5299089B2 (en) * | 2009-05-28 | 2013-09-25 | 富士電機株式会社 | Semiconductor chip test apparatus and test method |
| TW201423127A (en) * | 2012-12-14 | 2014-06-16 | Hon Tech Inc | Electronic component crimping unit, crimping control method and operation equipment using the same |
-
2019
- 2019-09-04 CN CN201910831626.XA patent/CN112444723B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112444723A (en) | 2021-03-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7160119B2 (en) | Controlled compliance fine pitch electrical interconnect | |
| US6939143B2 (en) | Flexible compliant interconnect assembly | |
| US6392429B1 (en) | Temporary semiconductor package having dense array external contacts | |
| US5815000A (en) | Method for testing semiconductor dice with conventionally sized temporary packages | |
| US6175241B1 (en) | Test carrier with decoupling capacitors for testing semiconductor components | |
| US7900347B2 (en) | Method of making a compliant interconnect assembly | |
| US8039943B2 (en) | Semiconductor device and manufacturing method therefor | |
| JP2000111576A (en) | Packaging and mutual connection of contact structure | |
| US7129730B2 (en) | Probe card assembly | |
| US8922232B2 (en) | Test-use individual substrate, probe, and semiconductor wafer testing apparatus | |
| JP2014168094A (en) | Micro electronic component package and method therefor | |
| WO1998014998A9 (en) | Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication | |
| WO1998014998A1 (en) | Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication | |
| KR20010070133A (en) | Contact structure having silicon finger contactors and total stack-up structure using same | |
| US20090027072A1 (en) | Apparatus for testing chips with ball grid array | |
| US20210190822A1 (en) | Multi-layer mems spring pin | |
| KR102600106B1 (en) | Method of manufacturing semiconductor packages | |
| CN112444723B (en) | Test device and test flow using same | |
| JP3720887B2 (en) | Contact device | |
| US8481366B2 (en) | Semiconductor device and manufacturing method therefor | |
| TWI710768B (en) | Testing apparatus and testing flow using the same | |
| US7474113B2 (en) | Flexible head probe for sort interface units | |
| KR20100069133A (en) | Spring contactor of test socket for semiconductor device | |
| US20040124507A1 (en) | Contact structure and production method thereof | |
| JP3596500B2 (en) | Method for manufacturing semiconductor inspection device, semiconductor inspection device, and method for inspecting semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |