TWI251081B - Method and apparatus for picking up an electric component under test - Google Patents

Method and apparatus for picking up an electric component under test Download PDF

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Publication number
TWI251081B
TWI251081B TW93124111A TW93124111A TWI251081B TW I251081 B TWI251081 B TW I251081B TW 93124111 A TW93124111 A TW 93124111A TW 93124111 A TW93124111 A TW 93124111A TW I251081 B TWI251081 B TW I251081B
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TW
Taiwan
Prior art keywords
elastic
tested
electronic component
picking
adsorption
Prior art date
Application number
TW93124111A
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Chinese (zh)
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TW200606432A (en
Inventor
Chiu-Fang Chang
Yuan-Chi Lin
Shih-Bau Chang
Diann-Fang Lin
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King Yuan Electronics Co Ltd
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Application filed by King Yuan Electronics Co Ltd filed Critical King Yuan Electronics Co Ltd
Priority to TW93124111A priority Critical patent/TWI251081B/en
Publication of TW200606432A publication Critical patent/TW200606432A/en
Application granted granted Critical
Publication of TWI251081B publication Critical patent/TWI251081B/en

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Abstract

By using two springs with different coefficients of elasticity, two stage compressions can be made. With the first stage compression, an electric component under test can be sucked and be pulled into a specific position surrounded with the floating site. At the meanwhile, each pair of the pads of the electric component under test and the pogo pins for testing the electric components are not contacted with each other, thus the electric component under test will not fall down because of the vacuum break. After moving the electric component under test to the tester, each pair of the pads and the pogo pins can be electrically coupled by the second stage compression.

Description

1251081 九、發明說明: 【發明所屬之技術領域】 本發明係有關於一種取放待測電子元件的方法與裝置,特別是 有關於以兩種不同彈性係數的彈性裝置來產生兩階段的壓縮之取 放待測電子元件的方法與裝置。 【先前技術】 電子元件於製造完成後通常需要經過測試,才能確定是否能 夠達到預設的功能。在測試時,通常是將整批的電子元件放置於 測減機台(tester)的托盤(tray)中,由測試機台上的取放裝置 Chandler)將一個或數個電子元件取放到擺梭裝置(shuttle means) ’ 接著由擺梭裝置將待測電子元件運送至測試區,再由測試區的取 放裝置將電子元件吸起,再搬移到插座(socket)以進行測試,並 ^在測試完成後,將電子元件交回擺梭裝置運回托盤區,再依測 試結果將電子元件放入合格托盤或不·合格的托盤中。 傳統上,係由取放裝置以一軟式吸頭,以真空吸取方式來交 之待測電子元件的上表面(即平整之表面),然後名 件移到測試機台後,以—下壓動作來將電子元卡 觸二二/子2adS)的下表面與插座中的測試端子(P〇g。pins) # 整。-般而言,電下表面’並且保持上表面, 句,因而造成2 :使得電f元件的厚度P 持水平,而下表面卻有著垂直角度可▲確保了上表面4 用彈ί:彈,置上裝置—彈簧裝置,^ 成水平的偏移,因此會在吸時不會因旋轉或錯動而立 ,,讓待測t子元在被吸附時,H圍安定位導板_1「 來將待測電子it件限制在一固定位置\入疋位導板所圍成的區域 弟圖所不,取放裝置10包含有吸附頭12、定位導板⑷ 1251081 彈簧裝置16。取放裝置1〇係利用真空吸附方式,由吸附頭 力來將待測電子元件18吸附,並且待測電子元件18會被叹產生叹 定位導板14而被固定在特定位置中,如第一 β圖所示。另咐滑入 裝置16可在待測電子元件18被下壓時,平均分攤待測電予1埤簧 表面的壓力以做為緩衝,減低端子受損的情形。 元件181251081 IX. Description of the Invention: [Technical Field] The present invention relates to a method and apparatus for picking and placing electronic components to be tested, and more particularly to generating two-stage compression by two elastic means with different elastic coefficients. A method and apparatus for picking up and placing electronic components to be tested. [Prior Art] After the electronic component is manufactured, it usually needs to be tested to determine whether the preset function can be achieved. In the test, usually the whole batch of electronic components are placed in the tray of the tester, and one or several electronic components are placed on the pendulum by the pick-and-place device Chandler on the test machine. Shuttle means' Next, the electronic component to be tested is transported to the test area by the shuttle device, and then the electronic components are sucked up by the pick-and-place device of the test area, and then moved to a socket for testing, and After the test is completed, the electronic components are returned to the shuttle device and transported back to the tray area, and the electronic components are placed in the qualified tray or the unqualified tray according to the test result. Traditionally, the upper surface (ie, the flat surface) of the electronic component to be tested is delivered by a pick-and-place device with a soft suction head in a vacuum suction manner, and then the member is moved to the test machine, and then the action is performed. To touch the lower surface of the electronic element card to the second or second 2adS) and the test terminal (P〇g.pins) in the socket. In general, the electric lower surface 'and keeps the upper surface, sentence, thus causing 2: making the thickness of the electric f element P horizontal, while the lower surface has a vertical angle ▲ ensuring that the upper surface 4 is used, Putting on the device-spring device, ^ is horizontally offset, so it will not stand due to rotation or dislocation when sucking, so that when the t-sub-element to be tested is adsorbed, H-encloses the guide plate_1 The electronic device to be tested is limited to a fixed position, and the area enclosed by the position guide is not included. The pick-and-place device 10 includes the adsorption head 12 and the positioning guide (4) 1251081 spring device 16. The pick-and-place device 1 The lanthanide system uses the vacuum adsorption method to adsorb the electronic component 18 to be tested by the adsorption head force, and the electronic component 18 to be tested is slanted to sing the positioning guide 14 to be fixed in a specific position, as shown in the first β diagram. The other sliding device 16 can evenly distribute the pressure of the surface to be tested to the surface of the spring to be used as a buffer to reduce the damage of the terminal when the electronic component 18 to be tested is pressed down.
此外,待,電子元件18在滑入定位導板14時,可能產 的情形’因此弟一 Β圖中的吸附頭12為一種軟式的吸附頭,逢斜 待測電子元件18在被吸引後,因受力不平均而造成一邊先=此當 位導板14時,如第一C圖所示,軟式吸附頭12因具有彈性而^入定 生形變來貼合待測電子元件18,進而將待測電子元件18的=殉產 份拉平’如鈾之弟一 Β圖所示。因此,定位導板用來揭限電/、他部 的範圍需預留比待測電子元件彳8稍大的空間,以避免在元件 由於空間過小而使待測電子元件18與定位導板14之間產走、付時, 磨擦力而卡住或歪斜。然而,現今,隨著電子元件的端子,大的 量增加,故對各端子間的精準度要求越來越高,致使定仅目大 能預留空間的容忍範圍也越來越小,也因此造成吸附的瞬14 測電子元件18滑入定位導板14也越來越困難。 @讓待In addition, when the electronic component 18 slides into the positioning guide 14, it may be produced. Therefore, the adsorption head 12 in the figure is a soft adsorption head, and after the electronic component 18 to be tested is attracted, When the force is uneven, one side first = this position guide 14 , as shown in the first C picture, the soft adsorption head 12 is elasticized and deformed to fit the electronic component 18 to be tested, and thus will be treated The electronic component 18 of the electronic component 18 is flattened as shown in the figure of the uranium. Therefore, the positioning guide is used to uncover the range of the electric/the other part, and a space slightly larger than the electronic component 彳8 to be tested is reserved to avoid the electronic component 18 and the positioning guide 14 to be tested due to the space being too small. When it is produced, paid, and rubbed, it is stuck or skewed. However, nowadays, as the terminals of electronic components increase in size, the accuracy requirements between the terminals are becoming higher and higher, and the tolerance range for the reserved space is also becoming smaller and smaller. It is also increasingly difficult to cause the adsorbed transient 14 to slide into the positioning guide 14. @让待
另外,為配合產品多樣化的需要,已有許多的電子元件兩 同時在封裝的上表面與下表面,同時裝配端子或其他特殊配:要 例如電子耦合裝置18〇(Charge Coupled Device ; CCD),其通常在一’ 表面配置一層感光層184以接收光線’並在另一個表面配置端 f 來與外界接觸,如第一 D圖所示。然而在測試時,所需要的 j 源需由測試機台發出’因此需要將感光層做為下表面,而端子"l / 則作為上表面。此時’如弟一 E圖所不’取放瓜置10除了原本口 附頭12外,還需要裝配與上表面端子182相應的測試端子、吸 pins)102,這些測試端子1〇2再由其他的接點來與測試機台接觸 達測試訊號。據此,當待測電子元件18被吸附時,便有可能因^ 入定位導板14時,因吸取角度的偏差,使得上表面的端子182蛊= 試端子10 2碰撞,造成測試,子10 2受損或使吸附頭12破真空而〔告= 待測電子元件18掉落,如第一 F圖所示。 乂成 因此如何讓雨面皆裝配配件的電子元件18,在取放時合 為上表面的端子碰撞測試端子’並且能夠讓待測電子元件 ^因 地順利滑入定位導板,來避免因取放失敗造成效能低落,,準 電子元件在進行測試上的一大課題。 彳 苟現今 π 1251081 【發明内容】 基於前述之動機,本發明提出一種取放待測電子元件的方法 與裝置,以用來避免先前技術中的待測電子元件在滑入定位導板 時,因歪斜而使得上表面的端子撞擊到測試端子,進而造成端子 或測試端子受損、或待測電子元件掉落的問題。 本發明之一主要目的係為避免取放裝置在吸附過程中,因待 測電子元件上表面上的端子碰撞到測試端子而造成端子受損或造 成待測電子元件掉落,因此本發明在電子元件被吸附時,讓端子 與測試端子保持一段距離,來避免碰撞的問題。 本發明之另一主要目的係為讓待測電子元件能更精準地滑入 誤差範圍越來越小的定位導板,因此本發明利用吸附時的吸力來 造成第一階段的收縮,將電子元件吸附後拉入定位導板,避免待 測電子元件被吸附時,因碰觸到定位導引的反作用力而造成偏差 的情形。 據此,本發明係利用兩種不同彈性係數的彈性裝置來產生兩 階段的壓縮,其中以第一階段的壓縮來將所吸附的待測電子元件 移至定位導板(floating site),用以固定待測電子元件之位置,此時 待測電子元件的端子(pads)與測試端子(pogo pins)並不接觸,因此待 測電子元件的端子與測試端子不會相互碰撞或抵觸,而使得吸附 頭被破真空並造成待測電子元件掉落的問題。此外,在待測電子 元件被移至測試機台上的測試端子時,再以第二段的壓縮來使得 待測電子元件的端子與測試端子接觸來完成測試。當測試完畢 後,釋放第二階段的壓縮,使得待測電子元件的端子與測試端子 分離,再將待測電子元件移至拖盤區破真空來釋放,同時也釋放 第一階段的壓縮。 【實施方式】 本發明一些實施例詳細描述如下。然而,除了詳細描述外, 本發明還可以廣泛地在其他的實施例施行,且本發明的範圍不受 限定,其以之後的專利範圍為準。 再者,為提供更清楚的描述及更易理解本發明,圖示内各部 分並沒有依照其相對尺寸繪圖,某些尺寸與其他相關尺度相比已 12 1251081 經被誇張;不相關之細節部分也未完全繪出,以求圖示的簡潔。 本發明係利用一個或多個吸管來吸附電子元件,各吸管被固 定在一吸附裝置上,並且各吸管的其中一端被用來吸附電子元 件,而另一端通往一氣密空間,並利用吸氣裝置(例如:幫泵) 對氣密空間抽氣以形成真空,來使得各吸管產生吸力以吸附待測 電子元件。由於待測電子元件被吸附後,各吸管形成氣密,使得 氣密空間也形成氣密,進而壓縮氣密空間而形成第一段收縮,來 將待測電子元件拉入定位導板所限制的範圍中。因此待測電子元 件是先被吸附後,才被拉入定位導板所限制的範圍中,如此,避 免了因吸附時受力不均而造成歪斜的情形,同時也讓待測電子元 件更精準地滑入定位導板所限制的範圍内,也意謂著定位導板所 限制的範圍中,用來預留的空間可以更小。另外,待測電子元件 用來被吸附的表面上可能密布許多端子,可用多個吸管來吸附電 子元件表面上未配置端子之處,用來分攤吸附電子元件的吸力, 因此本發明所能夠吸附的電子元件不會因電子元件被吸附表面的 端子位置而有所限制。此外,當完成待測電子元件之測試時,吸 氣裝置即不再吸氣,並需將氣密空間回復為原本大小(即所謂之 破真空),此時可利用吸氣裝置之吹氣來達成,或利用一彈性裝置 (如彈簧或彈性泡棉)來回復。 據此,本發明之一具體實施例係一種待測電子元件之取放裝 置100,如第二A圖所示,其包含有一基座24、一吸附裝置22與一吸 氣裝置26。吸附裝置22位於基座24之一氣密空間242中,分別包含 有一條或複數條的吸管222,此吸管222可為一軟性材質或一具有伸 縮功能之管子。當吸氣裝置26進行吸氣時,會使氣密空間242及吸 管222形成負壓,因而產生吸引力來吸附待測電子元件28之具有端 子之表面。當吸管222完成待測電子元件28的吸附後,會進一步使 得氣密空間242產生更大的負壓,故會使得整個吸附裝置22及待測 電子元件28 —起被吸引至氣密空間242的頂端,完成第一段的收縮。 此外,基座24上配置有定位導板244、複數個測試端子246與一 氣密空間242。氣密空間242之一第一開口用來連接一吸氣裝置26, 另一第二開口用來容納吸附裝置22,吸附裝置22與氣密空間242之 間為氣密接觸,亦即吸附裝置22與氣密空間242之間的間距很小, 氣體不易或不能從中洩露。此外,吸附裝置22之一連接端224可在 氣密空間242内移動,但被限制在一”x”的範圍中移動,亦即吸附裝 13 1251081 ϋ ίί 範圍内活動。吸附裝置22於吸氣裝置26未 ί近吸附端(即定義為第一位置)’當吸氣裝置26 ral二能自吸附裝置22的吸管222進入,並且在各吸管222 }口 Γι子兀件28而被堵住時,會使氣密空間242内形成-個 pqra a i朦始吸附端之間的氣密空間。由於不斷的吸氣,氣密空 Ϊ 3 :芒得吸附裝置22由第-位置被移到吸氣裝置26之 弟一 (Ρ氣密空間242之頂端),如第二Β圖所示。由於第一 m巧被限定為”χ”,故可藉’位移之適 之第裝置22中,更包含—具有第-彈性係數 亏弟合二二气3° ’此弟一彈性裝置30可㈣簧或彈性泡棉來形 完成電子元件28的吸附後,會使得整個吸附裝 IV) ^T1 fa1242^τ« (^^ 成第 的_ °由於第-彈性裝置3G具有吸收 應力之作用,除可作為一緩衝裝置來吸收第一段收 If二 力’以降低待測電子元件28所受之靡六休,、晉 之〔 子元件28被吸附後,保持水平的姿:玉待測電 之端子282與測試端子246之間的距^、, 玉^待測%子兀件28 元件28上的端子282在第一段收唯日士’’卩了避免待測電子 如第二C圖所示。 心日可,直接碰撞到測試端子246, 上述之取放裝置10在待測電子元件2 被拉向第二開口一段,,χ”之位移矩龜^到及官222,亚再 被精確的導入定位導板244所限制 ^,待測電子元件28已 元件28被移到測試機台之一插座位置巳中。然後二當待測電子 由測試機台所提供之一下壓的動作來產 ^顯示)時,可藉 電子元件28與插座接合,同時當此壓二第二段收縮,使待測 時,可進一步再壓縮第一彈性裝置3〇, ^大於該第一彈性係數 接觸以進行測試,如第二D圖所示。同=端子282與測試端子246 具有吸收應力之作用,因此可作為一°缓=’由於第一彈性裝置30 所產生之壓力,使得端子282與卿試端子$置來吸收第二段收縮 接觸,可避免過大的第二段收缩力#署以較緩和的力量完成 端子撕的損壞。 力里,測電子元件28或測試 14 !251〇81 壓之’、當3待測電子元件28完成測試後,測試機台會終止該下 此時n並„提供一上拉之力量,以使待測電子元件28脫離插座。 接著,吸^彈性裝置30亦會同時將端子282與測試端子246分離。 落至托裝置26進行吹氣(即破真空)並讓待測電子元件28掉 使得氣Ϊ二鬥由於破真空後,吸氣裝置26讓氣體流入氣密空間242, 至苐二ϋ㈢242的氣壓等於外部的氣壓’使得吸附裝置22會下降 能保營?tit定吸附裝置22能精確的退回至第一位置,以便 定的吸引Λ ;待測電子元件28間的距離,以確保吸附裝置22即 另1施:广附到待測電子元件28,本發明進-步提出 100的氣密空:所示。林實施例中,係於先前取放裝置 32 ’利用此第-彈㈣f二彈性係、數之第二彈性裝置 置,其中第控制吸附裝置22在氣密通道中的位 30的第_彈性衣第一彈性係數必須小於第一彈性裝置 的吸力壓以性= = 產生的第二:ί 得端子‘與測試端子;一彈性㈣ 氣子%件Μ完後並破真空後’吸氣°而於 此時吸 而將吸 虱衣置26下壓至第一位置。 焯丨生係數之舒展, 此外,上述之第一彈性裝置3〇與 =夕個彈性元件所構成,如以環形套環、、力^ ^32係可由一個 变明對構成彈性裝置之種類與數量並不加广限^彈簧來構成,本 據此,綜合上述之揭露,本發明提屮一链^ 方法的具體實施例,如第四圖所示。印一^取敌待測電子元件 取放待測電子元件之裝置中,藉由_ σ,騍41Q,在一種 吸力來吸附一待測電子元件28,以使插氣所產生之一 土、’、該取放待測電子元件之裝置已詳述^^一二^\242形成一吸引 f述。接下來,如步驟420所述,藉由氣贫刖★貫,例,在此不再 力來產生第一段收縮的力量,以將氣资二=J 242所形成之吸引 測電子元件2 8導入定位導板244所限制^ ^二2封閉並同時將待 子246與待測電子元件的端子282保持不接疋。f中,其中測試端 述,藉由取放裝置100所施與之下壓力旦 j後,如步驟430所 |來〉成第二段的收縮, 15 1251081 以使待測電子元件28上的端子282與測試端子246完成接觸,以進 行測試,其中係更藉由一第一彈性裝置30來作為緩衝,以使待測 電子元件28上的端子282與測試端子246能適當的接觸。最後,如 步驟440所述,待釋放待測電子元件28後,回復氣密空間242的位 置,其中回復氣密空間242,可進一步藉由一第二彈性裝置32來確 保氣密空間242已確實地回復至適當的位置。 以上所述僅為本發明之較佳實施例而已,並非用以限定本發 明之申請專利權利;同時以上的描述,對於熟知本技術領域之專 門人士應可明瞭及實施,因此其他未脫離本發明所揭示之精神下 所完成的等效改變或修飾,均應包含在下述之申請專利範圍中。 【圖式簡單說明】 本發明相對於先前技藝之優點與好處在於參考下列圖示與具 體實施例比較後將更容易顯現,其中: 第一 A圖至第一 F圖為先前技術之裝置示意圖; 第二A圖至第二D圖為本發明之一具體實施例之裝置示意圖 第三圖為本發明之具體實施例之另一裝置示意圖;以及 第四圖為本發明之另一具體實施例之流程示意圖。 【主要元件符號說明】In addition, in order to meet the needs of product diversification, there are many electronic components that are both on the upper surface and the lower surface of the package, and at the same time, the terminals or other special components are assembled: for example, a Couple Coupled Device (CCD), It is typically provided with a layer of photosensitive layer 184 on one surface to receive light and a terminal f on the other surface to contact the outside, as shown in the first D. However, in testing, the required j source needs to be emitted by the test machine. Therefore, the photosensitive layer is required as the lower surface, and the terminal "l / is used as the upper surface. At this time, if the same as the original mouth attachment 12, it is necessary to assemble the test terminal and the suction pin 102 corresponding to the upper surface terminal 182. These test terminals 1〇2 are further Other contacts come into contact with the test machine to reach the test signal. Accordingly, when the electronic component 18 to be tested is adsorbed, it is possible that the terminal 182 蛊 = the test terminal 10 2 of the upper surface collides due to the deviation of the suction angle when the positioning guide 14 is pressed, resulting in the test, the sub-10 2 damage or break the vacuum of the adsorption head 12 [Report = the electronic component 18 to be tested is dropped, as shown in the first F picture. Therefore, how to make the electronic components 18 of the accessories equipped with the rain surface be combined with the terminal impact test terminal of the upper surface during pick-and-place operation, and the electronic component to be tested can be smoothly slid into the positioning guide plate to avoid the take-up The failure of the release causes the performance to be low, and the quasi-electronic components are a major issue in testing. π π 1251081 [Summary of the Invention] Based on the foregoing motivation, the present invention provides a method and apparatus for picking and dropping electronic components to be tested, so as to avoid the prior art electronic components to be tested when sliding into the positioning guide Tilting causes the terminal of the upper surface to strike the test terminal, thereby causing damage to the terminal or test terminal, or falling of the electronic component to be tested. One of the main objects of the present invention is to prevent the terminal from being damaged or causing the electronic component to be tested to fall due to the terminal of the electronic component to be tested colliding with the test terminal during the adsorption process, and thus the present invention is in the electronic When the component is attracted, keep the terminal at a distance from the test terminal to avoid collision problems. Another main object of the present invention is to enable the electronic component to be tested to slide more accurately into the positioning guide with a smaller error range. Therefore, the present invention utilizes the suction force during adsorption to cause the first stage of shrinkage, and the electronic component After the adsorption, the positioning guide is pulled to avoid the deviation caused by the reaction force of the positioning guide when the electronic component to be tested is adsorbed. Accordingly, the present invention utilizes two elastic devices of different elastic coefficients to generate two-stage compression, wherein the first stage of compression is used to move the adsorbed electronic component to be tested to a floating site for Fixing the position of the electronic component to be tested, at this time, the terminals of the electronic component to be tested are not in contact with the test terminal (pogo pins), so the terminal of the electronic component to be tested and the test terminal do not collide or interfere with each other, thereby making adsorption The head is broken and causes the problem of the electronic component to be tested falling. In addition, when the electronic component to be tested is moved to the test terminal on the test machine, the second stage of compression is used to bring the terminal of the electronic component to be tested into contact with the test terminal to complete the test. When the test is completed, the second stage of compression is released, so that the terminal of the electronic component to be tested is separated from the test terminal, and then the electronic component to be tested is moved to the tray area to be evacuated to release, and the first stage of compression is also released. [Embodiment] Some embodiments of the present invention are described in detail below. However, the present invention can be widely practiced in other embodiments, and the scope of the present invention is not limited, and the scope of the invention will be limited. Furthermore, in order to provide a clearer description and a better understanding of the present invention, the various parts of the drawings are not drawn according to their relative dimensions, and some dimensions have been exaggerated compared to other related dimensions; the unrelated details are also Not completely drawn, in order to simplify the illustration. The invention utilizes one or more straws to adsorb electronic components, each straw is fixed on an adsorption device, and one end of each straw is used to adsorb the electronic component, and the other end is connected to an airtight space, and the inhalation is utilized. The device (eg, a pump) draws air into the airtight space to create a vacuum to cause each pipette to generate suction to attract the electronic component to be tested. After the electronic components to be tested are adsorbed, the straws are airtight, so that the airtight space is also airtight, thereby compressing the airtight space to form a first section of contraction, thereby limiting the electronic component to be tested into the positioning guide. In the scope. Therefore, the electronic component to be tested is first absorbed into the range limited by the positioning guide, so that the skew caused by the uneven force during the adsorption is avoided, and the electronic component to be tested is more accurate. The ground slides into the range limited by the positioning guides, which means that the space reserved for the positioning guides can be smaller. In addition, a plurality of terminals may be densely covered on the surface on which the electronic component to be tested is used for adsorption, and a plurality of suction pipes may be used to adsorb the unconfigured terminals on the surface of the electronic component to share the suction force of the adsorption electronic component, so that the present invention can adsorb Electronic components are not limited by the location of the terminals on which the electronic components are attracted. In addition, when the test of the electronic component to be tested is completed, the air suction device no longer inhales, and the airtight space needs to be restored to the original size (so-called vacuum breaking), and the air blowing device can be used to blow the air. Achieve, or use a resilient device (such as spring or elastic foam) to reply. Accordingly, one embodiment of the present invention is a pick-and-place device 100 for an electronic component to be tested, as shown in FIG. 2A, which includes a base 24, an adsorption device 22, and an air suction device 26. The adsorption device 22 is located in an airtight space 242 of the base 24, and includes one or a plurality of straws 222 respectively. The straw 222 can be a soft material or a tube having a stretching function. When the getter device 26 performs the inhalation, the airtight space 242 and the suction pipe 222 form a negative pressure, thereby generating an attractive force to adsorb the terminal surface of the electronic component 28 to be tested. When the suction pipe 222 completes the adsorption of the electronic component 28 to be tested, the airtight space 242 is further caused to generate a larger negative pressure, so that the entire adsorption device 22 and the electronic component 28 to be tested are attracted to the airtight space 242. At the top, complete the contraction of the first segment. In addition, the base 24 is provided with a positioning guide 244, a plurality of test terminals 246 and an airtight space 242. One of the first openings of the airtight space 242 is for connecting to the air suction device 26, and the other second opening is for accommodating the adsorption device 22. The air viscous contact between the adsorption device 22 and the airtight space 242, that is, the adsorption device 22 The space between the airtight space 242 and the airtight space 242 is small, and the gas is not easily or cannot be leaked therefrom. In addition, one of the attachment ends 224 of the adsorption device 22 is movable within the airtight space 242, but is limited to move within a range of "x", i.e., within the range of the adsorption assembly 13 1251081 ϋ ίί. The adsorption device 22 is not near the adsorption end (i.e., defined as the first position) of the suction device 26. When the suction device 26 ral can enter from the suction pipe 222 of the adsorption device 22, and the mouthpiece of each suction pipe 222 is Γ When it is blocked, it will cause an airtight space between the pqra ai and the adsorption end in the airtight space 242. Due to the continuous inhalation, the airtight air vent 3 is moved from the first position to the other side of the air suction device 26 (the top of the airtight space 242) as shown in the second figure. Since the first m is limited to "χ", it can be borrowed from the "displacement of the device 22, and further includes - having the first -elastic coefficient, the two-dimensional gas is 3 °', and the other elastic device 30 can be (four) After the spring or the elastic foam is used to complete the adsorption of the electronic component 28, the entire adsorption device IV) ^T1 fa1242^τ« (^^ becomes the first _ ° because the first elastic device 3G has the effect of absorbing stress, except As a buffer device to absorb the first segment of the If two force 'to reduce the electronic component 28 to be tested by the six six off, Jin [sub-component 28 is adsorbed, maintain a horizontal position: jade to be tested terminal The distance between the 282 and the test terminal 246, the terminal 282 on the component 28 of the component 28 is in the first segment, and the electrons to be tested are avoided as shown in the second C diagram. The heart can be directly hitting the test terminal 246, and the above-mentioned pick-and-place device 10 is pulled to the second opening for the electronic component 2 to be tested, and the displacement moment of the turtle is reached to the official 222. The introduction of the positioning guide 244 is limited, and the electronic component 28 to be tested has been moved to the socket position of the test machine. Then, when the electron to be tested is pressed by one of the tests provided by the test machine, the electronic component 28 can be engaged with the socket, and when the second segment of the pressure is contracted, the test piece can be tested. Further compressing the first elastic device 3〇, ^ is greater than the first elastic coefficient contact for testing, as shown in the second D. The same = terminal 282 and test terminal 246 have the effect of absorbing stress, and thus can be used as a slow = 'Because of the pressure generated by the first elastic means 30, the terminal 282 and the test terminal $ are placed to absorb the second-stage contraction contact, thereby avoiding the excessive second-stage contraction force #to achieve the terminal tearing with a gentle force Damage. In the case of Lili, the electronic component 28 or the test 14 !251〇81 is pressed, and when the electronic component 28 to be tested completes the test, the test machine will terminate the next time and provide a pull-up force. In order to disconnect the electronic component 28 to be tested from the socket. Next, the suction elastic device 30 also separates the terminal 282 from the test terminal 246 at the same time. Falling to the tray device 26 for blowing (ie, breaking the vacuum) and letting the electronic component 28 to be tested off, so that the air suction device 26 allows the gas to flow into the airtight space 242 after the vacuum chamber is broken, and the air pressure of the second (three) 242 is equal to The external air pressure 'allows the adsorption device 22 to fall down. The titration adsorption device 22 can be accurately retracted to the first position for a predetermined attraction Λ; the distance between the electronic components 28 to be tested to ensure that the adsorption device 22 is another 1 application: widely attached to the electronic component 28 to be tested, the present invention further proposes an airtight space of 100: as shown. In the embodiment of the forest, the first pick-and-place device 32' utilizes the first elastic (four) f-two elastic system and the second elastic device, wherein the first control elastic device 22 controls the adsorption device 22 at the position 30 of the airtight passage. The first spring constant must be less than the suction force of the first elastic device. == The second generated: ί terminal 'and the test terminal; one elastic (four). After the gas is broken, the vacuum is broken. At this point, the suction garment 26 is pressed down to the first position. Stretching of the twinning coefficient, in addition, the first elastic device 3〇 and the eleven elastic members are formed, for example, the ring collar, the force ^^32 system can be formed by an obvious pair of elastic devices. In accordance with the above disclosure, a specific embodiment of the method of the present invention is as shown in the fourth figure. In the device for taking the electronic component to be tested for taking the electronic component to be tested, the electronic component 28 to be tested is adsorbed by a suction force by _ σ, 骒 41Q, so that one of the air is generated by the gas insertion, The device for picking up and dropping the electronic component to be tested has been described in detail to form an attraction. Next, as described in step 420, by the gas stagnation, for example, no force is generated here to generate the first contraction force, so that the gas absorbing element 2 = J 242 is formed by the attracting electronic component 28 The introduction of the positioning guide 244 restricts the closing of the terminal 246 and simultaneously prevents the terminal 246 from being disconnected from the terminal 282 of the electronic component to be tested. f, wherein the test end, after the pressure device j is applied by the pick-and-place device 100, as in step 430 | to the second segment of the contraction, 15 1251081 to make the terminal on the electronic component 28 to be tested The 282 is in contact with the test terminal 246 for testing, and is further buffered by a first elastic means 30 to enable proper contact of the terminal 282 on the electronic component 28 to be tested with the test terminal 246. Finally, as described in step 440, after the electronic component 28 to be tested is to be released, the position of the airtight space 242 is restored, wherein the airtight space 242 is restored, and the second elastic device 32 can be further used to ensure that the airtight space 242 is indeed Return to the appropriate location. The above description is only the preferred embodiment of the present invention, and is not intended to limit the patent application rights of the present invention. The above description should be understood and implemented by those skilled in the art, so that the other embodiments are not deviated from the present invention. Equivalent changes or modifications made in the spirit of the disclosure are intended to be included in the scope of the claims below. BRIEF DESCRIPTION OF THE DRAWINGS Advantages and advantages of the present invention over prior art are more readily apparent upon comparison with the specific embodiments with reference to the following drawings, wherein: FIG. 1A through FIG. 1F are schematic diagrams of prior art devices; 2A through 2D are schematic views of a device according to a specific embodiment of the present invention. FIG. 3 is a schematic view of another device according to a specific embodiment of the present invention; and FIG. 4 is another embodiment of the present invention. Schematic diagram of the process. [Main component symbol description]
10,100 取放裝置 102 測試端子 12 吸附頭 14 定位導板 16 彈性裝置 18 電子元件 180 CCD 1251081 184 感光層 22 吸附裝置 222 吸管 224 連接端 24 基座 242 氣密空間 244 定位導板 246 測試端子 26 吸氣裝置 28 電子元件 282 端子 30 第一彈性裝置 32 第二彈性裝置 1710,100 pick and place device 102 test terminal 12 adsorption head 14 positioning guide 16 elastic device 18 electronic component 180 CCD 1251081 184 photosensitive layer 22 adsorption device 222 suction pipe 224 connection end 24 base 242 airtight space 244 positioning guide 246 test terminal 26 suction Gas device 28 electronic component 282 terminal 30 first elastic device 32 second elastic device 17

Claims (1)

1251081 十、申請專利範圍: 1. 一種取放待測電子元件之裝置,包含: 及附裝置係置於一氣密空間中,其包含至少 管的一端用來吸附一待測電子元件,另-端則與 2軋*二間連通,且該待測電子元件被吸附之表面包含複數個端 于, 端子τίί穷ϊίϋΐί氣密空間、一定位導板與複數個測試 ί之兩知開口分別與一吸氣裝置及該吸附裝置相 之一繁」# ,其中該吸附裝置被限制在該氣密空間中 接觸;以及/、一弟二位置間移動,並且與該氣密空間保持氣密 排氣袅置,係用以抽氣來產生一吸力,各該吸管藉由該吸 力來吸附該待測電子元件,在該待測 ,及=與該待測電子元件至該定位導=== 位置亚在^1亥吸力消失後,該氣密空間回復該吸附裝置至該第一 2如申請專利範圍第彳項所述之取放待 ,苴 j之吸氣裝置係以吹氣來產生—推力,用來回復被g的氣^ 3十如!^請專利範圍第1項所述之取放待測電子元件之裝置,复中上 .ϋϊϊ:與該測試端子在該吸附裝置被移至該第二位置時,保 =申壯31,第1項,之取放待測電子元件之裝置,其中該 寸衣置更匕έ 一具有第一彈性係數之一第一彈性裝 彈性裝置與該吸管相結合。 ④㈣衣ί σ亥第一 t+如申請專利範圍第4項所述之取放待測電子元件之裝置,並中 二一彈性裝置係在該吸附裝置被移至該第二位置時,藉由^第 =性裝置之該第-彈性係數來控制該端子與該測試端子之= 巨離’以使該端子與該測試端子不接觸。 6·如申請專利範圍第4項所述之取放待測電子元件之裝置,其中該 18 1251081 第二彈性裝置係於受到大於該第一彈性係數之一壓力時,因該第 一彈性裝置之收縮而使該端子與該測試端子接觸。 7·如申請專利範圍第4項所述之取放待測電子元件之裝置,盆中哕 第一彈性裝置為一彈簧或一彈性泡棉。 ’、" 申請專利範圍第1項所述之取放待測電子元件之裝置,其中該 氣,空間更包含具有一第二彈性係數之一第二彈性裝置,用以控 制該吸附裝置位於該第一位置與該第二位置間之位置。 ^如_申請專利範圍第8項所述之取放待測電子元件之裝置,其中該 $二5性裝置係於該待測電子元件被吸附後,受到該吸力、而g ΐ丄^於該吸力消失後,該第二彈性裝置舒展以回復被壓縮的氣 Φ空間。 10·如申請專利範圍第8項所述之取放待測電子元件之裝置,其中 上述之該第二彈性裝置為一彈簧或一彈性泡棉。 / 1\如2,亏利範圍第4或8項所述之取放待測電子元件之裝置,其 中该第二彈性裝置之該第二彈性係數小於該第一彈性裝置之該第 一彈性係數。 12. —種取放待測電子元件之方法,包含: 形成一吸引力量,係藉由一吸氣裝置抽氣所產生之一吸力來 使一吸附裝置吸附一待測電子元件,進而藉由一氣密空間形成該 ^引力量,且該待測電子元件被吸附之一表面上包含複數個端 六形成第一段收縮,係藉由該吸引力量來使該吸附裝置在該氣 始二間中移動,以形成該第一段收縮,來將該待測電子元件被導 入一固定位置中; —形成第二段收縮,係藉由一下壓力量來使得該待測電子元件 之複數個端子與相應之複數個測試端子形成接觸,以進行測試; 回復該氣密空間。 13·如申凊專利範圍第12項所述之取放待測電子元件之方法,其 19 1251081 中該吸附裝置中更包含一具有第一彈性係數之一第一彈性裝置。 14. 如申請專利範圍第13項所述之取放待測電子元件之方法,其中 形成該第一段收縮後,係藉由該第一彈性裝置來使該待測電子元 件之複數個端子與相應之該複數個測試端子不接觸。 15. 如申請專利範圍第12項所述之取放待測電子元件之方法,其中 該第二段收縮之下壓力量係由一測試機台提供,且該下壓力量大 於該第一彈性裝置之彈性係數。 16. 如申請專利範圍第13項所述之取放待測電子元件之方法,其中 該第一彈性裝置為一彈簧或一彈性泡棉。 17. 如申請專利範圍第12項所述之取放待測電子元件之方法,其中 該氣密空間更包含一具有第二彈性係數之一第二彈性裝置。 18. 如申請專利範圍第17項所述之取放待測電子元件之方法,其中 該第二彈性裝置係於該待測電子元件被吸附後,受到該吸引力量 而壓縮,並於該吸引力量诮失後,藉由該第二彈性裝置之第二彈 性係數來舒展以回復被壓縮的氣密空間。 19. 如申請專利範圍第17項所述之取放待測電子元件之方法,其中 該第二彈性裝置為一彈簧或一彈性泡棉。 20·如申請專利範圍第13或17項所述之取放待測電子元件之方 法,其中該第二彈性裝置之該第二彈性係數小於該第一彈性裝置 之該第一彈性係數。1251081 X. Patent application scope: 1. A device for picking and placing electronic components to be tested, comprising: and an attachment device placed in an airtight space, which comprises at least one end of the tube for adsorbing an electronic component to be tested, and the other end Then, it is connected with 2 rolling*, and the surface on which the electronic component to be tested is adsorbed comprises a plurality of ends, a terminal τίί poor ϊ ϋΐ 气 气 气 气 气 、 、 、 、 、 、 定位 定位 定位 定位 定位 定位 定位 定位 定位 定位 定位 定位 定位 定位 定位 定位 定位a gas device and a phase of the adsorption device, wherein the adsorption device is restricted from contacting in the airtight space; and/or a position between the two brothers, and maintaining a hermetic exhaust device with the airtight space Is used for pumping to generate a suction force, and each of the suction pipes absorbs the electronic component to be tested by the suction force, and the position to be tested, and = and the electronic component to be tested to the positioning guide === position is in the ^ After the 1 mile suction disappears, the airtight space returns to the adsorption device to the first 2, as described in the scope of claim 2, and the suction device is generated by blowing air. Reply to the gas of g ^ 3 ten like! ^ The device for picking and placing the electronic component to be tested, as described in the first item of the patent scope, is in the middle. When the adsorption terminal is moved to the second position, the test terminal is guaranteed to be 31, the first item. And means for picking up the electronic component to be tested, wherein the inch is further disposed with a first elastic elastic device having a first elastic modulus combined with the straw. 4(四)衣ί σ海第一t+ The device for picking and placing electronic components to be tested as described in claim 4, and the second elastic device is moved to the second position by the adsorption device The first modulus of elasticity of the first device controls the terminal and the test terminal to be "large" so that the terminal does not contact the test terminal. 6. The apparatus for picking and placing an electronic component to be tested according to claim 4, wherein the 18 1251081 second elastic device is subjected to a pressure greater than the first elastic coefficient, because the first elastic device Shrinking causes the terminal to contact the test terminal. 7. The device for picking and placing an electronic component to be tested as described in claim 4, wherein the first elastic device in the basin is a spring or an elastic foam. The apparatus for picking and placing an electronic component to be tested according to the first aspect of the invention, wherein the gas, the space further comprises a second elastic device having a second elastic coefficient for controlling the adsorption device to be located The position between the first position and the second position. The device for picking and placing an electronic component to be tested, as described in claim 8, wherein the $25 device is subjected to the suction after the electronic component to be tested is adsorbed, and After the suction disappears, the second elastic means stretches to restore the compressed gas Φ space. 10. The device of claim 8, wherein the second elastic device is a spring or an elastic foam. The apparatus for picking and dropping an electronic component to be tested, wherein the second elastic modulus of the second elastic device is smaller than the first elastic modulus of the first elastic device. . 12. A method for picking up and dropping an electronic component to be tested, comprising: forming an attractive amount, wherein a suction force generated by pumping a suction device causes an adsorption device to adsorb an electronic component to be tested, and thereby The dense space forms the guiding force, and the surface of the electronic component to be tested is adsorbed to include a plurality of ends 6 to form a first segment of the contraction, and the attraction device is used to move the adsorption device in the gas phase Forming the first segment of the contraction to introduce the electronic component to be tested into a fixed position; forming a second segment of contraction by using a lower amount of pressure to cause a plurality of terminals of the electronic component to be tested and corresponding A plurality of test terminals form a contact for testing; the airtight space is restored. 13. The method of claim 12, wherein the adsorption device further comprises a first elastic device having a first modulus of elasticity. 14. The method for picking and placing an electronic component to be tested according to claim 13 , wherein after the first segment is contracted, the plurality of terminals of the electronic component to be tested are caused by the first elastic device Correspondingly, the plurality of test terminals are not in contact. 15. The method of claim 12, wherein the second amount of contraction is provided by a test machine, and the amount of depression is greater than the first elastic device. The coefficient of elasticity. 16. The method of claim 13, wherein the first elastic means is a spring or an elastic foam. 17. The method of claim 12, wherein the airtight space further comprises a second elastic means having a second modulus of elasticity. 18. The method of claim 17, wherein the second elastic device is compressed by the amount of attraction after the electronic component to be tested is adsorbed, and the amount of attraction is After the loss, the second elastic modulus of the second elastic means is stretched to restore the compressed airtight space. 19. The method of claim 17, wherein the second elastic means is a spring or an elastic foam. The method of picking and placing an electronic component to be tested as described in claim 13 or 17, wherein the second elastic modulus of the second elastic means is smaller than the first elastic coefficient of the first elastic means.
TW93124111A 2004-08-11 2004-08-11 Method and apparatus for picking up an electric component under test TWI251081B (en)

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