201144740 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種熱板結構，特別是指一種可應用於電子產品之熱 板毛細結構。 【先前技術】 目前’一般電子產品容易因長時間使用而產生熱量，其解決方式大多 係為加裝熱板進行散熱，該熱板具有高熱傳導率、重量輕、結構簡單等特 0 性’且兼具有可傳遞大量熱量而不消耗電力之優點。 習知之熱板毛細結構主要係包括板體，該板體之内部形成有真空容 腔，並該真空容腔設有毛細組織及填充有工作流體，且於該板體之一侧連 接有一封管（又可稱為封口管、除氣管或填充除氣管），藉由該封管之一端 與該板體連接並與内部之真空容腔相互連通，藉由該封管可由外界對該熱 板之内部（即真空容腔）注入工作流體，並進行除氣及真空作業並藉而將 電子產品使用中產生之熱量疏散。 • 本發明人乃潛心研思、設計組製，期能提供-種可提高降溫效率之熱 板毛細結構，藉以延長產品使用壽命，為本發明所欲研創之發明動機者。 【發明内容】 本發明之主要目的，在提供-種熱板毛細結構，可提高熱板降溫效率。 為達上述目的’本發明之熱板毛細結構係包括：二板體，該二板體係 彼此相互結合形成-容置空間：至少一第一毛細層，係設於該容置空間中； •以及至少-第二毛細層’係設於該容置㈣t，且該第—毛細層與該第二 毛細層相互堆疊。藉此，使其可增加蒸氣擴散效率、促進工作流體均勾分 201144740 、新穎性、進步性和便利性。 、特點和技術内容，請參閱以下 佈，進而提高其降溫效率，確具有實用性 為了能夠更進一步瞭解本發明之特徵 有關本發明之詳細削與關’惟所_式僅提供參考與說_，非用以 限制本發明。 【實施方式】 請參閱第1A至1D圖所示，為本發明之熱板毛細結構第一實施例之立 體立體分解示賴、其二板體組合㈣圖 '其立體組合轉及其剖面示意 圖。該熱板毛細結構係包括二板體100、封管11〇、至少一第一毛細層21〇 及至少-第二毛細層22D’以達到降低熱源溫度、有效對熱量進行傳導以及 提高降溫效率之功效。 該-板體100係相互對應結合，並於該二板體1〇〇之間形成有一容置 空間m，於實際使用時，可於二板體100巾的其中一板體100設有一凹 槽102 ’或是於二板體1〇〇皆設有凹槽1〇2，使該二板體1〇〇結合後可形成 -呈真空狀態且具有工作流體之容置空間1〇1，其中，該二板體⑽之結 合方式可採用銅f或銀f高溫硬焊接合(Blazing)、擴散焊接(Diffusi〇n bounding)、高溫熔接(aiding)等。 該封管110(為一中空管體)係設置於該二板體1〇〇之任一側邊或任一側 角，且該封管11〇之一端係與該容置空間1〇1相連通，以藉由該封管11〇 可由外界對該容置空間1〇1進行注入工作流體，並利用工作流體的兩相變 化於該二板體100内之第一毛細層21〇及第二毛細層22〇之間的循環，使 達到降低熱源溫度及有效對熱量進行傳導疏散之功效。 各該第—毛細層210及各該第二毛細層220係設於該容置空間101中， 201144740 且5亥第二毛細層220與該第一毛細層210相互堆疊，該第一毛細層21〇與 該第二毛細層220相互堆疊後之高度與該容置空間101相等，其中，該第 一毛細層210與該第二毛細層220係為金屬網（或該第二毛細層220由粉末 (如金屬粉末）燒結而形成），該第一毛細層210之厚度為大於該第二毛細 層220之厚度’而該第一毛細層210之網目數則少於該第二毛細層220之 網目數（亦即，該第一毛細層210可稱為粗金屬網，該第二毛細層220則稱 為細金屬網）。201144740 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a hot plate structure, and more particularly to a hot plate capillary structure applicable to electronic products. [Prior Art] At present, 'general electronic products are prone to generate heat due to long-term use, and most of the solutions are to add heat to heat, which has high thermal conductivity, light weight, simple structure and the like. It also has the advantage of being able to transfer a large amount of heat without consuming power. The conventional hot plate capillary structure mainly comprises a plate body, a vacuum cavity is formed inside the plate body, and the vacuum cavity is provided with capillary structure and filled with a working fluid, and a tube is connected to one side of the plate body. (also referred to as a sealing tube, a degassing tube or a filling degassing tube), wherein one end of the sealing tube is connected to the plate body and communicates with the internal vacuum chamber, and the sealing tube can be externally applied to the hot plate The internal (ie, the vacuum chamber) injects the working fluid and performs degassing and vacuuming operations to thereby dissipate the heat generated by the use of the electronic product. • The inventor has devoted himself to research and design, and has been able to provide a thermal plate capillary structure that can improve the cooling efficiency, thereby prolonging the service life of the product, and is the motive for the invention of the invention. SUMMARY OF THE INVENTION The main object of the present invention is to provide a hot plate capillary structure, which can improve the cooling efficiency of the hot plate. In order to achieve the above object, the hot plate capillary structure of the present invention comprises: a two-plate system which is combined with each other to form an accommodating space: at least one first capillary layer is disposed in the accommodating space; At least a second capillary layer is disposed in the receiving portion (four) t, and the first capillary layer and the second capillary layer are stacked on each other. Thereby, it can increase the vapor diffusion efficiency and promote the work fluid to be classified, 201144740, novelty, advancement and convenience. , characteristics and technical content, please refer to the following cloth to improve its cooling efficiency, and it is practical. In order to further understand the characteristics of the present invention, the detailed cutting and closing of the present invention is only provided for reference and _, It is not intended to limit the invention. [Embodiment] Please refer to Figs. 1A to 1D, which are perspective views of a stereoscopic exploded view of a first embodiment of a hot plate capillary structure according to the present invention, and a schematic diagram of a three-dimensional combination thereof and a cross-sectional view thereof. The hot plate capillary structure comprises a second plate body 100, a sealing tube 11〇, at least a first capillary layer 21〇 and at least a second capillary layer 22D′ to reduce the heat source temperature, effectively conduct heat, and improve cooling efficiency. efficacy. The plate body 100 is coupled to each other, and an accommodation space m is formed between the two plates 1 ,. In actual use, one of the plates 100 of the two plate body 100 can be provided with a groove. 102' or the second plate body 1〇〇 is provided with a groove 1〇2, so that the two plates 1〇〇 can be combined to form a vacuum state and have a working space of the working fluid 1〇1, wherein The bonding method of the two plates (10) may be copper f or silver f-blanzing, diffusion welding, high-temperature welding, or the like. The sealing tube 110 (which is a hollow tube body) is disposed on either side or any side angle of the two-plate body 1〇〇, and one end of the sealing tube 11〇 is connected to the accommodating space 1〇1 Connected to the working space 1 〇 1 by the outside of the sealing tube 11 , and the first capillary layer 21 in the second plate 100 is changed by the two phases of the working fluid The circulation between the two capillary layers 22 使 makes it possible to reduce the temperature of the heat source and effectively conduct heat dissipation. Each of the first capillary layer 210 and each of the second capillary layers 220 is disposed in the accommodating space 101, and the second capillary layer 220 and the first capillary layer 210 are stacked on each other. The first capillary layer 21 is stacked on the first capillary layer 210. The height of the second capillary layer 220 and the second capillary layer 220 are equal to the accommodating space 101, wherein the first capillary layer 210 and the second capillary layer 220 are metal meshes (or the second capillary layer 220 is powdered) (as formed by sintering of the metal powder), the thickness of the first capillary layer 210 is greater than the thickness of the second capillary layer 220 and the number of meshes of the first capillary layer 210 is less than the mesh of the second capillary layer 220 The number (that is, the first capillary layer 210 may be referred to as a coarse metal mesh, and the second capillary layer 220 is referred to as a fine metal mesh).
於本實施例中，提供二板體100、一第一毛細層210及一第二毛細層 220，該二板體100的其中一板體1〇〇設有一凹槽1〇2，使該二板體1〇〇相 互對應結合後可形成有一容置空間1〇1，該封管11〇則設置於該二板體1〇〇 之一側角，且該封管110之一端係與該容置空間101相連通，而該第一毛 細層210及該第二毛細層220設於該容置空間101中，該第二毛細層22〇 堆疊於該第-毛細層21G下方，且該第-毛細層21〇及該第二毛細層22〇 之形狀與該板體⑽之凹槽1Q2相對應，該第—毛細層21Q與該第二毛細 層220相互堆疊後之高度與該容置空間1〇1才目等，使其可完整填充於該容 門101增加其支撑·性，並藉由該封管11〇可由外界對該二板體1〇〇内 進行注入工作流體(如水），進而利用工作流體的兩相變化及該二板體⑽ 之毛細結構的循環，使其降低熱源溫度及有效賴量進行傳導，同時，當 該工作流體餅_變化(如水'水紐)時，統紅X作频(如水蒸氣) °藉由該帛毛細層210而均勻擴散至上方之板體·，增加其蒸氣擴散效 率而液〜、狀之工作流體(如水)可藉由該第二毛細層⑽而均句分佈至下 方之板體100，藉以你推你.ώ 足進作〜體均勻分佈，進而提高其降溫效率。 201144740 第二實施例 請參閱2A至2D圖所示，係為本發明之熱板毛細結構第二實施例之立 體分解示意圖、其堆叠示意圓、其立體組合示意及其剖面示意圖。其令， 本實施例與第-實施例相同，其主要差別係在於該第二毛細層22〇之形狀 與該板體⑽之凹槽102相對應，且該第一毛細層⑽與該第二毛細層22〇 相互堆疊後之高度與該容置空間m相等，而該第一毛細層別之形狀則 為任意形狀(如T形）’而該第—毛細層21G之周緣形成有—缺嗜，使該 第二毛細層22G堆疊於該第—毛細層21{)下方時，蒸缝之工作流體(如水 蒸氣)快速通過該缺口 211，進而增加其降溫效率。 第三實施例 凊參閱3圖所示’係為本發明之熱板毛細結構第三實施例之立體分解 示意圖。其_，本實施例與第-實補相同，其主要差繼在於於該第一 毛細層210之上、下方分別堆疊有一第二毛細層220，且該第二毛細層22〇 之形狀與該板體100之凹槽1Q2相對應，該第—毛細層21()之形狀則為任 意形狀(如Τ形）’而該第一毛細層210之周緣形成有-缺口 211。 第四實施例 請參閱4圖所示，係為本發明之熱板毛細結構第四實施例之立體分解 不意圖。其中’本實_與第—實侧侧，其主要差別係在於該第一毛 細層210之形狀係與該第二毛細層22〇之形狀相對應，亦即，該第一毛細 層210及第二毛細層22〇之形狀皆為相對應之任意形狀(如了形），而該第 一毛細層210之周緣形成有一缺口 211 ’且該第二毛細層220之周緣亦形成 有一缺口 221。 201144740 本發明之熱板毛細結構的特點在於：將二板體100相互對應結合而形 成有一容置空間101，並於該容置空間101中設有至少一第一毛細層210及 至少一第二毛細層220，且該第一毛細層210與該第二毛細層220相互堆 疊’當該容置空間101中的工作流體進行兩相變化時，蒸氣態之工作流體 可快速通過該第一毛細層210上，使其增加蒸氣擴散效率，而液態狀之工 作流體可均勻擴散流動於該第二毛細層220上，以促進工作流體均勻分佈， 進而提商其降溫效率。 以上所述僅為本發明之較佳可行實施例，非因此即侷限本發明之專利 範圍’舉凡運用本發明綱書及赋内容所為之等輯構變化，均理同勺 含於本發明之範圍内，合予陳明。 201144740 【圓式簡單說明】 第1A圖係為本發明之熱板毛細結構第一實施例之立體分解示意圖。 第1B圖係為本發明之熱板毛細結構第一實施例之二板體組合示意圖。 第1C圖係為本發明之熱板毛細結構第—實施例之立體組合示意圖。 第1D圖係為第1C圖之A-A’線剖面示意圖。 第2A圖係縣侧之触毛細職第二實施歡讀分解示意圖。 第2B關為本發明之熱板毛細結構第二實施例之第—毛細層與第二毛細層 堆疊示意圖。 第2C圖係絲發明之熱板毛細結構[實施例之立體組合綠圖。 第2D _為第2dB_B’_面示意@。第3圖係為本發明之熱板毛細 結構第三實施例之立體分解示意圖。 第4圖係為本發明之熱板毛細結構第四實蘭之立體分解示意圖。 【主要元件符號說明】 100 板體 101 容置空間 102 凹槽 110 封管 第一毛細層 211 缺口 220 第二毛細層 缺口 8 221In the embodiment, a second plate body 100, a first capillary layer 210 and a second capillary layer 220 are provided. One of the plates 1 of the two plates 100 is provided with a groove 1〇2, so that the two The slabs 1 〇〇 〇〇 〇〇 〇〇 〇〇 可 可 可 可 容 容 容 容 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板 板The first capillary layer 210 and the second capillary layer 220 are disposed in the accommodating space 101, and the second capillary layer 22 is stacked under the first capillary layer 21G, and the first The shape of the capillary layer 21〇 and the second capillary layer 22〇 corresponds to the groove 1Q2 of the plate body (10), and the height of the first capillary layer 21Q and the second capillary layer 220 are stacked on each other and the accommodating space 1 〇1, etc., so that it can be completely filled in the door 101 to increase its supportability, and the sealing body 11 can be used to inject a working fluid (such as water) into the two plates 1 The two-phase change of the working fluid and the circulation of the capillary structure of the two plates (10) are used to reduce the heat source temperature and the effective amount of conduction, and the same When the working fluid cake_change (such as water 'water'), the red color X is used as a frequency (such as water vapor) to uniformly diffuse to the upper plate body by the fine layer 210 of the bristles, thereby increasing the vapor diffusion efficiency of the liquid. ~, the working fluid (such as water) can be evenly distributed to the lower plate 100 by the second capillary layer (10), so that you push the ώ foot into the body evenly distributed, thereby improving its cooling efficiency. 201144740 Second Embodiment Referring to Figures 2A to 2D, there is shown a schematic exploded view of a second embodiment of a hot plate capillary structure of the present invention, a schematic outline of the stack, a schematic combination thereof, and a schematic cross-sectional view thereof. The first embodiment is the same as the first embodiment, the main difference is that the shape of the second capillary layer 22 is corresponding to the groove 102 of the plate body (10), and the first capillary layer (10) and the second portion The height of the capillary layer 22 〇 stacked on each other is equal to the accommodating space m, and the shape of the first capillary layer is an arbitrary shape (such as a T shape) and the periphery of the first capillary layer 21G is formed with a defect When the second capillary layer 22G is stacked under the first capillary layer 21{), the working fluid (such as water vapor) of the steaming slit rapidly passes through the notch 211, thereby increasing the cooling efficiency. THIRD EMBODIMENT Referring to Figure 3, there is shown a perspective exploded view of a third embodiment of the thermal plate capillary structure of the present invention. The present embodiment is the same as the first-complement, and the main difference is that a second capillary layer 220 is stacked on the lower side of the first capillary layer 210, and the shape of the second capillary layer 22 is The groove 1Q2 of the plate body 100 corresponds to a shape (the shape of the first capillary layer 21) is an arbitrary shape (such as a Τ shape), and the periphery of the first capillary layer 210 is formed with a notch 211. FOURTH EMBODIMENT Referring to Fig. 4, it is a perspective exploded view of a fourth embodiment of the thermal plate capillary structure of the present invention. Wherein the 'the actual _ and the first side of the solid side, the main difference is that the shape of the first capillary layer 210 corresponds to the shape of the second capillary layer 22, that is, the first capillary layer 210 and the first The shape of the second capillary layer 22 is a corresponding shape (such as a shape), and the periphery of the first capillary layer 210 is formed with a notch 211 ' and a periphery of the second capillary layer 220 is also formed with a notch 221. 201144740 The hot plate capillary structure of the present invention is characterized in that the two plate bodies 100 are combined with each other to form an accommodating space 101, and at least one first capillary layer 210 and at least one second are disposed in the accommodating space 101. The capillary layer 220, and the first capillary layer 210 and the second capillary layer 220 are stacked on each other. When the working fluid in the accommodating space 101 undergoes two-phase change, the working fluid in the vapor state can quickly pass through the first capillary layer. 210, to increase the vapor diffusion efficiency, and the liquid working fluid can be uniformly diffused and flowed on the second capillary layer 220 to promote uniform distribution of the working fluid, thereby improving the cooling efficiency. The above is only a preferred embodiment of the present invention, and thus is not intended to limit the scope of the present invention. The use of the present invention and the content of the composition are all included in the scope of the present invention. Within, combined with Chen Ming. 201144740 [Circular Simple Description] Fig. 1A is a perspective exploded view of the first embodiment of the hot plate capillary structure of the present invention. Fig. 1B is a schematic view showing the combination of the two plates of the first embodiment of the hot plate capillary structure of the present invention. Fig. 1C is a perspective view showing the three-dimensional combination of the first embodiment of the hot plate capillary structure of the present invention. Fig. 1D is a schematic cross-sectional view taken along line A-A' of Fig. 1C. Figure 2A is a schematic diagram of the second implementation of the funeral demolition of the county side. 2B is a schematic view showing the stacking of the capillary layer and the second capillary layer in the second embodiment of the hot plate capillary structure of the present invention. 2C is a three-dimensional combined green figure of the invention. The 2nd _ is the 2nd dB_B'_ surface indicating @. Fig. 3 is a perspective exploded view showing the third embodiment of the thermal plate capillary structure of the present invention. Fig. 4 is a perspective exploded view showing the fourth solid state of the thermal plate capillary structure of the present invention. [Main component symbol description] 100 plate 101 accommodating space 102 groove 110 sealing tube first capillary layer 211 notch 220 second capillary layer notch 8 221