TW201144402A - Method for binding substrate - Google Patents

Method for binding substrate Download PDF

Info

Publication number
TW201144402A
TW201144402A TW100106185A TW100106185A TW201144402A TW 201144402 A TW201144402 A TW 201144402A TW 100106185 A TW100106185 A TW 100106185A TW 100106185 A TW100106185 A TW 100106185A TW 201144402 A TW201144402 A TW 201144402A
Authority
TW
Taiwan
Prior art keywords
film
heat
workpiece
adhesive
ultrasonic
Prior art date
Application number
TW100106185A
Other languages
English (en)
Chinese (zh)
Inventor
Marc Husemann
Frank Hannemann
Hans-Karl Engeldinger
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of TW201144402A publication Critical patent/TW201144402A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2415/00—Presence of rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW100106185A 2010-03-02 2011-02-24 Method for binding substrate TW201144402A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201010002501 DE102010002501A1 (de) 2010-03-02 2010-03-02 Verfahren zur Verklebung von Substraten

Publications (1)

Publication Number Publication Date
TW201144402A true TW201144402A (en) 2011-12-16

Family

ID=43969457

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100106185A TW201144402A (en) 2010-03-02 2011-02-24 Method for binding substrate

Country Status (3)

Country Link
DE (1) DE102010002501A1 (de)
TW (1) TW201144402A (de)
WO (1) WO2011107351A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012222056A1 (de) * 2012-12-03 2014-06-05 Tesa Se Lamination starrer Substrate mit dünnen Klebebändern
EP2975096B1 (de) 2014-07-17 2021-11-17 3M Innovative Properties Company Druckempfindliche klebeanordnung zur bindung an ungleichmässige substrate
DE102015217860A1 (de) * 2015-05-05 2016-11-10 Tesa Se Klebeband mit Klebemasse mit kontinuierlicher Polymerphase
DE102015217833A1 (de) * 2015-09-17 2017-03-23 Tesa Se Flexibles Haftklebeband zur strukturellen Verklebung
DE102016212622B4 (de) 2016-07-12 2022-02-10 Volkswagen Aktiengesellschaft Verfahren zum Fügen von Bauteilen
DE102019208668A1 (de) * 2019-06-14 2020-12-17 Tesa Se Verklebungsverfahren mittels einer härtenden strukturellen Klebmasse

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3834728A1 (de) * 1988-10-12 1990-04-19 Herbert Ferklass Packstuecke, welche durch klebestreifen verschlossen werden, sowie verfahren zum verschliessen derselben durch ultraschall
DE102005037663A1 (de) 2005-08-05 2007-02-08 Tesa Ag Verwendung eines Klebebandes mit einem Träger aus einem Spinnvlies, der einseitig mit einem druckempfindlichen Kleber zumindest partiell beschichtet ist
DE102005037662A1 (de) 2005-08-05 2007-02-08 Tesa Ag Klebeband mit einem Träger aus einem Spinnvlies, der einseitig mit einem druckempfindlichen Kleber zumindest partiell beschichtet ist
DE102007021967A1 (de) * 2007-05-10 2008-11-13 Gerhard Schubert Gmbh Verfahren und Vorrichtung zum Siegeln und Entnehmen
DE102007038458A1 (de) 2007-08-14 2009-02-19 Tesa Ag Verbundelement

Also Published As

Publication number Publication date
DE102010002501A1 (de) 2011-09-08
WO2011107351A1 (de) 2011-09-09

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