201134591 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種使用雷射光束切割印刷電路板的 雷射切斷方法及雷射切斷裝置。 【先前技術】 雷射光束因定向性、聚光性優越，易於用透鏡向微小 定點聚光，可得高能量密度。又可用鏡片等使雷射光束之 聚光位置移動至工件上之任意位置，得以加工細微且複雜 之形狀。因此雷射加工機在切斷加工之領域中被廣泛利用。 印刷電路板係由導體層與絕緣層之積層構造所構 成。一般而言，導體層係由銅等金屬所成，絕緣層為有機 化合物之樹脂所成。因此要以雷射光束切斷印刷電路板 時，如雷射光束之功率大時，會從印刷電路板所含成分中 產生碳化物等之加工渣，且附著於工件切斷面。加工渣將 顯著降低印刷電路板之絕緣可靠性。又，經剝離的加工渣 有時會成為灰塵堆積在印刷電路上。如是，加工渣將造成 印刷電路板之動作不良的原因。又，工件為金屬、矽、木 材等所構成時，也與印刷電路板同樣，加工漬也會附著於 切斷面。 作為以抑制加工渣附著在工件切斷面為目的之習知 雷射切斷方法，有一種沿工件上之同一軌道使雷射光束多 次掃描者（例如參照專利文獻1)。 作為以抑制加工渣附著在工件切斷面為目的之習知 雷射切斷方法，又有一種在切斷完後，對於切斷面照射气 4 322001 201134591 率較弱之雷射光束者(例如參照專利文獻2)。 [專利文獻] • (專利文獻1)日本特開2005-303322號公報 (專利文獻2)日本特開平5-343832號公報 【發明内容】 (發明欲解決之課題） 但是在專利文獻1之雷射切斷方法之情形，因要在工 件同一切斷面反覆照射雷射光束，而有對同一切斷面反覆 進行加熱與冷卻作業以致發生加工渣堆積之問題。 又，在專利文獻2之雷射切斷方法之情形，當切斷完 成時，附著於工件切斷面之加工逢，因在照射功率較弱之 雷射光束時己被冷卻，故而會起因於工件材料之變質等， 造成難以吸收雷射光束。因此，所發生之加工渣要以功率 較弱之雷射光束去除實有困難。 (解決課題之手段） 本發明之雷射切斷方法，其特徵在於：一邊使預定功 率之雷射光束對工件之掃描位置在每次掃描時逐次移動預 定移動量，一邊對上述工件多次掃描上述預定功率之雷射 光束，藉此切斷上述工件。 又，本發明之雷射切斷裝置，其特徵在於，具備：雷 射振盪器，射出雷射光束；聚光透鏡，將上述雷射振盪器 射出之雷射光束聚光在工件上；及控制裝置，控制雷射光 束之功率及雷射光束對上述工件之掃描位置，且一邊使預 定功率之雷射光束對上述工件之掃描位置在每次掃描時逐„ i 5 322001 201134591 次移動預定移動量，一邊對上述工件多次掃描上述預定功 率之雷射光束，藉此切斷上述工件。 * (發明效果） 依據本發明，可抑制加工渣附著在切斷工件所形成之 切斷面。 【實施方式】 (實施方式1) 參照第1圖至第5圖說明實施方式1。 第1圖為實施方式1之雷射切斷裝置之構成圖。實施 方式1之雷射切斷裝置係具備：雷射振盪器1，可射出雷 射光束2 ;多數個傳輸鏡片3、4、5，將雷射振盪器1射出 之雷射光束2傳輸至工件7;聚光透鏡6，將所傳輸之雷射 光束2聚光在工件7上；XY工作台8,裝載工件7可向X 轴與Y軸方向移動；及控制裝置9,依據數據10控制雷射 振盪器1與XY工作台8。數據10為加工程式、後述之光 束直徑D及掃描之總次數η等的資訊，且在輸入至雷射切 斷裝置後，儲存於未圖示之記憶體。再者，雷射光束2可 為無停機時間之CW振盪，或可為在每預定時間有停機時 間之脈波振盪。 第2圖為實施方式1之ΧΥ工作台之規格之說明圖。 ΧΥ工作台8有較藉由切斷工件7所形成之加工形狀7a為 大之開口部8a。由此，工件7被切斷時，可防止因雷射光 束2通過工件7照射到XY工作台8而損傷XY工作台8。 也可防止因通過工件7之雷射光束2在XY工作台8反射 Γ ^ S- *_> 6 322001 201134591 而照射工件7之背面。 ' 其次說明實施方式1之雷射切斷方法。另外，在隨後 * 之說明中，設定於雷射光束2之聚光位置之光束直徑為 D(mm)，且雷射光束2之功率為PJW)時，藉由雷射光束2 掃描1次即可切斷工件7。 於本實施方式，係藉由使雷射光束2掃描多次來切斷 工件7。又，在每次掃描時使雷射光束2之掃描位置移動。 此時，如下式（1)所示，將每次掃描之掃描位置之移動量 S〇nm)設定在大於0而D/n以下之值。另外，η為掃描之 總次數(η^2)。 0<(每次掃描之掃描位置之移動量S)SD/n …式（1) 在此，移動量S係在以前次掃描路徑上之任意點為A 點，且以A點之與前次掃描路徑之切線正交之直線和此次 之掃描路徑之交點為B點時，等於A點與B點之距離。 再者，如以下式（2)所示，將每次掃描之雷射光束2 之功率P2(W)設定在Pi/n以上而未滿P〗之值。201134591 VI. Description of the Invention: [Technical Field] The present invention relates to a laser cutting method and a laser cutting device for cutting a printed circuit board using a laser beam. [Prior Art] Since the laser beam is excellent in directionality and condensing property, it is easy to condense light at a small fixed point with a lens, and a high energy density can be obtained. Further, the condensing position of the laser beam can be moved to an arbitrary position on the workpiece by a lens or the like to process a fine and complicated shape. Therefore, laser processing machines are widely used in the field of cutting processing. The printed circuit board is composed of a laminated structure of a conductor layer and an insulating layer. In general, the conductor layer is made of a metal such as copper, and the insulating layer is made of a resin of an organic compound. Therefore, when the printed circuit board is cut by the laser beam, if the power of the laser beam is large, processing slag such as carbide is generated from the components contained in the printed circuit board, and adheres to the cut surface of the workpiece. Processing slag will significantly reduce the insulation reliability of printed circuit boards. Further, the peeled process slag sometimes causes dust to accumulate on the printed circuit. If so, the processing slag will cause the malfunction of the printed circuit board. Further, when the workpiece is made of metal, tantalum, wood or the like, the processed stain adheres to the cut surface as well as the printed circuit board. As a conventional laser cutting method for suppressing the adhesion of the machining slag to the workpiece cut surface, there is a case where the laser beam is scanned a plurality of times along the same track on the workpiece (see, for example, Patent Document 1). As a conventional laser cutting method for suppressing adhesion of processing slag to a workpiece cut surface, there is another type of laser beam which is weak to the cut surface after the cutting (for example, the cut surface is irradiated with gas) (for example, Refer to Patent Document 2). [Patent Document 1] JP-A-2005-303322 (Patent Document 2) Japanese Laid-Open Patent Publication No. Hei No. Hei 5-343832 (Invention) The laser of Patent Document 1 In the case of the cutting method, the laser beam is repeatedly irradiated on the same cut surface of the workpiece, and there is a problem in that the same cut surface is repeatedly heated and cooled so that the processing slag is accumulated. Further, in the case of the laser cutting method of Patent Document 2, when the cutting is completed, the processing which is attached to the cut surface of the workpiece is cooled by the laser beam having a weak irradiation power, which is caused by Deterioration of the workpiece material, etc., makes it difficult to absorb the laser beam. Therefore, it is difficult to remove the processed slag from the weaker laser beam. (Means for Solving the Problem) The laser cutting method according to the present invention is characterized in that the workpiece is scanned a plurality of times while moving a scanning beam of a predetermined power to a scanning position of the workpiece one by one by a predetermined movement amount per scan. The laser beam of the predetermined power is thereby cut off the workpiece. Further, a laser cutting device according to the present invention includes: a laser oscillator that emits a laser beam; and a collecting lens that condenses a laser beam emitted from the laser oscillator on a workpiece; and controls a device for controlling the power of the laser beam and the scanning position of the laser beam to the workpiece, and moving the scanning position of the laser beam of the predetermined power to the workpiece at each scanning time by a predetermined amount of movement The workpiece is cut by scanning the laser beam of the predetermined power a plurality of times to cut the workpiece. * (Effect of the Invention) According to the present invention, it is possible to prevent the processing slag from adhering to the cut surface formed by cutting the workpiece. (Embodiment 1) Embodiment 1 is described with reference to Figs. 1 to 5 . Fig. 1 is a configuration diagram of a laser cutting device according to Embodiment 1. The laser cutting device according to Embodiment 1 includes: The oscillator 1 can emit the laser beam 2; the plurality of transmission lenses 3, 4, 5 transmit the laser beam 2 emitted from the laser oscillator 1 to the workpiece 7; the collecting lens 6 transmits the transmitted laser beam Beam 2 concentrating On the workpiece 7, the XY table 8, the loading workpiece 7 is movable in the X-axis and Y-axis directions, and the control device 9 controls the laser oscillator 1 and the XY table 8 in accordance with the data 10. The data 10 is a processing program, which will be described later. The information such as the beam diameter D and the total number of times of scanning η is stored in a memory (not shown) after being input to the laser cutting device. Further, the laser beam 2 can be a CW oscillation without down time, or The pulse wave may be oscillated at a predetermined time. Fig. 2 is an explanatory view showing the specification of the boring table of the first embodiment. The boring table 8 has a machining shape 7a formed by cutting the workpiece 7. Therefore, when the workpiece 7 is cut, it is possible to prevent the XY table 8 from being damaged by the laser beam 2 being irradiated onto the XY table 8 through the workpiece 7. It is also possible to prevent the laser beam from passing through the workpiece 7. 2, the XY table 8 reflects Γ ^ S- *_> 6 322001 201134591 and illuminates the back surface of the workpiece 7. ' Next, the laser cutting method of the first embodiment will be described. In addition, in the description of the following *, the laser is set. The beam diameter of the condensing position of the beam 2 is D (mm), and the power of the laser beam 2 In the case of PJW), the workpiece 7 can be cut by scanning the laser beam 2 once. In the present embodiment, the workpiece 7 is cut by scanning the laser beam 2 a plurality of times. The scanning position of the laser beam 2 is shifted. At this time, as shown in the following formula (1), the movement amount S〇nm of the scanning position for each scanning is set to a value larger than 0 and D/n or less. The total number of scans (η^2). 0<(the amount of movement S of the scan position per scan) SD/n (1) Here, the movement amount S is at any point on the previous scan path. The point A is equal to the distance between point A and point B when the intersection of the line orthogonal to the tangent to the previous scanning path of point A and the current scanning path is point B. Further, as shown in the following formula (2), the power P2 (W) of the laser beam 2 for each scan is set to be equal to or greater than Pi/n.
PiX每次掃描之雷射光束2之功率PJ^Pi/n…式（2) 再者，根據式（1)及式（2)決定S與P2，係由雷射切斷 裝置之操作人員或由控制裝置9進行。 茲參照第3圖與第4圖說明實施方式1之具體例。第 3圖為實施方式1之具體例中的工件之規格與加工形狀之 例之說明圖。第3圖（a)為工件7之上視圖，第3圖（b)為工 件7之剖面圖。工件7為60mmx60mm之正方形所成，且 具有1 mm厚。又，切斷工件7形成之加工形狀7a為30mmThe power of the laser beam 2 scanned by PiX each time PJ^Pi/n... (2) Furthermore, S and P2 are determined according to equations (1) and (2), which are operated by the operator of the laser cutting device or This is carried out by the control device 9. A specific example of the first embodiment will be described with reference to Figs. 3 and 4 . Fig. 3 is an explanatory view showing an example of the specifications and the processed shape of the workpiece in the specific example of the first embodiment. Fig. 3(a) is a top view of the workpiece 7, and Fig. 3(b) is a sectional view of the workpiece 7. The workpiece 7 is made of a square of 60 mm x 60 mm and has a thickness of 1 mm. Moreover, the processed shape 7a formed by cutting the workpiece 7 is 30 mm.
[S 7 322001 201134591 x30mm之正方形狀所構成。工件7為由玻璃纖維布13浸 潰於環氧樹脂14之絕緣層與導體層之積層構造所構成的 印刷電路板。 下表1為使用以往之雷射切斷方法掃描1次時之實驗 結果。於表1之實驗，設定D=0.2 mm，且P2=80、100、120(W) 之3種，在第3圖所示工件7只掃描1次雷射光束2。再 者，在此實驗所用雷射切斷方法係相當於以往之雷射切斷 方法。表1為在各實驗之結果，顯示是否能切斷工件7、 及是否加工渣以可目視之程度附著在切斷面。在此能切斷 工件7係指雷射光束2有貫通工件7，不包含雷射光束2 僅到工件7之表面與背面之間的中間點之情形。 [表1] ^\p2(W) S(mm 80 100 120 無法切斷， 可切斷， 可切斷， — 無附著加 有附著加 有附著加 工渣 工渣 工渣 如表1所示，設定P2=80(w)時，切斷面雖無附著加 工渣，但是無法切斷工件7。另一方面，P2=100、120(W) 時，雖可切斷工件7，但是在切斷面附著有加工潰。因此， 使用以往之雷射切斷方法時，無關於雷射光束之功率P2 之值，無法獲得能切斷工件7，且在切斷面不附著加工渣 之良好結果。以下依據此實驗結果設定P^IOCK W)。 r 8 322001 201134591 以下之表2為使用實施方式1之雷射切斷方法掃描2 次時之實驗結果。於表2之實驗，係採用實施方式1之雷 射切斷方法，對第3圖所示之工件7掃描2次雷射光束2。 又，設定 D= 0.2(mm)及 P2 = 40、50、60(W)之 3 種，進而 在各自的P2之值中設定S=0.08、0.10、0.12(mm)之3種。 表2如同表1，為各實驗之結果，其顯示是否能切斷工件7、 及是否加工渣以可目視的程度附著在切斷面。 [表2] ^\P2(W) S(mm) 40 50 60 可切斷， 可切斷， 可切斷， 0.08 無附著加 無附著加 無附著加 工渣 工渣 工渣 無法切斷， 可切斷， 可切斷， 0.10 無附著加 無附著加 無附著加 工渣 工渣 工潰 無法切斷， 無法切斷， 可切斷， 0.12 無附著加 無附著加 無附著加 工渣 工渣 工渣 於表2之實驗，n=2(次）、？！=；!00(▽)，因此D/n = 0.1(mm)、P1/n=50(W)。所以在滿足式（1)之 S = 0.08、 O.lO(mm)，且滿足式（2)之P2 = 50、60(W)時，可獲得良好結 果。 Γ 9 322001 201134591 以下之表3為使用實施方式1之雷射切斷方法掃描4 次時之實驗結果。於表3之實驗，係採用實施方式1之雷 射切斷方法，對第3圖所示之工件7掃描4次雷射光束2。 又，設定 0.2(mm)及 P2 = 20、25、30(W)之 3 種，進而 在各自的P2之值中設定S=0.04、0.05、0.06(mm)之3種。 表3如同表1，為各實驗之結果，其顯示是否能切斷工件7、 及是否加工渣以可目視的程度附著在切斷面。 [表3] "\p2(W) S(mm 20 25 30 可切斷， 可切斷， 可切斷， 0.04 無附著加 無附著加 無附著加 工渣 工渣 工渣 無法切斷， 可切斷， 可切斷， 0.05 無附著加 無附著加 無附著加 工渣 工渣 工渣 無法切斷， 無法切斷， 可切斷， 0.06 無附著加 無附著加 無附著加 工渣 工渣 工渣 於表3之實驗，n = 4(次）、P〗=100(W)，因此D/n 所以滿足式（1)之 S = 0.04、 0.05(mm)，且滿足式（2)之P2 = 25、=30(W)時，可獲得良好 結果。 f 10 322001 201134591 第4圖為藉由雷射光束掃描4次，並採用實施方式ι 之雷射切斷方法將第3圖所示工件切斷之樣態圖。此時< n=4(次）、D=0.2(mm)、pi= i〇〇(w)。所以依據式⑴盘 式⑺，需滿足⑽此、仏25。於是，第4圖之例設定^ = 0.05(inm)、P2 = 25(w)。 第4圖⑷為顯示第卜欠掃描時，第4圖⑻為 次掃描時’第，。)為顯示第3次掃描時，第第2 示第4次掃描時之情形。又於第4圖啦第 = 圖，上圖為自上面看工件7之圖，以2點鏈線顯：:各 狀，且以粗線前碩顯示雷射光束2之掃描位置20 ) 方面，於第4圖⑻至第4圖⑷之各圖，下圖為工件 =2,且顯示平面方向之掃描位置21與由掃描形成之= 於第4圖⑷之情形，掃猫位置20係以s之1 5位 0·075 ππη位於加工形狀&之外側。於第4 _ ·= 描位置2〇係以S之〇 s也 θ也’轉 0.5倍之0.025 mm位於加工形妝7 外侧。於第4圖(c)之情形掃描位置2〇係以$之广 0.025 oun位於加工形狀上之内側。^第4圖⑷之·= 描位置2〇係以S、之1.5倍之0.075醒位於加工形狀^卞 内側？此，於第4圖之例，係使雷射光束2之掃插：= 2〇’在每-人掃描時於加工形狀7a之周邊逐次向内側方向移 動0.05腿，藉此切斷工件7而形成加工形狀7a。 第5圖為使用以往之雷射切斷方法時之切斷面，和使 用實施方式1之雷射切斷方法時之切斷面之照片。第5 11 322〇 201134591 (a)為使用以往之雷射切斷方法，而n= 1(次），D= 0.2(麵）， "P2=100(W)時之工件7之切斷面22之照片。於第5圖（a) • 係對切斷面22照射之雷射光束2之功率大至100W，所以 碳化物所成之加工渣大量附著於切斷面22。 另一方面，第5圖（b)係使用實施方式1之雷射切斷方 法，而 n = 4(次），D = 0.2(mm)，S = 0.05(mm) ’ P2 = 25(W)時 之工件7之切斷面22之照片。於第5圖（b)，為對每次掃 描所形成之切斷面22照射之雷射光束2之功率小至25W 之故，在每次掃描時之切斷面22幾乎不附著加工渣。再 者，在每次掃描時雷射光束2之掃描位置因會逐次移動0.2 mm，故在同一切斷面22會照射多次25W之雷射光束2， 因此可抑制發生加工渣之附著。如是，在最後形成之切斷 面22，僅照射最終次之第4次掃描之25W的雷射光束功 率。因此最後所形成之切斷面22幾乎不附著加工渣。 再者，於式（1)，S = D/6n以上為佳。即能滿足以下 之式(3)與式（2)時，可有效抑制加工渣之附著。 D/6nS(每次掃描之掃描位置之移動量S)SD/n…式（3) 又，於如上具體例之說明，係將雷射光束之掃描位 置，在每次掃描時在加工形狀7a之周邊逐次向内侧平行移 動0.05 mm用以切斷工件7而形成加工形狀7a，但是並不限 於此。即，例如，使雷射光束之掃描位置，每次掃描時在 加工形狀7a之周邊逐次向外側方向平行移動0.05 mm用以 切斷工件7，來形成加工形狀7a亦可。 再者，在如上之說明，工件7雖為印刷電路板所構成， L S] 12 322001 201134591 但是只要是用雷射光束照射會發生加工渣者，不管由何種 材料所構成均可。即，工件可為金屬、梦、木材等所構成。 ' 依據實施方式1，在切斷工件之期間可抑制產生加工 渣。因此可抑制在切斷工件所形成之切斷面附著加工渣。 再者，在實施方式1，說明每次掃描之掃描位置之移 動量S，與每次掃描之雷射光束2之功率P2，在每次掃描 為一定之情形者，但是並不限於此。即，只要能滿足式（1) 與式（2)，每次掃描時之S與P2不同亦可。此時亦可獲得 如與實施方式1同樣效果。 (實施方式2) 參照第6圖說明實施方式2。另外，以與實施方式1 不同的部分為中心加以說明，與實施方式相同部分則省略 其說明。 於實施方式1之在第1圖所示之雷射切斷裝置，係藉 由XY工作台8之X軸方向及Y軸方向之移動，使雷射光 束2對工件7之聚光位置移動。但是XY工作台8本體甚 重，以致聚光位置之移動變慢，拉長完成工件7之切斷所 需的時間。於實施方式2，一邊使用實施方式1所說明之 雷射切斷方法，一邊用以縮短切斷工件所需之時間者。 第6圖為在實施方式2之雷射切斷裝置之構成圖。於 實施方式2之雷射切斷裝置係具備：雷射振盪器1，可射 出雷射光束2 ;多數個傳輸鏡片3、4，將雷射振盪器1射 出之雷射光束2傳輸至後述之驅動鏡片30;可旋轉之驅動 鏡片30,將傳輸到之雷射光束2以任意角度偏向傳輸至工 [s ] 13 322001 201134591 件7 ;聚光透鏡6，將所傳輸之雷射光束2聚光在工件7 上；控制裝置31，控制雷射振盪器1與驅動鏡片30 ;及固 定工作台32，裝載工件7。 於實施方式2之雷射切斷裝置，係由驅動鏡片30之 旋轉而移動雷射光束2對工件7之聚光位置。使用此雷射 切斷裝置，以 n=4(次），D=0.2(mm)，S = 0.05(mm)，= 25(W)，使用實施方式1之雷射切斷方法進行雷射切斷之 結果，能切斷工件7之同時，在切斷面幾乎無附著碳化物。 再者，因驅動鏡片30較XY工作台8之重量為輕，聚光位 置之移動快速。如是，與使用實施方式1之雷射切斷裝置 比較，可縮短切斷所需時間達1/4倍。 依據實施方式2，除有實施方式1之效果之外，尚可 縮短雷射切斷所需之時間。 再者，於實施方式2,由驅動鏡片30之旋轉，移動雷 射光束2對工件7之聚光位置，但並不限於此。例如亦可 將驅動鏡片30向X軸方向與Y軸方向移動，移動雷射光 束2對工件7之聚光位置。此時也可獲得如同實施方式2 之效果。 又，在第6圖所示雷射切斷裝置，加上第1圖所示之 XY工作台8，使控制裝置31控制雷射振盪器1、驅動鏡 片30、及XY工作台8亦可。此時也可獲得如同實施方式 2之效果。 (實施方式3) 參照第7圖說明實施方式3。另外，以與實施方式2[S 7 322001 201134591 x30mm square shape. The workpiece 7 is a printed circuit board composed of a laminated structure of an insulating layer and a conductor layer of the epoxy resin 14 which is impregnated with the glass cloth 13. Table 1 below shows the results of the experiment when scanning once using the conventional laser cutting method. In the experiment of Table 1, three types of D = 0.2 mm and P2 = 80, 100, and 120 (W) were set, and the workpiece 7 was scanned only once for the laser beam 2 as shown in Fig. 3. Furthermore, the laser cutting method used in this experiment is equivalent to the conventional laser cutting method. Table 1 shows the results of the respective experiments, showing whether the workpiece 7 can be cut and whether the slag is attached to the cut surface to a visual extent. Here, the cutting of the workpiece 7 means that the laser beam 2 has penetrated the workpiece 7, and does not include the case where the laser beam 2 is only at an intermediate point between the surface and the back surface of the workpiece 7. [Table 1] ^\p2(W) S (mm 80 100 120 can not be cut, can be cut, can be cut, - no adhesion plus adhesion plus attached processing slag work residue as shown in Table 1, set When P2=80(w), the workpiece is not attached to the cut surface, but the workpiece 7 cannot be cut. On the other hand, when P2=100, 120 (W), the workpiece 7 can be cut, but the cut surface is Therefore, when the conventional laser cutting method is used, the value of the power P2 of the laser beam is not obtained, and the workpiece 7 can be cut, and the machining slag is not adhered to the cut surface. According to the result of this experiment, P^IOCK W) is set. r 8 322001 201134591 Table 2 below shows the results of the experiment when scanning twice using the laser cutting method of the first embodiment. In the experiment of Table 2, the laser beam 2 was scanned twice for the workpiece 7 shown in Fig. 3 by the laser cutting method of the first embodiment. Further, three types of D = 0.2 (mm) and P2 = 40, 50, and 60 (W) are set, and three types of S = 0.08, 0.10, and 0.12 (mm) are set in the respective values of P2. Table 2 is the result of each experiment as shown in Table 1, which shows whether the workpiece 7 can be cut and whether the slag is attached to the cut surface to a visual extent. [Table 2] ^\P2(W) S(mm) 40 50 60 Can be cut, cut, cut, 0.08 No adhesion plus no adhesion plus no adhesion processing slag work residue can not be cut, can be cut Broken, can be cut, 0.10 No adhesion plus no adhesion plus no adhesion processing slag work slag can not be cut, can not be cut, can be cut, 0.12 no adhesion plus no adhesion plus no adhesion processing slag slag on the table 2 experiments, n = 2 (times), ? ! =;!00(▽), so D/n = 0.1(mm), P1/n=50(W). Therefore, when S = 0.08, O.lO (mm) of the formula (1) is satisfied, and P2 = 50, 60 (W) of the formula (2) is satisfied, a good result can be obtained. Γ 9 322001 201134591 Table 3 below shows the results of the experiment when scanning four times using the laser cutting method of the first embodiment. In the experiment of Table 3, the laser beam 2 was scanned four times for the workpiece 7 shown in Fig. 3 by the laser cutting method of the first embodiment. Further, three types of 0.2 (mm) and P2 = 20, 25, and 30 (W) are set, and three types of S = 0.04, 0.05, and 0.06 (mm) are set in the respective values of P2. Table 3 is the result of each experiment as shown in Table 1, which shows whether the workpiece 7 can be cut and whether the slag is attached to the cut surface to a visual extent. [Table 3] "\p2(W) S(mm 20 25 30 can be cut, can be cut, can be cut, 0.04 no adhesion plus no adhesion plus no adhesion processing slag slag can not be cut, can be cut Broken, can be cut, 0.05 No adhesion plus no adhesion plus no adhesion processing slag slag can not be cut, can not be cut, can be cut, 0.06 no adhesion plus no adhesion plus no adhesion processing slag slag on the table The experiment of 3, n = 4 (times), P = 100 (W), so D / n therefore satisfies the equation (1) S = 0.04, 0.05 (mm), and satisfies the formula (2) P2 = 25, Good results are obtained at =30 (W). f 10 322001 201134591 Figure 4 shows the cutting of the workpiece shown in Figure 3 by scanning the laser beam four times and using the laser cutting method of the embodiment ι At this time, < n=4 (times), D=0.2 (mm), pi=i〇〇(w). Therefore, according to the formula (1), the disc type (7) needs to satisfy (10) and 仏25. Thus, 4 Example setting ^ = 0.05 (inm), P2 = 25 (w). Figure 4 (4) shows the underscan, and Figure 4 (8) shows the third scan. When the 2nd shows the 4th scan Shape. In the fourth figure, the figure is shown in the figure above. The figure above shows the figure of the workpiece 7 from above, which is displayed by a 2-point chain line: each shape, and the scanning position of the laser beam 2 is displayed in front of the thick line. In the figures of Fig. 4 (8) to Fig. 4 (4), the figure below shows the workpiece = 2, and the scanning position 21 in the plane direction is displayed and the shape formed by the scanning = Fig. 4 (4), the position of the sweeping cat is 20 The 1 5 bit 0·075 ππη is located on the outer side of the processed shape & At the 4th _ ·= position 2, the 以 s s also θ is also turned 0.5 times 0.025 mm on the outside of the processed makeup 7. In the case of Fig. 4(c), the scanning position 2 is located at the inner side of the machined shape at a width of 0.025 oun. ^Fig. 4 (4)·= The position of the drawing is 2, which is 0.75 times that of S, which is located at the inside of the machined shape. Therefore, in the example of FIG. 4, the scanning of the laser beam 2 is performed: = 2〇', and the leg is sequentially moved inward by 0.05 leg in the periphery of the processed shape 7a during the scanning of each person, thereby cutting the workpiece 7 A processed shape 7a is formed. Fig. 5 is a photograph of a cut surface when a conventional laser cutting method is used and a cut surface when the laser cutting method of the first embodiment is used. 5th 11 322〇201134591 (a) is the cutting surface of the workpiece 7 when the conventional laser cutting method is used, and n = 1 (times), D = 0.2 (face), "P2 = 100 (W) 22 photos. Fig. 5(a) • The power of the laser beam 2 irradiated to the cut surface 22 is as large as 100 W, so that a large amount of processed slag formed by carbide adheres to the cut surface 22. On the other hand, Fig. 5(b) uses the laser cutting method of the first embodiment, and n = 4 (times), D = 0.2 (mm), S = 0.05 (mm) 'P2 = 25 (W) A photograph of the cut surface 22 of the workpiece 7 at that time. In Fig. 5(b), the power of the laser beam 2 irradiated to the cut surface 22 formed by each scan is as small as 25 W, so that the cut surface 22 hardly adheres to the slag at each scanning. Further, since the scanning position of the laser beam 2 is shifted by 0.2 mm in each scanning, the laser beam 2 of 25 W is irradiated a plurality of times on the same cut surface 22, so that the adhesion of the machining slag can be suppressed. If so, at the last cut surface 22, only the laser beam power of 25 W of the fourth and fourth scans is irradiated. Therefore, the cut surface 22 formed lastly hardly adheres to the processing slag. Furthermore, in the formula (1), S = D/6n or more is preferable. In other words, when the following formulas (3) and (2) are satisfied, the adhesion of the processing slag can be effectively suppressed. D/6nS (movement amount S of scanning position per scan) SD/n (3) Further, as explained in the above specific example, the scanning position of the laser beam is processed in shape 7a per scan. The periphery is sequentially moved by 0.05 mm in parallel to the inner side to cut the workpiece 7 to form the processed shape 7a, but is not limited thereto. In other words, for example, the scanning position of the laser beam may be shifted by 0.05 mm in the outer direction in the outer direction of the processed shape 7a at each scanning to cut the workpiece 7 to form the processed shape 7a. Further, as described above, the workpiece 7 is constituted by a printed circuit board, and L S] 12 322001 201134591. However, any material may be formed as long as it is irradiated with a laser beam. That is, the workpiece can be made of metal, dream, wood, or the like. According to the first embodiment, the generation of the processing slag can be suppressed during the cutting of the workpiece. Therefore, it is possible to suppress the adhesion of the processing slag to the cut surface formed by cutting the workpiece. Further, in the first embodiment, the amount of movement S of the scanning position for each scanning and the power P2 of the laser beam 2 for each scanning are described as being constant for each scanning, but the present invention is not limited thereto. That is, as long as the formula (1) and the formula (2) can be satisfied, S and P2 may be different for each scan. At this time, the same effects as in the first embodiment can be obtained. (Embodiment 2) Embodiment 2 will be described with reference to Fig. 6 . It is to be noted that the portions that are different from the first embodiment will be mainly described, and the description of the same portions as those of the embodiment will be omitted. In the laser cutting apparatus shown in Fig. 1 of the first embodiment, the laser beam 2 is moved to the condensing position of the workpiece 7 by the movement of the XY table 8 in the X-axis direction and the Y-axis direction. However, the body of the XY table 8 is so heavy that the movement of the condensing position becomes slow, and the time required to complete the cutting of the workpiece 7 is elongated. In the second embodiment, the time required to cut the workpiece is shortened while using the laser cutting method described in the first embodiment. Fig. 6 is a view showing the configuration of a laser cutting device according to a second embodiment. The laser cutting device according to the second embodiment includes a laser oscillator 1 that emits a laser beam 2, and a plurality of transmission lenses 3 and 4 that transmit the laser beam 2 emitted from the laser oscillator 1 to a later-described one. Driving lens 30; rotatably driving lens 30, transmitting the transmitted laser beam 2 at an arbitrary angle to the working [s] 13 322001 201134591 piece 7; collecting lens 6, concentrating the transmitted laser beam 2 On the workpiece 7, the control device 31 controls the laser oscillator 1 and the driving lens 30, and the fixed table 32 to load the workpiece 7. In the laser cutting device of the second embodiment, the condensing position of the laser beam 2 to the workpiece 7 is moved by the rotation of the driving lens 30. Using this laser cutting device, laser cutting is performed using the laser cutting method of Embodiment 1 with n = 4 (times), D = 0.2 (mm), S = 0.05 (mm), = 25 (W) As a result of the cutting, the workpiece 7 can be cut, and almost no carbide adheres to the cut surface. Further, since the weight of the driving lens 30 is lighter than that of the XY table 8, the movement of the condensing position is fast. As a result, compared with the use of the laser cutting device of the first embodiment, the time required for cutting can be shortened by a factor of 1/4. According to the second embodiment, in addition to the effects of the first embodiment, the time required for the laser cutting can be shortened. Further, in the second embodiment, the position where the laser beam 2 is focused on the workpiece 7 is moved by the rotation of the driving lens 30, but is not limited thereto. For example, the driving lens 30 may be moved in the X-axis direction and the Y-axis direction to move the condensing position of the laser beam 2 to the workpiece 7. The effect as in Embodiment 2 can also be obtained at this time. Further, in the laser cutting device shown in Fig. 6, the XY table 8 shown in Fig. 1 is added, and the control device 31 controls the laser oscillator 1, the driving mirror 30, and the XY table 8. The effect as in Embodiment 2 can also be obtained at this time. (Embodiment 3) Embodiment 3 will be described with reference to Fig. 7. In addition, with Embodiment 2
[S 14 322001 201134591 不同部分為中心加以說明，與實施方式2相同部分則省略 其說明。 於實施方式2之第6圖所示的雷射切斷裝置，係使利 用可旋轉之驅動鏡片30而偏向之雷射光束2,藉由聚光透 鏡5聚光於工件7表面。因此，由於雷射光束2對工件7 之表面之照射非垂直，使切斷面與工件7表面不成垂直而 無法提高切斷精度。實施方式3，係一邊採用在實施方式1 說明之雷射切斷方法，一邊提高工件切斷之精度。 第7圖為於實施方式3之雷射切斷裝置之構成圖。於 實施方式3之雷射切斷裝置係具備：雷射振盪器1，可射 出雷射光束2 ;多數個傳輸鏡片3、4，將雷射振盪器1射 出之雷射光束2傳輸至後述之驅動鏡片30;可旋轉之驅動 鏡片30,將傳輸到之雷射光束2以任意角度偏向傳輸至工 件7 ;遠心f 0透鏡(telecentric lens)40，將所傳輸之雷射光 束2聚光在工件7上；控制裝置31，控制雷射振盪器1與 驅動鏡片30 ;及固定工作台32，可裝載工件7。 遠心透鏡40，係具有在設定像高為Y、焦距為f、 入射角度為0時，滿足Y二f χθ之特性。並且遠心f(9透 鏡40是一種可使藉由驅動鏡片30而偏向之雷射光束2對 工件7垂直照射的遠心透鏡。 於實施方式3之雷射切斷裝置，係使藉由驅動鏡片30 而偏向之雷射光束2，經由遠心透鏡40對工件7表面 垂直聚光。使用此雷射切斷裝置，以n=4(次），0.2(mm)， S = 0.05(mm)，P2 = 25(W)，並使用實施方式1之雷射切 15 322001 201134591 方法進行雷射切斷之結果，除有實施方式2之效果之外， 還可獲得對工件7之表面垂直之切斷面。 依據實施方式3，除了可獲得實施方式2之效果之 外，尚可得到對工件7之表面垂直之切斷面，得以提高雷 射切斷之精密度。 【圖式簡單說明】 第1圖為實施方式丨之雷射切斷裝置之構成圖。 第2圖為實施方式丨之又¥工作台之規格說明圖。 第3圖（a)及(b)為實施方式1之具體例之說明工件規 格與加工形狀的例示圖。 閾芏弟 並採用實施方式 的樣態圖 之 …—e u 个〜屮5田吁二 雷射切斷方法切斷第3圖所示之工 知雷射切斷方法時之切斷面 方法時之切斷面之照像圖。 射切斷裝置之構成圖。 射切割裝置之構成圖。 第5圖（a)及(b)為採用習 及採用實施方式1之雷射切斷 第6圖為實施方式2之雷· 第7圖為實施方式3之雷· 【主要元件符號說明】 1 雷射振盡器 2 雷射光束 3、4、5 傳輸鏡片 6 聚光透鏡 7 工件 7a 加工形狀 322001 201134591 8 X Y工作台 8a 開口部 9 控制裝置 10 數據 13 玻璃纖維布 14 環氧樹脂 20 掃描位置 21 掃描位置 22 切斷面 30 驅動鏡片 31 控制裝置 32 固定工作台 D 光束直徑[S 14 322001 201134591 The different parts are mainly described, and the description of the same portions as those of the second embodiment will be omitted. In the laser cutting device shown in Fig. 6 of the second embodiment, the laser beam 2 deflected by the rotatable driving lens 30 is condensed on the surface of the workpiece 7 by the collecting lens 5. Therefore, since the irradiation of the surface of the workpiece 7 by the laser beam 2 is not perpendicular, the cut surface is not perpendicular to the surface of the workpiece 7, and the cutting accuracy cannot be improved. In the third embodiment, the accuracy of the workpiece cutting is improved while the laser cutting method described in the first embodiment is employed. Fig. 7 is a view showing the configuration of a laser cutting device according to a third embodiment. The laser cutting device according to the third embodiment includes a laser oscillator 1 that emits a laser beam 2, and a plurality of transmission lenses 3 and 4 that transmit the laser beam 2 emitted from the laser oscillator 1 to a later-described one. Driving lens 30; rotatable driving lens 30, transmitting laser beam 2 to the workpiece 7 at an arbitrary angle; telecentric lens 40, concentrating the transmitted laser beam 2 on the workpiece 7; control device 31, controlling laser oscillator 1 and driving lens 30; and fixed table 32 for loading workpiece 7. The telecentric lens 40 has a characteristic of satisfying Y two f χ θ when the set image height is Y, the focal length is f, and the incident angle is 0. And the telecentric f (the 9 lens 40 is a telecentric lens that can vertically illuminate the workpiece 7 by the laser beam 2 deflected by the driving lens 30. The laser cutting device of the third embodiment is driven by the lens 30. The deflected laser beam 2 is vertically concentrated on the surface of the workpiece 7 via the telecentric lens 40. Using this laser cutting device, n=4 (times), 0.2 (mm), S = 0.05 (mm), P2 = 25 (W), and using the laser cutting method of Embodiment 1, the result of the laser cutting, in addition to the effect of the second embodiment, a cut surface perpendicular to the surface of the workpiece 7 can be obtained. According to the third embodiment, in addition to the effect of the second embodiment, the cut surface perpendicular to the surface of the workpiece 7 can be obtained, and the precision of the laser cut can be improved. [Simple description of the drawing] Fig. 1 is FIG. 2 is a view showing a specification of a workbench according to an embodiment of the present invention. FIG. 3(a) and (b) are diagrams showing a specific example of the first embodiment. An illustration of the specifications and the shape of the process. The threshold is used and the pattern of the embodiment is used. ... eu 屮 屮 田 田 田 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷Fig. 5 (a) and (b) are the laser cutting according to the first embodiment, and the sixth embodiment is the mine of the second embodiment. 3 Ray · [Main component symbol description] 1 Laser oscillating device 2 Laser beam 3, 4, 5 Transmission lens 6 Condenser lens 7 Workpiece 7a Processing shape 322001 201134591 8 XY table 8a Opening 9 Control device 10 Data 13 Glass fiber cloth 14 Epoxy resin 20 Scanning position 21 Scanning position 22 Cutting surface 30 Driving lens 31 Control device 32 Fixing table D Beam diameter