TWI517923B - Laser processing method - Google Patents

Description

Laser processing method

The present invention relates to a laser processing method.

In the following Patent Document 1, a printed wiring board having a metal foil on two layers of an insulating substrate is used, and a hole penetrating the printed wiring board is formed using a laser. Specifically, a laser hole is used to penetrate an alignment hole of the printed wiring substrate, a positioning hole is photographed by the CCD camera, and a laser irradiation position is determined according to the position of the photographed positioning hole, and the irradiation position is irradiated with a lightning. Shot, forming a hole to the middle of the printed wiring substrate. Next, the printed wiring board is turned over, the irradiation position of the laser is determined based on the positioning hole, the laser beam is irradiated to the irradiation position, and the depth is formed to penetrate the hole in the middle of the printed wiring board. According to Patent Document 1, since the holes are formed by irradiating laser light from both sides of the printed wiring board, it is possible to form a substantially straight hole when viewed in cross section.

Patent Document 2 listed below discloses that a double-sided substrate in which metal foil is present on both surfaces of an insulating layer is subjected to through-hole processing using laser light. Specifically, by the trepanning processing of the laser light, the reference hole is formed in the double-sided substrate, and the surface of the double-sided substrate is irradiated with the laser light to form a metal foil penetrating the surface, and the processing is stopped in the middle of the insulating layer. The middle section is machined. Next, the surface substrate is turned over, the camera is used to recognize the through-reference hole, and the laser light is irradiated with the aligned coordinates. Machined holes on the back side. Therefore, according to Patent Document 2, it is possible to connect the machined hole that is opened from the surface to the machined hole that is opened from the back side.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-335655

Patent Document 2: Japanese Patent Laid-Open Publication No. 2009-252892

Patent Document 1 does not describe at all the specific method required to use the laser hole positioning hole, and does not describe the machining time for shortening the positioning hole (reference through hole), and suppresses the central axis of the positioning hole (reference through hole). The method of tilting.

In Patent Document 2, it is described that the through-hole is formed by the hole-to-hole processing of the laser light. However, the processing time is not described at all, and the processing time for shortening the through-reference hole (reference through-hole) is not described at all, and the penetration reference is suppressed. A method of tilting the central axis of a hole (reference through hole).

The present invention has been made in view of the above-described problems, and an object of the invention is to provide a laser processing method capable of reducing the processing time of a reference through-hole while suppressing the inclination of the central axis of the reference through-hole.

In order to solve the above problems and achieve the above object, a laser processing method according to an aspect of the present invention is a processor that performs a through hole by a laser to a workpiece having an insulating layer interposed between a first conductor layer and a second conductor layer. The method includes the following steps: a reference through-hole forming step of adding the aforementioned from the side of the first conductor layer The workpiece causes the laser to be irradiated while being rotated for a plurality of times, and forms a reference through hole that sequentially penetrates the first conductor layer, the insulating layer, and the second conductor layer; and the first processed hole forming step is performed from the first conductor layer The side of the workpiece is irradiated with a laser to form a first processing hole that penetrates the first conductor layer to the insulating layer, and the second processing hole forming step is obtained by imaging the reference through hole from the second conductor layer side. The image is positioned, and the workpiece is irradiated with a laser beam from the side of the second conductor layer to form a second processing hole that penetrates the second conductor layer and reaches the insulating layer and communicates with the first processing hole. In the reference through-hole forming step, the amount of heat supplied to the side surface of the reference through-hole is equalized in a radial direction radiated from the central axis of the reference through-hole, and the laser is rotated in a plurality of times. Each of the turns has a mutual change.

According to the present invention, when the winding process is performed under the processing conditions in which the energy density is higher than the general processing conditions, the inclination of the central axis of the reference through hole can be suppressed. In other words, it is possible to reduce the processing time of the reference through hole and suppress the inclination of the central axis of the reference through hole.

1‧‧‧ Laser processing equipment

2‧‧‧Laser oscillator

10‧‧‧Processed objects

11‧‧‧1st conductor layer

11a‧‧‧ Surface of the first conductor layer

12‧‧‧2nd conductor layer

12a‧‧‧ Surface of the second conductor layer

13‧‧‧Insulation

14-1, 14-2, 14-1', 14-2'‧‧‧ benchmark through holes

15-1 to 15-3, 15-1' to 15-3'‧‧‧1st machined hole

16-1 to 16-3, 16-1' to 16-3'‧‧‧2nd machined hole

21, 22‧‧‧Transportation agencies

30‧‧‧ flip mechanism

40‧‧‧Processing Control Department

50‧‧ ‧ Laser Processing Department

51‧‧‧Camera

52X, 52Y‧‧‧ scanning electron microscope

53X, 53Y‧‧‧ electron microscope scanner

54‧‧‧fθ lens

55‧‧‧Processing table

58‧‧‧ fixture board

AM‧‧‧ positioning mark

Central axis of CA, CA'‧‧‧ benchmark through-hole

Center position (machining position) on the first conductor layer side of the reference through-hole of CP1, CP1'‧‧

Center position of the second conductor layer side of the CP2, CP2'‧‧ ‧ reference through-hole (positioning mark Central location)

Center position of the first conductor layer side of the first processed hole of CP3, CP3'‧‧

CP4’‧‧‧ machining location

D14, D14a‧‧‧ diameter of the reference through hole

Error in the center position of ER‧‧‧

LB‧‧‧ pulsed laser light

P15, P15', P16, P16'‧‧‧ relative coordinates (relative position)

PL‧‧‧ normal

WP1 to WP4‧‧‧ processing location

θ‧‧‧Tilt angle

Fig. 1 (a) to (d) are views showing a laser processing method according to the first embodiment.

Fig. 2 (a) to (d) are views showing a laser processing method according to the first embodiment.

Fig. 3 is a photomicrograph showing a cross section of a sample processed by the laser processing method of the first embodiment.

Fig. 4 (a) to (d) are views showing a laser processing method according to the second embodiment.

Fig. 5 (a) to (d) are views showing a laser processing method according to the third embodiment.

Fig. 6 (a) to (d) are views showing a laser processing method according to a fourth embodiment.

Fig. 7 (a) to (d) are views showing a laser processing method according to the fifth embodiment.

Fig. 8 (a) to (d) are views showing a laser processing method according to a sixth embodiment.

Fig. 9 (a) to (d) are views showing a laser processing method according to a seventh embodiment.

Fig. 10 (a) to (d) are views showing a laser processing method according to the eighth embodiment.

Fig. 11 (a) to (d) are views showing a laser processing method according to a ninth embodiment.

Fig. 12 (a) to (d) are views showing a laser processing method of the tenth embodiment.

Fig. 13 (a) to (d) are views showing a laser processing method of the eleventh embodiment.

Fig. 14 (a) to (d) are views showing a laser processing method of the twelfth embodiment.

Fig. 15 (a) to (d) are views showing a laser processing method according to a thirteenth embodiment.

Fig. 16 (a) to (d) are views showing a laser processing method according to a fourteenth embodiment.

Fig. 17 (a) to (d) are diagrams showing a laser processing method of a basic form.

Fig. 18 is a view showing the configuration of a laser processing apparatus of a basic form.

Fig. 19 (a) to (d) are diagrams showing a laser processing method of a basic form.

Fig. 20 is a photomicrograph showing a cross section of a sample processed by a laser processing method in a basic form.

Hereinafter, embodiments of the laser processing method of the present invention will be described in detail based on the drawings. Further, the present invention is not limited by the following embodiments.

Embodiment 1.

Before describing the laser processing method according to the first embodiment, a laser processing method of a basic form will be described using FIG. Fig. 17 (a) to (d) are cross-sectional views showing the steps of the laser processing method of the basic form.

In the step shown in Fig. 17 (a), the workpiece 10 is prepared. The workpiece 10 is a printed wiring board having a three-layer structure in which the insulating layer 13 is interposed between the first conductor layer 11 and the second conductor layer 12, as shown in Fig. 17 (a). The first conductor layer 11 is, for example, a copper foil. The second conductor layer 12 is, for example, a copper foil. The insulating layer 13 is, for example, a resin layer, and is formed of, for example, a material mainly composed of an epoxy resin or a polyimide resin.

At this time, for example, the processing control unit 40 of the laser processing apparatus 1 shown in Fig. 18 controls the jig plate 58, and the workpiece 10 is vacuum-adsorbed and fixed to the table 55 by the jig 58. on.

In the step shown in Fig. 17 (b), the workpiece 10 is irradiated with a pulse laser from the side of the first conductor layer 11 to form reference through holes 14-1 and 14-2. The reference through holes 14-1 and 14-2 are based on the processing of the workpiece 10 from the side of the second conductor layer 12 (see FIG. 17(d)).

At this time, for example, the laser oscillator 2 of the laser processing apparatus 1 shown in Fig. 18 causes the pulsed laser light LB to be generated and output to the laser processing unit 50. The machining control unit 40 controls the laser processing unit 50 to control the irradiation position of the pulsed laser light LB from the laser processing unit 50 to the workpiece 10. For example, the processing control unit 40 controls the angle of the scan mirror 52Y via a galvanometer scanner 53Y, and controls the driving position of the processing table 55 in the Y direction, thereby controlling the pulse wave Ray reflected by the scanning electron microscope 52Y. The light LB falls on the Y coordinate on the workpiece 10. The machining control unit 40 controls the angle of the scanning electron microscope 52X via the electron microscope scanner 53X, and controls the driving position of the processing table 55 in the X direction, thereby controlling the pulsed laser light LB reflected by the scanning electron microscope 52X to fall on the workpiece 10. X coordinates. Thereby, the pulsed laser light LB reflected by the scanning electron microscope 52Y and the scanning electron microscope 52X is condensed on the controlled coordinate position on the workpiece 10 by the f θ lens 54. The reference through holes 14-1 and 14-2 are formed. Further, the machining control unit 40 memorizes its controlled coordinate position. The coordinate position to be memorized is, for example, the center position CP1 of the opening end on the first conductor layer 11 side of the reference through hole 14-1 shown in Fig. 17(b).

In the step shown in Fig. 17 (c), the workpiece 10 is held from the first conductor layer 11 side while maintaining the position of the workpiece 10 at the position shown in Fig. 17(b). The laser is irradiated to form the first processing holes 15-1 to 15-3. The first processing holes 15-1 to 15-3 are holes that penetrate the first conductor layer 11 to the insulating layer 13.

At this time, for example, the laser oscillator 2 of the laser processing apparatus 1 shown in Fig. 18 causes the pulsed laser light LB to be generated and output to the laser processing unit 50. The machining control unit 40 controls the laser processing unit 50 to control the irradiation position of the pulsed laser light LB from the laser processing unit 50 to the workpiece 10. Thereby, the pulsed laser light LB reflected by the scanning electron microscope 52Y and the scanning electron microscope 52X is condensed on the controlled coordinate position on the workpiece 10 by the fθ lens 54 to form the first processing holes 15-1 to 15- 3. Further, the machining control unit 40 memorizes the controlled coordinate position and calculates the relative coordinates with respect to the reference through holes 14-1 and 14-2. The coordinate position to be memorized is, for example, the center position CP3 of the opening end on the first conductor layer 11 side of the first machined hole 15-1 shown in Fig. 17(c). Further, the calculated relative coordinate is, for example, the center position of the open end of the first processing hole 15-1 based on the center position CP1 of the opening end of the reference through hole 14-1 shown in Fig. 17(c). The relative coordinate of the CP3 is P15.

In the step shown in Fig. 17 (d), the reference through holes 14-1 and 14-2 are imaged from the side of the second conductor layer 12, and the position of the processing position is obtained by the captured image. Next, the workpiece 10 is irradiated with a laser beam from the second conductor layer 12 side to form second processed holes 16-1 to 16-3. The second processing holes 16-1 to 16-3 are through the second The conductor layer 12 reaches the insulating layer 13.

At this time, for example, the processing control unit 40 of the laser processing apparatus 1 shown in Fig. 18 controls the transport mechanism 21, transports the workpiece 10 to the reversing mechanism 30, and controls the reversing mechanism 30 to invert the workpiece 10, and then The conveyance mechanism 22 returns the inverted workpiece 10 to the processing table 55. The processing control unit 40 controls the jig plate 58 and the workpiece 10 is vacuum-adsorbed and fixed to the processing table 55 by the jig plate 58. Next, the processing control unit 40 controls the camera 51 (for example, a CCD image sensor or a CMOS image sensor), and photographs the reference through holes 14-1 and 14-2 from the second conductor layer 12 side. 51 Acquire the captured image. The processing control unit 40 performs image processing such as edge detection on the captured image, for example, performs image recognition, and the first reference through hole 14-1 shown in FIG. 17(b) is used. The pattern of the open end on the side of the conductor layer 11 is identified as an alignment mark AM, and the center position CP2 of the positioning mark AM is obtained. The machining control unit 40 determines the machining position CP1 based on the center position CP2 of the positioning mark AM, for example, based on the relative position P16 corresponding to the relative coordinate P15. Next, the machining control unit 40 controls the laser processing unit 50 to control the irradiation position of the pulsed laser light LB by the laser processing unit 50 to the workpiece 10 at, for example, the machining position CP1. Thereby, the pulsed laser light LB reflected by the scanning electron microscope 52Y and the scanning electron microscope 52X is condensed on the controlled coordinate position on the workpiece 10 by the f θ lens 54 to form the second processing holes 16-1 to 16 -3.

Here, it is assumed that the reference through holes 14-1 and 14-2 in the step shown in Fig. 17(b) are formed so that the penetration of the plurality of pulsed laser light LB is irradiated at the same portion of the first conductor layer 11. (punching) the case of processing. At this time, as the depth from the surface 11a of the first conductor layer 11 is deeper, the pulsed laser light LB becomes difficult to reach due to the divergence or the like on the side surface of the hole, and thus the reference through holes 14-1 and 14-2 are present. diameter There is a tendency to become smaller and smaller, and there is a possibility that the reference through holes 14-1 and 14-2 cannot penetrate to the second conductor layer 12 side. If the reference through holes 14-1 and 14-2 cannot be penetrated to the second conductor layer 12 side, the image recognition of the positioning mark AM cannot be performed in the step shown in Fig. 17 (d).

Further, even if the reference through holes 14-1 and 14-2 are successfully penetrated to the second conductor layer 12 side, the diameter D14 of the reference through holes 14-1 and 14-2 on the second conductor layer 12 side is still highly reduced. It is a possibility that the pulse laser beam LB has a beam diameter (for example, 20 μm to 30 μm). When the diameter D14 of the reference through holes 14-1 and 14-2 is reduced to a fraction of the beam diameter of the pulsed laser light LB, the positioning mark AM is performed in the step shown in Fig. 17(d). The error at the time of recognition is likely to be larger than the allowable range, and the position recognized as the center position CP2 of the positioning mark AM is present, and the error from the actual position tends to be larger than the allowable range.

On the other hand, in order to enlarge the diameter D14 of the reference through-holes 14-1 and 14-2 (for example, to expand to 500 μm to 1000 μm), the inventors of the present invention performed the hole-punching process under normal processing conditions in Fig. 17(b). The formation of the reference through holes 14-1 and 14-2 in the showing step was examined.

Specifically, in the step shown in FIG. 17(b), the irradiation position of the pulsed laser light LB is moved in the circumferential direction as shown in FIG. 19(a), and the reference through-hole 14 having a large diameter is produced. -1, 14-2 circumferential processing. Next, as shown in Figs. 19(b) to 19(d), the same processing as the circumferential processing shown in Fig. 19(a) is repeated a plurality of times. At this time, under normal processing conditions, until the first conductor layer 11 is penetrated, the following processing is performed: first, the pulsed laser light LB generated by the high energy density of the first conductor layer 11 (for example, copper) is processed. Dew on the insulating layer 13 At the time of the exit, the laser oscillator 2 is controlled to reduce the energy density to a low energy density for the insulating layer 13 (for example, a resin), and the pulsed laser light LB generated by the low energy density is processed to be exposed on the second conductor layer 12. At the time, the laser oscillator 2 is again controlled to increase the energy density to a high energy density for the second conductor layer 12 (for example, copper), and the pulsed laser light LB generated by the high energy density is processed. As a result, as shown in FIG. 17(b), the diameter D14 of the reference through-holes 14-1 and 14-2 on the second conductor layer 12 side can be enlarged to the reference through-holes 14-1 and 14-2. The diameter D14a on the side of the first conductor layer 11 is the same (for example, 500 μm to 1000 μm).

However, in the perforation processing of general processing conditions, since it is necessary to process a very large region (for example, a circular region having a diameter of 500 μm to 1000 μm) having a beam diameter (for example, 20 μm to 30 μm) which is relatively larger than the pulse laser light LB, the processing is performed. The time beyond the allowable range becomes very long and it is difficult to put it into practical use.

On the other hand, the inventors of the present invention conducted a study on the hole-punching process in the step shown in Fig. 17(b) under the processing conditions in which the energy density is higher than the general processing conditions.

Specifically, the laser oscillator 2 is controlled to maintain the energy density at a relatively high energy density for the first conductor layer 11 (for example, copper), and the pulse laser light LB generated at a certain energy density is repeatedly used. The circumferential processing shown in Fig. 19 (a) to Fig. 19 (b) is repeated a plurality of times. Thereby, the processing time can be limited to the allowable range.

However, the inventors of the present invention have also discovered a new subject in which the center axis of the reference through-hole is opposite to the first conductor layer 11 because the hole processing is performed under the processing conditions in which the energy density is higher than the general processing conditions. The normal to the surface 11a is clearly inclined, and its influence is so large that it cannot be ignored. Further, the inventors of the present invention have found that the thicker the workpiece 10, the more pronounced the tendency.

For example, as shown in Fig. 17(b), when the inclination angle θ of the central axis of the reference through hole 14-1 with respect to the normal line PL of the surface 11a of the first conductor layer 11 becomes larger than a predetermined value, the passage is passed. The distance from the normal line center position CP1 on the first conductor layer 11 side of the reference through hole 14-1 to the center position CP2 on the second conductor layer 12 side of the reference through hole 14-1, that is, the error ER at the center position Will become larger than the allowable range. As a result, the registration error of the relative position P15 shown in FIG. 17(c) and the relative position P16 shown in FIG. 17(d) becomes larger in accordance with the error ER of the center position, as shown in FIG. As shown in d), it is difficult to make the possibility that the second processing holes 16-1 to 16-3 communicate with the corresponding first processing holes 15-1 to 15-3. In other words, it is difficult to form the through-holes formed by the first processing holes 15-1 to 15-3 communicating with the second processing holes 16-1 to 16-3 with respect to the reference through holes 14-1 and 14-2. It may become higher.

In view of this, the inventors of the present invention confirmed that the central axis of the reference through-hole is significantly inclined as shown by the broken line in the photomicrograph of Fig. 20 after the actual preparation of the sample.

The inventors of the present invention examined the cause of the apparent tilt of the central axis of the reference through-hole. As a result, it is considered that the hole through holes 14-1 and 14-2 may be supplied to the reference through holes 14-1 and 14-2 due to variations in mechanical characteristics of the laser processing apparatus 1 or the like. The heat input on the side is potentially heterogeneous, and the hole processing (first main cause) is performed under the processing conditions in which the energy density is higher than the general processing conditions, and the same is repeated in the same manner as in Fig. 19 (a) to Fig. 19 The circumferential processing (second main cause) shown in (d) magnifies the unevenness.

At this time, if the energy density is lowered to the extent of general processing conditions in order to improve the first main body, the processing time is out of the allowable range as described above. It has a tendency to be very long and difficult to use.

In the first embodiment, in the radial direction of radiation from the central axis of the reference through-hole, the amount of heat supplied to the side surface of the reference through-hole is equalized, and each of the plurality of lasers is wound. The special processing in which the windings are changed from each other (hereinafter referred to as the winding variation processing to be distinguished from the above-mentioned winding processing), thereby maintaining the processing conditions of the energy density higher than the general processing conditions, and improving the second Main cause. Hereinafter, a description will be given focusing on a portion different from the laser processing method of the basic form.

Specifically, in the step shown in Fig. 1(a), the workpiece 10 which is the same as the step shown in Fig. 17(a) is prepared, and then in the step shown in Fig. 1(b), On the side of the first conductor layer 11, the workpiece 10 is irradiated with a plurality of times while being laser-rolled, and the reference through holes 14-1' and 14-2' are formed. In other words, the reference through-holes 14-1' and 14-2' are formed by spirally changing the workpiece 10 from the side of the first conductor layer 11.

In the winding variation processing, the radiation is radiated from the central axis CA' of the reference through holes 14-1' and 14-2' so as to be supplied to the side faces of the reference through holes 14-1' and 14-2'. The way in which the heat is equalized causes the respective turns of the plurality of turns of the laser to change. For example, in the winding variation processing, as shown in Figs. 2(a) to (d), the winding directions of the plurality of times of the plurality of windings of the laser are alternately changed.

For example, in the winding process shown in Fig. 2(a), the irradiation position of the pulse laser light LB is shifted clockwise with the machining position WP3 relating to the radiation direction radiated from the central axis CA' as the starting position. Next, in the winding process shown in Fig. 2(b), the machining position is related to the radiation direction radiated from the central axis CA'. Set WP3 as the starting position and move the irradiation position of the pulsed laser light LB counterclockwise. Next, in the winding process shown in Fig. 2(c), the processing position WP3 relating to the radiation direction radiated from the central axis CA' is taken as the starting position, and the irradiation position of the pulse laser light LB is moved clockwise. Next, in the winding process shown in Fig. 2(d), the processing position WP3 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and the irradiation position of the pulse laser light LB is shifted counterclockwise.

For example, in consideration of variations in mechanical characteristics of the laser processing apparatus 1 and the like, the heat input amount at the 1/4 winding position is LQ1 and the heat input amount at the 3/4 winding position is LQ2 in each winding process. The situation. At this time, in the winding variation processing shown in FIGS. 2(a) to 2(d), the heat input WPQ1 supplied to the machining position WP] related to the radiation direction radiated from the central axis CA' is expressed by the following equation 1 indicates.

WPQ1=LQ1+LQ2+LQ1+LQ2=2(LQ1+LQ2)...Formula 1

Further, in the winding variation processing shown in FIGS. 2(a) to 2(d), the heat input WPQ2 supplied to the machining position WP2 related to the radial direction radiated from the central axis CA' is expressed by the following formula 2 .

WPQ2=LQ2+LQ1+LQ2+LQ1=2(LQ1+LQ2)...Literature 2

The following Formula 3 is derived from Equations 1 and 2.

WPQ1=WPQ2...Expression 3

As is understood from the equation 3, the heat input WPQ1 supplied to the machining position WP1 related to the radial direction radiated from the central axis CA' can be supplied to the machining position WP2 related to the radial direction radiated from the central axis CA'. The heat WPQ2 is equal.

In the step shown in Fig. 1(b), Fig. 2 (a) to (d) are performed. In the illustrated winding variation processing, the inclination angle θ of the central axis CA' of the reference through hole 14-1 ′ with respect to the normal line PL of the surface 11 a of the first conductor layer 11 can be made smaller than a predetermined value. The normal line PL from the center position CP1' on the first conductor layer 11 side passing through the reference through hole 14-1' can be reached from the center position CP2' of the reference through hole 14-1' on the second conductor layer 12 side. The distance, that is, the error ER at the center position (see Fig. 17(b)) is suppressed within the allowable range. As a result, the registration error between the relative position P15' shown in FIG. 1(c) and the relative position P16' shown in FIG. 1(d) (that is, the alignment error between the center position CP3' and the machining position CP4') It becomes smaller in accordance with the error ER of the center position, and as shown in FIG. 1(d), for example, the processing position CP'4 of the second machining holes 16-1' to 16-3' can be correctly positioned, and It is easy to connect the second processing holes 16-1' to 16-3' with the corresponding first processing holes 15-1' to 15-3'. In other words, it is easy to form the first processing holes 15-1' to 15-3' to the second processing holes 16-1' to 16-3' based on the reference through holes 14-1' and 14-2'. The formed through hole.

In view of this, the inventors of the present invention confirmed that the central axis of the reference through-hole was successfully suppressed within the allowable range as shown by the broken line in the photomicrograph of FIG. 3 after the actual preparation of the sample.

As described above, in the first embodiment, in the step shown in Fig. 1(b), the radiation direction is emitted from the central axis CA' of the reference through holes 14-1' and 14-2'. The manner in which the heat input to the side faces of the reference through holes 14-1' and 14-2' is equal is such that the respective turns of the plurality of turns of the laser change. Thereby, when the winding process is performed under the processing conditions in which the energy density is higher than the general processing conditions, the inclination of the central axis CA' of the reference through holes 14-1' and 14-2' can be suppressed. That is, it is possible to shorten the processing time of the reference through holes 14-1' and 14-2' while suppressing the base. The inclination of the central axis CA' of the through-holes 14-1', 14-2'.

Further, in the first embodiment, in the step shown in Fig. 1(b), the winding directions of the plurality of times of the plurality of windings of the laser are alternately changed. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Further, in the first embodiment, in the step shown in FIG. 1(b), the workpiece 10 is irradiated with a laser generated at a constant energy density while being rotated a plurality of times. This constant energy density is suitable for the energy density of the processing of the first conductor layer 11. Thereby, the processing time of the step shown in FIG. 1(b) can be limited to the allowable range.

Embodiment 2.

Next, a laser processing method according to the second embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the first embodiment.

In the first embodiment, in the step shown in Fig. 1(b), the winding directions of the plurality of times of the plurality of windings of the laser are changed (see Figs. 2(a) to (d)). In the second embodiment, the start position of each of the plurality of windings of the laser is changed.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 4(a) to 4(d), each of the plurality of windings of the laser is wound. The starting position changes at least one round in its multiple windings.

For example, in the winding process shown in Fig. 4(a), the irradiation position of the pulse laser light LB is shifted clockwise with the machining position WP3 relating to the radiation direction radiated from the central axis CA' as the starting position. Next, in the winding process shown in Fig. 4(b), the machining position is related to the radiation direction radiated from the central axis CA'. Set WP1 as the starting position and move the irradiation position of the pulsed laser light LB clockwise. Next, in the winding process shown in Fig. 4(c), the processing position WP4 relating to the radiation direction emitted from the central axis CA' is taken as the starting position, and the irradiation position of the pulse laser light LB is moved clockwise. Next, in the winding process shown in Fig. 4(d), the irradiation position of the pulse laser light LB is shifted clockwise with the machining position WP2 relating to the radiation direction radiated from the central axis CA' as the starting position.

As described above, in the second embodiment, in the step shown in Fig. 1(b), the start position of each of the plurality of windings of the laser is rotated, and at least one of the plurality of windings is changed. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Embodiment 3.

Next, a laser processing method according to the third embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the first embodiment.

In the first embodiment, in the step shown in Fig. 1(b), the winding directions of the plurality of times of the plurality of windings of the laser are changed (see Figs. 2(a) to (d)). In the third embodiment, the pitch of each of the plurality of windings of the laser is changed.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 5(a) to (d), each of the plurality of windings of the laser is wound. The spacing is changed by at least one round in its multiple windings. The pitch of the winding is, for example, adapted to the shifting pitch of the irradiation position of the pulsed laser light LB.

For example, in the winding process shown in Fig. 5(a), the machining position WP3 related to the radiation direction radiated from the central axis CA' is taken as the starting position. The hour hand moves the irradiation position of the pulse laser light LB at the first pitch. Next, in the winding process shown in Fig. 5(b), the irradiation position of the pulse laser light LB is shifted by the second pitch which is slower than the first pitch. Next, in the winding process shown in Fig. 5(c), the irradiation position of the pulse laser light LB is shifted at the first pitch. Next, in the winding process shown in Fig. 5(d), the irradiation position of the pulse laser light LB is shifted at the second pitch. Further, the radial line segments shown in FIGS. 5(a) to (d) are examples of the pitch of the amounts of the three pulse waves of the pulse laser light LB. Further, in the fifth (a) to (d) of FIG. 5, the case where the two-wheel pitch is changed by four winding processes is exemplified.

As described above, in the third embodiment, in the step shown in Fig. 1(b), the pitch of each of the plurality of windings of the laser is changed by at least one round in the plurality of windings. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Embodiment 4.

Next, a laser processing method according to the fourth embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the second embodiment.

In the second embodiment, in the step shown in FIG. 1(b), the start position of each of the plurality of windings of the laser is changed (see FIGS. 4(a) to (d)). On the other hand, in the fourth embodiment, the winding direction of each of the plurality of windings of the laser is also changed.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 6(a) to (d), each of the plurality of windings of the laser is wound. The starting position is changed by at least one round in its multiple windings, and the winding directions of the plurality of windings of the laser are alternately changed.

For example, in the winding process shown in Fig. 6(a), the irradiation position of the pulse laser light LB is shifted clockwise with the machining position WP3 relating to the radiation direction radiated from the central axis CA' as the starting position. Next, in the winding process shown in Fig. 6(b), the processing position WP1 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and the irradiation position of the pulse laser light LB is shifted counterclockwise. Next, in the winding process shown in Fig. 6(c), the processing position WP4 relating to the radiation direction emitted from the central axis CA' is taken as the starting position, and the irradiation position of the pulse laser light LB is moved clockwise. Next, in the winding process shown in Fig. 6(d), the processing position WP2 relating to the radiation direction radiated from the central axis CA' is taken as the starting position, and the irradiation position of the pulse laser light LB is shifted counterclockwise.

As described above, in the second embodiment, in the step shown in FIG. 1(b), the start position of each of the plurality of windings of the laser is rotated, and at least one round is changed in the plurality of windings, and The winding directions of the multiple turns of the laser alternate alternately. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Embodiment 5.

Next, a laser processing method according to the fifth embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the first embodiment.

In the first embodiment, in the step shown in Fig. 1(b), the winding directions of the plurality of times of the plurality of windings of the laser are changed (see Figs. 2(a) to (d)). In the fifth embodiment, the pitch of each of the plurality of windings of the laser is further changed.

Specifically, the winding change in the step shown in FIG. 1(b) is added. In the middle of the work, as shown in Fig. 7 (a) to (d), the winding directions of the plurality of windings of the laser are alternately changed, and the spiraling of the plurality of times of the laser is repeated. The spacing is changed by at least one round in its multiple windings. The pitch of the winding is, for example, adapted to the shifting pitch of the irradiation position of the pulsed laser light LB.

For example, in the winding process shown in Fig. 7(a), the machining position WP3 related to the radial direction emitted from the central axis CA' is taken as the starting position, and the pulse laser light LB is shifted clockwise at the first pitch. Irradiation position. Next, in the winding process shown in Fig. 7(b), the irradiation position of the pulse laser light LB is shifted counterclockwise at a second pitch which is slower than the first pitch. Next, in the winding process shown in Fig. 7(c), the irradiation position of the pulse laser light LB is shifted clockwise at the second pitch. Next, in the winding process shown in Fig. 7(d), the irradiation position of the pulse laser light LB is shifted counterclockwise at the first pitch. Further, in the winding processing shown in Fig. 7(b) and the winding processing shown in Fig. 7(c), the pitch is set to be the same so that the correspondence between the pitch and the rotation direction is different every time.

As described above, in the fifth embodiment, in the step shown in Fig. 1(b), the winding directions of the plurality of times of the plurality of windings of the laser are alternately changed, and each of the plurality of times of the laser is wound. The pitch of the winding is changed by at least one round in its multiple windings. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Further, in the fifth embodiment, the winding direction and the pitch of each of the plurality of times of the plurality of windings of the laser are changed so that the correspondence between the pitch and the rotation direction is different. Thereby, it is possible to efficiently supply the reference through-holes in relation to the radiation directions radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. The heat input on the sides of 14-1' and 14-2' is equal.

Embodiment 6.

Next, a laser processing method according to the sixth embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the fifth embodiment.

In the fifth embodiment, in the step shown in Fig. 1(b), the winding direction and the pitch of each of the plurality of times of the laser are changed (see Figs. 7(a) to (d)). On the other hand, in the sixth embodiment, the start position of each of the plurality of windings of the laser is also changed.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 8(a) to (d), each of the plurality of windings of the laser is wound. The directions alternate, and the spacing and starting position of each of the plurality of windings of the laser are varied by at least one round in the plurality of windings. The pitch of the winding is, for example, adapted to the shifting pitch of the irradiation position of the pulsed laser light LB.

For example, in the winding process shown in Fig. 8(a), the machining position WP3 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and the pulse laser light LB is shifted clockwise at the first pitch. Irradiation position. Next, in the winding process shown in Fig. 8(b), the machining position WP1 relating to the radial direction emitted from the central axis CA' is taken as the starting position, and the pulsed laser light LB is shifted by the second pitch counterclockwise. Irradiation position. Next, in the winding process shown in FIG. 8(c), the machining position WP4 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and the pulse laser light LB is moved clockwise at the second pitch. Irradiation position. Next, in the winding process shown in FIG. 8(d), the machining position WP2 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and the pulse laser light LB is moved counterclockwise at the first pitch. Irradiation position.

As described above, in the sixth embodiment, in the step shown in Fig. 1(b), the winding directions of the plurality of times of the plurality of windings of the laser are alternately changed, and each of the plurality of times of the laser is wound. The pitch and starting position of the winding are changed by at least one round in its multiple windings. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Embodiment 7.

Next, a laser processing method according to the seventh embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the first embodiment.

In the first embodiment, in the step shown in FIG. 1(b), each of the plurality of windings of the laser is circular (see FIGS. 2(a) to (d)), and In the seventh embodiment, each of the plurality of windings of the laser is spiraled.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 9(a) to (d), each of the plurality of windings of the laser is wound. The direction changes in such a way that the direction of the spiral turns.

For example, in the winding process shown in Fig. 9(a), the machining position WP3 related to the radial direction radiated from the central axis CA' is taken as the starting position, and the clockwise direction is moved from the outer side of the spiral toward the center. The irradiation position of the pulse laser light LB. Next, in the winding process shown in Fig. 9(b), the irradiation position of the pulse laser light LB is moved counterclockwise from the outer side of the spiral toward the center. Next, in the winding process shown in Fig. 9(c), the irradiation position of the pulse laser light LB is shifted clockwise from the outer side of the spiral toward the center. Next, in the winding process shown in Fig. 9(d), the irradiation position of the pulse laser light LB is shifted counterclockwise so as to approach the center from the outer side of the spiral.

As described above, in the seventh embodiment, in the step shown in Fig. 1(b), the respective winding directions of the plurality of windings of the laser are changed so that the winding direction of the spiral changes. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Embodiment 8.

Next, a laser processing method according to the eighth embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the second embodiment.

In the second embodiment, in the step shown in Fig. 1(b), each of the plurality of windings of the laser is circular (see Figs. 4(a) to (d)), and In the eighth embodiment, each of the plurality of windings of the laser is spiral.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 10(a) to (d), each of the plurality of spirals of the laser is spiraled. The starting position of the shape of the winding is changed by at least one round in its multiple windings.

For example, in the winding process shown in Fig. 10(a), the machining position WP3 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and the clockwise direction is moved from the outer side of the spiral toward the center. The irradiation position of the pulse laser light LB. Next, in the winding process shown in Fig. 10(b), the machining position WP1 relating to the radial direction radiated from the central axis CA' is taken as the starting position, and the clockwise direction is moved from the outer side of the spiral toward the center. The irradiation position of the pulse laser light LB. Next, in the winding process shown in Fig. 10(c), the machining position WP4 relating to the radial direction radiated from the central axis CA' is taken as the starting position, and the clockwise direction is moved from the outer side of the spiral toward the center. The irradiation position of the pulse laser light LB. Next, in the winding process shown in Fig. 10(d), the radiation is emitted from the central axis CA'. The processing position WP2 related to the radial direction is the starting position, and the irradiation position of the pulse laser light LB is moved clockwise from the outer side of the spiral toward the center.

As described above, in the eighth embodiment, in the step shown in Fig. 1(b), the start position of the spiral winding of each of the plurality of windings of the laser is changed, and at least one round is changed in the plurality of windings. . Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Embodiment 9.

Next, a laser processing method according to the ninth embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the third embodiment.

In the third embodiment, in the step shown in FIG. 1(b), each of the plurality of windings of the laser is circular (see FIGS. 5(a) to (d)), and In the ninth embodiment, each of the plurality of windings of the laser is spiraled.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 11(a) to (d), each of the plurality of spirals of the laser is spirally wound. The pitch of the shape of the winding is changed by at least one round in its multiple windings. That is, each of the plurality of windings of the laser is rotated to change the number of turns of the spiral.

For example, in the winding process shown in Fig. 11(a), the machining position WP3 related to the radial direction radiated from the central axis CA' is taken as the starting position, and the number of turns of the spiral is made clockwise, for example, three times. The first pitch shifts the irradiation position of the pulsed laser light LB. Next, in the winding process shown in FIG. 11(b), the irradiation position of the pulse laser light LB is shifted by the second pitch in which the number of turns of the spiral is, for example, two turns. Next, in the winding process shown in Fig. 11 (c), the spiral is wound. The number of turns is, for example, the irradiation position of the first pitch shifting pulse laser light LB of three turns. Next, in the winding process shown in FIG. 11(d), the irradiation position of the pulse laser light LB is shifted by the second pitch in which the number of turns of the spiral is, for example, two turns.

As described above, in the ninth embodiment, in the step shown in Fig. 1(b), the respective windings of the plurality of windings of the laser are changed so as to change the number of turns of the spiral. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Embodiment 10.

Next, a laser processing method according to the tenth embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the fourth embodiment.

In the fourth embodiment, in the step shown in Fig. 1(b), each of the plurality of spirals of the laser is circularly wound (see Figs. 6(a) to (d)), and In the tenth embodiment, each of the plurality of windings of the laser is spiraled.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 12(a) to (d), each of the plurality of spirals of the laser is spiraled. The starting position of the shape of the winding is changed by at least one round in its multiple windings, and the winding direction of each of the plurality of windings of the laser is changed in such a manner as to change the winding direction of the spiral.

For example, in the winding process shown in Fig. 12(a), the machining position WP3 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and the clockwise direction is moved from the outer side of the spiral toward the center. The irradiation position of the pulse laser light LB. Next, in the winding process shown in Fig. 12(b), the machining position WP1 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and counterclockwise The irradiation position of the pulse laser light LB is shifted from the outer side of the spiral toward the center. Next, in the winding process shown in Fig. 12(c), the machining position WP4 relating to the radial direction radiated from the central axis CA' is taken as the starting position, and the clockwise direction is moved from the outer side of the spiral toward the center. The irradiation position of the pulse laser light LB. Next, in the winding process shown in Fig. 12(d), the machining position WP2 related to the radial direction radiated from the central axis CA' is taken as the starting position, and the counterclockwise movement is moved from the outer side of the spiral toward the center. The irradiation position of the pulse laser light LB.

As described above, in the tenth embodiment, in the step shown in Fig. 1(b), the start position of the spiral winding of each of the plurality of windings of the laser is changed, and at least one round is changed in the plurality of windings. And the direction of the winding of each of the plurality of times of the rotation of the laser is changed in such a manner as to change the direction of the winding of the spiral. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Embodiment 11.

Next, a laser processing method according to the eleventh embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the fifth embodiment.

In the fifth embodiment, in the step shown in Fig. 1(b), each of the plurality of windings of the laser is circular (see Figs. 7(a) to (d)), and In the eleventh embodiment, each of the plurality of windings of the laser is spiraled.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 13(a) to (d), each of the plurality of windings of the laser is wound. The direction changes in such a manner as to change the direction in which the spiral is wound, and the pitch of the spirals of the spirals of the plurality of times of the plurality of turns of the laser is changed by at least one round in the plurality of windings.

For example, in the winding process shown in Fig. 13(a), the machining position WP3 related to the radial direction emitted from the central axis CA' is taken as the starting position, and clockwise is approached from the outer side of the spiral toward the center. The irradiation position of the pulse laser light LB is shifted by the first pitch of the number of turns of the spiral of, for example, three. Next, in the winding process shown in Fig. 13(b), the pulse laser light LB is shifted counterclockwise from the outer side of the spiral toward the center and at a second pitch in which the number of turns of the spiral is, for example, two. Irradiation position. Next, in the winding process shown in FIG. 13(c), the pulsed laser light LB is shifted clockwise from the outer side of the spiral toward the center and at a second pitch in which the number of turns of the spiral is, for example, two. Irradiation position. Next, in the winding process shown in FIG. 13(d), the pulse laser light LB is shifted counterclockwise from the outer side of the spiral toward the center and at the first pitch in which the number of turns of the spiral is, for example, three. Irradiation position.

As described above, in the eleventh embodiment, in the step shown in Fig. 1(b), the respective windings of the plurality of windings of the laser are changed in such a manner as to change the winding direction of the spiral, and the laser is made. The pitch of the spirals of each of the plurality of turns is changed by at least one round in the plurality of turns. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Further, in the eleventh embodiment, the winding direction and the pitch of each of the plurality of times of the plurality of windings of the laser are changed such that the pitch and the direction of the spiral winding are different each time. Thereby, the radiation directions radiated from the central axes CA' of the reference through holes 14-1' and 14-2' can be efficiently supplied to the side faces of the reference through holes 14-1' and 14-2'. The heat input is equal.

Embodiment 12.

Next, a laser processing method according to the twelfth embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the sixth embodiment.

In the sixth embodiment, in the step shown in Fig. 1(b), each of the plurality of windings of the laser is circular (see Figs. 8(a) to (d)), and In the twelfth embodiment, each of the plurality of windings of the laser is spiral.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 14(a) to (d), each of the plurality of windings of the laser is wound. The direction is changed in such a manner as to change the direction of the winding of the spiral, and the pitch and starting position of the spiral of each of the plurality of windings of the laser are changed by at least one round in the plurality of windings.

For example, in the winding process shown in Fig. 14(a), the machining position WP3 related to the radial direction radiated from the central axis CA' is taken as the starting position, and clockwise is approached from the outer side of the spiral toward the center. The irradiation position of the pulse laser light LB is shifted by the first pitch of the number of turns of the spiral of, for example, three. Next, in the winding process shown in FIG. 14(b), the machining position WP1 related to the radiation direction radiated from the central axis CA' is the start position, and the counterclockwise direction is approached from the outer side of the spiral toward the center and The number of turns of the spiral is, for example, a second pitch of 2, which shifts the irradiation position of the pulsed laser light LB. Next, in the winding process shown in FIG. 14(c), the machining position WP4 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and clockwise is approached from the outer side of the spiral toward the center. The irradiation position of the pulse laser light LB is shifted by the second pitch of the number of turns of the spiral of, for example, two. Next, in the winding process shown in FIG. 14(d), the machining position WP2 related to the radial direction radiated from the central axis CA' is taken as the starting position, and the counterclockwise direction is approached from the outer side of the spiral toward the center. So that the number of turns of the spiral becomes the first of 3, for example The pitch shifts the irradiation position of the pulse laser light LB.

As described above, in the twelfth embodiment, in the step shown in Fig. 1(b), the winding directions of the plurality of times of the plurality of windings of the laser are changed in such a manner as to change the winding direction of the spiral, and the The pitch and starting position of each of the spiral windings of the plurality of windings of the shot are changed by at least one round in the plurality of windings. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Embodiment 13.

Next, a laser processing method according to the thirteenth embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the seventh embodiment.

In the seventh embodiment, in the step shown in Fig. 1(b), the winding direction of each winding is changed in such a manner as to change the winding direction of the spiral (refer to Fig. 9 (a) to (d)). In the thirteenth embodiment, the spiral is divided into a plurality of sections, and the spiraling section is changed.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 15(a) to (d), each of the plurality of windings of the laser is wound. The direction changes in such a manner as to change the direction of the spiral of the spiral, and divides the spiral into a plurality of intervals, and changes the interval in which the spiral is wound.

For example, in the winding process shown in Fig. 15(a), the machining position WP3 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and clockwise is approached from the outer side of the spiral toward the center and is wound. The irradiation position of the pulse laser light LB is shifted by dividing the spiral into the outer sections in the two sections. Next, in the winding process shown in Fig. 15(b), the counterclockwise is connected from the outer side of the spiral to the center. The irradiation position of the pulse laser light LB is shifted by winding the inner section of the spiral into two sections. Next, in the winding process shown in FIG. 15(c), the pulse laser light LB is moved clockwise so as to approach the center from the outer side of the spiral and to circumscribe the inner section when the spiral is divided into two sections. Irradiation position. Next, in the winding process shown in FIG. 15(d), the pulse laser light LB is moved counterclockwise so as to approach the center from the outer side of the spiral and to circumscribe the outer section when the spiral is divided into two sections. Irradiation position. Further, in the winding processing shown in Fig. 15 (b) and the winding processing shown in Fig. 15 (c), the spirally wound sections are set to be the same in order to make the winding section correspond to the winding direction of the spiral. Every time is different.

As described above, in the first embodiment, in the step shown in Fig. 1(b), the winding directions of the plurality of times of the plurality of windings of the laser are changed in such a manner as to change the winding direction of the spiral, and the spiral is changed. Divided into a plurality of intervals, and the changes are rotated. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Further, in the thirteenth embodiment, each of the plurality of windings of the plurality of windings and the winding direction of the spiral are changed such that the correspondence between the winding section and the winding direction of the spiral is different each time. Thereby, the radiation directions radiated from the central axes CA' of the reference through holes 14-1' and 14-2' can be efficiently supplied to the side faces of the reference through holes 14-1' and 14-2'. The heat input is equal.

Embodiment 14.

Next, a laser processing method according to the fourteenth embodiment will be described. Hereinafter, a description will be given focusing on a portion different from the seventh embodiment.

In the seventh embodiment, in the step shown in FIG. 1(b), the order is The winding direction of each winding is changed in such a manner as to change the winding direction of the spiral (refer to Fig. 9 (a) to (d)), and in the embodiment 14, the spiral is divided into a plurality of sections, and the change is performed by winding The interval, and the direction of advancement in the winding interval is changed without changing the winding direction of the spiral.

Specifically, in the winding variation processing in the step shown in FIG. 1(b), as shown in FIGS. 16(a) to (d), the spiral is divided into a plurality of sections, and the rotation is changed. The interval, and changes the direction of advancement within the winding interval. That is, the winding direction of each winding is changed in such a manner that the direction of advancement in the winding section is changed without changing the winding direction of the spiral.

For example, in the winding process shown in Fig. 16(a), the machining position WP3 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and clockwise is approached from the outer side of the spiral toward the center and is wound. The irradiation position of the pulse laser light LB is shifted by dividing the spiral into the outer sections in the two sections. Next, in the winding process shown in Fig. 16(b), the vicinity of the central axis CA' is used as the starting position, and the inner portion of the spiral is divided into two sections counterclockwise from the center of the spiral. The way to move the irradiation position of the pulse laser light LB. Next, in the winding process shown in FIG. 16(c), the machining position WP3 related to the radial direction radiated from the central axis CA' is taken as the starting position, and clockwise is approached from the outer side of the spiral toward the center and is wound. The irradiation position of the pulse laser light LB is shifted so that the spiral is divided into the inner sections in the two sections. Next, in the winding process shown in Fig. 16(d), the machining position WP3 related to the radiation direction radiated from the central axis CA' is taken as the starting position, and the spiral is rotated counterclockwise from the center of the spiral to the outer side. The irradiation position of the pulse laser light LB is shifted so as to be divided into the outer sections in the two sections. In addition, the winding process shown in Fig. 16(b) and the figure shown in Fig. 16(c) In the winding process, the sections to be wound are set to be the same in order to make the correspondence between the winding section and the forward direction in the winding section different each time.

As described above, in the fourteenth embodiment, in the step shown in Fig. 1(b), the winding section of each of the plurality of windings of the laser is changed, and the traveling direction in the winding section is changed. Thereby, the amount of heat input to the side faces of the reference through holes 14-1' and 14-2' can be equalized with respect to the radial direction radiated from the central axes CA' of the reference through holes 14-1' and 14-2'. .

Further, in the fourteenth embodiment, the respective winding directions in the plurality of windings of the laser and the traveling direction in the winding section are changed such that the correspondence between the winding section and the traveling direction in the winding section is different each time. Thereby, the radiation directions radiated from the central axes CA' of the reference through holes 14-1' and 14-2' can be efficiently supplied to the side faces of the reference through holes 14-1' and 14-2'. The heat input is equal.

(industrial use possibility)

As described above, the laser processing method of the present invention is very useful in the processing of through holes.

WP1 to WP4‧‧‧ processing location

Central axis of the CA’‧‧‧ benchmark through hole

Claims (9)

A laser processing method is a method in which a workpiece having an insulating layer interposed between a first conductor layer and a second conductor layer is processed by a laser through a through hole, and the method includes the following steps: forming a through hole a step of irradiating the workpiece with the laser while rotating the plurality of times from the side of the first conductor layer, and forming a through hole penetrating through the first conductor layer, the insulating layer, and the second conductor layer in sequence; a processing hole forming step of irradiating a laser beam onto the workpiece from the first conductor layer side to form a first processing hole that penetrates the first conductor layer to form the insulating layer; and a second processing hole forming step An image obtained by capturing the reference through-hole from the second conductor layer side is positioned, and the workpiece is irradiated with a laser beam from the second conductor layer side to form a through-the second conductor layer that reaches the insulating layer and communicates with the first The second processing hole of the processing hole is supplied to the side surface of the reference through hole in a radial direction of radiation from a central axis of the reference through hole in the reference through hole forming step. Equalization of the way into the heat, so that the laser multiple times in the convoluted convoluted interaction each time there is a change. The laser processing method according to claim 1, wherein in the reference through-hole forming step, the winding directions of the plurality of times of the plurality of windings of the laser are alternately changed. The laser processing method of claim 2, wherein in the reference through-hole forming step, a start position of each of the plurality of windings of the laser is performed, and at least one of the plurality of windings is changed. The laser processing method according to claim 2, wherein in the reference through-hole forming step, the pitch of each of the plurality of windings of the laser is changed by at least one round in the plurality of windings. The laser processing method of claim 3, wherein in the reference through-hole forming step, the pitch of each of the plurality of windings of the laser is changed by at least one round in the plurality of windings. The laser processing method according to claim 1, wherein in the reference through-hole forming step, a start position of each of the plurality of windings of the laser is performed, and at least one of the plurality of windings is changed. The laser processing method according to claim 1, wherein in the reference through-hole forming step, the pitch of each of the plurality of windings of the laser is changed by at least one round in the plurality of windings. The laser processing method according to claim 1, wherein in the reference through-hole forming step, the laser beam generated by the workpiece is irradiated at a constant energy density while being irradiated a plurality of times. The laser processing method of claim 8, wherein the predetermined energy density is suitable for the energy density of the processing of the first conductor layer.