CN104411447A - Laser machining method - Google Patents
Laser machining method Download PDFInfo
- Publication number
- CN104411447A CN104411447A CN201380033877.4A CN201380033877A CN104411447A CN 104411447 A CN104411447 A CN 104411447A CN 201380033877 A CN201380033877 A CN 201380033877A CN 104411447 A CN104411447 A CN 104411447A
- Authority
- CN
- China
- Prior art keywords
- laser
- hole
- benchmark
- multiple rotary
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The laser machining method for machining through holes with a laser in a workpiece in which an insulating layer is sandwiched between a first conductor layer and a second conductor layer is provided with: a reference through hole-forming process for irradiating a laser on the workpiece from the first conductor layer side while circling the laser multiple times to form a reference through hole that pierces the first conductor layer, the insulating layer and the second conductor layer in order; a first machine hole-forming process for irradiating the laser on the workpiece from the first conductor layer side to form a first machine hole that pierces the first conductor layer and reaches the insulating layer; and a second machine hole-forming process for positioning the reference through hole using an image taken from the second conductor layer side and irradiating the laser on the workpiece from the second conductor layer side to form a second machine hole that pierces the second conductor layer and reaches the insulating layer and also communicates with the first machine hole. In the reference through hole-forming process, the various circlings in the multiple circlings of the laser are made to differ from each other so that the amount of heat input into the side surface of the reference through hole in the radial direction from the central axis of the reference through hole is uniform.
Description
Technical field
The present invention relates to a kind of laser processing.
Background technology
In patent document 1, record following technology, that is, be laminated with on the printed wiring board of metal forming the two-sided of insulated substrate, use laser to form the hole running through printed wiring board.Specifically, laser is used to offer the calibration hole running through printed wiring board, utilize ccd video camera to take locating hole, and determine the irradiation position of laser according to the position of the calibration hole photographed, the hole that this irradiation position irradiation laser is formed to till the midway of printed wiring board.Then, upset printed wiring board, determines the irradiation position of laser using calibration hole as benchmark, irradiate laser, and the hole be formed to till above-mentioned midway is run through to this irradiation position.Thus, according to patent document 1, form hole, therefore, it is possible to form hole roughly straight when observing section owing to irradiating laser from the both sides of printed wiring board.
In patent document 2, record for the two-sided double-sided substrate that there is metal forming at insulating barrier, use laser and carry out the technology of through hole processing.Specifically, made at double-sided substrate by the cover hole machined of laser and run through datum hole, to the table surface irradiation laser of double-sided substrate, and the metal forming on surface runs through by making, stops the midway machining hole of processing in the midway of insulating barrier.Then, surface substrate is overturn, utilizing video camera to identify running through datum hole, carrying out the irradiation of laser with the coordinate coordinated, make the machining hole of rear side.Thus, according to patent document 2, be connected while the machining hole offered from surface and the machining hole zero deflection offered from rear side can be made.
Patent document 1: Japanese Unexamined Patent Publication 2004-335655 publication
Patent document 2: Japanese Unexamined Patent Publication 2009-252892 publication
Summary of the invention
In patent document 1, the concrete method using laser to offer calibration hole is not recorded completely, for the process time how shortening calibration hole (benchmark through hole), and the inclination of the central axis of calibration hole (benchmark through hole) how is suppressed also not recorded completely.
In patent document 2, record to be made by the cover hole machined of laser and run through datum hole, but its process time is not recorded completely, for how shortening the process time of running through datum hole (benchmark through hole), and the inclination of the central axis running through datum hole (benchmark through hole) how is suppressed also not recorded completely.
The present invention proposes in view of foregoing, its object is to obtain a kind of process time that can shorten benchmark through hole, and can suppress the laser processing of the inclination of the central axis of benchmark through hole.
In order to solve above-mentioned problem, achieve the goal, the laser processing that a technical scheme of the present invention relates to utilizes laser to carry out the laser processing of the processing of through hole to the machined object accompanying insulating barrier between the 1st conductor layer and the 2nd conductor layer, the feature of this laser processing is, there is following operation: benchmark through hole formation process, in this operation, for described machined object, make laser multiple rotary from described 1st conductor layer side and irradiate, formed and run through described 1st conductor layer successively, described insulating barrier, and the benchmark through hole of described 2nd conductor layer, 1st machining hole formation process, in this operation, for described machined object, irradiate laser from described 1st conductor layer side, formation runs through described 1st conductor layer and arrives the 1st machining hole of described insulating barrier, and the 2nd machining hole formation process, in this operation, the image that use is taken described benchmark through hole from described 2nd conductor layer side and obtained positions, for described machined object, laser is irradiated from described 2nd conductor layer side, formed and run through described 2nd conductor layer and arrive described insulating barrier and the 2nd machining hole be communicated with described 1st machining hole, in described benchmark through hole formation process, in order to the radiation direction the central axis from described benchmark through hole makes to become even to the heat input of the side of described benchmark through hole, each rotation in the multiple rotary of laser is changed each other.
The effect of invention
According to the present invention, when carrying out rotation with the processing conditions high with common processing conditions phase specific energy density and processing, the inclination of the central axis of benchmark through hole can be suppressed.That is, the process time of benchmark through hole can be shortened, and the inclination of the central axis of benchmark through hole can be suppressed.
Accompanying drawing explanation
Fig. 1 is the figure representing the laser processing that embodiment 1 relates to.
Fig. 2 is the figure of the laser processing representing embodiment 1.
Fig. 3 is the microphotograph in the cross section representing the sample that the laser processing related to by embodiment 1 is obtained.
Fig. 4 is the figure representing the laser processing that embodiment 2 relates to.
Fig. 5 is the figure representing the laser processing that embodiment 3 relates to.
Fig. 6 is the figure representing the laser processing that embodiment 4 relates to.
Fig. 7 is the figure representing the laser processing that embodiment 5 relates to.
Fig. 8 is the figure representing the laser processing that embodiment 6 relates to.
Fig. 9 is the figure representing the laser processing that embodiment 7 relates to.
Figure 10 is the figure representing the laser processing that embodiment 8 relates to.
Figure 11 is the figure representing the laser processing that embodiment 9 relates to.
Figure 12 is the figure representing the laser processing that embodiment 10 relates to.
Figure 13 is the figure representing the laser processing that embodiment 11 relates to.
Figure 14 is the figure representing the laser processing that embodiment 12 relates to.
Figure 15 is the figure representing the laser processing that embodiment 13 relates to.
Figure 16 is the figure representing the laser processing that embodiment 14 relates to.
Figure 17 is the figure representing the laser processing that basic mode relates to.
Figure 18 is the figure of the structure of the laser processing device representing basic mode.
Figure 19 is the figure of the laser processing representing basic mode.
Figure 20 is the microphotograph in the cross section representing the sample that the laser processing related to by basic mode is obtained.
Detailed description of the invention
Below, the embodiment of the laser processing that the present invention relates to is described in detail based on accompanying drawing.In addition, the present invention is not limited to present embodiment.
Embodiment 1
Before the laser processing related to embodiment 1 is described, with Figure 17, the laser processing that basic mode relates to is described.Figure 17 (a) ~ (d) is the operation sectional view representing the laser processing that basic mode relates to.
In the operation shown in Figure 17 (a), prepare machined object 10.Machined object 10 is such as printed wiring board as shown in Figure 17 (a), and this printed wiring board has the 3 layers of structure accompanying insulating barrier 13 between the 1st conductor layer 11 and the 2nd conductor layer 12.1st conductor layer 11 is such as Copper Foil.2nd conductor layer 12 is such as Copper Foil.Insulating barrier 13 is such as resin bed, such as, formed by using epoxy resin or the polyimide resin material as principal component.
Now, such as, 40 pairs, the machining control portion jig plate 58 of laser processing device 1 as shown in figure 18 controls, and via jig plate 58, machined object 10 vacuum suction is fixed on processing work platform 55.
In the operation shown in Figure 17 (b), to machined object 10 from the 1st conductor layer 11 side irradiated with pulse laser, and form benchmark through hole 14-1,14-2.Benchmark through hole 14-1,14-2 from the 2nd conductor layer 12 side to machined object 10 add man-hour (with reference to Figure 17 (d)) become benchmark.
Now, such as, the laser oscillator 2 of laser processing device 1 shown in Figure 18 produces pulse laser LB and exports to Laser Processing portion 50.Laser Processing portion 50 of 40 pairs, machining control portion controls, and controls the irradiation position of the pulse laser LB to machined object 10 in Laser Processing portion 50.Such as, machining control portion 40 is by controlling the angle of scanning reflection mirror 52Y via electrical scanner 53Y, and the activation point of the Y-direction of processing work platform 55 is controlled, thus the Building Y mark of the pulse laser LB reflected by scanning reflection mirror 52Y on machined object 10 is controlled.Machining control portion 40 is by controlling the angle of scanning reflection mirror 52X via electrical scanner 53X, and the activation point of the X-direction of processing work platform 55 is controlled, thus the Building X mark of the pulse laser LB reflected by scanning reflection mirror 52X on machined object 10 is controlled.Thus, the pulse laser LB reflected by scanning reflection mirror 52Y, scanning reflection mirror 52X is the controlled coordinate position of optically focused on machined object 10 by f θ lens 54, forms benchmark through hole 14-1,14-2.In addition, machining control portion 40 stores the coordinate position after this control.The coordinate position stored is such as the center CP1 of the benchmark through hole 14-1 shown in Figure 17 (b) in the openend of the 1st conductor layer 11 side.
In the operation shown in Figure 17 (c), under the state that the location dimension of machined object 10 is held in the position in the operation shown in Figure 17 (b), from the 1st conductor layer 11 side, laser is irradiated to machined object 10, and forms the 1st machining hole 15-1 ~ 15-3.1st machining hole 15-1 ~ 15-3 is the hole run through the 1st conductor layer 11 and arrive insulating barrier 13.
The laser oscillator 2 of such as, laser processing device 1 now, shown in Figure 18 produces pulse laser LB and exports to Laser Processing portion 50.Laser Processing portion 50 of 40 pairs, machining control portion controls, and controls the irradiation position of the pulse laser LB to machined object 10 in Laser Processing portion 50.Thus, the pulse laser LB reflected by scanning reflection mirror 52Y, scanning reflection mirror 52X is the controlled coordinate position of optically focused on machined object 10 by f θ lens 54, forms the 1st machining hole 15-1 ~ 15-3.In addition, machining control portion 40 stores the coordinate position after this control, and calculates the relational coordinate relative to benchmark through hole 14-1,14-2.The coordinate position stored is such as the center CP3 of the 1st machining hole 15-1 shown in Figure 17 (c) in the openend of the 1st conductor layer 11 side.In addition, the relational coordinate calculated such as, with the center CP1 of the openend of the benchmark through hole 14-1 shown in Figure 17 (c) be benchmark, the relational coordinate P15 of the center CP3 of the openend of the 1st machining hole 15-1.
In the operation shown in Figure 17 (d), from the 2nd conductor layer 12 side, benchmark through hole 14-1,14-2 are taken, use and take the location that the image obtained carries out Working position.Then, from the 2nd conductor layer 12 side, laser is irradiated to machined object 10, and forms the 2nd machining hole 16-1 ~ 16-3.2nd machining hole 16-1 ~ 16-3 runs through the 2nd conductor layer 12, and arrives insulating barrier 13.
Now, such as, 40 pairs, the machining control portion conveying mechanism 21 of the laser processing device 1 shown in Figure 18 controls, and machined object 10 is delivered to switching mechanism 30, switching mechanism 30 is controlled, and machined object 10 is overturn, conveying mechanism 22 is controlled, and the machined object after upset 10 is turned back on processing work platform 55.40 pairs, machining control portion jig plate 58 controls, thus via jig plate 58, machined object 10 vacuum suction is fixed on processing work platform 55.And 40 pairs, machining control portion video camera 51 (such as, ccd image sensor, cmos image sensor) controls, and takes from the 2nd conductor layer 12 side benchmark through hole 14-1,14-2, obtain the image taken and obtain from video camera 51.Machining control portion 40 carries out the image procossing such as rim detection to taking the image obtained, such as, benchmark through hole 14-1 shown in Figure 17 (b) is identified as collimating marks AM at the pattern image of the openend of the 1st conductor layer 11 side, obtains the center CP2 of collimating marks AM.Machining control portion 40, using the center CP2 of collimating marks AM as benchmark, such as, obtains Working position CP1 according to the relative position P16 corresponding with above-mentioned relational coordinate P15.Then, Laser Processing portion 50 of 40 pairs, machining control portion controls, and the irradiation position of the pulse laser LB to machined object 10 in Laser Processing portion 50 is such as controlled to Working position CP1.Thus, by the coordinate position that the pulse laser LB that scanning reflection mirror 52Y, scanning reflection mirror 52X reflect is condensed to after the control on machined object 10 by f θ lens 54, form the 2nd machining hole 16-1 ~ 16-3.
Herein, suppose to consider following situation, that is: by the same position in the 1st conductor layer 11 repeatedly irradiated with pulse laser LB perforation processing and carry out the formation of benchmark through hole 14-1, the 14-2 in the operation shown in Figure 17 (b).In this case, along with the surperficial 11a from the 1st conductor layer 11 deepens, due to the scattering etc. at the side place in hole, pulse laser LB is difficult to arrive depths, therefore there is the tendency diminished in the diameter of benchmark through hole 14-1,14-2, and benchmark through hole 14-1,14-2 likely cannot be made to be through to the 2nd conductor layer 12 side.If benchmark through hole 14-1,14-2 can not be made to extend through the 2nd conductor layer 12 side, then, in the operation shown in Figure 17 (d), image recognition cannot be carried out to collimating marks AM.
In addition, suppose that namely allowing to benchmark through hole 14-1,14-2 is through to the 2nd conductor layer 12 side, the diameter D14 of the 2nd conductor layer 12 side of benchmark through hole 14-1,14-2 diminishes as the possibility of the part left and right of the beam diameter (such as, 20 ~ 30 μm) of pulse laser LB is higher.If the diameter D14 of benchmark through hole 14-1,14-2 diminishes as the part left and right of the beam diameter of pulse laser LB, then in the operation shown in Figure 17 (d), error when carrying out image recognition as collimating marks AM easily exceedes permissible range and becomes large, and the error of the identified position and physical location that there is the center CP2 of collimating marks AM exceedes permissible range and becomes large tendency.
On the other hand, the present inventor is in order to be formed as comparatively greatly (such as by the diameter D14 of benchmark through hole 14-1,14-2,500 μm ~ 1000 μm), consider the formation carrying out benchmark through hole 14-1,14-2 in the operation shown in Figure 17 (b) with the cover hole machined of common processing conditions.
Specifically, in the operation shown in Figure 17 (b), as shown in Figure 19 (a), carry out the circle-shaped processing irradiation position of pulse laser LB being made large diameter benchmark through hole 14-1,14-2 with circle-shaped moving.And, as shown in Figure 19 (b) ~ Figure 19 (d), repeatedly repeat the processing identical with the circle-shaped processing shown in Figure 19 (a).Now, under common processing conditions, until run through the 1st conductor layer 11, the pulse laser LB produced with the high-energy-density of the 1st conductor layer 11 (such as copper) is utilized to process, when insulating barrier 13 exposes, laser oscillator 2 is controlled the low energy densities for being reduced to insulating barrier 13 (such as resin), and utilize the pulse laser LB produced with this low energy densities to process, when the 2nd conductor layer 12 exposes, again laser oscillator 2 is controlled the high-energy-density for being increased to the 2nd conductor layer 12 (such as copper), and utilize the pulse laser LB produced with this high-energy-density to process.Thus, as shown in Figure 17 (b), the diameter D14a of the 1st conductor layer 11 side of the diameter D14 of the 2nd conductor layer 12 side of benchmark through hole 14-1,14-2 and benchmark through hole 14-1,14-2 to same extent can be formed as comparatively large (such as, 500 μm ~ 1000 μm).
But, in the cover hole machined of common processing conditions, need to the beam diameter relative to pulse laser LB (such as, 20 ~ 30 μm) very large region is (such as, the border circular areas that diameter is 500 μm ~ 1000 μm) process, therefore exceed permissible range and become very long process time, having and be difficult to practical tendency.
On the other hand, the present inventor considers the cover hole machined carrying out the operation shown in Figure 17 (b) under the processing conditions high with common processing conditions phase specific energy density.
Specifically, laser oscillator 2 is controlled into maintenance the 1st conductor layer 11 (such as, copper) higher constant energy density, and utilize the circle-shaped processing that the pulse laser LB produced with this constant energy density carries out for many times as shown in Figure 19 (a) ~ Figure 19 (d).Thereby, it is possible to will be limited in permissible range process time.
But, the present inventor finds problem new described as follows, that is: owing to carrying out cover hole machined with the processing conditions high with common processing conditions phase specific energy density, therefore obviously produce the inclination of central axis relative to the normal of the surperficial 11a of the 1st conductive layer 11 of benchmark through hole, and there is the tendency that this impact increases to the degree that cannot ignore.In addition, the present inventor also finds, machined object 10 is thicker, and this tendency becomes more obvious.
Such as, as shown in Figure 17 (b), if the central axis of benchmark through hole 14-1 is greater than setting relative to the tilt angle theta of the normal PL of the surperficial 11a of the 1st conductive layer 11, then exceedes permissible range from the error E R of distance, i.e. center the center CP2 of the 2nd conductor layer 12 side of the normal PL to benchmark through hole 14-1 of the center CP1 of the 1st conductor layer 11 side by benchmark through hole 14-1 and become large.Its result, bit errors between the relative position P16 that the relative position P15 and Figure 17 (d) that Figure 17 (c) illustrates illustrates becomes the larger value corresponding with the error E R of center, as shown in Figure 17 (d), the possibility being difficult to the 2nd machining hole 16-1 ~ 16-3 and the 1st corresponding machining hole 15-1 ~ 15-3 are communicated with is larger.That is, be difficult to benchmark through hole 14-1,14-2 for benchmark, the possibility forming the processing through hole that the 1st machining hole 15-1 ~ 15-3 is communicated with the 2nd machining hole 16-1 ~ 16-3 is larger.
About this point, the present inventor's actual fabrication sample is also tested, and confirms as shown in the dotted line in the microphotograph of Figure 20, the obvious run-off the straight of central axis of benchmark through hole.
The reason of the present inventor to the obviously inclination of the central axis of generation benchmark through hole is investigated.Its result, think: in the cover hole machined of benchmark through hole 14-1,14-2, due to the mechanical property of laser processing device 1 deviation etc. and there is the inhomogeneities of the heat input of the side to benchmark through hole 14-1,14-2 potentially, but owing to carrying out cover hole machined (the 1st essential factor) with the processing conditions high with common processing conditions phase specific energy density, and the circle-shaped processing (the 2nd essential factor) repeatedly repeated in an identical manner as shown in Figure 19 (a) ~ Figure 19 (d), be thus exaggerated this inhomogeneities.
Now, suppose that then as mentioned above, process time exceeds permissible range and becomes very long, has and is difficult to practical tendency if energy density is reduced to the degree of common processing conditions to improve the 1st essential factor.
Therefore, in embodiment 1, in order to the radiation direction the central axis from benchmark through hole, the heat input to the side of benchmark through hole is made to become even, by carrying out the special processing (following, to distinguish to process with above-mentioned trepanning, being called and rotating variation processing) making each rotation in the multiple rotary of laser change each other, while its object is to the maintenance processing conditions high with common processing conditions phase specific energy density, the 2nd essential factor is improved.Below, be described centered by the part different from the laser processing that basic mode relates to.
Specifically, in the operation shown in Fig. 1 (a), after preparing the machined object 10 same with the operation shown in Figure 17 (a), in the operation shown in Fig. 1 (b), machined object 10 is made laser multiple rotary from the 1st conductor layer 11 side and irradiated, and forms benchmark through hole 14-1 ', 14-2 '.That is, benchmark through hole 14-1 ', 14-2 ' is formed relative to machined object 10 from the 1st conductor layer 11 side by rotating variation processing.
In rotation variation processing, in order to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ', make the heat input of the side to benchmark through hole 14-1 ', 14-2 ' become even, each rotation in the multiple rotary of laser is changed each other.Such as, in rotation variation processing, as shown in Fig. 2 (a) ~ (d), make each the direction of rotation alternately change in the multiple rotary of laser.
Such as, in the rotation processing shown in Fig. 2 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving clockwise.Then, in the rotation processing shown in Fig. 2 (b), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving counterclockwise.Then, in the rotation processing shown in Fig. 2 (c), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving clockwise.Then, in the rotation processing shown in Fig. 2 (d), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving counterclockwise.
Such as, consider following situation, that is: due to the deviation etc. of the mechanical property of laser processing device 1, in each rotation processing, being LQ1 at the heat input of the position that have rotated 1/4, is LQ2 at the heat input of the position that have rotated 3/4.In this case, in the rotation variation processing shown in Fig. 2 (a) ~ (d), the heat input WPQ1 of the Working position WP1 in the radiation direction from central axis CA ' is represented by following formula 1.
WPQ1=LQ1+LQ2+LQ1+LQ2=2 (LQ1+LQ2) ... formula 1
In addition, in the rotation variation processing shown in Fig. 2 (a) ~ (d), the heat input WPQ2 of the Working position WP2 in the radiation direction from central axis CA ' is represented by following formula 2.
WPQ2=LQ2+LQ1+LQ2+LQ1=2 (LQ1+LQ2) ... formula 2
Through type 1 and formula 2 derive following formula 3.
WPQ1=WPQ2 ... formula 3
Through type 3 is known, can make the heat input WPQ1 of the Working position WP1 in the radiation direction from central axis CA ' and equal to the heat input WPQ2 of the Working position WP2 in the radiation direction from central axis CA '.
In the operation shown in Fig. 1 (b), by carrying out the rotation variation processing as shown in Fig. 2 (a) ~ (d), the central axis CA ' of benchmark through hole 14-1 ' can be made to be less than setting relative to the tilt angle theta of the normal PL of the surperficial 11a of the 1st conductive layer 11, can by the distance the center CP2 ' of the 2nd conductor layer 12 side of the normal PL to benchmark through hole 14-1 ' of the center CP1 ' from the 1st conductor layer 11 side by benchmark through hole 14-1 ', namely the error E R (with reference to Figure 17 (b)) of center suppresses in permissible range.Its result, in the relative position P15 ' shown in Fig. 1 (c) and the bit errors between the relative position P16 ' shown in Fig. 1 (d) (namely, bit errors between center CP3 ' and Working position CP4 ') become the less value corresponding with the error E R of center, as shown in Fig. 1 (d), correctly can locate the such as Working position CP4 ' of the 2nd machining hole 16-1 ' ~ 16-3 ', easily make the 2nd machining hole 16-1 ' ~ 16-3 ' be communicated with the 1st corresponding machining hole 15-1 ' ~ 15-3 '.That is, using benchmark through hole 14-1 ', 14-2 ' as benchmark, the processing through hole that the 1st machining hole 15-1 ' ~ 15-3 ' is communicated with the 2nd machining hole 16-1 ' ~ 16-3 ' is easily formed.
About this point, the present inventor makes sample practically and tests, and confirms as shown in the dotted line in the microphotograph of Fig. 3, the inclination of the central axis of benchmark through hole can be suppressed in permissible range.
As previously discussed, in embodiment 1, in the operation shown in Fig. 1 (b), in order in the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ', make the heat input of the side to benchmark through hole 14-1 ', 14-2 ' become even, each rotation in the multiple rotary of laser is changed each other.Thus, when carrying out rotation with the processing conditions high with common processing conditions phase specific energy density and processing, the inclination of the central axis CA ' of benchmark through hole 14-1 ', 14-2 ' can be suppressed.That is, the process time of benchmark through hole 14-1 ', 14-2 ' can be shortened, and suppress the inclination of the central axis CA ' of benchmark through hole 14-1 ', 14-2 '.
In addition, in embodiment 1, in the operation shown in Fig. 1 (b), each the direction of rotation alternately change in the multiple rotary of laser is made.Thereby, it is possible in radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ', make the heat input of the side to benchmark through hole 14-1 ', 14-2 ' become even.
In addition, in embodiment 1, in the operation shown in Fig. 1 (b), make with the laser multiple rotary of constant energy density generation relative to machined object 10 and irradiate.This constant energy density is the energy density being suitable for processing the 1st conductor layer 11.Thereby, it is possible to the process time in the operation shown in Fig. 1 (b) is limited in permissible range.
Embodiment 2
Below, the laser processing that embodiment 2 relates to is described.Following, be described centered by the part different from embodiment 1.
In embodiment 1, in the operation shown in Fig. 1 (b), make each direction of rotation change (with reference to Fig. 2 (a) ~ (d)) in the multiple rotary of laser, but in embodiment 2, make the starting position change rotated for each time in the multiple rotary of laser.
Specifically, in the rotation variation processing of the operation shown in Fig. 1 (b), as shown in Fig. 4 (a) ~ (d), the starting position rotated for each time in the multiple rotary of laser is changed in the mode that at least samsara one is enclosed in this multiple rotary.
Such as, in the rotation processing shown in Fig. 4 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving clockwise.Then, in the rotation processing shown in Fig. 4 (b), using the Working position WP1 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving clockwise.Then, in the rotation processing shown in Fig. 4 (c), using the Working position WP4 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving clockwise.Then, in the rotation processing shown in Fig. 4 (d), using the Working position WP2 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving clockwise.
As mentioned above, in embodiment 2, in the operation shown in Fig. 1 (b), the starting position rotated for each time in the multiple rotary of laser is changed in the mode that at least samsara one is enclosed in this multiple rotary.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
Embodiment 3
Below, the laser processing that embodiment 3 relates to is described.Following, be described centered by the part different from embodiment 1.
In embodiment 1, in the operation shown in Fig. 1 (b), make each direction of rotation change (with reference to Fig. 2 (a) ~ (d)) in the multiple rotary of laser, but in embodiment 3, make the spacing change rotated for each time in the multiple rotary of laser.
Specifically, in the rotation variation processing of the operation shown in Fig. 1 (b), as shown in Fig. 5 (a) ~ (d), make the spacing that rotates for each time in the multiple rotary of laser with in this multiple rotary at least samsara mode once change.The spacing rotated such as with the irradiation position of pulse laser LB to move spacing corresponding.
Such as, in the rotation processing shown in Fig. 5 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, the irradiation position of pulse laser LB is made with the 1st spacing by moving clockwise.Then, in the rotation processing shown in Fig. 5 (b), the irradiation position of pulse laser LB is moved with the 2nd spacing more closely spaced than the 1st.Then, in the rotation processing shown in Fig. 5 (c), the irradiation position of pulse laser LB is moved with the 1st spacing.Then, in the rotation processing shown in Fig. 5 (d), the irradiation position of pulse laser LB is moved with the 2nd spacing.In addition, the radial line shown in Fig. 5 (a) ~ (d) illustrates such as corresponding with 3 pulsion phases of pulse laser LB spacing illustratively.In addition, in Fig. 5 (a) ~ (d), illustrate illustratively and rotate in processing at 4 times, the situation of the change samsara secondary of spacing.
As mentioned above, in embodiment 3, in the operation shown in Fig. 1 (b), make the spacing rotated for each time in the multiple rotary of laser, with in this multiple rotary at least samsara mode once change.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
Embodiment 4
Below, the laser processing that embodiment 2 relates to is described.Following, be described centered by the part different from embodiment 2.
In embodiment 2, in the operation shown in Fig. 1 (b), make the starting position change (with reference to Fig. 4 (a) ~ (d)) rotated for each time in the multiple rotary of laser, but in embodiment 4, also make each direction of rotation change in the multiple rotary of laser.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Fig. 6 (a) ~ (d), make the starting position rotated for each time in the multiple rotary of laser, change in the mode that at least samsara one is enclosed in this multiple rotary, and make each the direction of rotation alternately change in the multiple rotary of laser.
Such as, in the rotation processing shown in Fig. 6 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving clockwise.Then, in the rotation processing shown in Fig. 6 (b), using the Working position WP1 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving counterclockwise.Then, in the rotation processing shown in Fig. 6 (c), using the Working position WP4 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving clockwise.Then, in the rotation processing shown in Fig. 6 (d), using the Working position WP2 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB by moving counterclockwise.
As mentioned above, in embodiment 2, in the operation shown in Fig. 1 (b), make the starting position rotated for each time in the multiple rotary of laser, change in the mode that at least samsara one is enclosed in this multiple rotary, and make each the direction of rotation alternately change in the multiple rotary of laser.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
Embodiment 5
Below, the laser processing that embodiment 5 relates to is described.Following, be described centered by the part different from embodiment 1.
In embodiment 1, in the operation shown in Fig. 1 (b), make each direction of rotation change (with reference to Fig. 2 (a) ~ (d)) in the multiple rotary of laser, but in embodiment 5, also make the spacing change rotated for each time in the multiple rotary of laser.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Fig. 7 (a) ~ (d), make the alternately change of each direction of rotation in the multiple rotary of laser, and make the spacing that rotates for each time in the multiple rotary of laser with in this multiple rotary at least samsara mode once change.The spacing rotated such as with the irradiation position of pulse laser LB to move spacing corresponding.
Such as, in the rotation processing shown in Fig. 7 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, the irradiation position of pulse laser LB is made with the 1st spacing by moving clockwise.Then, in the rotation processing shown in Fig. 7 (b), the irradiation position of pulse laser LB is made with 2nd spacing more closely spaced than the 1st by moving counterclockwise.Then, in the rotation processing shown in Fig. 7 (c), the irradiation position of pulse laser LB is made with the 2nd spacing by moving clockwise.Then, in the rotation processing shown in Fig. 7 (d), the irradiation position of pulse laser LB is made with the 1st spacing by moving counterclockwise.In addition, in the rotation processing shown in the rotation processing shown in Fig. 7 (b) and Fig. 7 (c), spacing be set to identical, this is due to the correspondence of spacing and direction of rotation will be made different in each rotation.
As mentioned above, in embodiment 5, in the operation shown in Fig. 1 (b), make the alternately change of each direction of rotation in the multiple rotary of laser, and make the spacing that rotates for each time in the multiple rotary of laser with in this multiple rotary at least samsara mode once change.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
In addition, in embodiment 5, in the mode that the correspondence of spacing and direction of rotation is different in each rotation, each direction of rotation in the multiple rotary of laser and spacing change is made.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes the heat input to the side of benchmark through hole 14-1 ', 14-2 ' effectively become even.
Embodiment 6
Below, the laser processing that embodiment 6 relates to is described.Following, be described centered by the part different from embodiment 5.
In embodiment 5, in the operation shown in Fig. 1 (b), make each direction of rotation in the multiple rotary of laser and spacing change (with reference to Fig. 7 (a) ~ (d)), but in embodiment 6, also make the starting position change rotated for each time in the multiple rotary of laser.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Fig. 8 (a) ~ (d), make the alternately change of each direction of rotation in the multiple rotary of laser, and make the spacing that rotates for each time in the multiple rotary of laser and starting position with in this multiple rotary at least the mode of samsara one circle change.The spacing rotated such as with the irradiation position of pulse laser LB to move spacing corresponding.
Such as, in the rotation processing shown in Fig. 8 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is made with the 1st spacing by moving clockwise.Then, in the rotation processing shown in Fig. 8 (b), using the Working position WP1 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is made with the 2nd spacing by moving counterclockwise.Then, in the rotation processing shown in Fig. 8 (c), using the Working position WP4 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is made with the 2nd spacing by moving clockwise.Then, in the rotation processing shown in Fig. 8 (d), using the Working position WP2 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is made with the 1st spacing by moving counterclockwise.
As mentioned above, in embodiment 6, in the operation shown in Fig. 1 (b), make the alternately change of each direction of rotation in the multiple rotary of laser, and make the spacing that rotates for each time in the multiple rotary of laser and starting position with in this multiple rotary at least the mode of samsara one circle change.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
Embodiment 7
Below, the laser processing that embodiment 7 relates to is described.Following, be described centered by the part different from embodiment 1.
In embodiment 1, in the operation shown in Fig. 1 (b), rotating for each time in the multiple rotary of laser is round shape (with reference to Fig. 2 (a) ~ (d)), but in embodiment 7, the rotation rotated for each time in the multiple rotary of laser is helical form.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Fig. 9 (a) ~ (d), the mode that the direction of rotation rotated for each time in the multiple rotary of laser is changed with the coiling direction of spiral changes.
Such as, in the rotation processing shown in Fig. 9 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is moved in the clockwise mode close from the center, lateral of spiral.Then, in the rotation processing shown in Fig. 9 (b), the irradiation position of pulse laser LB is moved in the counterclockwise mode close from the center, lateral of spiral.Then, in the rotation processing shown in Fig. 9 (c), the irradiation position of pulse laser LB is moved in the clockwise mode close from the center, lateral of spiral.Then, in the rotation processing shown in Fig. 9 (d), the irradiation position of pulse laser LB is moved in the counterclockwise mode close from the center, lateral of spiral.
As mentioned above, in embodiment 7, in the operation shown in Fig. 1 (b), the mode that the direction of rotation rotated for each time in the multiple rotary of laser is changed with the coiling direction of spiral changes.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
Embodiment 8
Below, the laser processing that embodiment 8 relates to is described.Following, be described centered by the part different from embodiment 2.
In embodiment 2, in the operation shown in Fig. 1 (b), rotating for each time in the multiple rotary of laser is round shape (with reference to Fig. 4 (a) ~ (d)), but in embodiment 8, the rotation rotated for each time in the multiple rotary of laser is helical form.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Figure 10 (a) ~ (d), the starting position that each helical form in the multiple rotary of laser is rotated changes in the mode that at least samsara one is enclosed in this multiple rotary.
Such as, in the rotation processing shown in Figure 10 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is moved in the clockwise mode close from the center, lateral of spiral.Then, in the rotation processing shown in Figure 10 (b), using the Working position WP1 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is moved in the clockwise mode close from the center, lateral of spiral.Then, in the rotation processing shown in Figure 10 (c), using the Working position WP4 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is moved in the clockwise mode close from the center, lateral of spiral.Then, in the rotation processing shown in Figure 10 (d), using the Working position WP2 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is moved in the clockwise mode close from the center, lateral of spiral.
As mentioned above, in embodiment 8, in the operation shown in Fig. 1 (b), the starting position that each helical form in the multiple rotary of laser is rotated changes in the mode that at least samsara one is enclosed in this multiple rotary.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
Embodiment 9
Below, the laser processing that embodiment 9 relates to is described.Following, be described centered by the part different from embodiment 3.
In embodiment 3, in the operation shown in Fig. 1 (b), rotating for each time in the multiple rotary of laser is round shape (with reference to Fig. 5 (a) ~ (d)), but in embodiment 9, the rotation rotated for each time in the multiple rotary of laser is helical form.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Figure 11 (a) ~ (d), the spacing that each helical form in the multiple rotary of laser is rotated with in this multiple rotary at least samsara mode once change.That is, the mode making each time in the multiple rotary of laser rotation change with the winding number of spiral changes.
Such as, in the rotation processing shown in Figure 11 (a), by the Working position WP3 in the radiation direction from central axis CA ' as starting position, with the 1st spacing, the irradiation position of pulse laser LB is moved in the mode making the winding number of spiral such as become 3 by clockwise.Then, in the rotation processing shown in Figure 11 (b), with the 2nd spacing, the irradiation position of pulse laser LB is moved in the mode making the winding number of spiral such as become 2.Then, in the rotation processing shown in Figure 11 (c), with the 1st spacing, the irradiation position of pulse laser LB is moved in the mode making the winding number of spiral such as become 3.Then, in the rotation processing shown in Figure 11 (d), with the 2nd spacing, the irradiation position of pulse laser LB is moved to make the mode such as becoming 2 at the winding number of spiral.
As mentioned above, in embodiment 9, in the operation shown in Fig. 1 (b), the mode that each time in the multiple rotary of laser rotation is changed with the winding number of spiral changes.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
Embodiment 10
Below, the laser processing that embodiment 10 relates to is described.Following, be described centered by the part different from embodiment 4.
In embodiment 4, in the operation shown in Fig. 1 (b), rotating for each time in the multiple rotary of laser is round shape (with reference to Fig. 6 (a) ~ (d)), but in embodiment 10, the rotation rotated for each time in the multiple rotary of laser is helical form.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Figure 12 (a) ~ (d), the starting position that each helical form in the multiple rotary of laser is rotated changes in the mode that at least samsara one is enclosed in this multiple rotary, further, the mode making each direction of rotation in the multiple rotary of laser change with the coiling direction of spiral changes.
Such as, in the rotation processing shown in Figure 12 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is moved in the clockwise mode close from the center, lateral of spiral.Then, in the rotation processing shown in Figure 12 (b), using the Working position WP1 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is moved in the counterclockwise mode close from the center, lateral of spiral.Then, in the rotation processing shown in Figure 12 (c), using the Working position WP4 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is moved in the clockwise mode close from the center, lateral of spiral.Then, in the rotation processing shown in Figure 12 (d), using the Working position WP2 in the radiation direction from central axis CA ' as starting position, and the irradiation position of pulse laser LB is moved in the counterclockwise mode close from the center, lateral of spiral.
As mentioned above, in embodiment 10, in the operation shown in Fig. 1 (b), the starting position that each helical form in the multiple rotary of laser is rotated changes in the mode that at least samsara one is enclosed in this multiple rotary, further, the mode making each direction of rotation in the multiple rotary of laser change with the coiling direction of spiral changes.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
Embodiment 11
Below, the laser processing that embodiment 11 relates to is described.Following, be described centered by the part different from embodiment 5.
In embodiment 5, in the operation shown in Fig. 1 (b), rotating for each time in the multiple rotary of laser is round shape (with reference to Fig. 7 (a) ~ (d)), but in embodiment 11, the rotation rotated for each time in the multiple rotary of laser is helical form.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Figure 13 (a) ~ (d), the mode that each direction of rotation in the multiple rotary of laser is changed with the coiling direction of spiral changes, and the spacing that each helical form in the multiple rotary of laser is rotated with in this multiple rotary at least samsara mode once change.
Such as, in the rotation processing shown in Figure 13 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB, in the clockwise mode close from the center, lateral of spiral, and move with the 1st spacing in the mode making the winding number of spiral such as become 3.Then, in the rotation processing shown in Figure 13 (b), make the irradiation position of pulse laser LB, in the counterclockwise mode close from the center, lateral of spiral, and move with the 2nd spacing in the mode making the winding number of spiral such as become 2.Then, in the rotation processing shown in Figure 13 (c), make the irradiation position of pulse laser LB, in the clockwise mode close from the center, lateral of spiral, and move with the 2nd spacing in the mode making the winding number of spiral such as become 2.Then, in the rotation processing shown in Figure 13 (d), make the irradiation position of pulse laser LB, in the counterclockwise mode close from the center, lateral of spiral, and move with the 1st spacing to make the winding number of spiral such as become 3 modes.
As mentioned above, in embodiment 11, in the operation shown in Fig. 1 (b), the mode that each direction of rotation in the multiple rotary of laser is changed with the coiling direction of spiral changes, further, the spacing making each helical form in the multiple rotary of laser rotate with in this multiple rotary at least samsara mode once change.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
In addition, in embodiment 11, to make the mode that the correspondence of the coiling direction of spacing and spiral is different in each rotation, each direction of rotation in the multiple rotary of laser and spacing change is made.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes the heat input to the side of benchmark through hole 14-1 ', 14-2 ' effectively become even.
Embodiment 12
Below, the laser processing that embodiment 12 relates to is described.Following, be described centered by the part different from embodiment 6.
In embodiment 6, in the operation shown in Fig. 1 (b), rotating for each time in the multiple rotary of laser is round shape (with reference to Fig. 8 (a) ~ (d)), but in embodiment 12, the rotation rotated for each time in the multiple rotary of laser is helical form.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Figure 14 (a) ~ (d), the mode that each direction of rotation in the multiple rotary of laser is changed with the coiling direction of spiral changes, and the spacing that each helical form in the multiple rotary of laser is rotated and starting position change in the mode that at least samsara one is enclosed in this multiple rotary.
Such as, in the rotation processing shown in Figure 14 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB, in the clockwise mode close from the center, lateral of spiral, and move with the 1st spacing in the mode making the winding number of spiral such as become 3.Then, in the rotation processing shown in Figure 14 (b), using the Working position WP1 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB, in the counterclockwise mode close from the center, lateral of spiral, and move with the 2nd spacing in the mode making the winding number of spiral such as become 2.Then, in the rotation processing shown in Figure 14 (c), using the Working position WP4 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB, in the clockwise mode close from the center, lateral of spiral, and move with the 2nd spacing in the mode making the winding number of spiral such as become 2.Then, in the rotation processing shown in Figure 14 (d), using the Working position WP2 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB, in the counterclockwise mode close from the center, lateral of spiral, and move with the 1st spacing in the mode making the winding number of spiral such as become 3.
As mentioned above, in embodiment 12, in the operation shown in Fig. 1 (b), the mode that each direction of rotation in the multiple rotary of laser is changed with the coiling direction of spiral changes, further, the spacing making each helical form in the multiple rotary of laser rotate and starting position with in this multiple rotary at least samsara mode once change.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
Embodiment 13
Below, the laser processing that embodiment 13 relates to is described.Following, be described centered by the part different from embodiment 7.
In embodiment 7, in the operation shown in Fig. 1 (b), the mode that the direction of rotation rotated for each time is changed with the coiling direction of spiral changes (with reference to Fig. 9 (a) ~ (d)), but in embodiment 13, when being multiple interval by spiral segmentation, make the interval change of carrying out rotating.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Figure 15 (a) ~ (d), the mode that each direction of rotation in the multiple rotary of laser is changed with the coiling direction of spiral changes, and when being multiple interval by spiral segmentation, make the interval change of carrying out rotating.
Such as, in the rotation processing shown in Figure 15 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB, with the clockwise center, lateral from spiral near and the mode rotated between by LHA spiral segmentation 2 sections move.Then, in the rotation processing shown in Figure 15 (b), make the irradiation position of pulse laser LB, with the counterclockwise center, lateral from spiral near and the mode rotated between medial area under being 2 sections of situations by spiral segmentation move.Then, in the rotation processing shown in Figure 15 (c), make the irradiation position of pulse laser LB, with the clockwise center, lateral from spiral near and the mode rotated between medial area under being 2 sections of situations by spiral segmentation move.Then, in the rotation processing shown in Figure 15 (d), make the irradiation position of pulse laser LB, with the counterclockwise center, lateral from spiral near and the mode rotated between by LHA spiral segmentation 2 sections move.In addition, be set to identical by the interval rotated in the rotation processing shown in the rotation processing shown in Figure 15 (b) and Figure 15 (c), this is different in each rotation with the correspondence of the coiling direction of spiral owing to will make between Rotary District.
As mentioned above, in embodiment 13, in the operation shown in Fig. 1 (b), the mode that the direction of rotation rotated for each time in the multiple rotary of laser is changed with the coiling direction of spiral changes, and, when being multiple interval by spiral segmentation, make the interval change of carrying out rotating.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '.
In addition, in embodiment 13, to make modes different in each rotation with the correspondence of the coiling direction of spiral between Rotary District, make to change with the coiling direction of spiral between each Rotary District in the multiple rotary of laser.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes the heat input to the side of benchmark through hole 14-1 ', 14-2 ' effectively become even.
Embodiment 14
Below, the laser processing that embodiment 14 relates to is described.Following, be described centered by the part different from embodiment 7.
In embodiment 7, in the operation shown in Fig. 1 (b), the mode that the direction of rotation rotated for each time is changed with the coiling direction of spiral changes (with reference to Fig. 9 (a) ~ (d)), but in embodiment 14, when being multiple interval by spiral segmentation, make the interval change of carrying out rotating, and do not change the coiling direction of spiral and make the change in travel direction between Rotary District.
Specifically, in rotation variation processing in the operation shown in Fig. 1 (b), as shown in Figure 16 (a) ~ (d), when being multiple interval by spiral segmentation, make the interval change of carrying out rotating, and make the change in travel direction between Rotary District.That is, by not changing the coiling direction of spiral, the direct of travel between Rotary District is changed, thus the direction of rotation rotated for each time is changed.
Such as, in the rotation processing shown in Figure 16 (a), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB, close with the clockwise center, lateral from spiral, and the mode rotated between LHA under being 2 sections of situations by spiral segmentation is moved.Then, in the rotation processing shown in Figure 16 (b), as starting position near central axis CA ', and make the irradiation position of pulse laser LB, close laterally with the counterclockwise center from spiral, and the mode rotated between medial area when being 2 sections by spiral segmentation is moved.Then, in the rotation processing shown in Figure 16 (c), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB, close with the clockwise center, lateral from spiral, and the mode rotated between medial area when being 2 sections by spiral segmentation is moved.Then, in the rotation processing shown in Figure 16 (d), using the Working position WP3 in the radiation direction from central axis CA ' as starting position, and make the irradiation position of pulse laser LB, close laterally with the counterclockwise center from spiral, and the mode rotated between LHA when being 2 sections by spiral segmentation is moved.In addition, be set to identical by the interval rotated in the rotation processing shown in the rotation processing shown in Figure 16 (b) and Figure 16 (c), this is due to the correspondence of the direct of travel between Rotary District and between Rotary District will be made different in each rotation.
As mentioned above, in embodiment 14, in the operation shown in Fig. 1 (b), make to change between the Rotary District that rotates for each time in the multiple rotary of laser, and, make the change in travel direction between Rotary District.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes to become even to the heat input of the side of benchmark through hole 14-1 ', 14-2 '
In addition, in embodiment 14, to make the mode that the correspondence of the direct of travel between Rotary District and between Rotary District is different in each rotation, the change in travel direction between each Rotary District in the multiple rotary of laser and between Rotary District is made.Thereby, it is possible to the radiation direction the central axis CA ' from benchmark through hole 14-1 ', 14-2 ' makes the heat input to the side of benchmark through hole 14-1 ', 14-2 ' effectively become even.
Industrial applicibility
As previously discussed, the processing of the laser processing that the present invention relates to through hole is useful.
The explanation of label
1 laser processing device, 2 laser oscillators, 10 machined objects, 11 the 1st conductor layers, 12 the 2nd conductor layers, 13 insulating barriers, 14-1, 14-2 benchmark through hole, 14-1 ', 14-2 ' benchmark through hole, 15-1 ~ 15-3 the 1st machining hole, 15-1 ' ~ 15-3 ' the 1st machining hole, 16-1 ~ 16-3 the 2nd machining hole, 16-1 ' ~ 16-3 ' the 2nd machining hole, 21 conveying mechanisms, 22 conveying mechanisms, 30 switching mechanisms, 40 machining control portions, 50 Laser Processing portions, 51 video cameras, 52X scanning reflection mirror, 52Y scanning reflection mirror, 53X electrical scanner, 53Y electrical scanner, 54f θ lens, 55 processing work platforms, 58 jig plates.
Claims (9)
1. a laser processing, it utilizes laser to carry out the processing of through hole to the machined object accompanying insulating barrier between the 1st conductor layer and the 2nd conductor layer,
The feature of this laser processing is, has following operation:
Benchmark through hole formation process, in this operation, for described machined object, makes laser multiple rotary from described 1st conductor layer side and irradiates, and forms the benchmark through hole running through described 1st conductor layer, described insulating barrier and described 2nd conductor layer successively;
1st machining hole formation process, in this operation, for described machined object, irradiate laser from described 1st conductor layer side, formation runs through described 1st conductor layer and arrives the 1st machining hole of described insulating barrier; And
2nd machining hole formation process, in this operation, the image that use is taken described benchmark through hole from described 2nd conductor layer side and obtained positions, for described machined object, laser is irradiated from described 2nd conductor layer side, formed and run through described 2nd conductor layer and arrive described insulating barrier and the 2nd machining hole be communicated with described 1st machining hole
In described benchmark through hole formation process, in order to the radiation direction the central axis from described benchmark through hole makes to become even to the heat input of the side of described benchmark through hole, each rotation in the multiple rotary of laser is changed each other.
2. laser processing according to claim 1, is characterized in that,
In described benchmark through hole formation process, make each the direction of rotation alternately change in the multiple rotary of laser.
3. laser processing according to claim 2, is characterized in that,
In described benchmark through hole formation process, the starting position rotated for each time in the multiple rotary of laser is changed in the mode that at least samsara one is enclosed in described multiple rotary.
4. laser processing according to claim 2, is characterized in that,
In described benchmark through hole formation process, make the spacing that rotates for each time in the multiple rotary of laser with in described multiple rotary at least samsara mode once change.
5. laser processing according to claim 3, is characterized in that,
In described benchmark through hole formation process, make the spacing that rotates for each time in the multiple rotary of laser with in described multiple rotary at least samsara mode once change.
6. laser processing according to claim 1, is characterized in that,
In described benchmark through hole formation process, the starting position rotated for each time in the multiple rotary of laser is changed in the mode that at least samsara one is enclosed in described multiple rotary.
7. laser processing according to claim 1, is characterized in that,
In described benchmark through hole formation process, make the spacing that rotates for each time in the multiple rotary of laser with in described multiple rotary at least samsara mode once change.
8. laser processing according to claim 1, is characterized in that,
In described benchmark through hole formation process, for described machined object, make with the laser multiple rotary of constant energy density generation and irradiate.
9. laser processing according to claim 8, is characterized in that,
Described constant energy density is the energy density being suitable for processing described 1st conductor layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-144523 | 2012-06-27 | ||
| JP2012144523 | 2012-06-27 | ||
| PCT/JP2013/063165 WO2014002620A1 (en) | 2012-06-27 | 2013-05-10 | Laser machining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104411447A true CN104411447A (en) | 2015-03-11 |
| CN104411447B CN104411447B (en) | 2016-03-30 |
Family
ID=49782794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380033877.4A Expired - Fee Related CN104411447B (en) | 2012-06-27 | 2013-05-10 | Laser processing |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5465367B1 (en) |
| KR (1) | KR101682837B1 (en) |
| CN (1) | CN104411447B (en) |
| TW (1) | TWI517923B (en) |
| WO (1) | WO2014002620A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108188585A (en) * | 2017-12-25 | 2018-06-22 | 大族激光科技产业集团股份有限公司 | A kind of method that CD lines are processed on ceramics |
| CN113543477A (en) * | 2020-04-17 | 2021-10-22 | 珠海方正科技高密电子有限公司 | Method for processing laser hole of circuit board and circuit board with laser hole |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102204176B1 (en) * | 2019-11-19 | 2021-01-15 | 이재욱 | Apparatus and method for cutiing fabric |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335655A (en) * | 2003-05-06 | 2004-11-25 | Internatl Business Mach Corp <Ibm> | Hole forming method, printed wiring board, and hole forming device |
| JP2006272384A (en) * | 2005-03-29 | 2006-10-12 | Aisin Seiki Co Ltd | Apparatus and method of laser beam machining |
| CN1939644A (en) * | 2005-09-30 | 2007-04-04 | 日立比亚机械股份有限公司 | Laser machining method and laser machining apparatus |
| JP2009252892A (en) * | 2008-04-03 | 2009-10-29 | Mitsubishi Electric Corp | Laser machining method, method for manufacturing printed board, and laser machining apparatus |
| JP2011110589A (en) * | 2009-11-27 | 2011-06-09 | Hitachi Via Mechanics Ltd | Laser beam machining method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003145289A (en) * | 2001-11-14 | 2003-05-20 | Mitsubishi Heavy Ind Ltd | Laser beam machining device |
| JP2007268576A (en) * | 2006-03-31 | 2007-10-18 | Hitachi Via Mechanics Ltd | Laser beam machining method |
-
2013
- 2013-05-10 JP JP2013550697A patent/JP5465367B1/en not_active Expired - Fee Related
- 2013-05-10 WO PCT/JP2013/063165 patent/WO2014002620A1/en active Application Filing
- 2013-05-10 KR KR1020157001515A patent/KR101682837B1/en active IP Right Grant
- 2013-05-10 CN CN201380033877.4A patent/CN104411447B/en not_active Expired - Fee Related
- 2013-06-24 TW TW102122347A patent/TWI517923B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335655A (en) * | 2003-05-06 | 2004-11-25 | Internatl Business Mach Corp <Ibm> | Hole forming method, printed wiring board, and hole forming device |
| JP2006272384A (en) * | 2005-03-29 | 2006-10-12 | Aisin Seiki Co Ltd | Apparatus and method of laser beam machining |
| CN1939644A (en) * | 2005-09-30 | 2007-04-04 | 日立比亚机械股份有限公司 | Laser machining method and laser machining apparatus |
| JP2009252892A (en) * | 2008-04-03 | 2009-10-29 | Mitsubishi Electric Corp | Laser machining method, method for manufacturing printed board, and laser machining apparatus |
| JP2011110589A (en) * | 2009-11-27 | 2011-06-09 | Hitachi Via Mechanics Ltd | Laser beam machining method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108188585A (en) * | 2017-12-25 | 2018-06-22 | 大族激光科技产业集团股份有限公司 | A kind of method that CD lines are processed on ceramics |
| CN108188585B (en) * | 2017-12-25 | 2020-04-17 | 大族激光科技产业集团股份有限公司 | Method for processing CD (compact disc) grains on ceramic |
| CN113543477A (en) * | 2020-04-17 | 2021-10-22 | 珠海方正科技高密电子有限公司 | Method for processing laser hole of circuit board and circuit board with laser hole |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI517923B (en) | 2016-01-21 |
| TW201404509A (en) | 2014-02-01 |
| JP5465367B1 (en) | 2014-04-09 |
| WO2014002620A1 (en) | 2014-01-03 |
| CN104411447B (en) | 2016-03-30 |
| KR20150021582A (en) | 2015-03-02 |
| KR101682837B1 (en) | 2016-12-05 |
| JPWO2014002620A1 (en) | 2016-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104411447B (en) | Laser processing | |
| CN107206548B (en) | It is sprayed before inclined induced with laser to conversion | |
| CN106141444B (en) | Laser processing device | |
| TWI583475B (en) | Laser processing method and laser processing device | |
| JPWO2009122529A1 (en) | Planar body alignment apparatus, manufacturing apparatus, planar body alignment method, and manufacturing method | |
| TWI399256B (en) | Laser cutting method and laser cutting device | |
| KR20070098466A (en) | Laser machining method | |
| CN104105569A (en) | Method and apparatus for forming fine scale structures in dielectric substrate | |
| JP2010162559A (en) | Laser processing method, processing device and workpiece | |
| JP2001340980A (en) | Laser processing method and processing apparatus | |
| JP2003136270A (en) | Laser beam machining device | |
| JP2011031302A (en) | Laser beam machining method and device therefor | |
| CN103369848B (en) | A kind of radium-shine alignment system of high density interconnect printed circuit board (PCB) and method | |
| KR20110049247A (en) | A printed circuit board and a fabricating method the same | |
| TW200847377A (en) | Method of manufacturing wiring board | |
| JP5984394B2 (en) | Three-dimensional mounting method and apparatus | |
| JP4048873B2 (en) | Positioning method | |
| JP2007029989A (en) | Apparatus and method for laser beam machining | |
| JP4791681B2 (en) | Multilayer printed circuit board manufacturing process | |
| JP2004074217A (en) | Marking device | |
| JP2007025887A (en) | Plane stage device and its control method | |
| JP2006303074A (en) | Method and device for manufacturing printed wiring board | |
| JP2005088045A (en) | Method and apparatus for laser drilling | |
| JP4565606B2 (en) | Lamination method for forming multilayer printed circuits | |
| JP7294783B2 (en) | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160330 |