CN107206548B - It is sprayed before inclined induced with laser to conversion - Google Patents
It is sprayed before inclined induced with laser to conversion Download PDFInfo
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- CN107206548B CN107206548B CN201680006659.5A CN201680006659A CN107206548B CN 107206548 B CN107206548 B CN 107206548B CN 201680006659 A CN201680006659 A CN 201680006659A CN 107206548 B CN107206548 B CN 107206548B
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- membrane
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- 239000000758 substrate Substances 0.000 claims abstract description 116
- 239000012528 membrane Substances 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 58
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 230000005855 radiation Effects 0.000 claims abstract description 17
- 230000004927 fusion Effects 0.000 claims abstract description 12
- 230000008021 deposition Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 33
- 238000002347 injection Methods 0.000 claims description 26
- 239000007924 injection Substances 0.000 claims description 26
- 239000007921 spray Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 13
- 230000000737 periodic effect Effects 0.000 claims description 7
- 239000007888 film coating Substances 0.000 claims description 2
- 238000009501 film coating Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000010276 construction Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
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- 238000012360 testing method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 241000287828 Gallus gallus Species 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
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- 230000008901 benefit Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
- B23K26/342—Build-up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- General Chemical & Material Sciences (AREA)
Abstract
A kind of equipment of the material deposition on receptor surface, it include: transparent donor substrate, with the first and second opposite surfaces, so that at least part of second surface is not parallel to receptor surface, the transparent donor substrate further includes the donor membrane on second surface.The equipment also optical module, it is configured to guide radiation beam at the first surface for passing through donor substrate, and be radiated on donor membrane at the position of the part for being not parallel to receptor surface of second surface, receptor surface is ejected into from donor membrane with the droplet of induced fusion material.
Description
Technical field
Present invention relates in general to laser direct-writings, more particularly, to before induced with laser to conversion injection method and be
System.
Background technique
To the technology that conversion (LIFT) is for directly printing a variety of materials (such as metal and polymer) before induced with laser.
LIFT provides high printing quality, however, three-dimensional (3D) pattern that advanced electronic device includes chicken uniformly to coat.It mentions below
For the example of the prior art.
The United States Patent (USP) 6792326 (the disclosure of which is used as and is incorporated herein by reference) of Duignan is described for micro-structure
The material delivery system of manufacture, with substrate, the material support with sedimentary and towards material support element guide
Laser beam.The system is being added operation mode or is making subtracting each other mode of operation, so that when operation mode changes, no
Workpiece must be removed from tool.
The United States Patent (USP) 6805918 (the disclosure of which is used as and is incorporated herein by reference) of Auyeung et al. describes a kind of use
In the method that laser is converted and deposits Pheological fluid, wherein laser energy hits the target base plate including Pheological fluid, causes to flow
A part of fluid evaporates, and promotes on the Pheological fluid not evaporated to reception substrate.
The United States Patent (USP) 7277770 (the disclosure of which is used as and is incorporated herein by reference) of Huang describes a kind of according to calculating
Machine Computer Aided Design (CAD) manufactures the direct-write process and equipment of expectation circuit block on the substrate surface of microelectronic device.
(the disclosure of which is used as is incorporated by this to the U.S. Patent Application Publication 2005/0095367 of Babiarz et al.
It is literary) a kind of non-contact method distributed on cohesive material to substrate surface is described, substrate table is not orthogonal to using with edge
The injection valve of the nozzle of the injection direction guidance cohesive material stream in face.The injection direction of out of plumb causes to generate reduction on substrate
Humidification zones droplet.
The file being incorporated herein by reference is considered as a part of the application, unless fixed in the file that these are incorporated to
The term of justice is contradicted with the term of definition clear in the present specification or in secret, then only considers definition in the present specification.
Summary of the invention
The embodiment provides a kind of on receptor surface equipment that material deposits, the receptor being described herein
Surface includes the transparent donor substrate with the first and second opposite surfaces, so that at least part of second surface is not parallel
In receptor surface, transparent donor substrate further includes the donor membrane on second surface.The equipment further includes optical module, is matched
It is set to guidance first surface of the radiation beam by donor substrate, and in the part for being not parallel to receptor surface of second surface
It is irradiated on donor membrane at position, with using droplet ejection to receptor surface from donor membrane induced fusion material.
In some embodiments, second surface includes periodic structure.In other embodiments, second surface includes more points
Face structure.In another embodiment, second surface includes the first and second facets, and the first and second facets are taken with opposite angles
To, and with respectively different donor membrane coatings.In alternative embodiments, second surface includes the first and second facets, wherein only
First facet is coated with donor membrane.In one embodiment, second surface includes warp architecture.
According to an embodiment of the invention, a kind of equipment for material deposition is additionally provided, including with opposite first
With the transparent donor substrate of second surface so that at least part of second surface be it is nonplanar, transparent donor substrate also wraps
Include the donor membrane on the non-flat portion of second surface.The equipment further includes optical module, is configured to guidance radiation beam
It is irradiated on donor membrane by the first surface of donor substrate, and at the position of the non-flat portion of second surface, with from confession
Body film induced fusion material uses droplet ejection to receptor surface.
According to an embodiment of the invention, additionally providing a kind of method for material deposition, including provide transparent donor base
Plate with the first and second opposite surfaces and has the first and second facets being located on second surface, and first and second
Facet is orientated with opposite angles, and transparent donor substrate further includes the donor membrane in the first and second facets.Donor substrate is adjacent
Nearly acceptor substrate positioning, second surface is towards acceptor substrate.Radiation beam is conducted through the first surface of donor substrate, and in sound
It should be radiated on donor membrane at the position that the first and second facets of second surface select, from the first and second facets
Donor membrane induced fusion material uses droplet ejection to acceptor substrate.
According to an embodiment of the invention, additionally providing a kind of method for material deposition, including provide transparent donor base
Plate with the first and second opposite surfaces and has the donor membrane being located on second surface.Donor substrate is adjacent to receptor base
The receptor surface of plate positions, and second surface is taken towards acceptor substrate, and relative to receptor surface with oblique angle (i.e. with non-perpendicular angles)
To.Radiation beam is conducted through the first surface of donor substrate, and illuminates while second surface is orientated with oblique angle in donor
On film, with using droplet ejection to receptor surface from donor membrane induced fusion material.
Together with attached drawing, the present invention can be more fully understood from the detailed description to the embodiment of the present invention.
Detailed description of the invention
Fig. 1 is the schematic illustration of embodiment according to the present invention system of direct write on substrate；
Fig. 2 is according to an embodiment of the invention, showing the schematic side elevation of the details of the system of Fig. 1；
Fig. 3-6 is according to an embodiment of the invention, to the details of conversion (LIFT) donor before showing non-planar induced with laser
Schematic sectional view；And
Fig. 7 is according to an embodiment of the invention, showing the details for being not parallel to the non-planar LIFT donor of acceptor substrate
Schematic sectional view.
Specific embodiment
It summarizes
Below to conversion (LIFT) technology before the induced with laser described herein the embodiment provides enhancing
Capacity and availability method and apparatus.It can be used for by the enhancing that these embodiments provide in the electricity including various types substrate
It is printed on sub-circuit, particularly for being printed in three-dimensional (3D) structure.However, disclosed technology is never limited to these specific applications
Background, the various aspects of embodiment described herein can also it is mutatis mutandis on the substrate other than electronic circuit board based on LIFT
Printing.The enhancing includes type metal and nonmetallic materials.
In the system typically based on LIFT, the small distance between donor surface and acceptor substrate generates height on substrate
Printing quality.However, there are two challenges for printing tool in the 3D structure on substrate: between donor surface and the lower surface of receptor
Possible big distance (low printing quality is generated on receptor)；And the poor coating of possibility of the upright side walls of the 3D structure of substrate
(" stepcoverage ").
The embodiment of invention described below is by providing the donor constructions of different novel types and being orientated and grasp
Make LIFT system corresponding method overcome these limitation in it is some.In some embodiments, transparent donor substrate has phase
Pair the first and second surfaces so that at least part of second surface is not parallel to receptor surface, and further include being located at it
On donor membrane.Optical module is configured to guidance first surface of the radiation beam by donor substrate, in the injustice of second surface
Row is radiated on donor membrane at the position of the part of receptor surface.The irradiation from donor membrane induced fusion material (such as gold
Belong to and polymer) use droplet ejection to receptor surface.
In other embodiments, second surface includes more facet periodic structures, wherein at least some of each facet is used
Donor membrane coating.More facet structures include the first substantially similar facet facet similar with second substantially, the first and second facets with
Opposite angles orientation, and coated with respective different donor membranes.In another embodiment, the second surface of donor includes being not parallel to
The substantially similar facet of the first of the horizontal surface of substrate facet similar with second substantially and be parallel to substrate horizontal surface but
It is the substantially similar facet of third without donor membrane coating.Third facet can be used for via donor on-site test LIFT process.
In alternative embodiments, second surface includes warp architecture.
In another embodiment, transparent donor substrate has the first and second opposite surfaces, so that second surface is extremely
Few a part is nonplanar, and has the donor membrane on the non-flat portion of second surface.Optical module guidance radiation
Beam is radiated on donor membrane at the position of the non-flat portion of second surface by the first surface of donor substrate, with from
Donor membrane induced fusion material uses droplet ejection to receptor surface.
System describe
Fig. 1 is the schematic illustration of the embodiment according to the present invention system of direct write on substrate 24.This system and its portion
Part is merely shown as illustrating that applicable environment of technology described herein herein.This technology can be similarly used suitable other
Types of machines results is simultaneously implemented in other constructions.
The foundation around printing and direct write equipment 10 of the system of Fig. 1, the equipment is in (such as the flat-panel monitor of electronic circuit 12
(FPD) or printed circuit board (PCB)) substrate 24 on operate, electronic circuit is maintained in mounting surface 14.In general LIFT
In technique, substrate 24 is also known as receiver or receptor.Term " flat-panel monitor ", " FPD ", " printed circuit board " and " PCB " exists
Herein for being generally referred to any kind of dielectric or metal or semiconductor substrate, such as the conductive material or ratio of metal
If the non-conducting material of dielectric and polymer is deposited on substrate, the type but regardless of baseplate material and the technique for deposition
How.Equipment 10 can be used for depositing mew layer, such as the type metal circuit on various substrates or on any other electronic device.
Equipment 10 includes optical module 16, it includes for before laser from induced with laser to conversion (LIFT) and optical system
System.Optical module 16 and its operation are described below with reference to Fig. 2.It executes straight
Connecing printing application (such as PCB or FPD or any other can patterning or layer deposition on application apparatus) may include other examine
Cutting capacity, diagnosis capability can built-in (monitor i.e. during printing process and detect), integrated (i.e. after completing LIFT technique
The device for monitoring and detecting and selecting immediately) or pass through independent diagnostics system off-line.
Optical module 16 is located in and moving along the axis linearity of equipment 10 and is begged for by the positioning component 20 of bridge form
On related place on the substrate 24 of opinion.In other embodiments, positioning component 20 can be other forms, such as in circuit 12
With 16 lower section of stationary components along the mobile station of (X) axis, two (X, Y) axis or three (X, Y, Z) axis.Control unit
The operation of 27 control optical modules and positioning component, and implement additional functionality, such as temperature control, to implement required detection, print
Brush, patterning and/or other manufactures and reparation operation, as described below.
In general, control unit 27 is connected to operating terminal 23, together with user interface and software, operating terminal includes tool
There is the general purpose computer of processor 34 and display 36.
Fig. 2 is to show the schematic side elevation according to an embodiment of the invention, the especially details of optical module 16 of equipment 10.
13 pulse radiation of laser, impulse radiation are focused by optical system 15.Laser can be for example including exporting with frequency multiplication
The impulse amplitude of pulse Nd:YAG laser, laser can easily be controlled by control unit 27.Although (by unusual
Means, control unit 27 may be configured to the control pulse duration).Optical system 15 can be similarly controlled, to adjust
The position of the focus formed by laser beam and size.
In some embodiments, the additional laser device (not shown) or any other with different beam characteristics can be used
Light source (such as LED or lamps and lanterns).Additional laser device can operate under another wavelength and have another optical settings, and can
For example for Surface testing.
Optical module 16 is shown in Fig. 2 with LIFT construction.Optical system 15 focuses on the light beam from laser 13
Donor 19, donor include donor substrate 17, and one or more donor membranes 18 are deposited on substrate 17.In general, substrate 17 includes saturating
Bright optical material, such as glass or plastic sheet or other types of transparent substrate, such as silicon wafer or flexiplast foil.Come
Selection place on from the substrate 24 of the light beam of laser 13 and circuit 12 is aligned (by positioning component 20), and donor 19 is located in
Above the place, with substrate at a distance of desired gap width D.In general, the gap width is at least 0.1mm, inventor is it has been found that can
To use 0.2mm or even 0.5mm or bigger gap width, by properly selecting parameters of laser beam.
The outer surface that optical system 15 makes laser beam pass through substrate 17 focuses on film 18, so as to cause the small of melted material
Drop is sprayed from film, across the gap, is reached on the surface of device substrate (such as into structure sheaf 25).
Fig. 3 is the schematic sectional view for showing the details of non-planar LIFT donor 22A of embodiment according to the present invention.For
Body 22A penetrates laser beam 28, and including two surfaces, that is, is typically normal to laser beam 28 and is parallel to the plane first of substrate 24
(on) surface 23A and towards substrate 24 second (under) surface 21A.In one embodiment, the lower surface of donor 22A is non-flat
Face, and two or more facets including being not parallel to substrate 24.In the example of fig. 3, the lower surface of donor 22A includes
Substantially similar facet 32 and substantially similar facet 26.Facet 32 is typically parallel to laser 28, and facet 26 has gradient (slope), and
It is coated with one or more films of material 26M, to form the single layer or multiple-level stack of respective material.In the disclosure and power
During benefit requires, it is assumed that facet has flat and plane surface.
During LIFT technique, laser beam 28 provides impulse radiation to donor 22A.Radiation is irradiated to choosing across surface 23A
The donor membrane for the facet 26 selected.Since the facet of selection is not parallel to the receptor surface 33A of substrate 24, so assuming herein
Be parallel to the basal plane 35A of substrate, the droplet 30 of the melted material from donor membrane with angle 29 be ejected into substrate 24 by body surface
Face 33A.The receptor surface 33A of substrate 24 is also referred to as the top surface 33A of substrate.In general, the injection of droplet 30 is orthogonal
It is indicated in facet 26, and by arrow 31.Therefore, although laser beam 28 is perpendicular to substrate 24, the gradient of facet 26 leads to institute
Show inclination injection, it will be on the side wall of the structure 25A of the deposition of droplet 30 on substrate 24.As shown in the figure, structure 25A has not
It is parallel to the surface of receptor surface 33A (i.e. basal plane 35A), such as side wall.In the following description, other structures 25B, 25C,
25D, 25E are installed on substrate 24.Other structures have attribute identical with structure 25A described herein, i.e., they are not with
It is parallel to the surface of the basal plane of substrate 24.
In the example of fig. 3, droplet is mainly set by the design of donor 22A from the spray angle of coating facet.
In typical LIFT technique, the small distance between donor 22A and substrate 24 (and structure 25A) is in 24 He of substrate
High printing quality is generated on structure 25A.In addition, more facet structures provide on the preset expected direction perpendicular to each facet
Simple injection so that the high coating uniformity of the side wall of 3D structure is possibly realized.
In some embodiments, the lower surface of donor 22A includes periodic structure (as shown in Figure 3).In other embodiments
In, the structure of the lower surface of donor 22A can have the aperiodicity knot for having different facet gradients along the lower surface of donor 22A
Structure.That is, the structure can be from the center of donor 22A to the edge of donor difference.For example, the facet in the edge of donor 22A
Tilt angle can be steeper than the angle of the facet at center.
In alternative embodiments, the lower surface of donor 22A may include more than two facet, as described with regard to fig. 5.
Fig. 4 is the schematic sectional view for showing the details of non-planar LIFT donor 22B of embodiment according to the present invention.For
The upper surface 23B of body 22B is parallel to the top surface 33A of substrate 24.The lower surface 21B of donor 22B is nonplanar, and including more
Facet structure, such as substantially similar facet 40 and substantially similar facet 42, they are not parallel to the receptor surface 33A of substrate 24.
Each facet has different gradients about the receptor surface of substrate 24 as a result,.In one embodiment, facet relative to light beam 28 with
Opposite (may not be equal) angle (such as+45 ° and -30 °) orientation.Facet can respectively different donor membrane coatings, such as
About material 26M described in Fig. 3 and another material.
This bi-material layers structure can be manufactured by various technologies, for example photoetching, directly evaporation are (the case where metal coats
Under) or place with double angles (such as cone) structure coated in the different materials in each facet.(in some embodiments,
Some distributions can not coated).During LIFT operation, two kinds of materials can substantially spray simultaneously, such as by using flat
Two or more capable light beams.Alternatively or additionally, High Repetition Laser can be scanned to effectively obtain simultaneously
Injection.Injection simultaneously can be used for forming mixing material (such as mixture) on basic 24.In addition alternatively or additionally, two kinds
Material can continuously be printed to form mixed material structure.
Since facet 40 and 42 is not parallel to the surface of substrate 24, so the droplet of melted material is closed from the injection of donor membrane
In the surface of substrate 24 with an angle (i.e. the angle 29 of Fig. 3) generation.In one embodiment, facet 40 and 42 is with by similar or not
The film coating formed with material.In alternative embodiments, only one facet (such as facet 40) is coated by film.Droplet 30 is from facet
40 injection is indicated that droplet 30 about surface 40 with orthogonal angles by spraying, with the left side of coated structure 25B by arrow 41
Wall.Arrow 43 is shown droplet 30 and is sprayed from facet 42 generally about facet 42 with orthogonal spray angle, with the right side of coated structure 25B
Side wall.The top surface of coated substrate 24 and the upper surface for being parallel to donor 22B of structure 25B is gone back in two injections.
In some embodiments, the injection of droplet 30 is performed simultaneously, small in the case where the different materials in each facet
The injection of drop 30 can form the hybrid films (such as mixture or alloy) of respective material on substrate 24.In other embodiments,
Droplet 30 executes before or after the injection of facet 42 from the droplet 30 that is injected in of facet 40.Difference in facet 40 and 42
In the case where material, the successive of droplet 30 can form multilayered structure or mixing material structure in the identical layer of substrate 24.
The spray angle of droplet is limited by the gradient of facet 40 and 42 respectively.In some embodiments, in facet 40 and 42
Coating material be it is similar, to print identical material across structure 25B and substrate 24.In other embodiments, coating material
Can be different, to print mixing or multilayer material on structure 25B and substrate 24.
Fig. 5 is the schematic sectional view for showing the details of non-planar LIFT donor 22C of embodiment according to the present invention.For
Body 22C penetrates laser beam 28 (being not shown in Fig. 5).In some embodiments, donor 22C can be configured to through for LIFT technique
Another laser or another light source of detection, such as LED or luminaire, as described below.
The upper surface 23C of donor 22C is parallel to the top surface 33A of substrate 24.The lower surface 21C of donor 22C includes injustice
Row in the surface 33A and 35A of substrate 24 substantially similar facet 50 and substantially similar facet 52 and be parallel to the big of surface 33A
Cause similar facet 54.
Facet 50 and 52 can in each facet identical material or different materials coat, as described in relation to fig. 4.One
In a little embodiments, facet 54 is not coated with, and for the on-site test during LIFT technique, to monitor LIFT printing technology
Quality.Alternatively or additionally, uncoated facet can be used for additional detections application, such as registration and/or alignment.Via uncoated
Facet detection can be used with for spray identical laser or additional laser (being not shown in Fig. 5) or it is any its
Its suitable light source (such as LED or luminaire), as described above.
In other embodiments, facet 54 can be coated with the material to be sprayed, usually in the injection shown in arrow 55
Perpendicular to substrate 24.50 He of facet is usually respectively perpendicular to from the injection (being shown respectively by arrow 51 and 53) of facet 50 and 52
52.Arrow 51 shows the left side wall and top surface of the 30 coated structure 25C of droplet from facet 50.Arrow 55 shows the painting of droplet 30
Cover the top surface of structure 25C.Arrow 53 shows the right surface of 30 coated structure 25C of droplet.The spray angle master of facet 50 and 52
It to be set by the corresponding slope of facet.
Fig. 6 is the schematic sectional view for showing the details of non-planar LIFT donor 22D of embodiment according to the present invention.For
Body 22D penetrates laser beam 28.The upper surface 23D of donor 22C is parallel to the top surface 33A of substrate 24.The lower surface of donor 22D
21D includes one or more warp architectures 71, they are coated on the top of the flat bottom surface 77 of donor 22D by donor membrane.
Each warp architecture 71 has thickness h and width L.Structure 71 is also referred to as element 71.For example, four flexure elements
Part 71 is shown in FIG. 6, and is assumed to be the section of the corresponding spherical surface with equal curvatures radius 73.
However, it should be understood that element 71 may include substantially any curved surface, thus can for example including cylindrical cross-section or
The section of another bending entity (such as oval).Moreover, element 71 can be arranged in a periodic manner on the 21D of surface, or can be with
It is arranged to acyclic.
In general, the width L of each element 71 is substantially greater than the thickness h of similar elements, member is radiated to avoid when light beam
The distortion of the hot spot of light beam 28 when on part 71.In one embodiment, for the gap 79 between donor 22D and surface 33A 200
μm in 300 μ ms or bigger, thickness h is about 100 μm or smaller.These of thickness and gap value guarantee donor 22D and base
Printing condition between plate 24 is substantially consistent.
The curvature and light beam 28 of element 71 are radiated at spray angle θ of the droplet of the position restriction on element 30 from elemente,
Droplet is usually orthogonal to irradiation area injection.Therefore, operator can control position of the light beam 28 on bending donor, to be directed to base
Desired locations on plate obtain the required spray angle of given droplet 30.In general, passing through control light beam 28, donor 22D and/or base
The position of plate 24, the spray angle of droplet 30 may be selected as any angle in successive range in operator, and thus can be changed every
Landing angle and landing place of a droplet 30 on surface 33A and structure 25D.In one embodiment, spray angle is continuous
Range is located relative between+30 ° and -30 ° of the measurement of light beam 28.
For example, when (assuming to be parallel to surface 33A herein) on the center that light beam 28 is radiated at element 71, droplet 30
It is usually orthogonal to surface 33A injection, as indicated by arrow 72.In this case, droplet coating surface 33A or top surface 25D.Work as light
When beam 28 is radiated at the right side of element 71, droplet 30 is occurred from the injection of donor membrane with an angle, as shown in arrow 74.In the feelings
Under condition, droplet drops to receptor surface 33A with non-normal angle (than angle 29 as described in Figure 3), or to the left side of structure 25D
Wall.Similarly, when light beam 28 is radiated at the left side of element 71, droplet 30 is from the injection of donor membrane to be radiated at element with light beam
The opposite angle in right side occurs, as shown in arrow 76.In this case, droplet is with opposite angles (with example shown in arrow 74
Compared to) drop to receptor surface 33A, or the right side wall to structure 25D.
In the close packing of element 71, width L is indicated by the maximum allowable spray angle and thickness h of element 71.If
θmIt is maximum spray angle, then the width (for the element in the section of spherical surface) of element 71 is given by:
Thus, for example, setting thickness h as 100 μm, it is assumed that maximum spray angle is 30 °, and curved surface width L is about 750
μm, it is significantly greater than typical spot size.Similar consideration is applied to other compact warp architecture situations.
Fig. 7 is to show non-planar LIFT donor 22E according to an embodiment of the present invention (to be not parallel to the surface 33A of substrate 24
And 35A) details schematic sectional view.Donor 22E is the plane upper surface 23E of donor 22E and to be parallel to substrate 24
The tilt angle 66 measured between the horizontal line of surface 33A and 35A tilts.Surface 23E serves as the restriction flat table of donor 22E
Face, tilt angle 66 is between surface 23E and the line of surface 33A, 35A for being parallel to substrate 24.
Donor 22E penetrates laser beam 28, and the lower surface including being coated by donor membrane and with skew angle towards substrate 24
21E.Structure 25E is located on substrate 24, and usually has three-dimensional (3D) structure as shown in Figure 7.
In one embodiment, the user 11 of equipment 10 (Fig. 1) identifies the shape characteristic in the 3D structure of structure 25E, and fixed
Position donor 22E make the lower surface of donor at a skewed angle (i.e. nonopiate in surface) towards the surface of 3D structure.Once fixed
Position donor 22E and substrate 24, then user by the guidance of light beam 28 to be radiated on donor 22E, with from donor membrane blasting materials to
3D structure is usually orthogonal to the lower surface of donor 22E.For example, droplet 30 is orthogonal to donor 22E's if angle 66 is equal to 10 °
Lower surface injection, then droplet can be sprayed relative to the horizontal line for being parallel to substrate 24 with 100 °, and with the table relative to substrate 24
80 ° of the angle (90 ° -10 °) of face 33A measurement drops on the top surface of structure 25E.
In some embodiments, the surface 21E of donor 22E includes multiple facets, such as facet 61 and 64, they usually by
Donor membrane coating.In other embodiments, surface 21E is plane (not including facet), and is coated with donor membrane.
During LIFT technique, impulse radiation is emitted to donor 22E by laser beam 28.The radiation is shone across surface 23E
It penetrates on the donor membrane of the lower surface donor 22E, receptor surface is ejected into from donor membrane with the droplet of induced fusion material, in Fig. 7
Example in, receptor surface includes each section of the upper surface of the surface 33A and structure 25E of substrate 24.
In the first of plane (non-facet) surface 21E of donor 22E, from the spray angle of donor membrane on donor
Be it is constant, light beam 28 is towards structure 25E with 90 °+angle of angle, 66 droplet ejection as a result,.As a result, droplet 66 is with non-orthogonal angles
Degree drops on the top surface of substrate 24 and structure 25E.As described in above example, angle 66 is equal to 10 °, as a result, from donor 22E
Spray angle be 100 °, the landing angle on the top surface of structure 25E is 80 °.The side wall of structure 25E is dropped in droplet
In the case where on (surface for being orthogonal to substrate 24), landing angle is 10 ° usually relative to the surface of side wall.
At the second situation (shown in Fig. 7), the lower surface of donor 22E includes substantially similar facet 62 and substantially similar facet
64.In this embodiment, during LIFT technique, light beam 28 passes through surface 23E, and is radiated on the donor membrane of facet 62, leads
Droplet 30 is caused to spray (shown in arrow 68) towards the horizontal top surface of right side wall and structure 25E.In this case, it sprays and lands
Angle depends on the skew angle of angle 66 and facet 62 relative to surface 21E.
For example, facet 62 is 60 ° relative to the angle of the lower surface of donor 22E, and injection is just if angle 66 is equal to 10 °
The surface of facet 62 is met at, then injection is equal to 10 °+60 °+90 ° from the angle (arrow 68) of facet 62, relative to donor 22E's
Lower surface is equal to 160 °.Landing angle of the droplet on the top surface of structure 25E can be 20 ° (90 ° -70 °), structure 25E's
Landing angle in left orthogonal side walls can be 70 °.
Similarly, light beam 28 passes through the upper surface of donor 22E, and is radiated on the donor membrane of facet 64, leads to droplet 30
(shown in arrow 70) is sprayed towards the horizontal surface of right side wall and structure 25E.
In both embodiments, compared with parallel donor-receptor construction, non-zero tilt angle 66 provides donor 22E
Closer to the accurate location of substrate 24.Smaller distance typically results in the high printing quality of LIFT technique between donor and receptor.
In Fig. 7, due to tilt angle 66, the left side of donor 22E is lower than right side, and can mention together with facet 62 and 64
For the short distance between the film on donor 22E and structure 25E (provided compared with the prior art systems in these short distances
The higher printing quality of droplet 30 on structure 25E).Inclination embodiment provides the feelings of the non-homogeneous height on structure 25E
High printing energy under condition, as shown in Figure 7, wherein the right side of structure 25E is higher than the left side of structure.
As shown in fig. 7, the combination of more facet structures on the lower surface of non-zero tilt angle 66 and donor 22E provides phase
Flexibility for the specific morphology adaptation LIFT technique of structure 25E.For example, highest 3D structure is located at structure 25E in Fig. 7
Right side, thus donor 22E is tilted to the left downwards.In 3D structure under the higher contrary circumstance in the left side of structure 25E, donor
22E can be tilted downwardly and to the right, it means that tilt angle 66 is opposite with angle shown in Fig. 7.For example, in addition to 10 °, angle 66 is-
10°(170°).The combination of more facet structures of the tilt angle and donor that can be adapted to provides the table that can be used for obtaining donor 22E
The flexibility of small distance between face 21E and structure 25E, and thus provide any type 3D feature for structure 25E
High printing quality.
It should be appreciated that above-described embodiment refers in an illustrative manner, the present invention is not limited to what is be particularly shown and describe above.Really
Ground is cut, the scope of the present invention includes that the combination of various features described above and sub-portfolio and those skilled in the art are reading
Foregoing description it is conceivable that and undocumented various modifications and transformation in the prior art.
Claims (22)
1. the equipment for the material deposition on receptor surface, comprising:
Transparent donor substrate, have the first and second opposite surfaces so that at least part of second surface be not parallel to by
Body surface face, the transparent donor substrate further include the donor membrane on second surface；And
Optical module is configured to guide radiation beam at the first surface for passing through donor substrate, and in the not parallel of second surface
Be radiated on donor membrane at the position of the part of receptor surface, with the droplet of induced fusion material from donor membrane be ejected by
Body surface face, wherein at least one of droplet is sprayed with the spray angle for being non-orthogonal with receptor surface.
2. equipment as described in claim 1, wherein the second surface includes periodic structure.
3. equipment as described in claim 1, wherein the second surface includes more facet structures.
4. equipment as claimed in claim 3, wherein the second surface includes the first and second facets, and described first and the
Two facets are orientated with opposite angle, and with respectively different donor membrane coatings.
5. equipment as claimed in claim 3, wherein the second surface includes the first and second facets, and wherein, only the
One facet is coated with donor membrane.
6. the equipment for material deposition, comprising:
Transparent donor substrate has the first and second opposite surfaces, so that at least part of the second surface is non-flat
Face, the transparent donor substrate further includes the donor membrane on the non-flat portion of second surface；And
Optical module is configured to guide radiation beam at the first surface for passing through donor substrate, and in the non-planar of second surface
It is radiated on donor membrane at partial position, receptor surface is ejected into from donor membrane with the droplet of induced fusion material, wherein small
At least one of drop is sprayed with the spray angle for being non-orthogonal with receptor surface.
7. equipment as claimed in claim 6, wherein the second surface includes periodic structure.
8. equipment as claimed in claim 6, wherein the second surface includes warp architecture.
9. equipment as claimed in claim 6, wherein the second surface includes more facet structures.
10. equipment as claimed in claim 9, wherein the second surface includes the first and second facets, and described first and the
Two facets are orientated with opposite angle, and with respectively different donor membrane coatings.
11. equipment as claimed in claim 9, wherein the second surface includes the first and second facets, and wherein, only
First facet is coated with donor membrane.
12. a kind of method for material deposition, comprising:
Transparent donor substrate is provided, with the first and second opposite surfaces, and there is the first He being located on second surface
Second facet, the first and second facets are orientated with opposite angle, and transparent donor substrate further includes being located at the first and second facets
On donor membrane；And
Neighbouring acceptor substrate positions donor substrate, and second surface is towards acceptor substrate；And
By radiation beam guidance at the first surface for passing through donor substrate, and in the first and second facets in response to second surface and
It is radiated on donor membrane at the position of selection, is sprayed with the droplet of induced fusion material from the donor membrane in the first and second facets
To acceptor substrate,
Wherein, at least one of droplet is sprayed with the spray angle for being non-orthogonal with acceptor substrate.
13. method as claimed in claim 12, wherein the droplet of melted material is from the donor membrane in the first and second facets
Injection is performed simultaneously.
14. method as claimed in claim 12, wherein the droplet of melted material is from the donor membrane in the first and second facets
Injection is successively executed.
15. a kind of method for material deposition, comprising:
Transparent donor substrate is provided, with the first and second opposite surfaces, and there is the donor membrane being located on second surface；
And
The receptor surface of neighbouring acceptor substrate positions donor substrate, and second surface is towards acceptor substrate, and about receptor surface
Tilt angle orientation；And
Radiation beam is guided into the first surface for passing through donor substrate, and irradiation while second surface is orientated with tilt angle
On donor membrane, receptor surface is ejected into from donor membrane with the droplet of induced fusion material,
Wherein, at least one of droplet is sprayed with the spray angle for being non-orthogonal with receptor surface.
16. method as claimed in claim 15, wherein positioning donor substrate includes the shape characteristic on identification receptor surface
Three-dimensional (3D) shape, and in response to 3D shape orientation donor substrate.
17. method as claimed in claim 15, wherein the second surface includes warp architecture.
18. method as claimed in claim 15, wherein the second surface of the donor substrate includes more facet structures.
19. method as claimed in claim 18, wherein more facet structures include with opposite angle orientation and with donor
First and second facets of film coating.
20. method as claimed in claim 19, including simultaneously from the donor membrane droplet ejection of the first and second facets to 3D shape
Shape.
21. method as claimed in claim 19, including successively from the donor membrane droplet ejection of the first and second facets to 3D
Shape.
22. method as claimed in claim 15, wherein the second surface of the donor substrate includes periodic structure.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562105761P | 2015-01-21 | 2015-01-21 | |
| US62/105,761 | 2015-01-21 | ||
| PCT/IL2016/050007 WO2016116921A1 (en) | 2015-01-21 | 2016-01-05 | Angled lift jetting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107206548A CN107206548A (en) | 2017-09-26 |
| CN107206548B true CN107206548B (en) | 2019-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201680006659.5A Expired - Fee Related CN107206548B (en) | 2015-01-21 | 2016-01-05 | It is sprayed before inclined induced with laser to conversion |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20170306495A1 (en) |
| EP (1) | EP3247529A4 (en) |
| KR (1) | KR20170102984A (en) |
| CN (1) | CN107206548B (en) |
| IL (1) | IL253169A0 (en) |
| TW (1) | TW201639654A (en) |
| WO (1) | WO2016116921A1 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016020817A1 (en) | 2014-08-07 | 2016-02-11 | Orbotech Ltd. | Lift printing system |
| EP4380323A3 (en) | 2014-10-19 | 2024-09-25 | Orbotech Ltd. | Lift printing of conductive traces onto a semiconductor substrate |
| KR102282860B1 (en) | 2015-01-19 | 2021-07-28 | 오르보테크 엘티디. | Printing of three-dimensional metal structures with a sacrificial support |
| KR20180030609A (en) | 2015-07-09 | 2018-03-23 | 오르보테크 엘티디. | Control of LIFT discharge angle |
| US10688692B2 (en) | 2015-11-22 | 2020-06-23 | Orbotech Ltd. | Control of surface properties of printed three-dimensional structures |
| TW201901887A (en) * | 2017-05-24 | 2019-01-01 | 以色列商奧寶科技股份有限公司 | Electrical interconnection circuit components on the substrate without prior patterning |
| EP3521483A1 (en) * | 2018-02-06 | 2019-08-07 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Lift deposition apparatus and method |
| WO2020222090A1 (en) | 2019-05-01 | 2020-11-05 | Io Tech Group Ltd. | Method to electrically connect chip with top connectors using 3d printing |
| WO2020225810A1 (en) * | 2019-05-07 | 2020-11-12 | Orbotech Ltd. | Lift printing using thin donor foils |
| US11446750B2 (en) | 2020-02-03 | 2022-09-20 | Io Tech Group Ltd. | Systems for printing solder paste and other viscous materials at high resolution |
| US11622451B2 (en) | 2020-02-26 | 2023-04-04 | Io Tech Group Ltd. | Systems and methods for solder paste printing on components |
| EP3893611A1 (en) * | 2020-04-07 | 2021-10-13 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO | Controlled deposition method of a donor material onto a target surface and plate therefor |
| US11497124B2 (en) | 2020-06-09 | 2022-11-08 | Io Tech Group Ltd. | Methods for printing conformal materials on component edges at high resolution |
| US11691332B2 (en) | 2020-08-05 | 2023-07-04 | Io Tech Group Ltd. | Systems and methods for 3D printing with vacuum assisted laser printing machine |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP3247529A4 (en) | 2019-01-16 |
| KR20170102984A (en) | 2017-09-12 |
| CN107206548A (en) | 2017-09-26 |
| EP3247529A1 (en) | 2017-11-29 |
| US20170306495A1 (en) | 2017-10-26 |
| TW201639654A (en) | 2016-11-16 |
| WO2016116921A1 (en) | 2016-07-28 |
| IL253169A0 (en) | 2017-08-31 |
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