CN100593447C - Laser device for cutting - Google Patents
Laser device for cutting Download PDFInfo
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- CN100593447C CN100593447C CN200710074111A CN200710074111A CN100593447C CN 100593447 C CN100593447 C CN 100593447C CN 200710074111 A CN200710074111 A CN 200710074111A CN 200710074111 A CN200710074111 A CN 200710074111A CN 100593447 C CN100593447 C CN 100593447C
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Abstract
The invention discloses an FPC (Flexible Printed Circuit) laser cutting device, consisting of a laser focus scanning system, a control system and a vacuum platform system. The cutting device of the invention improves the FPC formation accuracy and saves processing time and cost.
Description
[technical field]
The present invention relates to a kind of cutter sweep, especially, the present invention relates to a kind of FPC laser cutting device.
[technical background]
Along with the trend that machine, instrument and equipment develop towards miniaturization, such as in industries such as electronics, automobile, space flight, experiments of measuring equipment, the output value of FPC (Flexible Printed Circuit) FPC is increasing.Wiring board cutting forming, traditional method are to come punching press with mould.But the precision of die forming is low, the highest can only being controlled at+/-0.05mm, most+/-0.10mm, often also can damage circuit by pressure; And the Mold Making cycle is long, and can not be general, needs constantly to upgrade, and does not therefore catch up with the paces of research and development.Though many laser cutting devices are also arranged in the market, all can not satisfy the requirement of FPC to precision and cut quality.In this case, just need a kind of new equipment of exploitation to replace mould.Therefore, laser soft board cutter sweep arises at the historic moment.And the soft board cutting technique precision of prior art is not high, can not satisfy the demand of cloth field to the high accuracy cutting.
[summary of the invention]
The technical problem that desire of the present invention solves provides a kind of laser cutting device that the FPC FPC is carried out the high accuracy cutting.
The technical solution adopted in the present invention is: a kind of Ultra-Violet Laser cutter sweep, and this device comprises the laser focus scanning system, and the arbitrary curve of setting is carried out the scanning of true ratio;
Control system, target on the target object is sought with the location by computer control CCD by this system; This system also controls laser instrument emission laser, vibration mirror scanning and platform simultaneously and moves;
The vacuum pumping platform system, the vacuum absorption device of this system can not produce processing plate and platform and relatively moves.
Described scanning system comprises laser instrument, is used to produce laser; Speculum; Beam expanding lens, being used for a laser instrument emitted laser expands bundle; Galvanometer; Focus lamp is used for focusing on through expanding the laser after restrainting.
The wavelength of described laser instrument emitted laser is 355nm, frequency: 0-100KHz, beam diameter: 1.2mm, average output power: 8w, pulse width: 80ns.
The graphic file to be processed that described control system will import control system automatically is divided into some sub-districts, processes successively from first zonule then.
Described laser focus scanning system is focused into a small spot with laser beam.
Described vacuum pumping platform system comprises worktable panel, workbench base plate, snap joint, vacuum generator, and this system's utilization vacuumizes target object absorption and is fixed on the platform, and this system also is provided with dust exhaust apparatus.
The technique effect that the present invention will reach is, utilize the high-energy of laser focused spot, destroy the strand of machined material, realize the purpose of cutting, the present invention is run up by the computer control galvanometer, makes focus point scan two-dimensional curve with true ratio on platform.The present invention can revise arbitrarily cutting parameter in software as required, to reach better cutting effect.The present invention combines with computer, realizes the automation of cutting process.
[description of drawings]
The invention will be further described in conjunction with example with reference to the accompanying drawings.
Fig. 1 is a work schematic diagram of the present invention.
Fig. 2 is the schematic diagram of control system of the present invention.
[specific embodiment]
As shown in Figure 1, the FPC plate 7 that will process earlier is adsorbed on the platform 8 by pumped vacuum systems, and pumped vacuum systems comprises worktable panel, workbench base plate, snap joint, vacuum generator.The workbench base plate is connected with screw with worktable panel, snap joint is directly installed on the workbench base plate, the other end of snap joint is connected with the vacuum mouth of pipe of vacuum generator by plastic flexible pipe, the air inlet of vacuum generator is received in the gas circuit by plastic flexible pipe and is connected with compressed air, when compressed air enters vacuum generator, air forms high velocity air in the pump housing, therefore just have strong more suction capactity, like this FPC plate is adsorbed on the platform 8 firmly.
As shown in Figure 2, control flow of the present invention is as follows: the control system that the file of FPC plate 7 is imported computer before processing, the software of system can be divided into it some zonules automatically according to the size of graphic file, adds man-hour from first zone beginning processing successively.We are provided with initial parameter, main initial parameter comprises the thickness of laser frequency, pulse width, cutting speed, plate etc., wherein, cutting speed is decided according to material, generally between 100-500mm/s, laser frequency: 0-100KHz, pulse width is less than the inverse of the frequency of setting, and thickness of slab is less than 2mm.Each parameter needs constantly to regulate in actual process, to reach best.As the parameter that is provided with when a kind of PI film of cutting be: wavelength 355nm, beam diameter: 1.2mm, average output power: 8w, frequency: 60KHz, pulsewidth: 10ns, speed: 250mm/s thickness: 0.16mm.Setting just can be by the beginning key after the parameter, computer software can control CCD9 look on the FPC plate 7 target 10 with the location, target 10 is the intrinsic location points of FPC plate 7, control system can grasp the signal that feeds back according to CCD9 and discern, once identification is unsuccessful, CCD9 can carry out feedback repeatedly, until till locating successfully; Control system is controlled laser instrument emission laser, vibration mirror scanning, platform simultaneously and is moved and process.
As shown in Figure 1, adding man-hour, laser instrument 1 can be launched beam of laser according to default parameter, 2 reflections enter beam expanding lens 3 through speculum, the laser beam that expands behind the bundle enters galvanometer 5 through speculum 4, and galvanometer 5 changes the angle of light beam outgoing by the angle of swinging its reflector plate, and outgoing beam enters focus lamp 6 again, focus lamp 6 is focused into a little luminous point with laser beam, utilizes this little luminous point to cut then.After processing a zone, computer software can be controlled platform and move to the continuation processing of next zone, processes up to whole FPC plate 7.Vacuumizing and adsorbing can not produce processing plate and platform and relatively moves, and the dust exhaust apparatus of platform setting adsorbs dust, the dust that cutting produces fully, has guaranteed the precision of cutting and the cleaning of plate.
The laser instrument of high frequency of the present invention can reach good cutting effect, and the galvanometer that runs up has improved the speed of cutting, and high-precision galvanometer and platform relative motion have guaranteed the precision of workpiece size.
Claims (4)
1, a kind of Ultra-Violet Laser cutter sweep, it is characterized in that: this device is used to cut FPC, and cutting speed is 100-500mm/s, and this device comprises:
The laser focus scanning system carries out the scanning of true ratio to the arbitrary curve of setting; Described scanning system comprises laser instrument, is used to produce laser; Speculum; Beam expanding lens, being used for a laser instrument emitted laser expands bundle; Galvanometer; Focus lamp is used for focusing on through expanding the laser after restrainting; The wavelength of described laser instrument emitted laser is 355nm, frequency: 0-100KHz, and beam diameter: 1.2mm, average output power: 8w, the pulse width of laser is less than the inverse of the frequency of setting;
With the location, this system also controls laser instrument emission laser, vibration mirror scanning and platform simultaneously and moves by the target on the computer control CCD searching target object for control system, this system;
The vacuum pumping platform system, the vacuum absorption device of this system can not produce processing plate and platform and relatively moves.
2, Ultra-Violet Laser cutter sweep as claimed in claim 1 is characterized in that: the graphic file to be processed that described control system will import control system automatically is divided into some sub-districts, processes successively from first zonule then.
3, Ultra-Violet Laser cutter sweep as claimed in claim 1 is characterized in that: described laser focus scanning system is focused into a small spot with laser beam.
4, Ultra-Violet Laser cutter sweep as claimed in claim 1, it is characterized in that: described vacuum pumping platform system comprises worktable panel, workbench base plate, snap joint, vacuum generator, this system's utilization vacuumizes target object absorption and is fixed on the platform, and this system also is provided with dust exhaust apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710074111A CN100593447C (en) | 2007-04-19 | 2007-04-19 | Laser device for cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710074111A CN100593447C (en) | 2007-04-19 | 2007-04-19 | Laser device for cutting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101288921A CN101288921A (en) | 2008-10-22 |
| CN100593447C true CN100593447C (en) | 2010-03-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200710074111A Active CN100593447C (en) | 2007-04-19 | 2007-04-19 | Laser device for cutting |
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| CN (1) | CN100593447C (en) |
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2007
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| CN101288921A (en) | 2008-10-22 |
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Address after: 518051 Dazu laser building, 9 new West Road, North Nanshan District high tech park, Shenzhen, Guangdong Co-patentee after: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Patentee after: HANS LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Address before: No. 5 road 518057 in Guangdong province Shenzhen city Nanshan District high tech park of Pine Hill Factory District No. 8 Co-patentee before: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Patentee before: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen |
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Effective date of registration: 20200612 Address after: 518101 workshop 5 / F, 1 / 2 / F, 14 / F, 17 / F, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518051 Dazu Laser Building, No. 9 Xinxi Road, North District, Nanshan High-tech Park, Shenzhen City, Guangdong Province Co-patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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Address after: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |