CN103182608B - The processing method that pcb board is uncapped - Google Patents

The processing method that pcb board is uncapped Download PDF

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Publication number
CN103182608B
CN103182608B CN201310115670.3A CN201310115670A CN103182608B CN 103182608 B CN103182608 B CN 103182608B CN 201310115670 A CN201310115670 A CN 201310115670A CN 103182608 B CN103182608 B CN 103182608B
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China
Prior art keywords
pcb board
laser beam
uncapping
processing method
processing
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CN201310115670.3A
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CN103182608A (en
Inventor
范永闯
高云峰
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Shenzhen Hans CNC Technology Co Ltd
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Han s Laser Technology Industry Group Co Ltd
Shenzhen Hans CNC Technology Co Ltd
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Abstract

The processing method that pcb board is uncapped, it comprises: the shape presetting the region of uncapping of described pcb board; Described pcb board is placed on processing platform; Adopt laser beam along described in the uncap border in region cut, the power of wherein said laser beam is 3 ~ 10 watts, the rate travel of the relatively described pcb board of described laser beam be 100 ~ 400 millimeters per second, the pulse frequency of described laser beam is 50 ~ 150 KHzs, and the burst length is 1 ~ 5 microsecond.The processing method that above-mentioned pcb board is uncapped adopts laser beam to cut along the border in region of uncapping, and can control the working depth of pcb board, cut edge is smooth without dust, thus improves cutting quality, reduces production cost, promotes the competitiveness of pcb board.

Description

The processing method that pcb board is uncapped
[technical field]
The present invention relates to a kind of processing method of pcb board, particularly relate to a kind of processing method adopting the pcb board of Laser Processing.
[background technology]
Pcb board processing of uncapping is the important operation of one, pcb board factory, because electronics market change is very fast, the replacing construction of new product model is accelerated, and the competition between wiring board enterprise is more and more serious, in order to obtain more order, each enterprise all accelerates the speed of paying sample.
Traditional pcb board is uncapped and is adopted mould die cutting techniques to carry out hemisection, easily causes the edge of pcb board uneven or hurt base plate etc. and cause pcb board to scrap.And different pcb board needs to be equipped with different moulds, the pcb board of same type also needs to change mould if any upgrade file variation, increases production cost.
[summary of the invention]
In view of above-mentioned condition, be necessary to provide a kind of quality of uncapping processing method that higher, lower-cost pcb board is uncapped.
The processing method that pcb board is uncapped, it comprises:
Preset the shape in the region of uncapping of described pcb board;
Described pcb board is placed on processing platform; And
Adopt laser beam along described in the uncap border in region cut, the power of wherein said laser beam is 3 ~ 10 watts, the rate travel of the relatively described pcb board of described laser beam be 100 ~ 400 millimeters per second, the pulse frequency of described laser beam is 50 ~ 150 KHzs, and the burst length is 1 ~ 5 microsecond.
The processing method that above-mentioned pcb board is uncapped adopts laser beam to cut along the border in region of uncapping, and can control the working depth of pcb board, cut edge is smooth without dust, thus improves cutting quality, reduces production cost, promotes the competitiveness of pcb board.
Wherein in an embodiment, described pcb board comprises soft board layer and two layers of uncapping, and described two layers of uncapping are layered on two apparent surfaces of described soft board layer respectively.
Wherein in an embodiment, 1/2 ~ 2/3 of layer thickness of uncapping described in the degree of depth that described laser beam cuts equals.
Wherein in an embodiment, described pcb board is fixed on described processing platform, and the laser head launching described laser beam moves.
Wherein in an embodiment, described processing platform is provided with vacuum absorption device, for described pcb board is adsorbed on processing platform.
Wherein in an embodiment, the laser head launching described laser beam is fixed relative to described processing platform, and described processing platform is provided with mobile platform, and described pcb board is fixed on described mobile platform, and described mobile platform drives described pcb board to move.
Wherein in an embodiment, described laser beam is UV laser beam.
Wherein in an embodiment, described laser beam is 1 ~ 4 time around the processing number of times of described zone boundary of uncapping.
[accompanying drawing explanation]
Fig. 1 is the principle schematic of the processing method that the pcb board of embodiment of the present invention is uncapped;
The schematic diagram of the working depth of the layer of uncapping that Fig. 2 is the pcb board shown in Fig. 1.
[detailed description of the invention]
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Preferred embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the understanding of disclosure of the present invention more comprehensively thorough.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
The processing method that the pcb board of embodiment of the present invention is uncapped, for uncapping to pcb board 100.Refer to figure, the processing method that this pcb board is uncapped comprises the steps a ~ step c.
Step a, presets the shape in the region of uncapping of described pcb board 100.Preferably, described pcb board 100 comprises soft board layer 110 and two layers 130 of uncapping, and described two layers 130 of uncapping are layered on two apparent surfaces of described soft board layer 110 respectively.
Step b, is placed on described pcb board 100 on processing platform 300.
Step c, adopts laser beam 200 to cut along the border in described region of uncapping.Preferably, the power of described laser beam 200 is 3 ~ 10 watts, if power is too low, in order to reach working depth, then will increase processing number of times accordingly, will certainly have influence on the uniformity of working depth; If power is too high, cutting surfaces will produce serious melanism, has influence on processing quality.The rate travel of the relatively described pcb board 100 of described laser beam 200 be 100 ~ 400 millimeters per second, if rate travel is too slow, cutting surfaces also can produce serious melanism, has influence on processing quality; Rate travel is too fast, and in order to reach working depth, corresponding also will increasing processes number of times thus the uniformity that can have influence on working depth.The pulse frequency of described laser beam 200 is 50 ~ 150 KHzs, and the burst length is 1 ~ 5 microsecond, to reach desirable working power.Preferably, described laser beam 200 is UV laser beam.
Described laser beam 200 moving relative to described pcb board 100, can be that laser beam 200 moves or pcb board 100 moves, such as, described pcb board 100 be fixed on described processing platform 300, and the laser head 400 launching described laser beam 200 moves.Preferably, described processing platform 300 is provided with vacuum absorption device, for described pcb board 100 is adsorbed on processing platform 300.Owing to adopting vacuum absorption device location pcb board 100, make pcb board 100 in the process of processing, keep smooth stable.
Or the laser head 400 launching described laser beam 200 is fixed relative to described processing platform 300, and described processing platform 300 is provided with mobile platform, and described pcb board 100 is fixed on described mobile platform, and described mobile platform drives described pcb board 100 to move.
Refer to Fig. 2, further, uncap described in the degree of depth h that described laser beam 200 cuts equals 1/2 ~ 2/3 of layer 130 thickness H.
Further, described laser beam 200 is 1 ~ 4 time around the processing number of times of described zone boundary of uncapping.
Laser cutting principle utilizes the high power laser light focused on to irradiate rapidoprint surface, after laser beam 200 exceedes threshold power density, the chemical bond of long key-like macromolecule organic can be interrupted, under numerous particle causes volume to increase and external force is aspirated, material is rapidly removed and pore-forming, along with laser beam 200 and the relative movement of workpiece, finally form joint-cutting at material surface.Adopt mould die cutting techniques to carry out hemisection, easily cause product edge uneven and hurt base plate etc. and cause product rejection.But, adopt laser beam 200 cutting processing, laser working depth can be controlled to ensure that product is qualified.Easily puncture the layer 130 of uncapping of pcb board 100 when laser energy is excessive, hurt soft board below, cause scrapping, therefore need the power of control laser beam 200, rate travel, pulse frequency and burst length.
The processing method that above-mentioned pcb board is uncapped adopts laser beam 200 to cut along the border in region of uncapping, can control the working depth of pcb board 100, cut edge is smooth without dust, thus improves cutting quality, reduce production cost, promote the competitiveness of pcb board 100.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (6)

1. a pcb board processing method of uncapping, is characterized in that, comprising:
Preset the shape in the region of uncapping of described pcb board;
Described pcb board is placed on processing platform; And
Adopt laser beam along described in the uncap border in region cut, the power of wherein said laser beam is 3 ~ 10 watts, the rate travel of the relatively described pcb board of described laser beam be 100 ~ 400 millimeters per second, the pulse frequency of described laser beam is 50 ~ 150 KHzs, burst length is 1 ~ 5 microsecond, described pcb board comprises soft board layer and two layers of uncapping, described two layers of uncapping are layered on two apparent surfaces of described soft board layer respectively, 1/2 ~ 2/3 of layer thickness of uncapping described in the degree of depth that described laser beam cuts equals.
2. the pcb board as claimed in claim 1 processing method of uncapping, it is characterized in that, described pcb board is fixed on described processing platform, and the laser head launching described laser beam moves.
3. the pcb board as claimed in claim 2 processing method of uncapping, it is characterized in that, described processing platform is provided with vacuum absorption device, for described pcb board is adsorbed on processing platform.
4. the pcb board as claimed in claim 1 processing method of uncapping, it is characterized in that, the laser head launching described laser beam is fixed relative to described processing platform, described processing platform is provided with mobile platform, described pcb board is fixed on described mobile platform, and described mobile platform drives described pcb board to move.
5. the pcb board as claimed in claim 1 processing method of uncapping, it is characterized in that, described laser beam is UV laser beam.
6. the pcb board as claimed in claim 1 processing method of uncapping, it is characterized in that, described laser beam is 1 ~ 4 time around the processing number of times of described zone boundary of uncapping.
CN201310115670.3A 2013-04-03 2013-04-03 The processing method that pcb board is uncapped Active CN103182608B (en)

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Publication number Priority date Publication date Assignee Title
CN106271096B (en) * 2015-06-09 2019-09-20 大族激光科技产业集团股份有限公司 A kind of processing method of pcb board
CN106425121A (en) * 2016-12-02 2017-02-22 光达(深圳)精密设备有限公司 Method for laser cutting of printed circuit board (PCB)

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CN101288921A (en) * 2007-04-19 2008-10-22 深圳市大族激光科技股份有限公司 Laser device for cutting
CN101480758A (en) * 2009-01-22 2009-07-15 华中科技大学 Technological process of ultraviolet laser cutting flexible printed circuit board
CN101610643A (en) * 2009-07-14 2009-12-23 华中科技大学 A kind of method of processing blind hole by laser
CN101676059A (en) * 2005-03-04 2010-03-24 日立比亚机械股份有限公司 Method and device for perforating printed circuit board
CN101870039A (en) * 2010-06-12 2010-10-27 中国电子科技集团公司第四十五研究所 Double-workbench drive laser processing machine and processing method thereof
DE102009060480A1 (en) * 2009-12-18 2011-06-22 Schweizer Electronic AG, 78713 Conductor structure element and method for producing a conductor structure element
CN102256438A (en) * 2011-05-09 2011-11-23 厦门市英诺尔电子科技有限公司 Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof
CN102271469A (en) * 2011-07-08 2011-12-07 深圳市精诚达电路有限公司 Method for processing rigid-flexible printed circuit board (PCB)
CN102510679A (en) * 2011-11-02 2012-06-20 上海美维电子有限公司 Method for processing rigid-flexible printed circuit board (PCB)

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US7062845B2 (en) * 1996-06-05 2006-06-20 Laservia Corporation Conveyorized blind microvia laser drilling system
KR101044135B1 (en) * 2009-11-30 2011-06-28 삼성전기주식회사 Fabricating Method Of Printed Circuit Board

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1843649A2 (en) * 1998-09-03 2007-10-10 Ibiden Co., Ltd. Multilayered printed circuit board and manufacturing method therefor
CN101676059A (en) * 2005-03-04 2010-03-24 日立比亚机械股份有限公司 Method and device for perforating printed circuit board
CN101288921A (en) * 2007-04-19 2008-10-22 深圳市大族激光科技股份有限公司 Laser device for cutting
CN101480758A (en) * 2009-01-22 2009-07-15 华中科技大学 Technological process of ultraviolet laser cutting flexible printed circuit board
CN101610643A (en) * 2009-07-14 2009-12-23 华中科技大学 A kind of method of processing blind hole by laser
DE102009060480A1 (en) * 2009-12-18 2011-06-22 Schweizer Electronic AG, 78713 Conductor structure element and method for producing a conductor structure element
CN101870039A (en) * 2010-06-12 2010-10-27 中国电子科技集团公司第四十五研究所 Double-workbench drive laser processing machine and processing method thereof
CN102256438A (en) * 2011-05-09 2011-11-23 厦门市英诺尔电子科技有限公司 Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof
CN102271469A (en) * 2011-07-08 2011-12-07 深圳市精诚达电路有限公司 Method for processing rigid-flexible printed circuit board (PCB)
CN102510679A (en) * 2011-11-02 2012-06-20 上海美维电子有限公司 Method for processing rigid-flexible printed circuit board (PCB)

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Patentee after: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd.

Address before: 518055, the Han Dynasty laser building, No. 9 West West Road, Nanshan District hi tech park, Guangdong, Shenzhen

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Address after: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province

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