CN106271096B - A kind of processing method of pcb board - Google Patents
A kind of processing method of pcb board Download PDFInfo
- Publication number
- CN106271096B CN106271096B CN201510312503.7A CN201510312503A CN106271096B CN 106271096 B CN106271096 B CN 106271096B CN 201510312503 A CN201510312503 A CN 201510312503A CN 106271096 B CN106271096 B CN 106271096B
- Authority
- CN
- China
- Prior art keywords
- pcb board
- processing
- laser beam
- cutting
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to technical field of laser processing, disclose a kind of processing method of pcb board, which includes the following: the shape of cutting region on default pcb board；The pcb board is placed on processing platform；It is cut on the boundary of cutting region along pcb board using laser beam, and using layering and front and back sides processing；Wherein the power of laser beam is 8~12W, and the rate travel of the relatively described pcb board of laser beam is 100~300mm/s, and the pulse frequency of laser beam is 30~60KHz, and the burst length is 1~4um.It is cut using laser beam along the boundary of cutting region in the present invention, the smooth no dust in cut edge, and is cut using layering and front and back sides, to improve cutting quality, reduce production cost, raising efficiency, to promote the competitiveness of pcb board.
Description
Technical field
The present invention relates to technical field of laser processing, more specifically, in particular to a kind of processing method of pcb board.
Background technique
Pcb board is one important process of pcb board factory with a thickness of 1.0mm or more, quickly due to electronics market variation,
The replacing construction of new product model is accelerated, and the competition between wiring board enterprise is increasingly severe, each in order to obtain more orders
Enterprise all accelerates the speed for delivering sample.
Traditional is cut with a thickness of the cutting of 1.0mm or more pcb board using mold die cutting techniques entirely, is be easy to cause like that
The edge of pcb board is uneven or hurts structure etc. pcb board is caused to scrap, and different pcb boards need to be equipped with different molds,
Same type of pcb board increases production cost if any upgrade file variation is also required to change mold, using machining, produces
Product initial design arrange when for material saving and arrange it is closeer can not change when, have hard force to a thickness of the PCB of 1.0mm or more
It is required that when, machining is all unable to satisfy and causes to scrap.
Summary of the invention
It is an object of the invention to be directed to technical problem of the existing technology, a kind of processing method of pcb board is provided,
Cut quality is higher, cost is relatively low.
In order to solve posed problems above, the technical solution adopted by the present invention are as follows:
A kind of processing method of pcb board, the processing method include the following:
The shape of cutting region on default pcb board；
The pcb board is placed on processing platform；
It is cut on the boundary of cutting region along pcb board using laser beam, and using layering and front and back sides processing；Wherein
The power of laser beam is 8~12W, and the rate travel of the relatively described pcb board of laser beam is 100~300mm/s, the pulse of laser beam
Frequency is 30~60KHz, and the burst length is 1~4um.
The processing platform is equipped with vacuum absorption device, for pcb board to be adsorbed on processing platform.
The pcb board is fixed on processing platform, and the laser head for emitting the laser beam is mobile.
The laser head of the transmitting laser beam is fixed relative to processing platform, and processing platform is equipped with mobile platform,
Pcb board is fixed on a mobile platform, and mobile platform drives pcb board mobile.
The laser beam uses UV laser beam.
The processing times of the laser beam are 8~27 times.
Compared with prior art, the beneficial effects of the present invention are:
It is cut, the smooth no dust in cut edge, and adopted along the boundary of cutting region using laser beam in the present invention
It is cut with layering and front and back sides, to improve cutting quality, reduces production cost, raising efficiency and cutting accuracy, cutting
The hard force requirement of pcb board itself is nor affected on later, and destroys the structure between every layer of pcb board, to promote the competing of pcb board
It is not up to standard if will appear hard force if machine cuts using other cuttings to strive power, and the structure between every layer of pcb board can be destroyed.
In addition, not limited by pcb board planform using laser cutting, and do not pollute other components without dust, if
It then will appear that dust is more using machine cuts, dust, which grows on trees, after cutting pollutes route on pcb board or part and surface.
Detailed description of the invention
Fig. 1 is the machining sketch chart of pcb board of the present invention.
Fig. 2 is the flow chart of pcb board processing method of the present invention.
Fig. 3 is the sectional view after pcb board of the present invention cutting.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the invention can be realized in many different forms, however it is not limited to this paper institute
The embodiment of description.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more thorough
Comprehensively.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
Refering to fig. 1 and shown in Fig. 2, a kind of processing method of pcb board provided by the invention, for a thickness of 1.0mm with
The obverse and reverse of upper pcb board carries out cutting processing.
The step of processing method, is as follows:
Step S1: the shape of cutting region on default pcb board 100.Preferably, cutting region is in the main hardboard of pcb board 100
It is preset on apparent surface.
Step S2: the pcb board 100 is placed on processing platform 300.
Preferably, the processing platform 300 is equipped with vacuum absorption device, for pcb board 100 to be adsorbed on processing platform
On 300.Due to positioning pcb board 100 using vacuum absorption device, pcb board 100 is made to keep smooth stabilization during processing.
Step S3: using laser beam 200, the boundary of cutting region is cut along pcb board 100, and using layering and just
Reverse side cutting.
The Slice by slice cutting be with defocusing away from come realize can quantity set, processing times be 8~27 times.Since pcb board is thicker,
Through over-focusing back focal length value it is about 400um with normal laser, therefore a layered shaping need to be done, since laser beam 200 is very thin,
There is very big a part of energy to be concentrated in product surface when cutting to middle layer, to guarantee that product quality and effect are best, therefore adopts
It is cut with front and back sides, so smooth no dust in cut edge, to improve cutting quality, reduces production cost, promote cutting effect
Rate.
Preferably, the power of the laser beam 200 is 8~12W, if power is too low, it may appear that cutting constantly, hair occurs
Thorn will should then increase processing times to reach cutting accordingly；If power is excessively high, cutting surfaces will generate serious
Melanism influences processing quality.
The rate travel of the relatively described pcb board 100 of the laser beam 200 is 100~300mm/s, if rate travel is too
Slowly, cutting surfaces can also generate serious melanism, influence processing quality；Rate travel is too fast, it may appear that and cutting is continuous,
There is burr, in order to reach cutting, should then reduce rate travel accordingly or increase power.
Among the above, laser beam 200 can be the movement of laser beam 200 or pcb board 100 be mobile relative to the movement of pcb board 100,
For example, pcb board 100 is fixed on the processing platform 300, the laser head 400 for emitting the laser beam 200 is mobile.Alternatively, hair
The laser head 400 for penetrating the laser beam 200 is fixed relative to the processing platform 300, and the processing platform 300 is equipped with movement
Platform, pcb board 100 is fixed on a mobile platform, and mobile platform drives pcb board 100 mobile.
The pulse frequency of the laser beam 200 is 30~60KHz, and the burst length is 1~4um, to reach ideal processing
Power, laser beam 200 are preferably UV laser beam.
In the present invention, laser cutting principle is to work as laser beam using the high power laser light irradiation rapidoprint surface focused
The chemical bond of long key-like macromolecule organic more than after threshold power density, can be interrupted, cause body in numerous particles by 200
Product increases under external force suction, is rapidly removed material and pore-forming, with the relative movement of laser beam 200 and workpiece, most
Form joint-cutting on the surface of the material eventually.However, using 200 cutting processing of laser beam, without considering that product is arranged, the factors such as structure,
It can control laser machining site and redemption, meet demand is to guarantee product qualification.
The following are the pcb board part machined parameters data of the thickness 1.0mm of experiment test:
The above power is to test the data obtained using laser for experimental facilities.
Fig. 3 Green is coating, and centre is laser cutting section path, and latticed is pcb board schematic cross-section, wherein scheming
A be it is normal, figure B be cut through it is more, figure C be cutting it is very few.
In above table by taking first group of process data as an example: if speed is constant with pulse frequency, cutting times are excessive, then
Therefore pcb board surface protection coating can be destroyed or be influenced the performance of product itself, the pcb board after cutting through mostly just will appear
As Fig. 3 B in phenomenon.If speed is constant with pulse frequency, cutting times will appear if excessively few be can't cut, if can't cut strong
Property processed break it is disconnected just will appear flash or burr and phenomena such as pcb board is layered, as Fig. 3 C in phenomenon.
Therefore, if machined parameters be arranged it is unreasonable if will affect product itself performance and destroy pcb board surface coating,
Or it will appear cutting and constantly cause the problems such as scrapping.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (4)
1. a kind of processing method of pcb board, it is characterised in that: the processing method includes the following:
The shape of cutting region on default pcb board；
The pcb board is placed on processing platform；
It is cut on the boundary of cutting region along pcb board using laser beam, and using layering and front and back sides processing；Wherein laser
The power of beam is 8~12W, and the rate travel of the relatively described pcb board of laser beam is 100~300mm/s, the pulse frequency of laser beam
For 30~60KHz, the burst length is 1~4um；The processing method of the pcb board be used for a thickness of 1.0mm or more pcb board into
Row cutting processing, layering processing are with defocusing away from come realize can quantity set；The laser beam uses UV laser beam；It is described to swash
The processing times of light beam are 8~27 times.
2. the processing method of pcb board according to claim 1, it is characterised in that: the processing platform is inhaled equipped with vacuum
Adsorption device, for pcb board to be adsorbed on processing platform.
3. the processing method of pcb board according to claim 1, it is characterised in that: the pcb board is fixed on processing platform
On, the laser head for emitting the laser beam is mobile.
4. the processing method of pcb board according to claim 3, it is characterised in that: the laser of the transmitting laser beam
Head is fixed relative to processing platform, and processing platform is equipped with mobile platform, and pcb board is fixed on a mobile platform, mobile platform band
Dynamic pcb board is mobile.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510312503.7A CN106271096B (en) | 2015-06-09 | 2015-06-09 | A kind of processing method of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510312503.7A CN106271096B (en) | 2015-06-09 | 2015-06-09 | A kind of processing method of pcb board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106271096A CN106271096A (en) | 2017-01-04 |
| CN106271096B true CN106271096B (en) | 2019-09-20 |
Family
ID=57660212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510312503.7A Active CN106271096B (en) | 2015-06-09 | 2015-06-09 | A kind of processing method of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106271096B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107150179B (en) * | 2017-07-14 | 2019-09-10 | 东莞市盛雄激光设备有限公司 | A kind of zero draft laser cutting device and its cutting method |
| CN110315216B (en) * | 2018-03-29 | 2021-07-30 | 上海名古屋精密工具股份有限公司 | Method for laser machining a workpiece and use thereof for producing a tool |
| CN109104818A (en) * | 2018-09-29 | 2018-12-28 | 江苏芯力特电子科技有限公司 | A kind of pcb board processing method |
| CN114406487A (en) * | 2020-10-14 | 2022-04-29 | 大族激光科技产业集团股份有限公司 | Laser cutting identification method, device, equipment and medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000077851A (en) * | 1998-09-03 | 2000-03-14 | Ibiden Co Ltd | Manufacture of multilayer printed wiring board |
| CN101288921A (en) * | 2007-04-19 | 2008-10-22 | 深圳市大族激光科技股份有限公司 | Laser device for cutting |
| CN101480758A (en) * | 2009-01-22 | 2009-07-15 | 华中科技大学 | Technological process of ultraviolet laser cutting flexible printed circuit board |
| CN103182608A (en) * | 2013-04-03 | 2013-07-03 | 深圳市大族激光科技股份有限公司 | Processing method of PCB (Printed Circuit Board) open cover |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI382795B (en) * | 2005-03-04 | 2013-01-11 | Hitachi Via Mechanics Ltd | A method of opening a printed circuit board and an opening device for a printed circuit board |
| CN101402158B (en) * | 2008-11-05 | 2012-03-14 | 深圳市大族激光科技股份有限公司 | Laser cutting method for PCB plate |
-
2015
- 2015-06-09 CN CN201510312503.7A patent/CN106271096B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000077851A (en) * | 1998-09-03 | 2000-03-14 | Ibiden Co Ltd | Manufacture of multilayer printed wiring board |
| CN101288921A (en) * | 2007-04-19 | 2008-10-22 | 深圳市大族激光科技股份有限公司 | Laser device for cutting |
| CN101480758A (en) * | 2009-01-22 | 2009-07-15 | 华中科技大学 | Technological process of ultraviolet laser cutting flexible printed circuit board |
| CN103182608A (en) * | 2013-04-03 | 2013-07-03 | 深圳市大族激光科技股份有限公司 | Processing method of PCB (Printed Circuit Board) open cover |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106271096A (en) | 2017-01-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106271096B (en) | A kind of processing method of pcb board | |
| US10639741B2 (en) | Ablation cutting of a workpiece by a pulsed laser beam | |
| EP1634673A4 (en) | Method of producing laser-processed product and adhesive sheet, for laser processing used therefor | |
| TW201529286A (en) | Method for manufacturing three-dimensional modeled object | |
| KR102267989B1 (en) | Processing method of package substrate | |
| US10821663B2 (en) | Method for manufacturing three-dimensional shaped object | |
| MX2007003742A (en) | Brittle material scribing method and scribing apparatus. | |
| EP2886231B1 (en) | Method of manufacturing a formed portion of a car body | |
| CN110877160A (en) | Quartz glass laser three-dimensional cutting and material removing method and device | |
| CN102179632A (en) | Method for cutting golden finger of flexible circuit board by ultraviolet laser | |
| CN109967804B (en) | Micro turning tool front tool surface texture derivative cutting inhibition processing method | |
| CN206154057U (en) | Gate buries an abrasive band grinding device | |
| CN110744201A (en) | Preparation method of micro-texture cutter and micro-texture cutter | |
| CN103182608B (en) | The processing method that pcb board is uncapped | |
| CN101428355A (en) | Milling method for honeycomb parts | |
| CN115159828A (en) | Laser cutting method and system for ground glass | |
| CN101856841A (en) | Method for scribing ceramic substrate | |
| CN203995368U (en) | A kind of twolip diamond cutter for engraved stone | |
| CN107971751B (en) | Fully-automatic chamfering machine | |
| CN107039260A (en) | The processing method of chip | |
| CN213257731U (en) | High strength aluminum alloy frame laser cutting machine | |
| KR101819608B1 (en) | Method and apparatus for cutting glass laminates | |
| CN106363240A (en) | Noise-reduction saw blade and manufacture method for base body of same | |
| CN104772607A (en) | Group hole accuracy machining method of liquid engine injector plate | |
| EP1790447B1 (en) | Process and apparatus for machining panel-shaped workpieces |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200629 Address after: 518000 No. 9988 Shennan Avenue, Shenzhen, Guangdong, Nanshan District Patentee after: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518000, No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address |