CN106271096A - A kind of processing method of pcb board - Google Patents
A kind of processing method of pcb board Download PDFInfo
- Publication number
- CN106271096A CN106271096A CN201510312503.7A CN201510312503A CN106271096A CN 106271096 A CN106271096 A CN 106271096A CN 201510312503 A CN201510312503 A CN 201510312503A CN 106271096 A CN106271096 A CN 106271096A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- laser beam
- processing
- processing method
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Abstract
The present invention relates to technical field of laser processing, the processing method disclosing a kind of pcb board, this processing method includes the following: the shape of cutting zone on default pcb board；Described pcb board is placed on processing platform；Use laser beam to cut on the border of cutting zone along pcb board, and use layering and positive and negative processing；Wherein the power of laser beam is 8～12W, and the rate travel of the most described pcb board of laser beam is 100～300mm/s, and the pulse frequency of laser beam is 30～60KHz, and the burst length is 1～4um.Using laser beam to cut along the border of cutting zone in the present invention, cut edge is smooth without dust, and uses layering and positive and negative to cut, thus improves cutting quality, reduces production cost, raising efficiency, thus promotes the competitiveness of pcb board.
Description
Technical field
The present invention relates to technical field of laser processing, in particular, particularly to a kind of pcb board
Processing method.
Background technology
Pcb board thickness is that 1.0mm is above one important operation of pcb board factory, due to electronic product city
Quickly, the replacing construction of new product model is accelerated, and the competition between wiring board enterprise is more and more tighter in field change
Weight, in order to obtain more order, each enterprise all accelerates the speed paying sample.
Traditional thickness is that the cutting of more than 1.0mm pcb board uses mould die cutting techniques entirely to cut, that
It is uneven or hurt structure etc. and cause pcb board to scrap that sample easily causes the edge of pcb board, and not
Needing to be equipped with different moulds with pcb board, same type of pcb board also needs if any upgrade file variation
Mould to be changed, increases production cost, makes to be machined into, and product when initial design is arranged is
Material saving and arrange closeer when cannot change, the PCB that thickness is more than 1.0mm is had hard force requirement
Time, machining all cannot meet and cause and scrap.
Summary of the invention
Present invention aims to the technical problem that prior art exists, it is provided that a kind of pcb board
Processing method, its cut quality is higher, cost is relatively low.
In order to solve posed problems above, the technical solution used in the present invention is:
The processing method of a kind of pcb board, this processing method includes the following:
Preset the shape of cutting zone on pcb board；
Described pcb board is placed on processing platform；
Use laser beam cut on the border of cutting zone along pcb board, and use layering and positive and negative
Face processes；Wherein the power of laser beam is 8～12W, the rate travel of the most described pcb board of laser beam
Being 100～300mm/s, the pulse frequency of laser beam is 30～60KHz, and the burst length is 1～4um.
Described processing platform is provided with vacuum absorption device, for adsorbing pcb board at processing platform.
Described pcb board is fixed on processing platform, and the laser head launching described laser beam moves.
The laser head of the described laser beam of described transmitting is fixed relative to processing platform, and processing platform is provided with
Mobile platform, pcb board is fixing on a mobile platform, and mobile platform drives pcb board to move.
Described laser beam uses UV laser beam.
The processing number of times of described laser beam is 8～27 times.
Compared with prior art, the beneficial effects of the present invention is:
The present invention use laser beam cut along the border of cutting zone, the smooth nothing in cut edge
Dust, and use layering and positive and negative to cut, thus improve cutting quality, reduce production cost,
Raising efficiency and cutting accuracy, nor affect on the hard force requirement of pcb board itself, and destroy after cutting
Structure between pcb board every layer, if thus promoting the competitiveness of pcb board and use other cutting such as machine
It is the most up to standard that tool cutting then there will be hard force, and can destroy the structure between pcb board every layer.
Additionally, use cut not limited by pcb board planform, and do not pollute other without dust
Parts, if using machine cuts, there will be dust many, and after cutting, dust grows on trees and pollutes
Circuit on pcb board or part and surface.
Accompanying drawing explanation
Fig. 1 is the machining sketch chart of pcb board of the present invention.
Fig. 2 is the flow chart of pcb board processing method of the present invention.
Fig. 3 is the sectional view after pcb board of the present invention cutting.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is more fully retouched
State.Accompanying drawing gives presently preferred embodiments of the present invention.But, the present invention can be different with many
Form realizes, however it is not limited to embodiment described herein.On the contrary, provide these embodiments
Purpose is to make the understanding to the disclosure more thorough comprehensively.
Unless otherwise defined, all of technology used herein and scientific terminology with belong to the present invention's
The implication that those skilled in the art are generally understood that is identical.Institute the most in the description of the invention
The term used is intended merely to describe the purpose of specific embodiment, it is not intended that in limiting the present invention.
Refering to shown in Fig. 1 and Fig. 2, the processing method of a kind of pcb board that the present invention provides, for right
Thickness is that the obverse and reverse of more than 1.0mm pcb board carries out cutting processing.
The step of this processing method is as follows:
Step S1: preset the shape of cutting zone on pcb board 100.Preferably, cutting zone is at PCB
Preset on the main hardboard apparent surface of plate 100.
Step S2: described pcb board 100 is placed on processing platform 300.
Preferably, described processing platform 300 is provided with vacuum absorption device, for by pcb board 100
Absorption is on processing platform 300.Owing to using vacuum absorption device location pcb board 100, make pcb board
100 keep smooth stable during processing.
Step S3: use laser beam 200 border of cutting zone along pcb board 100 to cut, and
Use layering and positive and negative cutting.
Described Slice by slice cutting is that processing number of times is 8～27 times away from realizing energy quantity set with defocusing.Due to PCB
Plate is thicker, is about 400um with normal laser through over-focusing back focal length value, therefore need to do at a layering
Reason, owing to laser beam 200 is very thin, has the biggest a part of energy to concentrate when cutting to intermediate layer
At product surface, for ensureing product quality and best results, therefore use positive and negative cutting, so cut
Flush edge is without dust, thus improves cutting quality, reduces production cost, promotes cutting efficiency.
Preferably, the power of described laser beam 200 is 8～12W, if power is too low, it may appear that cut
Cut constantly, burr occurs, in order to reach to cut off, the most then to increase processing number of times；If merit
Rate is too high, and cutting surfaces will produce serious melanism, has influence on processing quality.
The rate travel of the described the most described pcb board of laser beam 200 100 is 100～300mm/s, as
Really rate travel is too slow, and cutting surfaces also can produce serious melanism, has influence on processing quality；
Rate travel is the fastest, it may appear that cutting constantly, burr occurs, in order to reach to cut off, the most then wants
Rate travel should be reduced or increase power.
In above-mentioned, laser beam 200 moves relative to pcb board 100, can be that laser beam 200 moves
Or pcb board 100 moves, such as, pcb board 100 is fixed on described processing platform 300, launches institute
The laser head 400 stating laser beam 200 moves.Or, launch the laser head 400 of described laser beam 200
Fixing relative to described processing platform 300, described processing platform 300 is provided with mobile platform, pcb board
100 fix on a mobile platform, and mobile platform drives pcb board 100 to move.
The pulse frequency of described laser beam 200 is 30～60KHz, and the burst length is 1～4um, to reach
To preferable working power, laser beam 200 is preferably UV laser beam.
In the present invention, cut principle is to utilize the high power laser light focused on to irradiate rapidoprint surface,
After laser beam 200 exceedes threshold power density, the chemical bond of long key-like macromolecule organic can be given
To interrupt, numerous particles cause volume increase with external force suction under, make material be rapidly removed and
Pore-forming, along with the relative movement of laser beam 200 with workpiece, finally forms joint-cutting at material surface.So
And, use laser beam 200 cutting processing, it is not necessary to consider product arrangement, the factor such as structure, can control
Laser machining site processed and redemption, meet demand to ensure that product is qualified.
It is below the pcb board part machined parameters data of the thickness 1.0mm of experiment test:
Above power is to use laser instrument test the data obtained for experimental facilities.
Fig. 3 Green is coating, and centre is path, cut cross section, latticed for pcb board cross section
Schematic diagram, wherein figure A is normal, and B is many for cutting through for figure, and figure C is very few for cutting.
In above table as a example by first group of process data: if speed is constant with pulse frequency, cutting
Number of times is too much, then therefore pcb board surface protection coating can be destroyed or affect the performance of product itself,
Pcb board after how cutting through arises that such as phenomenon in the B of Fig. 3.If speed is with pulse frequency not
Becoming, cutting times crosses to there will be at least and can't cut, if can't cut mandatory breaking disconnected to arise that burr
Or the phenomenon such as burr and pcb board layering, such as phenomenon in the C of Fig. 3.
Therefore, if machined parameters arranges unreasonable, the performance of product own can be affected and destroy pcb board
The coating on surface, or there will be cutting constantly cause problems such as scrapping.
Above-described embodiment is the present invention preferably embodiment, but embodiments of the present invention are not by upper
Stating the restriction of embodiment, that is made under other any spirit without departing from the present invention and principle changes
Become, modify, substitute, combine, simplify, all should be the substitute mode of equivalence, be included in the present invention
Protection domain within.
Claims (6)
1. the processing method of a pcb board, it is characterised in that: this processing method includes the following:
Preset the shape of cutting zone on pcb board；
Described pcb board is placed on processing platform；
Use laser beam to cut on the border of cutting zone along pcb board, and use layering and positive and negative
Processing；Wherein the power of laser beam is 8～12W, and the rate travel of the most described pcb board of laser beam is
100～300mm/s, the pulse frequency of laser beam is 30～60KHz, and the burst length is 1～4um.
The processing method of pcb board the most according to claim 1, it is characterised in that: described processing
Platform is provided with vacuum absorption device, for adsorbing pcb board at processing platform.
The processing method of pcb board the most according to claim 1, it is characterised in that: described PCB
Plate is fixed on processing platform, and the laser head launching described laser beam moves.
The processing method of pcb board the most according to claim 1, it is characterised in that: described transmitting
The laser head of described laser beam is fixed relative to processing platform, and processing platform is provided with mobile platform, PCB
Plate is fixing on a mobile platform, and mobile platform drives pcb board to move.
The processing method of pcb board the most according to claim 1, it is characterised in that: described laser
Shu Caiyong UV laser beam.
The processing method of pcb board the most according to claim 1, it is characterised in that: described laser
The processing number of times of bundle is 8～27 times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510312503.7A CN106271096B (en) | 2015-06-09 | 2015-06-09 | A kind of processing method of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510312503.7A CN106271096B (en) | 2015-06-09 | 2015-06-09 | A kind of processing method of pcb board |
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| Publication Number | Publication Date |
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| CN106271096A true CN106271096A (en) | 2017-01-04 |
| CN106271096B CN106271096B (en) | 2019-09-20 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107150179A (en) * | 2017-07-14 | 2017-09-12 | 东莞市盛雄激光设备有限公司 | A kind of zero draft laser cutting device and its cutting method |
| CN109104818A (en) * | 2018-09-29 | 2018-12-28 | 江苏芯力特电子科技有限公司 | A kind of pcb board processing method |
| CN110315216A (en) * | 2018-03-29 | 2019-10-11 | 上海名古屋精密工具股份有限公司 | The method of laser processing workpiece and its application in cutter manufacture |
| CN114406487A (en) * | 2020-10-14 | 2022-04-29 | 大族激光科技产业集团股份有限公司 | Laser cutting identification method, device, equipment and medium |
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| JP2000077851A (en) * | 1998-09-03 | 2000-03-14 | Ibiden Co Ltd | Manufacture of multilayer printed wiring board |
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| CN101288921A (en) * | 2007-04-19 | 2008-10-22 | 深圳市大族激光科技股份有限公司 | Laser device for cutting |
| CN101402158A (en) * | 2008-11-05 | 2009-04-08 | 深圳市大族激光科技股份有限公司 | Laser cutting method for PCB plate |
| CN101480758A (en) * | 2009-01-22 | 2009-07-15 | 华中科技大学 | Technological process of ultraviolet laser cutting flexible printed circuit board |
| CN103182608A (en) * | 2013-04-03 | 2013-07-03 | 深圳市大族激光科技股份有限公司 | Processing method of PCB (Printed Circuit Board) open cover |
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| JP2000077851A (en) * | 1998-09-03 | 2000-03-14 | Ibiden Co Ltd | Manufacture of multilayer printed wiring board |
| US20060211158A1 (en) * | 2005-03-04 | 2006-09-21 | Hitachi Via Mechanics, Ltd. | Method and apparatus for perforating printed circuit board |
| CN101288921A (en) * | 2007-04-19 | 2008-10-22 | 深圳市大族激光科技股份有限公司 | Laser device for cutting |
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| CN101480758A (en) * | 2009-01-22 | 2009-07-15 | 华中科技大学 | Technological process of ultraviolet laser cutting flexible printed circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107150179A (en) * | 2017-07-14 | 2017-09-12 | 东莞市盛雄激光设备有限公司 | A kind of zero draft laser cutting device and its cutting method |
| CN110315216A (en) * | 2018-03-29 | 2019-10-11 | 上海名古屋精密工具股份有限公司 | The method of laser processing workpiece and its application in cutter manufacture |
| CN111278598A (en) * | 2018-03-29 | 2020-06-12 | 上海名古屋精密工具股份有限公司 | Method for laser machining a workpiece and use thereof for producing a tool |
| CN110315216B (en) * | 2018-03-29 | 2021-07-30 | 上海名古屋精密工具股份有限公司 | Method for laser machining a workpiece and use thereof for producing a tool |
| CN109104818A (en) * | 2018-09-29 | 2018-12-28 | 江苏芯力特电子科技有限公司 | A kind of pcb board processing method |
| CN114406487A (en) * | 2020-10-14 | 2022-04-29 | 大族激光科技产业集团股份有限公司 | Laser cutting identification method, device, equipment and medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106271096B (en) | 2019-09-20 |
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Effective date of registration: 20200629 Address after: 518000 No. 9988 Shennan Avenue, Shenzhen, Guangdong, Nanshan District Patentee after: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518000, No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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Address after: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |