TW201133679A - Process chamber, semiconductor manufacturing apparatus and substrate processing method having the same - Google Patents

Abstract

Disclosed herein is a semiconductor manufacturing apparatus including a transfer chamber provided with a substrate moving device to move substrates, a load lock chamber to align the substrates and to load and unload the substrates into and out of the transfer chamber, and at least one process chamber to process the substrates transferred from the transfer chambers. Each of the at least one process chamber includes a chamber body provided with a substrate entrance formed on a side surface thereof, a substrate support provided within the chamber body such that at least two substrates are disposed on the substrate support, and at least one divider provided within the chamber body to align the at least two substrates.

Description

201133679 VI. Description of the invention: [Technical field to which the invention pertains] and method of the company's semiconductor manufacturing equipment, and special adhesion to a place where the treatment is transferred to the position, the forest is crying _ to send the substrate equipment [previous technology 】 In order to manufacture the rotating body #, the flat display device and the solar cell, the film deposition process 'the film formed by the material 1 is deposited on a wafer surface two-light lithography process, wherein the selected area of the film is used - light or shadow, - In the process, the film is removed from the selected area to form a desired pattern. , = and. In order to describe the process, the axis deposition process and the side process are all processed to the shout. The transfer between the substrates is carried out by a transfer chamber. The above-mentioned towel is audible and has these processes. (4) The semiconductor manufacturing equipment has the following problems. - Each substrate is twisted - one substrate. Therefore, the substrate must be transferred to another processing chamber while the substrate is transferred to a processing chamber and the substrate is under the rail vacuum in the processing chamber. This reduces productivity. In other words, when a substrate is transferred to a processing chamber, the processing chamber needs to be operated 'as long as only one substrate enters or exits the processing chamber, and the opening of the processing chamber needs to be opened and closed and the processing chamber needs to be formed again (10) Gas vacuum. SUMMARY OF THE INVENTION Therefore, in view of the above problems, an object of the present invention is to provide a semiconductor processing apparatus and a substrate processing method therewith. SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate, such as a processing chamber for a body, and an apparatus and method for transferring a substrate to a substrate. The advantages, objects, and features of the present invention will be partially explained in the following: and other advantages, objects, and features of the present invention will be apparent to those of ordinary skill in the art. The outline is understood or can be derived from the _ real shot. The present invention and other advantages can be realized and obtained by the contents of the book and the patent application and the combination of the drawings. In order to obtain the present invention and other objects, the present invention has embodied and generalized materials, and the present invention includes: a substrate human σ, a substrate support member formed on a side surface thereof, Provided in the body such that at least two substrates are disposed on the substrate support and at least one spacer is provided in the chamber for positioning the at least two substrates. Each of the at least one partition member includes a selection member and a separation member, the support member supports the edge portions of the at least two substrates, and the separation member is coupled to the at least two substrates. Separated from each other. _ ^ Less - a partition contains a partition, the partition has a straight line to separate and position each other to face each other, or two partitions, the two partitions have a cross Straight_ to separate and set the substrate. The at least one spacer may have a line width of -4 to 6 Gm (_). 201133679 The at least one spacer can position at least two substrates at the same height. 〉, seven spacers are formed by a Taoman or anodized coating. The substrate support member includes at least one loading frame for loading and unloading the two sides to support an outermost area of the bottom surface of the two lower substrates, and a pin for supporting the silk surface of the at least two health plates The heart area. In another aspect of the invention, a semiconductor manufacturing apparatus includes a transfer chamber that is transported to a substrate-transferred configuration for moving a plurality of health plates, a load lock to 'which is used to position the substrates and is wired Disposing the substrate in the transfer chamber or unloading the substrate from the transfer, and at least one processing chamber for processing the substrate conveyed from the transfer chamber, wherein each of the at least one processing chamber includes a chamber body The chamber body has a substrate population on the silk surface, a substrate support member, which is provided in the chamber body such that at least two substrates are disposed on the substrate support member and at least one partition member Provided in the chamber body to position the at least two substrates. The semiconductor manufacturing apparatus can further include a plurality of aligning members disposed in the load lock chamber to position the substrate. These aligning members may be provided on at least two corners of a support member on which the substrates are placed. Two substrates facing each other may be provided in the load lock chamber, and the aligning members include a plurality of stationary members or a plurality of rotating members provided between the two substrates. 0 Four substrates may be provided in the load lock chamber. The alignment members include a pair of alignment members having a rectangular shape, intersecting each other, and providing a center of the four bases 201133679 plates that the four substrates meet. The pair of aligning members includes at least four rotating members respectively provided between the four substrates, and the four substrates are rotationally positioned through the rotating members. The aligning members within the load lock chamber are positioned in the same pattern as the at least one partition of the processing chamber. In a further aspect of the present invention, a substrate processing method includes the following steps: sequentially loading at least two substrates into a first chamber, wherein the first plurality of alignment members are disposed to position the alignment members (4) at least two recording boards, (4) a substrate conveying unit, at least two substrates are transported from the first chamber to the second chamber, and at least two substrates are transported from the second chamber to the third chamber using the substrate transport unit. At least two of the substrates are loaded into the third chamber in a pattern identical to the "alignment pattern" of the at least two substrates within the first chamber. To >, the knife spacers are disposed within the second chamber, and the at least two substrates are separated and positioned at the same height through a predetermined interval. The description of the invention as set forth above and the description of the invention as set forth below are representative and versatile, and are intended to further disclose the scope of the invention. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail in conjunction with the drawings. Wherein the same reference numerals are used in the drawings to refer to the same or the like. In the drawings, the thickness of several layers and regions are exaggerated for clarity. The _-thickness ratio of each layer in the figure does not represent the actual thickness ratio. 201133679 "1A" to "1F" are schematic views of a processing chamber of an embodiment of the present invention, and "2A" and "2B" are "substrate 1A" Schematic diagram of the substrate loaded. The processing chamber according to an embodiment of the present invention will be described with reference to "1A" and "2A" and "2B" in τ. In the present embodiment, a plurality of substrates 16 are simultaneously loaded in the processing chamber, and a process of depositing a semiconductor layer, for example, on these substrates 16, is simultaneously performed. "Fig. 1A" shows the inside of the processing chamber, and four substrates 16 are provided in one chamber. Here, each of the substrates 16 is mounted on a substrate support of the chamber body 1G. The substrate support member includes a loading frame 12 and a plurality of pins 14. Loading frame The 12-story building faces the surface of each of the substrates 16 to the body. That is, it is assumed that the four substrates 16 act as a substrate, and the frame 12 is loaded on the edge of the substrate. Further, the pin 14 supports the edges of the respective substrates 16 facing the spacers 4''. That is, if each of the substrates 16 has a rectangular cross section, the two sides of each of the substrates 16 facing the chamber body 1 are transmitted through the loading frame 12 and the remaining two sides of each of the substrates 16 pass through the pin 14 support. . The substrate I6 can be supported by the loading frame u alone or separately through the pins, and the loading frame 12 or the pin μ must be provided so as to support all the edges of the four substrates. Progressively, the four substrates 16 are separated by a plurality of partitions*. Here, = four wafers are provided in the processing chamber, and these spacers are provided so that the knife spacers 4G have a linear shape intersecting each other so as to separate the four substrates from each other. That is to say, when the partitioning members (8) separate the four substrates b, the partitioning members 40 are formed in a similarly shaped shape. 201133679 "Load frame 12 of FIG. 1A" support er and loading frame 12 only "FIG. 2A" indicates that substrate 16 is mounted on pin 14. The substrate is passed through a pedestal 5 to support the edge of the substrate 16. : Figure 2B is an enlarged view of part d of Figure 2A. = ice 40 direct state plate 16 phase _, domain separation and grain substrate. The female one is a partition 4 〇 including a support member and a separate member. The edge separating strips of the gussets/boards 16 separate the substrates π from each other such that adjacent substrates 16 are not in contact with each other. Here, the separators have a trapezoidal shape, and the substrates 16 are separated from each other, and the direct contact area with the substrate 16 is reduced, thereby preventing damage to the substrate 16. Here, the adjacent substrate 16 is separated from each other by at least one of the widths of the bottom side of the separator. In the present embodiment, adjacent substrates 16 are separated from each other by (iv) house meters (mm). That is, if the spacer 4 has a two-sided alignment structure, the substrate 16 is spaced apart from the center of the spacer 4 by at least 2 to 3 q mm (the Cong interferes with each of the substrates 16 of the processing chamber. Further, since the substrates 16 are supported by the branch members 4A of the same partition member 4, the substrate 16 can be supported at the same height. That is, since the adjacent substrates 16 are allowed to be loaded on a robot. The remaining amount is 4 millimeters (mm), and therefore, if the separator 4b of the partition member 4b has a width of less than 4 penm (mm), adjacent substrates collide with each other due to lack of such margin, when the substrate 16 When the crucible is loaded on the base 50, it can be damaged. Further, the area of the portion of the substrate 16 loaded on the spacer 40 is increased, and the portion of the substrate 16 on which the spacer 4 is mounted is The ungrounded insulator is fabricated, and thus the uniformity of a film formed over the substrate 201133679. Further, for example, the spacer 40b of the spacer 4〇 allows adjacent substrates 16 during a thin film deposition process. The film formed on the film is not connected And preventing the susceptor 50 of the support substrate 16 from being exposed to the plasma ' thereby allowing a desired thickness of the film to be deposited on the substrate 16. On the other hand 'if the separator 4 〇b of the spacer 40 has more than 60 mm (mm) The width 'in view of the limited space within the chamber body ,, the space utilization is insufficient. That is, as the line width of the partition member 40 increases, the area of the pedestal 5 也 also increases. When the line width of the separating member of the partition member is increased, the substrate Μ can be loaded on the pedestal 5 早 at the same time. In this case, when the susceptor % is exposed to the electropolymer, an electric arc of _ 50 may occur. Discharge, and electropolymerization can be deposited over the pedestal 5〇 and thus the substrate 16 is effectively aligned during subsequent substrate processing. Preferably, the spacer 4 is during processing, such as a thin film deposition process and side The system does not react with the electric system and the surname. In the present embodiment, the spacer is formed of an insulating material such as a shout or an anodized coating. Since the susceptor is grounded, it is formed of an insulating material. When the area of the partition 4〇 is increased, the area where no plasma is generated The product is increased, thereby obtaining a lower plasma density and lowering the uniformity of the formed film. - Fine ===== 201133679 U-picture" indicates that the arm 22 of a substrate transport unit 20 will be the substrate in the processing chamber 16 Transfer to the interior of the chamber ίο and '1B' indicate that in the processing chamber, after the substrate 16 is loaded on the substrate support, one (five) 3 〇 closes the chamber body. Here the valve contains a valve cover and A vane moving within the valve cover for opening and closing an opening in the valve cover. ..., in the chamber 10 of the processing chamber of the embodiment of Fig. 1C, there are two substrates in the chamber! In addition to the other embodiment, the processing of the other embodiment shown in the "1C chart" is the processing room of the previous embodiment. As shown in "the ic diagram", a spacer member 4 having a linear shape is provided to separate the two substrates 16 from each other to the line width and height of the blade spacer 40 and the line width of the separator of the previous embodiment. And the same height. In accordance with the pre-implementation__method, the surfaces of the two substrates 16 facing each other are supported by a plurality of pins 14. Fig. 1D and Fig. 1E are the processing chambers of one embodiment. In the treatment room, the substrate 16 is supported by the pin 14 alone, and does not have the "ia" to "1C" The loading frame shown is 丨2. That is to say, ''1D'' represents a processing chamber in which a plurality of pins 14 are provided along the edge of each substrate]6, and the "Kiyoshi" plate is indicated - The processing chamber is closed after the substrate is loaded on the chamber body 1 of the "mth diagram". Further, "F1F" indicates a processing chamber of still another embodiment, in which two substrates 16 are threatened - one of the chamber bodies 1G supports 14 substrates & edges. That is to say, the ants' room is a room of the size of the squirrel-like (10) coffee*2, _匪), which can make the treatment in the literary literacy of her product (10) Li 201133679

The processing chamber of the embodiment shown in the larger substrate '1A' used in Enhanced Chemical Vapor Deposition, PEC VD) can simultaneously load and process four sizes with - 5G (1,100 mm * uoo mm) The substrate, and the processing chamber of the 7F embodiment of the "Redundancy Diagram" can simultaneously load and process two larger substrates. Further, the processing chamber of the above embodiment can simultaneously load and process other substrates having different sizes and with the upper plate. Here, the spacers 4' may be provided to separate or isolate the substrates from each other. Figure 3 is a schematic view of a semiconductor manufacturing apparatus of the present invention - "4th drawing" is a schematic view of a substrate arrangement in a load lock chamber of "Fig. 3" and 5A" to " $图" is a schematic view of a reading member of "Fig. 4" according to an embodiment of the present invention. Hereinafter, the semiconductor manufacturing apparatus of the present embodiment will be described with reference to "Fig. 3" to "Fig. π". The semiconductor manufacturing apparatus of this embodiment includes the above processing chamber. That is, the semiconductor manufacturing apparatus includes a load lock chamber Lc, a transfer chamber tc, a process chamber PC', and a gate and m are provided between the chambers. The load lock chamber LC carries the substrate S from the outside to the transfer chamber TC, and unloads the substrate supplied from the transfer chamber TC to the outside. In the case of further steps, the transfer chamber TC carries a substrate to move the substrate s in the transfer chamber Tc, thereby transmitting =S to JL. In the city, the plurality of wire plate shafts are fixed and the 1125 is fixed and transferred on the substrate s. Specifically, the processing chamber PC has the same configuration as the processing chamber of the embodiment of the "figure u" and the "figure diagram and the second diagram". That is to say, the treatment chamber 3 has a chamber body, and the chamber body is provided with a base 12 201133679 ^ port' on its side surface and a plurality of separators in the body for using a plurality of substrates They are spaced apart from each other' and the processing of the substrate is performed. Therefore, the spacers having the linear shape processed into the pc are interdigitated with each other to separate the four substrates from each other, and are formed of a shouting material or an anodized coating. _ it-steps' _ chamber PC contains a substrate support member, the substrate support member includes a wire table _ loading facing the chamber body, and a plurality of pins for following and "Fig. 1A" and " The processing chamber of the embodiment of Fig. 2A" & "2B" supports the surface of the substrate facing the separator in the same manner. A plurality of aligning members are provided in the load lock chamber LC, thus performing alignment of the substrate s. That is, when the substrate is supplied from the outside to the load lock chamber Lc, the load lock chamber LC performs the positioning of the pure s using the release member and the wire supplies the substrate to the miscellaneous chamber TC. That is, when four substrates S are supplied to the process chamber PC, the four substrates s must be positioned through the spacers and then shock-loaded. However, in view of the processing efficiency, the positioning of the substrate s in the processing chamber PC is not desirable, and the subsequent deposition of the film, it is not expected that the processing chamber PC is turned on for a long time. Here, the processing chamber PC can perform a plurality of processes on each of the substrates s transferred from the transfer chamber TC, such as a deposition process, a cleaning process, a preheating process, a drying process, a heat treatment process, and a photolithography. Process, one side process, diffusion process, and an ion implantation process. As will be described later, a plurality of processing chambers can be provided. Therefore, the load lock chamber LC positions the substrate s and then the substrate S is supplied to the transfer chamber TC along the direction A, and the transfer chamber TC supplies the substrate S along the direction c to the office 13 201133679. Here, the substrate S in the transfer chamber TC can be horizontally moved in the direction B. The transfer chamber TC itself does not move and the substrate moving device 12 and the arm 125 move to move the substrate S.

That is, as shown in "Fig. 3", the substrate moving device 12 is movable in the direction B and the arm 125 is movable in the direction A and the direction C. In the case of the step, although "Fig. 3" only shows a processing chamber PC, an array of - processing chambers can be provided to simultaneously perform a plurality of pavings and so - the structure will be described in conjunction with "Fig. 8". Fig. 4 is a schematic view showing the arrangement of the substrate $ in detail showing the inside of the load lock chamber Lc. In Fig. 4, the load lock chamber... comprises a main body (9), and == sample "the main body 15G is provided with a plurality of substrates s for providing the substrate S to the load lock chamber LC. The interior, and the two earth plates S are positioned at the center A or the edge of the load lock chamber LC. Alignment = 2 "5A", "5C" and "5D", the tens member is located at the center of the load lock chamber Lc, as shown in the positioning substrate s, at the edge of the load lock chamber LC B set money board s 1 Xiang 5B map" The optional pieces are available or provided at the same time. Far S. Read the _ type pair "Step 2: Piece or Rotate." (4)^

Figure, "5D" and "5E: Sub, and 5B Here, let go, for example, she is aligned by Hi/Hi (4). The substrate s is moved, so _ s can be positioned. Contact with the substrate S and 201133679 "/5A" indicates the alignment member I% provided at the center of the load lock chamber LC. As shown in "Fig. 5A", the alignment member 17 is provided at a place where the four substrates meet. Here, the alignment member 17 is provided in a region where the edges of the respective substrates s are in surface contact with each other. In the present embodiment, the four alignment members 172, 174, m, and 178 are provided at the locations where the four substrates meet. Each of the alignment members Π2, m, 176, and 178 may have a size of 4 to 6 mm (_) (straight 彳) and so that the line width of the separator of the spacer of the processing chamber is the same. In the "fifth diagram", each of the alignment members 172, 174, 176, and 178 includes a plurality of circles. The size of the above 4 to 6 G millimeters indicates the separation distance between adjacent substrates s. Alignment members i72, and 178 having circular rollers are used for the surface of the alignment members 172, 174, 176, and 178 to be in surface contact with the substrates s, and are rotated and rubbed by the alignment members 172, 174, 176, and 178. These substrates S are precisely positioned. "Cth Figure C" and "帛5D" indicate the alignment members of other embodiments of the present invention. In ", 5C^", the load lock chambers encountered on the four substrates S The linear alignment members 18 of the LC that intersect each other are similar to the spacers in the processing chamber. The line width of the alignment member 18G may be 4 to 6 Gmm (mm). Loading the lock to the alignment member in the LC Used to position the substrate, and thus not with the spacers in the processing chamber, and only adjust the spacing between the substrates in the substrate (10) All of the edges of the panel S are in contact. In the factory 咕 5D diagram, two substrates are provided in one chamber, and thus a linear alignment member 182 is provided. 15 201133679 Figure 5B is "4th" The aligning member 162 of the substrate S is positioned at the edge B of the load lock chamber LC as shown in the figure. In conjunction with the "figure map", the aligning member 162 surrounds the edge of the substrate s and the operation of the aligning member 162 is precisely adjusted. The device is controlled by the lake. The aligning member control bases shown in "Fig. 5A" are not close to each other, and the aligning member 162 of "Fig. 5B" controls the substrate s so that the substrates s are not excessively distant from each other. Here, The aligning member 162 of the "Fig. 5B" is provided at the corner of each of the substrates S. "5E" shows an aligning member 172, 174 having a circular roller according to another embodiment of the present invention. 176 and 178. Unlike the embodiment of the "figure diagram", this embodiment shows that each row has two rollers. Further, in the "fifth Fth", two substrates s are provided in one room' and Therefore, the pair 17K with the roller is provided. The substrate s positioned by the aligning member can be transported to the process chamber buckle through the transfer chamber Tc. Here, the substrate S is transferred to the processing chamber in the same pattern as in the load lock chamber Lc, and the substrate is interposed between the chambers. The substrate moving device comprises a base (four) material element-like viewing unit, the listening transmission unit is used for uploading the silk plate in the horizontal direction, and the base seam element transmits the substrate to the transfer locking chamber and the processing chamber through Wei. Here, the substrate transfer The unit can move the substrate in the direction B of "Fig. 3". Further, the substrate transport unit can move the substrate in the direction A or the direction c of "Fig. 3". Also, the new ship unit and the silk view unit The substrate can be moved in a direction perpendicular to each other in 201133679. The substrate transport unit may include a vertical moving portion and a horizontal moving portion

A or direction C injury. That is to say, the horizontal moving portion slides the substrate in the direction by the sliding of the arm. The 'vertical movement part' is responsible for the loading and unloading of the substrate. In order to prevent damage to the edge of the substrate due to contact with the face member, the vertically moving portion moves the substrate horizontally to the optimum position after the horizontal movement of the substrate to reduce the substrate. Figure 8 shows a schematic diagram of a semiconductor manufacturing apparatus according to another embodiment of the present invention, and "Fig. 6 and "筮7园主-"you's a schematic diagram of the apparatus. Figure 7 is not the third The substrate is moved in the semiconductor manufacturing apparatus of the embodiment of Fig. 3, and the transfer chamber performs substrate transfer between a load lock chamber LC and a processing chamber pc. In another aspect, the semiconductor manufacturing apparatus of the embodiment of Fig. 8 includes a transfer chamber Tc, and the transfer chamber TC is provided in a plurality of processing chambers pc. * The transfer of the plates between the different processing chambers of Fig. 8 corresponds to the transfer in the direction A or the direction C of the base reverse Fig. 3, and the transfer of the substrate through the transport guide 210 in the horizontal direction of the "Fig. 8" The transfer corresponds to the transfer of the substrate in the direction B of "Fig. 3". The &'-substrate_device includes a substrate transfer sheet and a substrate transport unit 300. The substrate transfer unit is mounted in the longitudinal direction of the transfer chamber TC, and thus moves the substrate wheel feed 300 in the horizontal direction. For this purpose, the substrate transport unit π 200 can be a linear motor. 17 201133679 Progress s 'The substrate transfer unit 200 includes a transport guide 21 and a transport portion 220. The conveying guide 21 is guided to the level of the transfer portion of the transfer area. For example, the transport guide 21 can be a stator of a linear motor. The conveying section portion 220 is mounted above the conveying guide 21A so as to be conveyable, and thus conveyed in the horizontal direction along the conveying guide. For example, the delivery zone portion 220 can be a rotor (or a coil portion) of a linear motor. The substrate transport unit 300 includes a chassis 3U), a fork frame no, first and second sliding fork units 330, a fork lifting unit view, and a fork lifting guide early element 360. The chassis 310 is embossed above the transport section 22 of the substrate transport unit and in the horizontal direction together with the transport section. The fork frame 320 includes a first yoke 322, a plurality of side wall supports, and a second support frame 326. The port 322 is mounted above the chassis 31 to a height of one year and supported by the fork lifting unit 350 for ascending or descending. A plurality of protrusions 328 are formed on the first and second side surfaces of the first frame 322, wherein the fork lifting unit 35 passes through the protrusions 328. ...the plurality of side wall supports 324 are mounted at a specified interval along the edge of the first support frame, thus supporting the second support frame 326. A second pedestal 326 is mounted over the side wall slabs to overlap the first support frame 322. The second swing 326 is raised and lowered as the first support frame 322 rises and falls. The first-two-way sliding fork unit 33A according to the embodiment includes first and second 201133679 slides 410 and 420, a first fork slider 43A, and a plurality of first substrate support jaws 440. The first and first sliding forks 420 are mounted on the first support frame 322 in parallel at a predetermined interval, and are driven in a first horizontal direction or in a first horizontal direction according to the driving of the first and second sliding members 43A. Transmitted in the second horizontal direction. The first and second sliding forks 410 and 420 respectively include a first guiding block 412 and first to third sliding bars 414, 416 and 418. The first guide blocks 412 of the first and second sliding forks 410 and 420 are mounted on the first support frame 322 between the two sides of the first support frame 322 and are guided to slide by the first sliding temple 414. The first slide bars 414 of the first and second sliding forks 410 and 420 are mounted on the plurality of first guide block buckles 'and according to the driving of the first and second sliding members, in the first horizontal direction and the first horizontal direction Transmitted in the opposite second horizontal direction. The second sliders 416 of the first and second sliding forks 410 and 420 are mounted on the side surface of the first slider and are conveyed in the horizontal direction together with the sliding of the first slider w. The third slide bars 418 of the first and second slide forks 410 and 420 are placed on the side surface of the second slide bar 416 and are conveyed in the horizontal direction in conjunction with the sliding of the second slide bar 416. Alternatively, the second and third sliders 416 and 418 may be sequentially stacked on the top surface of the first slider and may be horizontally uploaded in conjunction with the first slider. The first again sliding member 430 is mounted between the two sides of the first cutting frame 322 so that 19 201133679 is located between the first sliding fork 410 and the second sliding fork 420, and thus is in the first horizontal direction or opposite to the first horizontal direction. Both the first and second slides 410 and 420 are simultaneously transmitted in the second horizontal direction. The first fork slider 430 includes a first guiding rod 432 and a first conveying cylinder 434. The first guiding rod 432 is mounted between the two sides of the first supporting frame 322 so as to be supported by a bracket. The first conveying cylinder The 434 is mounted on the first guide bar 432 so as to be transferable and provided with links (not shown) respectively connected to the first and second sliding forks 41A. The first fork slider 43A may be a hydraulic or pneumatic cylinder for conveying the first transfer cylinder 434 using hydraulic pressure or air pressure supplied to at least one side of the first guide rod 432. A plurality of first substrate support pads 440 are mounted over the third slider 418 at specified intervals, and support the substrate rear surface when the substrate is transferred. Although the present embodiment is described as a first-two-way sliding unit 33, which includes two sliding and (first and second sliding forks 41G and 42G) 'but the first-two-way sliding unit 330 is not limited thereto and the first two-way sliding The fork unit 33A may include two or more sliding forks to obtain a stable substrate ship. In the case of the step, the first embodiment of the present embodiment is described as the first repetitive member 43 of the first-two-way sliding fork unit 330 being hydraulic or pneumatic, but the first fork slider 430 is not limited thereto and the first and the third The two sliding forks and 420 are slidable through a linear (LM) guide, a ball screw, and at least one of the belts or a combination of at least two of them. The first-two-way sliding fork unit 330 may further include a position sensor to detect the sliding positions of the first to third sliding bars 414, 416 and 418 so that when the first to third sliding bars 414, 416 and 418 are When sliding in both directions, the first and second sliders 43 are controlled. 20 201133679 As described above, the first and second sliding forks 420 of the first two-way sliding fork unit 330 are elongated or retracted to use the first re-sliding member 43 in the first conveying direction and the first conveying direction. In the second conveying direction of the same movement, the substrate is conveyed in two directions to the side garment-side processing chamber PC which is in the conveying chamber Tc. Pad 540. The second bidirectional sliding and single S according to the embodiment includes third and fourth sliding forks 510 and 520, a second reversing member 530, and a plurality of second substrate supporting third and fourth sliding forks 510 and 52. The 〇 is mounted in parallel with the second gantry 326 at a specified interval, and is moved in the first horizontal direction or the second horizontal direction opposite to the first horizontal direction according to the driving of the second fork slider. To this end, the third and fourth sliding forks 5K) and 520 respectively include a second guiding block 512 and fourth to sixth sliding bars 514, 516 and 518. The second guide blocks 512 of the third and fourth sliding forks 510 and 520 are mounted on the second branch 326 between the two sides of the second support frame, and the sliding of the guide slides 514. The fourth sliding rods 514 of the third and fourth sliding forks 510 and 520 are mounted on the second guiding block 512, and are driven in the first horizontal direction or opposite to the first horizontal direction according to the driving of the second fork sliding member 53? Move in the second horizontal direction. The fifth sliders 516 of the third and fourth sliding forks 510 and 520 are mounted on the side surface of the fourth slider 514, and are moved in the horizontal direction in conjunction with the sliding of the fourth slider 514. The sixth slide bars 518 of the third and fourth sliding forks 510 and 520 are mounted above the side surface of the fifth slide 21 201133679 cup 516 and move in the horizontal direction in conjunction with the sliding of the fifth slide bar 516. Further, the fifth and sixth sliders 516 and 518 may be sequentially stacked on the top surface of the fourth slider 4, and are slidably moved upward together with the fourth slider. The lunar member 530 is disposed between the two sides of the second stud 326 so as to be disposed between the second sliding 51 〇 and the fourth sliding fork 52 ,, thus in the first horizontal direction or with the first level The second horizontal direction of the opposite direction is the fourth sliding and 52G. The second fork slider 530 includes a second guide rod 532 installed between the two sides of the second branch frame 326 for transmission through a bracket branch; The second transfer red 534 above is permeable to and is provided with a link 536 that is coupled to the third and fourth sliding forks 51G and 52G, respectively. Thus, the second fork member 53 can be a hydraulic or pneumatic cylinder for moving the second transfer cylinder 534 using hydraulic pressure or air pressure provided on at least one side surface of the second guide rod 532 #. A plurality of second substrate support pads 540 are mounted over the sixth slider 518 at specified intervals' and support the back surface of the substrate when the substrate is transferred. Although the embodiment is described as the second two-way sliding and the unit 34A includes two slidings (the second and fourth sliding surfaces 51 and 520), the structure of the second two-way sliding fork unit 340 is not limited thereto. The second bi-directional slide fork unit 34A may include two or more slide forks for stable substrate transfer. Further, although the second fork slider 53 is described as a hydraulic or pneumatic cylinder of the second two-way sliding fork unit 34, the second fork slider 530 is not limited thereto, and the third 22 201133679 And the third sliding forks 510 and 52G are slidable through a linear (LM) guide, a ball screw, and at least one of the belts or a combination of at least two of them. The second two-way sliding unit 340 may further include a position sensor to sense the sliding positions of the fourth to sixth sliding bars 514, 516 and 518 so that when the fourth to sixth sliding bars 514, 516 and 518 are in two The second fork slider 530 is controlled when the directions are slid. As described above, the third and fourth slides of the second two-way slide unit 34 are further elongated and retracted so as to use the second fork slider 530 in the first transport direction or the first transport direction. The second transport direction is slid, so that the board transfers the processing chamber PC, which is placed on the side or the other side of the Wei room TC, in both directions. The fork lifting unit 35〇 according to the embodiment includes a first lifting branch member 352a, a second lifting support member, a first lifting motor plus a second lifting motor (not shown), and a first ball. A lead screw 356a, a second rolling light bar, and an interlocking shaft 358. The first-lifting support member 352a is vertically mounted on the chassis 310 at a first side surface of the yoke 32''. The second lifting support 352b is vertically mounted on the second side surface of the yoke 320 above the chassis 310 so as to face the first lifting support 352a. The first lift motor 354a is mounted on the chassis such that the inner surfaces of the members 352_ are adjacent, thereby rotating the first ball screw 356a in the first direction or in the second direction opposite to the first direction. The second lift motor is mounted above the chassis 310 so as to be adjacent to the inner surface of the second lift tower member 352b, thereby rotating the 23 201133679 second ball screw 356b in the same direction as the first ball screw 3. The first ball screw 356a is mounted between the first lifting branch member 352a and the first lift motor 354a so as to pass through the protrusion 328 formed on the first support frame 322 of the fork frame 320, thus according to the first lift motor The rotation of 354a raises or lowers the first side of the shelf 320. Here, the projections 328 formed on the first stud 322 are provided with a thread that is combined with the first ball bobbin 356a. The second ball screw 356b is mounted between the second lifting support 352b and the second lifting motor so as to pass through the protrusion 328 formed on the first support frame 322 of the fork frame 320, thereby being lifted according to the rotation of the second lifting motor 354b. Or lower the second side of the fork 32 。. Here, the protrusion 328 formed on the first support frame 322 is provided with a thread that meshes with the first ball screw 356b. The interlocking shaft 358 is installed between the first lift motor 354a and the second lift motor, and transmits the rotational force of one of the first lift motor 354a or the second lift motor to the first lift motor 354a or the second lift motor. The other, thereby interlocking the rotation of the first lift motor 354a with the rotation of the second lift motor to synchronize the rotation of the first lift motor 354a with the rotation of the second lift motor. As described above, the lift unit 35 提升 raises or lowers the fork 32 〇 according to the rotation of the first and second ball screws 356 a and 356 b due to the rotation of the first lift motor 354 a and the first lift motor, and thus The first and second bi-directional slides, in turn, units 330 and 340 are raised or lowered to a desired height. The lifting unit 350 can further include a position sensor for detecting the position of the frame 320 when the fork 32 is raised or lowered to control the rotation of the first lift motor 354a and the first lift motor. 24 201133679 The fork lift guide unit 360 according to the present embodiment includes a plurality of lift guide blocks 362 and a plurality of lift guide rails 364. These lift guide blocks 362 are mounted opposite the corners of the first and second side surfaces of the yoke 320 on the side wall support. Here, two lifting guide blocks 362 may be mounted on the first and second side surfaces of the fork frame 320, respectively. A plurality of lifting guides 364 are vertically mounted above the chassis 31A for connection with the respective lifting guides 362, thereby guiding the lifting or lowering of the lifting guides 362 as the forks 32 are raised or lowered. As described above, the substrate moving device can transfer the substrate within the transfer chamber TC by the movement of the substrate transfer unit 2, and transfer the substrate to the process chamber PC or the load lock chamber Lc in both directions using the substrate transfer unit. Hereinafter, the above-described semiconductor manufacturing designing method will be described, that is, a substrate moving method. First, a plurality of substrates are sequentially loaded in a first chamber (load lock chamber) having an aligning member. Here, the above-described solution in the load lock chamber positions the four corners of the substrates. It has been described above that the four sub-boards are positioned using the liking of the aligning member: In addition to the aligning members provided at the corners of the substrate, other aligning members may be provided at the place where the load locks are placed. The substrate is provided in the load lock chamber (4), and the rear_release member can be a fresh piece, the pair of solution parts are in the load lock 胄, and the four base oils have a straight _, which is positioned in a flat or vertical direction. Four substrates. Thereafter, the basic transport unit sets the board from |_ (transmission chamber). < Le-to 25 201133679 Then, the substrate transfer unit transports the substrate within the transfer chamber. Here, the substrate is transferred to a position parallel to the load lock chamber to a position parallel to the process chamber. Thereafter, the substrate transport unit transfers the substrates from the transfer chamber to the third chamber (processed to). Here, the plurality of substrates are loaded into the processing chamber in the same pattern as the pattern positioned in the load lock chamber. A plurality of separators can be provided within these processing chambers. These spacers are provided in the same pattern as the alignment member, i.e., a pair of linear spacers having intersecting each other, thereby positioning the four substrates in the horizontal direction and the vertical direction. Further, when the substrate transport unit transports the substrate from an unloading chamber to a loading chamber, the 'substrate transport unit lifts the substrate in the unloading chamber, transfers the substrate from the unloading chamber to the loading chamber, and then in the loading chamber. Lower or load these substrates vertically. Although the present invention has been disclosed above in the foregoing preferred embodiments, it is not intended to limit the invention. Those skilled in the art will appreciate that the modifications and refinements of the present invention are within the scope of the present invention without departing from the spirit and scope of the invention as disclosed in the appended claims. within. Please refer to the attached patent application for the scope of protection defined by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to FIG. 1 are schematic views of a processing chamber according to an embodiment of the present invention; FIGS. 2A and 2B are schematic views of a substrate loaded on a substrate supporting member of FIG. 1A; 3 is a schematic diagram of a semiconductor manufacturing apparatus according to an embodiment of the present invention; 26 201133679 FIG. 4 is a sound diagram of a substrate arrangement in a load lock chamber of FIG. 3; FIG. 5A to FIG. 5F are A schematic view of an aligning member according to a fourth embodiment of the present invention; FIGS. 6 and 7 are schematic views of substrate shifting according to an embodiment of the present invention; and FIG. 8 is a view showing another embodiment of the present invention. Example of semiconductor manufacturing equipment, sound chamber body loading frame pin substrate substrate transport unit substrate transport unit arm valve partition support member separate member base gate [main component symbol description] 10 12 14 16 18 20 22 30 40 40a 40b 50 100, 110 27 201133679 120 125 150 160 162 170 172, 174, 176, 178 180, 182 200 210 220 300 310 320 322 324 326 328 330 340 350 substrate moving device arm body precision adjustment device alignment piece alignment piece Alignment piece aligning piece substrate conveying unit conveying guide conveying area part substrate conveying unit underframe fork first support frame side wall support second support frame protrusion first two-way sliding fork unit second two-way sliding fork unit fork lifting Unit 28 201133679 352a First lifting support 352b Second lifting support 354a First lifting motor 354b Second lifting motor 356a First ball screw 356b Second ball screw 358 Interlocking shaft 360 Fork lifting guide unit 362 Lifting guide block 364 lifting guide tunnel 410 first sliding fork 412 first guiding block 414 first sliding rod 416 second sliding rod 418 third sliding rod 420 second sliding fork 430 first fork slider 432 first guiding rod 434 first transmission Cylinder 440 first substrate support pad 510 third sliding fork 29 201133679 512 514 516 518 520 530 532 534 536 540

TC s

LC T1

PC second guide block fourth slide bar fifth slide bar sixth slide bar fourth slide fork second fork slider second guide bar second transfer cylinder link second substrate support pad transfer chamber substrate load lock chamber width processing chamber 30

Claims (1)

201133679 VII. Patent Application Range: 1. A processing chamber includes: a body having a substrate inlet formed on a side surface of the chamber body; a substrate support member provided in the chamber body So that at least two substrates are disposed on the substrate support; and at least one spacer is provided in the chamber body for positioning the at least two substrates. 2. The processing chamber of claim 1, wherein each of the at least one partition comprises a branch member and a separate member, the support member for supporting the edge of the at least two substrates And the separating member is in contact with the at least two substrates to separate the at least two substrates from each other. 3. The processing chamber of claim 1, wherein the at least one partition comprises - as a spacer 'the partition has a straight shape when the opposite direction is opposite: the base plate, or the inclusion There are two partitions which have a straight line of each other to separate and position the four substrates. 4. If you ask for the first! The processing chamber of the item, wherein the at least one spacer has a line width of 4 to 60 millimeters (mm). 5. The processing chamber of claim w, wherein the at least one spacer positions the at least two substrates at the same height. 6. The process chamber of claim 1 wherein the at least one separator is formed from - 31 201133679 ceramic or anodized aluminum. 7. The processing chamber of claim 1, wherein the substrate support comprises at least one of a load bearing frame and a plurality of pins, the loading frame for supporting the wires of the at least two substrates The outermost regions of the face, and the pins are used to support the central regions of the bottom surfaces of the at least two substrates. 8. A semiconductor manufacturing equipment, comprising: - a transport chamber' is equipped with - a substrate moving device (four) a plurality of substrates; - a load lock chamber, a ribbed money board, and a substrate is mounted thereon Unloading the substrates from or within the transfer chamber; and at least one processing chamber for processing the substrates transported from the transfer chambers, wherein each of the at least one processing chamber contains The - chamber body has a substrate σ formed on the silk surface of the chamber body; the substrate support member is provided on the chamber body to enable at least two substrates to be disposed on the substrate support member And at least one separator is provided in the chamber body to fix at least two substrates. 9. The semiconductor manufacturing apparatus of claim 8 further comprising a plurality of aligning members. The semiconductor manufacturing apparatus of claim 9, wherein the alignment members are disposed on at least two corners of a support member, wherein the substrate is placed on the support member. The semiconductor manufacturing apparatus of claim 8, wherein each of the at least one spacer comprises a support member and a separation member for supporting an edge portion of the at least two substrates, and The separating member is in contact with the at least two substrates to separate the at least two substrates from each other. 12. The semiconductor manufacturing apparatus of claim 8, wherein the at least one spacer comprises a spacer, the yarn spacer has a straight-to-sequence and a facing-to-substrate facing each other, or comprises There are two partitions having straight lines that intersect each other to separate and position the four substrates. 13. The device as described in claim 1G, wherein two substrates facing each other are disposed in the load lock chamber, and the alignment members include _wei provided on the two substrates A stationary part or a plurality of tilting pieces. The casting manufacturing apparatus of claim H, wherein the four substrates are provided in the hard-to-load locking chamber, and the aligning members comprise a rectangular shape, and each other is from the mosquito. Four regret her _ a pair of alignment pieces in the center of the four panels. 15. If the material is requested, the aligning piece is supplied to the _ wire, and the four substrates are positioned by the rotation of the special rotating piece. 33 201133679 16. If the request is to make a bribe, the aligning members in the towel holding compartment and the (four) at least one partition of the processing chamber position the substrates in the same pattern.如 If the request for the transfer of difficult equipment is made, one of the partitions of the towel is formed of a ceramic or anodized aluminum. 18. The semiconductor manufacturing apparatus of claim 8, wherein the at least one spacer positions the at least two substrates at the same height. 19. A substrate processing method comprising the steps of: sequentially loading at least two substrates into a "first chamber", the first chamber being provided with a plurality of alignment members; and positioning the at least two using the alignment members a corner portion of the substrate; transporting the at least two substrates from the first chamber to a second chamber using a substrate transport unit; and transporting the at least two substrates from the second chamber to the first substrate using the substrate transport unit a third chamber, wherein the at least two substrates are carried within the third chamber in accordance with the alignment of the at least two substrates within the first chamber. 20. The substrate processing method of claim 19, wherein the towel has at least one of the spacers separating and positioning the at least two substrates at the same height through the predetermined interval. 34