KR101854165B1 - Processing chamber, apparatus for manufacturing semiconductor including the same and method for processing substrate - Google Patents

Abstract

One embodiment of a semiconductor manufacturing apparatus includes: a plurality of substrates; And a substrate transferring section for transferring the plurality of substrates into the load lock chamber and transferring the plurality of substrates from the load lock chamber into the transfer chamber and transferring the plurality of substrates from the transfer chamber into the process chamber, The plurality of substrates may be in the same alignment pattern until they are transferred to the load lock chamber, the transfer chamber, and the process chamber.

Description

[0001] The present invention relates to a process chamber, a semiconductor manufacturing apparatus including the same, and a substrate processing method,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a process chamber for processing substrates such as semiconductor devices and an apparatus and a method for transferring substrates between chambers.

A thin film deposition process for depositing a thin film of a specific material on a wafer or a glass to manufacture a semiconductor device, a flat display device, a solar cell, etc., a process for exposing or removing a selected region of these thin films using a photosensitive material, A photolithography process for concealing the photoresist, and an etching process for removing the thin film of the selected region and patterning the photoresist layer as desired.

In order to perform the above-described processes, a thin film deposition process, an etching process, and the like are performed in a plurality of process chambers, respectively. The transfer of substrates between the plurality of process chambers is performed by a transfer chamber.

However, the conventional process chamber and the semiconductor manufacturing apparatus including the same have the following problems.

In each process chamber, one substrate is processed, one substrate is moved to each process chamber, the process is performed in a vacuum atmosphere, and then the process chamber is moved to another process chamber.

That is, the transfer chamber must be operated each time one substrate is moved, and the substrate entrance and exit are opened and closed every time one substrate enters and exits the process chamber, and the vacuum atmosphere of each process chamber must be formed again.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to solve the problem that an excessive load is consumed in the transfer chamber by moving the chambers separately for each substrate.

It is another object of the present invention to solve the problem that the process is separately performed for each substrate in each process chamber, and the opening and closing of the substrate entrance and the formation of the vacuum atmosphere are frequently performed.

One embodiment of a semiconductor manufacturing apparatus includes: a plurality of substrates; And a substrate transferring section for transferring the plurality of substrates into the load lock chamber and transferring the plurality of substrates from the load lock chamber into the transfer chamber and transferring the plurality of substrates from the transfer chamber into the process chamber, The plurality of substrates may be in the same alignment pattern until they are transferred to the load lock chamber, the transfer chamber, and the process chamber.

One embodiment of the semiconductor manufacturing apparatus may further include an aligning member provided in the load lock chamber and aligning the plurality of substrates.

The plurality of substrates facing each other may be provided in the load lock chamber, and the aligning member may be provided as a fixing member or a rotating member between the plurality of substrates.

Another embodiment of a semiconductor manufacturing apparatus includes a load lock chamber; An aligning member for aligning four corners of the plurality of substrates in the load lock chamber; And a substrate transfer device including a substrate transfer section, wherein the substrate transfer device transfers the plurality of substrates from the load lock chamber to the transfer chamber using the substrate transfer section, And may be to move to a side-by-side position with the chamber.

The alignment member may be provided at four corners of the support on which the plurality of substrates are to be mounted.

The substrate moving apparatus may further include a substrate transferring unit for horizontally transferring the plurality of substrates, and the substrate transferring unit may transfer the plurality of substrates to the load lock chamber or the process chamber through sliding.

The substrate transfer section may transfer the plurality of substrates from the transfer chamber to the process chamber.

One embodiment of the substrate processing method includes the steps of: transporting a plurality of substrates into a load lock chamber; Transporting the plurality of substrates in the load lock chamber into a transfer chamber; And transferring the plurality of substrates into the process chamber in the transfer chamber, wherein the plurality of substrates may be of the same alignment pattern until transported to the load lock chamber, the transfer chamber, and the process chamber .

The load lock chamber may be configured to align the plurality of substrates with the plurality of substrates and supply the plurality of aligned substrates to the transfer chamber.

The load lock chambers align the four substrates, and the four aligned substrates may be supplied to the process chamber while maintaining the same alignment.

Effects of the process chamber, the semiconductor manufacturing apparatus including the same, and the substrate processing method according to the present invention will be described as follows.

First, a plurality of substrates are loaded in a process chamber, and a process such as deposition is performed, so that a plurality of substrates can be processed at the same time.

Secondly, a divider is provided on a plurality of substrates in the process chamber to prevent the thin films from being connected to each other and deposited between adjacent substrates in a thin film deposition process or the like.

Third, a plurality of substrates can be pre-aligned in the load lock chamber and then supplied to the process chamber, thereby improving the process efficiency.

FIGS. 1A through 1F are views showing one embodiment of a process chamber according to the present invention,
Figures 2a and 2b are views of a substrate mounted on a substrate support in Figure 1a,
3 is a view showing an embodiment of a semiconductor manufacturing apparatus according to the present invention,
FIG. 4 is a view showing the alignment of the substrate in the load lock chamber in FIG. 3,
FIGS. 5A through 5F are views showing one embodiment of the alignment member in FIG. 4,
6 and 7 are views showing an embodiment of the substrate moving apparatus,
8 is a view showing another embodiment of the semiconductor manufacturing apparatus according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The same components as those in the prior art are denoted by the same names and the same reference numerals for convenience of description, and a detailed description thereof will be omitted.

FIGS. 1A-1F illustrate one embodiment of a process chamber in accordance with the present invention, and FIG. 2 illustrates a substrate mounted on a substrate support in FIG. 1A. Hereinafter, one embodiment of a process chamber according to the present invention will be described with reference to Figs. 1A to 2.

The present embodiment can simultaneously mount a plurality of substrates 16 in a process chamber, and perform processes such as vapor deposition at one time.

1A shows an interior of a process chamber, in which a total of four substrates 16 are provided in a chamber body 10. As shown in Fig. Here, each substrate 16 is seated on a substrate support within the chamber body 10.

Here, the substrate support table is composed of a loading frame (12) and a pin (14). The loading frame supports the face of each substrate 16 facing the chamber body 10. That is, if the entire four boards 16 are viewed as one, the loading frame 12 supports one edge of the substrate.

The pins 14 support the edges of each substrate 16 toward the divider 40. That is, when the cross section of each substrate 16 is a tetragonal shape, two sides opposite to the chamber body 10 are supported by the loading frame 12, and the remaining two sides are supported by the pins 14 .

Also, the substrate 16 may be supported only by the loading frame 12 or by the pins 14 only. At this time, it is needless to say that each of the loading frame 12 or the pin 14 should be provided so as to support all the edges of the four boards 16.

The four boards 16 are divided by a divider 40. Here, when four substrates are provided in the process chamber, the dividers 40 are arranged in a straight line intersecting each other, so that four substrates can be distinguished. That is, when the divider 40 divides the four substrates, the divider 40 may be shaped like a cross.

Figure 2a shows a substrate mounted on a substrate support in Figure 1a wherein the substrate 16 is supported by a susceptor 50 and the loading frame 12 is shown on the side, Only the edges of.

2B is an enlarged view of a portion 'D' in FIG. 2A.

As shown, the divider 40 includes a support member 40a and a separating member 40b, which can support a portion of the edges of the substrates and the separating member 40b, So as not to contact each other. Here, although the separating member 40b has a trapezoidal shape, it is possible to reduce the area of direct contact with the substrate while separating the substrates, thereby preventing damage to the substrate.

Here, the adjacent substrates are separated by at least the width T1 of the lower side of the separating member 40b, which may be 4 to 60 millimeters (mm) in the present embodiment. That is, if the divider 40 is left-right symmetrical, the substrate is spaced from the center by at least 2 to 30 millimeters to avoid interference that may occur between the substrates in the process chamber.

That is, since the margin for allowing the adjacent substrates to be placed on the robot is 4 millimeters, when the separating member 40b of the divider 40 is formed to have a width of 4 millimeters or less, when the substrate is placed on the susceptor, Shortage may cause damage due to collision between adjacent substrates. In addition, when the area where the substrate is seated in the divider 40 is widened, the divider 40 can not be grounded, and thus the uniformity of the thin film formed on the substrate can be reduced.

In addition, for example, in the deposition process of the thin film, the separating member 40b of the divider 40 prevents the thin films from being connected to each other between adjacent substrates at the time of deposition, thereby increasing the uniformity of the thin film on the substrate edge, Is formed with a width of 4 mm or less to minimize the exposure of the susceptor and the divider 40 supporting the substrate to plasma or the like so that a thin film having a desired thickness can be deposited on the substrate It can play a role to

Further, when the separating member 40b of the divider 40 has a width of 60 mm or more, space utilization is not sufficient considering the limited space of the chamber body 10. [ That is, when the line width of the divider 40 is widened, the area of the susceptor also widens.

When the line width of the divider 40 and the separating member 40b is widened, the substrate may be seated only on the susceptor. When the susceptor is exposed to the plasma, arcing may occur in the susceptor, May be deposited to prevent alignment of the substrate in the next substrate processing process.

In addition, it is desirable that the divider 40 does not directly affect the deposition and etching of the substrate by minimizing direct exposure to the plasma, etchant, etc. in the process of thin film deposition or etching in the chamber, In the embodiment, the divider 40 is made of an insulator such as ceramic or anodized coated aluminum. Since the susceptor is grounded, if the area of the insulator of the divider 40 is widened, a region where no plasma is generated is widened, so that a lower plasma may be formed and the uniformity of the thin film may be lowered.

The separator 40b of the divider 40 may have a difference of not more than +/- 10 millimeters from the height of the adjacent substrate since the divider 40 has only a height sufficient to exhibit the above-described effect.

1B shows a state in which the chamber body 10 is closed after the substrate is placed in the chamber body 10 in the embodiment shown in FIG. 1A. 1A, the arm 22 of the substrate transfer section 20 moves the substrate 16 into the chamber body 10, and in FIG. 1B, after the substrate 16 is seated on the substrate support, valve 30 closes the chamber body 10. As shown in FIG.

The valve 30 includes a valve housing and a blade for opening and closing an opening on the valve housing while moving inside the valve housing.

1C is basically the same as the embodiment shown in FIG. 1B, except that two substrates 16 are provided in one chamber body 10. FIG. At this time, as shown in the drawing, the dividers 40 are formed in a line type so that it is enough to divide the two boards 16, and the line width and height of the divider 40 are as described above. The surfaces facing each other in the two substrates 16 are supported by the fins 14 as shown in FIG.

Figures 1d-1e illustrate a process chamber in which the substrate 16 is supported by only the fins 14 without the loading frame in Figures 1a-1c.

1D, each substrate 16 in the chamber body 10 is provided with a pin 14 along the edge portion to support the substrate 16. FIG. 1E is a cross-sectional view of the substrate 16 in the embodiment shown in FIG. And shows a state in which the chamber body 10 is closed after the substrate is placed in the chamber body 10.

1F shows that two substrates 16 are provided in one chamber body 10 and an edge portion of each substrate 16 is supported by the pins 14. That is, If the exemplary process chamber is a PECVD (plasma enhanced chemical vapor deposition) device of a substrate and is a chamber of 8.5G size (2200 mm * 2600 mm) capable of large area substrate processing, 1100 millimeters * 1300 millimeters) can be loaded and processed at one time, but in the embodiment shown in Figure 1C, two larger substrates can be loaded and processed at one time.

In addition, it is also possible to load and process substrates of different sizes and numbers in addition to the above-described four or two substrates. In this case, the divider 40 may be provided to separate or isolate the respective substrates.

FIG. 3 is a view showing an embodiment of the semiconductor manufacturing apparatus according to the present invention, FIG. 4 is a view showing the alignment of the substrate in the load lock chamber in FIG. 3, and FIGS. And Fig. Hereinafter, an embodiment of a semiconductor manufacturing apparatus according to the present invention will be described with reference to FIGS. 3 to 5F.

The present semiconductor manufacturing apparatus is a semiconductor manufacturing apparatus including the above-described process chamber. That is, the semiconductor manufacturing apparatus includes a load lock chamber (LC), a transfer chamber (TC), and a process chamber (PC), and gates (Gate, 100, and 110, respectively.

Here, the load lock chamber LC loads the substrate S from the outside into the transfer chamber TC or unloads the substrate S supplied from the transfer chamber TC to the outside.

In addition, the transfer chamber TC may include a substrate transfer device 120 for transferring the substrate S in the chamber to another chamber. Here, the arm (125) connected to the substrate moving apparatus can support the substrate (S) during the fixing and moving of the substrate (S).

Specifically, the process chamber PC has the same configuration as the embodiment shown in Figs. 1A to 2 described above. That is, the process chamber PC includes a chamber body having a substrate entrance part formed on a side surface thereof, and a divider disposed inside the chamber body and dividing a plurality of substrates into a process chamber.

Accordingly, in the process chamber PC, the dividers are arranged in a straight line intersecting each other to divide the four substrates, and may be formed of ceramics or anodized coated aluminum.

The substrate support may include a loading frame for supporting the surface of the substrate facing the chamber body and a pin for supporting the surface of the substrate facing the divider.

An alignment member is provided in the load lock chamber LC to perform alignment of the substrate S. That is, when the substrate S is supplied from the outside, the load lock chamber LC aligns the substrate S and supplies the substrate S to the transfer chamber TC.

That is, when four substrates S are supplied to the process chamber PC, they must be aligned and seated by the dividers. If the alignment process is performed in the process chamber PC, ) For a long time is not preferable for the subsequent deposition process or the like.

Each of the process chambers PC is provided with a deposition process, a cleaning process, a preheating process, a drying process, a heat treatment process, a photolithography process, an etching process, a diffusion process, and an ion implantation process on a substrate S transported from a transfer chamber TC. Process, and the like, and a plurality of processes may be provided as described later.

Thus, after the substrate S is deflected in the unloading chamber LC, the transfer chamber TC is supplied to the transfer chamber TC in the direction A, and the transfer chamber TC transfers the substrate S to the process chamber PC in the C- .

At this time, the substrate S can horizontally move in the direction B in the transfer chamber TC, and the transfer chamber TC itself does not move, and the substrate moving device 120 and the arm 125 move, .

3, the substrate moving apparatus 120 moves in the B direction, and the arm 125 can move in the A direction and the C direction. Although only one process chamber (PC) is provided in FIG. 3, a plurality of process chambers (PC) arrays may be provided together to perform various processes sequentially, which will be described later with reference to FIG.

Fig. 4 is a diagram showing the inside of the load lock chamber LC, showing the alignment of the substrate S in detail.

4, the load lock chamber LC is provided with a substrate S in a body 150, and an aligning member for aligning the substrate S is provided. Here, four substrates S are provided in the load lock chamber LC, and the substrates S can be aligned at the center A or can be aligned at the edge B.

That is, the alignment member may be formed by aligning the substrates S at the center A, as shown in Figs. 5A, 5C and 5D, or by aligning the substrates S at the edge B as shown in Fig. Align. At this time, the above-mentioned two alignment members may be provided selectively or together.

5A, 5E, and 5F show rollers as an embodiment of a rotating member, and in FIGS. 5B, 5D, and 5E, the alignment member may be a fixed member or a rotating member, A linear alignment member is shown. Here, the rotating member such as the roller is in contact with the substrate S, and the substrate S can be moved and aligned by the frictional force generated by the rotation.

5A shows an alignment member 170 provided at the center of the load lock chamber LC. As shown in the drawing, the alignment member 170 is provided at a position where the four substrates S meet. Here, the aligning member 170 is provided at a portion where the edge of each substrate S is interposed, and four alignment members 172, 174, 176 (in this embodiment, And 178, respectively.

In addition, each of the alignment members 172, 174, 176, 178 may have a size (diameter) of 4 to 60 millimeters, which may be the same as the line width of the separating member of the divider in the process chamber.

In FIG. 5A, each of the alignment members 172, 174, 176, and 178 is composed of a plurality of circular type rollers. The above-described 20 to 30 millimeters refers to the total distance that the adjacent substrate S is spaced apart. The reason that the alignment members 172, 174, 176 and 178 are provided in the roller type is that the rotation of the alignment members 172, 174, 176 and 178 and the rotation of the alignment marks So as to align the substrate S to a fine distance by friction.

5C and 5D are provided with other embodiments of the alignment member. In Fig. 5C, the alignment member 180 is provided with a pair of straight lines intersecting each other at the central portion where the four substrates S meet, similarly to the divider in the process chamber. In this case, the line width of the alignment member 180 may be 4 to 60 millimeters.

Unlike the divider 40 in the process chamber PC, the alignment member in the load lock chamber LC aligns the alignment of the substrate so that the center of the substrate S does not face the entire edge of the substrate S, It is sufficient to adjust the distance between the substrates.

5D shows an embodiment in which only two substrates S are provided in one chamber, and thus it is sufficient that the alignment member 182 is provided in a line shape.

Fig. 5b shows an alignment member for aligning the substrates S at the edge B in Fig. In FIG. 5B, the edge of the substrate S is surrounded by the alignment member 162, and the alignment member 162 is controlled by the fine alignment device 160.

That is, adjacent substrates S are controlled not to be too close to each other by the alignment member shown in FIG. 5A or the like, and the alignment member 162 of FIG. 5B controls the substrates S to not spread too far to the periphery. It is a matter of course that the alignment members 162 in Fig. 5B should be provided at the corners of the respective substrates S, respectively.

In FIG. 5E, the alignment members 172, 174, 176, and 178 are made of circular type rollers. Unlike the embodiment shown in FIG. 5A, each of the alignment members has two rollers Respectively.

5F shows an embodiment in which only two substrates S are provided in one chamber, wherein the aligning member 170 is provided in a roller type. In the above-described load lock chamber LC, The substrates S aligned by the transferring unit can be transferred to the process chamber TC through the transfer chamber TC and then moved to the process chamber TC in the same pattern as the load lock chamber LC. do.

The above-described movement of the substrate between the chambers is performed by the substrate moving device. Here, the substrate moving apparatus may include a substrate transfer unit for horizontally transferring the substrate, and a substrate transfer unit for transferring the substrate to the load lock chamber and the process chamber through sliding.

Here, the substrate transfer section can move the substrate in the B direction in Fig. 3, the substrate transfer section can move the substrate in the A direction or the C direction. That is, the substrate transferring portion and the substrate transferring portion can move the substrate in a direction perpendicular to each other.

The substrate conveying unit may include a vertical moving unit and a horizontal moving unit. That is, the horizontal moving unit slides the substrate in the A direction or the C direction by sliding the substrate on the arm.

The vertical movement unit is responsible for loading and unloading the substrate. To prevent damage to the edge of the substrate due to contact with the divider when loading or unloading the substrate into or out of the process chamber, And the vertical movement unit moves the substrate up or down.

FIG. 8 is a view showing another embodiment of the semiconductor manufacturing apparatus according to the present invention, and FIGS. 6 and 7 are views showing an embodiment of the substrate moving apparatus in FIG.

That is, in the above-described FIG. 3, movement of the substrate between one load lock chamber LC and one process chamber PC is performed in the transfer chamber TC, but in FIG. 8, (TC).

8, movement of the substrate between the different process chambers PC corresponds to movement in the direction A or C in FIG. 3, and movement in the horizontal direction along the transfer guide 201 of the substrate in FIG. In the B direction.

Here, the substrate moving apparatus includes a substrate transferring unit 200 and a substrate transferring unit 300. The substrate transfer unit 200 is installed along the longitudinal direction of the transfer chamber TC to transfer the bidirectional substrate transfer unit 300 in the horizontal direction. To this end, the substrate transferring unit 200 may be constituted by a linear motor.

The substrate transfer unit 200 includes a transfer gate 210 and a transfer block unit 220. Here, the conveying guider 210 guides the horizontal conveyance of the conveying block portion 220. For example, the feed guider 210 may be a stator of a linear motor.

The conveying block unit 220 is provided to be capable of being conveyed to the conveying guider 210 and conveyed along the conveying guider 210 in the horizontal direction. For example, the transfer block unit 220 may be a rotor (or a coil part) of a linear motor.

The substrate transfer section 300 includes a base frame 310, a fork frame 320, first and second bidirectional sliding forks 330 and 340, a fork lift section 350 and a fork lift guide section 360 ).

The base frame 310 is installed on the transfer block 220 of the substrate transfer unit 200 and is transferred in the horizontal direction together with the transfer block unit 220.

The fork frame 320 includes a first support frame 322, a plurality of side wall supports 324, and a second support frame 326.

The first support frame 322 is installed at a predetermined height on the base frame 310 and supported by the fork lifting unit 350 so as to be able to move up and down. At this time, protrusions 328 are formed in the first and second side surfaces of the first support frame 322, respectively, through which the fork lifting unit 350 passes.

The plurality of side wall supports 324 are installed at regular intervals along the edge of the first support frame 322 to support the second support frame 326.

A second support frame 326 is mounted on the plurality of side wall supports 324 to overlap the first support frame 322. The second support frame 326 ascends and descends with the elevation of the first support frame 322.

The first bidirectional sliding fork portion 330 includes first and second sliding forks 410 and 420, a first fork slider 430, and a plurality of first substrate supporting pads 440, .

Each of the first and second sliding forks 410 and 420 is disposed on the first support frame 322 at regular intervals so that the first and second sliding forks 410 and 420 are moved in the first horizontal direction or the first horizontal direction In the second horizontal direction opposite to the second horizontal direction. Each of the first and second sliding forks 410 and 410 includes a first guide block 412 and first to third sliding bars 414, 416 and 418.

The first guide block 412 is installed between both sides of the first support frame 322 to guide the sliding of the first sliding bar 414.

The first sliding bar 414 is installed in the first guide block 412 and is transported in a first horizontal direction or a second horizontal direction opposite to the first horizontal direction in accordance with the driving of the first fork slider 430.

The second sliding bar 416 is installed on the side surface of the first sliding bar 414 and is transported in the horizontal direction interlocking with the sliding of the first sliding bar 414.

The third sliding bar 418 is installed on the side surface of the second sliding bar 416 and is transported in the horizontal direction interlocked with the sliding of the second sliding bar 416.

Each of the second and third sliding bars 416 and 418 may be sequentially stacked on the upper surface of the first sliding bar 414 and may be transported in the horizontal direction interlocked with the sliding of the first sliding bar 414.

The first fork slider 430 is installed between both sides of the first support frame 322 so as to be disposed between the first and second sliding forks 410 and 420 so that the first and second sliding forks 410 and 420 are simultaneously In a first horizontal direction or in a second horizontal direction opposite to the first horizontal direction.

The first fork slider 430 is provided so as to be capable of being transported to the first guide bar 432 and the first guide bar 432 provided between both sides of the first support frame 322 to be supported by the bracket, And a first transfer cylinder 434 having links (not shown) connected to the second sliding forks 410 and 420, respectively. The first fork slider 430 may be a hydraulic or pneumatic driving cylinder for transferring the first transfer cylinder 434 by hydraulic or pneumatic pressure supplied to at least one side of the first guide bar 432.

The plurality of first substrate supporting pads 440 are disposed at regular intervals on the third sliding bar 418 to support one side rear surface of the substrate during transport of the substrate.

Meanwhile, although the first bidirectional sliding fork unit 330 includes two sliding forks 410 and 420, the sliding forks may be formed of two or more for stable substrate transportation. In the first bidirectional sliding fork unit 330, the first fork slider 430 is formed of a hydraulic or pneumatic driving cylinder. However, the present invention is not limited to this, and the first fork slider 430 may be an LM guider, And / or at least two of the belts may be combined to slide the sliding forks 410 and 420.

On the other hand, the first bidirectional sliding fork portion 330 further includes a position detecting sensor for detecting the sliding position of the sliding bar 414, 416, 418 in bi-directional sliding and controlling the first fork slider 430 .

The first bidirectional sliding fork unit 330 is configured to move the first and second sliding forks 410 and 420 in the first transport direction or the second transport direction opposite to the first transport direction using the first fork slider 430. [ The substrates are transported in both directions to the process chamber TC disposed on one side or the other side of the transfer chamber TC.

The second bidirectional sliding fork portion 340 includes a third and fourth sliding forks 510 and 520, a second fork slider 530, and a plurality of second substrate supporting pads 540, .

Each of the third and fourth sliding forks 510 and 520 is installed on the second support frame 326 at regular intervals and is moved in the first horizontal direction or the first horizontal direction In the second horizontal direction opposite to the second horizontal direction. To this end, each of the third and fourth sliding forks 510, 510 includes a second guide block 512; And fourth to sixth sliding bars 514, 516, and 518, respectively.

The second guide block 512 is installed between both sides of the second support frame 322 to guide the sliding of the fourth sliding bar 514.

The fourth sliding bar 514 is installed in the second guide block 512 and is transported in the first horizontal direction or the second horizontal direction opposite to the first horizontal direction as the second fork slider 530 is driven.

The fifth sliding bar 516 is installed on the side of the fourth sliding bar 514 and is transported in the horizontal direction in association with the sliding of the fourth sliding bar 514.

The sixth sliding bar 518 is installed on the side surface of the fifth sliding bar 516 and interlocked with the sliding of the fifth sliding bar 516 to be transported in the horizontal direction.

Each of the fifth and sixth sliding bars 516 and 518 may be sequentially stacked on the upper surface of the fourth sliding bar 514 and may be transported in the horizontal direction interlocked with the sliding of the fourth sliding bar 514.

The second fork slider 530 is installed between the opposite sides of the second support frame 326 so as to be disposed between the third and fourth sliding forks 510 and 520 so that the third and fourth sliding forks 510 and 520 In a first horizontal direction or in a second horizontal direction opposite to the first horizontal direction.

The second fork slider 530 includes a second guide bar 532 installed on both sides of the second support frame 326 to be supported by the bracket; And a second transfer cylinder 534 having a link 536 connected to each of the third and fourth sliding forks 510 and 520 so as to be transported to the second guide bar 532. The second fork slider 530 may be a hydraulic or pneumatic driving cylinder for transferring the second transfer cylinder 534 by hydraulic or pneumatic pressure supplied to at least one side of the second guide bar 532. [

The plurality of second substrate supporting pads 540 are disposed at regular intervals on the sixth sliding bar 518 to support one side rear surface of the substrate during transport of the substrate.

Meanwhile, in the second bidirectional sliding fork unit 340, two sliding forks 510 and 520 have been described. However, the sliding forks may be composed of two or more for stable and unstable substrate transportation. In the second bidirectional sliding fork portion 340, the second fork slider 530 is configured to be a hydraulic or pneumatic driving cylinder. However, the present invention is not limited to this, and the second fork slider 530 may be an LM guider, And / or at least two of the belts may be combined to slide the sliding forks 510 and 520.

The second bidirectional sliding fork portion 340 may further include a position detecting sensor for detecting the sliding position in bi-directional sliding of the sliding bars 514, 516, 518 and controlling the second fork slider 530 have.

The second bidirectional sliding fork unit 340 is configured to move the third and fourth sliding forks 510 and 520 in the first conveying direction or the second conveying direction opposite to the first conveying direction by using the second fork slider 530, The substrates are transported in both directions to the process chamber TC disposed on one side or the other side of the transfer chamber TC.

The fork lifting unit 350 according to an embodiment includes a first lifting support 352a, a second lifting support 352b, a first lifting motor 354a; A second elevating motor (not shown), a first ball screw 356a, a second ball screw 356b, and an interlocking shaft 358.

The first lifting support 352a is installed perpendicular to the base frame 310 so as to face the first side of the fork frame 320. [

The second lifting support 352b is installed on the second side of the fork frame 320 so as to be perpendicular to the base frame 310 so as to face the first lifting support 352a.

The first elevating motor 354a is mounted on the base frame 310 so as to be adjacent to the inner side surface of the first elevating support 352a and supports the first ball screw 356a in the first direction or in the second direction opposite to the first direction .

The second elevating motor is installed on the base frame 310 so as to be adjacent to the inner surface of the second elevating support 352b and rotates the second ball screw 356b in the same direction as the first ball screw 356b.

The first ball screw 356a is installed between the first lift support 352a and the first lift motor 354a so as to penetrate the protrusion 328 formed in the first support frame 322 of the fork frame 320, The first side of the fork frame 320 is moved up and down according to the rotation of the elevating motor 354a. At this time, the protrusion 328 formed on the first support frame 322 is formed with a thread to be engaged with the first ball screw 356a.

The second ball screw 356b is installed between the second lift support 352b and the second lift motor so as to pass through the protrusion 328 formed in the first support frame 322 of the fork frame 320, 354b, the second side of the fork frame 320 is raised and lowered. At this time, the protrusion 328 formed in the first support frame 322 is formed with a thread to be engaged with the second ball screw 356b.

The interlocking shaft 358 is installed between the first elevating motor 354a and the second elevating motor 354a and transmits the rotational force of the first elevating motor 354a or the second elevating motor to another elevating motor to control the first elevating motor 354a And the rotation of the second elevating motor is interlocked and synchronized.

The fork lifting unit 350 moves the fork frame 320 up and down according to the rotation of the first and second ball screws 356a and 356b according to the rotation of the first lifting motor 354a and the second lifting motor The first or second bidirectional sliding fork portions 330 and 340 are lifted to a desired height.

The fork lift unit 350 may further include a position sensor for detecting the position of the fork frame 320 when the fork frame 320 is moved up and down and controlling the rotation of the first and second lift motors 354a and 354a.

The fork lifting guide unit 360 may include a plurality of lifting guide blocks 362 and a plurality of lifting guide rails 364.

A plurality of elevation guide blocks 362 are installed in the side wall supports 324 corresponding to the first and second side edge portions of the fork frame 320. Here, a plurality of the elevation guide blocks 362 may be provided for each of the first and second side surfaces of the fork frame 320.

The plurality of elevating guide rails 364 are vertically installed on the base frame 310 so as to be connected to the elevating guide blocks 362 to guide the elevating and lowering of the elevating guide block 362 when the fork frame 320 is lifted or lowered.

As described above, the substrate moving apparatus moves the substrate in the transfer chamber through horizontal movement by the substrate transfer section 200, and transfers the substrate to the process chamber PC or the load lock chamber LC by the substrate transfer section 300 The substrate can be transported in both directions.

A method of processing a substrate, that is, a method of moving a substrate in the above-described semiconductor manufacturing apparatus will be described.

First, a plurality of substrates are sequentially loaded in a first chamber (load lock chamber) equipped with an aligning member. At this time, the alignment member in the above-described load lock chamber can align four corners of the plurality of substrates. As described above, it is possible to align the four boards by moving the rollers with the aligning members.

At this time, in the load lock chamber, in addition to the alignment member near the corner of the substrate, another alignment member may be provided at a portion where the plurality of substrates meet. At this time, if four substrates are provided in the load lock chamber, the other alignment member is provided in a cross shape, that is, a pair of straight lines intersecting each other at a center portion where four substrates meet, It can be aligned in the vertical direction.

Then, the plurality of substrates are transferred from the load lock chamber into the second chamber (transfer chamber) using the substrate transfer section.

Then, the substrate is transferred using the substrate transfer unit in the transfer chamber, and is moved to a position in parallel with the process chamber at a position in parallel with the load lock chamber.

Subsequently, the plurality of substrates are transferred from the transfer chamber to the third chamber (process chamber) using the substrate transfer section. At this time, the plurality of substrates are seated in the process chamber in the same pattern as the pattern aligned in the load lock chamber.

In the third chamber, a divider may be provided, and the divider may be provided in the same pattern as the alignment member, that is, in a straight line intersecting each other, so that the four substrates can be aligned in the horizontal direction and the vertical direction .

When the substrate is transported in the substrate transfer section, the substrate is vertically raised in the unloading chamber, the substrate is horizontally moved from the unloading chamber to the loading chamber, and then the substrate is vertically lowered into the loading chamber, .

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. This is possible.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the equivalents of the claims, as well as the claims.

10: chamber body 12: loading frame
14: pin 16: substrate
20: substrate carrying section 22, 125: arm
30: valve 40: divider
40a: support member 40b: separating member
50: susceptor 100, 110: gate
120: Substrate moving device 150: Body
160: fine adjustment device 162, 170, 180, 182: alignment member
200: substrate transfer unit 300: substrate transfer unit

Claims (29)

A process chamber having two or four substrates;
A load lock chamber for aligning the two or four substrates; And
A substrate transfer device for loading the two or four substrates from the load lock chamber into the process chamber at one time,
Lt; / RTI >
The substrate moving device includes:
The two or four substrates are transferred from the load lock chamber to the process chamber while the two or four substrates are transferred while maintaining the same alignment pattern in the substrate transfer device,
Wherein the load lock chamber has an aligning member therein,
Wherein the alignment member is provided as a fixing member or a rotating member between the two or four substrates. The method according to claim 1,
The substrate moving device includes:
And a plurality of arms for supporting the two or four substrates at one time. delete A first chamber in which a plurality of substrates facing each other are provided;
An aligning member provided in the first chamber and aligning the plurality of substrates;
And a substrate transfer device including a substrate transfer section,
The substrate moving device includes:
The plurality of substrates are transferred from the first chamber to the third chamber using the substrate transfer section, the plurality of substrates are transported in the same alignment pattern,
Wherein the alignment member is provided as a fixing member or a rotating member between the plurality of substrates. delete delete A first chamber in which a plurality of substrates facing each other are provided;
An aligning member provided in the first chamber and aligning the plurality of substrates;
And a substrate transfer device including a substrate transfer section,
The substrate moving device includes:
The plurality of substrates are transferred to the first chamber, the second chamber and the third chamber using the substrate transfer section, the plurality of substrates are transferred in the same alignment pattern,
Wherein the alignment member is provided as a fixing member or a rotating member between the plurality of substrates. delete delete [Claim 10 is abandoned upon payment of the registration fee.] A first chamber in which a plurality of substrates facing each other are provided;
An aligning member provided in the first chamber and aligning the plurality of substrates;
And a substrate transfer device including a substrate transfer section,
The substrate moving device includes:
Wherein the plurality of substrates are moved from the first chamber to the second chamber using the substrate transfer unit, the plurality of substrates being moved in parallel with the first chamber,
Wherein the alignment member is provided as a fixing member or a rotating member between the plurality of substrates. delete delete [13] has been abandoned due to the registration fee. A first chamber in which a plurality of substrates facing each other are provided;
An aligning member provided in the first chamber and aligning the plurality of substrates;
And a substrate transfer device including a substrate transfer section,
The substrate moving device includes:
Moving the plurality of substrates from the first chamber to the third chamber using the substrate transfer unit, moving the plurality of substrates to a position in parallel with the first chamber,
Wherein the alignment member is provided as a fixing member or a rotating member between the plurality of substrates. delete delete [Claim 16 is abandoned upon payment of registration fee.] A first chamber in which a plurality of substrates facing each other are provided;
An aligning member provided in the first chamber and aligning the plurality of substrates in the first chamber;
And a substrate transfer device including a substrate transfer section,
The substrate moving device includes:
The plurality of substrates are moved to the first chamber, the second chamber, and the third chamber using the substrate transfer unit, and the plurality of substrates are moved to a position in parallel with the first chamber,
Wherein the alignment member is provided as a fixing member or a rotating member between the plurality of substrates. delete delete A first stage in which a plurality of substrates are transported into the first chamber;
A second step of transporting the plurality of substrates in the first chamber into a second chamber; Lt; / RTI >
Wherein the plurality of substrates maintain the same alignment pattern until they are transferred from the first chamber to the second chamber,
And an aligning member for aligning the plurality of substrates is provided in the first chamber,
Wherein the alignment member is provided as a fixing member or a rotating member between the plurality of substrates facing each other. delete 20. The method of claim 19,
The first chamber aligns the four substrates,
Wherein the four aligned substrates are supplied to the second chamber while maintaining the same alignment. A first stage in which a plurality of substrates are transported into the first chamber;
A second step of transporting the plurality of substrates in the first chamber into a third chamber; Lt; / RTI >
Wherein the plurality of substrates maintain the same alignment pattern until they are transferred from the first chamber to the third chamber,
And an aligning member for aligning the plurality of substrates is provided in the first chamber,
Wherein the alignment member is provided as a fixing member or a rotating member between the plurality of substrates facing each other. delete 23. The method of claim 22,
The first chamber aligns the four substrates,
Wherein the four aligned substrates are supplied to the third chamber while maintaining the same alignment. A first stage in which a plurality of substrates are transported into the first chamber;
A second step of transporting the plurality of substrates in the first chamber into a second chamber; And
And transporting the plurality of substrates in the second chamber into a third chamber,
Wherein the plurality of substrates maintain the same alignment pattern until they are transported to the first chamber, the second chamber, and the third chamber,
And an aligning member for aligning the plurality of substrates is provided in the first chamber,
Wherein the alignment member is provided as a fixing member or a rotating member between the plurality of substrates facing each other. delete 26. The method of claim 25,
The first chamber aligns the four substrates,
Wherein the four aligned substrates are supplied to the first chamber, the second chamber, and the third chamber while maintaining the same alignment. A process chamber having two or four substrates;
A load lock chamber for aligning the two or four substrates; And
A transfer chamber between the process chamber and the load lock chamber;
Lt; / RTI >
Wherein the transfer chamber comprises:
A substrate transfer device for loading the two or four substrates from the load lock chamber into the process chamber at one time,
Lt; / RTI >
Wherein the load lock chamber has an aligning member therein,
Wherein the alignment member is provided as a fixing member or a rotating member between the two or four substrates. 29. The method of claim 28,
The substrate moving device includes:
And a plurality of arms for supporting the two or four substrates at one time.

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