TW201130072A - Heat treatment device - Google Patents

Heat treatment device

Info

Publication number
TW201130072A
TW201130072A TW099124594A TW99124594A TW201130072A TW 201130072 A TW201130072 A TW 201130072A TW 099124594 A TW099124594 A TW 099124594A TW 99124594 A TW99124594 A TW 99124594A TW 201130072 A TW201130072 A TW 201130072A
Authority
TW
Taiwan
Prior art keywords
clean air
substrate transfer
chamber
transfer path
heat treatment
Prior art date
Application number
TW099124594A
Other languages
Chinese (zh)
Inventor
Shunichi Yahiro
Tetsuya Sada
Makoto Kubo
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201130072A publication Critical patent/TW201130072A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tunnel Furnaces (AREA)
  • Furnace Details (AREA)

Abstract

This invention intends to suppress the heat treatment temperature variation among different substrates, and to homogenize the line widths of wiring patterns among different substrates and within a substrate plane. The heat treatment device of this invention includes a substrate transfer means 10 for continuously and horizontally transferring a plurality of substrates 9 along a substrate transfer path 2, a first chamber 8 covering prescribed zones on the substrate transfer path 2 and forming a heat treatment space for the substrate transferred along the substrate transfer path, heating means 17, 18 for heating the interior of the first chamber, a clean air supply means 7 disposed in front of the first chamber and supplying clean air to the substrate transfer path, and a control means 50 for at least controlling the quantity of clean air supplied by the clean air supply means. The first chamber has a carry-in port 51 through which substrates on the substrate transfer path are carried in. Clean air supplied by the clean air supply means is supplied into the first chamber through the carry-in port.
TW099124594A 2009-09-18 2010-07-26 Heat treatment device TW201130072A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009217475A JP4936567B2 (en) 2009-09-18 2009-09-18 Heat treatment equipment

Publications (1)

Publication Number Publication Date
TW201130072A true TW201130072A (en) 2011-09-01

Family

ID=43865838

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099124594A TW201130072A (en) 2009-09-18 2010-07-26 Heat treatment device

Country Status (4)

Country Link
JP (1) JP4936567B2 (en)
KR (1) KR20110031112A (en)
CN (1) CN102024678A (en)
TW (1) TW201130072A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101239609B1 (en) * 2011-06-17 2013-03-11 주식회사 테스 Sola cell manufacturing apparatus
JP6555091B2 (en) * 2015-11-10 2019-08-07 シンフォニアテクノロジー株式会社 Robot transfer device
JP7066525B2 (en) * 2018-05-30 2022-05-13 東京エレクトロン株式会社 Board processing equipment and board processing method
JP7034011B2 (en) * 2018-06-06 2022-03-11 東京エレクトロン株式会社 Board processing equipment and board temperature measurement method
CN110047781B (en) * 2019-03-14 2021-08-24 云谷（固安）科技有限公司 Laser annealing equipment and laser annealing method
CN114671217A (en) * 2020-12-24 2022-06-28 志圣工业股份有限公司 Self-cleaning conveying device and heating equipment comprising same

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
JP2888697B2 (en) * 1992-05-06 1999-05-10 富士写真フイルム株式会社 Hard substrate coating / prebaking equipment
JPH05343312A (en) * 1992-06-11 1993-12-24 Nippon Telegr & Teleph Corp <Ntt> Heat treatment processor for semiconductor
JPH09237965A (en) * 1996-02-29 1997-09-09 Furukawa Electric Co Ltd:The Reflow furnace
JPH10267544A (en) * 1997-03-24 1998-10-09 Murata Mfg Co Ltd Continuous heat treating furnace
JP3679243B2 (en) * 1997-03-25 2005-08-03 東京エレクトロン株式会社 Processing apparatus and processing method
JP3783366B2 (en) * 1997-10-09 2006-06-07 松下電器産業株式会社 Firing furnace
JP3897456B2 (en) * 1998-07-15 2007-03-22 大日本印刷株式会社 Drying equipment
JP3799278B2 (en) * 2001-02-23 2006-07-19 株式会社タムラ製作所 Hot air injection device, hot air injection type heating device and heating furnace
JP2003007594A (en) * 2001-06-21 2003-01-10 Dainippon Screen Mfg Co Ltd Device for heat-treating substrate
JP4149687B2 (en) * 2001-07-19 2008-09-10 シャープ株式会社 Heat treatment method
JP4030787B2 (en) * 2002-03-04 2008-01-09 東京エレクトロン株式会社 Substrate heating method, substrate heating apparatus, coating and developing apparatus
JP2003332727A (en) * 2002-05-15 2003-11-21 Sony Corp Heat shielding member and reflow apparatus
JP2004207225A (en) * 2002-12-11 2004-07-22 Nec Plasma Display Corp Burning furnace of plasma display panel, and manufacturing method of plasma display panel
JP2006245110A (en) * 2005-03-01 2006-09-14 Tokyo Electron Ltd Heat-treating apparatus
JP4531690B2 (en) * 2005-12-08 2010-08-25 東京エレクトロン株式会社 Heat treatment device
JP2008053454A (en) * 2006-08-24 2008-03-06 Dainippon Printing Co Ltd Baking apparatus and baking method
JP4272230B2 (en) * 2006-12-22 2009-06-03 東京エレクトロン株式会社 Vacuum dryer
JP2008160011A (en) * 2006-12-26 2008-07-10 Tokyo Electron Ltd Substrate treating equipment
JP2008164235A (en) * 2006-12-28 2008-07-17 Ngk Insulators Ltd Heat treatment furnace for flat plate-shaped member
JP4341978B2 (en) * 2007-03-02 2009-10-14 東京エレクトロン株式会社 Substrate processing equipment
JP4542577B2 (en) * 2007-09-19 2010-09-15 東京エレクトロン株式会社 Normal pressure drying apparatus, substrate processing apparatus, and substrate processing method
JP4813583B2 (en) * 2009-07-15 2011-11-09 東京エレクトロン株式会社 Substrate processing equipment

Also Published As

Publication number Publication date
JP2011066318A (en) 2011-03-31
JP4936567B2 (en) 2012-05-23
KR20110031112A (en) 2011-03-24
CN102024678A (en) 2011-04-20

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