TW201129857A - Solder resist composition and printed circuit board - Google Patents

Solder resist composition and printed circuit board

Info

Publication number
TW201129857A
TW201129857A TW099113676A TW99113676A TW201129857A TW 201129857 A TW201129857 A TW 201129857A TW 099113676 A TW099113676 A TW 099113676A TW 99113676 A TW99113676 A TW 99113676A TW 201129857 A TW201129857 A TW 201129857A
Authority
TW
Taiwan
Prior art keywords
solder resist
resist composition
circuit board
printed circuit
light polymerization
Prior art date
Application number
TW099113676A
Other languages
Chinese (zh)
Other versions
TWI484290B (en
Inventor
Mami Nousaka
Yoshikazu Daigo
Shigeru Ushiki
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201129857A publication Critical patent/TW201129857A/en
Application granted granted Critical
Publication of TWI484290B publication Critical patent/TWI484290B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The topic of the present invention is to provide a solder resist composition capable of preventing the reduction of reflectivity due to discoloration deterioration and having high resolution under high reflectivity, and a printed circuit board obtained by using the solder resist. The solder resist composition of the present invention is characterized in having: (A) carboxy-containing resin without aromatic ring; (B) double-acyl phosphine oxide type light polymerization initiator; (C) single-acyl phosphine oxide type light polymerization initiator; (D) light polymerization type single; (E) rutile type titanium oxide; and (G) organic solvent.
TW099113676A 2010-02-17 2010-04-29 Solder resist composition and printed wiring board TWI484290B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010032934A JP4975834B2 (en) 2010-02-17 2010-02-17 Solder resist composition and printed wiring board

Publications (2)

Publication Number Publication Date
TW201129857A true TW201129857A (en) 2011-09-01
TWI484290B TWI484290B (en) 2015-05-11

Family

ID=43600595

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099113676A TWI484290B (en) 2010-02-17 2010-04-29 Solder resist composition and printed wiring board

Country Status (4)

Country Link
JP (1) JP4975834B2 (en)
KR (1) KR101718996B1 (en)
CN (2) CN102722083B (en)
TW (1) TWI484290B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011227308A (en) * 2010-04-20 2011-11-10 Taiyo Holdings Co Ltd Solder resist composition and print circuit board
JP2011215384A (en) * 2010-03-31 2011-10-27 Taiyo Holdings Co Ltd Solder resist composition and printed-circuit board
CN102944977B (en) * 2012-11-28 2014-08-27 惠州市容大油墨有限公司 Photosensitive solder resist composite, application thereof and printed circuit board (PCB) containing same
JP5688129B1 (en) * 2013-09-30 2015-03-25 太陽インキ製造株式会社 Curable composition for printed wiring board, cured coating film using the same, and printed wiring board
CN106028668A (en) * 2016-05-05 2016-10-12 广合科技（广州）有限公司 Printed circuit board preparing method preventing discoloration of solder resist layer
CN114442425A (en) * 2020-10-30 2022-05-06 常州正洁智造科技有限公司 Curable resin composition, solder resist film formed from the same, interlayer insulating material, and printed wiring board

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6454390A (en) 1987-08-26 1989-03-01 Matsushita Electric Ind Co Ltd Driver using shape memory alloy
JPH0717737A (en) 1993-07-02 1995-01-20 Showa Electric Wire & Cable Co Ltd Device for producing optical fiber perform
DE19812859A1 (en) * 1998-03-24 1999-09-30 Basf Ag Mixtures of photoinitiators
SE9904080D0 (en) * 1998-12-03 1999-11-11 Ciba Sc Holding Ag Fotoinitiatorberedning
JP2004318047A (en) * 2003-03-31 2004-11-11 Sumitomo Bakelite Co Ltd Photosensitive resin composition, laminate, wiring board, and flexible wiring board
JP4340272B2 (en) * 2006-05-30 2009-10-07 太陽インキ製造株式会社 Photocurable / thermosetting solder resist composition and printed wiring board using the same
KR100904348B1 (en) * 2006-10-24 2009-06-23 다이요 잉키 세이조 가부시키가이샤 Photocurable thermosetting resin composition and printed wiring board using same
JP4538484B2 (en) * 2006-10-24 2010-09-08 太陽インキ製造株式会社 Photocurable thermosetting resin composition and printed wiring board using the same
TWI357536B (en) * 2006-10-24 2012-02-01 Taiyo Ink Mfg Co Ltd Photosetting and thermosetting solder resist ink c
JP4994922B2 (en) * 2007-04-06 2012-08-08 太陽ホールディングス株式会社 Solder resist composition and cured product thereof
JP2009194222A (en) * 2008-02-15 2009-08-27 Denki Kagaku Kogyo Kk White alkali-developable photocurable and thermosetting solder resist composition, and metal-base circuit substrate using the same
JP2010014767A (en) * 2008-07-01 2010-01-21 Denki Kagaku Kogyo Kk Alkali developable photocurable/heat curable solder resist composition and metal base circuit board using the same
TWI408150B (en) * 2008-10-17 2013-09-11 Taiyo Ink Mfg Co Ltd A solder resist composition and a printed circuit board using the same
JP5749886B2 (en) * 2009-12-28 2015-07-15 株式会社タムラ製作所 Curable resin composition and printed wiring board using the same
JP5325805B2 (en) * 2010-01-29 2013-10-23 株式会社タムラ製作所 Photosensitive resin composition and printed wiring board using cured film thereof

Also Published As

Publication number Publication date
CN101980081A (en) 2011-02-23
JP2011170049A (en) 2011-09-01
CN102722083B (en) 2016-03-30
TWI484290B (en) 2015-05-11
KR101718996B1 (en) 2017-03-22
CN102722083A (en) 2012-10-10
KR20110095096A (en) 2011-08-24
JP4975834B2 (en) 2012-07-11

Similar Documents

Publication Publication Date Title
TW201129600A (en) Solder resist composition and printed circuit board
TW201129857A (en) Solder resist composition and printed circuit board
MY155964A (en) Photosensitive resin composition, cured product thereof, and printed wiring board
MY163409A (en) Photosensitive resin composition,laminate utilizing same and solid-state imaging device
TW200834233A (en) Photocurable/thermocurable solder resist ink composition and printed circuit board using it
WO2011119272A3 (en) Macro-photoinitiators and curable compositions thereof
BRPI1011705A8 (en) VINYL ESTER RESIN COMPOSITION
TW201612627A (en) Photosensitive resin composition
WO2010105141A3 (en) Azaporphyrins and applications thereof
WO2011111964A3 (en) Photosensitive resin composition having excellent heat resistance and mechanical properties, and protective film for a printed circuit board
MY170310A (en) Synthesized resins and varnishes, prepregs and laminates made therefrom
WO2011105277A3 (en) Resin composition for polyester base material, and dry film and printed circuit boards using same
IN2014CN03017A (en)
WO2011118939A3 (en) Photocurable and thermocurable resin composition, and dry film solder resist
WO2010136110A3 (en) Polymers comprising substituted indenofluorene derivates as structural units, method for the production thereof, and use thereof
PE20131126A1 (en) ALTERATION RESISTANT DOSAGE FORM INCLUDING AN ANIONIC POLYMER
TW201130015A (en) Pitch division patterning techniques
WO2014176490A8 (en) Photosensitive compositions and applications thereof
ATE516693T1 (en) IMPROVED MELTING COMPOSITIONS
TW200730966A (en) Display device
WO2013048134A3 (en) Touch panel comprising conductive pattern
WO2012091293A3 (en) Polycarbonate resin composition having excellent chemical resistance
FI2742180T3 (en) Pigment for paper and paper laminate
IL217246A0 (en) Monomers, photoresist compositions and methods of forming photolithographic patterns
JP2010539659A5 (en)