CN106028668A - Printed circuit board preparing method preventing discoloration of solder resist layer - Google Patents
Printed circuit board preparing method preventing discoloration of solder resist layer Download PDFInfo
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- CN106028668A CN106028668A CN201610291973.4A CN201610291973A CN106028668A CN 106028668 A CN106028668 A CN 106028668A CN 201610291973 A CN201610291973 A CN 201610291973A CN 106028668 A CN106028668 A CN 106028668A
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- solder mask
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a printed circuit board preparing method preventing discoloration of a solder resist layer. According to the invention, after a nickel layer and a gold layer are chemically deposited on a circuit board, the circuit board is immersed into hot water; the solder resist layer can be effectively prevented from discoloration; a prepared product has a balanced color and reflective effect; and the method is particularly suitable for preparing LED lighting products.
Description
Technical field
The present invention relates to printed wiring board preparation method, be specifically related to a kind of printed wiring board system preventing solder mask variable color
Preparation Method.
Background technology
The solder mask of printed wiring board through repeatedly wave-soldering process after, the most aging, variable color, cause whole plate face
Color is uneven.When this printed wiring board is used for manufacturing LED product, due to plate face irregular colour, LED product regional is caused to produce
Add lustre to coloured silk, reflection inequality, affect the light efficiency of LED product.The Chinese invention patent of Patent No. 2012105056786 discloses one
Plant welding resistance coating, the ageing resistace of solder mask can be improved, but through test, still can not effectively eliminate wiring board solder mask
Metachromatism.Therefore, a kind of wiring board preparation method preventing assembly welding layer variable color is needed badly.
Summary of the invention
In view of this, the present invention discloses a kind of wiring board preparation method preventing solder mask variable color.
The purpose of the present invention is achieved through the following technical solutions: a kind of printed wiring board preparation side preventing solder mask variable color
Method, including following operation:
S1. in copper-clad plate, form circuit；
S2. solder mask is formed in the logicalnot circuit region of wiring board；
S3. online road surfaces covers nickel dam and layer gold；
S4. wiring board is immersed immersion 8-15Min in the water of 60-90 DEG C.
The present invention (is abbreviated as ENIG, also known as changing nickel nickel gold golden, heavy or without electricity at wiring board chemical deposition nickel dam and layer gold
Nickel gold) after, wiring board is immersed in hot water, this step can be effectively improved the discoloration problem of solder mask.Described shape in copper-clad plate
Become circuit, formation solder mask, covering nickel dam and layer gold all to can be selected for any one prior art to realize.
Further, the described solder mask that formed in the logicalnot circuit region of wiring board includes coating welding resistance in the circuit board successively
Ink, pre-baked, expose, develop, bake afterwards；Described pre-baked be air cooking wiring board 10-30Min at 70-90 DEG C；Bake after described
It is air cooking wiring board 50-90Min at 150-190 DEG C.
Inventor finds under study for action, controls pre-baked and rear roasting temperature and time, can prevent solder mask from sending out further
Change color.
Further, its raw material of described solder mask includes modified epoxy acrylate resin oligomer 40-70 by weight
Part；Epoxy resin 10-20 part；Firming agent 2-5 part；Reactive diluent 1-10 part；Solvent 2-9 part；Light trigger 2-6 part；In vain
Color pigment 0.5-1 part；Inorganic filler 15-30 part；Resistance toner 0.01-0.24 part；Described modified epoxy acrylate resin is low
Polymers is by novolac epoxy resin 60 parts by weight, 20 parts of acrylic acid, 5 parts of glycidoxypropyl group silane, catalyst four
Butylammonium bromide 7 parts, hydroquinone of polymerization retarder 1 part, the mixture of solvent ethylene glycol butyl ether 120 parts composition is at 120 DEG C of bars
React 5h under part, then it is prepared to add 10 parts of THPA reaction 2-6h；Described resistance toner includes alpha-Naphthol 2wt%, 1,2,3-indantrione monohydrate
20wt%, the EDETATE SODIUM of dihydromyrcenol 40wt% and 10wt% and the potassium chloride of surplus.
Described epoxy resin, firming agent, reactive diluent, solvent, light trigger, Chinese white, inorganic filler, phenolic aldehyde ring
Epoxy resins, acrylic acid, glycidoxypropyl group silane, catalyst tetrabutyl ammonium bromide, hydroquinone of polymerization retarder, solvent ethylene glycol
Butyl ether all can be selected for any one prior art and realizes, the kind as disclosed in Chinese invention patent 2012105056786.Especially
, the present invention adds resistance toner in solder mask, and alpha-Naphthol therein, 1,2,3-indantrione monohydrate can be effectively improved the anti-discoloration of solder mask
Can, in long-term aging test, remain to maintain the color and luster of solder mask, be the most also avoided that solder mask is aging, ftracture under high temperature.Two
Hydrogen myrcenol, EDETATE SODIUM and potassium chloride can be effectively improved the smoothness on solder mask surface, flatness, improve reflective effect
Really.Described alpha-Naphthol, has another name called alpha naphthol, 1-naphthols.There is unpleasant phenol abnormal smells from the patient.Be slightly soluble in water, be soluble in ethanol, ether, benzene,
Chloroform, is dissolved in sodium hydroxide solution.For synthetic dyestuffs and intermediate thereof, it is additionally operable to synthetic perfume and other organic synthesis work
Industry, can be selected for any one commercially available prod and realizes.Described 1,2,3-indantrione monohydrate is a kind of examination for detecting ammonia or primary amine and secondary amine
Agent.When reacting with these unhindered aminas, it is possible to produce navy blue or the material of purple, it is called Ruhemann purple.1,2,3-indantrione monohydrate is normal
Being used for detecting fingerprint, this is the lysine residue owing to containing in the protein of fingerprint surface institute shedding and peptide, one-level thereon
Amine is detected by 1,2,3-indantrione monohydrate, can be selected for commercially available prod and realize in the present invention.Dihydromyrcenol mainly from dihydromyrcene (from pinene
Hydrogenation products pinane be cracked to form) under acid catalysis and water, formic acid addition and obtain, for commercially available prod.
Further, at least one during described epoxy resin is novolac epoxy resin, bisphenol A type epoxy resin；Institute
Stating firming agent is imidazole curing agent；Described reactive diluent is hydroxyethyl methylacrylate, glyceral methacrylate, methyl
Isobornyl acrylate, trimethylolpropane trimethacrylate, ethoxyquin trimethylolpropane trimethacrylate, the third oxidation three hydroxyls
At least one in propane tri, pentaerythritol triacrylate, dipentaerythritol acrylate.
Preferably, described solvent is ethylene glycol, dipropylene glycol methyl ether, ethylene glycol ether acetate, butyl glycol ether
At least one in acetate, propylene glycol methyl ether acetate；Described light trigger be benzoin and derivant thereof, benzil class,
Alkylbenzene ketone, acyl group phosphorous oxides, benzophenone, thioxanthone apoplexy due to endogenous wind at least one；Described inorganic filler is Talcum
At least one in powder, bentonite.
Preferably, the optical radiation energy of described exposure is 600-700mj/cm2。
Wiring board, after wiring board chemical deposition nickel dam and layer gold, is immersed in hot water by the present invention, and this can be effectively improved resistance
The discoloration problem of layer, makes prepared product have color and luster and the reflecting effect of equilibrium, is particularly suited for preparing LED illumination and produces
Product.
Detailed description of the invention
The present invention is described in further detail below in conjunction with embodiment for the ease of it will be appreciated by those skilled in the art that:
Embodiment 1
The present embodiment provides a kind of printed wiring board preparation method preventing solder mask variable color, including following operation:
S1. in copper-clad plate, form circuit；
S2. solder mask is formed in the logicalnot circuit region of wiring board；
S3. online road surfaces covers nickel dam and layer gold；
S4. wiring board is immersed in the water of 75 DEG C and soak 10Min.
Further, the described solder mask that formed in the logicalnot circuit region of wiring board includes coating resistance in the circuit board successively
Solder paste is black, pre-baked, expose, develop, bake afterwards；Described pre-baked be air cooking wiring board 20Min at 80 DEG C；After described roasting be
Air cooking wiring board 60Min at 170 DEG C.
Further, its raw material of described solder mask includes modified epoxy acrylate resin oligomer 50 parts by weight；
Epoxy resin 15 parts；3 parts of firming agent；Reactive diluent 6 parts；Solvent 5 parts；Light trigger 4 parts；Chinese white 0.7 part；Nothing
Machine filler 20 parts；Resistance toner 0.14 part；Described modified epoxy acrylate resin oligomer is by novolac epoxy resin by weight
60 parts, 20 parts of acrylic acid, 5 parts of glycidoxypropyl group silane, catalyst tetrabutyl ammonium bromide 7 parts, polymerization inhibitor is to benzene two
1 part of phenol, the mixture of solvent ethylene glycol butyl ether 120 parts composition reacts 5h under the conditions of 120 DEG C, then adds 10 parts of tetrahydrochysene benzene
Anhydride reactant 2-6h prepares；Described resistance toner include alpha-Naphthol 2wt%, 1,2,3-indantrione monohydrate 20wt%, dihydromyrcenol 40wt% and
The EDETATE SODIUM of 10wt% and the potassium chloride of surplus.
Further, described epoxy resin is novolac epoxy resin；Described firming agent is imidazole curing agent, this enforcement
Example is preferably commercially available 2-Methylimidazole.；Described reactive diluent is hydroxyethyl methylacrylate.
Preferably, described solvent be ethylene glycol, 2-Butoxyethyl acetate, propylene glycol methyl ether acetate with quality 1:
The ratio mixing of 1:3；Described light trigger is isopropyl thioxanthone；Described inorganic filler is Pulvis Talci；Described Chinese white
For titanium dioxide.
Preferably, the optical radiation energy of described exposure is 650mj/cm2。
Embodiment 2
The present embodiment provides a kind of printed wiring board preparation method preventing solder mask variable color, including following operation:
S1. in copper-clad plate, form circuit；
S2. solder mask is formed in the logicalnot circuit region of wiring board；
S3. online road surfaces covers nickel dam and layer gold；
S4. wiring board is immersed in the water of 90 DEG C and soak 8Min.
Further, the described solder mask that formed in the logicalnot circuit region of wiring board includes coating resistance in the circuit board successively
Solder paste is black, pre-baked, expose, develop, bake afterwards；Described pre-baked be air cooking wiring board 10Min at 90 DEG C；After described roasting be
Air cooking wiring board 50Min at 190 DEG C.
Further, its raw material of described solder mask includes modified epoxy acrylate resin oligomer 70 parts by weight；
Epoxy resin 10 parts；5 parts of firming agent；Reactive diluent 1 part；Solvent 9 parts；Light trigger 2 parts；Chinese white 1 part；Inorganic
Filler 15 parts；Resistance toner 0.24 part；Described modified epoxy acrylate resin oligomer is by novolac epoxy resin by weight
60 parts, 20 parts of acrylic acid, 5 parts of glycidoxypropyl group silane, catalyst tetrabutyl ammonium bromide 7 parts, polymerization inhibitor is to benzene two
1 part of phenol, the mixture of solvent ethylene glycol butyl ether 120 parts composition reacts 5h under the conditions of 120 DEG C, then adds 10 parts of tetrahydrochysene benzene
Anhydride reactant 2-6h prepares；Described resistance toner include alpha-Naphthol 2wt%, 1,2,3-indantrione monohydrate 20wt%, dihydromyrcenol 40wt% and
The EDETATE SODIUM of 10wt% and the potassium chloride of surplus.
Further, described epoxy resin is bisphenol A type epoxy resin；Described firming agent is imidazole curing agent；Described
Reactive diluent is that hydroxyethyl methylacrylate, dipentaerythritol acrylate are with the mixing of quality 1:1.
Preferably, described solvent is propylene glycol methyl ether acetate；Described light trigger is isopropyl thioxanthone；Described nothing
Machine filler is Pulvis Talci.Chinese white is calcium carbonate
Preferably, the optical radiation energy of described exposure is 700mj/cm2。
Embodiment 3
The present embodiment provides a kind of printed wiring board preparation method preventing solder mask variable color, including following operation:
S1. in copper-clad plate, form circuit；
S2. solder mask is formed in the logicalnot circuit region of wiring board；
S3. online road surfaces covers nickel dam and layer gold；
S4. wiring board is immersed immersion 11min in 80 water.
Further, the described solder mask that formed in the logicalnot circuit region of wiring board includes coating resistance in the circuit board successively
Solder paste is black, pre-baked, expose, develop, bake afterwards；Described pre-baked be air cooking wiring board 30Min at 70 DEG C；After described roasting be
Air cooking wiring board 90Min at 150 DEG C.
Further, its raw material of described solder mask includes modified epoxy acrylate resin oligomer 40 parts by weight；
Epoxy resin 20 parts；2 parts of firming agent；Reactive diluent 10 parts；Solvent 2 parts；Light trigger 6 parts；Chinese white 0.5 part；Nothing
Machine filler 30 parts；Resistance toner 0.01 part；Described modified epoxy acrylate resin oligomer is by novolac epoxy resin by weight
60 parts, 20 parts of acrylic acid, 5 parts of glycidoxypropyl group silane, catalyst tetrabutyl ammonium bromide 7 parts, polymerization inhibitor is to benzene two
1 part of phenol, the mixture of solvent ethylene glycol butyl ether 120 parts composition reacts 5h under the conditions of 120 DEG C, then adds 10 parts of tetrahydrochysene benzene
Anhydride reactant 2-6h prepares；Described resistance toner include alpha-Naphthol 2wt%, 1,2,3-indantrione monohydrate 20wt%, dihydromyrcenol 40wt% and
The EDETATE SODIUM of 10wt% and the potassium chloride of surplus.
Further, described epoxy resin is novolac epoxy resin；Described firming agent is imidazole curing agent；Described work
Property diluent is trimethylolpropane trimethacrylate.
Preferably, described solvent is dipropylene glycol methyl ether, ethylene glycol ether acetate；Described light trigger is benzil class
Light trigger；Described inorganic filler is bentonite.
Preferably, the optical radiation energy of described exposure is 600mj/cm2。
Embodiment 4
The present embodiment provides a kind of printed wiring board preparation method preventing solder mask variable color, including following operation:
S1. in copper-clad plate, form circuit；
S2. solder mask is formed in the logicalnot circuit region of wiring board；
S3. online road surfaces covers nickel dam and layer gold；
S4. wiring board is immersed in the water of 70 DEG C and soak 12Min.
Remaining operation all can use prior art to complete.
Embodiment 5
The present embodiment provides a kind of printed wiring board preparation method preventing solder mask variable color, including following operation:
S1. in copper-clad plate, form circuit；
S2. solder mask is formed in the logicalnot circuit region of wiring board；
S3. online road surfaces covers nickel dam and layer gold；
S4. wiring board is immersed in the water of 90 DEG C and soak 15Min.
Further, the described solder mask that formed in the logicalnot circuit region of wiring board includes coating resistance in the circuit board successively
Solder paste is black, pre-baked, expose, develop, bake afterwards；Described pre-baked be air cooking wiring board 30Min at 90 DEG C；After described roasting be
Air cooking wiring board 90Min at 190 DEG C.
Further, its raw material of described solder mask includes modified epoxy acrylate resin oligomer 50 parts by weight；
Epoxy resin 15 parts；3 parts of firming agent；Reactive diluent 6 parts；Solvent 5 parts；Light trigger 4 parts；Chinese white 0.7 part；Nothing
Machine filler 20 parts；Resistance toner 0.14 part；Described modified epoxy acrylate resin oligomer is by novolac epoxy resin by weight
60 parts, 20 parts of acrylic acid, 5 parts of glycidoxypropyl group silane, catalyst tetrabutyl ammonium bromide 7 parts, polymerization inhibitor is to benzene two
1 part of phenol, the mixture of solvent ethylene glycol butyl ether 120 parts composition reacts 5h under the conditions of 120 DEG C, then adds 10 parts of tetrahydrochysene benzene
Anhydride reactant 2-6h prepares；Described resistance toner includes the EDETATE SODIUM of 1,2,3-indantrione monohydrate 20wt%, 10wt% and the potassium chloride of surplus.
Further, described epoxy resin is novolac epoxy resin；Described firming agent is imidazole curing agent, this enforcement
Example is preferably commercially available 2-Methylimidazole.；Described reactive diluent is hydroxyethyl methylacrylate.
Preferably, described solvent be ethylene glycol, 2-Butoxyethyl acetate, propylene glycol methyl ether acetate with quality 1:
The ratio mixing of 1:3；Described light trigger is isopropyl thioxanthone；Described inorganic filler is Pulvis Talci；Described Chinese white
For titanium dioxide.
Preferably, the optical radiation energy of described exposure is 650mj/cm2。
Embodiment 6
The present embodiment provides a kind of printed wiring board preparation method preventing solder mask variable color, including following operation:
S1. in copper-clad plate, form circuit；
S2. solder mask is formed in the logicalnot circuit region of wiring board；
S3. online road surfaces covers nickel dam and layer gold；
S4. wiring board is immersed immersion 8-15Min in the water of 60-90 DEG C.
Further, the described solder mask that formed in the logicalnot circuit region of wiring board includes coating resistance in the circuit board successively
Solder paste is black, pre-baked, expose, develop, bake afterwards；Described pre-baked be air cooking wiring board 10-30Min at 70-90 DEG C；After described
Roasting is air cooking wiring board 50-90Min at 150-190 DEG C.
Further, its raw material of described solder mask includes modified epoxy acrylate resin oligomer 50 parts by weight；
Epoxy resin 15 parts；3 parts of firming agent；Reactive diluent 6 parts；Solvent 5 parts；Light trigger 4 parts；Chinese white 0.7 part；Nothing
Machine filler 20 parts；Resistance toner 0.14 part；Described modified epoxy acrylate resin oligomer is by novolac epoxy resin by weight
60 parts, 20 parts of acrylic acid, 5 parts of glycidoxypropyl group silane, catalyst tetrabutyl ammonium bromide 7 parts, polymerization inhibitor is to benzene two
1 part of phenol, the mixture of solvent ethylene glycol butyl ether 120 parts composition reacts 5h under the conditions of 120 DEG C, then adds 10 parts of tetrahydrochysene benzene
Anhydride reactant 2-6h prepares；Described resistance toner includes alpha-Naphthol 2wt%, the EDETATE SODIUM of dihydromyrcenol 40wt% and 10wt%
And the magnesium chloride of surplus.
Further, described epoxy resin is novolac epoxy resin；Described firming agent is imidazole curing agent, this enforcement
Example is preferably commercially available 2-Methylimidazole.；Described reactive diluent is hydroxyethyl methylacrylate.
Preferably, described solvent be ethylene glycol, 2-Butoxyethyl acetate, propylene glycol methyl ether acetate with quality 1:
The ratio mixing of 1:3；Described light trigger is isopropyl thioxanthone；Described inorganic filler is Pulvis Talci；Described Chinese white
For titanium dioxide.
Preferably, the optical radiation energy of described exposure is 650mj/cm2。
Comparative example
This comparative example provides a kind of printed wiring board preparation method, including following operation:
S1. in copper-clad plate, form circuit；
S2. solder mask is formed in the logicalnot circuit region of wiring board；
S3. online road surfaces covers nickel dam and layer gold；
S4. wiring board is immersed in the water of 30 DEG C and soak 10Min.
Further, the described solder mask that formed in the logicalnot circuit region of wiring board includes coating resistance in the circuit board successively
Solder paste is black, pre-baked, expose, develop, bake afterwards；Described pre-baked be air cooking wiring board 20Min at 80 DEG C；After described roasting be
Air cooking wiring board 60Min at 170 DEG C.
Further, its raw material of described solder mask includes modified epoxy acrylate resin oligomer 50 parts by weight；
Epoxy resin 15 parts；3 parts of firming agent；Reactive diluent 6 parts；Solvent 5 parts；Light trigger 4 parts；Chinese white 0.7 part；Nothing
Machine filler 20 parts；Resistance toner 0.14 part；Described modified epoxy acrylate resin oligomer is by novolac epoxy resin by weight
60 parts, 20 parts of acrylic acid, 5 parts of glycidoxypropyl group silane, catalyst tetrabutyl ammonium bromide 7 parts, polymerization inhibitor is to benzene two
1 part of phenol, the mixture of solvent ethylene glycol butyl ether 120 parts composition reacts 5h under the conditions of 120 DEG C, then adds 10 parts of tetrahydrochysene benzene
Anhydride reactant 2-6h prepares；Described resistance toner include alpha-Naphthol 2wt%, 1,2,3-indantrione monohydrate 20wt%, dihydromyrcenol 40wt% and
The EDETATE SODIUM of 10wt% and the potassium chloride of surplus.
Further, described epoxy resin is novolac epoxy resin；Described firming agent is imidazole curing agent, this enforcement
Example is preferably commercially available 2-Methylimidazole.；Described reactive diluent is hydroxyethyl methylacrylate.
Preferably, described solvent be ethylene glycol, 2-Butoxyethyl acetate, propylene glycol methyl ether acetate with quality 1:
The ratio mixing of 1:3；Described light trigger is isopropyl thioxanthone；Described inorganic filler is Pulvis Talci；Described Chinese white
For titanium dioxide.
Preferably, the optical radiation energy of described exposure is 650mj/cm2。
Discoloration-resisting is tested.
Wiring board prepared by embodiment is toasted 5 hours at a temperature of 255 degrees Celsius, and is placed on xenon lamp aging
Case (irradiation intensity 1000W/m2Burin-in process 1000 hours in).Whiteness reduction rate (the GB/T 17749-of test assembly welding layer
2008).Its result is as shown in the table.
Test is through the coefficient of kinetic friction of the embodiment solder mask of burin-in process, and its result is as shown in the table.
Being more than the wherein specific implementation of the present invention, it describes more concrete and detailed, but can not therefore manage
Solve as the restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from
On the premise of present inventive concept, it is also possible to make some deformation and improvement, these obvious alternative forms belong to this
Bright protection domain.
Claims (6)
1. prevent a printed wiring board preparation method for solder mask variable color, including following operation:
S1. in copper-clad plate, form circuit；
S2. solder mask is formed in the logicalnot circuit region of wiring board；
S3. online road surfaces covers nickel dam and layer gold；
S4. wiring board is immersed immersion 8-15Min in the water of 60-90 DEG C.
Method the most according to claim 1, it is characterised in that: the described solder mask that formed in the logicalnot circuit region of wiring board depends on
Secondary include coating in the circuit board solder mask, pre-baked, expose, develop, bake afterwards；Described pre-baked be at 70-90 DEG C hot blast dry
Roasting wiring board 10-30Min；Roasting after described is air cooking wiring board 50-90Min at 150-190 DEG C.
3. according to the method described in any one of claim 1 or 2, it is characterised in that: its raw material of described solder mask wraps by weight
Include modified epoxy acrylate resin oligomer 40-70 part；Epoxy resin 10-20 part；Firming agent 2-5 part；Activity dilution
Agent 1-10 part；Solvent 2-9 part；Light trigger 2-6 part；Chinese white 0.5-1 part；Inorganic filler 15-30 part；Resistance
Toner 0.01-0.24 part；Described modified epoxy acrylate resin oligomer is by novolac epoxy resin 60 parts, propylene by weight
Acid 20 parts, 5 parts of glycidoxypropyl group silane, catalyst tetrabutyl ammonium bromide 7 parts, hydroquinone of polymerization retarder 1 part, molten
The mixture of agent butyl glycol ether 120 parts composition reacts 5h under the conditions of 120 DEG C, then adds 10 parts of THPA reaction 2-
6h prepares；Described resistance toner includes alpha-Naphthol 2wt%, 1,2,3-indantrione monohydrate 20wt%, the EDTA of dihydromyrcenol 40wt% and 10wt%
Disodium and the potassium chloride of surplus.
Method the most according to claim 3, it is characterised in that: described epoxy resin is novolac epoxy resin, bisphenol A-type ring
At least one in epoxy resins；Described firming agent is imidazole curing agent；Described reactive diluent be hydroxyethyl methylacrylate,
Glyceral methacrylate, isobornyl methacrylate, trimethylolpropane trimethacrylate, ethoxyquin trimethylolpropane
Triacrylate, the third oxidation trimethylolpropane trimethacrylate, pentaerythritol triacrylate, dipentaerythritol six acrylic acid
At least one in ester.
Method the most according to claim 4, it is characterised in that: described solvent is ethylene glycol, dipropylene glycol methyl ether, second
At least one in glycol ether acetate, 2-Butoxyethyl acetate, propylene glycol methyl ether acetate；Described light trigger is benzene
Acyloin and derivant, benzil class, alkylbenzene ketone, acyl group phosphorous oxides, benzophenone, thioxanthone apoplexy due to endogenous wind are at least
A kind of；Described inorganic filler is at least one in Pulvis Talci, bentonite.
Method the most according to claim 5, it is characterised in that: the optical radiation energy of described exposure is 600-700mj/cm2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610291973.4A CN106028668A (en) | 2016-05-05 | 2016-05-05 | Printed circuit board preparing method preventing discoloration of solder resist layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610291973.4A CN106028668A (en) | 2016-05-05 | 2016-05-05 | Printed circuit board preparing method preventing discoloration of solder resist layer |
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| CN106028668A true CN106028668A (en) | 2016-10-12 |
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|---|---|---|---|
| CN201610291973.4A Pending CN106028668A (en) | 2016-05-05 | 2016-05-05 | Printed circuit board preparing method preventing discoloration of solder resist layer |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0480988A (en) * | 1990-07-24 | 1992-03-13 | Cmk Corp | Manufacture of printed wiring board |
| WO2010035601A1 (en) * | 2008-09-29 | 2010-04-01 | ソニーケミカル＆インフォメーションデバイス株式会社 | Printed wiring board and method for manufacturing same |
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