201127900 六、發明說明： 【發明所屬之技術領域】 本發明係有關特定之樹脂組成物’更進 定樹脂組成物之防焊材。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder resist which is a resin composition of a specific resin composition.
I 【先前技術】 在印刷電路板上爲防止焊錫對不需之部 ，並同時具有作用爲防止電路基板之腐蝕之 會在其兩面上施以防焊材（solder resist) 方面一般爲使用感光性樹脂組成物。 但藉由使用感光性樹脂組成物之微影（ 步驟中的防焊材（s ο 1 d e r r e s i s t )形成方法 夠對應隨著近年來的電路基板之薄型化或微 給化之迴流焊接（solder reflow)溫度上昇 ，因感光防焊材所必要之感光性及顯影性使 料受限，難以得到可滿足耐熱性及機械特性 另外，使用熱硬化型防焊材時，會使用 進行開口部之形成（具體參考專利文獻1 ) 底部會產生膠渣（Smear )，所以所謂的去 渣作業爲必要的。具體上而言，一般在多層 絕緣層形成中的去膠渣處理係使用電漿的乾 性氧化劑溶液等的濕式法，從產能或生產成 法爲泛用。進而防焊材之開口部底部之膠澄 式法之去除來進行檢討，但因濕式法爲將基 一步含有該特 分的附著狀況 永久保護膜， 。以往防焊材 lithography ) ，產生無法足 細配線化、無 之問題。此爲 得可使用之材 的硬化物。 二氧化碳雷射 ，因在開口部 膠渣的去除膠 配線板等層間 式法及使用鹼 本之觀點濕式 也以同樣的濕 板整體進行處 -5- 201127900 理，適用於防焊材之狀態時’不僅開口部連同防焊材之表 面也會被進行處理，使得防焊材表面受到損傷。因此’之 後在進行開口部的鎳鍍敷等處理時，在鑛敷浴中會有防焊 材成分的溶出、污染鍍敷浴，使鍍敷之析出速度產生變化 ，因而產生必須提高頻率建立高價且毒性高的鍍敷浴的問 題。 另外，將熱硬化型防焊材與使用感光性樹脂組成物的 向來的感光防焊材相較之下，雖然具有高耐熱性或機械特 性，但摻爲使熱膨脹率降低較佳以摻合無機塡充材。但， 當調合無機塡充材時，防焊材與銅配線之密著性有降低之 傾向，再者，伴隨上述之去膠渣處理之鍍敷浴污染問題， 也使得無機塡充材的溶出變的顯著》 [先前技術文獻] [專利文獻] [專利文獻1 ]日本國特開2 0 0 0 - 2 4 4 1 2 5號公報 【發明內容】 [發明之槪要] [發明所欲解決的課題] 本發明欲解決之課題，係提供一兼具與銅配線之優異 密著性及高去膠渣耐性之適用於防焊材之樹脂組成物。 [解決課題之手段] -6- 201127900 本發明者們經由專心硏究討論之結 定之（A)環氧樹脂' (b)含有三畊 酚醛清漆型酚醛樹脂、及（C)咪唑衍 衍生物發現能解決上述之課題，遂而完 亦即，本發明如以下所述。 (1 ) 一種樹脂組成物，其特徵係 脂、（B)含有三畊構造之酚醛清漆型 )咪唑衍生物及/或環狀脒衍生物。 (2 )如（1 )記載之樹脂組成物， )無機塡充材。 (3 )如（1 )或（2 )記載之樹脂 (A )環氧樹脂，係1分子中具有2以 2〇 °C時爲液狀之環氧樹脂，及/或1分 環氧基，環氧當量爲250以下，溫度 芳香族系環氧樹脂。 (4 )如（1 )或（2 )記載之樹脂 (A )環氧樹脂，係1分子中具有2以 - 2 〇 °C時爲液狀之環氧樹脂，及1分子中 -基，環氧當量爲250以下，溫度20 °C 族系環氧樹脂，其摻合質量比係20 : 1· (5 ) —種防焊材，其特徵係將由 〜記載之樹脂組成物所成之樹脂組成物 上。 (6 )如上述（5 )記載之防焊材， 果，藉由使含有特 (triazine )構造之 生物及/或環狀脒 成本發明。 含有（A )環氧樹 酚醛樹脂、及（C 其中，更含有（D 組成物，其中含有 上之環氧基，溫度 子中具有3以上之 2〇°C時爲固體狀之 組成物，其中含有 上之環氣基，溫度 具有3以上之環氧 時爲固體狀之芳香 ~ 1 ： 10° (1 )〜（4 )中任 層形成在支撐薄膜 其中，硬化後的樹 201127900 脂組成物層後之硬化層對於銅箔之剝離強度係以 0.50kgf/cm以上、5.00kgf/cm以下密著’且經由鹼性過錳 酸溶液處理形成表面粗糙度（Ra値）係以1 〇〇nm以上、 3 00nm以下之粗化面。 [發明的效果] 經由含有特定之（A)環氧樹脂、（B)含有三哄構 造之酚醛清漆型酚醛樹脂、及（C)咪唑衍生物及/或環 狀脒衍生物，可提供一兼具與銅配線之優異密著性及高去 膠渣耐性之適用於防焊材之樹脂組成物。 [實施發明的最佳型態] 以下爲按照本發明之其最佳之實施型態予以詳細說明 〇 本發明之樹脂組成物之特徵爲含有（A)環氧樹脂、 (B)含有三哄構造之酚醛清漆型酚醛樹脂、及（C)咪 唑衍生物及/或環狀脒衍生物。 [(A )環氧樹脂] 本發明之樹脂組成物所使用的環氧樹脂並無特別限定 ，可舉例如「1分子中具有2以上之環氧基、溫度20°C時 爲液狀之環氧樹脂」（以下稱爲第1環氧樹脂）、「1分 子中具有3以上之環氧基、環氧當量爲250以下、溫度 2〇°C時爲固體狀之芳香族系環氧樹脂」（以下稱爲第2環 201127900 氧樹脂）。此處之所謂的「液狀」意味著液體之狀態，「 固體狀」意味著固體之狀態’所謂的「芳香族系環氧樹月旨 」爲意味其分子內具有芳香環骨架之環氧樹脂。又，1分 子中的環氧基數爲平均數。 第1環氧樹脂方面’具體可舉例如雙酣A型環氧樹 脂、雙酚F型環氧樹脂、苯酚酚醛清漆型（phen〇1 Novolac type)環氧樹脂、萘型環氧樹脂、縮水甘油胺型 環氧樹脂、添加氫型環氧樹脂等。可單獨使用此等之任1 種或2種以上倂用。又’以製成乾性薄膜狀況之操作性及 進行層合（laminate )時良好的流動性觀點而言，環氧當 量以250以下爲宜、較宜爲220以下、更宜爲2〇〇以下、 更更宜爲180以下。另外’以柔軟性之觀點而言，環氧當 量之下限以50以上爲宜、較宜爲80以上、更宜爲12〇以 上、更更宜爲150以上。該第1環氧樹脂可使用市售品， 具體可舉例如曰本環氧樹脂（股）製「耶皮樞特（音譯） 825」（雙酚A型環氧樹脂，1分子中的環氧基數：2、環 氧當量：I75)、日本環氧樹脂（股）製「耶皮樞特8〇7 」（雙酚F型環氧樹脂’1分子中的環氧基數：2、環氧 當量：169)、日本環氧樹脂（股）製「耶皮樞特ι52」 (苯酚酚醛清漆型環氧樹脂，1分子中的環氧基數：2以 上、環氧當量：175) 、DIC (股）製「EpiCL〇N HP_4〇32 」（萘型環氧樹脂’1分子中的環氧基數：2、環氧當量 :150)、日本環氧樹脂（股）製「耶皮樞特6〇4」（縮 水甘油胺型環氧樹脂’ 1分子中的環氧基數：3、環氧當 201127900 量.120)、日本環氧樹脂（股）製「耶皮樞特YX8〇〇〇j (添加氫型環氧樹脂’ 1分子中的環氧基數：2、環氧當 量：205 )。 作爲樹脂組成物之硬化物的適當物性方面，例如有耐 熱性、低膨脹率等’由此等物性之觀點而言，該環氧樹脂 以使用芳香族系環氧樹脂爲宜。因而本發明中的第1環氧 樹脂以芳香族系環氧樹脂爲宜。又，第1環氧樹脂亦可爲 溫度在未達2(TC時爲液狀者。 另外，作爲第2環氧樹脂方面，具體可舉例如苯酚酚 醛清漆型環氧樹脂、酚酚醛型環氧（Phenol No volac type epoxy)樹脂、萘型環氧樹脂、苯酚類與具有苯酚性羥基 之芳香族醛之縮合物的環氧化物（三苯基甲烷型環氧樹脂 )等。可單獨使用此等之任1種或2種以上倂用。該第2 環氧樹脂可使用市售品，具體可舉例如DIC (股）製「N-740」（苯酚酚醛清漆型環氧樹脂，1分子中的環氧基數 :3以上 '環氧當量：180) 、DIC (股）製「N-6 90」（ 甲酚酚醛清漆型環氧樹脂，1分子中的環氧基數：3以上 、環氧當量：220) 、DIC (股）製「EXA4700」（4官能 萘型環氧樹脂，1分子中的環氧基數：4、環氧當量：162 )、日本化藥（股）製「EPPN-502H」（三苯酚環氧樹脂 ，1分子中的環氧基數：3以上、環氧當量：168)等。 該第2環氧樹脂之中，以密著性、耐藥品性之觀點而 言，環氧當量的上限値以22〇以下爲宜、較宜爲200以下 、更宜爲180以下。另外，以柔軟性之觀點而言，環氧當 -10- 201127900 量的下限値宜爲50以上、較宜爲80以上、更宜爲120以 上、更更宜爲150以上。 另外，即使具有環氧當量爲25 0以下之芳香族系環氧 樹脂，但若爲1分子中的環氧基數不滿3之環氧樹脂時， 難以得到硬化物之耐熱性或耐藥品性。 特別是將本發明之樹脂組成物製成樹脂組成物薄片時 ，環氧樹脂宜爲含有第1環氧樹脂與第2環氧樹脂之雙方 。另外，亦可含有此2種類之環氧樹脂以外的其他環氧樹 脂。 第1環氧樹脂，主要係當樹脂組成物薄片在進行層合 時’擔任使其顯示良好流動性的角色；第2環氧樹脂，主 要係在樹脂組成物薄片之熱硬化後，擔任使其硬化物性提 升之角色。 本發明之樹脂組成物中’相對於樹脂組成物中的整體 不揮發分之（A)環氧樹脂之含有比率之上限以6〇質量 %以下爲宜、較宜爲45質量％以下。另外，相對於樹脂 組成物中的整體不揮發分之（A)環氧樹脂之含有比率之 下限以5質量％以上爲宜、較宜爲15質量％以上。 倂用第1環氧樹脂與第2環氧樹脂之情況時，相對於 樹脂組成物中之整體不揮發分第！環氧樹脂之含有比率之 上限以30質頁％以下爲宜、較宜爲2〇質量％以下。此爲 在操作樹脂組成物薄片之20〜3(TC左右的常溫下，使樹 月旨組成物薄片容易具有沾黏（tack)、及維持樹脂組成物 薄片之操作性之觀點爲出發點。另外，相對於樹脂組成物 -11 - 201127900 中之整體不揮發分第1環氧樹脂之含有比率之下限以5質 量％以上爲宜、較宜爲10質量％以上。此爲基於在操作 樹脂組成物薄片之20〜30°C左右的常溫下，以獲得樹脂 組成物薄片之足夠之可撓性且維持樹脂組成物薄片之操作 性之觀點、對電路基板進行樹脂組成物薄片之層合之際， 以獲得僅使其塡充於導通孔（via hole)或通孔（through hole )內之足夠的流動性之觀點、爲防止對電路基板進行 樹脂組成物薄片之層合之際，來自電路基板之應藉由樹脂 組成物所被覆之領域之大量樹脂組成物之滲出，而造成製 品不良、污染機械之觀點等。 相對於樹脂組成物中之整體不揮發分之第2環氧樹脂 的含有比率之上限以15質量％以下爲宜、較宜爲10質量 %以下。此爲基於在操作樹脂組成物薄片之20〜3 0 °C左 右的常溫下，獲得樹脂組成物薄片之足夠之可撓性且維持 樹脂組成物薄片之操作性之觀點、對電路基板進行樹脂組 成物薄片之層合之際，獲得僅使其塡充於導通孔（via hole)或通孔（through hole)內之足夠的流動性觀點等 。另外，以樹脂組成物薄片之形態使用之際，爲使硬化物 反映第2環氧樹脂之特性，使發揮耐熱性或耐藥品性之觀 點而言，相對於樹脂組成物之整體不揮發分之第2環氧樹 脂的含有比率之下限以〇.〇1質量％以上爲宜、較宜爲1 質量％以上。 第1環氧樹脂與第2環氧樹脂之摻合比係以質量比（ 第1環氧樹脂：第2環氧樹脂）爲20: 1至1: 10爲宜、 -12- 201127900 較宜爲1 0 : 1至1 ·· 2。摻合比在該範圍內時，經由倂用 第1環氧樹脂與第2環氧樹脂，使其發揮更顯著的效果。 [(Β )含有三哄構造之酚醛清漆型酚醛樹脂] 含有三哄構造之酚醛清漆型酚醛樹脂，係作用爲環氧 樹脂之硬化劑。含有三哄構造之酚醛清漆型酚醛樹脂，爲 使三畊類與苯酚類與醛類反應所得到的縮合物組成物。三 哄類、苯酚類及醛類皆無特別的限定；作爲三畊類方面， 以選自三聚氰胺、苯并胍胺及甲基胍胺等之1種或2種以 上者爲宜。又，作爲苯酚類方面，以選自苯酚、或甲酚、 乙苯酚、η-丙苯酚、異丁苯酚、t-丁苯酚、辛基苯酚、壬 基苯酚、茬酚、甲基丁苯酚、二-t-丁苯酚等之烷基苯酚的 各種〇-，m-’ P -異構物、或乙烯苯酚、烯丙基苯酚、丙烯 基苯酚、乙炔基苯酚的各種〇-，m-，p-異構物、或環戊基 苯酚、環己基苯酚、環己基甲酚等的環烷基苯酚、或苯基 苯酚等之取代苯酚類之1種或2種以上者爲宜。另外，醛 類方面以福馬林及/或多聚甲醛（paraformaldehyde )爲 宜。 含有三哄構造之酚醛清漆型酚醛樹脂之氮原子含有率 (相對於全原子數之氮原子數之比率）的上限，以合成時 溶劑溶解性的觀點而言，宜爲2 5 %以下、較宜爲1 4 %以 下。另外’含有三畊構造之酚醛清漆型酚醛樹脂之氮原子 含有率（相對於全原子數之氮原子數之比率）的下限，以 維持銅配線密著性之觀點而言，宜爲4 %以上、更宜爲8 -13- 201127900 %以上。 在三哄類與苯酚類與醛類之反應中，觸媒之使用及種 類並無特別限定，即使在無觸媒下反應仍會進行。在防焊 材方面，不宜有以殘留觸媒形式之金屬等無機物之殘留。 因而，使用觸媒之際，宜爲使用三甲胺、三乙胺、二乙胺 、苯胺等之胺系觸媒。 在本發明使用的含有三哄構造之酚醛清漆型酚醛樹脂 可使用市售品。具體可舉例如DIC (股）製「PHENOLITE LA-7052」（氮原子含有率 8%) 、 「PHENOLITE LA- 7751」 （ 氮原子 含有率 14%) 等。 本發明中，（B)含有三畊構造之酚醛清漆型酚醛樹 脂，使存在於樹脂組成物中環氧基之合計數與該酚醛樹脂 之苯酚性羥基之合計數比（環氧基之合計數：苯酚性羥基 之合計數）以成爲1 : 0·5至1.5進行摻合。如果酚醛樹 脂之摻合比率在此範圍外時，恐會造成樹脂組成物硬化物 之耐熱性不足之虞。 [(C)咪唑衍生物及/或環狀脒衍生物] 本發明中之咪唑衍生物及/或環狀脒衍生物，係作用 爲硬化促進劑。所謂的咪唑衍生物，即「含有咪唑基，對 環氧樹脂爲具有硬化促進作用之化合物」者。亦即只要具 有硬化促進作用則無任何限制，具體可舉例如，咪唑（「 1，3-二吖-2,4-環戊二烯」）：2-甲基咪唑、2_乙基咪哩、 2-十七咪唑、2-十一咪唑、2-苯基咪唑等的2-取代咪唑衍 -14- 201127900 生物：1-氰乙基-2 -甲基咪唑、1-氰乙基-2-H——咪唑、1-氰乙基-2-乙基-4-甲基咪唑、1-氰乙基-2-苯基咪唑等的含 有氰基咪唑衍生物；2,4-二胺基-6-[2’-甲基咪唑基-(Γ ) ]-乙基-8-三哄、2,4-二胺基-6-(2’-十一咪唑基）-乙基-3-三哄、2,4-二胺基-6-〔 2’-乙基-4’ -甲基咪唑基·（ 1’）〕-乙基-s -三畊等的含有三哄之咪唑衍生物；2 -苯基咪唑之異 三聚氰酸加成物、2-乙基咪唑之異三聚氰酸加成物、2,4· 二胺-6-〔2’-甲基咪唑基-(1’）〕-乙基-3-三哄之異三聚 氰酸加成物等的異三聚氰加成物咪唑衍生物、2-苯基-4,5-二羥乙基咪唑、2 -苯基甲基_5_羥基二甲基咪唑等的 4,5 -取代咪唑衍生物；2,3 _羥基-1 Η -吡咯〔1，2 - a〕苄咪唑 ;環氧合成咪唑等。 咪唑衍生物可單獨1種使用，亦可併用2種以上使用 。此等化合物當中，以銅配線密著性與樹脂組成物之保存 安定性之折衷觀點而言，宜爲4,5-取代咪唑衍生物、環氧 合成咪唑。 所謂的環狀脒衍生物爲「含有環狀的脒骨架，並具有 硬化促進作用之化合物」。亦即只要具有硬化促進作用則 無特別的限制，具體可舉例如二吖雙環十一碳烯（D B U ) 及其衍生物，以及此等之鹽、或二吖雙環壬烯（D B N )及 其衍生物’以及此等之鹽等。此處所謂的「衍生物」係意 味著形成環狀脒骨架中之亞胺鍵結之氮原子被取代基鍵結 之化合物，作爲取代基方面，可舉例如苄基等。此外，所 謂的「鹽」’具體上爲苯酚鹽、羧酸鹽、辛酸鹽、p -甲苯 -15- 201127900 磺酸酸鹽、甲酸鹽、鄰苯二甲酸鹽、苯酚酚醛清漆樹脂鹽 、四苯硼酸鹽等。 該環狀脒衍生物之中，就銅配線密著性與樹脂組成物 的保存安定性之點而言，以DBU或其衍生物、或者是此 等之鹽爲宜、特宜爲DBU鹽、DBU衍生物之鹽。具體可 舉例如DBU-苯酚鹽（具體爲San-Apro (股）製「U-CAT SA1」等）、DBU·辛酸鹽（具體爲 San-Apro (股）製、 「U-CAT SA102」等）、DBU-p-甲苯磺酸酸鹽（具體爲 San-Apro (股）製、「U-CAT SA5 06」等）、DBU-甲酸鹽 (具體爲 San-Apro (股）製、「U-CAT SA603」等）、 DBU-鄰苯二甲鹽（具體爲 San-Apro (股）製、「U-CAT SA810」等）、DBU-苯酚酚醛清漆樹脂鹽（具體爲San-Apro (股） 製、 「U-CAT SA841」等）、DBU衍生物之鹽 (具體爲San-Apro (股）製、「U-CAT 5002」等）等。 本發明中的環狀脒衍生物，可單獨1種使用或倂用2 種以上使用。 在本發明中，當倂用咪唑衍生物與環狀脒衍生物之情 況時，可各自以1種之化合物所構成者，或以2種以上之 化合物所構成者。 本發明中的咪唑衍生物及環狀脒衍生物，以在溶劑中 爲可溶解之物作爲溶解物爲宜。作爲溶劑之具體可舉例如 丙酮、甲基乙基酮、環己酮等的酮類、乙酸乙酯、乙酸丙 醋、乙酸2 -乙氧乙酯（Cellosolve acetate)、丙二醇甲醜 醋酸醋(Propylene Glycol Monomethyl Ether Acetate)、 -16 - 201127900 乙酸卡必醇（Carbitol acetate)等的醋酸醋類、2·乙氧乙 醋（Cellosolve) 、丁 卡必醇（butyl carbitol)等的卡必 醇類、甲苯、二甲苯等的芳香族炭化水素類、二甲基甲醯 胺、二甲基乙醯胺、N-甲基吡咯啶酮等。可倂用此等1種 或2種以上之組合使用。 另外，在溶劑中不會溶解、對溶劑之溶解性極低之物 質，宜爲使其原樣地分散在樹脂組成物中。將摻合粉末狀 咪唑衍生物及/或環狀脒衍生物爲目的之樹脂組成物作爲 防焊材使用時，以提高精細圖型之導體層的絕緣信賴性之 觀點而言，1次粒子的平均粒徑之上限宜爲2 0 /z m以下、 較宜爲ΙΟμιη以下、更宜爲5am以下。另外，以防止二 次凝聚集之觀點而言，1次粒子的平均粒徑之下限宜爲 0.0 1 V m以上。此處所謂的平均粒徑，係基於米氏（M i e )散射理論，可藉由雷射光之折射·散射法測定者。具體 上爲經由雷射折射式粒度分佈測定裝置，將測定對象之化 合物的粒度分佈作成體積基準，並以其中數粒徑（median d i a m e t e r )定爲平均粒徑進行測定。測定試樣宜爲使用以 超音波，將測定對象之化合物使其在水中分散者。雷射折 射式粒度分佈測定裝置方面，使用（股）堀場製作所製 LA-500 等。 本發明之樹脂組成物以藉由含有（C )咪唑衍生物及 /或環狀脒衍生物，促使含有三哄構造之酚醛清漆型酚醛 樹脂的環氧樹脂之硬化反應，以改善硬化物之去膠渣耐性 ’可使硬化物即使在去膠渣後仍保有美麗、具高級感的外 -17- 201127900 觀。另外，大幅提升硬化物之對銅配線之密著性。 本發明中，相對於樹脂組成物中整體不揮發分之（C )咪唑衍生物及/或環狀脒衍生物之含有比率之上限，以 保存安定性及不使在乾燥步驟中產生過度的硬化之觀點而 言，以5質量％以下爲宜、更宜爲3質量％以下。另外， 含有比率之下限，以銅箔密著性、耐藥品性等之觀點而言 ，以0.01質量％以上爲宜、更宜爲0.1質量％以上。 本發明之樹脂組成物，如同後述所述，特別適宜以可 作爲防焊材之使用，使用含有本發明之（A )成分、（B )成分及（C )成分的樹脂組成物之防焊材，兼具有所謂 的與銅配線之優異密著性與高去膠渣耐性的性質。 使用含有本發明之（A)成分、（B)成分、（C)成 分的樹脂組成物的防焊材，其對於銅配線的優異密著性， 可藉由如後述的〔銅配線密著性測定〕所記載的測定方法 予以測定，由銅箔剝離強度可進行掌握。使用本發明之樹 脂組成物的防焊材之銅配線密著性（銅箔剝離強度）之上 限値’以所謂實用的觀點而言，以5.00kgf/cm以下爲宜 、較宜爲2.00kgf/cm以下、更宜爲以下、更 更宜爲〇.95kgf/cm以下、又更更宜爲〇 9〇kgf/cm以下者 。另外’使用本發明之樹脂組成物的防焊材之銅配線密著 性（銅箔剝離強度）之下限値，以所謂密著性越高越好之 觀點而言，以0.50kgf/cm以上爲宜、較宜爲〇 55kgf/cm 以上、更宜爲0.60kgf/cm以上、更更宜爲〇 65kgf/cm以 上、又更更宜爲0.70kgf/cm以上、特宜爲0 75kgf/cm以 -18· 201127900 上、極宜爲0.80kgf/cm以上者。 使用含有本發明之（A)成分、（B)成分、（c)成 分的樹脂組成物的防焊材的去膠渣耐性，可藉由如後述的 〔去膠渣耐性測定〕所記載的評估方法（鹼性過錳酸溶液 處理後之表面粗糙度（Ra値））予以掌握。使用本發明 的樹脂組成物的防焊材之去膠渣耐性（表面粗糙度（Ra 値））的上限値，以防止對鍍敷浴中防焊材成分的溶出觀 點而言，以500nm以下爲宜、較宜爲400nm以下、更宜 爲 3 50nm以下、更更宜爲 300nm以下、又更更宜爲 2 8 Onm以下者。另外，使用本發明的樹脂組成物的防焊材 之去膠渣耐性（表面粗糙度（Ra値））的下限値，以所 謂實用的觀點而言，以50nm以上爲宜、較宜爲1 〇0nm以 上、更宜爲150nm以上、更更宜爲200nm以上者。 [(D )無機塡充材] 在本發明之樹脂組成物中，可摻合無機塡充材用以降 低樹脂組成物之熱膨脹率。無機塡充材方面，可使用舉例 如矽、氧化鋁、硫酸鋇、滑石、黏土、雲母粉、氫氧化鋁 、氫氧化鎂、碳酸鈣、碳酸鎂、氧化鎂、氮化硼、硼酸鋁 、鈦酸鋇、鈦酸緦、鈦酸鈣、鈦酸鎂、鈦酸鉍、氧化鈦、 鉻酸鋇、锆酸鈣等。之中以矽爲宜。 使用無機塡充材時，以提高所謂精細圖型之導體層的 絕緣信賴性之觀點而言，1次粒子的平均粒徑之上限宜爲 20ym以下、較宜爲lOym以下' 更宜爲5#m以下。另 -19- 201127900 外，以防止二次凝聚之觀點而言，1次粒子的平均粒徑之 下限宜爲以上。另外，爲提高無機塡充材的耐濕 性，具有以矽烷偶合劑等之表面處理劑施以表面處理過者 爲宜。無機塡充材之平均粒徑爲基於米氏（Mie)散射理 論，可經由雷射折射•散射法予以測定。 相對於樹脂組成物中之整體不揮發分，無機塡充材之 含有比率的上限，以進行層合時之熔融性或與銅配線之密 著性之觀點而言，宜爲85質量％以下、較宜爲60質量％ 以下。另外，相對於樹脂組成物中之整體不揮發分，無機 塡充材之含有比率的下限，以熱膨脹率之觀點而言，宜爲 30質量％以上、較宜爲35質量％以上。 此外，本發明之樹脂組成物的硬化物，熱膨脹率以在 3 0°C〜150°C範圍內爲80χ1(Γ6/Κ以下者爲宜、較佳爲60x 1(Γ6/Κ以下。此處所謂的熱膨脹率，係指藉由使溫度產生 變化同時加以拉伸之非振動性荷重，以其物質之變形作爲 溫度之函數所測定之値，可使用SIINanoTechnology股份 有限公司製「EXSTAR TMA/SS6000」等進行測定。 本發明之樹脂組成物以賦予熱硬化後之防焊材適度的 可撓性等爲目的，亦可摻合「（E)高分子化合物」。作 爲該高分子化合物而言，具體可舉例如苯氧基樹脂、聚乙 烯醇縮醛（polyvinylacetal )樹脂、聚醯亞胺、聚醯胺醯 亞胺、聚醚颯、聚珮、脂肪族聚酯系多元醇、聚醚多元醇 、聚碳酸酯系多元醇、聚對苯二甲酸乙二酯多元醇、丙烯 酸樹脂等。可單獨使用此等之任1種或倂用2種以上使用 -20- 201127900 作爲苯氧基樹脂之具體例，可舉例如東都化成（股） 製 FX28 0、FX293、日本環氧樹脂（股）製 YX8100 ' YL69 54 > YL69 74、YL74 82、YL7 5 5 3、YL6794、YL72 1 3 、YL7290 等。 聚乙烯醇縮醛樹脂方面，則以聚乙烯丁醛樹脂爲宜， 聚乙烯醇縮醛樹脂之具體例可舉例如電氣化學工業（股） 製、DENKA BUTYRAL4000-2、5000-A、6000-C、6000-E P、積水化學工業（股）製S - L E C B Η系列、B X系列、 K S系歹IJ、B L系歹IJ、Β Μ系列等。 作爲聚醯亞胺之具體例方面，可舉例如新日本理化（ 股）製的聚醯亞胺「RIKACOAT SN20」及「RIKACOAT ΡΝ2 0」。另外，將2官能性羥基末端聚丁二烯、二異氰 酸酯化合物與四元酸酐（tetrabasic acid anhydride)反應 所得的線狀聚醯亞胺（日本國特開2006-37083號公報記 載內容）、含有聚矽氧烷骨架之聚醯亞胺（日本國特開 2002-12667號公報、日本國特開2000-319386號公報等記 載內容）等之改性聚醯亞胺。 作爲聚醯胺醯亞胺之具體例，可舉例如東洋紡績（股 )製的聚醯胺醯亞胺「VYLOMAXHR1 1NN」及「 VYLOMAXHR16NN」。另外，日立化成工業（股）製的 含有聚矽氧烷骨架的聚醯胺醯亞胺「KS9100」、「 KS 9 3 00」等的改性聚醯胺醯亞胺。 聚醚颯之具體例方面，可舉例如住友化學（股）製的 -21 · 201127900 聚醚颯「PES 5 003 P」等。 聚颯之具體例方面，可舉例如 Solvay Advanced Polymers (股）製的聚颯「P 1 700」、「P3 5 00」等。 該高分子化合物宜爲，以樹脂組成物之整體不揮發成 分爲100質量％時，以低於30質量％之比例摻合。若爲 30質量％或超過此値時，樹脂組成物的黏度會變得過高 ，對於電路上之配線圖型之埋入有變困難之傾向。而且， 若摻合量過少的話，因無法充分得到藉由摻合高分子化合 物所達到的效果，所以摻合量之下限宜爲1質量％以上。 本發明之樹脂組成物中，除了上述成分之外，在不阻 礙本發明之效果的範圍內，亦可摻合添加劑、有機塡充材 、上述以外之硬化促進劑等其他成分。 添加劑方面並無特別限制，具體可舉例如有機磷系阻 燃劑、有機系含有氮磷化合物、氮化合物、聚矽氧烷系阻 燃劑、金屬氫氧化物等的阻燃劑：聚矽氧烷粉末、尼龍粉 末、氟素粉末等的塡充劑；有機膨土（ organic benton ) 、膨土（ benton )等的增黏劑；聚矽氧烷系、氟系、高分 子系的消泡劑或調平劑；咪唑系、噻唑系、三唑系、矽烷 系偶合劑劑等的密著性賦予劑；酞花青•藍、酞花青.綠 、碘綠（iodine green)、雙偶氮黃、碳黑等的顏料等。 作爲有機塡充材，可舉例如丙烯酸橡膠粒子、聚醯胺 微粒子、聚矽氧烷粒子等。丙烯酸橡膠粒子之具體例方面 ’將丙烯腈-丁二烯橡膠、丁二烯橡膠、丙烯酸橡膠等顯 示有橡膠彈性之樹脂施以化學交聯處理，只要是具有對有 -22- 201127900 機溶劑不溶且不融之樹脂的微粒子體即可，具體上可舉例 如XER-91(日本合成橡膠（股）製）、使塔菲蘿伊多（ 音譯）AC3355、AC3816、AC3832、AC4030、AC3364、 IM101 (以上爲G AN Z CHEMICAL (股）製）、啪啦蘿依 多EXL265 5、EXL2602 (以上爲吳羽化學工業（股）製） 等。作爲聚醯胺微粒子之具體例，如尼龍等的脂肪族聚醯 胺或如刻維拉（Kevlar Fiber )等的芳香族聚醯胺，甚至 只要是具有50/zm以下微粒子之聚醯胺醯亞胺等具有醯 胺鍵結的樹脂即可，具體上爲 VESTOSINT 2070 ( DAICEL . HUELS (股）製）、或 S P 5 0 0 ( Τ Ο R A Y (股） 製）等。 有機塡充材之1次粒子的平均粒徑也以20/zm以下 爲宜，較宜爲10/zni以下' 特宜爲5"m以下者。若平均 粒徑超過20 μ m時，當底基銅配線成爲精細圖型的情況 下，恐有無法維持絕緣信賴性之虞。尙有，若有機塡充材 的平均粒徑過小的話，因有產生二次凝聚之傾向，平均粒 徑以0.0 1 // m以上爲宜。此外，有機塡充材之平均粒徑亦 與前述之無機塡充材進行同樣的測定。 本發明之樹脂組成物中，以更進一步地改善銅配線密 著性或調整保存安定性與硬化促進效果之平衡之觀點而言 ’亦可進一步摻合咪唑衍生物及環狀脒衍生物以外之硬化 促進劑。作爲此等硬化促進劑方面，除了三級胺類、胍類 或此等之環氧加成物或微膠囊化者之外，還可以使用三苯 膦、四苯膦•四苯硼酸等之有機膦系化合物等，此等周知 -23- 201127900 慣用化合物可單獨使用或合倂2種以上組合使用。並且， 此等硬化促進劑，以相對於樹脂組成物中之整體不揮發分 之含有比例以0.01〜5質量％範圍內使用。 本發明之樹脂組成物可使用在各種之用途上，特別是 以防焊材用爲宜，尤其又更宜爲以油墨型防焊材或乾式薄 膜型防焊材之用。亦即，可經由本發明之樹脂組成物之清 漆對電路基板上之塗佈、乾燥來形成防焊材；或可藉由在 支撐體上形成本發明之樹脂組成物層、製作成樹脂組成物 薄片，並將該樹脂組成物薄片壓著、層合到電路基板上形 成防焊材。工業上以乾式薄膜型防焊材，亦即製成樹脂組 成物薄片後使用者爲宜。 樹脂組成物薄片之製造方法並無限制，以周知之製造 方法予以製造即可。具體可爲將樹脂組成物溶解於有機溶 劑中調製成樹脂清漆，以支撐薄膜作爲支撐體，將樹脂清 漆塗佈，更進一步加熱，或藉由吹以熱風等使有機溶劑乾 燥，形成樹脂組成物層。 有機溶劑方面，具體上可舉例如丙酮、甲基乙基酮、 環己酮等的酮類、乙酸乙酯、乙酸丙酯、乙酸2-乙氧乙 酯、丙二醇甲醚醋酸酯、乙酸乙基二甘醇酯等的酢酸酯類 、2-乙氧乙酯、丁卡必醇等的卡必醇類、甲苯、二甲苯等 的芳香族炭化水素類、二甲基甲醯胺、二甲基乙醯胺、N-甲基吡咯啶酮等。有機溶劑亦可以2種以上之組合使用。 乾燥條件並無特別限定，以對於樹脂組成物層之有機 溶劑的含有比例爲1 0質量％以下，宜爲使其乾燥到5質 -24- 201127900 量％以下。所形成的樹脂組成物層之溶融黏度曲線 會依後述之乾燥條件而受到影響，較佳爲所設定之 件能滿足前述之溶融黏度特性。亦會隨著清漆中之 劑量而不同，具體上含有30〜60質量％之有機溶 漆，在50〜150 °C下3〜10分鐘左右可使其乾燥。 技術領域中者，經由簡單之實驗，可設定出適宜、 乾燥條件。 樹脂組成物層之厚度並無特別的限制，宜爲大 基板具有之導體層之厚度。電路基板具有之導體層 通常在5〜7〇 μ m之範圍，樹脂組成物層之厚度以: 〜100#m之厚度爲宜。 另外，樹脂組成物薄片中的樹脂組成物層，亦 述之保護薄膜予以保護。藉由保護薄膜之保護，可 物等對樹脂組成物層表面之附著或損傷。 在本發明中作爲支撐薄膜及保護薄膜方面，可 聚乙烯、聚丙烯、聚氯乙烯等之聚烯烴、聚對苯二 二酯（以下簡稱「PET」）、聚2,6萘二甲酸乙 polyethylene naphthalate)等之聚酯、聚碳酸酯、 胺等之塑膠薄膜等。另外，支撐薄膜及保護薄膜可 以消光處理、電暈處理、脫模處理等。 支撐薄膜之厚度並無特別限定，以10〜150" 、較宜爲以25〜50/zm之範圍使用。又，保護薄 度以1〜40 // m爲宜。而且，如後述所述，在樹脂 薄片之製造步驟中作用爲支撐體使用的支撐薄膜， ，雖然 乾燥條 有機溶 劑之清 該所屬 最佳之 於電路 之厚度 具有10 可以後 防止異 舉例如 甲酸乙 二酯（ 聚酿亞 適當施 m爲宜 膜之厚 組成物 在對電 -25- 201127900 路基板之樹脂組成物層的層合作業、層合後之 層之加熱硬化處理中，可作爲保護樹脂組成物 護薄膜使用。 樹脂組成物薄片中的支撐薄膜，係在對電 樹脂組成物層後、或層合後之樹脂組成物層經 成硬化層後予以剝離。若爲於樹脂組成物層加 將支撐薄膜剝離的話，可防止硬化步驟中的異 ，另外，可提高硬化層表面之平滑性。若爲加 進行剝離之狀況，以事先對支撐薄膜施以脫模 。且，支撐薄膜上所形成的樹脂組成物層，形 成物層之面積較支撐薄膜面積小者爲佳。此外 物薄片可捲曲成卷筒狀，予以保存、儲蔵。 將樹脂組成物薄片層合到電路基板形成防 ，可根據以往的乾式薄膜型防焊材之方法進行 樹脂組成物層有以保護薄膜保護之狀況時，將 以樹脂組成物層直接接觸到電路基板之方式， 物薄片層合到電路基板之單面或雙面。經由真 ，於減壓下加熱及加壓，使層合到電路基板之 的使用方法。層合之方法可以批次式、或以軋 進行。另外，於進行層合前，視情況所需，可 物薄片及電路基板加以預熱放著。 真空層合可使用市售之真空層合機。市售 機方面，具體可舉例如Nichigo-Morton (股） Applicator、（股）名機製作所製真空加壓式 樹脂組成物 層表面的保 路基板層合 加熱硬化形 熱硬化後才 物等的附著 熱硬化後才 處理者爲佳 成以樹脂組 ，樹脂組成 焊材之作業 。首先，若 此剝離後， 將樹脂組成 空層合法之 方法爲最佳 輥之連續式 將樹脂組成 的真空層合 製 V acuum 層合機、（ -26- 201127900 股）Hitachi Plant Technologies 製乳輕式 Drycoater 、 Hitachi AIC (股）製真空層合機等。 層合之條件，壓著溫度（層合溫度）以70〜l4〇°C爲 宜，壓著壓力以 1 〜llkgf/cm2(9.8xl〇4〜107.9xl04N/m2 )爲宜，空氣壓以在20mmHg(26.7hPa)以下之減壓下進 行層合爲宜。 層合步驟後，宜爲使用金屬板進行熱壓製，使層合之 樹脂組成物薄片予以平坦化。該平坦化步驟，於常壓下， 藉由加熱後的SUS鏡面板等之金屬板，加熱及加壓接着 薄片來進行。加熱及加壓條件可使用與上述層合步驟同樣 的條件。 由本發明之樹脂組成物所設置有防焊材的電路基板， 主要係形成在環氧玻璃、金屬基板、聚酯基板、聚醯亞胺 基板、BT樹脂基板、熱硬化型聚苯醚（I [Prior Art] In order to prevent the solder from being unnecessary on the printed circuit board, and at the same time, it is effective to prevent the corrosion of the circuit substrate, and the solder resist is applied to both sides thereof. Resin composition. However, by using the lithography of the photosensitive resin composition (the solder resist material forming method in the step is sufficient to correspond to the reflow soldering (solder reflow) of the circuit board in recent years due to thinning or micro-feeding of the circuit board. When the temperature rises, the photosensitivity and developability required for the photosensitive solder resist are limited, and it is difficult to obtain heat resistance and mechanical properties. When a thermosetting solder resist is used, the opening portion is formed (specifically Reference Patent Document 1) Smear is generated at the bottom, so a so-called slag removing operation is necessary. Specifically, the desmear treatment in the formation of a plurality of insulating layers is generally a dry oxidizing agent solution using plasma. The wet method is a general use from the production capacity or the production method. In addition, the removal of the glue-based method at the bottom of the opening of the welding material is reviewed, but the wet method is to include the adhesion of the special component in one step. Permanent protective film, lithography of conventional soldering materials, can not be neatly wired, no problem. This is a hardened material for the materials that can be used. The carbon dioxide laser is applied to the same wet board due to the interlayer method such as the removal of the adhesive slag in the opening part and the use of the alkali. The application is applied to the state of the welding material. 'Not only the opening but also the surface of the solder resist will be treated, so that the surface of the solder resist is damaged. Therefore, when processing such as nickel plating in the opening is performed, the deposition of the solder resist component and the contamination of the plating bath are caused in the mineral bath, and the deposition rate of the plating is changed, so that it is necessary to increase the frequency to establish a high price. And the problem of a highly toxic plating bath. Further, in comparison with the conventional photosensitive solder resist using the photosensitive resin composition, the thermosetting type solder resist has high heat resistance or mechanical properties, but is preferably blended to lower the coefficient of thermal expansion to blend inorganic Filling the material. However, when the inorganic ruthenium filler is blended, the adhesion between the solder resist and the copper wiring tends to be lowered, and further, the problem of the plating bath contamination accompanying the above-described desmear treatment also causes the dissolution of the inorganic ruthenium filler. [Previousness of the Invention] [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open No. 2 0 0 - 2 4 4 1 2 5 [Invention] [Inventive Summary] [Invented to solve Problem to be Solved by the Invention It is an object of the present invention to provide a resin composition suitable for a solder resist material which has excellent adhesion to copper wiring and high desmear resistance. [Means for Solving the Problem] -6- 201127900 The inventors discovered (A) epoxy resin by focusing on the discussion (b) containing three-powder novolac type phenolic resin, and (C) imidazole derivative derivative The above problems can be solved, and the present invention is as follows. (1) A resin composition characterized by (B) a novolac type of a three-till structure) an imidazole derivative and/or a cyclic anthracene derivative. (2) The resin composition as described in (1), the inorganic ruthenium filler. (3) The resin (A) epoxy resin according to (1) or (2), which is an epoxy resin having 2 liquids at 2 ° C in 1 molecule, and/or a 1-minute epoxy group, The epoxy equivalent is 250 or less, and the temperature is an aromatic epoxy resin. (4) The resin (A) epoxy resin according to (1) or (2), which is an epoxy resin having a liquid content of 2 to 2 〇 ° C in one molecule, and a 1-mole-based ring. An epoxy resin having a oxygen equivalent weight of 250 or less and a temperature of 20 ° C, and a blending mass ratio of 20:1 (5), a solder resist material characterized by a resin composed of the resin composition described in ~ On the object. (6) The welding material according to the above (5), which is obtained by the invention of a microorganism containing a triazine structure and/or a ring. And (C) containing (A) an epoxy resin phenol resin, and (C, further comprising (D composition, wherein the epoxy group is contained therein, and having a temperature of 3 or more in a temperature of 2 〇 ° C is a solid composition, wherein Contains a ring-based gas base, a solid aroma when the temperature has 3 or more epoxy ~ 1 : 10° (1) ~ (4) Any of the layers formed in the support film, the hardened tree 201127900 lipid composition layer The peeling strength of the hardened layer to the copper foil is 0. 50kgf/cm or more, 5. 00 kgf/cm or less is adhered to 'and is treated with an alkaline permanganic acid solution to form a roughened surface having a surface roughness (Ra 値) of 1 〇〇 nm or more and 300 00 nm or less. [Effects of the Invention] A phenolic phenol resin containing a triterpene structure and (C) an imidazole derivative and/or a cyclic anthracene derivative can be provided through a specific (A) epoxy resin, (B) a tris-containing novolac type phenol resin, and (C) an imidazole derivative and/or a cyclic anthracene derivative. A resin composition suitable for solder resists with excellent adhesion to copper wiring and high desmear resistance. BEST MODE FOR CARRYING OUT THE INVENTION The following is a detailed description of the preferred embodiment of the present invention. The resin composition of the present invention is characterized by containing (A) an epoxy resin and (B) a triterpenoid structure. A novolac type phenolic resin, and (C) an imidazole derivative and/or a cyclic anthracene derivative. [(A) Epoxy Resin] The epoxy resin used in the resin composition of the present invention is not particularly limited, and examples thereof include a ring having 2 or more epoxy groups in one molecule and a liquid ring at a temperature of 20 ° C. Oxygen resin (hereinafter referred to as "first epoxy resin"), "an aromatic epoxy resin having 3 or more epoxy groups in one molecule, an epoxy equivalent of 250 or less, and a solid at a temperature of 2 ° C" (hereinafter referred to as the second ring 201127900 oxygen resin). Here, the term "liquid" means the state of the liquid, and the "solid state" means the state of the solid. The so-called "aromatic epoxy tree" means an epoxy resin having an aromatic ring skeleton in its molecule. . Further, the number of epoxy groups in the molecule is an average. Specific examples of the first epoxy resin include a biguanide A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type (phen〇1 Novolac type) epoxy resin, a naphthalene type epoxy resin, and glycidol. An amine type epoxy resin, a hydrogen type epoxy resin, or the like. Any one or two or more of these may be used alone. Further, from the viewpoint of the workability in the case of producing a dry film and the good fluidity at the time of lamination, the epoxy equivalent is preferably 250 or less, more preferably 220 or less, and most preferably 2 or less. More preferably, it is 180 or less. Further, from the viewpoint of flexibility, the lower limit of the epoxy equivalent is preferably 50 or more, more preferably 80 or more, more preferably 12 or more, and still more preferably 150 or more. A commercially available product can be used as the first epoxy resin. Specifically, for example, "Jie Pivot 825" (bisphenol A type epoxy resin, epoxy in one molecule) Base: 2, epoxy equivalent: I75), Japan Epoxy resin (stock) "Yepikud 8 〇 7" (bisphenol F type epoxy resin '1 molecule in the number of epoxy groups: 2, epoxy equivalent : 169), Japan Epoxy Resin Co., Ltd. "Jeppel ι52" (phenol novolak type epoxy resin, number of epoxy groups in one molecule: 2 or more, epoxy equivalent: 175), DIC (share) "EpiCL〇N HP_4〇32" (the number of epoxy groups in one molecule of naphthalene type epoxy resin: 2, epoxy equivalent: 150), and "E.p. (Glycidylamine type epoxy resin' number of epoxy groups in 1 molecule: 3, epoxy when 201127900 amount. 120), Japan Epoxy Resin Co., Ltd. "Yeput YT8〇〇〇j (addition of hydrogen type epoxy resin - number of epoxy groups in one molecule: 2, epoxy equivalent: 205). As a resin composition In terms of appropriate physical properties of the cured product, for example, heat resistance, low expansion ratio, etc., the epoxy resin is preferably an aromatic epoxy resin from the viewpoint of physical properties, and thus the first ring in the present invention. The oxy-resin is preferably an aromatic epoxy resin, and the first epoxy resin may have a temperature of less than 2 (the liquid is TC. Further, as the second epoxy resin, specifically, for example, phenol An epoxy resin of a novolak type epoxy resin, a Phenol No volac type epoxy resin, a naphthalene type epoxy resin, a condensate of a phenol and an aromatic aldehyde having a phenolic hydroxyl group (triphenylmethane) Any of these may be used alone or in combination of two or more. The second epoxy resin may be a commercially available product, and specific examples thereof include "N-740" manufactured by DIC Corporation. Phenolic novolac type epoxy resin, number of epoxy groups in one molecule: 3 or more 'epoxy equivalent 180) DIC (shares) "N-6 90" (cresol novolac type epoxy resin, number of epoxy groups in one molecule: 3 or more, epoxy equivalent: 220), DIC (share) "EXA4700" (4-functional naphthalene type epoxy resin, number of epoxy groups in one molecule: 4, epoxy equivalent: 162), "EPPN-502H" manufactured by Nippon Kayaku Co., Ltd. (trisphenol epoxy resin, ring in one molecule) The number of oxy groups: 3 or more, epoxy equivalent: 168), etc. Among the second epoxy resins, the upper limit of the epoxy equivalent is preferably 22 Å or less from the viewpoint of adhesion and chemical resistance. It is preferably 200 or less, and more preferably 180 or less. Further, from the viewpoint of flexibility, the lower limit of the amount of the epoxy -10-201127900 is preferably 50 or more, more preferably 80 or more, more preferably 120 or more, and more preferably In addition, when the epoxy resin having an epoxy equivalent of 25 or less is used, if the epoxy resin having less than 3 epoxy groups in one molecule is used, it is difficult to obtain heat resistance of the cured product. Or chemical resistance. In particular, when the resin composition of the present invention is formed into a sheet of a resin composition, the epoxy resin is preferably contained. (1) Both epoxy resin and second epoxy resin. Other epoxy resins other than the two types of epoxy resins may be contained. The first epoxy resin is mainly used when the resin composition sheet is laminated. 'The role of the second epoxy resin is mainly to promote the hardening property after the heat curing of the resin composition sheet. The resin composition of the present invention is relative to the resin composition. The upper limit of the content ratio of the epoxy resin (A) is preferably 6% by mass or less, more preferably 45% by mass or less, and the total non-volatile content in the resin composition. The lower limit of the content ratio of the epoxy resin (A) is preferably 5% by mass or more, and more preferably 15% by mass or more. When the first epoxy resin and the second epoxy resin are used, the total non-volatile content in the resin composition is the first! The upper limit of the content ratio of the epoxy resin is preferably 30% by mass or less, and more preferably 2% by mass or less. This is based on the viewpoint of operating the resin composition sheet at 20 to 3 (at a normal temperature of about TC, the handle of the composition of the tree is easy to have a tack, and the operability of the sheet of the resin composition is maintained). The lower limit of the content ratio of the first non-volatile first epoxy resin in the resin composition -11 - 201127900 is preferably 5% by mass or more, more preferably 10% by mass or more. This is based on the operation of the resin composition sheet. At a normal temperature of about 20 to 30 ° C, in order to obtain sufficient flexibility of the resin composition sheet and maintain the handleability of the resin composition sheet, and to laminate the resin composition sheet on the circuit board, From the viewpoint of obtaining sufficient fluidity to be merely filled in a via hole or a through hole, in order to prevent lamination of a resin composition sheet on a circuit substrate, the circuit board should be The bleed out of a large amount of the resin composition in the field covered by the resin composition, resulting in a product defect, a mechanical contamination, etc. The second non-volatile matter relative to the resin composition The upper limit of the content ratio of the oxygen resin is preferably 15% by mass or less, more preferably 10% by mass or less. This is based on the fact that the resin composition sheet is obtained at a normal temperature of about 20 to 30 ° C of the resin composition sheet. From the viewpoint of sufficient flexibility and maintaining the handleability of the resin composition sheet, when the circuit substrate is laminated with the resin composition sheet, it is obtained that only the via hole or the through hole is obtained. In addition, when it is used in the form of a sheet of a resin composition, in order to reflect the characteristics of the second epoxy resin, the cured product exhibits heat resistance and chemical resistance. The lower limit of the content ratio of the second epoxy resin which is non-volatile to the entire resin composition is 〇. Preferably, 〇1% by mass or more is more preferably 1% by mass or more. The blend ratio of the first epoxy resin to the second epoxy resin is preferably 20:1 to 1:10 in a mass ratio (first epoxy resin: second epoxy resin), and -12-201127900 is preferably 1 0 : 1 to 1 ·· 2 When the blend ratio is within this range, the first epoxy resin and the second epoxy resin are used to exhibit a more remarkable effect. [(Β) Novolac type phenolic resin containing a triterpene structure] A novolac type phenolic resin containing a triterpene structure acts as a curing agent for an epoxy resin. A novolac type phenol resin containing a triterpene structure, which is a condensate composition obtained by reacting three tillages with phenols and aldehydes. The triterpenoids, phenols, and aldehydes are not particularly limited, and one or more selected from the group consisting of melamine, benzoguanamine, and methyl decylamine are preferable. Further, as the phenol, it is selected from the group consisting of phenol, or cresol, ethyl phenol, η-propoxy phenol, isobutyl phenol, t-butyl phenol, octyl phenol, nonyl phenol, nonyl phenol, methyl butyl phenol, and Various 〇-, m-' P-isomers of alkylphenols such as -t-butanol, or various 〇-, m-, p- of ethylene phenol, allyl phenol, propenyl phenol, ethynyl phenol One or two or more kinds of a cycloalkyl phenol such as cyclopentyl phenol, cyclohexyl phenol or cyclohexyl cresol or a substituted phenol such as phenylphenol are preferable. Further, the aldehyde is preferably a formalin and/or a paraformaldehyde. The upper limit of the nitrogen atom content (ratio of the ratio of the number of nitrogen atoms to the total number of atoms) of the novolac type phenol resin having a triterpene structure is preferably 25% or less from the viewpoint of solvent solubility at the time of synthesis. It should be less than 14%. In addition, the lower limit of the nitrogen atom content ratio (ratio of the ratio of the number of nitrogen atoms to the total number of atoms) of the novolac type phenol resin containing the three-pound structure is preferably 4% or more from the viewpoint of maintaining the adhesion of the copper wiring. More preferably, it is 8 -13-201127900% or more. In the reaction of a triterpenoid with a phenol and an aldehyde, the use and type of the catalyst are not particularly limited, and the reaction proceeds even without a catalyst. In the case of solder resist, it is not preferable to have a residue of an inorganic substance such as a metal in the form of a residual catalyst. Therefore, when a catalyst is used, an amine-based catalyst such as trimethylamine, triethylamine, diethylamine or aniline is preferably used. A commercially available product can be used as the novolac type phenol resin containing a triterpene structure used in the present invention. Specifically, for example, "PHENOLITE LA-7052" (nitrogen atom content: 8%) and "PHENOLITE LA-7751" (nitrogen atom content: 14%), which are manufactured by DIC (share), etc., may be mentioned. In the present invention, (B) a novolak-type phenol resin containing a three-till structure, the total number of epoxy groups present in the resin composition and the total ratio of the phenolic hydroxyl groups of the phenolic resin (the total number of epoxy groups) : phenolic hydroxyl group count) to become 1: 0 · 5 to 1. 5 for blending. If the blending ratio of the phenol resin is outside this range, the heat resistance of the cured product of the resin composition may be insufficient. [(C) Imidazole derivative and/or cyclic anthracene derivative] The imidazole derivative and/or cyclic anthracene derivative in the present invention acts as a curing accelerator. The imidazole derivative is a compound which contains an imidazole group and is a compound having a hardening promoting effect on an epoxy resin. That is, as long as it has a hardening promoting effect, there is no limitation, and specific examples thereof include imidazole ("1,3-dioxan-2,4-cyclopentadiene"): 2-methylimidazole, 2-ethylimidazole 2-Substituted imidazole derivatives of 2-peptidazole, 2-undecylimidazole, 2-phenylimidazole, etc. - 201127900 Biological: 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2 -H - a cyanoimidazole derivative containing imidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, etc.; 2,4-diamino group -6-[2'-methylimidazolyl-(Γ)]-ethyl-8-triazine, 2,4-diamino-6-(2'-undecazolyl)-ethyl-3- Triterpene imidazole derivative containing triterpenoids, 2,4-diamino-6-[ 2'-ethyl-4'-methylimidazolyl (1')]-ethyl-s-three tillage 2-Phenyl imidazolium iso-cyanate adduct, 2-ethylimidazolium iso-cyanate adduct, 2,4·diamine-6-[2'-methylimidazolyl-( Isoimidazole derivative of 1')-ethyl-3-triazole isomeric cyanuric acid addition product, 2-phenyl-4,5-dihydroxyethylimidazole, 2 4,5-substituted imidazole derivatives such as -phenylmethyl-5-hydroxydimethylimidazole Thereof; _ 3-hydroxy -1 Η - pyrrolo [1,2 - a] benzyl imidazole; epoxy imidazole and the like. The imidazole derivative may be used alone or in combination of two or more. Among these compounds, a 4,5-substituted imidazole derivative or an epoxy-imidazole is preferable from the viewpoint of the compromise between the copper wiring adhesion and the storage stability of the resin composition. The cyclic anthracene derivative is a "compound having a cyclic oxime skeleton and having a hardening promoting action". That is, there is no particular limitation as long as it has a hardening promoting action, and specific examples thereof include diindole bicycloundecene (DBU) and derivatives thereof, and the salts thereof, or diterpene bicyclononene (DBN) and derivatives thereof. ' and the salt of these, etc. The term "derivative" as used herein means a compound in which a nitrogen atom bonded to an imine bond in a cyclic anthracene skeleton is bonded with a substituent, and examples of the substituent include a benzyl group. In addition, the so-called "salt" is specifically a phenol salt, a carboxylate, an octylate, p-toluene-15-201127900 sulfonate, formate, phthalate, phenol novolac resin salt, Tetraphenylborate and the like. Among the cyclic anthracene derivatives, DBU or a derivative thereof or a salt thereof is preferably used as a DBU salt in terms of copper wiring adhesion and storage stability of the resin composition. A salt of a DBU derivative. Specifically, for example, DBU-phenolate (specifically, "U-CAT SA1" manufactured by San-Apro Co., Ltd.), DBU octoate (specifically, San-Apro (manufactured by the company), "U-CAT SA102", etc.) , DBU-p-toluenesulfonate (specifically, San-Apro (manufactured by the company), "U-CAT SA5 06", etc.), DBU-formate (specifically, San-Apro (share) system, "U- CAT SA603", etc.), DBU-phthalate (specifically, San-Apro (manufactured by the company), "U-CAT SA810", etc.), DBU-phenol novolac resin salt (specifically, San-Apro) , "U-CAT SA841", etc.), salts of DBU derivatives (specifically, San-Apro (share), "U-CAT 5002", etc.). The cyclic anthracene derivative in the present invention may be used alone or in combination of two or more. In the present invention, when the imidazole derivative and the cyclic anthracene derivative are used, each of them may be composed of one type of compound or two or more kinds of compounds. The imidazole derivative and the cyclic anthracene derivative in the present invention are preferably dissolved as a soluble substance in a solvent. Specific examples of the solvent include ketones such as acetone, methyl ethyl ketone and cyclohexanone, ethyl acetate, propylene acetate, Cellosolve acetate, and propylene glycol acetaminoacetate (Propylene). Glycol Monomethyl Ether Acetate), -16 - 201127900 Acetate, such as acetic acid vinegar such as Carbitol acetate, Cellosolve, butyl carbitol, etc. An aromatic carbonized water element such as xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone or the like. These may be used in combination of one type or two or more types. Further, a substance which does not dissolve in a solvent and has extremely low solubility in a solvent is preferably dispersed in the resin composition as it is. When a resin composition for the purpose of blending a powdery imidazole derivative and/or a cyclic anthracene derivative is used as a solder resist material, the primary particle is improved from the viewpoint of improving the insulation reliability of the conductor layer of the fine pattern. The upper limit of the average particle diameter is preferably 2 0 /zm or less, more preferably ΙΟμηη or less, and more preferably 5am or less. Further, in terms of preventing the secondary aggregation set, the lower limit of the average particle diameter of the primary particles is preferably 0. 0 1 V m or more. The average particle diameter referred to herein is based on the Mie scattering theory and can be measured by the laser light scattering/scattering method. Specifically, the laser particle size distribution measuring apparatus is used to measure the particle size distribution of the compound to be measured on a volume basis, and the median diameter (median d i a m e t e r ) is determined as an average particle diameter. The measurement sample is preferably one in which the compound to be measured is dispersed in water by using ultrasonic waves. For the laser-refractive-type particle size distribution measuring apparatus, LA-500 manufactured by Horiba Ltd. is used. The resin composition of the present invention promotes hardening reaction of an epoxy resin containing a triterpene-structured novolac type phenol resin by containing (C) an imidazole derivative and/or a cyclic anthracene derivative to improve the hardened material. Glue resistance can make the hardened material retain beautiful and high-grade appearance even after de-slaging. In addition, the adhesion of the cured product to the copper wiring is greatly enhanced. In the present invention, the upper limit of the content ratio of the (C) imidazole derivative and/or the cyclic anthracene derivative which is not volatile with respect to the entire resin composition, preserves stability and does not cause excessive hardening in the drying step. In view of the above, it is preferably 5% by mass or less, more preferably 3% by mass or less. In addition, the lower limit of the content ratio is from the viewpoint of copper foil adhesion, chemical resistance, and the like. 01% by mass or more is more suitable, more preferably 0. 1% by mass or more. The resin composition of the present invention is particularly suitably used as a solder resist, and a solder resist containing a resin composition containing the component (A), the component (B) and the component (C) of the present invention is used as described later. It also has the so-called excellent adhesion to copper wiring and high desmear resistance. The solder resist containing the resin composition of the component (A), the component (B), and the component (C) of the present invention has excellent adhesion to the copper wiring, and can be [copper wiring adhesion] as will be described later. The measurement method described in the measurement is measured, and the peel strength of the copper foil can be grasped. The copper wiring adhesion (copper foil peeling strength) of the solder resist of the resin composition of the present invention is limited to φ. 00kgf / cm or less is more suitable, preferably 2. 00kgf/cm or less, more preferably the following, more preferably 〇. 95kgf/cm or less, and more preferably 〇 9〇kgf/cm or less. Further, the lower limit of the copper wiring adhesion (copper foil peeling strength) of the solder resist of the resin composition of the present invention is 0. The higher the so-called adhesion, the better. More than 50kgf / cm is more suitable, more preferably 〇 55kgf / cm or more, more preferably 0. 60kgf / cm or more, more preferably 〇 65kgf / cm or more, and more preferably 0. 70kgf / cm or more, especially suitable for 0 75kgf / cm to -18 · 201127900 on the top, very suitable for 0. 80kgf / cm or more. The desmear resistance of the solder resist containing the resin composition containing the component (A), the component (B), and the component (c) of the present invention can be evaluated by the [degelation resistance measurement] described later. The method (surface roughness (Ra値) after treatment with an alkaline permanganic acid solution) was mastered. The upper limit 去 of the desmear resistance (surface roughness (Ra 値)) of the solder resist of the resin composition of the present invention is 500 nm or less from the viewpoint of preventing elution of the solder resist component in the plating bath. Preferably, it is preferably 400 nm or less, more preferably 3 50 nm or less, still more preferably 300 nm or less, and still more preferably 2 8 Onm or less. In addition, the lower limit 去 of the desmear resistance (surface roughness (Ra値)) of the solder resist of the resin composition of the present invention is preferably 50 nm or more, and more preferably 1 〇 from the viewpoint of practical use. 0 nm or more, more preferably 150 nm or more, and still more preferably 200 nm or more. [(D) Inorganic 塡 Filling Material] In the resin composition of the present invention, an inorganic cerium filling material may be blended to lower the thermal expansion coefficient of the resin composition. For the inorganic cerium filling, for example, cerium, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, titanium can be used. Barium strontium, barium titanate, calcium titanate, magnesium titanate, barium titanate, titanium oxide, barium chromate, calcium zirconate, and the like. It is better to use it. When the inorganic ruthenium material is used, the upper limit of the average particle diameter of the primary particles is preferably 20 μm or less, and more preferably 10 μm or less from the viewpoint of improving the insulation reliability of the conductor layer of the so-called fine pattern. m or less. Further, in addition to -19-201127900, the lower limit of the average particle diameter of the primary particles is preferably the above from the viewpoint of preventing secondary aggregation. Further, in order to improve the moisture resistance of the inorganic cerium filler, it is preferred to apply a surface treatment agent such as a decane coupling agent to the surface treatment. The average particle size of the inorganic cerium filler is based on the Mie scattering theory and can be determined by laser refractometry. The upper limit of the content ratio of the inorganic cerium filler in the resin composition is preferably 85% by mass or less from the viewpoint of the meltability at the time of lamination or the adhesion to the copper wiring. It is preferably 60% by mass or less. In addition, the lower limit of the content ratio of the inorganic cerium material in the resin composition is preferably 30% by mass or more, and more preferably 35% by mass or more from the viewpoint of the coefficient of thermal expansion. Further, in the cured product of the resin composition of the present invention, the coefficient of thermal expansion is preferably 80 χ1 (Γ6/Κ or less, preferably 60×1 (Γ6/Κ or less) in the range of 30 ° C to 150 ° C. The coefficient of thermal expansion refers to a non-vibration load that is stretched while changing the temperature, and the deformation of the material is measured as a function of temperature. "EXSTAR TMA/SS6000" manufactured by SIINano Technology Co., Ltd. can be used. The resin composition of the present invention may be blended with "(E) polymer compound" for the purpose of imparting appropriate flexibility to the solder resist after heat curing. For example, a phenoxy resin, a polyvinyl acetal resin, a polyimine, a polyamidimide, a polyether oxime, a polyfluorene, an aliphatic polyester polyol, a polyether polyol, Polycarbonate-based polyol, polyethylene terephthalate polyol, acrylic resin, etc. Any one of these may be used alone or two or more of them may be used. -20-201127900 is a specific example of the phenoxy resin. , for example, Dongdu Huacheng (Shares) FX28 0, FX293, Japanese epoxy resin (share) YX8100 'YL69 54 > YL69 74, YL74 82, YL7 5 5 3, YL6794, YL72 1 3, YL7290, etc. Polyvinyl acetal resin For example, a polyvinyl butyral resin is preferable, and specific examples of the polyvinyl acetal resin include, for example, the electric chemical industry, DENKA BUTYRAL 4000-2, 5000-A, 6000-C, 6000-EP, and Sekisui Chemical Co., Ltd. Industrial S-LECB Η series, BX series, KS series 歹 IJ, BL series 歹 IJ, Β Μ series, etc. As a specific example of poly phthalimide, for example, the new Japanese physicochemical (share) system Polyimine "RIKACOAT SN20" and "RIKACOAT ΡΝ20." Further, a linear polyimine obtained by reacting a bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride ( Japanese Laid-Open Patent Publication No. 2006-37083, etc., and a polyfluorene-containing polyamine (such as those described in JP-A-2002-12667, JP-A-2000-319386, etc.) Modified polyimine. Specific examples of the polyamido quinone imine "VYLOMAX HR1 1NN" and "VYLOMAX HR16NN" manufactured by Toyobo Co., Ltd., and a polyamine oxime skeleton containing a polyoxyalkylene skeleton manufactured by Hitachi Chemical Co., Ltd. Modified polyamidoximine such as imine "KS9100" or "KS 9 3 00". Specific examples of the polyether oxime include, for example, -21 · 201127900 polyether oxime "PES 5 003 P" manufactured by Sumitomo Chemical Co., Ltd. Specific examples of the polyfluorene include, for example, "P 1 700" and "P3 500" manufactured by Solvay Advanced Polymers Co., Ltd. The polymer compound is preferably blended at a ratio of less than 30% by mass based on the total nonvolatile content of the resin composition of 100% by mass. When the content is 30% by mass or more, the viscosity of the resin composition becomes too high, and the wiring pattern on the circuit tends to be difficult to embed. Further, when the blending amount is too small, the effect achieved by blending the polymer compound cannot be sufficiently obtained, so the lower limit of the blending amount is preferably 1% by mass or more. In addition to the above components, the resin composition of the present invention may be blended with other components such as an additive, an organic chelating material, and a curing accelerator other than the above, within a range not inhibiting the effects of the present invention. The additive is not particularly limited, and specific examples thereof include an organic phosphorus-based flame retardant, an organic-based nitrogen-phosphorus compound, a nitrogen compound, a polyoxyalkylene-based flame retardant, and a metal hydroxide. a chelating agent such as an alkane powder, a nylon powder or a fluorinated powder; a tackifier such as an organic benton or a benton; a polyoxyalkylene-based, a fluorine-based or a polymer-based antifoaming agent; Or leveling agent; adhesion imparting agent such as imidazole, thiazole, triazole or decane coupling agent; phthalocyanine blue, phthalocyanine. Pigments such as green, iodine green, disazo yellow, carbon black, and the like. Examples of the organic cerium filler include acrylic rubber particles, polyamine fine particles, and polyoxyalkylene particles. Specific examples of the acrylic rubber particles 'Chemical cross-linking treatment of a resin exhibiting rubber elasticity such as acrylonitrile-butadiene rubber, butadiene rubber, acrylic rubber, etc., as long as it has a solvent insoluble in -22-201127900 The microparticles of the resin are not melted, and specific examples thereof include XER-91 (manufactured by Nippon Synthetic Rubber Co., Ltd.), Tafir Roydo (AC3355), AC3816, AC3832, AC4030, AC3364, IM101 ( The above are G AN Z CHEMICAL (manufactured by the company), the 啪 萝 依 多 多 EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX EX Specific examples of the polyamide fine particles include an aliphatic polyamine such as nylon or an aromatic polyamine such as Kevlar Fiber, or even a polyamidene having micro particles of 50/zm or less. A resin having a guanamine bond such as an amine, specifically VESTOSINT 2070 ( DAICEL . HUELS (share) system, or S P 5 0 0 (Τ Ο R A Y (share) system). The average particle diameter of the primary particles of the organic cerium filler is preferably 20/zm or less, more preferably 10/zni or less, and is preferably 5 or less. When the average particle diameter exceeds 20 μm, when the base copper wiring is in a fine pattern, there is a fear that the insulation reliability cannot be maintained. In some cases, if the average particle size of the organic ruthenium material is too small, the average particle diameter tends to be 0. 0 1 // m or more is appropriate. Further, the average particle diameter of the organic ruthenium was measured in the same manner as the above-mentioned inorganic ruthenium. In the resin composition of the present invention, it is possible to further blend the imidazole derivative and the cyclic anthracene derivative from the viewpoint of further improving the adhesion of the copper wiring or adjusting the balance between the storage stability and the curing acceleration effect. Hardening accelerator. As such a hardening accelerator, in addition to tertiary amines, anthraquinones, or such epoxy addition or microencapsulation, organic compounds such as triphenylphosphine, tetraphenylphosphine, and tetraphenylboronic acid can also be used. A phosphine-based compound or the like is known. -23-201127900 Conventional compounds may be used singly or in combination of two or more. Further, the hardening accelerators are present in a proportion of 0% relative to the total nonvolatile content in the resin composition. 01~5 mass% range is used. The resin composition of the present invention can be used in various applications, particularly in the case of a solder resist, and more preferably in the form of an ink type solder resist or a dry film type solder resist. In other words, the solder resist can be formed by coating and drying the varnish of the resin composition of the present invention on the circuit board; or the resin composition layer of the present invention can be formed on the support to form a resin composition. The sheet is pressed and laminated on the circuit board to form a solder resist. In the industry, it is preferred to use a dry film type solder resist material, that is, a resin composition sheet. The method for producing the resin composition sheet is not limited, and it may be produced by a known production method. Specifically, the resin composition may be dissolved in an organic solvent to prepare a resin varnish, the support film may be used as a support, the resin varnish may be coated, further heated, or the organic solvent may be dried by blowing hot air to form a resin composition. Floor. Specific examples of the organic solvent include ketones such as acetone, methyl ethyl ketone, and cyclohexanone, ethyl acetate, propyl acetate, 2-ethoxyethyl acetate, propylene glycol methyl ether acetate, and ethyl acetate. A phthalate such as diethylene glycol ester, a carbitol such as 2-ethoxyethyl or butyl carbitol, an aromatic carbonized alkane such as toluene or xylene, dimethylformamide or dimethyl Acetylamine, N-methylpyrrolidone, and the like. The organic solvent may be used in combination of two or more kinds. The drying condition is not particularly limited, and the content ratio of the organic solvent to the resin composition layer is 10% by mass or less, and it is preferable to dry it to 5 mass -24 to 201127900% by volume or less. The melt viscosity curve of the formed resin composition layer is affected by the drying conditions described later, and it is preferred that the set member satisfies the aforementioned melt viscosity characteristics. It will also vary with the dosage in the varnish, specifically containing 30 to 60% by mass of the organic lacquer, and it can be dried at 50 to 150 ° C for about 3 to 10 minutes. In the technical field, suitable and dry conditions can be set by simple experiments. The thickness of the resin composition layer is not particularly limited, and is preferably the thickness of the conductor layer which the large substrate has. The conductor layer of the circuit substrate is usually in the range of 5 to 7 μm, and the thickness of the resin composition layer is preferably: thickness of 〜100#m. Further, the resin composition layer in the resin composition sheet is also protected by a protective film. By the protection of the protective film, the adhesion or damage to the surface of the resin composition layer can be caused by the object. In the present invention, as a support film and a protective film, polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, polyphenylene terephthalate (hereinafter referred to as "PET"), and polyethylene 2,6 naphthalene dicarboxylate may be used. Naphthalate) and other plastic films such as polyester, polycarbonate, and amine. Further, the support film and the protective film may be subjected to matting treatment, corona treatment, mold release treatment, or the like. The thickness of the support film is not particularly limited and is preferably from 10 to 150 ", preferably from 25 to 50/zm. Also, the protection thickness is preferably 1 to 40 // m. Further, as described later, in the manufacturing step of the resin sheet, the support film used as the support is used, and although the dry strip organic solvent is preferably selected to have a thickness of the circuit of 10, it is possible to prevent the illegal action such as formic acid B. The diester (the polystyrene is suitably used as a protective resin in the thickening composition of the film, in the layering of the resin composition layer of the electro--25-201127900 substrate, and the heat-hardening treatment of the layer after lamination The composition film is used in the resin composition sheet, and the resin composition layer after the electro resin composition layer or after lamination is peeled off after being formed into a hardened layer. When the support film is peeled off, the difference in the hardening step can be prevented, and the smoothness of the surface of the hardened layer can be improved. If the peeling is performed, the support film is previously released from the support film, and formed on the support film. The resin composition layer preferably has a smaller area than the support film area, and the material sheet can be curled into a roll shape for storage and storage. When the resin composition sheet is laminated on the circuit board, the resin composition layer can be directly contacted to the circuit board when the resin composition layer is protected by the protective film according to the conventional dry film type solder resist material. In the method, the sheet is laminated on one side or both sides of the circuit board, and the method of laminating to the circuit board is carried out by heating and pressurizing under reduced pressure. The method of laminating can be batch type or Further, before the lamination, the sheet and the circuit board may be preheated as needed. For vacuum lamination, a commercially available vacuum laminator may be used. Nichigo-Morton (shares) Applicator, (shares), the manufacturer of the vacuum-pressed resin composition layer, the surface of the substrate, the heat-hardening type, the heat-hardening, etc. The resin group and the resin are used to form the welding consumable. First, if the resin is formed into a blank layer after the stripping, the vacuum lamination of the resin is performed in a continuous manner of the optimum roller. Cuum laminator, (-26- 201127900 shares) Hitachi Plant Technologies milk light Drycoater, Hitachi AIC (stock) vacuum laminator, etc. Lamination conditions, pressing temperature (lamination temperature) to 70~l4 〇 ° C is appropriate, pressing pressure is 1 ~ llkgf / cm2 (9. 8xl〇4~107. 9xl04N/m2) is suitable, the air pressure is at 20mmHg (26. It is advisable to laminate at a reduced pressure of 7 hPa). After the laminating step, it is preferred to use a metal plate for hot pressing to planarize the laminated resin composition sheet. This flattening step is carried out by heating and pressurizing the sheet with a metal plate such as a heated SUS mirror panel under normal pressure. The heating and pressurizing conditions can be the same as those of the above laminating step. A circuit board provided with a solder resist material of the resin composition of the present invention is mainly formed on an epoxy glass, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether (
Polyphenyleneether)基板等基板之單面或雙面上，經圖 型加工所形成導體層（電路）者。另外，本發明所謂的電 路基板亦包含，由導體層與絕緣層以交互方式形成之層， 在其單面或雙面上經圖型加工形成導體層（電路）之多層 印刷電路板。且，導體電路層表面施以黑化處理等事先的 粗化處理者，以防焊材與電路基板的密著性之觀點而言爲 宜。 如此地在將樹脂組成物薄片層合到電路基板後、或是 更進一步於層合後實施平坦化步驟後，需剝離支撐薄膜時 予以剝離，並藉由熱硬化，可在電路基板上形成防焊材。 -27- 201127900 加熱硬化條件以選擇在150 °C〜220 °C、20分鐘〜180分 鐘之範圍，更佳爲在160 °C〜200 °C下、30〜120分鐘者。 防焊材形成後，若爲硬化前支撐薄膜不予以剝離之狀 況時，則在此時進行剝離。接著，對電路基板上形成之防 焊材進行開孔，形成開口部。開孔具體上可以鑽孔（drill )、雷射、電漿等周知的方法，又若有必要，可組合此等 之方法予以施行，但以二氧化碳雷射、YAG雷射等之雷 射開孔爲最一般的作法。 開口部形成後，施以去膠渣處理以去除開口部底部產 生的膠渣。去膠渣處理可以周知的各種方法來進行，但以 產能或生產成本之點而言，最佳爲使用鹼性過錳酸溶液之 濕式法。另外，以鹼性過錳酸水溶液等氧化劑進行去膠渣 處理時，於處理前事先以膨潤液施以膨潤處理者爲宜。膨 潤液，具體可舉例如 ATOTECH JAPAN (股）製的 Swelling Dip S ecuri ganth P、Swelling Dip S ecuri ganth SBU等。膨潤處理，較佳爲將電路基板浸漬於加熱到60 〜8 0°C的膨潤液中5〜10分鐘。鹼性過錳酸水溶液方面， 具體可舉例如在氫氧化鈉水溶液中溶解過錳酸鉀或過錳酸 鈉之溶液。鹼性過錳酸水溶液的粗化處理，以在60〜80 °C、10〜30分鐘之處理爲宜。鹼性過錳酸水溶液，市售 品方面可舉例如 ATOTECH JAPAN股份有限公司製的 Concentrate Compact CP、dosing solutionsecurity P 等。 之後，具體爲在洗淨電路基板後，將電路基板浸漬於 無電解鎳鍍敷液中，於防焊材之開口部內藉由無電解鍍敷 -28- 201127900 形成鎳鍍敷層（厚度1〜l〇//m左右），然後，再將其基 板，具體上以浸漬於無電解金鍍敷液中，在鎳鍍敷層上形 成金鍍敷層（厚度0.01〜左右），在防焊材之開口 部內形成焊錫墊（solder pad )。無電解鎳鍍敷液，市售 品方面可舉例如上村工業（股）製「NIMUDEN」等；無 電解金鍍敷液市售品方面可舉例如上村工業（股）製「 GOBRIGHT」等。 然後在防焊材之開口部，印刷上作爲低熔點金屬之焊 錫膏（solder paste)，具體上藉由在 220〜260 °C下進行 迴流（reflow)，形成焊錫凸塊（solder bump)，該焊錫 凸塊成爲與半導體晶片或電容器等電子零件焊接之部位， 而配線板完成。 【實施方式】 [實施例] 以下將以實施例具體地說明本發明，但本發明不僅只 限定於以下之實施例。且，以下述記載中之「份」意指「 質量份」。 首先，針對實施例及比較例之物性評估中的測定方法 予以說明。 [銅配線密著性測定] 將下述的實施例及比較例中所得到的樹脂組成物薄片 之保護薄膜予以剝離後，將此以名機製作所製真空層合機 -29 - 201127900 (MVLP-500)，在氣壓5mmHg以下、溫度i〇〇〇c、壓力 7kgf/cm2之條件下’與經CZ處理過之銅箔（3〇ym)進 行層合。剝離P E T薄膜後’將此附有樹脂之銅箔以名機 製作所製真空層合機（MVLP. 500 )層合到銅箔積層板（ COPPER CLAD LAMINATE)，以氣壓 5mmHg 以下、溫度 100°C、壓力7kgf/cm2之條件層合到經CZ處理過之銅范 積層板。並將其以180°C、60分鐘熱硬化處理。另外，上 述所謂的CZ處理’具體來說爲將銅箔浸漬在蟻酸與鹽酸 之混合液後、水洗、洗掉處理液，粗化銅箔表面之處理。 銅配線密著性’係依照π S C 6 4 8 1以測定過的銅箔之剝離 強度來進行測定。 [去膠渣耐性測定] 對於2片由下述的實施例及比較例中所得到的樹脂組 成物薄片，將其保護薄膜剝離，2片之樹脂組成物薄片以 名機製作所製真空層合機（MVLP- 5 00 )，在氣壓5mmHg 以下、溫度l〇〇°C、壓力7kgf/cm2之條件下，同時層合到 FR4雙面銅箔積層板之兩面上。接下來以連續溫度100 °C 、壓力5kgf/cm2之條件，使用SUS鏡面板進行熱壓製。 然後將PET薄膜剝離，進行180°C ' 30分鐘的熱硬化處 理。然後，假設進行去膠渣處理，使用氧化劑溶液之 ATOTECH JAPAN (股）製的粗化液（Swe 11 ing Dip Securiganth P (膨潤）、Concentrate Compact CP (氧化 )' Reduction solution Securiganth P (中和）），在層 -30- 201127900 合板上依序進行膨潤6 0 °C x 5分鐘、氧化8 〇 χ 2 〇分鐘、 中和40°C Χ5分鐘之處理。 所得到的層合板利用非接觸型表面粗糙度計（V e e c 〇 Instruments 公司製 WYKONT3 3 00 )，以 VSI 接觸模式、 5 〇倍透鏡、測定範圍爲1 2 1 // m X 9 2 " m條件下進行測定 ’求得表面粗糖度（R a値）。另外，以全測定範圍1 〇點 之平均値作爲Ra値。去膠渣耐性爲由該表面粗糙度（Ra 値）之値評估。 [熱膨脹率之評估] 將下述實施例及比較例中所得到的樹脂組成物薄片之 保護薄膜予以剝離後’以1 8 0 °C加熱9 0分鐘使其熱硬化 ’再將支撐體剝離後得到薄片狀之硬化物。將其硬化物裁 剪成寬度約5mm、長度約l5mm之試驗片，使用熱機械分 析裝置SII NanoTechnology股份有限公司製「EXSTAR TMA/SS6000」’在拉伸加重法下進行熱機械分析。將試 驗片裝著到前述裝置後，以荷重1 g、昇溫速度5 °C /分中 之測定條件連續測定2次。第2次的測定中算出2 5。〇〜 150°C的平均線熱膨脹率。 [實施例Π 將液狀雙酚F型環氧樹脂（環氧當量丨70，日本環氧 樹脂（股）製’ 「耶皮樞特8 0 7」）3 3份與甲酚酚醛清漆 型環氧樹脂（環氧當量220，DIC (股）製「EPICLONN- -31 - 201127900 690」）10份’加入到MEK20份與環己酮10份之混合液 中’邊攪拌邊使其加熱溶解。然後添加氮原子含有率爲8 %之含有三哄構造的苯酚酚醛清漆樹脂的MEK清漆（ DIC (股）製「PHENOLITe LA— 7052」，不揮發分 60 質 量％、不揮發分之苯酚性羥基當量120) 30份、作爲無機 塡充材的球形矽（平均粒徑lym，胺基矽烷處理）50份 、作爲硬化促進劑的咪唑系硬化促進劑（2-苯基-4-甲基-5-羥甲咪唑：四國化成（股）製「2P4MHZ-PW」）0.5份 、苯氧基樹脂清漆（不揮發分40質量％，東都化成（股 )製「FX293」，玻璃轉移溫度163°C)20份、及聚乙烯 醇縮醛樹脂清漆（不揮發分15質量％，積水化學工業製 「KS 1」，玻璃轉移溫度1 07°C ) 1 5份調製成樹脂清漆。 相對於樹脂清漆之不揮發分，無機塡充材含有量爲40質 量％。 接下來，將樹脂清漆在厚度爲38//m的聚對苯二甲 酸乙二酯（厚度38/zm，以下略稱PET)上，以塗佈機塗 佈成乾燥後樹脂組成物層的厚度爲30//m，再以80〜120 °C (平均100°C )乾燥6分鐘（殘留溶劑量約1質量％ ) 。繼續在樹脂組成物層的表面，一邊貼合由厚度爲15ym 的聚丙烯薄膜所成之保護薄膜，一邊捲曲成滾筒狀。再將 滾筒狀樹脂組成物薄片分條成寬度5 07mm，如此便可得 到尺寸爲507mmx 3 3 6mm之樹脂組成物薄片。在用其進行 銅箔密著評估試驗與去膠渣耐性評估試驗、熱膨脹率之測 定。密著強度爲〇.89kg f/cm’表面粗糙度爲262 nm。該硬 -32- 201127900 化物之熱膨脹率爲58x1 (Γ”Κ。 [實施例2 ] 除了將咪唑系硬化促進劑（四國化成（股）製「 2P4MHZ-PW」）0.5份變更成 DBU鹽（DBU-苯酚鹽： San-Apro (股）製「U-CAT SA 1」）0_5份外，與實施例 1同樣進行製作樹脂清漆。相對於樹脂清漆之不揮發分， 無機塡充材含有量爲40質量％。 進一步，使用此樹脂清漆與實施例1同樣地製作樹脂 組成物薄片，並進行銅箔密著評估試驗及去膠渣耐性評估 試驗。密著強度爲0.98kgf/cm，表面粗糙度爲299nm。又 ，該硬化物之熱膨脹率爲58x1 (Γ6/Κ。 [比較例1 ] 不使用咪唑系硬化促進劑（四國化成（股）製「 2P4MHZ-PW」），其他與實施例1同樣之條件下製作樹 脂清漆。相對於樹脂清漆之不揮發分，無機塡充材含有量 爲40質量％。 進一步，使用此樹脂清漆與實施例1同樣地製作樹脂 組成物薄片，並進行銅箔密著評估試驗及去膠渣耐性評估 試驗。密著強度爲〇.75kgf/cm，表面粗糖度爲397nm。 [比較例2] 除了將咪唑系硬化促進劑（四國化成（股）製「 -33- 201127900 2P4MHZ-PW」）0.5份變更成磷系硬化促進劑（北興 公司製「TPP-S」）0.5份之外，與實施例1同樣進 作樹脂清漆。相對於樹脂清漆之不揮發分，無機塡充 有量爲40質量％。 進一步，使用此樹脂清漆與實施例1同樣地製作 組成物薄片，並進行銅箔密著評估試驗及去膠渣耐性 試驗。密著強度爲0.89kg f/cm，表面粗糙度爲330 nm [比較例3 ] 除了使用苯酚酚醛清漆樹脂之MEK清漆（DIC )製「PHENOLITETD-2090」，不揮發分 60質量％ 揮發分之苯酚性羥基當量105) 31份取代含有三哄構 苯酚酚醛清漆樹脂之 MEK清漆（DIC (股）： PHENOLITELA- 7052」，不揮發分 60質量％，不揮 之苯酚性羥基當量1 2 0 ) 3 0份外，與實施例1同樣進 作樹脂清漆。相對於樹脂清漆之不揮發分，無機塡充 有量爲40質量％。 進一步，使用此樹脂清漆與實施例1同樣地製作 組成物薄片，並進行銅箔密著評估試驗及去膠渣耐性 試驗。密著強度爲〇.49kgf/cm，表面粗糖度爲585nm [比較例4] 除了使用萘酣芳院（naphtholaralkyl)樹脂之 清漆（東都化成（股）製「SN-485」，不揮發分60 化學 行製 材含 樹脂 評估 (股 ，不 造的 製「 發分 行製 材含 樹脂 評估 MEK 質量 -34- 201127900 % ’不揮發分之苯酚性羥基當量215) 63份， 啡構造的苯酚酚醛清漆樹脂之MEK清漆（DIC PHENOLITELA-705 2」，不揮發分 60質量％ 之苯酚性羥基當量1 2 0 ) 3 0份之外，與實施例 製作樹脂清漆。相對於樹脂清漆之不揮發分， 含有量爲40質量％。 進一步，使用此樹脂清漆與實施例1同樣 組成物薄片’並進行銅箱密著評估試驗及去膠 試驗。密箸強度爲〇.76kgf/cm ’表面粗糙度爲 以上的結果如下述表1所示。 A代含有三 (股）製Γ ’不揮發分 1同樣進行 無機塡充材 地製作樹脂 渣耐性評估 7 9nm。 -35- 201127900 【Γ—I嗽一 比較例4 SN-485 2P4MHZ-PW On 0.76 比較例3 PHENOLITE TD-2090 2P4MHZ-PW 585 0.49 比較例2 PHENOLITELA-7052 TPP-S — 330 0.89 比較例1 1 397 1 J 0.75 實施例2 U-CAT SA 1 299 0.98 實施例1 2P4MHZ-PW 262 0.89 苯酚硬化劑 硬化促進劑 表面粗糙度(nm) 銅箔之剝離強度 (kgf^cm) -36- 201127900 由表1可明確得知，實施例之樹脂組成物之硬化物， 兼具銅配線密著性與去膠渣耐性，經由本發明之樹脂組成 物可實現高性能的防焊材。 [產業利用性] 藉由含有特定的（A)環氧樹脂、（B)含有三哄構 造之酚醛清漆型酚醛樹脂、及（C)咪唑衍生物及/或環 狀脒衍生物’爲兼具與銅配線之優異密著性及高去膠渣耐 性之適合作爲防焊材的樹脂組成物，能提供含有其樹脂組 成物之防焊材更具深遠意義。 本申請案以日本當地申請之專利申請2009- 1 67 1 64爲 基礎，其內容皆包含於本說明書中。 -37-Polyphenyleneether) A conductor layer (circuit) formed by patterning on one or both sides of a substrate such as a substrate. Further, the circuit board of the present invention also includes a multilayer printed circuit board in which a conductive layer (circuit) is formed by patterning on a single side or both sides of a layer formed by an alternating layer of a conductor layer and an insulating layer. Further, the surface of the conductor circuit layer is subjected to a prior roughening treatment such as a blackening treatment, and it is preferable from the viewpoint of the adhesion between the solder material and the circuit board. After laminating the resin composition sheet to the circuit board or further performing the planarization step after lamination, the support film is peeled off when peeled off, and the film can be formed on the circuit substrate by thermal curing. Welding consumables. -27- 201127900 Heat hardening conditions are selected in the range of 150 °C to 220 °C for 20 minutes to 180 minutes, more preferably at 160 °C to 200 °C for 30 to 120 minutes. After the formation of the solder resist material, if the support film is not peeled off before curing, peeling is performed at this time. Next, the solder resist formed on the circuit board is opened to form an opening. The opening may specifically be well-known methods such as drill, laser, plasma, etc., and if necessary, may be combined to perform the method, but a laser opening such as a carbon dioxide laser or a YAG laser is used. For the most general practice. After the opening portion is formed, a desmearing treatment is applied to remove the slag generated at the bottom of the opening. The desmear treatment can be carried out by various methods known in the art, but in terms of productivity or production cost, the wet method using an alkaline permanganic acid solution is preferred. Further, when the desmutting treatment is carried out with an oxidizing agent such as an alkaline permanganic acid aqueous solution, it is preferred to apply a swelling treatment to the swelling liquid before the treatment. Specific examples of the swelling liquid include Swelling Dip S ecuriganth P manufactured by ATOTECH JAPAN Co., Ltd., Swelling Dip Securigan SBU, and the like. For the swelling treatment, it is preferred to immerse the circuit board in a swelling liquid heated to 60 to 80 ° C for 5 to 10 minutes. Specific examples of the aqueous alkaline permanganic acid solution include a solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous sodium hydroxide solution. The roughening treatment of the aqueous alkaline permanganic acid solution is preferably carried out at 60 to 80 ° C for 10 to 30 minutes. The alkaline permanganic acid aqueous solution may, for example, be Concentrate Compact CP or dosing solution security P manufactured by ATOTECH JAPAN Co., Ltd., for example. After that, after the circuit board is cleaned, the circuit board is immersed in an electroless nickel plating solution, and a nickel plating layer (thickness 1 to 1) is formed in the opening of the solder resist by electroless plating -28-201127900. L〇//m or so), and then the substrate is specifically immersed in an electroless gold plating solution to form a gold plating layer (thickness: 0.01~) on the nickel plating layer, in the solder resist A solder pad is formed in the opening. In the case of the commercially available product, for example, "Numoku", which is a product of the above-mentioned industrial group, and the like, and "GOBRIGHT", which is a product of the electroless gold plating solution, can be exemplified. Then, at the opening of the solder resist, a solder paste as a low melting point metal is printed, and specifically, a solder bump is formed by reflow at 220 to 260 ° C, and the solder bump is formed. The solder bumps are soldered to electronic parts such as semiconductor wafers or capacitors, and the wiring board is completed. [Embodiment] [Examples] Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited only to the following examples. In addition, the "parts" in the following description means "parts by mass". First, the measurement methods in the physical property evaluation of the examples and comparative examples will be described. [Measurement of the adhesion of the copper wiring] The protective film of the resin composition sheet obtained in the following Examples and Comparative Examples was peeled off, and then a vacuum laminator manufactured by a machine was produced -29 - 201127900 (MVLP- 500), laminated with a CZ-treated copper foil (3 〇 ym) under conditions of a pressure of 5 mmHg or less, a temperature i〇〇〇c, and a pressure of 7 kgf/cm2. After peeling off the PET film, the resin-attached copper foil was laminated to a copper foil laminate (MVPER. 500) by a machine made of COPPER CLAD LAMINATE at a pressure of 5 mmHg or less and a temperature of 100 °C. The conditions of a pressure of 7 kgf/cm2 were laminated to a CZ-treated copper-clad laminate. It was heat-hardened at 180 ° C for 60 minutes. Further, the above-mentioned "CZ treatment" is specifically a treatment in which a copper foil is immersed in a mixture of formic acid and hydrochloric acid, washed with water, and the treatment liquid is washed away to roughen the surface of the copper foil. The copper wiring adhesion was measured in accordance with the peel strength of the measured copper foil in accordance with π S C 6 4 8 1 . [Determination of the desmear resistance] Two sheets of the resin composition sheets obtained in the following Examples and Comparative Examples were peeled off, and the two resin sheets of the resin composition were produced by a machine. (MVLP-5 00 ), simultaneously laminated to both sides of the FR4 double-sided copper foil laminate under the conditions of a pressure of 5 mmHg or less, a temperature of 10 ° C, and a pressure of 7 kgf/cm 2 . Next, hot pressing was performed using a SUS mirror panel under the conditions of a continuous temperature of 100 ° C and a pressure of 5 kgf/cm 2 . The PET film was then peeled off and subjected to a heat hardening treatment at 180 ° C for 30 minutes. Then, a desmear solution (Swe 11 ing Dip Securiganth P (swelling), Concentrate Compact CP (oxidation)' Reduction solution Securiganth P (neutral)) using an oxidizing agent solution is assumed. On the layer -30- 201127900 plywood, it is swelled at 60 °C for 5 minutes, oxidized for 8 〇χ 2 〇 minutes, neutralized at 40 ° C for 5 minutes. The obtained laminate was subjected to a non-contact type surface roughness meter (WYKONT 3 3 00 manufactured by V eec 〇 Instruments Co., Ltd.) in a VSI contact mode, a 5 〇 lens, and a measurement range of 1 2 1 // m X 9 2 " m The measurement was carried out under conditions to determine the surface roughness (R a 値). In addition, the average enthalpy of the entire measurement range of 1 〇 is used as Ra 値. The desmear resistance is evaluated by the surface roughness (Ra 値). [Evaluation of Thermal Expansion Rate] The protective film of the resin composition sheet obtained in the following Examples and Comparative Examples was peeled off, and then heat-cured by heating at 180 ° C for 90 minutes to remove the support. A flaky cured product is obtained. The cured product was cut into a test piece having a width of about 5 mm and a length of about 15 mm, and subjected to thermomechanical analysis under the tensile weighting method using "EXSTAR TMA/SS6000" manufactured by SII NanoTechnology Co., Ltd., a thermomechanical analysis device. After the test piece was placed in the above apparatus, the test piece was continuously measured twice under the measurement conditions of a load of 1 g and a temperature increase rate of 5 °C /min. In the second measurement, 2 5 was calculated. 〇 ~ 150 ° C average line thermal expansion rate. [Examples] 33 parts of liquid bisphenol F type epoxy resin (epoxy equivalent 丨70, manufactured by Nippon Epoxy Resin Co., Ltd.) and cresol novolak type ring Oxygen resin (epoxy equivalent 220, "EDCLONN--31 - 201127900 690" manufactured by DIC Co., Ltd.) 10 parts 'added to a mixture of 20 parts of MEK and 10 parts of cyclohexanone' was heated and dissolved while stirring. Then, MEK varnish ("PHENOLITe LA-7052" manufactured by DIC Co., Ltd.) containing a bisphenol-containing phenol novolak resin having a nitrogen atom content of 8% was added, and the nonvolatile content was 60% by mass, and the non-volatile phenolic hydroxyl equivalent was added. 120) 30 parts of spherical cerium (average particle size lym, amino decane treatment) as an inorganic cerium filling material, 50 parts of an imidazole-based hardening accelerator (2-phenyl-4-methyl-5-) as a hardening accelerator Methotrexate: 0.5 parts of "2P4MHZ-PW" manufactured by Shikoku Kasei Co., Ltd.), phenoxy resin varnish (40% by mass, "FX293" manufactured by Tohto Kasei Co., Ltd., glass transition temperature 163 °C) 20 parts and polyvinyl acetal resin varnish (non-volatile content 15% by mass, "KS 1" manufactured by Sekisui Chemical Co., Ltd., glass transition temperature 1 07 ° C) 15 parts were prepared into a resin varnish. The content of the inorganic cerium filler was 40% by mass based on the nonvolatile content of the resin varnish. Next, the resin varnish was coated on a polyethylene terephthalate (thickness 38/zm, hereinafter abbreviated as PET) having a thickness of 38/m, and coated by a coater to a thickness of the resin composition layer after drying. It is 30/m, and is further dried at 80 to 120 ° C (average 100 ° C) for 6 minutes (the residual solvent amount is about 1% by mass). On the surface of the resin composition layer, a protective film made of a polypropylene film having a thickness of 15 μm was attached and rolled into a roll shape. Further, the sheet-like resin composition sheet was slit into a width of 5 07 mm, so that a resin composition sheet having a size of 507 mm x 3 3 6 mm was obtained. It is used for the copper foil adhesion evaluation test and the desmear resistance evaluation test, and the measurement of the thermal expansion rate. The adhesion strength was 89.89 kg f/cm' and the surface roughness was 262 nm. The thermal expansion coefficient of the hard-32-201127900 compound is 58x1 (Γ"Κ. [Example 2] In addition, 0.5 part of the imidazole-based hardening accelerator ("2P4MHZ-PW" manufactured by Shikoku Kasei Co., Ltd.) was changed to DBU salt ( A resin varnish was prepared in the same manner as in Example 1 except that DBU-phenolate: "U-CAT SA 1" manufactured by San-Apro Co., Ltd.) was used in the same manner as in Example 1. The inorganic cerium content of the resin varnish was Further, a resin composition sheet was produced in the same manner as in Example 1 using this resin varnish, and a copper foil adhesion evaluation test and a desmear resistance evaluation test were carried out. The adhesion strength was 0.98 kgf/cm, and the surface roughness was obtained. In addition, the thermal expansion coefficient of the cured product was 58×1 (Γ6/Κ. [Comparative Example 1] The imidazole-based hardening accelerator (“2P4MHZ-PW” manufactured by Shikoku Kasei Co., Ltd.) was not used, and the other example 1 was used. The resin varnish was produced under the same conditions, and the inorganic cerium content was 40% by mass based on the non-volatile content of the resin varnish. Further, a resin composition sheet was produced in the same manner as in Example 1 using this resin varnish, and copper foil was produced. Close evaluation test and go In the slag resistance evaluation test, the adhesion strength was 〇75 kgf/cm, and the surface roughness was 397 nm. [Comparative Example 2] In addition to the imidazole-based hardening accelerator ("Diako Kasei Co., Ltd." -33-201127900 2P4MHZ-PW" In the same manner as in Example 1, a resin varnish was added in the same manner as in Example 1 except that 0.5 parts of the phosphorus-based hardening accelerator ("TPP-S" manufactured by Kitagawa Co., Ltd.) was changed to 0.5 parts. The amount of inorganic cerium charged with respect to the non-volatile content of the resin varnish was 40% by mass. Further, using this resin varnish, a composition sheet was produced in the same manner as in Example 1, and a copper foil adhesion evaluation test and a desmear resistance test were carried out. The adhesion strength was 0.89 kgf/cm, and the surface roughness was 330 nm [Comparative Example 3] "PHENOLITETD-2090" manufactured by MEK varnish (DIC) using phenol novolak resin, nonvolatile content of 60% by mass of phenolic hydroxyl equivalent of volatile matter 105) 31 parts of substituted triterpene phenolic phenolic resin A resin varnish was produced in the same manner as in Example 1 except that MEK varnish (DIC: PHENOLITELA-7052) of varnish resin was used in the same manner as in Example 1 except that the nonvolatile content was 60% by mass and the phenolic hydroxyl equivalent of the phenolic hydroxyl group was not changed to 120%. Resin varnish In the same manner as in Example 1, a composition sheet was prepared in the same manner as in Example 1, and the copper foil adhesion evaluation test and the desmear resistance test were carried out. The adhesion strength was 〇. .49kgf/cm, surface roughness of 585nm [Comparative Example 4] In addition to the use of naphtholaralkyl resin varnish (Dongdu Chemical Co., Ltd. "SN-485", non-volatile 60 chemical materials containing resin evaluation (Stock, not made) "Make-up line material containing resin evaluation MEK quality -34- 201127900 % 'non-volatile phenolic hydroxyl equivalent 215) 63 parts, phenol Phenolic novolac resin MEK varnish (DIC PHENOLITELA-705) 2) A resin varnish was produced in the same manner as in the Example except that the phenolic hydroxyl equivalent of 60% by mass of the phenolic hydroxyl group was 1 2 0). The content was 40% by mass based on the nonvolatile content of the resin varnish. Further, this resin varnish was used in the same manner as in Example 1 and subjected to a copper box adhesion evaluation test and a degumming test. The sealing strength was 〇.76 kgf/cm 'the surface roughness was as above. The results are shown in Table 1 below. A generation contains three (stock) system ’ 'non-volatile matter 1 The same is carried out in the inorganic cerium filling material Resin slag resistance evaluation 7 9nm. -35- 201127900 [Γ-I嗽1 Comparative Example 4 SN-485 2P4MHZ-PW On 0.76 Comparative Example 3 PHENOLITE TD-2090 2P4MHZ-PW 585 0.49 Comparative Example 2 PHENOLITELA-7052 TPP-S — 330 0.89 Comparative Example 1 1 397 1 J 0.75 Example 2 U-CAT SA 1 299 0.98 Example 1 2P4MHZ-PW 262 0.89 Surface roughness of phenol hardener hardening accelerator (nm) Peel strength of copper foil (kgf^cm) -36- 201127900 From Table 1 It is clear that the cured product of the resin composition of the embodiment has both copper wiring adhesion and desmear resistance, and a high-performance solder resist can be realized by the resin composition of the present invention. [Industrial Applicability] By containing a specific (A) epoxy resin, (B) a novolac type phenol resin containing a triterpene structure, and (C) an imidazole derivative and/or a cyclic anthracene derivative It is suitable as a resin composition for solder resists, which is excellent in adhesion to copper wiring and high desmear resistance. It is more profound to provide a solder resist containing a resin composition. The present application is based on a Japanese patent application No. 2009-1 67 1 64, the contents of which are incorporated herein by reference. -37-