TW201125060A - Cooling system for semiconductor manufacturing and testing processes - Google Patents

Cooling system for semiconductor manufacturing and testing processes Download PDF

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Publication number
TW201125060A
TW201125060A TW099126208A TW99126208A TW201125060A TW 201125060 A TW201125060 A TW 201125060A TW 099126208 A TW099126208 A TW 099126208A TW 99126208 A TW99126208 A TW 99126208A TW 201125060 A TW201125060 A TW 201125060A
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Taiwan
Prior art keywords
air
flow
cold
discharge pipe
cold air
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TW099126208A
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Chinese (zh)
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TWI458034B (en
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Hsiu-Ming Chang
Ching-Wen Chuang
Hsiang-Han Kung
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Advanced Semiconductor Eng
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
    • F25B9/04—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect using vortex effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A cooling system for providing a desired environment for a semiconductor manufacturing and/or testing processes includes a vortex unit and a semiconductor processing device is suitable for performing a semiconductor processing function. The vortex unit includes an air inlet for receiving compressed air, a hot air exhaust for outputting an air stream having a temperature greater than the received compressed air, a cool air exhaust for outputting an air stream having a temperature lower than the received compressed air, and a dry air tube enclosing the second air exhaust and connecting to the air compressor unit and the vortex unit. Since the dry air continuously flows surrounding the cold air tube, no water will be condensed around the cold air tube. Accordingly, no pollution and damages by the condensed water will happen to the manufactured or tested devices.

Description

ASE Confidential/Security A 201125060 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種冷卻系統，特別適用於半導 體製程或測試系統之渦流冷卻系統，其用來提供 一適合半導體製造與測試之環境溫度。 【先前技術】ASE Confidential/Security A 201125060 VI. Description of the Invention: [Technical Field] The present invention relates to a cooling system, particularly suitable for eddy current cooling systems of semiconductor processes or test systems, for providing a suitable semiconductor manufacturing and testing Ambient temperature. [Prior Art]

半導體元件之製造與測試是一項花費人力的工 作，因為製程的複雜性，高失效率可能會在製造 元件時發生，因此，此半導體元件必須在設定參 數下做廣泛的測試以確保運作正常，此外，半導 體元件測試不只是需要測試半導體之性能，也需 測試此性能在不同預期溫度下的運作狀況。The manufacture and testing of semiconductor components is a labor-intensive task. Because of the complexity of the process, high failure rates may occur during component manufacturing. Therefore, the semiconductor components must be extensively tested under set parameters to ensure proper operation. In addition, semiconductor component testing is not only required to test the performance of the semiconductor, but also to test the performance of this performance at different expected temperatures.

何體元件可能會在-非常大範圍之溫度狀態 操作，從極高溫度至低溫’卩及，其中使用者 望運作此半導體元件性能之任—預期溫度環境 因此：其會需要在此預期溫度範罔内來測試此 導體元件以確保其元件之耐用性。 譬如’傳統測試半導體元件的方法包含 * 二=來冷卻此待製造或待測試之彻元: 在製造或測試時所需之環境溫度，其卜屋縮空 0I473-TW/ASE2331 4 201125060 ^ ASE Confidential/Security a 氣被導入一渦流管，最後，冷空氣會排出到此待 測試與製造元件周圍來冷卻其環境溫度。 然而，因為其渦流管之空氣冷卻管與其環境溫度 的溫度差，水氣容易凝結在此空氣冷卻管之周 圍，而此凝結之水氣容易從此渦流管之空氣冷卻 管滴落到此待製造或待測試元件上，其容易造成 _ 此待測試或製造元件之失效，一般此渦流管常用 一隔熱材料來包覆在其外圍，但是水氣凝結仍容 易發生在此包覆之隔熱材料上，如此一來，即容 易對此半導體製造與測試元件造成汙染與損害。 【發明内容】 因此，本發明的目的是提供一種冷卻系統，並提 供此待測試與製造之半導體元件之環境溫度，其 _ 為一有效且低成本之方法，並且，不需要其他移 動配件、電氣裝置與冷媒，而不會有水氣凝結的 問題。 在此本發明中，一渦流管包含有：一接受壓縮空 氣之入口； 一熱空氣排氣管，其排氣溫度高於此 -接受之壓縮空氣；一冷空氣排氣管，其排氣溫度 低於此接收壓縮空氣；一乾空氣管接至此隔熱系 統，並且此乾空氣管内之乾空氣會至此渦流管之 01473-TW/ASE 2331 5What components may operate in a very wide range of temperature conditions, from very high temperatures to low temperatures, where the user wants to operate the performance of this semiconductor component - the expected temperature environment is therefore: it will need to be at this expected temperature range This conductor element is tested internally to ensure the durability of its components. For example, the traditional method of testing semiconductor components includes *2 = to cool the material to be manufactured or to be tested: the ambient temperature required for manufacturing or testing, the room is reduced to 0I473-TW/ASE2331 4 201125060 ^ ASE Confidential /Security a The gas is introduced into a vortex tube. Finally, cold air is discharged to the area to be tested and manufactured to cool the ambient temperature. However, because of the temperature difference between the air cooling tube of the vortex tube and its ambient temperature, the moisture easily condenses around the air cooling tube, and the condensed water vapor is easily dripped from the air cooling tube of the vortex tube to be manufactured or On the component to be tested, it is easy to cause failure of the component to be tested or manufactured. Generally, the vortex tube is usually coated with a heat insulating material on the periphery thereof, but moisture condensation is still likely to occur on the coated heat insulating material. As a result, it is easy to cause pollution and damage to the semiconductor manufacturing and test components. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a cooling system and to provide an ambient temperature of the semiconductor component to be tested and fabricated, which is an efficient and low cost method, and does not require other moving parts, electrical The device and the refrigerant, without the problem of moisture condensation. In the present invention, a vortex tube includes: an inlet for receiving compressed air; a hot air exhaust pipe having a discharge temperature higher than this-accepted compressed air; a cold air exhaust pipe having an exhaust temperature thereof Lower than this to receive compressed air; a dry air pipe is connected to the insulation system, and the dry air in the dry air pipe will reach the vortex tube 01473-TW/ASE 2331 5

201125060 , ^ ASE Confidential / Secunty A 冷空氣排氣管之排氣口排出，此冷空氣排氣管連 接至此半導體製程元件處，所以，此半導體製程 元件可從此渦流管接收一冷空氣，此冷空氣可提 供一適合此半導體製造與測試元件之環境溫度以 運作其半導體功能，此乾空氣管在此冷空氣排氣 ' 管周圍可作為一隔熱層用，所以在此冷空氣排出 ’ 管周圍不會有水氣凝結，如此一來，即不會對此 半導體製造與測試元件造成汙染與損害。 ® 【實施方式】 參考圖一，其顯示本發明用一渦流單元（1)來作為 冷卻系統用之示意圖，一渦流管（2)接收一壓縮空 氣（3)且將其分為一熱氣流（4)與一冷氣流（5)，此壓 縮空氣流（3)是從一壓縮機（12)或製程工廠中之一 中央壓縮空氣系統而來，此渦流管（2)中之圓筒渦# 流產生器（6)會產生一第一旋轉氣流，此第一旋轉 氣流沿著渦流管壁被送至此渦流管之尾端，此第 一旋轉氣流部分之圓周層氣流（7)經過一控制閥 。 (15)，會以熱空氣的形式排·出，此第一旋轉氣流之 / 其餘部分則從中央管路回流以形成一中央層氣流 (8)，此第一旋轉氣流之中央層氣流（8)以相對於此 圓周層氣流（7)反向且較慢的速度流動，其中，在 01473-TW/ASE 2331 201125060201125060, ^ ASE Confidential / Secunty A exhaust port of the cold air exhaust pipe, the cold air exhaust pipe is connected to the semiconductor process component, so the semiconductor process component can receive a cold air from the vortex tube, the cold air An ambient temperature suitable for the semiconductor fabrication and test component can be provided to operate its semiconductor function. The dry air pipe can be used as a thermal insulation layer around the cold air exhaust pipe, so that the cold air is discharged around the pipe. There will be moisture condensation, which will not cause pollution and damage to the semiconductor manufacturing and test components. ® [Embodiment] Referring to Figure 1, there is shown a schematic diagram of the present invention using a vortex unit (1) as a cooling system, a vortex tube (2) receiving a compressed air (3) and dividing it into a hot gas stream ( 4) with a cold air flow (5), the compressed air flow (3) is from a compressor (12) or a central compressed air system in the process plant, the cylindrical vortex in the vortex tube (2) The flow generator (6) generates a first swirling airflow that is sent along the wall of the vortex tube to the trailing end of the vortex tube. The circumferential layer airflow (7) of the first swirling airflow portion passes through a control valve. . (15), which is discharged in the form of hot air, and the remainder of the first swirling airflow is recirculated from the central duct to form a central layer airflow (8), the central layer airflow of the first swirling airflow (8) ) flowing at a slower and slower rate relative to the circumferential layer gas stream (7), wherein, at 01473-TW/ASE 2331 201125060

' 、 ASE Confidential /Security A 此令央層氣流（8)之熱會被傳送至此較快移動之圓 周層氣流(7)，如此，可降低此中央層氣流（8)之溫 度，此中央層氣流（8)流過此圓筒渦流產生器（6)並 從一冷氣流管（1〇)排出以形成一冷氣流（5)，為了 冷邠的目的，此冷空氣流（5)被導入至此半導體製-程或測試元件（9)上。其中，在此圓周層氣流⑺之· φ 角速度疋非吊慢而在此中央層氣流（8)中則是非常 !·夬疋此渦流官（2)的運作機制，在此圓周層氣流（乃 與此中央層氣流（8)之間的摩擦會使其降低相對的 角速度以使形成一完整的流體，如此會使内層的 Μ層氣流⑻的角速度降低，且會使外層_周. 層氣流（7)的角速度增加’結果就是此中央層氣流 ⑻會失去其動能並轉移至此圓周層氣流⑺内，此 • 中央層氣流（8)之溫度會降低，而此圓周層氣流（7) 之溫度會升高，如此一來，即可在此冷氣流管（1〇) 處形成該冷氣流（5)，此冷氣流管（10)在連接至一 位於半導體製程或測試設備上之夹具（11)上以用 來冷卻此半導體元件（9)之溫度。 - 參考圖-所示，本發明之渦流單元⑴之冷氣流管. (10)外部包覆了 —乾空氣管(14)，其内有一乾空氣 流（13)是從一壓縮機（12)或製程工廠中之一中央 01473-TW/ASE2331', ASE Confidential / Security A This causes the heat of the central layer airflow (8) to be transmitted to this faster moving circumferential layer airflow (7), thus reducing the temperature of the central layer airflow (8), this central layer airflow (8) flowing through the cylindrical vortex generator (6) and discharging from a cold gas flow tube (1 〇) to form a cold air flow (5), which is introduced to the cold chilling purpose Semiconductor manufacturing process or test component (9). Among them, in this circumferential layer airflow (7), the angular velocity of φ is not slow and is very high in this central layer airflow (8)! The operating mechanism of this vortex officer (2), in this circumferential layer airflow (with The friction between the central layer gas stream (8) causes it to reduce the relative angular velocity so that a complete fluid is formed, which reduces the angular velocity of the inner layer of the layered gas stream (8) and causes the outer layer to be layered. The angular velocity increases. The result is that the central layer airflow (8) loses its kinetic energy and is transferred to the circumferential layer airflow (7). The temperature of the central layer airflow (8) will decrease, and the temperature of the circumferential layer airflow (7) will rise. High, so that the cold gas flow (5) can be formed at the cold gas flow pipe (1), which is connected to a fixture (11) located on a semiconductor process or test equipment. For cooling the temperature of the semiconductor component (9) - as shown in the reference figure, the cold flow tube of the eddy current unit (1) of the present invention. (10) is externally covered with a dry air tube (14) having a stem therein Air flow (13) is one of a compressor (12) or process plant Central 01473-TW / ASE2331

201125060 ASE Confidential /Security A 壓縮空氣系統而來，此乾空氣流（13)之溫度介於此 熱氣流（4)與此冷氣流（5)之間，此乾空氣流（13)環 繞著此冷氣流管（10)外部流過，並從此冷氣流管 (10)處導出，因為此乾空氣流（13)環繞著此冷氣流 管（10)外部流過，故不會有水氣凝結在此冷氣流管 ~ (10)之外部以至於凝結滴落至此製造或測試區，因 · 此，不會有汙染與損害至此半導體製造與測試元 件（9)與此半導體製造與測試機台（19)，此在乾空 氣管（14)内之乾空氣流（13)即形成一良好之溫度 隔絕層，且此乾空氣管（14)可良好設計以至不會干 擾此冷氣流管（1 0)之溫度特性。 並且，位於此渦流管（2)之熱氣流出口之一控制閥 (1 5)可用來控制此冷氣流的比例，此導至此冷氣流 管（10)之渗氣流相對於此導入渦流管（2)之壓縮氣鲁 流是為該冷氣流的比例，如此，使用者藉由控制 此控制閥（1 5)可以控制出渦流管（2)之熱氣流（4)與 冷氣流（5)之流量，並且其可提供許多不同的比 例，調整此熱流管出口之熱氣口（17)之流量可以設 定此冷氣口（ 16)之流量與溫度，當此熱氣口（ 17)之 氣流溫度因不同接受之壓縮氣體壓力變化而升高 時，此冷氣口（ 1 6)之氣流溫度會下降，其原因是， 01473-TW/ASE 2331 8 201125060201125060 ASE Confidential /Security A Compressed air system, the temperature of the dry air stream (13) is between the hot air stream (4) and the cold air stream (5), the dry air stream (13) surrounds the air conditioner The flow tube (10) flows outside and is led out from the cold gas flow tube (10) because the dry air flow (13) flows around the outside of the cold gas flow tube (10), so that no moisture condensation occurs here. The outside of the cold air flow tube ~ (10) so that the condensation drops to the manufacturing or test area, because there is no pollution and damage to the semiconductor manufacturing and test components (9) and the semiconductor manufacturing and testing machine (19) The dry air flow (13) in the dry air pipe (14) forms a good temperature insulation layer, and the dry air pipe (14) is well designed so as not to interfere with the cold air pipe (10). Temperature characteristics. And a control valve (15) located at the outlet of the hot gas flow (2) of the vortex tube (2) can be used to control the proportion of the cold air flow, and the air flow leading to the cold air flow pipe (10) is introduced into the vortex tube relative to the vortex tube (2). The compressed gas flow is the ratio of the cold air flow, so that the user can control the flow of the hot air flow (4) and the cold air flow (5) of the vortex tube (2) by controlling the control valve (15). And it can provide many different ratios, and the flow rate of the hot gas port (17) at the outlet of the heat pipe can be adjusted to set the flow rate and temperature of the cold air port (16). When the air temperature of the hot air port (17) is different, the temperature is accepted. When the pressure of the compressed gas rises and rises, the temperature of the airflow of the cold air port (16) decreases, because 01473-TW/ASE 2331 8 201125060

' , ASE Confidential/Security A 當越多的熱氣流（4)從熱氣口（17)排出會使冷氣流 (5)的排出比例降低，此即降低此冷氣流的比例， 如此會更進一步降低此冷氣口（16)之冷氣流（5)溫 度，當越少的熱氣流（4)從熱氣口（17)排出會使冷 氣流（5)排出比例升高，此即提高此冷氣流的比. 例，此冷氣口（16)之冷氣流（5)溫度會降低的較. ^ 少。在另一方面，改變此送入之壓縮氣體（3)之流 量或壓力也會改變此冷氣流（5)與此熱氣流（4)之 溫度，增加此壓縮氣體（3)之壓力並維持較低的冷 氣流的比例可以使此冷氣流（5)之溫度降低更多且 此熱氣流（4)之溫度並不會升高太多，相反地，增 加此壓縮氣體（3)之壓力並維持較高的冷氣流的比 例可以使此冷氣流（5)之溫度降低較少且此熱氣流 # (4)之溫度會升高較多’如此具有相當大的操作彈 性。一控制器（1 8)連接至此壓縮機（12)與此半導體 製造與測試機台（19)以控制此冷卻系統之運作，此 控制閥（1 5)連接到在此半導體製造與測試機台ο” 上之一溫度感測為（20) ’如此連結可控制此控制閥· (15)。 " ' 然其並非 在不脫離 雖然本發明已以前述較佳實施例揭示 用以限定本發明’任何熟習此技藝者 01473-TW/ASE 2331' , ASE Confidential / Security A When more hot air ( 4 ) is discharged from the hot air port ( 17 ) , the discharge rate of the cold air flow ( 5 ) is reduced, which reduces the proportion of the cold air flow, which will further reduce this The cold air flow (5) of the cold air port (16), when less hot air (4) is discharged from the hot air port (17), the cold air flow (5) discharge ratio is increased, which increases the ratio of the cold air flow. For example, the cold air flow (5) of the cold air port (16) will decrease in temperature less than . On the other hand, changing the flow or pressure of the compressed gas (3) fed also changes the temperature of the cold gas stream (5) and the hot gas stream (4), increasing the pressure of the compressed gas (3) and maintaining the pressure. The ratio of the low cold gas flow can reduce the temperature of the cold gas stream (5) more and the temperature of the hot gas stream (4) does not rise too much. Conversely, the pressure of the compressed gas (3) is increased and maintained. A higher ratio of cold gas flow can cause the temperature of the cold gas stream (5) to decrease less and the temperature of the hot gas stream #(4) to increase more, thus having considerable operational flexibility. A controller (18) is connected to the compressor (12) and the semiconductor manufacturing and testing machine (19) to control the operation of the cooling system. The control valve (15) is connected to the semiconductor manufacturing and testing machine. ο" One of the upper temperature senses is (20) 'The connection is such that the control valve can be controlled. (15). "It is not without departing from the invention. The invention has been disclosed in the foregoing preferred embodiments to define the invention. 'Anyone familiar with this artist 01473-TW/ASE 2331

201125060 , ASE Confidential /Security A 本發明之精神和範圍内，當可作各種之更動與修 .改。因此本發明之保護範圍.當視後附之申請專利 範圍所界定者為準。 【圖式簡單說明】 圖一係本發明之用於半導體製造與測試製程之冷 卻系統示意圖。 【主要元件符號說明】 1 渦流單元 2 渦流管 3 壓縮空氣 4 熱氣流 5 冷氣流 6 .圓筒渦流產生器 7 圓周層氣流 8 中央層氣流 9 半導體製造與測試元件 10 冷氣流管 11 夾具 12 壓縮機 13 乾空氣流 14 乾空氣管 15 控制閥 16 冷氣口 17 熱氣口 18 控制器201125060, ASE Confidential / Security A Within the spirit and scope of the present invention, various changes and modifications can be made. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a cooling system for a semiconductor manufacturing and testing process of the present invention. [Main component symbol description] 1 eddy current unit 2 vortex tube 3 compressed air 4 hot air flow 5 cold air flow 6. cylindrical eddy current generator 7 circumferential layer air flow 8 central layer air flow 9 semiconductor manufacturing and test element 10 cold air flow tube 11 clamp 12 compression Machine 13 dry air flow 14 dry air tube 15 control valve 16 cold air port 17 hot air port 18 controller

19半導體製造與測試機台 20溫度感測器 01473-TW/ASE 2331 1019 Semiconductor Manufacturing and Testing Machine 20 Temperature Sensor 01473-TW/ASE 2331 10

Claims (1)

201125060 ASE Confidential /Security A 七、申請專利範圍： 1. 一種冷卻系統，特別是用於半導體製造與測試製 程之冷卻系統，其包括： 一渦流管單元，其從一空氣入口接受一壓縮空氣；‘ 一熱空氣排出管，其排出一溫度高於此壓縮空氣之 ^ 熱空氣流； 一冷空氣排出管，其排出一溫度低於此壓縮空氣之 冷空氣流， 一乾空氣管，其包覆於此冷空氣排出管外，其中有 一從此壓縮空氣分流之一乾空氣，此乾空氣在此乾 空氣管内沿著此冷空氣排出管外部流過； 一空氣壓縮系統，其提供此壓縮空氣至此渦流管單 元與此乾空氣管。 2. 如申請專利範圍第1項之冷卻系統，其中此满流 管單元更含有一控制閥，其位於此熱空氣排出管 之末端以控制此熱空氣流與此冷空氣流之流量 比例。 3. —種渦流冷卻系統，特別是用於半導體製造與測 試製程之冷卻系統，其包括： 01473-TW/ASE 2331 11 201125060 , 、 ASE Confidential /Security A 一渦流管單元，其從一空氣入口接受一壓縮空氣； 一熱空氣排出管，其排出一溫度高於此壓縮空氣之 熱空氣流； 一冷空氣排出管，其排出一溫度低於此壓縮空氣之 | 冷空氣流； _ 一乾空氣管，其包覆於此冷空氣排出管外，其中有 一從此壓縮空氣分流之一乾空氣，此乾空氣在此乾· 空氣管内沿著此冷空氣排出管外部流過； 4.如申請專利範圍第4項之渦流冷卻系統，其中此 渦流管單元更含有一控制閥，其位於此熱空氣排 出管之末端以控制此熱空氣流與此冷空氣流之 流量比例。 01473-TW/ASE2331 12201125060 ASE Confidential / Security A VII. Patent Application Range: 1. A cooling system, in particular for a semiconductor manufacturing and test process, comprising: a vortex tube unit that receives a compressed air from an air inlet; a hot air discharge pipe discharging a hot air flow having a temperature higher than the compressed air; a cold air discharge pipe discharging a cold air flow having a temperature lower than the compressed air, and a dry air pipe covering the same Outside the cold air discharge pipe, there is a dry air which is branched from the compressed air, and the dry air flows through the outside of the cold air discharge pipe in the dry air pipe; an air compression system supplies the compressed air to the vortex tube unit and This dry air tube. 2. The cooling system of claim 1, wherein the full flow unit further comprises a control valve located at an end of the hot air discharge pipe to control a flow ratio of the hot air flow to the cold air flow. 3. A vortex cooling system, in particular for a semiconductor manufacturing and test process, comprising: 01473-TW/ASE 2331 11 201125060, ASE Confidential / Security A vortex tube unit, which is received from an air inlet a compressed air; a hot air discharge pipe that discharges a hot air flow having a temperature higher than the compressed air; a cold air discharge pipe that discharges a cold air flow lower than the compressed air; _ a dry air pipe, Covering the outside of the cold air discharge pipe, there is a dry air which is branched from the compressed air, and the dry air flows through the outside of the cold air discharge pipe in the dry air pipe; 4. As claimed in the fourth item The vortex cooling system, wherein the vortex tube unit further comprises a control valve located at the end of the hot air discharge pipe to control the flow ratio of the hot air flow to the cold air flow. 01473-TW/ASE2331 12
TW099126208A 2010-01-15 2010-08-06 Cooling system for semiconductor manufacturing and testing processes TWI458034B (en)

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US20110173994A1 (en) 2011-07-21

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