TW201118961A - Linear deposition source - Google Patents

Abstract

A deposition source includes a crucible for containing deposition material and a body comprising a conductance channel. An input of the conductance channel is coupled to an output of the crucible. A heater heats the crucible so that the crucible evaporates the deposition material into the conductance channel. A heat shield comprising a plurality of heat resistant material layers is positioned around at least one of the heater and the body. A plurality of nozzles is coupled to an output of the conductance channel so that evaporated deposition material is transported from the crucible through the conductance channel to the plurality of nozzles where the evaporated deposition material is ejected from the plurality of nozzles to form a deposition flux.

Description

201118961 VI. Description of the Invention: [Technical Field to Which the Invention pertains] This teaching is generally directed to equipment and methods for the flux of raw material vapors for organizational purposes only, and is not the subject matter described in this application. [Prior Art] A deposition method for depositing on a substrate. The subsections used herein are to be construed as limiting the application in any way to the continuation of the application of the U.S. Patent Application Serial No. 12/628,189, filed on November 30, 2009. The deposition source is its title, and the US Provisional Patent Application No. 61/, entitled "Deposition Source for Co-deposited Copper 'Indium, and Gallium", and related methods, dated February 27, 2009, U.S. Provisional Application No. 61/138,932, entitled "Deposition Sources, Systems, and Related Methods for Co-Deposition of Copper, Indium, and Gallium", No. 156,348, and December 18, 2008, is preferred. The entire specification of U.S. Patent Application Serial No. 12/628,189, U.S. Provisional Patent Application Serial No. 61/156,348, and U.S. Provisional Application Serial No. 61/138,932 is incorporated herein by reference. Large-area substrate deposition systems have been used for many years to process elastic mesh substrates and rigid panel substrates for a wide variety of substrate materials. Many conventional systems are designed to handle plastic mesh substrates and rigid panels. Glass substrate. The mesh substrate or rigid panel passes directly over the linear deposition source. A conventional linear deposition source suitable for evaporating a material on a mesh substrate or a rigid panel substrate comprises a boat-shaped crucible, typically Formed by the refractory material used to hold the source material of 201118961. The vapor outlet tube simultaneously spaces the vapors. One or more are linearly arranged. The stack is placed at the vapor outlet for use as a vapor outlet - Evaporation space and use as a steam outlet opening system along the source [Invention content] You 丨,, 立Μ Μ 4 ^ 驭 Specific implementation 4 J 4th on the 1st / fei丨ήί·々 A. «j-· The special features, structures, or features described in the embodiment of the plant are included in at least the teachings of the teachings. In the various positions in the description, the '' The expressions of the phrases in the embodiments are not necessarily all referring to the same specific embodiments. It should be understood that the individual steps of the method of the present teachings can be performed in any order and/or as long as the teachings remain different. Being applied Furthermore, the device and method of the teachings may include any number or all of the specific embodiments of the description as long as the teachings can maintain the operation. The teachings are described in more detail with reference to exemplary embodiments thereof. The present teachings are as shown in the drawings. Although the teachings are described in conjunction with various specific embodiments and examples, the description is not intended to limit the teachings to the specific embodiments. Instead, the teachings include various alternatives, modifications, and Equivalents are known to those of ordinary skill in the art, and those of ordinary skill in the art having the right to use the teachings herein will recognize additional variations within the scope of the disclosure. Modifications, specific embodiments, and other fields of use, as described herein. This teaching is generally directed to apparatus and methods for producing a flux of deposition source material vapor for deposition on a substrate. Some aspects of this teaching relate to 201118961: A linear deposition source used to produce a flux of vapor deposited from a source material deposited on a mesh substrate, a rigid panel substrate, or another elongated workpiece. Other aspects of the present teachings relate to linear deposition sources suitable for producing a flux of deposition source material vapor for deposition on a substrate holder that supports a plurality of conventional substrates, such as semiconductor substrates. In many specific embodiments, which are not taught, the methods and apparatus are related to deposition by evaporation. As used herein, "evaporation," means converting a 6-source material into a vapor, and includes several techniques normally used in the art, such as vaporization, evaporation, and sublimation. The deposition source material can be in any material state. In the specific embodiment, the teaching apparatus and method are used to simultaneously evaporate two or more different materials to a substrate, such as a mesh substrate or a rigid substrate. On a panel substrate, in some specific examples, the teachings and methods of the present teachings are used to evaporate a single material onto a substrate, such as a mesh substrate or a rigid panel substrate. Use in a majority or partitioned cassette. A single deposition material will increase repeatability and will increase the flux ratio. One application of the present teachings relates to methods and apparatus for simultaneously depositing copper, indium, and gallium onto a mesh substrate or a rigid panel substrate. A compound (c I g compound) in which gallium replaces all or part of indium indium and copper indium is a compound known as copper indium gallium diselenide (CIGS compound). CIGS compounds are generally made For the manufacture of photovoltaic cells. In particular, CIGS compounds are generally used as absorbers in thin film solar cells. These CIGS compounds have a direct band gap that allows solar radiation in the visible region of the electromagnetic spectrum. The strong absorption. CIGS photovoltaic cells have been shown in the 6 5 201118961 model to have high conversion efficiency and good stability, such as with other types of absorber compounds, such as cadmium telluride (CdTe) and amorphous germanium. The commonly used photovoltaic cells are used for comparison. The CIGS absorber layer is typically a p-type compound semiconductor layer with good crystallinity. Good crystallinity is generally required # to achieve the needs of high-efficiency photovoltaic cell operation. The desired charge transport properties. In fact, the CIGS absorber layer must be at least partially crystallized in order to achieve a highly efficient photovoltaic operation. The crystallized c丨G s compound has a crystallographic = structure, which is considered to be used. The deposition temperature of the CIGS compound is characterized by the presence of chalcopyrite crystals or sphalerite crystals. CIGS compounds can be Techniques are formed. A method for forming a compound uses a chemical precursor. The chemical precursor is deposited in a film and then subsequently annealed to form the desired CIGS layer. When the precursor material is deposited at a low temperature The resulting CIGS film is amorphous or only weakly crystallized. The CIGS film is then annealed at elevated temperatures to improve the crystallization of the CIGS compound to provide the desired charge transport properties. However, in the elevated temperature required to cause local crystallization of the CIGS film, the selenium in the deposited film is more volatile than other elements. Therefore, when the precursor layer is annealed to improve crystallization and provide Selenium is usually added in the desired composition and stoichiometric amount of CIGS compound. This formation of the IGS film compound method is quite time consuming and requires a large amount of selenium in the vapor phase, which increases the manufacturing cost. Another method for forming a CIGS compound uses a vacuum evaporation method. Compared with 7 201118961 CIGS photovoltaic cells made of precursor materials, CIGS photovoltaic cells manufactured by simultaneous evaporation can have high photovoltaic conversion efficiency. In this method, copper, indium, gallium, and selenium are simultaneously evaporated onto a substrate. Simultaneous evaporation allows for precise control of the stoichiometry of the film and allows for fractionation of the components used in the light absorbing layer of the film. Therefore, simultaneous evaporation can be accurately used to tailor the band gap to achieve optimal photovoltaic performance. However, the simultaneous evaporation of copper, indium, gallium, and antimony can be a process technology that is difficult to use on an industrial scale because it is difficult to uniformly evaporate materials over a large surface area. One aspect of the teachings is to provide a deposition source, system, and method of operating such deposition sources and systems to efficiently and controllably provide a majority of devices for use in a wide variety of devices, such as CIGS photovoltaic cells. Evaporate the source material. Another aspect of the present teachings provides a deposition source, system, and method of operating the T deposition source and system to efficiently and controllably provide a device for use in a luminescent type, such as an organic light emitting diode (OLED). The early manufacture of the device - the evaporation of the source material. Those having ordinary skill in the art of the layer should understand that although the teachings of the present teachings are related to the manufacture of photovoltaic cells and OLED devices, the teachings in this disclosure apply to any household that can use evaporated materials. The device manufactured by the other - (4). 1A illustrates a cross-sectional view of a linear deposition source 100 according to the present teachings. FIG. 1 is a linear deposition source comprising a linear configuration (4) to the plurality of conduction channels 104 and then lightly coupled to a plurality of nozzles 106. The disaster is 1〇2. Each of the retannings 102 includes an evaporation source material which may be the same or

201118961 Different source materials. The input of each of the plurality of conduction channels 104 is coupled to the output of the individual ones of the plurality of turns 102. In many specific embodiments, when the vaporized material is being transported in the plurality of conductive channels 1, the plurality of conductive channels 丨〇4 are designed such that they are not intermixed by the evaporating material. A housing 208 accommodates the plurality of rims 2 and the outer casing 1 〇 8 is formed of stainless steel or a similar material. In some embodiments, the fluid cooling passageway is positioned along the outer casing 108. The outer casing 8 also includes a sealing flange 将该 that attaches the outer casing 108 to a vacuum chamber (not shown). One feature of the linear deposition source 100 is that the clamps are on the outside of the vacuum chamber, and thus they are easily refilled and serviced, thereby increasing usability. A body 丨丨 2 including the plurality of conductive passages 104 and the plurality of nozzles 6 extends through the sealing flange 1 1 该 of the outer casing 108. In some embodiments, the fluid cooling passage is positioned along the body 11 2 . In the embodiment illustrated in FIG. 1A, the linear deposition source includes three turns 102 in a linear configuration such that the inputs of the individual conductive channels of the three conductive channels ι4 are coupled to the three The output of the individual 11 02. The nozzles 106 are positioned at a plurality of locations along each of the plurality of conductive channels 丨〇4. However, because Figure 1A is a cross-sectional view, only the intermediate conductive channel 104, and half of the nozzles 1〇6 are shown in Figure 1A. Those of ordinary skill in the art will appreciate that a wide variety of models can be used. For example, at least a portion of the plurality of turns can include at least one vortex formed on the inside of another cause as described with respect to FIG. The plural number of accidents 201118961 1 0 2 includes evaporation materials suitable for use in the manufacturing process of this special + by 丨 '. In the multi-specific embodiment, the complex number +a '(four) chain... 〇2 each includes - a different evaporating material. ·#. The three exhausted mothers may comprise one of copper, indium, and gallium to provide a material for the etched, metamorphic simultaneous evaporation of the functional absorbing layer of the CIGS-based photovoltaic device. Clip the ten claw source. However, in some embodiments, at least two of the plurality of turns comprise the same deposited material. For example, each of the three disasters can contain ^, 匕3 for a single material system used for the joints of the LED device. One or more hanging heaters 丨14 are broken into heat and communicate with the plurality 坩埚102. The i# 加加舞3|丨丨41* device 114 is designed and positioned to increase the temperature of the complex smash (10) such that each of the (four) (four) 1 〇 2 evaporates its = source material into the plural Pass (4) Road (10) - Individual Conduction (4) Force: Heater 1M is required to heat the evaporation source material to: & This: 坩埚 heater can be made of graphite, tantalum carbide, refractory, or other high melting point What is the material? The s-specific heater 114 can be a single-heater or can be a multiple heater. For example, in each of the plural (four) heaters, each of the heaters can be individually controlled, so that the individual 坩彳μ + - 4 Ή π plus the mature state of the violation of the plurality of heaters is the same as the mother of the complex number 021 02 Individuals are hot and connected. These heaters can be any type of heater. For example, "the two-cause heater m can be an impedance heater, as shown in Figure VIII. A specific embodiment of the two-impedance heater is described in relation to Figure 6a". The 坩埚 heater 丨 14 is also .. οβ e j J horse multi-type RF induction plus ... and / or one of the infrared heaters. % hate many specific examples,

10 201118961 All such sweet vortex heaters i 14 are heaters of the same type. However, in some embodiments, two or more of the linked heaters 114 are different types of heaters having different thermal properties for evaporating materials of different deposition sources. The heater (m) heater m or a separate conduction channel heater is positioned in thermal communication with at least one of the plurality of conduction channels 1〇4 such that the temperature of each of the plurality of conduction channels 104 is raised above the specific conduction channel Above the condensation point of the deposition source material. Conduction channel heaters are described in relation to Figures 7A, 7B and 7C. Those of ordinary skill in the art will appreciate that a multitude of devices can be used to heat the plurality of conductive channels 104, such as impedance heaters, RF induction heaters, and/or infrared heaters. The conductive channel heater can be a single heater or can be a plurality of heaters. More than one type of heater can be used. In one embodiment, the conductive channel heater has the ability to control the temperature of one of the plurality of conductive channels 104 relative to the plurality of conductive channels 1〇4. 1B illustrates a cross-sectional perspective view of a linear deposition source 1 根据 1 in accordance with the present teachings. The mysterical linear deposition source 110 includes a linear configuration coupled to the single conduction channel 104' and then coupled to a plurality of nozzles 1 The plural of 6 is 〇1〇2. The linear deposition source 1〇1 is similar to the linear deposition source 1 〇〇 ' described with respect to Figure 1A except that the body 112 includes only one conduction channel 1〇4. Each of the plurality of complexes 102 includes an evaporation source material which may be the same or different source materials. The input of the conduction port Q4 is connected to the output of the complex port 102. The plurality of nozzles 100 extend through the (four) flange 11G of the outer casing 108. In the embodiment of the embodiment shown in Figure 1B, the linear 11 201118961 ' makes the conduction channel. The nozzles 106 deposition source 100 includes three turns of a linear configuration. The input of the input coupled to the three turns 02 is positioned at a plurality of positions along the conductive path 1 〇4. The crucible heater 4 is used to increase the temperature of the three crucibles 1, so that the crucible evaporates the deposition material into the conduction channel. The fault heaters m or a separate conductive channel heater are positioned such that the conductive passages 104 are in thermal communication such that the temperature of the conductive passages 1〇4 is raised above the deposition source material passing through the conductive passages 104. Above the condensation point. The conduction channel heater is described with respect to Figures 7A, 76 and 7C. Those of ordinary skill in the art will appreciate that a wide variety of heaters can be used to heat the conductive pathways 104, such as impedance heaters, RF induction heaters, and/or infrared heaters. The input of each of the plurality of nozzles 106 is coupled to the output of the conductive channel 1-4, such that the evaporated deposition material is transported by the plurality 坩埚1〇2 through the conductive channel ΠΜ to the plurality of nozzles (10), where The evaporated deposition material is ejected by the plurality of nozzles 106 to form a deposition flux. Figure 2A illustrates a cross-sectional view of the linear deposition source 1A described with respect to Figures 1A & 1B, and the plurality of nozzles 106 are positioned such that they evaporate the deposited material in the upward direction. The characteristic of the linear deposition source of the present teachings is that the plurality of nozzles 106 can be positioned in any orientation relative to the plurality of (four) coffee. The heater for the plurality of conduction channels 1〇4 or for the single conduction channel 1() 4 is designed to prevent condensation of the evaporated deposition source material independently of the position of the plurality of squirts (10). Figure 2B illustrates a cross-sectional view of a linear deposition source 15 根据 according to the present teachings, and the plurality of nozzles 106 are positioned such that they evaporate the deposited material in a downward direction. The linear deposition source 15 of Figure 2B is similar to the linear deposition sources 1 〇〇 and 1 〇 1 described with respect to Figure 2A. However, the plurality of nozzles 106 are positioned such that their exit apertures face downwardly in the direction of the complex 坩埚1〇2. 2C illustrates a cross-sectional view of a linear deposition source 152 in accordance with the present teachings 'including the body 11 2' including a plurality of nozzles 106 positioned in an upright orientation. The linear deposition source 152 is similar to that described with respect to FIG. 2a. The linear deposition source 100 and UH, except that the linear deposition source 152 includes an angled coupling 154, the angled drain #154 changes the orientation of the body from the sealing flange 110 relative to the normal direction. Those skilled in the art will appreciate that the angled consumable 154 can be oriented at any angle relative to the normal direction of the sealing flange 110. (4) The body 112, such a feature of the linear deposition source includes The plurality of nozzles 1〇6: the body"2' can be positioned relative to the housing ι8 including the plurality of hooks 1〇2. For the complex conduction conduction ::::..."---: 2:7 = the other - linear one cross section mouth 106. The linear,. Positioning in the erect direction of the ridge number of the effusion source 丨 52 The source 156 is similar to the line (5) described with respect to Figure 2C, except that the linear deposition source 156 includes a T-shaped tang rim 110 The horse piece 158 changes the orientation of the body 112" from the direction of the sealing cam. In the embodiment shown on the two sides of the concrete surface 13 201118961 1 5 8 shown in FIG. 2D, the body i 12 is in the upright direction. Figure 3 illustrates a cross-sectional perspective view of a linear deposition source in accordance with the present teachings. The linear deposition source includes a single 坩埚2〇 in a linear configuration (4) to a plurality of conduction channels 204 and then coupled to the plurality of nozzles 2〇6. 2. The linear deposition source 2GG is similar to the linear deposition source 100 described with respect to Figures 2 and 2, however, the linear deposition source 200 includes only one catastrophe 202. The single-time error 202 is positioned at the outer shell +, as described with respect to Figure i. The single crucible 202 can have a single compartment that is designed for a type of deposition source material. This enthalpy coupled to the plurality of conduction channels 204 will have a relatively high deposition flux throughput. Alternatively, the single raft 202 can have a plurality of partitions 210 that partially isolate the segments of the 坩埚2〇2, where the size of each of the partially isolated segments is designed to locate a plurality of One of the source materials. The plurality of deposition source materials may be the same material or may be different materials. Using the same deposition source material in each of the partially isolated sections will increase repeatability and will increase the flux ratio. In the particular embodiment where the single enhancement 202 includes a plurality of partially isolated segments, the input of each of the plurality of conductive channels 204 is positioned to immediately follow one of the plurality of partially isolated segments. The heater 212 is positioned in thermal communication with the single hanger 202. The heater 2 12 increases the temperature of the crucible 2〇2 such that the crucible evaporates the at least one deposition material into the plurality of conduction channels 204 or into the single conduction channel 204'. The heater 2 1 2 or the second heater is positioned to be in thermal communication with at least one of the plurality of 14 201118961 conductive channels 204 to conduct a heat conduction to the plurality of conduction channels 2〇4' The temperature of the ramp 2, the channel 204 or the single conducting channel 2041 is such that the evaporated material does not condense. Some of the heaters 2 1 2 can raise the temperature of at least one of the plurality of conductive channels 204 relative to the plurality of conductive channels that are forced to pass 2U4. , h, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ▲ ^ "In the embodiment, the heat shield 214 is designed and positioned to control the temperature of the raft 202 relative to the other section of the 坩埚 2 〇 2 202. Also presented here &gt 1*訾, In the specific embodiment, the heat shield 2 1 4 is designed and positioned so as to provide at least a 佃偟 channel of the plurality of conductive channels 204. At least partial thermal isolation of the s conductive channels such that different temperatures can be maintained in at least two of the conductive channels of the plurality of conductive materials 204. In this embodiment, the plurality of conductive channels 204 can be The insulating material having different thermal properties is insulated. The plurality of nozzles 206 are coupled to the plurality of conductive channels 2〇4. The evaporated deposition material is transported by the single hanging channel 2〇2 through the plurality of conductive channels 2〇4 & to 4 after nozzles 206' where the evaporated deposition material is ejected from the plurality of nozzles 206 to form a deposition flux. Figure 3B illustrates a cross section of a linear deposition source 2〇〇 according to the present teachings. Perspective view, the linear deposition source 2〇〇 includes a linear structure Connected to a single conduction pass = 2〇4 and then lightly connected to a single (four) 2〇2 in the complex nozzle. The linear deposition source, 201 is similar to the linear deposition source 15 201118961 200 described with respect to Figure 3A. However, the linearity The deposition source 201 includes only one conduction channel. The linear deposition source of the present teachings is suitable for evaporating one or more different deposition sources on large-area workpieces, such as mesh substrates and rigid panel substrates: linear deposition The linear geometry of the sources makes them suitable for processing wide and large-area workpieces, such as mesh mold substrates used for photovoltaic cells and rigid panel substrates, because the linear deposition source can be provided over a large area of winter Efficient and highly controllable evaporation materials. A feature of the linear deposition sources of the present teachings is that they are quite small for each of the plurality of deposition sources and for each of the plurality of conduction channels: another of the linear deposition sources of the present teachings One feature is that they use a common:: heat exchanger and shared insulation board material' which improves the performance metrics of multi-devices, such as size and equipment. And the operating cost. In Fig. 4, a cross-sectional perspective view of a stacking fault for the linear deposition source of the present teaching is illustrated. The hanging system is formed of a two-type material. The hanging bag = another At least one (four) of the inner side of the catastrophe. In the specific embodiment shown in Fig. 4, the hanging sill includes -1 sleeve on the outer _ taking the inner 坩埚 302 inside. In this design, the 'type 2 material Can be used to hold the deposited material in order to improve the performance of the crash. In his specific embodiment, 'at least - the tether is nested on at least two other sides. For example, in one embodiment Forming one or more of the plurality 坩埚1〇2 (Fig. and 1.B) or (4) 202 (Fig. and 3B) having an internal 坩埚3〇2 formed by pyrolytic boron nitride and by graphite The outer crucible 304 is formed. In this embodiment, the internal source material is formed by pyrolytic nitridation. Pyrolytic boron nitride - non-porous, highly non-living. In addition, 埶 melting point, good cup, and, 'boron nitride have - very good, ...: and excellent thermal shock properties. These properties n # (4) σ heart directly accommodates most of the evaporation source ..., and, the pyrolytic boron nitride is particularly brittle and damaged. Ϋιn 』 and this is easy for you: the oxides and metal oxides can also be used in the interior (four) material factory μ external disasters 304 series is formed by a material, such as graphite, which is: long, but still able to heat operating. The more durable material protects the 埶 nitriding butterfly from damage. In another embodiment, the inner raft is formed of quartz and the outer lanthanum is formed of alumina. —Shiyang. The combination of niobium and an aluminum outer crucible has a relatively high performance' and is quite inexpensive. Figure 5A illustrates a perspective view of a portion of a linear deposition source 1 (10) in accordance with the present teachings showing two conductive channels 1G4 coupled to three of the housings 108. The input Π8 of each of the three conduction channels 1G4 is coupled to the output of the individual 坩埚1〇2. The three conductive channels 104 are designed such that when the evaporated material is being transported through the plurality of conductive passes 1 1 , there is no evaporated material from any of the three materials 1 () 2 Significant intermixing. In many deposition processes, the important enthalpy generally prevents intermixing of the deposited materials to prevent two or more deposited materials from reacting before the deposited material reaches the surface of the substrate being processed. 5B illustrates a top plan view of a portion of a linear deposition source 110 in accordance with the present teachings, showing a single conduction channel 104 coupled to three stacks 1 〇 2 17 2011 18961 in the housing 〇8, . The wheel ι 8 of the conduction channel 1〇4 is lightly connected to the output of each of the three stacking faults 102, as shown in the figure and (7), or is connected to the single-kun 202 Figure 6A is a perspective view of the linear (four) source impedance heater 400 of the present teachings, showing the location of the hoisted heater. ! The inside and three sides. In various embodiments, the stacking heater 400 can be secured to the outer casing 1 8 (in the figure, or removably attached to the outer casing. The slamming heater is completely around the bottom of the (four) ι〇2 And a plurality of impedance heating elements 4 〇 2 are included on the side. In the specific embodiment shown in FIG. 6A, the impedance heating elements 4 〇 2 are plural Ρ two open graphite bus bars, the graphite confluence The bar of the bar boulder 2 is supported by the rods. The graphite bars are arranged to be structurally connected together and electrically insulated from the graphite bus bars. The impedance heating elements are 2 may include a serpentine graphite wire positioned between opposite ends of the demon elements to be fed (4) (4): a wide source of 100, a casing 108 of 100 to connect the graphite bus bars to the power supply (not shown) The graphite bus bar bars 402 include screws 406 that securely attach the wires. Fig. 6B is used to heat each of the plurality of faults heaters - the perspective view of the outside (the figure of the figure shown in Fig. 6 is similar to that in Fig. 6A) The display shows the ':: all four sides of the heater. ～, 4, Figure 7A is a side view of a linear deposition source 1 根据 according to the teachings, 18 201118961 is shown to heat the complex conduction channel The conductive channel heater, the drawing page shows a perspective view of the rod 13 包括 including the conductive channel heaters. Figure % illustrates - a perspective view of the linear deposition source 丨 (8) according to the present teachings. - joining the ends of the rods 130 to the coupling members 132 of the body ι 2. Referring to Figures 1A, IB, 7A, 7B, and %, the rods 13 are tied in the longitudinal direction of the body H2 The length along the length of the conductive channels 1〇4 is clamped to the conductive channels 1() 4. The rods i3Q can be formed of any type of high temperature material, such as graphite, carbon cut, fire resistant. Materials, or other materials of very high melting point. The rods 13'' are electrically connected to the output of a power source (not shown) that produces a first-rate current through the rods 13 thereby increasing the rods Temperature of 13G. The rod i3g can be used with a spring or wire bundle that provides sufficient motion. Electrically connected to the output of the power supply to allow thermal expansion of the rods #13() during the operation; in these rods, heat is generated by the heat generated by the current from the 5H power source. The conduction channels 1G4' thereby raise the temperature of the conduction channels 1G4 such that the evaporated source material transported through the "Hyper number conduction path i Q4" does not condense. Figure 7A also shows that each segment rod 3 The plurality of coupling members 132 are attached together. In some embodiments, the length of the body " 2 is so long that the majority of the rods 130 are coupled to the system to be more cost effective and reliable. And easier to manufacture. Those of ordinary skill in the art will appreciate that there is a "small-type light fitting" which can be used to join a plurality of segment rods together. For example, a screw-coupled coupling can be used to connect the two-stage boring bar. The light fitting 132 is provided through the entire length of the rods 13G by 19,118,961 degrees - a continuous electrical connection having a relatively constant impedance. Figure 8 illustrates a frame 500 (Figure 1) of a moon body 112 that includes a telescoping rod 502. Referring to Figures 1A, 1R, 7A „ ^ B 7A, and 8, the plurality of conductive channels 104 are removed from the space inside the body 50 1 of the body 1 1 2 and ▲ Rod 502. The telescoping; ???, 502 is sometimes used because the body 112 undergoes significant thermal expansion and contraction during normal operation. The thermal expansion coefficients of the rods 130 and the plurality of conductive passages 1 可 4 may be The thermal expansion coefficient of the rack and other components in the body 112 is significantly different. In addition, the rack 500 and other components in the Xuantai type, such as the stem U0 and the plurality of conductive passages There may be a significant temperature difference between 1 and 4 such that it is intended to cause the frame 500 to extend from the component in the body 2, such as the plurality of conductive channels 1〇4 and the rods (10). ' and shrinkage. The telescopic kneading λ λ and zhong 衿 500 series shown in Fig. 8 can be used in the frame: ... the specific embodiment shown in Fig. 8 to the frame 5. = two 504 or other types of fastener attachment knot section _ extended, one borrowed two;: retracted rod 502 is extended Thereby, a space for the components in the body 112 is established in the rack_, and the components in the body 112 are at a faster rate than the body. Another option is that when the ...:: piece is shrinking faster than the frame 500, the ", 506 fold" is thereby reduced to the machine: the space of the contracting body U2. Fig. 9 is a cross-sectional perspective view of the plurality of snails 20 201118961 102 (Figs. 1A and 1B) for a linear deposition source according to the present teachings and a heat shield for the plurality of conduction channels 1-4. Figure 9B is a complete perspective view of the heat shield 6 〇〇 shown in Figure 9A. Those of ordinary skill in the art will appreciate that the heat shield 600 can be made from any of a wide variety of insulating materials. For example, in the specific embodiment, the heat insulation & is formed of a carbon fiber carbon composite material. Figure 9C illustrates a corner cross-sectional view of a particular embodiment of a heat shield 65 根据 in accordance with the present invention. Only the top and one side surfaces are shown in Figure 9c to more easily illustrate the various layers in the heat shield 650. In some embodiments, the outer layer 650 on the top and bottom surfaces and the side surfaces are in various embodiments, and the outer layer 652 can be hard and durable. And can have a relatively high-order corrosion protection. - a reflective material may be deposited on the outer surface of at least some of the outer layers 652 to improve the thermal properties of the heat shield 65. In a particular embodiment, the outer layer 652 is a carbon fiber board. For example, the outer layer 652 can be a carbon fiber sheet having a thickness that is in the range of (10) ^ 0.08 inches. In some embodiments, the carbon fiber is coated on at least a surface with a conductive material, such as a metal carbon, and the heat shield 650 is also on the top and bottom surfaces and the side surfaces. A plurality of heat resistant material layers 654 are included. In some embodiments, the thermal material layer 654 can be a heat resistant tile. For example, there may be more than five, more than ten, or more than two (four) layers of thermal material 654 positioned on the bottom, and/or side surfaces of the heat shield (4). In some embodiments: Example 21 201118961, at least a portion of the plurality of heat resistant material layers 654 have a thickness in the range of from 吋 1 吋 to 0.020 吋 thick. In some embodiments, a reflective material is clamped onto at least one outer surface of at least one of the layers 650 of heat resistant material layers. In some embodiments, the layer of heat resistant material 654 is one of various types of refractory metal foil layers. Also in some embodiments t, the layers of heat resistant material are layers of graphite material. A very wide variety of layers of graphite material can be used. For example, the layers of graphite material can be formed from Graf〇il or any other type of elastic graphite material. The elastic graphite material is made from pure, natural graphite flakes. The Grafoil system is well suited for use as an insulating sheet because it is resistant to heat, fire, corrosion and chemicals. In some embodiments, the heat shield 65 includes a rigid material 656 positioned between a portion of the plurality of heat resistant material layers 654. The stiff material 656 is typically thicker than the layers of heat resistant material 654. The hard material 656 provides mechanical strength and corrosion protection to the heat shield. A very wide variety of materials are used which may be the same or different from the hard material positioned on the plurality of heat resistant material layers 654 < at least one & outer surface. For example, the hard material can be one of many types of carbon fiber sheets, such as a carbon fiber cloth having a carbon matrix, which is generally referred to as CFC or slave in the work - in the embodiment, the carbon fiber sheet has - Thickness in the range of 〇〇2 and 〇·08忖. In some embodiments, the carbon's cut-off plate is (at) at least - surface--conductive material, such as a metal slain. In addition, the hard material may be a non-fiber reinforced graphite 22 201118961. Thus, in each (four) body embodiment, the hard materials 652, 656 may be clamped outside the heat resistant material layer 654 and/or For example, in a particular embodiment, the thermal insulation 65° includes top and bottom surfaces including the following layers: (1) at least one layer of a hard material coated with a refractory pottery material, such as One or two layers coated with carbonized sharp carbon fiber sheets or similar materials; (2) multiple refractory metal foils and/or stone black layers 'such as 2-20 refractory metal box sheets and/or graphite layers; (3) hard Material: at least - layer 'such as '- or two-layer carbon fiber board; (4) a plurality of refractory metal foil and / or graphite layer 'such as ' 2 2 〇 refractory metal foil and / or graphite layer, and (5) At least one layer of a hard material coated with a refractory ceramic material is, for example, or coated with a carbonized sharp carbon fiber sheet or the like. Referring to Figures IB, IB, 9A-9C, a first section 6〇2 of the heat shield 600 is positioned next to each of the plurality of turns 102 to provide at least partial thermal isolation of each of the plurality of turns 102 . The first section 602 of the heat shield 6 隔热 insulates the individual 坩埚1〇2 such that, if desired, significantly different temperatures can be maintained during processing. For some deposition processes, it is important to maintain significantly different temperatures because each of the plurality of crucibles 102 can then be heated to its optimum temperature for the particular deposition source material. Heating the crucibles 102 to their optimum temperature for the particular deposition source material reduces negative heating effects, such as sputtering of deposited materials. Moreover, heating the 坩埚1〇2 to its optimum temperature for the particular deposition source material can significantly reduce the operating cost of the deposition source. In various other embodiments, the first section 602 of the heat shield 600 includes a plurality of separate heat shields, wherein the plurality of separate heat shields 6 〇〇 23 2011 18961 are surrounded by individual heat shields.丨02 individual 坩埚. Each of the plurality of discrete insulation panels 600 can be the same or can be a different insulation panel. For example, the crucible used to heat the higher temperature deposition source material may be formed of different or thicker insulating materials having different thermal properties. The second section 6〇4 of the heat shield 600 is positioned next to the plurality of conductive channels 104 to provide at least partial thermal isolation of the plurality of conductive channels 1〇4 from the plurality of turns 102. Each of the plurality of conductive channels 1〇4 can be insulated by a separate insulating panel, or a single insulating panel can be used. In some embodiments, the second section 6〇4 of the heat shield 6 is positioned to provide local thermal isolation of at least one of the plurality of conductive channels 104 relative to at least one other of the conductive channels. In other words, the design and positioning of the second section 604 of the insulating panel 6 can be selected to allow for different operating temperatures of at least one of the plurality of conductive channels relative to at least one other of the plurality of conductive channels 1〇4. . In these embodiments, at least two of the plurality of conductive channels ι4 can be thermally insulated by an insulating material having a thermal property of + $. For example, at least two of the plurality of conductive channels of the plurality of conductive channels 1〇4 can be insulated by different insulating materials, different insulating sheets, and different proximity of the insulating materials to the particular conductive channels. The insulation panel 600 is exposed to very high temperatures during normal operation. Some of the heat shields according to the present teachings are formed with at least one surface formed by a low emissivity material or having a low emissivity coating that reduces the emission of heat radiation. For example, the interior or exterior surface of the insulation & 6 can be coated with a low emissivity coating that reduces heat transfer or any other type of coating. Any such coating is typically designed to maintain a constant emissivity throughout the life of the linear deposition source. In comparison with the casing 810 and the body 丨i 2 and in comparison with the components of the casing 丨〇 8 and the body U2, the heat shield 600 is also deflated and contracted at different rates. In a specific embodiment, the thermal insulation & _ is movably attached to at least one of the outer &2&8; and the frame 5' (Fig. δ) At least one movement relative to the outer casing 108 and the frame 500 during normal operation. In some embodiments, the telescoping rod is configured to allow the heat shield 600 to extend and contract relative to other source components. Further, in some embodiments, the thermal barrier 600 includes a plurality of layers of insulating material that are resistant to thermal expansion and contraction. For example, a plurality of insulated magnetic monuments can be used to increase resistance to thermal expansion and contraction. Figure 10 illustrates a perspective top view of a deposition source 100 in accordance with the present teachings showing the body 112 for evaporating material onto a substrate or other workpiece. The input of each of the plurality of nozzles 106 is coupled to the output of the individual conduction channels of the plurality of conduction channels 1G4, as described with respect to FIG. 5A or coupled to the output of the conduction channels 1〇4, such as About the person described in the figure. In the embodiment shown in FIG. 5A, the deposited materials of the Luofa are transported by the plurality of conductive channels 104 to the plurality of nozzles 1〇6 without intermixing. The evaporated deposition material is ejected by the plurality of nozzles 106 to form a deposition flux. The linear deposition source 100 shown in the figure illustrates seven groups of nozzles 106 where each group includes three nozzles. Those of ordinary skill in the art will appreciate that deposition sources according to the present teachings can include any number of nozzle groups and any number of nozzles within each group. In various embodiments, the distance between the plurality of nozzles 106 may be uniform or uneven. One aspect of the teachings is that the plurality of nozzles 106 can be unevenly spaced to achieve certain process objectives. For example, in a particular embodiment, the spacing between the plurality of nozzles 106 is selected to improve the uniformity of the deposition flux. In this embodiment, the spacing of the nozzles 106 near the edge of the body 112 is closer than the spacing of the nozzles 106 to the center of the body U2, as shown in FIG. 10, to compensate for the proximity. Reduced deposition flux at the edge of the body Π2. The correct spacing can be selected such that the linear deposition source 100 is immediately adjacent to the substrate or workpiece to produce a substantially uniform deposition material flux. In some embodiments, the plurality of nozzles! The spacing between 〇6 is selected to achieve high material utilization in order to reduce the operating cost of the deposition source and increase the effectiveness of the process time and service interval. Also in some embodiments, the spacing of the plurality of nozzles 106 is selected to provide an overlap of desired deposition fluxes by the plurality of nozzles 106 to achieve a predetermined mixing of the evaporated material. In one embodiment, at least one of the plurality of nozzles 1 〇 6 is positioned at an angle from the top surface 16 of the conductive channels 104 at an angle relative to the normal angle to achieve certain processes. . For example, in the second embodiment, at least one of the plurality of nozzles 1 〇 6 is positioned at an angle from the top of the conduction pass if 1G4 from 16 () to the angle of the normal angle ' The angle is selected to provide a uniform deposition flux across the surface of the substrate or work to be treated. Also in some embodiments, at least one of the plurality of nozzles 1〇6 is positioned by the conductive channel two

26 201118961 The top surface 160 of the sister M C2, _ .. ^ + the angle of the normal angle, the angle is selected 'to provide by the § Xuan plural mouthpiece 06 - the desired deposition flux overlap, to A predetermined mixing of the evaporated material is achieved. Figure 11A illustrates a cross-sectional view of one of the bodies 112 of the deposition source 100 in accordance with the present teachings, with a row of nozzles 1 〇 6 connected to the conduction channel 1 〇 4, which are connected to the slabs Controlling the flow of deposited material to the plurality of nozzles 1〇6. The tubes 170 are positioned f to the conductive channel 1 () 4 such that the sub-170 limits the amount of deposition material supplied to the squirt 1 〇 6. The tubes 170 are positioned at least partially into the conductive channel 1〇4. The length of the tubes can be selected to achieve a predetermined deposition flux through the nozzle 1Q6. The length of the tube + 17 对应 corresponding to one of the plurality of nozzles 1 〇 6 may be different from the length of the tube corresponding to at least one other of the plurality of nozzles 106: in the particular embodiment 'in the tubes + m The emissivity at the top is lower than the emissivity at the bottom of the tubes + 17G to provide a desired thermal gradient. The geometry of some or all of these nozzles 106 can be selected to improve the homography. For example, at least one of the plurality (4) 1 〇 6 can include an output aperture, the shape of the output aperture being designed to pass a deposition flux of an uneven sentence. The geometry of the tube 17A corresponding to one of the plurality of nozzles 106 may be different from the geometry of the tube 17A corresponding to at least one other of the plurality of nozzles 106.

The distance between the plurality of nozzles 106 can be an uneven sentence to achieve certain process goals. For example, the spacing of the plurality of nozzles 1 〇 6 can be such that the distance between the plurality of nozzles 1 〇 6 immediately adjacent to the center of the body 112 is closer to the edge of the body 112 of the I 27 201118961. The spacing of one of the plurality of nozzles i06 can be selected to achieve a substantially uniform flux of deposited material from the plurality of nozzles 〇6. A spacing of the plurality of nozzles 106 can also be selected to increase the utilization of the deposited material. A spacing of the plurality of nozzles 1 〇 6 can also be selected to provide a desired overlap of the deposition fluxes emanating from the plurality of nozzles 〇6. The dimensions of the tubes 170, such as the length and diameter of the tubes 17, determine the amount of deposition material that is supplied by the conductive passages 1 to 4 to the corresponding nozzles. Furthermore, the positioning of the tubes 17G, such as the distance in which the tubes 17 are positioned in the conductive passages 〇4, also determines the amount of deposition material that is supplied by the conductive passages 104 to the corresponding nozzles 〇6. . For example, changing the diameter of the tubes 170 will change the deposition flux pattern emitted by the nozzles 〇6. The lengths of the tubes + m are chosen to match the overall flow resistance and design of the tubes + 17 。. In the case of the embodiment, the step of passing through the conduction port (10) is longer: s child 1 70 will supply less evaporated deposition material to the corresponding nozzle 1 〇6. In various embodiments, the geometry and position of the particular tube + Π0 can be the same and different. In a specific embodiment, the plurality of tubes 17 may have different lengths and/or different geometries so as to obtain a characteristic conduction through each of the plurality of 17Qs and achieve certain Process target. For example, from the end of the body 11 2 of the sealing flange ι to the end of the body i 丨 2, tubes 1 having different sizes can be used to compensate for the pressure difference in the linear deposition source. Thus, a feature of the teachings of the deposition source is that the shape and positioning of the tubes can be selected to precisely control the supply to each of the plurality of nozzles 106. The number of multiple nozzles does not change the distribution of the evaporating material from it. For example, the shape of the special pipe 170 and the shape of the singer Shi Cheng are broken to achieve certain process objectives, such as from special nozzles or quantities. Ten thousand times a predetermined deposit from the plurality of nozzles 106 is passed through, in some embodiments, at least one of the plurality of nozzles 106 extends (four) above the top surface of the 1G4 to prevent vapor condensation and material over time. Cumulative increase. The nozzles can also be positioned to achieve the desired deposition flux distribution pattern. Individual nozzle heaters can be positioned immediately adjacent to the plural (four) 1〇6 or more to control the temperature of the evaporating material emitted by the nozzles 106 to prevent condensation and material build-up. In other embodiments, at least one of the plurality of jets f 1G6 is positioned at the top of the plurality of conductive channels 1Q4 from the 16QT side to guide the desired by the heater and the plurality of conductive channels 1〇6 Heat and/or achieve a desired deposition flux distribution pattern. Figure 11B illustrates a plurality of conductive channels 104 <杈 cross-sectional views of a deposition source 1 根据 according to the present teachings, showing a row of nozzles 1 〇 6 coupled to the plurality of conductive channels 104 by a tube i 7 ,, the tube controls The flow of material to the nozzles 104 is deposited. Figure 1B shows three conductive channels with tubes. In various embodiments, the tubes can have different lengths, as shown in Figure 11B. One aspect of the teachings is that the nozzles 1〇6 are heated by the conductive channel heaters (rods 130 in Figures 7A-C) and by the associated conductive channels 104. Figure 12 illustrates a perspective view of a mouthpiece 1 〇 6 comprising - a plurality of nozzles for a linear deposition source, 10...01 as shown in the teachings of the Chinese Patent No. 29 201118961. In this embodiment, the squirt 106 includes a tapered outer surface and/or a tapered inner surface to provide a desired thermal slope for the material being evaporated. The nozzle 106 is designed to maintain the heat transfer required for its supply to prevent condensation of the evaporated deposition source material. At least one of the plurality of nozzles 106 can be formed from certain materials and can include certain coatings to improve performance. For example, the spray f(10) can be formed from a material having a thermal conductivity that results in a substantially uniform temperature of the coating, which will reduce sputtering of the deposited material from the nozzle. For example, the nozzle may be formed of graphite, charcoal fossils, fossil materials, or other materials having a very melting point. In some embodiments, the nozzle 106 is designed to reduce the thermal slope experienced by the material passing through the nozzle 1〇6. In addition, the nozzle 106 can protect 4 6 (10) Μ ' to minimize total radiation loss. The nozzle .106 can be coated at least at a rate. The surface of the wafer 4 includes - low emission. The nozzle 1 〇 6 includes an aperture 18 for passing the evaporated deposition source material from the associated conductive channel 104. At least the IS output aperture 80 of the plurality of nozzles can be positioned at an angle to the top relative to a normal angle. The surface of the ρ is as recited with respect to FIG. 1A. In some embodiments, The surface of the orifice 180 has a low emissivity coating that reduces krypton radiation, thereby reducing any condensation in the nozzle 106. The orifice 180 is designed to eject a desired column of evaporative material. The orifice 108 is shown in the nozzle coffee of Fig. 12. However, it should be understood that any one of the extremely porous shape shapes, t-shape can be used in the nozzle 106 30 201118961 to achieve the desired treatment. For example, the orifice 18 can be circular, elliptical, rectangular, square, or a slit. Further, the outlet of the orifice 180 is not shown to have a radius shape. However, it should be understood that the orifice 18 0 can use any of the many exits to form any one of the heart shapes to achieve the desired processing target. For example, the exit shape can be chamfered, radiused or sumo style (ie restricted) Reverse matching of nozzle shape or another type) In some embodiments, at least one of the plurality of nozzles 1〇6 has a tab (10), and the shape of the orifice 180 is designed to pass a deposition flux of an uneven sentence. Therefore, in the embodiment of the body, at least a part of the shape of the plurality of apertures can be designed, and a uniform deposition flux of η 丁 & h is passed, and the deposition flux is combined to form a phase, 2L Θ ' / 罝 罝 罝 pattern. For example, the desired combination deposition flux pattern can be a uniform deposition flux pattern throughout a 'pre-turn region. The method heats the plurality of 坩埚102, each of the sleeves of the mother and the armor holds a deposition source material, so that the plurality of sacred sacs 1 〇 2 each of the abstinence „ evaporation deposition material. The method can include independently controlling the separate helium heaters, at a time X m λα i , for a parent deposition source material. The method may also include protecting the mother of the plurality of turns 102 such that different temperatures are maintained in the special (d). The deposition material from the parent of the plurality of nets 1200 is transported through the conductive channel 104 in the body (1), and the eight-body embodiment including the wide-body 丨i-h seek channel 104 'From the complex number = individual conduction channels through one: from any of the plural 坩埚 102 - incoming goods / erection material. The pass 31 201118961 is not condensed until the nozzle 106 is illuminated. The conductive channels 丨〇4 can be heated separately to achieve different temperatures for at least two of the plurality of conductive channels 丨04. Each of the plurality of conductive channels 104 can be shielded such that different temperatures can be maintained in different conductive channels 104. A number of methods include lifting, a movable component and space for the heater and thermal expansion of the plurality of thermal insulation materials immediately adjacent to the plurality of 坩埚1 〇2 and immediately adjacent to the plurality of conductive channels 104. The evaporative deposition material is transported by the conductive channel 1〇4 or by each of the plurality of conductive channels 104 to individual nozzles of the plurality of nozzles 1〇6. In various embodiments, the evaporated deposition material is passed through a plurality of tubes 17 or other structures that control the flow of the deposition material, from the conduction channel HM, or from each of the plurality of conduction channels 1〇4 An individual nozzle that is transported to the heart number nozzle 106. In various embodiments of the method shown in summer (d), the deposited material is =: tube, and, or the tube population is opposite to the conduction channel 1; the position is controlled by " and # J, \L... The shape, and/or the position of the inlet phase of the tube, is selected to achieve a deposition flux and/or a high deposition material utilization rate for certain processes. ...# The plurality of nozzles 1〇6 then cause the evaporation to form a deposition flux. 'Before, by the spacing, to achieve a certain process, the deposition flux of the multiple nozzles 106 is selected and ~ such as from the complex nozzles 106 and ~ deposition material utilization. φ 32 201118961 The teachings of the j-to, , ..., r μ persons are described in conjunction with various specific embodiments, and the teachings of the applicants are limited to the specific embodiments. Instead, the affirmation of the person's teachings encompasses a variety of alternatives, modifications, and equivalents, which are known to those of ordinary skill in the art world, where they can be made without 'the spirit of the teachings' And the scope is separated. BRIEF DESCRIPTION OF THE DRAWINGS The teachings of the present invention are described in more detail in the following detailed description of the preferred embodiments. Those skilled in the art will appreciate that the drawings referred to below are for illustrative purposes only. The drawings are not necessarily to scale, but rather generally emphasize that the principles of the teachings are not intended to limit the scope of the teaching in any way. Figure 1A illustrates a transverse deposition source according to the present teachings. The surface perspective view 'The linear deposition source includes a plurality of worms that are lightly coupled to the plurality of conduction channels in a linear configuration and then coupled to the plurality of nozzles. 1B illustrates a cross-sectional perspective view of a linear deposition source including a plurality of discrete phases coupled to a single conductive channel and then coupled to the plurality of nozzles in accordance with the present teachings. Figure 2A illustrates a cross-sectional view of the linear deposition source as described with respect to Figures 1A and iB, and clamps the complex nozzles to evaporate the deposited material in an upward direction. Figure 2A illustrates a cross-sectional perspective view of a linear deposition source in accordance with the present teachings, and the plurality of nozzles are positioned such that they deposit material on-down. 33 33 201118961 图 图 图 Figure 2C illustrates a cross-sectional perspective of a linear deposition source in accordance with the present teachings, and the body including the plurality of nozzles is positioned in an upright orientation. 2D illustrates a cross-sectional perspective of another linear deposition source in accordance with the present teachings, and the body including the plurality of nozzles is positioned in an upright orientation. 3A illustrates a cross-sectional perspective view of a linear deposition source including a single unit coupled in a linear configuration to a plurality of conduction channels and coupled to a plurality of nozzles in accordance with the present teachings. Fig. 3B shows a perspective view of a surface of a linear deposition source according to the teachings of the present invention. The linear deposition source includes a single defect that is coupled to the single-conducting channel in a linear configuration and then coupled to the complex nozzle. Figure 4 illustrates a cross-sectional perspective view of a linear deposition source for use in the teachings of the present invention, which is formed from two materials. Figure 5A illustrates a perspective top view of a portion of a linear deposition source in accordance with the present teachings showing three conductive channels coupled to three turns in the housing. Figure 5B illustrates a perspective top view of a portion of a linear deposition source in accordance with the present teachings showing a single conduction channel coupled to three turns in the housing. Figure 6A is a perspective view of a portion of an impedance type damper for a linear deposition source of the present teaching, showing the inside and three sides of the heater where the crucible is positioned. . . Fig. 6B is a perspective view of the outside of one of the plurality of smashing heaters for heating each of the plurality of catastrophes. Figure 7A is a side elevational view of a linear deposition source in accordance with the teachings of the present invention. 34 201118961 A conductive channel heater for heating the plurality of conductive channels. Figure 7B is a perspective view of a rod including the conductive channel heaters. Figure 7C illustrates a perspective view of a body of a linear deposition source in accordance with the present teachings showing a splicing of the ends of the bars to the body. Figure 8 illustrates a frame of the body including a telescoping rod. Figure 9A is a cross-sectional perspective view of a heat shield for the plurality of hooks and the plurality of conductive channels for a linear deposition source in accordance with the present teachings. Figure 9B is an overall perspective view of the heat shield shown in Figure 9A. Fig. 9 is a perspective cross-sectional view showing a specific embodiment of the heat shield according to the present invention. Figure 10 illustrates a perspective top view of a deposition source in accordance with the present teachings showing multiple nozzles in the body for evaporating material onto a substrate or other workpiece. 1A illustrates a cross-sectional view of a body of a deposition source in accordance with the present teachings showing a row of nozzles that are lightly coupled to a conductive passageway that controls the flow of deposited material to the nozzles. Figure 11B illustrates a cross-sectional view of the plurality of conductive channels of a deposition source in accordance with the present teachings, showing a row of nozzles coupled to the plurality of conductive channels by tubes. The tubes control the flow of deposited material to the nozzles. Figure 12 illustrates a perspective view of a nozzle including one of the plurality of nozzles for a linear deposition source in accordance with the present teachings. [Main component symbol description] 35

Claims (1)

201118961 VII. Scope of Application for Proposal·· 1. A deposition source, comprising: a) a crucible for holding a deposition material; b) a body including a conduction channel, the wheel of which is coupled to the S #竭的轮出; C) a heater positioned to be in thermal communication with the crucible and the conductive passage, the heater heating the crucible such that the crucible evaporates the deposition material into the conduction passage; d) An insulating panel positioned around the heater and at least one of the body. The heat shield comprises a plurality of layers of heat resistant material; and a plurality of nozzles, each of the plurality of nozzles being connected to The output of the conductive channel is such that the evaporated deposition material is transported from the crucible through the paraphilic channel to the plurality of nozzles, where the evaporated deposition material is: ejected from the plurality of nozzles to form a deposition flux. The deposition source of the ninth aspect of the invention, wherein the heat shield further comprises a hard material positioned on at least a surface of the layer of the plurality of heat resistant materials. The deposition source of the two items, wherein the hard material 3. The corrosion protection is provided as in the scope of the patent application. 4. The deposition source of claim 2, wherein the hard material comprises a carbon fiber board. 5. The deposition source of claim 4, wherein the carbon fiber board is coated with metal carbide on at least one surface. . 6. The deposition source of claim 4, wherein the carbon fiber sheet 36 201118961 has a thickness in the range of 0.02 and 〇 Π δ over a long period of time. The deposition source of the second item of the patent scope, the hard material in the bean is defined as: "the surface of at least one layer of the heat resistant material layer. The deposition source of the second paragraph of the patent of the patent, wherein the hard material Between the two layers of the plurality of heat-resistant material layers. The deposition source of claim 1 of the patent scope further includes a reflective material positioned on at least the outer surface of the heat shield. The deposition source of item 1, wherein the heat insulating plate further comprises a first hard material on a top surface of the plurality of heat resistant material layers and a second hard surface on a bottom surface of the plurality of heat resistant material layers U. The deposition source of claim 1, wherein at least one of the first and second hard materials comprises a carbon fiber board. 12. A deposition source according to the scope of claim 专利10, * at least one outer surface of the first and first hard materials is coated with a metal carbide. 13. The deposition source of claim 1, wherein at least a portion of the plurality of heat resistant material layers have w and U are thicker degrees. wherein the plurality of heat-resistant portions of the plurality of heat-resistant materials are the heat-resistant materials. 14. The deposition source material layer of claim 1 includes more than 5 layers of graphite material. The deposition source material layer of 帛1 includes more than 10 layers of graphite material. 16· The deposition source layer according to the scope of claim ώ includes at least one refractory metal foil. 37 201118961 1 7·If the patent application scope is 丨The deposition source of the item, wherein the heat resistant material layer comprises at least one layer of graphite material. 18. The deposition source of claim </ RTI> wherein the at least two of the plurality of nozzles comprise a limit to be supplied to the corresponding nozzle The amount of material of the tube 'the length of the tube corresponding to one of the plurality of nozzles is different from the length of the tube corresponding to at least one other of the S-fold sneeze. 1 9. A deposition source comprising: a) - 坩埚, For holding the deposition material; b) - the body, comprising a plurality of conduction channels, the wheel of the plurality of conduction channels being coupled to the output of the crucible; c) a heater positioned The crucible is in thermal communication with the plurality of conduction channels, the heater heating the crucible such that the crucible evaporates the deposition material into the plurality of conduction channels; d) an insulating panel positioned to surround the heater and the body One of the 'insulation panels includes a plurality of layers of heat resistant material; and e) a plurality of nozzles, the input of each of the plurality of nozzles being coupled to the output of the plurality of conductive channels such that the deposited material being evaporated is The catastrophic transport is carried through the plurality of conductive channels to the plurality of nozzles, wherein the evaporated deposition material is ejected from the plurality of nozzles to form a deposition flux. 20. The deposition source according to claim 9 of the patent application, wherein Positioning surrounds: the heat insulator and the heat shield of the body have a plurality of layers of heat resistant material adjacent to the plurality of conductive channels, the heat resistant material layers and a plurality of other conductive channel materials adjacent to the plurality of conductive channels The layers are different. .21. The deposition source of claim 19, wherein the heat shield further comprises a rigid material positioned on a surface of at least one of the plurality of layers of heat resistant material. 22' The deposition source of claim 2, wherein the hard material comprises a carbon fiber board. ^ 23. The deposition source of claim 22, wherein the carbon fiber board is coated with a metal carbide on at least one surface. 24. The deposition source of claim 21, wherein the hard material is positioned on at least an outer surface of the layer of the plurality of heat resistant material layers. The deposition source of claim 2, wherein the hard material is positioned between two of the layers of the plurality of heat resistant materials. 6. The deposition source of claim 19, further comprising a reflective material positioned on at least one outer surface of the heat shield. 27· If the source of the patent application is 19 ^ ^, the heat shield is further clamped on the surface of the plurality of heat-resistant materials UM ^ Μ ^ #, the first hard 弋 position in the plurality of heat-resistant materials Layer $ hard material. I is the first firmer 28' on the clothing song, as claimed in the 19th article of the patent application, at least the reversal of the L-storage/original, wherein the plurality of nozzles to the second of the nozzles includes a tube that limits the amount of supply, corresponding to The material of the (four) nozzle of the plurality of nozzles is at least the length of the tube of the plurality of nozzles: the length is different from the length of the corresponding 2〇, ^ 。. 29. The sink layer of claim 19 includes s i. product/original wherein the heat resistant materials are at least one refractory metal foil. 30. The material layer of item 19 of the patent application includes a graphite material. ―, towel heat-resistant material 39 201118961 3 1. A deposition source, comprising: a) a plurality of enthalpy for holding the deposition material; b) a body comprising a plurality of conduction channels, the input of each of the plurality of conduction channels being Lightly connected to the output of the individual 坩埚 of the s 玄 complex number; c) a heater positioned to be in thermal communication with the plurality of turns and the plurality of conductive paths, the heater heating the plurality of turns such that each of the plurality of turns Evaporating the deposition material into the plurality of conductive channels; d) - a heat shield 'which is positioned around at least one of the heater and the body, the heat shield comprising a plurality of layers of heat resistant material; and e) a plurality of nozzles The input of each of the plurality of nozzles, the output of the plurality of conductive channels is evaporated from the plurality of deposited materials through the plurality of conductive channels to the plurality of nozzles, where the evaporated deposition material is The plurality of nozzles are ejected to form a deposition flux. The invention relates to a deposition source of the third aspect of the patent scope, wherein the heat shield which is positioned around the crucible heater and the body has a plurality of layers of heat resistant material close to the plurality of crucibles, and the layers of the heat resistant material are close to many The other layer of the plurality of heat-resistant materials is different. 33. The deposition source of claim 3, wherein the heat shield further comprises a hard material positioned on a surface of at least one of the plurality of layers of heat resistant material. 34. The deposition source of claim 33, wherein the hard material comprises a carbon fiber board. / 35. The deposition source of claim 34, wherein the carbon fiber board is coated with a metal carbide on at least one surface. 40 8 201118961, for example, the deposition source of claim 31, wherein the hard material is clamped on at least the outer surface of the layer of the plurality of heat resistant layers. 37. The deposition source of claim 31, wherein the hard material is positioned between two of the layers of the plurality of heat resistant materials. 38. The deposition source day of claim 31, the other day comprising a reflective material positioned on at least one outer surface of the heat shield. 2. The deposition source of claim 31, wherein the heat shield further comprises a first hard material on a top surface of the swarf heat resistant material layer, and is positioned in the Fuling Μ &amp; u μ a The material of the bottom surface of the alpha 'complex heat resistant material layer is the hard material. &lt; 罘一坚 (10). The deposition source of item 31 of the U patent, wherein the plurality of nozzles includes a tube that limits the material supplied to the corresponding nozzle for a plurality of deniers corresponding to the plurality of nozzles - The length of the tube is different from the length of the tube corresponding to at least one other of the plurality of nozzles. ',,, for example, at least part of the deposition source 1 of the application for patent coverage 帛 31. The multiple accidents include - positioning inside the external hanging shackles. 42. The deposition source of claim 31, wherein the plurality of defects include a first accident containing steel (Cu), a third containing indium (In), and a third germanium containing gallium (Ga). A. The deposition source of claim 31, wherein the heater comprises a plurality of separately controllable heaters, wherein the individual heaters of the plurality of heaters are in thermal communication with the individual heaters of the plurality of turns. 44. The deposition source of claim 31, wherein the heat resistant material layer comprises at least one refractory metal foil. The deposition source of claim 31, wherein the heat resistant material layer comprises at least one layer of graphite material. Eight, the pattern: (such as the next page) 42